Housing assembly and electronic device

Abstract

The utility model provides a shell assembly and electronic equipment. The shell assembly is applied to the electronic equipment, and the electronic equipment is provided with a grounding assembly. The housing assembly includes a first member, a trim, and a sealing structure. The first component is provided with a first face and a second face which are oppositely arranged in the thickness direction. The second surface is arranged towards the grounding assembly. The first member has a first through structure penetrating the first surface and the second surface. The decorating part covers the first through structure. The decorative part at least comprises a first metal part. And at least part of the first metal part is overlapped with the first surface in the thickness direction of the first component, and is hermetically connected with the first surface through a sealing structure. The first member includes a second metal portion connected to the first metal portion. And the second metal part is arranged to avoid the sealing structure. At least part of the second metal part is used for being in conductive contact with the grounding assembly. According to the shell assembly and the electronic equipment provided by the invention, sealing and grounding of the decorating part can be considered.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to a housing assembly and an electronic device. Background Technology

[0002] As camera specifications and designs improve, decorative components are becoming increasingly larger. This results in a smaller gap between the decorative component and the antenna. When the decorative component contains metal, it may affect antenna performance, necessitating grounding of the metal parts. However, layout limitations restrict the placement of the grounding point, potentially causing it to shift to the edge of the component and interfere with the sealing structure between the decorative component and the main housing assembly. Utility Model Content

[0003] This application provides a housing assembly and an electronic device that improves upon the problem that the edges of existing decorative parts cannot simultaneously accommodate grounding point placement and sealing.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] In a first aspect, a housing assembly is provided. This housing assembly is applied to an electronic device having a grounding component. The housing assembly includes a first member, a decorative element, and a sealing structure. The first member has a first surface and a second surface disposed opposite to each other along its thickness direction. The second surface is disposed facing the grounding component. The first member has a first through-structure extending through the first surface and the second surface. The decorative element covers the first through-structure. The decorative element includes at least a first metal portion. At least a portion of the first metal portion overlaps with the first surface in the thickness direction of the first member and is sealed to the first surface by the sealing structure. The first member includes a second metal portion connected to the first metal portion. The second metal portion is disposed to avoid the sealing structure. At least a portion of the second metal portion is used for conductive contact with the grounding component.

[0006] In the housing assembly and electronic device provided in this application embodiment, the first component is no longer entirely made of non-metallic material. Instead, at least a portion of the first component is a second metal part, which connects the first metal part and the grounding component, while avoiding the sealing structure between the decorative part and the first component. This allows the electronic device to achieve electrical connection between the first metal part and the spring contact via the second metal part, enabling the grounding point located at the edge of the decorative part to be grounded, and the placement of the second metal part does not affect the seal between the edge of the decorative part and the first component. In other words, the housing assembly and electronic device provided in this application embodiment can simultaneously accommodate the grounding point placement at the edge of the decorative part and the seal between the decorative part and the first component. This allows for more placement positions of the grounding points on the decorative part within a limited layout space, contributing to the further development of electronic devices.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, the first component further includes an insulating portion. The insulating portion has a first through structure and a second through structure. The second through structure extends through the insulating portion along its thickness direction. At least a portion of a second metal portion passes through the second through structure and is connected to the first metal portion. At least a portion of the second metal portion is located on the side of the insulating portion facing the grounding assembly.

[0008] By adopting the solution provided in this embodiment, the main part of the first component can be made of insulating material, which is less likely to have an adverse effect on the antenna, and the cost of the first component is lower.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the second metal portion includes a vertical portion and a horizontal portion. The vertical portion passes through the second through structure and is connected to the first metal portion. The horizontal portion is located on the side of the vertical portion away from the first metal portion and is connected to the vertical portion. The side of the horizontal portion opposite to the vertical portion is part of a second surface and is used for conductive contact with the grounding component.

[0010] In this embodiment, the second metal part can be either a one-piece molded structure or a separate connected structure. When the second metal part is a separate connected structure, it can be that the horizontal part and the vertical part are separately connected, or the vertical part and a part of the horizontal part are integrally molded, while the other part of the horizontal part is separately connected to the aforementioned one-piece molded structure. Using the structure provided in this embodiment, the structure of the second metal part is simple and easy to assemble.

[0011] In conjunction with the first aspect, in certain implementations of the first aspect, the second metal portion includes a first connector and a second connector. The first connector includes a first portion and a second portion interconnected. The first portion passes through a second through structure and is connected to the first metal portion. The second portion is larger in size than the first portion at least in a first direction, and is located on the side of the insulating portion facing the grounding assembly, and is spaced apart from the insulating portion. The second connector is disposed between the second portion and the insulating portion, and is in conductive contact with the first portion and / or the second portion. At least a portion of the second connector extends beyond the first connector in a first direction perpendicular to the thickness direction to make conductive contact with the grounding assembly.

[0012] In this embodiment, the first connector can be a screw-in connector, a plug-in connector, etc. When the first connector is a screw-in connector, it can be a screw, a bolt, etc., or it can have a protrusion on the side wall of the screw rod. It is understood that when the first connector is a screw, the nut of the first connector is the second part mentioned above, and the screw rod of the first connector is the first part mentioned above. When the first connector has a protrusion on the side wall of the screw rod, the protrusion is the second part, and the screw rod is the first part. The second connector can be a sheet structure, a block structure, or other structures, depending on the usage requirements. In this embodiment, the second connector and the second part of the first connector can be combined to form the horizontal part in Embodiment Two, and the first part of the first connector can form the vertical part in Embodiment Two. Using the structure provided in this embodiment facilitates material sourcing and assembly.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, the thickness of the portion of the second connector that contacts the first connector is greater than the thickness of the other portions of the second connector.

[0014] The thickness of the part of the second connector that contacts the first connector is greater than the thickness of the other parts of the second connector. This allows the part of the second connector that contacts the first connector to have a larger amount of deformation, which helps to ensure full contact between the second connector and the first connector, thereby ensuring the stability of the grounding line connection.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, the side of the second connector facing the first connector and / or the side of the first connector facing the second connector are provided with a first protrusion, the first protrusion being a connection point for the electrical connection between the second connector and the first connector.

[0016] The first protrusion allows the second connector of different products to be electrically connected to the first connector through a preset contact point (i.e., the location of the first protrusion), which helps to ensure the uniformity of the connection points of different products.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, the side of the second part facing the second connector has a concave-convex structure, which is used to increase the friction between the second part and the second connector. The concave-convex structure can reduce the risk of loosening after the first connector is threaded.

[0018] In conjunction with the first aspect, in some implementations of the first aspect, the side of the insulating part facing away from the sealing structure is provided with a mounting groove, the mounting groove is connected to the second through structure, and the second connector is disposed in the mounting groove.

[0019] The mounting slot design ensures that the second connector does not protrude from the surface of the insulating part, or that the portion protruding from the surface of the insulating part is minimal, resulting in a relatively flat second surface of the first component, which facilitates the installation of internal components of the electronic device. Simultaneously, the mounting slot design allows for the fixation of the second connector's position, enabling it to be installed in a preset location.

