Perovskite cell packaging assembly and perovskite cell

Abstract

The utility model discloses a packaging assembly of a perovskite battery and the perovskite battery, and relates to the technical field of batteries. The packaging assembly comprises a first substrate, a perovskite functional layer, a first packaging structure, a second packaging structure and a second substrate. The first packaging structure surrounds the perovskite functional layer, and the thickness of the main body packaging part of the first packaging structure is different from the thickness of the auxiliary packaging part, so that when the second substrate is placed on the sides, away from the first substrate, of the first packaging structure and the second packaging structure, the perovskite functional layer is packaged. The second substrate, the first packaging structure and the first substrate do not form a closed structure in advance due to the gravity of the second substrate, and a gap can be formed between the second substrate and at least partial area of the first packaging structure. Therefore, in the subsequent lamination process, bubbles generated by the second packaging structure can be discharged from the gap, the bad bubbles are reduced, and the yield of the perovskite battery is improved.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a perovskite battery encapsulation component and a perovskite battery. Background Technology

[0002] Perovskite solar cells have advantages such as high photoelectric conversion efficiency, low cost, and environmentally friendly materials, and are gradually becoming a popular type of solar cell, making them a key development direction for the photovoltaic cell industry.

[0003] In related technologies, a perovskite solar cell includes a first substrate, a perovskite functional layer located on one side of the first substrate, and a second substrate located on the side of the perovskite functional layer away from the first substrate. The encapsulation process of the perovskite solar cell includes: disposing encapsulating adhesive around the perovskite functional layer; filling the side of the perovskite functional layer away from the first substrate with an encapsulation layer; placing the second substrate on the side of the encapsulating adhesive and encapsulation layer away from the first substrate to form a sealed structure; and laminating the second substrate using a lamination process.

[0004] However, during the lamination process, the encapsulation layer material is heated and melted, generating bubbles. These bubbles cannot escape from the sealed structure, resulting in a low yield of perovskite solar cells. Summary of the Invention

[0005] This application provides a perovskite solar cell packaging component and a perovskite solar cell, which can solve the problem of low yield of perovskite solar cells in related technologies. The technical solution is as follows:

[0006] On one hand, a perovskite solar cell encapsulation assembly is provided, the perovskite solar cell encapsulation assembly comprising:

[0007] First substrate;

[0008] A perovskite functional layer is located on one side of the first substrate, and the orthographic projection of the perovskite functional layer on the first substrate is located within the first substrate. The perovskite functional layer is used to convert optical signals into electrical signals.

[0009] A first packaging structure is located on one side of the first substrate. The orthographic projection of the first packaging structure on the first substrate is located inside the first substrate, and the orthographic projection of the first packaging structure on the first substrate surrounds the orthographic projection of the perovskite functional layer on the first substrate.

[0010] A second packaging structure, wherein the second packaging structure is at least partially located on the side of the perovskite functional layer away from the first substrate;

[0011] And a second substrate, the second substrate being located on the side of the first packaging structure and the second packaging structure away from the first substrate;

[0012] The first packaging structure includes a main packaging part and at least one auxiliary packaging part. The main packaging part and the at least one auxiliary packaging part are an integral structure. The thickness of the main packaging part is different from the thickness of the auxiliary packaging part. At least a portion of the first packaging structure has a gap with the second substrate.

[0013] Optionally, the first packaging structure includes a plurality of auxiliary packaging portions, which are evenly arranged around the perovskite functional layer.

[0014] Optionally, the dimension of the first substrate along the first direction is larger than the dimension of the first substrate along the second direction, and the first direction and the second direction intersect.

[0015] The plurality of auxiliary packaging portions include a plurality of first-type auxiliary packaging portions arranged along the first direction, and a plurality of second-type auxiliary packaging portions arranged along the second direction;

[0016] The number of the first type of auxiliary packaging parts is greater than the number of the second type of auxiliary packaging parts.

[0017] Optionally, the first substrate is rectangular in shape, and the orthographic projection of the first packaging structure onto the first substrate is rectangular in shape;

[0018] The plurality of first-type auxiliary packaging parts constitute two groups of first packaging groups arranged along the second direction, and each group of first packaging groups includes a plurality of first-type auxiliary packaging parts arranged along the first direction.

[0019] The plurality of second-type auxiliary packaging parts constitute two sets of second packaging groups arranged along the first direction, and each set of second packaging groups includes at least one second-type auxiliary packaging part arranged along the second direction.

[0020] Optionally, the two sets of first packaging groups include the same number of first-type auxiliary packaging parts, and the two sets of second packaging groups include the same number of second-type auxiliary packaging parts.

[0021] Optionally, the first type of auxiliary packaging parts included in the two sets of the first packaging groups are symmetrically arranged with respect to the first axis, and the second type of auxiliary packaging parts included in the two sets of the second packaging groups are symmetrically arranged with respect to the second axis.

[0022] Wherein, the first axis extends along the first direction and passes through the center of the first substrate, and the second axis extends along the second direction and passes through the center of the first substrate.

[0023] Optionally, the width of the auxiliary packaging portion is less than or equal to the width of the main packaging portion;

[0024] Wherein, the width of the auxiliary packaging part is the length of the auxiliary packaging part in the extension direction perpendicular to the first packaging structure, and the width of the main packaging part is the length of the main packaging part in the extension direction perpendicular to the first packaging structure.

[0025] Optionally, the thickness of the main packaging portion is less than the thickness of the auxiliary packaging portion, and the difference between the thickness of the main packaging portion and the thickness of the auxiliary packaging portion ranges from 0.2 mm to 0.4 mm.

[0026] Optionally, the second substrate is in contact with at least the surface of the auxiliary packaging portion away from the first substrate;

[0027] At least a portion of the main packaging section near the auxiliary packaging section has a gap with the second substrate.

