Wafer cleaning nozzle structure

Abstract

The utility model relates to the technical field of wafer processing, and relates to a wafer cleaning nozzle structure. According to the utility model, the discharging mechanism discharges the wafer onto the rotating assembly, the mechanical arm drives the cleaning nozzle to spray and clean the wafer on the rotating assembly, and the rotating assembly drives the wafer product to rotate, so that the relative speed between the water flow and the wafer is relatively high, and a relatively large impact force can be generated; therefore, impurities on the surface of the whale can be further removed, rotary cleaning of the wafer is achieved, and the cleaning effect and the cleaning efficiency are effectively improved. And the detection mechanism performs visual detection on the wafer before and after cleaning, and detects the cleaning effect on the wafer in real time by comparing wafer images before and after cleaning.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and specifically to a wafer cleaning nozzle structure. Background Technology

[0002] Wafer cleaning is a crucial step in semiconductor manufacturing, used to remove contaminants and impurities from the wafer surface. The quality of wafer cleaning directly affects the performance and yield of semiconductor devices. In the wafer cleaning process, the wafer is often fixed in place before cleaning. Due to the special nature of wafers, clamping them can damage the wafer surface; moreover, fixing the wafer in place does not result in good cleaning effectiveness. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a wafer cleaning nozzle structure that enables rotating cleaning of wafers, effectively improves cleaning effect and efficiency, and can detect the cleaning effect of wafers in real time.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0005] A wafer cleaning nozzle structure includes:

[0006] A cleaning mechanism includes a cleaning cylinder and a rotating assembly. The cleaning cylinder has a cleaning chamber inside, and the rotating assembly is disposed on the bottom surface of the cleaning chamber. The rotating assembly is used to drive the wafer product to rotate.

[0007] A feeding mechanism is disposed opposite to the rotating assembly, and the feeding mechanism is used to feed the wafer onto the rotating assembly;

[0008] A cleaning mechanism includes a drive assembly and a cleaning nozzle. The cleaning nozzle is mounted on a robotic arm, which is mounted on a fixed base. The robotic arm is used to drive the cleaning nozzle to spray and clean the wafers on the rotating assembly. The fixed base is driven to the drive assembly, which is used to drive the cleaning nozzle on the robotic arm to adjust the cleaning position.

[0009] An inspection mechanism is located above the cleaning cylinder and is used to perform visual inspection on the wafers before and after cleaning.

[0010] In one embodiment of the present invention, the rotating assembly includes a rotating seat disposed on the bottom surface of the cleaning cylinder, a rotating platform disposed on the rotating seat, a vacuum suction plate disposed on the rotating platform, an adsorption groove disposed on the vacuum suction plate, and the rotating seat is driven and connected to a rotating motor.

[0011] In one embodiment of the present invention, the feeding mechanism includes a feeding cylinder, which is drivenly connected to the feeding rack. The feeding rack is provided with a support plate, and the support plate is provided with a plurality of support seats, which surround to form a support plane for wafer receiving.

[0012] In one embodiment of this utility model, the support plate is provided with a clearance hole, the inner diameter of the clearance hole is larger than the outer diameter of the rotating platform, and multiple support seats are evenly arranged on the edge of the clearance hole. The feeding cylinder drives the support plate to be sleeved on the rotating platform to transfer the wafer on it to the rotating platform.

[0013] In one embodiment of this utility model, the driving component includes a driving frame, on which a first moving module is disposed, the first moving module being drivenly connected to the moving frame, and on which a second moving module is disposed, the second moving module being drivenly connected to a fixed base, the first moving module and the second moving module being arranged perpendicularly.

[0014] In one embodiment of this utility model, a plurality of water outlets are provided on the bottom surface of the cleaning cylinder, the water outlets are connected to water outlet pipes, and a filter screen is provided on the water outlets.

[0015] In one embodiment of the present invention, the cleaning nozzle includes a base and a nozzle, the base being disposed on the movable end of the robotic arm, and the nozzle being detachably connected to the base.

[0016] In one embodiment of this utility model, a tensioner is provided in the middle of the base, and a mounting hole matching the tensioner is provided on the nozzle. Positioning pins and positioning posts are respectively provided on both sides of the base, and pin holes and positioning holes matching the positioning pins and positioning posts are provided on the nozzle.

[0017] In one embodiment of this utility model, a material changing rack is further included. The material changing rack is provided with a plurality of connecting racks, and the connecting rack is provided with a storage groove. A positioning fixture matching the nozzle is provided in the storage groove.

[0018] In one embodiment of this utility model, the detection mechanism includes a detection frame and a mounting base. The detection frame is provided with a hinged seat, and the mounting base is hinged to the hinged seat. A vision camera is provided on the mounting base, and the vision camera is arranged opposite to the cleaning cylinder.