[0020] In conjunction with the first aspect, in some implementations of the first aspect, the first connector includes a screw-in member; and / or, the second connector includes a sheet structure. The use of a screw-in member in the first connector enhances the connection strength between the decorative element and the first component, ensuring the connection strength meets usage requirements. Furthermore, the screw-in member is small in size and easy to assemble. Additionally, using a metal screw-in member in the first connector also meets the electrical connection requirements between the decorative element and the grounding component, eliminating RSE-related issues, and making the solution feasible. The sheet structure of the second connector is simple, thin, and easy to assemble.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, the first member further includes an insulating portion. The insulating portion has a first through structure and a second through structure. The second through structure extends through the insulating portion along its thickness direction. A second metal portion is disposed on the side of the insulating portion opposite to the sealing structure and is connected to the insulating portion. The first metal portion has a second protrusion protruding toward the first member, at least a portion of the second protrusion passing through the second through structure and making conductive contact with the second metal portion.

[0022] Compared with the solution in Embodiment 2, the second metal part can be composed of only one component to achieve electrical connection between the second metal part and the first metal part. If the second metal part adopts the above-mentioned second connector, the structure of the second metal part can be simplified and the connection between the first metal part and the second metal part can be made more convenient.

[0023] In conjunction with the first aspect, in some implementations of the first aspect, the second metal part includes a sheet structure.

[0024] The solution provided in this embodiment simplifies the structure of the second metal part, making it easy to prepare and assemble.

[0025] In conjunction with the first aspect, in some implementations of the first aspect, the second metal part is connected to the first metal part by a screw connection.

[0026] This ensures a stable connection between the second metal part and the first metal part, and guarantees that the connection strength between the decorative part and the first component meets the usage requirements. It is understood that, in addition to providing fasteners at the location of the second metal part, fasteners can also be provided at the location of the insulating part when the decorative part includes an insulating part, depending on the specific usage requirements.

[0027] In conjunction with the first aspect, in some implementations of the first aspect, the first component further includes an insulating portion, the insulating portion having a third through structure extending through itself in the thickness direction, and the second metal portion being disposed in the third through structure.

[0028] The solution provided in this embodiment can simplify the structure of the first component, making it easier to prepare and assemble.

[0029] In a second aspect, an electronic device is provided, including a frame, a grounding component, and a housing component as provided in any of the above embodiments, wherein the frame and the housing component form a receiving space, the grounding component is disposed within the receiving space, and the grounding component is electrically connected to the housing component.

[0030] The technical effects corresponding to the second aspect can be found in the first aspect and the technical effects corresponding to any implementation of the first aspect, which will not be repeated here.

[0031] With the above technical solution, the electronic device thus possesses at least all the beneficial effects of the document processing method, which will not be elaborated further here. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the front view structure of an electronic device provided in an embodiment of this application;

[0033] Figure 2 For along Figure 1 A schematic diagram of the cross-sectional structure along line AA in the diagram;

[0034] Figure 3 A rear view schematic diagram of a partial structure of an electronic device provided in an embodiment of this application;

[0035] Figure 4 For along Figure 3 A schematic diagram of the cross-sectional structure of the BB line in the diagram;

[0036] Figure 5 This is a cross-sectional schematic diagram of a partial structure of an electronic device in related technologies;

[0037] Figure 6 for Figure 5 A magnified schematic diagram of the local structure at point B;

[0038] Figure 7 for Figure 4 A magnified schematic diagram of the partial structure at point A in the middle;

[0039] Figure 8 A cross-sectional view of a partial structure of an electronic device provided in another embodiment of this application;

[0040] Figure 9A cross-sectional view of a first connector in an electronic device according to an embodiment of this application;

[0041] Figures 10 to 14 Cross-sectional structural schematic diagrams of partial structures of electronic devices provided in different embodiments of this application;

[0042] Figure 15 for Figure 14 A schematic front view of a partial structure of the first component in the electronic device shown.

[0043] Figure 16 A front view schematic diagram of a partial structure of a first component in an electronic device provided in another embodiment of this application;

[0044] Figure 17 A cross-sectional view of a partial structure of an electronic device provided in another embodiment of this application;

[0045] Figure 18 for Figure 17 A schematic front view of the partial structure of the first component in the electronic device shown.

[0046] Explanation of reference numerals in the attached figures:

[0047] 10. Frame; 10a. Middle plate; 10b. Frame; 10b1. Antenna; 10b2. Insulation structure; 10c. Second accommodating space;

[0048] 20. Display screen;

[0049] 30. Housing assembly; 31. First component; 31a. First surface; 31b. Second surface; 31c. First through-type structure; 311. Second metal part; 3111. Vertical part; 3112. Horizontal part; 3113. First connector; 3114. Second connector; 3115. First protrusion; 3116. Mounting groove; 3117. Concave-convex structure; 312. Insulating part; 3121. Second through-type structure; 312a. Third through-type structure; 312b. Fourth through-type structure; 313. Third protrusion; 32. Decorative part; 321. Main body part; 321a. First metal part; 321b. Second protrusion; 322. Light-transmitting component; 323. Raised structure; 33. Sealing structure; 34. Fastener;

[0050] 40. Circuit board assembly; 41. Circuit board; 42. Camera; 43. Flash; 44. Shielding cover;

[0051] 50. Battery;

[0052] 60. Shrapnel;

[0053] Z: Thickness direction; X: Width direction; Y: Length direction. Detailed Implementation

[0054] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0055] In the description of this application, it should be understood that the terms "inner" and "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0056] To facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with essentially the same function and effect. For example, the first limiting part and the second limiting part are only used to distinguish different limiting parts and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0057] It should be noted that in this application, the terms "in one embodiment" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "in one embodiment" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "in one embodiment" or "for example" is intended to present the relevant concepts in a specific manner.

[0058] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0059] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments.

[0060] First, some terms used in the embodiments of this application will be explained to facilitate understanding by those skilled in the art.

[0061] The multipath effect, also known as the multipath effect, occurs when there are multiple paths between a signal and a receiver (such as a direct path plus a reflected path). Signals arriving through these different paths may interfere with each other, causing fluctuations in the strength of the received signal.

[0062] Fading is a phenomenon in wireless communication where the strength of a received signal decreases with changes in time, location, or frequency.

[0063] RSE (Radiation Spurious Emission) is an abbreviation for radiated spurious interference. It refers to emissions outside the operating frequency generated or amplified by a radio transmitting device when connected to a non-radiating, purely resistive load or in receiver mode, radiating through the device's casing, power supply, control equipment, and audio cables. If the RSE of a radio transmitting device is too high at a certain frequency, it can cause the equipment operating at that frequency to malfunction, adversely affecting related services. RSE testing is a crucial technical means to assess the performance of radio transmitting equipment and eliminate harmful interference at its source. An ideal test environment is essential for objectively and accurately assessing the RSE of radio transmitting equipment. Analyzing each aspect of the test environment clarifies the role of each element in the testing process and its impact on the test results. This is significant for improving the quality of test environment setup and ensuring objective and accurate quantification of the RSE of radio transmitting equipment.