[0028] Optionally, the thickness of the main packaging portion is greater than the thickness of the auxiliary packaging portion, and the difference between the thickness of the main packaging portion and the thickness of the auxiliary packaging portion ranges from 0.2 mm to 0.4 mm.

[0029] Optionally, the second substrate is in contact with at least the surface of the main package portion away from the first substrate;

[0030] At least a portion of the auxiliary packaging section near the main packaging section has a gap between it and the second substrate.

[0031] On the other hand, a perovskite solar cell is provided, which is obtained by laminating the encapsulation component described above using a lamination process, the perovskite solar cell comprising:

[0032] First substrate;

[0033] A perovskite functional layer is located on one side of the first substrate, and the orthographic projection of the perovskite functional layer on the first substrate is located within the first substrate. The perovskite functional layer is used to convert optical signals into electrical signals.

[0034] A first packaging structure is located on one side of the first substrate. The orthographic projection of the first packaging structure on the first substrate is located within the first substrate, and the orthographic projection of the first packaging structure on the first substrate surrounds the orthographic projection of the perovskite functional layer on the first substrate. The first packaging structure contacts the second substrate on the surface away from the first substrate, and the first packaging structure contacts the first substrate on the surface close to the first substrate.

[0035] A second packaging structure, wherein the second packaging structure is at least partially located on the side of the perovskite functional layer away from the first substrate;

[0036] And a second substrate, the second substrate being located on the side of the first packaging structure and the second packaging structure away from the first substrate;

[0037] The first packaging structure includes a first part and at least one second part, the first part and the at least one second part are an integral structure, the width of the first part and the width of the second part are different, the width of the first part is the length of the first part in the extension direction perpendicular to the first packaging structure, and the width of the second part is the length of the second part in the extension direction perpendicular to the first packaging structure.

[0038] Optionally, the difference between the width of the first portion and the width of the second portion ranges from 1 mm to 2 mm.

[0039] The beneficial effects of the technical solution provided in this application include at least the following:

[0040] This application provides a perovskite solar cell encapsulation component and a perovskite solar cell. The encapsulation component includes: a first substrate, a perovskite functional layer, a first encapsulation structure, a second encapsulation structure, and a second substrate. The first encapsulation structure surrounds the perovskite functional layer, and the thickness of the main encapsulation portion of the first encapsulation structure is different from the thickness of the auxiliary encapsulation portion. Therefore, when the second substrate is placed on the side of the first and second encapsulation structures away from the first substrate, it will not prematurely form a sealed structure with the first encapsulation structure and the first substrate due to its own weight. Instead, a gap can be formed between at least a portion of the second substrate and the first encapsulation structure. As a result, in subsequent lamination processes, bubbles generated by the second encapsulation structure can be discharged through the gap, reducing bubble defects and improving the yield of the perovskite solar cell. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the structure of a perovskite solar cell encapsulation component provided in an embodiment of this application;

[0043] Figure 2 yes Figure 1 A partial schematic diagram of region A;

[0044] Figure 3 The encapsulation component provided in this application embodiment is along Figure 2A schematic diagram of the cross-section in the BB' direction;

[0045] Figure 4 The encapsulation component provided in this application embodiment is along Figure 2 A schematic diagram of the cross-section in the CC' direction;

[0046] Figure 5 This is a schematic diagram of a first encapsulation structure in an encapsulation component provided in an embodiment of this application;

[0047] Figure 6 This is a schematic diagram of the gap between a second substrate and a first packaging structure provided in an embodiment of this application;

[0048] Figure 7 The encapsulation component provided in this application embodiment is along Figure 2 Another cross-sectional diagram in the BB' direction;

[0049] Figure 8 This is a schematic diagram of the gap between another second substrate and a first package structure provided in an embodiment of this application;

[0050] Figure 9 This is a schematic diagram of the structure of a perovskite solar cell provided in an embodiment of this application;

[0051] Figure 10 This is a schematic diagram of a first packaging structure in a perovskite solar cell provided in the embodiments of this application;

[0052] Figure 11 yes Figure 10 A partial schematic diagram of region D;

[0053] Figure 12 This is a schematic diagram of another first packaging structure in the perovskite solar cell provided in the embodiments of this application;

[0054] Figure 13 yes Figure 12 A partial schematic diagram of region E;

[0055] Figure 14 This is a schematic diagram of another perovskite solar cell provided in the embodiments of this application. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0057] Perovskite solar cells, as the third generation of solar cells, are currently being widely researched and industrialized due to their high efficiency and low cost. The encapsulation process for perovskite solar cells currently involves the following steps: coating with encapsulant (butyl rubber, PIB), applying a POE film, substrate lamination, and lamination. Encapsulant coating refers to applying encapsulant around the perovskite functional layer on the first substrate. The POE film involves filling the side of the perovskite functional layer away from the first substrate with POE material. Substrate lamination involves placing the second substrate on top of the butyl rubber, PIB, and POE film. The lamination process aims to ensure a tight bond between the encapsulant and the first and second substrates, forming a sealed structure to block water and oxygen, and to eliminate air bubbles generated by the melting of the POE during heating.

[0058] However, in current encapsulation processes, butyl rubber (PIB) is a pressure-sensitive adhesive with good adhesion and water-oxygen interaction properties at room temperature. Therefore, after substrate lamination but before lamination, the second substrate, due to its own gravity, causes the butyl rubber PIB to adhere directly to both the first and second substrates, forming a sealed structure. Consequently, during the lamination process, bubbles generated by the melting of POE during heating cannot escape, resulting in bubble defects that affect battery life and have an unsightly appearance. Although lamination is a high-temperature process, longer pressurization and heating times can eliminate bubbles to some extent, but the bubble elimination effect is generally limited and has a significant impact on the photoelectric conversion efficiency of the perovskite functional layer.