[0019] The beneficial effects of this utility model are:

[0020] The feeding mechanism of this invention feeds the wafers onto a rotating assembly. A robotic arm drives a cleaning nozzle to spray and clean the wafers on the rotating assembly. Simultaneously, the rotating assembly rotates the wafers, creating a high relative velocity between the water flow and the wafers, which generates a significant impact force. This further removes impurities from the wafer surface, achieving rotary cleaning of the wafers and effectively improving the cleaning effect and efficiency. The inspection mechanism performs visual inspection of the wafers before and after cleaning, comparing the images before and after cleaning to detect the cleaning effect of the wafers in real time. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a wafer cleaning nozzle structure according to the present invention.

[0022] Figure 2 This is a schematic diagram of the base of this utility model.

[0023] Figure 3 This is a schematic diagram of the nozzle of this utility model.

[0024] Figure 4 This is a schematic diagram of the material changing rack of this utility model.

[0025] The following are the labeling instructions in the diagram: 1. Cleaning cylinder; 11. Water outlet; 2. Feeding mechanism; 21. Feeding cylinder; 22. Feeding rack; 23. Support plate; 24. Support base; 25. Clearance hole; 3. Rotating platform; 31. Rotating seat; 32. Vacuum suction plate; 33. Rotating motor; 4. Detection mechanism; 41. Detection frame; 42. Hinge seat; 43. Mounting seat; 44. Vision camera; 5. Drive assembly; 51. Drive frame; 52. First moving module; 53. Moving frame; 54. Second moving module; 55. Fixed seat; 56. Robotic arm; 7. Cleaning nozzle; 71. Base; 72. Tensioner; 73. Positioning pin; 74. Positioning column; 75. Nozzle; 76. Mounting hole; 77. Positioning hole; 78. Pin hole; 79. Water outlet nozzle; 8. Material changing rack; 81. Connecting frame; 82. Storage trough; 83. Positioning fixture. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0027] Reference Figure 1-4 As shown, a wafer cleaning nozzle structure includes:

[0028] A cleaning mechanism includes a cleaning cylinder 1 and a rotating assembly. The cleaning cylinder 1 is provided with a cleaning chamber, and the rotating assembly is disposed on the bottom surface of the cleaning chamber. The rotating assembly is used to drive the wafer product to rotate.

[0029] The feeding mechanism 2 is disposed opposite to the rotating component, and the feeding mechanism 2 is used to feed the wafer onto the rotating component;

[0030] The cleaning mechanism includes a drive assembly 5 and a cleaning nozzle 7. The cleaning nozzle 7 is mounted on a robotic arm 56, which is mounted on a fixed base 55. The robotic arm 56 is used to drive the cleaning nozzle 7 to spray and clean the wafers on the rotating assembly. The fixed base 55 is driven to the drive assembly 5. The drive assembly 5 is used to drive the cleaning nozzle 7 on the robotic arm 56 to adjust the cleaning position.

[0031] Inspection mechanism 4 is located above the cleaning cylinder 1 and is used to perform visual inspection on the wafers before and after cleaning.

[0032] The feeding mechanism 2 of this invention feeds the wafer onto the rotating assembly. The robotic arm 56 drives the cleaning nozzle 7 to spray and clean the wafer on the rotating assembly. At the same time, the rotating assembly drives the wafer to rotate, so that there is a high relative speed between the water flow and the wafer, which generates a large impact force, thereby further removing impurities from the surface of the wafer and realizing the rotational cleaning of the wafer, effectively improving the cleaning effect and cleaning efficiency. The detection mechanism 4 performs visual inspection on the wafer before and after cleaning, and detects the cleaning effect of the wafer in real time by comparing the wafer images before and after cleaning.

[0033] In one embodiment of the present invention, the rotating assembly includes a rotating seat 31, which is disposed on the bottom surface of the cleaning cylinder 1. A rotating platform 3 is disposed on the rotating seat 31, and a vacuum suction plate 32 is disposed on the rotating platform 3. An adsorption groove is disposed on the vacuum suction plate 32. The rotating seat 31 is driven and connected to a rotating motor 33.

[0034] Specifically, the vacuum suction plate 32 on the rotating platform 3 is connected to the vacuum generator, which generates negative pressure in the adsorption tank to adsorb and fix the wafer. The rotating seat 31 is connected to the rotating motor 33 for driving. Under the drive of the rotating motor 33, the wafer on the rotating platform 3 rotates, realizing the rotation cleaning of the wafer and further improving the cleaning effect.

[0035] In one embodiment of the present invention, the feeding mechanism 2 includes a feeding cylinder 21, which is drivenly connected to the feeding rack 22. The feeding rack 22 is provided with a support plate 23, and the support plate 23 is provided with a plurality of support seats 24, which surround to form a support plane for wafer receiving.