[0064] The above is a brief introduction to the terms used in the embodiments of this application, and will not be repeated below.

[0065] This application provides an electronic device. The aforementioned electronic device may also be referred to as a terminal, user equipment (UE), mobile station (MS), mobile terminal (MT), etc. Specific product forms of the electronic device may include mobile phones, tablets, desktop computers, PDAs (personal digital assistants), laptops, ultra-mobile personal computers (UMPCs), wearable devices (such as headphones, smart bracelets, smart glasses, virtual reality (VR) / augmented reality (AR) devices), in-vehicle devices, home appliances (such as electric toothbrushes, flashlights), gaming devices (such as game controllers, joysticks, and mice), multimedia players, and other electronic devices with camera-related decorative components. This application does not specifically limit the form of the electronic device.

[0066] For ease of explanation, the following embodiments will use a candybar-type mobile phone as an example.

[0067] Please see Figure 1 , Figure 1 This is a front view schematic diagram of an electronic device provided according to an embodiment of this application. It is understood that... Figure 1 The electronic device shown is merely an example; electronic devices may have more or fewer components than those shown in the diagram. For ease of understanding, Figure 1 A coordinate system is established in this paper with the width direction of the electronic device as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. Other figures in this paper that also have coordinate systems have coordinate directions that are... Figure 1 same.

[0068] The electronic device includes a frame 10 and a display screen 20 located on the frame 10.

[0069] The frame 10 is a supporting component in the electronic device, used to support the display screen 20, circuit board assembly, battery, etc. One or more frames 10 can be provided. When multiple frames 10 are provided, they can be slidably connected, rotatably connected via a pivot structure, or connected in other ways, depending on the function of the electronic device.

[0070] A single frame 10 has a length direction Y, a width direction X, and a thickness direction Z. Generally, the dimension of a single frame 10 in the length direction Y is larger than its dimension in the width direction X, and the dimension in the width direction X is larger than its dimension in the height direction Z. In some cases, the dimension of a single frame 10 in the length direction Y may be the same as its dimension in the width direction X. The frame 10 has a first surface and a second surface disposed opposite to each other in the thickness direction Z.

[0071] The display screen 20 is used to display images, videos, etc. The display screen 20 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a MiniLED, a MicroLED, a Micro-OLED, a quantum dot light-emitting diode (QLED), etc.

[0072] The display screen 20 is disposed opposite to and connected to at least a portion of the first surface of the frame 10. The display screen 20 may form a first receiving space with the frame 10, or it may be attached to the first surface of the frame 10 without a first receiving space between them; the specific arrangement depends on the application requirements. The first receiving space may be used to accommodate electrical connectors, etc., as required by the application.

[0073] Figure 2 For along Figure 1 A schematic diagram of the cross-sectional structure along line AA.

[0074] like Figure 2 As shown, in addition to the above structure, electronic devices generally also include housing assembly 30, circuit board assembly 40, battery 50, etc.

[0075] The housing assembly 30 is also known as a back cover or battery cover. At least a portion of the second surface of the frame 10 is disposed opposite to and connected to the housing assembly 30. The housing assembly 30 and the frame 10 form a second receiving space 10c. The second receiving space 10c is used to install the battery 50, circuit board assembly 40, electrical connectors, etc. When the display screen 20 and the frame 10 form a first receiving space, this first receiving space may or may not be connected to the second receiving space 10c, depending on the usage requirements.

[0076] A battery 50 is disposed within the second receiving space 10c and is used to power the aforementioned circuit board assembly 40, etc. There may be one or more batteries 50, depending on the specific application. The second surface of the frame 10 generally has a battery compartment, which is part of the second receiving space 10c. The battery 50 is disposed within the battery compartment.

[0077] The circuit board assembly 40 is disposed within the second receiving space 10c and located outside the battery compartment. The circuit board assembly 40 includes a circuit board and electronic components.

[0078] The circuit board can be a flexible printed circuit board, a rigid printed circuit board, or a rigid-flex printed circuit board. One or more circuit boards can be used depending on the application requirements.

[0079] Electronic components are typically found in multiples. All electronic components can be located on a circuit board, or some can be located on the circuit board while others are located off-board. The off-board electronic components can be connected to the circuit board via electrical connectors, or to other electronic components located on the circuit board.

[0080] It is understandable that when an electronic device has multiple circuit boards, the types and quantities of electronic components on each circuit board can be the same or different.

[0081] Electronic components include, but are not limited to, processors, power management integrated circuits (PMICs), mobile communication modules, wireless communication modules, audio modules, sensor modules, motors, indicators, cameras, etc.

[0082] The processor may include, but is not limited to, an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, memory, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU). Different processing units may be independent devices or integrated into one or more processors.

[0083] The processor can calculate the CPU load and target thread load in the historical frame drawing task, predict the CPU load and target thread load in the next frame drawing task based on the CPU load and target thread load in the historical frame drawing task, determine the minimum value of the CPU frequency range in the next frame drawing task and the CPU frequency range in the next frame drawing task based on the CPU load and target thread load in the next frame drawing task, and adjust the CPU frequency based on the CPU frequency range in the next frame drawing task.

[0084] The aforementioned display screen 20 is electrically connected to the circuit board assembly 40. The electronic device can implement display functions through a GPU, display screen 20, and application processor. The GPU is a microprocessor for image processing, connected to the display screen 20 and the application processor. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. The processor may include one or more GPUs, which execute program instructions to generate or modify display information.

[0085] Both mobile communication modules and wireless communication modules can include filters, switches, radio frequency power amplifiers, low noise amplifiers (LNAs), etc.

[0086] The audio module may include an audio power amplifier, as well as speakers, receivers, microphones, headphone jacks, etc. connected to the audio power amplifier.

[0087] Sensor modules may include pressure sensors, gyroscopes, barometric pressure sensors, magnetic sensors, accelerometers, distance sensors, proximity sensors, fingerprint recognition devices, temperature sensors, touch sensors, ambient light sensors, bone conduction sensors, etc.

[0088] Electronic devices can implement audio functions (such as music playback and recording) through audio modules and application processors. They can also implement shooting functions through ISPs, cameras, video codecs, GPUs, displays, and application processors. With societal development and increasing user demands for video recording, electronic devices can be equipped with multiple cameras. Furthermore, to improve image quality, in addition to cameras, electronic devices may also include flash units and LiDAR (Light Detection and Ranging) sensors. Flash units provide additional illumination in low-light conditions to help the electronic device capture clearer, brighter photos or videos. LiDAR sensors are used to obtain distance and depth information of objects. Through cameras, LiDAR, and other technologies, electronic devices can obtain three-dimensional images with depth information.

[0089] In addition to the aforementioned electronic components, electronic devices generally also include antennas, which are typically located on the frame.

[0090] like Figure 2 As shown, the frame 10 includes a middle plate 10a and a frame 10b surrounding the middle plate 10a. The frame 10b extends beyond the middle plate 10a at least at one end in the thickness direction of the electronic device toward the housing assembly 30, and forms a groove structure with the middle plate 10a. The groove structure is part of the second receiving space 10c described above, for accommodating at least a portion of the circuit board assembly 40, battery 50, etc.