[0059] Figure 1 This is a schematic diagram of the structure of a perovskite solar cell packaging component provided in an embodiment of this application. Figure 2 yes Figure 1 A partial schematic diagram of region A. Figure 3 The encapsulation component provided in this application embodiment is along Figure 2 A schematic diagram of the cross section in the BB' direction. Figure 4 The encapsulation component provided in this application embodiment is along Figure 2 A schematic diagram of the cross-section along the CC' direction. (Combined with...) Figures 1 to 4 The encapsulation component 100 includes: a first substrate 101, a perovskite functional layer 102, a first encapsulation structure 103, a second encapsulation structure 104, and a second substrate 105.

[0060] The perovskite functional layer 102 is located on one side of the first substrate 101, and its orthographic projection onto the first substrate 101 lies within the first substrate 101. The perovskite functional layer 102 is used to convert optical signals into electrical signals.

[0061] The first packaging structure 103 is located on one side of the first substrate 101. The orthographic projection of the first packaging structure 103 on the first substrate 101 is located inside the first substrate 101, and the orthographic projection of the first packaging structure 103 on the first substrate 101 surrounds the orthographic projection of the perovskite functional layer 102 on the first substrate 101.

[0062] The second packaging structure 104 is at least partially located on the side of the perovskite functional layer 102 away from the first substrate 101. The second substrate 105 is located on the side of the first packaging structure 103 and the second packaging structure 104 away from the first substrate 101. Optionally, the second packaging structure 104 may be located not only on the side of the perovskite functional layer 102 away from the first substrate 101, but also between the first packaging structure 103 and the perovskite functional layer 102.

[0063] Optionally, the first encapsulation structure 103 can be butyl rubber (PIB), and the second encapsulation structure 104 can be a POE film.

[0064] Combination Figures 1 to 4 The first packaging structure 103 includes a main packaging portion 1031 and at least one auxiliary packaging portion 1032. The main packaging portion 1031 and the at least one auxiliary packaging portion 1032 are integrally formed. When the second substrate 105 contacts the first packaging structure 103, a gap will exist between at least a portion of the first packaging structure 103 and the second substrate 105 because the thickness of the main packaging portion 1031 is different from the thickness of the auxiliary packaging portion 1032.

[0065] Optionally, at least a portion of the thinner encapsulation portion in the main encapsulation portion 1031 and the auxiliary encapsulation portion 1032 has a gap between it and the second substrate 105.

[0066] In this embodiment, because the main packaging portion 1031 and the auxiliary packaging portion 1032 of the first packaging structure 103 have different thicknesses, after the second substrate 105 is placed on the first packaging structure 103 and the second packaging structure 104 (i.e., after the substrate lamination process), the second substrate 105 will not prematurely form a sealed structure with the first packaging structure 103 and the first substrate 101 due to its own weight. Instead, a gap can be formed between at least a portion of the second substrate 105 and the first packaging structure 103. Therefore, in the subsequent lamination process, bubbles generated by the second packaging structure 104 can be discharged through the gap, reducing bubble defects. The gap can serve as a channel for bubble discharge.

[0067] Furthermore, by using gaps as channels for bubble removal in this embodiment, it is possible to reduce or eliminate bubbles without extending the heating time in the lamination process, thus avoiding the impact on photoelectric conversion efficiency caused by excessive heating time of the perovskite functional layer 102.

[0068] Optionally, during the lamination process, after the material of the second encapsulation structure 104 is heated and melted, the air bubbles generated by the second encapsulation structure 104 can be evacuated before pressurization. After the air bubbles are removed, pressurization is applied, and the first substrate 101, the second substrate 105, and the first encapsulation structure 103 form a sealed structure, which can significantly reduce the pressurization time and pressure of the laminator.

[0069] In summary, this application provides a perovskite solar cell encapsulation assembly, comprising: a first substrate, a perovskite functional layer, a first encapsulation structure, a second encapsulation structure, and a second substrate. The first encapsulation structure surrounds the perovskite functional layer, and the thickness of the main encapsulation portion of the first encapsulation structure differs from the thickness of the auxiliary encapsulation portion. Therefore, when the second substrate is placed on the side of the first and second encapsulation structures away from the first substrate, it will not prematurely form a sealed structure with the first encapsulation structure and the first substrate due to its own weight. Instead, a gap can be maintained between at least a portion of the second substrate and the first encapsulation structure. Consequently, in subsequent lamination processes, bubbles generated by the second encapsulation structure can be discharged through the gap, reducing bubble defects and improving the yield of the perovskite solar cell.

[0070] Optionally, the area of ​​the main packaging portion 1031 projected onto the first substrate 101 is larger than the area of ​​the auxiliary packaging portion 1032 projected onto the first substrate 101.

[0071] In the embodiments of this application, reference is made to Figure 1 The first encapsulation structure 103 may include a plurality of auxiliary encapsulation portions 1032. The plurality of auxiliary encapsulation portions 1032 are evenly arranged around the perovskite functional layer 102. This allows for a uniform arrangement of bubble discharge channels, thereby improving the efficiency of bubble discharge during the lamination process by ensuring uniform bubble discharge.

[0072] Optionally, when multiple auxiliary encapsulation portions 1032 are evenly arranged around the perovskite functional layer 102, the portion of the first encapsulation structure 103 other than the multiple auxiliary encapsulation portions 1032 is the main encapsulation portion 1031. The main encapsulation portion 1031 can be divided into multiple encapsulation parts 10311 by the multiple auxiliary encapsulation portions 1032. An auxiliary encapsulation portion 1032 is disposed between any two adjacent encapsulation parts 10311, and the multiple encapsulation parts 10311 and the multiple auxiliary encapsulation portions 1032 are connected to form a whole to constitute a surrounding structure around the perovskite functional layer 102.

