Circuit board with compression-resistant structure

Abstract

The utility model relates to the technical field of circuit boards, and discloses a circuit board with a pressure-resistant structure, which comprises a fixed plate, the top end of the fixed plate is fixedly connected with a connecting frame, the inner wall of the connecting frame is provided with a circuit body, the left end and the right end of the connecting frame are fixedly connected with sliding chute plates, and the inner walls of the sliding chute plates are connected with buffer shells through tension groups. Extrusion rods are slidably connected to the top ends of the buffer shells, traction rods are connected to the top ends of the extrusion rods through buffer sets, a connecting cover is installed at the top end of the connecting frame, a heat conduction groove is formed in the top end of the connecting cover, and a plurality of heat dissipation plates are fixedly connected to the inner wall of the heat conduction groove. According to the utility model, the movable block is dragged by the traction rod to move outside the fixed rod, and the tension of the tension spring enables the movable block to generate resistance to counteract bounce, so that the extrusion rod is fully buffered, thereby ensuring that the extrusion rod can effectively finish the buffer stroke, avoiding the springback oscillation phenomenon of the mechanism, protecting the circuit body and prolonging the service life of the circuit body.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board with a pressure-resistant structure. Background Technology

[0002] Circuit boards, also known as printed circuit boards (PCBs), are a type of electronic device. They enable the miniaturization and visualization of circuits, playing a crucial role in the large-scale mass production of fixed circuits and the optimization of electrical appliance layouts. The price of a circuit board is influenced by many factors, including the materials used, the number of layers, the board's size, the production quantity per batch, the manufacturing process employed, the minimum trace width and spacing, the minimum hole diameter and number of holes, and any special process requirements. Furthermore, different circuit board designs will correspond to different prices.

[0003] In current practical applications, existing circuit boards have certain performance shortcomings. When the circuit board is subjected to external pressure, because various electronic components are mounted on its surface, these electronic components are easily affected by the pressure, which can lead to damage. This reflects that the existing circuit boards themselves have insufficient pressure resistance, and the lack of pressure resistance will directly lead to a reduction in the service life of the circuit board.

[0004] In response to this technical problem, this application proposes a circuit board with a pressure-resistant structure. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a circuit board with a pressure-resistant structure. The moving block is pulled outward by a traction rod, and the tension of the spring causes the moving block to generate resistance to counteract the rebound force, thus fully buffering the compression rod. This ensures that the compression rod can effectively complete the buffer stroke, while also preventing the mechanism from rebounding and oscillating, protecting the circuit body and extending its service life.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A circuit board with a pressure-resistant structure includes a fixing plate, a connecting frame fixedly connected to the top of the fixing plate, a circuit body installed on the inner wall of the connecting frame, sliding plates fixedly connected to both ends of the connecting frame, buffer shells connected to the inner walls of the sliding plates via tension groups, compression rods slidably connected to the top of each buffer shell, traction rods connected to the top of the compression rods via buffer groups, a connecting cover installed at the top of the connecting frame, a heat-conducting groove formed at the top of the connecting cover, and several heat dissipation plates fixedly connected to the inner wall of the heat-conducting groove.

[0008] Furthermore, the tension assembly includes fixed rods that are fixedly connected to both the front and rear ends of the inner wall of the slide plate, with one end of each fixed rod fixedly connected to the front and rear ends of the buffer shell.

[0009] Furthermore, each of the fixed rods is provided with a tension spring on its outer wall. The opposite ends of the tension springs are fixedly connected to the front and rear ends of the buffer shell, and the opposite ends of the tension springs are respectively fixedly connected to the opposite ends of the moving block.

[0010] Furthermore, the buffer group includes support blocks that are fixedly connected to the top of the compression rod, and the traction rods are rotatably connected to the front and rear ends of the support blocks respectively.

[0011] Furthermore, each of the compression rods is fixedly connected to a spring at its bottom end, and the bottom end of each spring is fixedly connected to the bottom end of the inner wall of the buffer shell.

[0012] Furthermore, the fixing plate has several heat dissipation holes at both the front and rear ends.

[0013] Furthermore, a heat dissipation hole is provided at the top of the inner wall of the connecting cover and extends through it.