[0091] Figure 3 This is a rear view of a partial structure of an electronic device provided in an embodiment of this application. The housing components are not shown in the figure.

[0092] like Figure 3 As shown, the frame 10b includes an antenna 10b1 and an insulating structure 10b2. The antenna 10b1 is formed from a metal material through cutting or segmentation. Multiple antennas 10b1 are typically provided, corresponding to different frequency bands. To ensure electrical isolation between each antenna 10b1, a small gap is generally left between adjacent antennas 10b1, and the gap is filled with a non-conductive material to form the insulating structure 10b2. In some embodiments, the frame 10b may only include the antenna 10b1 and the insulating structure 10b2; in other embodiments, the frame 10b includes the antenna 10b1, the insulating structure 10b2, and a metal portion that does not have antenna functionality.

[0093] It should be noted that the antenna 10b1 may sometimes extend to the middle plate depending on the application requirements. The middle plate may also have an insulating part. The insulating structure 10b2 on the frame can be integrally formed with the insulating part on the middle plate, or it can be connected separately, depending on the application requirements.

[0094] The primary function of antenna 10b1 is to receive and transmit wireless signals to enable various communication functions of the electronic device. Antenna 10b1 can be, but is not limited to, a mobile communication antenna, a Wi-Fi antenna, a Bluetooth antenna, or a Global Positioning System (GPS) antenna. Specifically, the mobile communication antenna is responsible for receiving and transmitting wireless signals from the base station, enabling functions such as voice calls, SMS messaging, and internet access for the electronic device. The Wi-Fi antenna allows the electronic device to connect to a Wireless Local Area Network (WLAN) for high-speed internet access, including web browsing, file downloads, and online video streaming. The Bluetooth antenna enables short-range wireless communication between the electronic device and other Bluetooth devices, such as headphones, speakers, and smartwatches, facilitating data transmission and device interconnection. The GPS antenna receives signals from Global Positioning System (GPS) satellites to determine the location of the electronic device, supporting applications such as map navigation and location services.

[0095] Each antenna 10b1 can be used to cover one or more communication frequency bands. Different antennas 10b1 can also be reused to improve the utilization rate of antennas 10b1.

[0096] The antenna 10b1 is electrically connected to the circuit board assembly. The electronic device can realize wireless communication functions through the antenna 10b1, mobile communication module, wireless communication module, processor, etc.

[0097] Specifically, the circuit board is generally equipped with radio frequency circuits, and the antenna 10b1 is connected to the aforementioned mobile communication module, wireless communication module, processor, etc. through the radio frequency circuits.

[0098] like Figure 2 and Figure 3 As shown, the housing assembly 30 includes a first component 31 and a decorative component 32. The first component 31 is a cover, generally made of non-metallic material. A first through-structure 31c, extending through the first component 31 along its thickness, is provided at a position corresponding to camera-related components (such as camera 42, flash 43, lidar, etc.). The first through-structure 31c is generally a through hole, but can also be a notch, depending on the specific application requirements.

[0099] Decorative component 32 is disposed at the first through structure 31c and is used to cover the first through structure 31c. At least a portion of the decorative component 32 protrudes from the first component 31. The decorative component 32 can shield the camera 42, flash 43, and other electronic components located in the corresponding area of ​​the first through structure 31c, thus serving as a dust and dirt preventer. In addition, the decorative component 32 can also enhance the aesthetics of the electronic device to a certain extent, highlighting the personalized design of the electronic device. Currently, decorative components 32 are gradually developing towards functionality and personalization.

[0100] To give electronic devices a glossy and textured appearance, at least a portion of some decorative parts 32 are made of metallic materials (such as stainless steel, aluminum alloy, etc.). Due to the presence of metallic materials, these decorative parts 32 reflect light, providing a visually appealing element, and can also achieve diverse design styles through different surface treatments (such as polishing, frosting, brushing). Furthermore, metallic materials are generally more robust and durable than non-metallic materials (such as plastics, etc.), better protecting the internal electronic components (such as the camera 42, flash 43, etc.) from external impacts or scratches.

[0101] Specifically, the decorative component 32 includes a main body portion 321. At least a portion of the main body portion 321 is a first metal part 321a. Specifically, the main body portion 321 may include only the first metal part 321a, or it may include an insulating component in addition to the first metal part 321a, depending on the application requirements.

[0102] The main body 321 can be sealed to the housing assembly 30 or built-in components (such as circuit board 41) in electronic devices by means of foam, adhesive layer, screws, etc.

[0103] The main body 321 is provided with a second through structure. The second through structure may include multiple through holes. At least some of the through holes are corresponding to the camera 42. As mentioned above, there may be one or more cameras 42, and the electronic device may also include a flash 43, a lidar, etc., in addition to the camera 42. This makes the number of through holes generally greater than the number of cameras 42. Some through holes are corresponding to the camera 42, and other through holes are corresponding to the flash 43, lidar, etc.

[0104] In addition to the main body 321, the decorative component 32 also includes a light-transmitting component 322. The light-transmitting component 322 covers the aforementioned second through structure. The light-transmitting component 322 can be made of glass, resin, etc., and can be sealed to the main body 321 by gluing, plugging, or other methods. The light-transmitting component 322 allows light to pass through. The direction of light propagation can be from outside the electronic device to inside, such as light emitted or reflected by the object being photographed, which can pass through the light-transmitting component 322 to enter the electronic device and be captured by the camera 42. Alternatively, the direction of light propagation can be from inside the electronic device to outside, such as when the electronic components include a flash 43 and / or a lidar, the light-transmitting component 322 allows light emitted by the flash 43 and / or lidar to pass through.

[0105] The decorative element 32 can be located on the central axis L extending along the length direction Y of the first component 31, or it can be located on one side of the central axis L. Regardless of its location, the decorative element 32 is generally spaced apart from the antenna 10b1. However, with the improvement of the specifications and design of the camera 42, the size of the decorative element 32 is becoming larger. Sometimes, the decorative element 32 needs to cover not only components related to shooting, such as the camera 42, flash 43, and lidar, but also electronic components unrelated to shooting. That is, the coverage area of ​​the decorative element 32 is generally larger than the projection area of ​​the shooting-related components on the circuit board 41; some decorative elements 32 can have a coverage area that is 1.5 times, 2 times, or even larger than the projection area of ​​the shooting-related components on the circuit board 41. This makes the spacing between the decorative element 32 and the antenna 10b1 increasingly smaller.