[0073] refer to Figure 1 The dimension of the first substrate 101 along the first direction X is larger than the dimension of the first substrate 101 along the second direction Y. The first direction X and the second direction Y intersect. Optionally, the first direction X and the second direction Y are perpendicular.

[0074] The plurality of auxiliary packaging portions 1032 include a plurality of first-type auxiliary packaging portions 1032a arranged along a first direction X, and at least one second-type auxiliary packaging portion 1032b arranged along a second direction Y. The number of first-type auxiliary packaging portions 1032a is greater than the number of second-type auxiliary packaging portions 1032b.

[0075] Because the first substrate 101 has a larger size in the first direction X, the number of first-type auxiliary packaging portions 1032a arranged along the first direction X can be designed to be larger, thereby improving the bubble discharge channel in the first direction X. Because the first substrate 101 has a smaller size in the first direction X, the number of second-type auxiliary packaging portions 1032b arranged along the second direction Y can be designed to be smaller.

[0076] Optionally, the first substrate 101 can be rectangular. Correspondingly, the shape of the orthographic projection of the first packaging structure 103 onto the first substrate 101 can also be rectangular. In this case, refer to... Figure 5 The first packaging structure 103 may include two first strip-shaped packaging structures 103a extending along a first direction X, and two second strip-shaped packaging structures 103b extending along a second direction Y. The two first strip-shaped packaging structures 103a are arranged along the second direction Y, and the two second strip-shaped packaging structures 103b are arranged along the first direction X.

[0077] The first type of auxiliary packaging portion 1032a can be a part of the first strip-shaped packaging structure 103a, and the portion of the first strip-shaped packaging structure 103a other than the first type of auxiliary packaging portion 1032a is the main packaging portion 1031. The second type of auxiliary packaging portion 1032b can be a part of the second strip-shaped packaging structure 103b, and the portion of the second strip-shaped packaging structure 103b other than the second type of auxiliary packaging portion 1032b is the main packaging portion 1031.

[0078] Optionally, each of the two first strip-shaped packaging structures 103a may include a first type of auxiliary packaging portion 1032a. For example, multiple first type of auxiliary packaging portions 1032a may constitute two sets of first packaging groups 1032z1 arranged along the second direction Y, each set of first packaging groups 1032z1 including multiple first type of auxiliary packaging portions 1032a arranged along the first direction X. The two sets of first packaging groups 1032z1 correspond to the two first strip-shaped packaging structures 103a. Each of the two first strip-shaped packaging structures 103a includes multiple first type of auxiliary packaging portions 1032a in the corresponding first packaging group 1032z1.

[0079] Each of the two second strip-shaped packaging structures 103b may include a second type of auxiliary packaging portion 1032b. For example, multiple second type of auxiliary packaging portions 1032b may constitute two sets of second packaging groups 1032z2 arranged along a first direction X, each second packaging group 1032z2 including at least one second type of auxiliary packaging portion 1032b arranged along a second direction Y. The two sets of second packaging groups 1032z2 correspond to the two second strip-shaped packaging structures 103b. Each of the two second strip-shaped packaging structures 103b includes multiple second type of auxiliary packaging portions 1032b in the corresponding second packaging group 1032z2.

[0080] Optionally, the two sets of first package groups 1032z1 include the same number of first-type auxiliary package portions 1032a. For example... Figure 1 and Figure 5 Each first package group 1032z1 includes two first-type auxiliary package parts 1032a. The two second package groups 1032z2 include the same number of second-type auxiliary package parts 1032b. For example... Figure 1 and Figure 5 Each second packaging group 1032z2 includes one second type of auxiliary packaging part 1032b. That is, the first packaging structure 103 includes six auxiliary packaging parts 1032.

[0081] Alternatively, the number of first-type auxiliary packaging portions 1032a included in the two first packaging groups 1032z1 may also be different. The number of second-type auxiliary packaging portions 1032b included in the two second packaging groups 1032z2 may also be the same. This application embodiment does not specifically limit whether the number of first-type auxiliary packaging portions 1032a included in the two first packaging groups 1032z1 is the same, nor does it specifically limit whether the number of second-type auxiliary packaging portions 1032b included in the two second packaging groups 1032z2 is the same.

[0082] Optionally, the first type of auxiliary packaging portion 1032a included in the two sets of first packaging groups 1032z1 are symmetrically arranged with respect to the first axis m1. The second type of auxiliary packaging portion 1032b included in the two sets of second packaging groups 1032z2 are symmetrically arranged with respect to the second axis m2. The first axis m1 extends along the first direction X and passes through the center of the first substrate 101, and the second axis m2 extends along the second direction Y and passes through the center of the first substrate 101.

[0083] As an optional implementation, refer to Figure 3The thickness h1 of the main packaging portion 1031 is less than the thickness h2 of the auxiliary packaging portion 1032. In this case, the distance from the surface of the auxiliary packaging portion 1032 away from the first substrate 101 to the first substrate 101 is greater than the distance from the surface of the main packaging portion 1031 away from the first substrate 101 to the first substrate 101.

[0084] Optionally, the difference between the thickness h1 of the main packaging portion 1031 and the thickness h2 of the auxiliary packaging portion 1032 can range from 0.2 mm to 0.4 mm. For example, the difference between the thickness of the main packaging portion 1031 and the thickness of the auxiliary packaging portion 1032 can be 0.3 mm.

[0085] When the second substrate 105 is placed on the side of the first packaging structure 103 away from the first substrate 101, the second substrate 105 will preferentially contact the surface of the auxiliary packaging part 1032 away from the first substrate 101 within a certain range, instead of being completely and tightly bonded to the surface of the first packaging structure 103 away from the first substrate 101 in advance.