[0014] This utility model has the following beneficial effects:

[0015] In this invention, when the extrusion connecting cover moves in the connecting frame, it will extrude the extrusion rod at the support block and move in the buffer shell. The spring in the buffer shell buffers the extrusion force, and the spring rebound force causes the extrusion rod to move in the opposite direction. The traction rod pulls the moving block to move outward from the fixed rod. The tension spring force causes the moving block to generate resistance to offset the rebound force, so that the extrusion rod can be fully buffered. This ensures that the extrusion rod can effectively complete the buffer stroke and avoids the rebound oscillation phenomenon of the mechanism, protecting the circuit body and extending its service life. Attached Figure Description

[0016] Figure 1 This is a perspective view of a circuit board with a pressure-resistant structure proposed in this utility model;

[0017] Figure 2 This is a half-sectional view of a connection cover for a circuit board with a pressure-resistant structure proposed in this utility model;

[0018] Figure 3 This is a cross-sectional view of a fixing plate for a circuit board with a pressure-resistant structure proposed in this utility model;

[0019] Figure 4 This is a cross-sectional view of a slide plate with a pressure-resistant structure for a circuit board proposed in this utility model;

[0020] Figure 5 This is a half-sectional view of the buffer shell of a circuit board with a pressure-resistant structure proposed in this utility model.

[0021] Legend:

[0022] 1. Fixing plate; 2. Connecting frame; 3. Connecting cover; 4. Heat conduction groove; 5. Heat dissipation hole one; 6. Heat dissipation plate; 7. Heat dissipation hole two; 8. Sliding plate; 9. Support block; 10. Traction rod; 11. Circuit body; 12. Fixing rod; 13. Tension spring; 14. Moving block; 15. Buffer shell; 16. Compression rod; 17. Spring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Reference Figure 1 , Figure 4 and Figure 5 An embodiment of this utility model provides a circuit board with a pressure-resistant structure, including a fixed plate 1, a connecting frame 2 fixedly connected to the top of the fixed plate 1, a circuit body 11 installed on the inner wall of the connecting frame 2, sliding plates 8 fixedly connected to both the left and right ends of the connecting frame 2, fixed rods 12 fixedly connected to both the front and rear ends of the inner wall of the sliding plates 8, fixed rods 12 fixedly connected to the front and rear ends of the buffer shell 15 at opposite ends, tension springs 13 provided on the outer wall of the fixed rods 12, tension springs 13 fixedly connected to the front and rear ends of the buffer shell 15 at opposite ends, tension springs 13 fixedly connected to the opposite ends of the moving blocks 14 at opposite ends, compression rods 16 slidably connected to the top of the buffer shell 15, support blocks 9 fixedly connected to the top of the compression rods 16, traction rods 10 rotatably connected to the front and rear ends of the support blocks 9 at opposite ends, springs 17 fixedly connected to the bottom of the compression rods 16, and springs 17 fixedly connected to the bottom of the inner wall of the buffer shell 15.

[0025] Specifically: During the mechanical transmission process, when the extrusion connecting cover 3 is displaced along the guide rail of the connecting frame 2, its bottom inclined structure first contacts and applies pressure to the support block 9. This force causes the extrusion rod 16 to move axially within the guide groove of the buffer shell 15. At this time, the spring 17 installed inside the buffer shell 15 implements three-stage buffering of the impact load through elastic deformation. In the first stage, the linear compression of the spring 17 absorbs kinetic energy; in the second stage, the torsional torque of the spring 17 disperses lateral stress; and in the third stage, the damping characteristics of the spring 17 dissipate energy. When the impact load is eliminated, the spring... The combined rebound force generated by 17 drives the compression rod 16 to move in the opposite direction along the buffer shell 15. At this time, the traction rod 10, which is hinged to the compression rod 16, synchronously drives the moving block 14 to slide outward within the limiting track of the fixed rod 12. During this process, the tension spring 13 in the pre-tightened state generates controllable resistance through the mechanical balance system. This resistance value forms a dynamic torque balance with the rebound force of the spring 17, which ensures that the compression rod 16 can effectively complete the buffer stroke and avoids the rebound oscillation phenomenon of the mechanism. Through this multi-stage buffer linkage mechanism, the all-round dynamic protection of the circuit body 11 inside the connecting frame 2 is finally achieved.

[0026] Reference Figure 2 and Figure 3 The top of the connecting frame 2 is equipped with a connecting cover 3. The top of the connecting cover 3 is provided with a heat conduction groove 4. Several heat dissipation plates 6 are fixedly connected to the inner wall of the heat conduction groove 4. Several heat dissipation holes 7 are provided at both the front and rear ends of the fixed plate 1. A heat dissipation hole 5 is provided at the top of the inner wall of the connecting cover 3 and passes through it.