[0106] As is well known, antenna 10b1 emits and receives electromagnetic waves of different frequencies, and free electrons exist in metals, which can interact with electromagnetic waves. Therefore, when the decorative part 32 contains a metallic material, that is, when the decorative part 32 has the aforementioned first metal part 321a, the reduced spacing between the decorative part 32 and antenna 10b1 may affect the performance of the antenna. The aforementioned problems may be related to the following reasons: First, the first metal part 321a reflects electromagnetic waves, causing a multipath effect, where the same signal reaches the receiver (such as antenna 10b1 or a receiving device located outside the electronic device) through different paths. This may lead to signal phase interference, thereby reducing signal quality or causing fading. Second, the first metal part 321a absorbs some of the radio frequency energy of electromagnetic waves, especially when the signal frequency is high. This absorption reduces the usable effective signal strength, affecting communication distance and reliability. Third, the first metal part 321a may resonate with antenna 10b1, especially when the size is close to an integer multiple of the wavelength. Such resonance may enhance the signal in some directions while suppressing the signal in other directions, distorting the original design radiation pattern. These reasons may cause a single antenna to receive more clutter, or multiple antennas to receive clutter, thus affecting antenna performance.

[0107] For the reasons mentioned above, in order to minimize or eliminate the impact of the decorative element 32 on the performance of the antenna 10b1, the first metal part 321a in the decorative element 32 is generally grounded. During grounding, a spring is typically provided on the circuit board 41, which is connected to the grounding circuit on the circuit board assembly 40 and contacts the first metal part 321a. In addition, a matching adjustment element is provided on the circuit board assembly 40 to tune clutter. This matching adjustment element includes, but is not limited to, resistors, capacitors, and metal-oxide-semiconductor (MOS) transistors, which can filter out at least some clutter.

[0108] To ensure the grounding effect, the decorative part 32 is generally provided with multiple grounding points, and at least one spring is required at any grounding point. Figure 4 For along Figure 3 A schematic diagram of the cross-sectional structure along the BB line. (See attached diagram.) Figure 4 As shown, to facilitate connection with the spring contact, a protruding structure 323 protruding towards the frame 10 can be provided at the grounding point of the decorative part 32. The protruding structure 323 can be integrally formed with the main body 321 or separately connected with the insulating component. However, the protruding structure 323 is generally made of metal. The protruding structure 323 contacts the spring contact 60 to achieve electrical connection between the decorative part 32 and the spring contact 60.

[0109] Because a sealed connection is required between the decorative element 32 and the first component 31, a sealing structure 33 is generally required on the edge of the decorative element 32 to seal with the first component 31. This results in the grounding point of the decorative element 32 generally not being particularly close to the edge of the decorative element 32.

[0110] As the performance and design of the camera 42 improve, the space on the decorative component 32 becomes increasingly limited, resulting in less usable space. For example, some electronic devices use a cannon-like shape for the decorative component 32, where it protrudes significantly from the surface of the first component 31. This design inherently requires additional space. Therefore, within the limited dimensions of the housing assembly 30, it reduces the space available for other components. Furthermore, the complex geometry of the cannon-like shape increases the difficulty of manufacturing and assembly. To ensure a seamless connection between the decorative component 32 and the first component 31, and to guarantee good sealing and waterproofing performance, more complex processes and technologies may be required, which could also reduce the effective utilization of the internal space of the decorative component 32. This makes the placement of the grounding point of the decorative component 32 one of the bottlenecks in the development of electronic devices.

[0111] In some electronic devices, Figure 3 From this perspective, the left and top areas covered by the decorative element 32 have fewer electronic components, making it easier to find suitable grounding points. However, the right and bottom areas covered by the decorative element 32 have electronic components and a shielding cover 44, making it difficult to find suitable grounding points on these areas.

[0112] Figure 5 This is a cross-sectional schematic diagram of a partial structure of an electronic device in related technologies. Figure 6 for Figure 5 A magnified schematic diagram of the structure at point B in the middle. (See diagram below.) Figure 5 and Figure 6As shown, if there are fewer electronic components on the left side of the area covered by the decorative element 32, a spring contact 60 (as shown in the figure, spring contact 61) can be installed in this area. Spring contact 61 can directly make conductive contact with the protruding structure 323 on the decorative element 32. However, the right side of the area covered by the decorative element 32 has electronic components and a shielding cover 44. If a spring contact 60 (as shown in the figure, spring contact 62) is installed in this area, spring contact 62 needs to be located below the sealing structure 33. Since the first component 31 is sealed to the decorative element 32, part of the first component 31 will also be located below the sealing structure 33. Therefore, spring contact 62 cannot make conductive contact with the protruding structure 323 on the decorative element 32, but will instead contact the first component 31. Since the first component 31 is generally made entirely of non-metallic materials, spring contact 62 cannot be used for grounding. Therefore, the location of spring contact 62 is not suitable for placing a spring contact. Furthermore, in this case, if the protruding structure 323 is installed at the position corresponding to spring contact 62 on the decorative element 32, it will affect the installation of the sealing structure 33, thereby affecting the seal between the decorative element 32 and the first component 31.

[0113] To at least partially improve the above-mentioned problems, embodiments of this application provide a housing assembly. This housing assembly has a second metal part disposed between a first metal part and a spring clip. The second metal part avoids the sealing structure between the decorative element and the first component. Thus, the second metal part enables electrical connection between the first metal part and the spring clip, allowing the edge grounding point of the decorative element to be grounded. Furthermore, the placement of the second metal part does not affect the seal between the decorative element and the first component.

[0114] Figure 7 for Figure 4 A magnified schematic diagram of the structure at point A in the middle. (See diagram below.) Figure 4 and Figure 7 As shown, one embodiment of this application provides an electronic device. The electronic device includes a frame 10, a grounding component, and a housing assembly 30. The housing assembly 30 and the frame 10 form a receiving space. The receiving space is the aforementioned second receiving space 10c. The grounding component is disposed within the receiving space. The grounding component is electrically connected to the housing assembly 30. The grounding component includes the aforementioned circuit board assembly 40 and a spring contact 60 connected to the circuit board assembly 40.

[0115] The housing assembly 30 includes a first component 31, a decorative element 32, and a sealing structure 33. The first component 31 has a first surface 31a and a second surface 31b arranged opposite each other along the thickness direction Z. The first surface 31a is the outer surface of the first component 31, exposed to the outside of the electronic device. The second surface 31b is the inner surface of the first component 31, facing the frame 10 and the grounding assembly. It is understood that the first surface 31a and the second surface 31b can be planar, curved, or irregular (e.g., locally provided with stepped structures, protrusions 323, etc.), depending on the application requirements.

[0116] The first component 31 has a first through structure 31c that penetrates the first surface 31a and the second surface 31b. As mentioned above, the first through structure 31c can be a through hole, a notch, or other structures, depending on the application requirements.

[0117] Decorative element 32 covers the first through structure 31c. Decorative element 32 includes at least a first metal portion 321a. As mentioned above, decorative element 32 may include only the first metal portion 321a, or it may include an insulating component in addition to the first metal portion 321a. The insulating component may include the aforementioned light-transmitting component 322, or other components (such as foam, plastic, etc.), depending on the specific application requirements.

[0118] At least a portion of the first metal part 321a overlaps with the first surface 31a in the thickness direction Z of the first member 31, and is sealed to the first surface 31a by the sealing structure 33. Specifically, when the first metal part 321a is an annular structure and located at the edge of the decorative member 32, the first metal part 321a can be completely overlapped with and sealed to the first surface 31a. When the size of the first metal part 321a is large enough to cover at least a portion of the first through structure 31c, then only a portion of the first metal part 321a is overlapped with and sealed to the first surface 31a.