[0086] refer to Figure 6 Due to its own gravity, the second substrate 105 may come into contact with a portion of the main package 1031 that is farther from the auxiliary package 1032. Simultaneously, at least a portion of the main package 1031 near the auxiliary package 1032 will have a gap G between it and the second substrate 105. This gap G can form a channel for bubble discharge.

[0087] For example, the portions of the main package 1031 near the two ends of the auxiliary package 1032 arranged along the extension direction of the first package structure 103 (which can be a circumferential direction) have a gap G between them and the second substrate 105. That is, the presence of each auxiliary package 1032 can provide at least two air bubble discharge channels.

[0088] In this embodiment of the application, if the first encapsulation structure 103 is PIB adhesive, during the process of coating PIB adhesive, more PIB adhesive can be coated at some locations to form the auxiliary encapsulation part 1032, and less PIB adhesive can be coated at other locations to form the main encapsulation part 1031.

[0089] As another alternative implementation, refer to Figure 7 The thickness h1 of the main packaging portion 1031 is greater than the thickness h2 of the auxiliary packaging portion 1032. In this case, the distance from the surface of the auxiliary packaging portion 1032 away from the first substrate 101 to the first substrate 101 is less than the distance from the surface of the main packaging portion 1031 away from the first substrate 101 to the first substrate 101. For example, the portion of the auxiliary packaging portion 1032 below the main packaging portion 1031 can be a recess. Figure 7The encapsulation component provided in this application embodiment is along Figure 2 Another cross-sectional diagram in the CC' direction.

[0090] Optionally, the difference between the thickness h1 of the main packaging portion 1031 and the thickness h2 of the auxiliary packaging portion 1032 can range from 0.2 mm to 0.4 mm. For example, the difference between the thickness of the main packaging portion 1031 and the thickness of the auxiliary packaging portion 1032 can be 0.3 mm.

[0091] When the second substrate 105 is placed on the side of the first packaging structure 103 away from the first substrate 101, the second substrate 105 is in contact with at least the surface of the main packaging portion 1031 away from the first substrate 101. Furthermore, the second substrate 105 will not be tightly fitted to the auxiliary packaging portion 1032 at the location of the groove K formed in the auxiliary packaging portion 1032. That is, before the lamination process, the second substrate 105 will not be completely and tightly fitted to the surface of the first packaging structure 103 away from the first substrate 101 to form a sealed structure.

[0092] refer to Figure 8 Due to its own weight, the second substrate 105 may come into contact with a portion of the auxiliary packaging section 1032 that is farther from the main packaging section 1031 (such as the middle of the auxiliary packaging section 1032). Simultaneously, at least a portion of the auxiliary packaging section 1032 near the main packaging section 1031 will have a gap G between it and the second substrate 105. This gap G can form a channel for bubble discharge.

[0093] For example, both ends of the groove K have gaps between them and the second substrate 105. That is, the groove K formed by each auxiliary packaging part 1032 can provide at least two air bubble discharge channels. If the length of the auxiliary packaging part 1032 is small (the length of the auxiliary packaging part 1032 is the length along the extension direction of the first packaging structure 103), the second substrate 105 may not contact the surface of the auxiliary packaging part 1032 away from the first substrate 101 under its own gravity. Therefore, there are gaps between the second substrate 105 and the auxiliary packaging part 1032, which can form a larger exhaust channel.

[0094] In this embodiment of the application, if the first encapsulation structure 103 is PIB adhesive, then during the process of coating PIB adhesive, less PIB adhesive can be coated in some positions to form the auxiliary encapsulation part 1032, and more PIB adhesive can be coated in other positions to form the main encapsulation part 1031.

[0095] Optionally, the length of the auxiliary encapsulation part 1032 can be in the range of 1mm to 3mm, for example, the length of the auxiliary encapsulation part 1032 can be 2mm. Because the length of the auxiliary encapsulation part 1032 is relatively small, it can be ensured that the PIB adhesive of the main encapsulation part 1031 can fill the groove formed by the auxiliary encapsulation part 1032 during the lamination process, ensuring a sealing effect after lamination. Of course, if the length of the auxiliary encapsulation part 1032 is less than 1mm, the groove formed by the auxiliary encapsulation part 1032 will be too small, affecting the expulsion of air bubbles. Therefore, setting the length of the auxiliary encapsulation part 1032 in the range of 1mm to 3mm not only ensures the expulsion of air bubbles but also ensures a sealing effect.

[0096] In this embodiment, the width d2 of the auxiliary packaging portion 1032 may be less than or equal to the width d1 of the main packaging portion 1031. The width d2 of the auxiliary packaging portion 1032 is the length of the auxiliary packaging portion 1032 in the extension direction perpendicular to the first packaging structure 103. The width d1 of the main packaging portion 1031 is the length of the main packaging portion 1031 in the extension direction perpendicular to the first packaging structure 103.

[0097] When the thickness of the auxiliary encapsulation portion 1032 is greater than the thickness of the main encapsulation portion 1031, if the width d2 of the auxiliary encapsulation portion 1032 is greater than the width d1 of the main encapsulation portion 1031, PIB adhesive may overflow into the perovskite functional layer 102 during lamination, potentially affecting the photoelectric conversion efficiency of the perovskite functional layer 102. Therefore, designing the width of the auxiliary encapsulation portion 1032 to be less than or equal to the width of the main encapsulation portion 1031 effectively prevents PIB adhesive from overflowing into the perovskite functional layer 102. (Reference) Figure 2 The width of the auxiliary packaging part 1032 can be equal to the width of the main packaging part 1031.

[0098] If the thickness of the main packaging portion 1031 is greater than the thickness of the auxiliary packaging portion 1032, and the width of the auxiliary packaging portion 1032 is greater than the width of the main packaging portion 1031, then the groove formed by the auxiliary packaging portion 1032 may not be filled during the lamination process, affecting the sealing effect.