[0027] Specifically: In the heat conduction system, the array of heat-conducting grooves 4 on the surface of the connecting cover 3 continuously introduces the low temperature of the external environment through the principle of heat conduction by making efficient contact with the heat sink 6. The heat sink 6 adopts a gradient fin structure, and the phase change heat-conducting medium embedded at its bottom conducts the cold energy in a directional manner to the air intake channel of the heat dissipation hole 5, forming forced convection to inject cold air into the internal cavity of the connecting frame 2. At the same time, the centrifugal air duct system set inside the fixing plate 1 forms a counter-current heat exchange with the heat-generating element inside the connecting frame 2 through the low temperature airflow introduced through the heat dissipation hole 5. The heat dissipation hole 7, which is optimized by thermodynamic calculation, accelerates the exhaust of the heated airflow with the Venturi effect. This composite heat dissipation system performs three-stage heat management: the first stage is the basic heat conduction completed by the heat-conducting grooves 4, the second stage is the active air cooling implemented through the heat dissipation hole 5, and the third stage uses the heat dissipation hole 7 to build a chimney effect to exhaust the heat flow, ultimately reducing the operating temperature of the circuit body 11 and effectively improving the system's operational stability.

[0028] Working principle: When the compression connecting cover 3 moves at the connecting frame 2, the compression rod 16 at the support block 9 moves at the buffer shell 15. The buffer shell 15 buffers the compression force of the compression rod 16 through the spring 17. The rebound force generated by the spring 17 causes the compression rod 16 to move in the opposite direction. The compression rod 16 pulls the moving block 14 outward at the fixed rod 12 through the traction rod 10 at the support block 9. The tension force generated by the tension spring 13 pulls the moving block 14, so that the moving block 14 generates resistance to counteract the rebound force generated by the spring 17. This allows the compression rod 16 to fully buffer the connecting cover 3, thereby protecting the circuit body 11 inside the connecting frame 2. The heat conduction groove 4 at the connecting cover 3, under the heat conduction of the heat dissipation plate 6, introduces the low temperature from the outside into the connecting cover 3 and transmits it into the connecting frame 2 through the heat dissipation hole 1 5. The cold air introduced into the fixed plate 1 through the heat dissipation hole 1 5 discharges the heat inside the connecting frame 2 through the heat dissipation hole 2 7, thereby cooling the circuit body 11.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wiring board having a pressure-resistant structure, comprising a fixed plate (1), characterized by: The fixed plate (1) top fixedly connected with the connecting frame (2), the connecting frame (2) inner wall is mounted with line body (11), the connecting frame (2) left and right two ends are fixedly connected with the sliding groove plate (8), the sliding groove plate (8) inner wall is connected with the buffer shell (15) through the tension group, the buffer shell (15) top is slidably connected with the extrusion rod (16), the extrusion rod (16) top is connected with the traction rod (10) through the buffer group, the connecting cover (3) is installed on the connecting frame (2) top, the connecting cover (3) top is provided with heat conduction groove (4), the heat conduction groove (4) inner wall is fixedly connected with a plurality of heat dissipation plates (6).

2. The circuit board having a pressure-resistant structure according to claim 1, characterized by: The tension group includes the fixed rod (12) fixedly connected on the inner wall of the sliding groove plate (8) front and back ends, and the fixed rod (12) is fixedly connected to the front and back ends of the buffer shell (15) respectively.

3. The circuit board having a pressure-resistant structure according to claim 2, characterized by: The fixed rod (12) outer wall is provided with a tension spring (13), and the tension spring (13) is fixedly connected to the front and back ends of the buffer shell (15) respectively.

4. The circuit board having a pressure-resistant structure according to claim 1, characterized by: The buffer group includes the support block (9) fixedly connected to the top of the extrusion rod (16), and the opposite end of the traction rod (10) is rotatably connected to the front and back ends of the support block (9) respectively.

5. The circuit board having a pressure-resistant structure according to claim 1, characterized by: The extrusion rod (16) bottom is fixedly connected with a spring (17), and the spring (17) bottom is fixedly connected to the inner wall bottom of the buffer shell (15).

6. The circuit board having a pressure-resistant structure according to claim 1, wherein: The fixed plate (1) front and back ends are provided with a plurality of heat dissipation holes (7).

7. The circuit board having a pressure-resistant structure according to claim 1, characterized by: The connecting cover (3) inner wall top is provided with a heat dissipation hole (5) and penetrates.

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