Easy-to-adjust silicon wafer water jet slicing structure of wafer inserting machine

Abstract

The utility model provides a wafer inserting machine silicon wafer water jet slicing structure convenient to adjust, which comprises a rack, a silicon wafer conveying mechanism and a water jet mounting device, a water tank is arranged on the rack, and the silicon wafer conveying mechanism and the water jet mounting device are mounted in the water tank; the front end of the silicon wafer conveying mechanism is in butt joint with a guide supporting frame connected to the inner walls of the two sides of the water tank. The water jet cutter mounting device is mounted on the rear side of the guide supporting frame and comprises a water jet cutter fixing block, a guide rod, a U-shaped connecting frame, a lead screw and a motor. The two ends of the water jet cutter fixing block are installed on the two guide rods in a sliding mode respectively, and the multiple water jet cutter nozzles are evenly installed on the water jet cutter fixing block. The two ends of the connecting frame are connected to the top and the bottom of the water jet cutter fixing block respectively. According to the utility model, the water jet nozzle capable of moving up and down is used for carrying out water flow impact fragmentation on the silicon wafers, so that the water flow of the water jet uniformly impacts the end parts of the silicon wafers, and water quickly and uniformly enters gaps among the silicon wafers, thereby separating the silicon wafers and improving the fragmentation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, specifically to a water jet wafer slicing structure for an easily adjustable wafer inserter. Background Technology

[0002] The wafer insertion machine is mainly used for automatic wafer insertion of silicon wafer 6. Before inserting silicon wafer 6, a water jet device is needed to clean and slit the silicon wafer 6. With the development of thinner wafers, the thickness of silicon wafer 6 is getting thinner and thinner. The thinner wafers place higher and higher requirements on the water jet slitting of the wafer insertion machine. At present, the slitting water jet is fixed. When the water jet is slit, it sprays at a fixed position on the side wall of the silicon wafer 6, which reduces the efficiency of silicon wafer 6 slitting, thereby reducing the efficiency of the entire silicon wafer 6 production. Utility Model Content

[0003] In order to overcome the problems existing in the background technology, this utility model provides a silicon wafer 6 water jet slicing structure for a wafer inserter, so as to solve the technical problem mentioned in the background technology that the current slicing water jet is fixed and the water jet is aimed at a fixed position on the side wall of the silicon wafer 6 during slicing, which reduces the efficiency of silicon wafer 6 slicing.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0005] An easily adjustable silicon wafer waterjet slicing structure for a wafer insertion machine includes a frame 1, a silicon wafer conveying mechanism 2, and a waterjet mounting device 3. A water tank 11 is mounted on the frame 1, and the silicon wafer conveying mechanism 2 and the waterjet mounting device 3 are installed in the water tank 11. The front end of the silicon wafer conveying mechanism 2 is connected to a guide support frame 4 that is attached to the inner walls of both sides of the water tank 11. The waterjet mounting device 3 is installed on the rear side of the guide support frame 4 and includes a waterjet fixing block 31, a guide rod 32, a U-shaped connecting frame 33, a lead screw 34, and a motor 35. Two guide rods 32 are vertically installed in the water tank 11. The two ends of the water jet fixing block 31 are slidably installed on the two guide rods 32 respectively. Multiple water jet nozzles 36 are evenly installed on the water jet fixing block 31. The two ends of the connecting frame 33 are respectively connected to the top and bottom of the water jet fixing block 31. The two ends of the lead screw 34 are respectively rotatably connected to the bottom of the water tank 11 and the upper end of the wall of the water tank 11. The connecting frame 33 is threadedly connected to the lead screw 34. The motor 35 is installed on the outer wall of the frame 1 and is connected to the upper end of the lead screw 34 for transmission.

[0006] Preferably, the silicon wafer conveying mechanism 2 includes a bottom conveyor belt 21 installed at the bottom of the water tank 11 and supporting the bottom of the silicon wafer 6, and a side conveyor belt 22 installed on the side wall of the water tank 11 and supporting both ends of the silicon wafer 6.

[0007] Preferably, the guide support frame 4 includes an L-shaped support plate 41 and a baffle 42. The baffle 42 is above the support plate 41. The support plate 41 is supported at the bottom of both ends of the silicon wafer 6, and the baffle 42 is blocked at both ends of the silicon wafer 6.

[0008] Preferably, a pressure gauge 5 capable of detecting water pressure is connected to the water pipe to which the water jet nozzle 36 is connected.

[0009] The beneficial effects of this utility model are as follows: This utility model uses a water jet nozzle that can move up and down to impact and separate silicon wafers with water flow, so that the water flow from the water jet impacts the ends of the silicon wafers evenly, allowing water to quickly and evenly enter the gaps between the silicon wafers, thereby separating the silicon wafers. This replaces the existing fixed water jet which can only impact one position at the end of the silicon wafer, making the silicon wafer separation slower. This utility model improves the separation efficiency. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0011] Figure 2 This is a schematic diagram of the structure of the water jet mounting device.