[0099] In summary, this application provides a perovskite solar cell encapsulation assembly, comprising: a first substrate, a perovskite functional layer, a first encapsulation structure, a second encapsulation structure, and a second substrate. The first encapsulation structure surrounds the perovskite functional layer, and the thickness of the main encapsulation portion of the first encapsulation structure differs from the thickness of the auxiliary encapsulation portion. Therefore, when the second substrate is placed on the side of the first and second encapsulation structures away from the first substrate, it will not prematurely form a sealed structure with the first encapsulation structure and the first substrate due to its own weight. Instead, a gap can be maintained between at least a portion of the second substrate and the first encapsulation structure. Consequently, in subsequent lamination processes, bubbles generated by the second encapsulation structure can be discharged through the gap, reducing bubble defects and improving the yield of the perovskite solar cell.

[0100] This application also provides a method for encapsulating perovskite solar cells, the method comprising:

[0101] 1. Obtain the packaging components provided in the above embodiments.

[0102] 2. The packaging assembly is heated and pressurized using a laminator, so that the second substrate 105, the first packaging structure 103 and the first substrate 101 in the packaging assembly form a sealed area.

[0103] Optionally, during the lamination process, the material of the second encapsulation structure 104 (e.g., POE film) can be heated using a laminator first. After the material of the second encapsulation structure 104 is heated and melted, bubbles may be generated. Before pressurizing the laminator, the bubbles generated in the second encapsulation structure 104 are evacuated and removed. After the bubbles are removed, the laminator is used to pressurize and form a sealed structure between the first substrate 101, the first encapsulation structure 103, and the second encapsulation structure 104, which can significantly reduce the pressurization time and pressure of the laminator.

[0104] Figure 9 This is a schematic diagram of a perovskite solar cell provided in an embodiment of this application. The perovskite solar cell is obtained by laminating the encapsulation component provided in the above embodiment using a lamination process. (Reference) Figure 9 The perovskite solar cell includes: a first substrate 101, a perovskite functional layer 102, a first encapsulation structure 103, a second encapsulation structure 104, and a second substrate 105.

[0105] The perovskite functional layer 102 is located on one side of the first substrate 101. The orthographic projection of the perovskite functional layer 102 on the first substrate 101 is located within the first substrate 101. The perovskite functional layer 102 is used to convert optical signals into electrical signals.

[0106] The first packaging structure 103 is located on one side of the first substrate 101. The orthographic projection of the first packaging structure 103 on the first substrate 101 is located inside the first substrate 101, and the orthographic projection of the first packaging structure 103 on the first substrate 101 surrounds the orthographic projection of the perovskite functional layer 102 on the first substrate 101.

[0107] The second packaging structure 104 is at least partially located on the side of the perovskite functional layer 102 away from the first substrate 101. The second substrate 105 is located on the side of the first packaging structure 103 and the second packaging structure 104 away from the first substrate 101. Optionally, the second packaging structure 104 may be located not only on the side of the perovskite functional layer 102 away from the first substrate 101, but also between the first packaging structure 103 and the perovskite functional layer 102.

[0108] Optionally, the first encapsulation structure 103 can be butyl rubber (PIB), and the second encapsulation structure 104 can be a POE film.

[0109] In this embodiment, the surface of the first encapsulation structure 103 away from the first substrate 101 is in contact with the second substrate 105, and the surface of the first encapsulation structure 103 close to the first substrate 101 is in contact with the first substrate 101. This allows the first substrate 101, the second substrate 105, and the first encapsulation structure 103 to form a sealed structure to block water and oxygen, ensuring the reliability of the perovskite functional layer 102 located within the sealed structure.

[0110] In this embodiment, the main packaging portion 1031 of the first packaging structure 103 before the lamination process can be used to form the first portion 1031a of the first packaging structure 103 after the lamination process. The auxiliary packaging portion 1032 of the first packaging structure 103 before the lamination process can be used to form the second portion 1032c of the first packaging structure 103 after the lamination process. That is, the first packaging structure may include the first portion 1031a and at least one second portion 1032c. The first portion 1031a and at least one second portion 1032c are an integral structure.

[0111] Since the thickness of the main packaging portion 1031 and the thickness of the auxiliary packaging portion 1032 of the first packaging structure 103 are different before the lamination process, therefore, referring to... Figure 10 After the lamination process, the widths of the first portion 1031a and the second portion 1032c of the first package structure 103 can be different. The width of the first portion 1031a is its length in the extension direction perpendicular to the first package structure 103. The width of the second portion 1032c is its length in the extension direction perpendicular to the first package structure 103.

[0112] Optionally, if the thickness of the main packaging portion 1031 before the lamination process is greater than the thickness of the auxiliary packaging portion 1032, then as follows Figure 10 and Figure 11 As shown, the width d3 of the first portion 1031a after the lamination process can be greater than the width d4 of the second portion 1032c after the lamination process. If the thickness of the main package portion 1031 before the lamination process is less than the thickness of the auxiliary package portion 1032, then as... Figure 12 and Figure 13 As shown, the width d3 of the first part 1031a after the lamination process can be smaller than the width d4 of the second part 1032c after the lamination process.

[0113] Optionally, the junction of the main packaging portion 1031 and the auxiliary packaging portion 1031 can be used to form a transition portion 1033a between the first portion 1031a and the second portion 1032c. The width of the transition portion 1033a can gradually change to connect the first portion 1031a and the second portion 1032c.

[0114] For example, in Figure 11 In the middle, the width of the transition portion 1033a gradually decreases as the distance between it and the first portion 1031a increases, or it can be understood that the width of the transition portion 1033a gradually increases as the distance between it and the second portion 1032a increases.

[0115] exist Figure 13 In the middle, the width of the transition portion 1033a gradually increases as the distance between it and the first portion 1031a increases, or it can be understood that the width of the transition portion 1033a gradually decreases as the distance between it and the second portion 1032c increases.