[0119] The first component 31 includes a second metal portion 311 connected to the first metal portion 321a. The second metal portion 311 is disposed to avoid the sealing structure 33, and at least a portion of the second metal portion 311 is used for conductive contact with the grounding component.

[0120] In this embodiment, the first component 31 may include only the second metal part 311, or it may include an insulating component in addition to the second metal part 311, depending on the usage requirements.

[0121] The second metal part 311 can be located below the sealing structure 33, or part of it can be located on one side of the sealing structure 33 in the X-axis direction and the other part can be located below the sealing structure 33, or other arrangements can be adopted, as long as the second metal part 311 can realize the electrical connection between the first metal part 321a and the grounding component, and does not affect the arrangement of the sealing structure 33.

[0122] Using the housing assembly 30 provided in this application embodiment, the first metal part 321a can be... Figure 7 The path indicated by the dashed arrow in the diagram is electrically connected to the spring 60 in the grounding assembly.

[0123] In this embodiment, the housing assembly 30 and the first component 31 of the electronic device are no longer entirely made of non-metallic materials. Instead, at least a portion of the first component 31 is a second metal part 311, which connects the first metal part 321a and the grounding component, while avoiding the sealing structure 33 between the decorative part 32 and the first component 31. This allows the electronic device to achieve electrical connection between the first metal part 321a and the spring contact 60 via the second metal part 311, enabling the grounding point located at the edge of the decorative part 32 to be grounded. Furthermore, the placement of the second metal part 311 does not affect the seal between the edge of the decorative part 32 and the first component 31. In other words, the housing assembly 30 and the electronic device provided in this embodiment can simultaneously accommodate the grounding point placement at the edge of the decorative part 32 and the seal between the decorative part 32 and the first component 31. This allows for more placement positions of the grounding point on the decorative part 32 within a limited layout space, contributing to the further development of electronic devices.

[0124] There are various ways to install the second metal part 311. For ease of understanding, examples are given below.

[0125] Example 1

[0126] like Figure 4 and Figure 7 As shown, the first component 31 further includes an insulating portion 312. The insulating portion 312 has a first through structure 31c and a second through structure 3121 that penetrates itself along the thickness direction Z. At least a portion of the second metal portion 311 passes through the second through structure 3121 and connects to the first metal portion 321a. At least a portion of the second metal portion 311 is located on the side of the insulating portion 312 facing the grounding assembly. In this embodiment, the second metal portion 311 may be composed of one or more components.

[0127] By adopting the solution provided in this embodiment, the main part of the first component 31 can be made of insulating material, which is less likely to have an adverse effect on the antenna 10b1, and the cost of the first component 31 is lower.

[0128] The solution described in Example 1 can be implemented in various ways, and examples are given below.

[0129] In some embodiments, the second metal portion 311 includes a vertical portion 3111 and a horizontal portion 3112. The vertical portion 3111 passes through the second through structure 3121 and is connected to the first metal portion 321a. The horizontal portion 3112 is located on the side of the vertical portion 3111 away from the first metal portion 321a and is connected to the vertical portion 3111. The side of the horizontal portion 3112 facing away from the vertical portion 3111 is part of the second surface 31b, and the horizontal portion 3112 is used for conductive contact with the grounding component.

[0130] In this embodiment, the second metal part 311 can be either an integrally formed structure or a separate connected structure. When the second metal part 311 is a separate connected structure, the horizontal part 3112 and the vertical part 3111 can be separately connected, or the vertical part 3111 and a part of the horizontal part 3112 can be integrally formed, and the other part of the horizontal part 3112 can be separately connected to the aforementioned integrally formed structure.

[0131] Using the housing assembly 30 provided in this application embodiment, the first metal part 321a can be... Figure 7 The path indicated by the dashed arrow in the diagram is electrically connected to the spring contact 60 in the grounding assembly. That is, the first metal part 321a is electrically connected to the spring contact 60 in the grounding assembly via the vertical part 3111 and the horizontal part 3112 in sequence.

[0132] Using the structure provided in this embodiment, the second metal part 311 has a simple structure and is easy to assemble.

[0133] Figure 8 This is a cross-sectional structural diagram of a partial structure of an electronic device provided in another embodiment of this application. For example... Figure 8 As shown, in some other embodiments, the second metal part 311 includes a first connector 3113 and a second connector 3114. In this embodiment, the first connector 3113 and the second connector 3114 are generally metal parts, but they can also be internally made of insulating material, coated with a metal coating, or other configuration methods, as long as the electrical connection between the first metal part 321a and the grounding component can be achieved.

[0134] Figure 9 This is a cross-sectional view of a first connector in an electronic device according to an embodiment of this application. Figure 8 and Figure 9 As shown, the first connector 3113 includes a first portion 3113a and a second portion 3113b that are interconnected. The first portion 3113a passes through the second through structure 3121 and is connected to the first metal portion 321a. The second portion 3113b is larger than the first portion 3113a in at least a first direction. The second portion 3113b is located on the side of the insulating portion 312 facing away from the sealing structure 33 and is spaced apart from the insulating portion 312. The second connector 3114 is disposed between the second portion 3113b and the insulating portion 312 and is in conductive contact with the first portion 3113a and / or the second portion 3113b. At least a portion of the second connector 3114 extends beyond the first connector 3113 in the first direction to make conductive contact with the grounding assembly. The first direction is perpendicular to the thickness direction Z. That is, the first direction can be the X direction, the Y direction in the figure, or any direction parallel to the plane formed by X and Y, which can be determined according to the position of the spring piece 60 in the grounding assembly.

[0135] In this embodiment, the first connector 3113 can be a screw-on connector, a plug-in connector, etc. When the first connector 3113 is a screw-on connector, it can be a screw, a bolt, etc., or it can have a protrusion on the side wall of the screw rod. It is understood that when the first connector 3113 is a screw, the nut of the first connector 3113 is the aforementioned second part 3113b, and the screw rod of the first connector 3113 is the aforementioned first part 3113a. When the first connector 3113 has a protrusion on the side wall of the screw rod, the protrusion is the second part 3113b, and the screw rod is the first part 3113a.

[0136] The second connector 3114 can be a sheet structure, a block structure, or other structures, depending on the application requirements.

[0137] In this embodiment, the second connector 3114 and the second part 3113b of the first connector 3113 can be combined to form the horizontal part in Embodiment 2, and the first part 3113a of the first connector 3113 can form the vertical part in Embodiment 2.

[0138] The structure provided in this embodiment facilitates material sourcing and assembly.

[0139] In other embodiments, Embodiment 1 may also employ other configuration methods, which can be determined according to the specific needs of use.

[0140] Based on the above embodiments, various configuration methods can be used to ensure a stable electrical connection between the decorative element 32 and the grounding component. Examples are provided below for clarity.