[0036] In one embodiment of the present invention, the support plate 23 is provided with a clearance hole 25, the inner diameter of the clearance hole 25 is larger than the outer diameter of the rotating platform 3, and a plurality of support seats 24 are evenly arranged on the edge of the clearance hole 25. The feeding cylinder 21 drives the support plate 23 to be sleeved on the rotating platform 3 to transfer the wafer on it to the rotating platform 3.

[0037] Specifically, the feeding cylinder 21 drives the wafer on the support plate 23 to move toward the rotating platform 3. Since the inner diameter of the clearance hole 25 on the support plate 23 is larger than the outer diameter of the rotating platform 3, the support plate 23 is sleeved on the rotating platform 3, and the wafer on the support plate 23 is transferred to the rotating platform 3.

[0038] In one embodiment of the present invention, the driving component 5 includes a driving frame 51, on which a first moving module 52 is disposed, the first moving module 52 being drivenly connected to a moving frame 53, and on which a second moving module 54 is disposed, the second moving module 54 being drivenly connected to a fixed base 55, and the first moving module 52 and the second moving module 54 being arranged perpendicularly.

[0039] Specifically, the first moving module 52 and the second moving module 54 are vertically arranged to form a two-axis motion module, which can drive the robotic arm 56 and the cleaning nozzle 75 to perform positional movements. The movement is highly accurate and can quickly change the spraying posture of the cleaning nozzle 75 on the wafer, thereby improving the cleaning quality.

[0040] In one embodiment of this utility model, a plurality of water outlets 11 are provided on the bottom surface of the cleaning cylinder 1. The water outlets 11 are connected to the water outlet pipes. A filter screen is provided on the water outlets 11 to quickly discharge the cleaning liquid and avoid the accumulation of cleaning liquid causing liquid splashing and affecting the wafer cleaning effect.

[0041] In one embodiment of the present invention, the cleaning nozzle 7 includes a base 71 and a nozzle 75. The nozzle 75 is provided with a plurality of water outlet nozzles 79. The base 71 is disposed on the moving end of the robotic arm 56. The nozzle 75 is detachably connected to the base 71, and a suitable nozzle 75 can be replaced without stopping the machine, thereby improving processing efficiency and ensuring the cleaning effect on the wafer.

[0042] In one embodiment of the present invention, a tensioner 72 is provided in the middle of the base 71, and a mounting hole 76 matching the tensioner 72 is provided on the nozzle 75. A positioning pin 73 and a positioning post 74 are respectively provided on both sides of the base 71, and a pin hole 78 and a positioning hole 77 matching the positioning pin 73 and the positioning post 74 are provided on the nozzle 75.

[0043] Specifically, the two-axis motion module drives the robotic arm 56 and the base 71 to the material changing rack 8. The appropriate nozzle 75 is selected according to the specifications of the wafer. The tensioner 72 on the base 71 is inserted into the mounting hole 76 and tightened, so that the base 71 and the nozzle 75 are connected. At the same time, the positioning pin 73 and the positioning post 74 on the base 71 are inserted into the corresponding pin hole 78 and positioning hole 77, completing the rapid assembly of the nozzle 75 and the base 71.

[0044] In one embodiment of the present invention, a material changing rack 8 is further included. The material changing rack 8 is provided with a plurality of connecting racks 81. The connecting racks 81 are provided with a storage groove 82. The storage groove 82 is provided with a positioning fixture 83 that matches the nozzle 75.

[0045] Specifically, the material changing rack 8 is equipped with multiple connecting racks 81, which can hold multiple nozzles 75. The appropriate nozzle 75 can be selected according to the specifications of the wafer, and the appropriate nozzle 75 can be changed without stopping the machine, thereby improving processing efficiency and ensuring the cleaning effect on the wafer.

[0046] In one embodiment of the present invention, the detection mechanism 4 includes a detection frame 41 and a mounting base 43. The detection frame 41 is provided with a hinged seat 42, and the mounting base 43 is hinged to the hinged seat 42. A vision camera 44 is provided on the mounting base 43, and the vision camera 44 is disposed opposite to the cleaning cylinder 1.

[0047] Specifically, the vision camera 44 is positioned opposite to the cleaning cylinder 1. The vision camera 44 can perform visual inspection on the wafer before and after cleaning, and ensure the cleaning effect of the wafer by comparing the wafer images before and after cleaning.