[0116] In the embodiments of this application, whether the thickness of the main packaging portion 1031 is greater than the thickness of the auxiliary packaging portion 1032, or the thickness of the auxiliary packaging portion 1032 is greater than the thickness of the main packaging portion 1031, the thickness of the main packaging portion 1031 can be determined by increasing or decreasing the thickness of the auxiliary packaging portion 1032 to achieve a difference in thickness between the main packaging portion 1031 and the auxiliary packaging portion 1032.

[0117] Optionally, the thickness of the main packaging portion 1031 can be 0.8 mm, and the thickness of the auxiliary packaging portion 1031 can be in the range of 1 mm to 1.2 mm. That is, the thickness of the auxiliary packaging portion 1032 is greater than the thickness of the main packaging portion 1031. In this case, the difference between the width of the first portion 1031a and the width of the second portion 1032c can be in the range of 1 mm to 2 mm. For example, the width of the first portion 1031a can be approximately 10 mm, and the width of the second portion 1032c can be in the range of 11 mm to 12 mm.

[0118] Alternatively, the thickness of the main packaging portion 1031 can be 0.8 mm, and the thickness of the auxiliary packaging portion 1031 can be in the range of 0.4 mm to 0.6 mm. That is, the thickness of the main packaging portion 1031 is greater than the thickness of the auxiliary packaging portion 1032. In this case, the difference between the width of the first portion 1031a and the width of the second portion 1032c can be in the range of 1 mm to 2 mm. For example, the width of the first portion 1031a can be approximately 10 mm, and the width of the second portion 1032c can be in the range of 8 mm to 9 mm.

[0119] Optional, see reference Figure 14 The perovskite functional layer 102 includes a first electrode layer 1021, a hole transport layer 1022, a perovskite light-absorbing layer 1023, an electron transport layer 1024, and a second electrode layer 1025, which are sequentially stacked in a direction away from the first substrate 101.

[0120] Optionally, the first electrode layer 1021 can be an anode layer, and the second electrode layer 1025 can be a cathode layer.

[0121] When light shines on the perovskite light-absorbing layer 1023, photons are absorbed and electron-hole pairs are formed. These electrons and holes rapidly separate within the perovskite light-absorbing layer 1023; electrons are transported to the cathode layer through the electron transport layer 1024, and holes are transported to the anode layer through the hole transport layer 1022. As electrons and holes accumulate in the anode and cathode layers, an electromotive force is generated. When the perovskite solar cell is connected to an external electrical device, a photocurrent is generated, enabling the perovskite solar cell to power the device.

[0122] In this embodiment, the second encapsulation structure 104 can be a POE film. POE film is a polyolefin elastomer material with excellent mechanical properties such as high elasticity, high strength, and high elongation, as well as good low-temperature performance. POE film also possesses excellent water-blocking properties and resistance to PID (potential-induced degradation), characteristics that make it widely applicable in the field of solar cells.

[0123] The POE film is located between the second substrate 105 and the perovskite functional layer 102. Its main function is to protect the perovskite functional layer 102, so that the perovskite cell is not affected by the external environment during operation, thus extending the service life of the perovskite cell. At the same time, it allows sunlight to pass through the POE film to the perovskite functional layer 102 to the maximum extent, thereby improving the power generation efficiency of the perovskite cell.

[0124] Optionally, the first encapsulation structure 103 can be butyl rubber PIB (polyisobutylene), a novel encapsulation material mainly used to improve the waterproof performance of perovskite batteries.

[0125] As an example, the first encapsulation structure 103 plays a crucial role in the encapsulation of the perovskite solar cell. Because perovskite solar cells are highly sensitive to moisture, moisture intrusion can lead to cell degradation, affecting performance and lifespan. Butyl rubber (PIB) possesses low moisture permeability, high adhesion, and electrical insulation properties, effectively blocking moisture intrusion and protecting the cell's stability and performance.

[0126] Since perovskite solar cells can have essentially the same technical effects as the perovskite solar cell encapsulation components described in the previous embodiments, for the sake of brevity, the technical effects of perovskite solar cells will not be described again here.

[0127] This application also provides a photovoltaic module, which includes one or more perovskite cells as described in the above embodiments. When the photovoltaic module includes multiple perovskite cells, the multiple perovskite cells can be connected in series or in parallel.

[0128] Optionally, the number of perovskite cells included in a photovoltaic module can be determined according to different application scenarios. Photovoltaic modules can convert solar energy into electrical energy, which can then be stored in batteries or used to power loads.

[0129] Since photovoltaic modules can have essentially the same technical effects as the encapsulation components of perovskite cells described in the previous embodiments, for the sake of brevity, the technical effects of photovoltaic modules will not be described again here.

[0130] This application also provides an electrical device, which may include: an electrical appliance and a perovskite battery as provided in the above embodiments. The perovskite battery is connected to the electrical appliance and is used to supply power to the electrical appliance.

[0131] Optionally, the electrical equipment can be common devices including perovskite solar cells. Examples include equipment in the communications, transportation, industrial and agricultural, and lighting sectors. Other examples include satellites, communication equipment, traffic lights, lighthouses, wireless telephone booths, monitoring equipment in oil drilling, power systems, camping lights, electric vehicles, electronic device chargers, and building facades.

[0132] The electrical equipment may include one or more perovskite cells. If the electrical equipment includes multiple perovskite cells, these cells can be connected in series or in parallel.

[0133] Optionally, one or more perovskite cells included in the electrical equipment can constitute a photovoltaic module.

[0134] Since the electrical device can have essentially the same technical effects as the perovskite battery encapsulation components described in the previous embodiments, the technical effects of the electrical device will not be repeated here for the sake of brevity.

[0135] The terminology used in the embodiments section of this application is for explaining the embodiments of this application only and is not intended to limit this application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains.