[0141] Example a

[0142] Figure 10 This is a cross-sectional structural diagram of a partial structure of an electronic device provided in another embodiment of this application. For example... Figure 10 As shown, in this embodiment, the thickness d1 of the portion of the second connector 3114 that contacts the first connector 3113 is greater than the thickness d2 of the other portions of the second connector 3114. In this embodiment, the second connector 3114 can be a sheet structure or a block structure with non-uniform thickness; it can also be a sheet structure or a block structure with uniform thickness, but it is bent in the area that contacts the first connector 3113, that is, the thickness of the portion of the second connector 3114 that contacts the first connector 3113 is the sum of the thicknesses of the multi-layer sheet structure or the multi-layer block structure.

[0143] The thickness d1 of the part of the second connector 3114 that contacts the first connector 3113 is greater than the thickness d2 of the other parts of the second connector 3114. This allows the part of the second connector 3114 that contacts the first connector 3113 to have a larger amount of deformation, which helps the second connector 3114 to have full contact with the first connector 3113, thereby ensuring the stability of the grounding line connection.

[0144] Example b

[0145] Figure 11 This is a cross-sectional structural diagram of a partial structure of an electronic device provided in another embodiment of this application. For example... Figure 11 As shown, in this embodiment, the second connector 3114 facing the first connector 3113 and / or the first connector 3113 facing the second connector 3114 are provided with a first protrusion 3115. The first protrusion 3115 is the connection point for the electrical connection between the second connector 3114 and the first connector 3113. The first protrusion 3115 can be integrally formed on the second connector 3114, or integrally formed on the first connector 3113, or partly located on the first connector 3113 and partly located on the second connector 3114, depending on the specific application requirements.

[0146] The first protrusion 3115 allows the second connector 3114 of different products to be electrically connected to the first connector 3113 through a preset contact point (i.e., the location of the first protrusion), which helps to ensure the consistency of the connection points of different products and can optimize the connection between the second connector 3114 and the first connector 3113 to a certain extent.

[0147] like Figure 9 As shown, in some embodiments, the second portion 3113b has a concave-convex structure 3117 on the side facing the second connector 3114. The concave-convex structure 3117 is used to increase the friction between the second portion 3113b and the second connector 3114. The concave-convex structure 3117 can reduce the risk of loosening after the first connector 3113 is threaded.

[0148] In some embodiments, the second surface 31b of the insulating portion 312 is provided with a mounting groove 3116. The mounting groove 3116 communicates with the second through structure. The second connector 3114 is disposed within the mounting groove 3116. The mounting groove 3116 ensures that the second connector 3114 does not protrude from the surface of the insulating portion 312, or the portion protruding from the surface of the insulating portion 312 is relatively small, making the second surface 31b of the first component 31 relatively flat, which facilitates the installation of internal structural components of the electronic device. At the same time, the mounting groove 3116 can fix the position of the second connector 3114, allowing the second connector 3114 to be installed in a preset position.

[0149] Based on the above embodiments, in some embodiments, the first connector 3113 is a screw-in connector. In other embodiments, the first connector 3113 includes not only a screw-in connector but also other structures, such as a metal plating layer or reinforcing structures on the outer surface of the screw-in connector. The use of a screw-in connector in the first connector 3113 enhances the connection strength between the decorative element 32 and the first component 31, ensuring that the connection strength between the decorative element and the first component meets usage requirements. Furthermore, the screw-in connector is small in size and easy to assemble. In addition, the use of a metal screw-in connector in the first connector 3113 also meets the electrical connection requirements between the decorative element and the grounding component, eliminating RSE (Radiation Spurious Emission) related issues, thus making the solution feasible.

[0150] In some embodiments, the second connector 3114 is a sheet structure, which may include a gasket. In other embodiments, the second connector 3114 may include other structures besides the sheet structure, such as a metal plating layer disposed on the outer surface of the sheet structure, or a metal block embedded in the sheet structure.

[0151] The aforementioned sheet structure can be a ring-shaped gasket, a long strip gasket, or a gasket of other shapes, depending on the application requirements. It is understood that using a ring-shaped gasket in the sheet structure facilitates material sourcing and installation.

[0152] The second connector 3114 adopts a sheet structure, which is simple in structure, has a small thickness, and is easy to assemble.

[0153] Understandably, when the first connector 3113 uses screws or bolts, and the second connector 3114 uses a washer, the washer is larger than the nut. The extra part of the washer connects to the spring contact 60 in the grounding assembly, thus achieving grounding between the decorative part 32 and the circuit board 41 assembly 40. The shape of the washer is not too restricted; it can be designed according to product stacking or simply made into a ring for easy reuse. Optimization measures for the electrical connection between the spring contact 60 and the washer include, but are not limited to: First, the washer is made of nickel silver, and the spring contact 60 directly contacts the washer; the contact part between the spring contact 60 and the washer can be either a ball head or a non-ball head. Second, the washer is made of stainless steel with a nickel-plated outer surface; the contact part between the spring contact 60 and the washer can be either a ball head or a non-ball head. Third, the washer is made of aluminum alloy, and the surface oxide layer is removed by laser engraving; the contact part between the spring contact 60 and the washer can be either a ball head or a non-ball head.

[0154] Alternatively, when a gasket is used in the second connector 3114, the aforementioned first protrusion 3115 can be made by forming a raised bulge on the gasket. The gasket can be made of steel sheet or other metal sheet.

[0155] Example 3

[0156] Figure 12 This is a cross-sectional structural diagram of a partial structure of an electronic device provided in another embodiment of this application. For example... Figure 12 As shown, in this embodiment, the first component 31 further includes an insulating portion 312. The insulating portion 312 has a first through structure and a second through structure 3121 that extends through itself along the thickness direction. A second metal portion 311 is disposed on the side of the insulating portion 312 away from the sealing structure 33 and is connected to the insulating portion 312.

[0157] The first metal portion 321a has a second protrusion 321b that protrudes toward the first member 31. At least a portion of the second protrusion 321b passes through the second through structure 3121 and makes conductive contact with the second metal portion 311. The second protrusion 321b can be as follows: Figure 12 The bottom surface shown is in conductive contact with the second metal part 311, or it can be like this. Figure 13 The sidewall shown is in conductive contact with the second metal part 311, or it may be in conductive contact with the second metal part 311 in other ways, depending on the application requirements.

[0158] In this embodiment, the second metal part 311 can be a sheet structure, a block structure, etc., and can be composed of one or more parts.

[0159] Compared with the solution in Embodiment 2, the second metal part 311 can be composed of only one component to realize the electrical connection between the second metal part 311 and the first metal part 321a. If the second metal part 311 adopts the above-mentioned second connector 3114, the structure of the second metal part 311 can be simplified, and the connection between the first metal part 321a and the second metal part 311 can be made more convenient.

[0160] In some embodiments, the second metal part 311 is a sheet structure. In other embodiments, the second metal part 311 may include other structures besides the sheet structure, such as a metal block stacked with the sheet structure, which may be determined according to the application requirements.

[0161] The solution provided in this embodiment makes the structure of the second metal part 311 simple and easy to manufacture and assemble.

[0162] To meet usage requirements, there are certain strength requirements between the decorative part and the first component. To improve the connection strength between the decorative part and the first component, in some embodiments, the second metal part 311 is connected to the first metal part 321a by a fastener 34.