[0048] Usage process

[0049] The wafer is placed on a support plane formed by multiple support bases 24. The feeding cylinder 21 drives the wafer on the support plate 23 to move towards the rotating platform 3. Since the inner diameter of the clearance hole 25 on the support plate 23 is larger than the outer diameter of the rotating platform 3, the support plate 23 is fitted onto the rotating platform 3, and the wafer on the support plate 23 is transferred to the rotating platform 3. The vacuum suction plate 32 on the rotating platform 3 is connected to a vacuum generator, so that the suction tank generates negative pressure to adsorb and fix the wafer. The rotating base 31 is driven by the rotating motor 33, which drives the wafer on the rotating platform 3 to rotate. The first moving module 52 and the second moving module 53 are connected to the rotating platform 3. Module 54 is vertically arranged to form a two-axis motion module, which drives the robotic arm 56 and the base 71 to move to the material changing rack 8. According to the specifications of the wafer, the appropriate nozzle 75 is selected. The tensioner 72 on the base 71 is inserted into the mounting hole 76 and tightened, so that the base 71 and the nozzle 75 are connected. At the same time, the positioning pin 73 and the positioning post 74 on the base 71 are inserted into the corresponding pin hole 78 and positioning hole 77, completing the rapid assembly of the nozzle 75 and the base 71. The two-axis motion module drives the cleaning nozzle 7 to move above the cleaning cylinder 1. The cleaning robotic arm 56 is used to drive the cleaning nozzle 7 to spray and clean the wafer on the rotating assembly, thereby completing the comprehensive spray cleaning of the wafer and improving the cleaning effect.

[0050] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A wafer cleaning nozzle structure, characterized in that, The utility model relates to a wafer cleaning device, including: a cleaning mechanism including a cleaning cylinder and a rotating assembly, the cleaning cylinder is provided with a cleaning cavity, the rotating assembly is arranged on the bottom surface of the cleaning cavity, and the rotating assembly is used to drive the wafer product to rotate; a feeding mechanism is arranged opposite to the rotating assembly, and the feeding mechanism is used to feed the wafer to the rotating assembly; a cleaning mechanism including a driving assembly and a cleaning nozzle, the cleaning nozzle is arranged on the mechanical arm, the mechanical arm is arranged on the fixed seat, the mechanical arm is used to drive the cleaning nozzle to spray and clean the wafer on the rotating assembly, the fixed seat is drivenly connected with the driving assembly, and the driving assembly is used to drive the cleaning nozzle on the mechanical arm to adjust the cleaning posture; a detection mechanism is arranged above the cleaning cylinder, and the detection mechanism is used to visually detect the wafer before and after cleaning.

2. The wafer cleaning showerhead structure of claim 1, wherein, The rotating assembly includes a rotating seat, the rotating seat is arranged on the bottom surface of the cleaning cylinder, the rotating platform is arranged on the rotating seat, the vacuum suction plate is arranged on the rotating platform, the suction groove is arranged on the vacuum suction plate, and the rotating seat is drivenly connected with a rotating motor.

3. The wafer cleaning showerhead structure of claim 2, wherein, The feeding mechanism includes a feeding cylinder, the feeding cylinder is drivenly connected with a feeding frame, the supporting plate is arranged on the feeding frame, a plurality of supporting seats are arranged on the supporting plate, and the plurality of supporting seats surround to form a supporting plane for receiving the wafer.

4. The wafer cleaning showerhead structure of claim 3, wherein, The supporting plate is provided with a avoiding hole, the inner diameter of the avoiding hole is greater than the outer diameter of the rotating platform, a plurality of supporting seats are evenly arranged on the edge of the avoiding hole, and the feeding cylinder drives the supporting plate to be sleeved on the rotating platform to transfer the wafer on the rotating platform to the rotating platform.

5. The wafer cleaning showerhead structure of claim 1, wherein, The driving assembly includes a driving frame, the first moving module is arranged on the driving frame, the first moving module is drivenly connected with a moving frame, the second moving module is arranged on the moving frame, the second moving module is drivenly connected with the fixed seat, and the first moving module and the second moving module are arranged vertically.

6. The wafer cleaning showerhead structure of claim 1, wherein, A plurality of water outlets are arranged on the bottom surface of the cleaning cylinder, the water outlets are connected with water outlets, and the water outlets are provided with filter screens.

7. The wafer cleaning showerhead structure of claim 1, wherein, The cleaning nozzle includes a base and a nozzle, the base is arranged on the moving end of the mechanical arm, and the nozzle is detachably connected with the base.

8. The wafer cleaning showerhead structure of claim 7, wherein, The middle part of the base is provided with a tensioner, the nozzle is provided with a mounting hole matched with the tensioner, the two sides of the base are respectively provided with a positioning pin and a positioning column, and the nozzle is provided with a pin hole and a positioning hole matched with the positioning pin and the positioning column.

9. The wafer cleaning showerhead structure of claim 7, wherein, The detection mechanism includes a detection frame and a mounting seat, the hinged seat is arranged on the detection frame, the mounting seat is hinged with the hinged seat, the visual camera is arranged on the mounting seat, and the visual camera is arranged opposite to the cleaning cylinder.

10. The wafer cleaning showerhead structure of claim 1, wherein, ​

Images