[0136] The terminology used in the embodiments section of this application is for illustrative purposes only and is not intended to limit the application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar terms used in the patent application specification and claims of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including," and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. The terms "connected," "linked," and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0137] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A package assembly for a perovskite cell, characterized by, The packaging assembly of the perovskite cell comprises: a first substrate; a perovskite functional layer located on one side of the first substrate, a normal projection of the perovskite functional layer on the first substrate being located within the first substrate, the perovskite functional layer being configured to convert a light signal into an electrical signal; a first packaging structure located on one side of the first substrate, a normal projection of the first packaging structure on the first substrate being located within the first substrate, and the normal projection of the first packaging structure on the first substrate surrounding the normal projection of the perovskite functional layer on the first substrate; a second packaging structure at least partially located on a side of the perovskite functional layer away from the first substrate; and a second substrate located on a side of the first packaging structure and the second packaging structure away from the first substrate. The first packaging structure comprises a main packaging portion and at least one auxiliary packaging portion, the main packaging portion and the at least one auxiliary packaging portion being an integral structure, the thickness of the main packaging portion being different from the thickness of the auxiliary packaging portion, and a gap being present between at least part of the first packaging structure and the second substrate.

2. The package assembly of claim 1, wherein, The first packaging structure comprises a plurality of auxiliary packaging portions, the plurality of auxiliary packaging portions being uniformly arranged around the perovskite functional layer.

3. The package assembly of claim 2, wherein, The first substrate has a dimension along a first direction that is greater than a dimension along a second direction, the first direction and the second direction intersecting each other; The plurality of auxiliary packaging portions comprises a plurality of first-type auxiliary packaging portions arranged along the first direction, and a plurality of second-type auxiliary packaging portions arranged along the second direction; The number of the first-type auxiliary packaging portions is greater than the number of the second-type auxiliary packaging portions.

4. The package assembly of claim 3, wherein, The first substrate has a rectangular shape, and a normal projection of the first packaging structure on the first substrate has a rectangular shape; The plurality of first-type auxiliary packaging portions forms two groups of first packaging groups arranged along the second direction, each group of the first packaging groups comprising a plurality of first-type auxiliary packaging portions arranged along the first direction; The plurality of second-type auxiliary packaging portions forms two groups of second packaging groups arranged along the first direction, each group of the second packaging groups comprising at least one second-type auxiliary packaging portion arranged along the second direction.

5. The package assembly of claim 4, wherein, The two groups of the first packaging groups comprise the same number of first-type auxiliary packaging portions, and the two groups of the second packaging groups comprise the same number of second-type auxiliary packaging portions.

6. The package assembly of claim 5, wherein, The first-type auxiliary packaging portions included in the two groups of the first packaging groups are symmetrically arranged relative to a first axis, and the second-type auxiliary packaging portions included in the two groups of the second packaging groups are symmetrically arranged relative to a second axis; The first axis extends along the first direction and passes through the center of the first substrate, and the second axis extends along the second direction and passes through the center of the first substrate.

7. The package assembly of any one of claims 1 to 6, wherein, The width of the auxiliary packaging portion is less than or equal to the width of the main packaging portion. The width of the auxiliary packaging portion is the length of the auxiliary packaging portion in a direction perpendicular to the extension direction of the first packaging structure, and the width of the main packaging portion is the length of the main packaging portion in a direction perpendicular to the extension direction of the first packaging structure.

8. The package assembly of any one of claims 1 to 6, wherein, The thickness of the main packaging portion is less than the thickness of the auxiliary packaging portion, and the difference between the thickness of the main packaging portion and the thickness of the auxiliary packaging portion ranges from 0.2 mm to 0.4 mm.

9. The package assembly of claim 8, wherein, The second substrate contacts at least a surface of the auxiliary packaging portion away from the first substrate. At least part of the main packaging portion close to the auxiliary packaging portion has a gap with the second substrate.

10. The package assembly of any one of claims 1 to 6, wherein, The thickness of the main packaging portion is greater than the thickness of the auxiliary packaging portion, and the difference between the thickness of the main packaging portion and the thickness of the auxiliary packaging portion ranges from 0.2 mm to 0.4 mm.

11. The package assembly of claim 10, wherein, The second substrate contacts at least a surface of the main packaging portion away from the first substrate. At least part of the auxiliary packaging portion close to the main packaging portion has a gap with the second substrate.

12. A perovskite cell, characterized in that, The perovskite battery is obtained by laminating the packaging assembly of any one of claims 1 to 11 using a lamination process, and the perovskite battery comprises: a first substrate; a perovskite functional layer, which is located on one side of the first substrate, and the orthographic projection of the perovskite functional layer on the first substrate is located in the first substrate, and the perovskite functional layer is used to convert a light signal into an electrical signal; a first packaging structure, which is located on one side of the first substrate, and the orthographic projection of the first packaging structure on the first substrate is located in the first substrate, and the orthographic projection of the first packaging structure on the first substrate surrounds the orthographic projection of the perovskite functional layer on the first substrate; the surface of the first packaging structure away from the first substrate contacts the second substrate, and the surface of the first packaging structure close to the first substrate contacts the first substrate; a second packaging structure, which is at least partially located on the side of the perovskite functional layer away from the first substrate; and a second substrate, which is located on the side of the first packaging structure and the second packaging structure away from the first substrate; The first packaging structure comprises a first part and at least one second part, the first part and the at least one second part are an integral structure, the width of the first part and the width of the second part are different, the width of the first part is the length of the first part in a direction perpendicular to the extension direction of the first packaging structure, and the width of the second part is the length of the second part in a direction perpendicular to the extension direction of the first packaging structure.

13. The perovskite cell of claim 12, wherein, The difference between the width of the first part and the width of the second part ranges from 1 mm to 2 mm.

Images