[0163] In this embodiment, the fastener 34 can be a screw, bolt, etc., which can be determined according to the usage requirements.

[0164] This ensures a stable connection between the second metal part 311 and the first metal part 321a, guaranteeing that the connection strength between the decorative element and the first component meets usage requirements. It is understood that, in addition to providing fasteners at the location of the second metal part 311, fasteners can also be provided at the location of the insulating part when the decorative element also includes an insulating part; the specific method depends on the usage requirements.

[0165] Figure 13 This is a cross-sectional structural diagram of a partial structure of an electronic device provided in another embodiment of this application. For example... Figure 12 and Figure 13 As shown, in order to increase the contact area between the second metal part 311 and the second protrusion 321b, in some embodiments, the second metal part 311 is provided with a third protrusion 313 on the side near the second protrusion 321b, which contacts the second metal part 311. The third protrusion 313 can be integrally formed with the second metal part 311 or it can be separately connected to the second metal part 311. However, when the third protrusion 313 is integrally formed with the second metal part 311, the third protrusion 313 can be directly formed during manufacturing, or a sheet can be formed first, then a hole can be made in the middle of the sheet, and the hole wall can be cut. Then, the structure near the hole wall can be folded away from the frame or towards the frame to form the third protrusion 313.

[0166] Example 4

[0167] Figure 14 This is a cross-sectional structural diagram of a partial structure of an electronic device provided in another embodiment of this application. For example... Figure 14 As shown, in this embodiment, the first component 31 further includes an insulating portion 312. The insulating portion 312 has a third through structure 312a that extends through itself along the thickness direction. The second metal portion 311 is disposed in the third through structure 312a.

[0168] In this embodiment, the third through structure 312a may include the first through structure 31c, or may be arranged at an interval from the first through structure 31c.

[0169] In this embodiment, the third through structure 312a has multiple configuration methods, and the second metal part 311 also has multiple installation methods, which are illustrated below. For example... Figure 14 As shown, in some embodiments, the first through structure 31c is disposed on the insulating portion 312, and the side wall of the first through structure 31c is provided with a fourth through structure 312b communicating with the first through structure 31c. The fourth through structure 312b can be an annular through hole, such as... Figure 15 As shown; it can also be a groove structure with its opening facing the first through structure 31c, such as Figure 16As shown. The fourth through structure 312b is connected to the first through structure 31c to form the third through structure 312a, and the second metal part 311 is disposed in the fourth through structure 312b. Figure 17 A cross-sectional view of a partial structure of an electronic device provided in another embodiment of this application;

[0170] Figure 18 for Figure 17 The diagram shows a front view of a partial structure of the first component in the electronic device. (See attached diagram.) Figure 17 and Figure 18 As shown, in some other embodiments, the first through structure 31c is disposed on the insulating part 312, and the insulating part 312 is also provided with a third through structure 312a spaced apart from the first through structure 31c, and the second metal part 311 is disposed in the third through structure 312a.

[0171] Regardless of which of the above settings is adopted, the solution provided in this embodiment can make the structure of the first component 31 simple and easy to prepare and assemble.

[0172] Finally, it should be noted that the above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A housing assembly for use in an electronic device, the electronic device having a grounding assembly, characterized in that, The shell assembly comprises a first member, a decoration piece and a sealing structure; The first member has a first surface and a second surface arranged oppositely along a thickness direction, the second surface is arranged towards the grounding assembly, the first member has a first through structure penetrating the first surface and the second surface, and the decoration piece covers the first through structure; The decoration piece comprises at least a first metal part, at least a part of the first metal part is overlapped with the first surface along the thickness direction of the first member and is sealingly connected with the first surface through the sealing structure; The first member comprises a second metal part connected with the first metal part, the second metal part is arranged away from the sealing structure, and at least a part of the second metal part is arranged to be in conductive contact with the grounding assembly.

2. The housing assembly of claim 1, wherein, The first member further comprises an insulating part, the insulating part is provided with the first through structure and a second through structure penetrating the insulating part along the thickness direction, at least a part of the second metal part passes through the second through structure and is connected with the first metal part, and at least a part of the second metal part is located on a side of the insulating part towards the grounding assembly.

3. The housing assembly of claim 2, wherein, The second metal part comprises a vertical part and a horizontal part; the vertical part is arranged in the second through structure and is connected with the first metal part; the horizontal part is located on a side of the vertical part away from the first metal part and is connected with the vertical part; a surface of the horizontal part away from the vertical part is a part of the second surface and is arranged to be in conductive contact with the grounding assembly.

4. The housing assembly of claim 2, wherein, The second metal part comprises a first connecting piece and a second connecting piece; the first connecting piece comprises a first part and a second part connected with each other; the first part passes through the second through structure and is connected with the first metal part; the second part has a size in a first direction larger than that of the first part, the second part is located on a side of the insulating part towards the grounding assembly and is arranged to be spaced apart from the insulating part; the second connecting piece is arranged between the second part and the insulating part and is in conductive contact with the first part and / or the second part; at least a part of the second connecting piece is arranged to be beyond the first connecting piece along the first direction to be in conductive contact with the grounding assembly, and the first direction is perpendicular to the thickness direction.

5. The housing assembly of claim 4, wherein, The thickness of the part of the second connecting piece in contact with the first connecting piece is larger than that of other parts of the second connecting piece.

6. The housing assembly of claim 4, wherein, A surface of the second connecting piece towards the first connecting piece and / or a surface of the first connecting piece towards the second connecting piece is provided with a first protruding part, and the first protruding part is a connecting point for electrically connecting the second connecting piece with the first connecting piece.

7. The housing assembly of claim 4, wherein, A surface of the second part towards the second connecting piece is provided with a concave-convex structure for increasing the friction between the second part and the second connecting piece.

8. The housing assembly of any of claims 4-7, wherein, A surface of the insulating part away from the sealing structure is provided with a mounting groove, the mounting groove is in communication with the second through structure, and the second connecting piece is arranged in the mounting groove.

9. The housing assembly of any of claims 4-8, wherein, The first connecting piece comprises a screwing piece. And / or, the second connecting piece comprises a sheet structure.

10. The housing assembly of claim 1, wherein, The first component further comprises an insulating portion provided with the first through structure and a second through structure penetrating the insulating portion along a thickness direction, and the second metal portion is arranged on a side of the insulating portion away from the sealing structure and connected with the insulating portion. The first metal portion has a second protruding portion protruding towards the first component, and at least a part of the second protruding portion is in conductive contact with the second metal portion through the second through structure.

11. The housing assembly of claim 10, wherein, The second metal portion comprises a sheet structure.

12. The housing assembly of claim 10 or 11, wherein, The second metal portion is connected with the first metal portion through a screwing element.

13. The housing assembly of claim 1, wherein, The first component further comprises an insulating portion provided with a third through structure penetrating the insulating portion along a thickness direction, and the second metal portion is arranged on the third through structure.

14. An electronic device, comprising: The frame and the housing assembly form an accommodating space, and the grounding assembly is arranged in the accommodating space and electrically connected with the housing assembly.

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