[0012] Figure 3 This is a schematic diagram of the silicon wafer transport mechanism. Detailed Implementation

[0013] To make the objectives, technical solutions, and beneficial effects of this utility model clearer, the preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings, so as to facilitate the understanding of those skilled in the art.

[0014] like Figure 1-3As shown, this utility model provides an easily adjustable silicon wafer waterjet slicing structure for a wafer insertion machine, including a frame 1, a silicon wafer conveying mechanism 2, and a waterjet mounting device 3. A water tank 11 is provided on the frame 1, and the silicon wafer conveying mechanism 2 and the waterjet mounting device 3 are installed in the water tank 11. The front end of the silicon wafer conveying mechanism 2 is connected to a guide support frame 4 that is attached to the inner walls of both sides of the water tank 11. The waterjet mounting device 3 is installed on the rear side of the guide support frame 4 and includes a waterjet fixing block 31, a guide rod 32, a U-shaped connecting frame 33, and a lead screw 34. The motor 35; two guide rods 32 are vertically installed in the water tank 11, and the two ends of the water jet fixing block 31 are slidably installed on the two guide rods 32 respectively. Multiple water jet nozzles 36 are evenly installed on the water jet fixing block 31; the two ends of the connecting frame 33 are respectively connected to the top and bottom of the water jet fixing block 31; the two ends of the lead screw 34 are respectively rotatably connected to the bottom of the water tank 11 and the upper end of the wall of the water tank 11, and the connecting frame 33 is threadedly connected to the lead screw 34; the motor 35 is installed on the outer wall of the frame 1 and is connected to the upper end of the lead screw 34 for transmission. The silicon wafers 6 that are stuck together are placed on the silicon wafer conveying mechanism 2 and conveyed forward. The silicon wafers 6 at the front end are conveyed to the guide support frame 4 and conveyed forward. They are separated by water jet cutting, so that the wafer suction and feeding device (not shown in the existing device diagram) can sequentially suck up and convey the separated silicon wafers 6 forward. The motor 35 drives the lead screw 34 to rotate. Since the water jet fixing block 31 is threadedly connected to the lead screw 34 through the connecting frame 33, the water jet fixing block 31 is driven to move up and down along the guide rod 32, thereby driving the water jet nozzle 36 to move up and down, and uniformly impacting the silicon wafers 6 with water flow to separate them. By setting the forward and reverse rotation of the motor 35, the water jet nozzle 36 moves up and down to move back and forth, so that the water flow of the water jet impacts the end of the silicon wafer 6 evenly, so that the water quickly and evenly enters the gap between the silicon wafers 6, thereby separating the silicon wafers 6. This invention replaces the existing fixed water jet which can only impact one position at the end of the silicon wafer 6, making the silicon wafer 6 separate slowly. This utility model improves the efficiency of wafer separation.

[0015] The silicon wafer conveying mechanism 2 includes a bottom conveyor belt 21 installed at the bottom of the water tank 11 and supporting the bottom of the silicon wafer 6, and side conveyor belts 22 installed on the side wall of the water tank 11 and supporting both ends of the silicon wafer 6. The silicon wafer 6 is driven to move forward by the bottom conveyor belt 21 and the side conveyor belts 22.

[0016] The guide support frame 4 includes an L-shaped support plate 41 and baffles 42. The baffles 42 are located above the support plate 41. The support plate 41 supports the bottom of both ends of the silicon wafer 6, and the baffles 42 block both ends of the silicon wafer 6. Because the front end of the bottom conveyor belt 21 has an arc structure, the silicon wafer 6 falls downwards. When the silicon wafer 6 moves to the front end of the conveying mechanism, both ends are supported on the support plate 41. Under the limitation of the baffles 42 on both sides, it moves forward and is separated by the water jet, which facilitates the wafer suction and feeding device to sequentially suck up the separated silicon wafers 6 and convey them forward.

[0017] The water pipe connected to the water jet nozzle 36 is equipped with a pressure gauge 5 that can detect water pressure. The pressure gauge 5 can detect the water pressure of the water jet in real time, which facilitates the adjustment of the water pressure stability. The water pressure can be precisely adjusted according to the thickness of the silicon wafer 6 to ensure smooth separation of the silicon wafer 6. By constantly detecting the water pressure, blockages in the water jet can be detected in time.

[0018] Work process:

[0019] The adhered silicon wafers 6 are placed on the silicon wafer conveying mechanism 2 and conveyed forward. The front silicon wafers 6 are conveyed to the guide support frame 4 and conveyed forward, and separated by water jet cutting. This facilitates the wafer suction and feeding device (not shown in the existing device diagram) to sequentially suction and convey the separated silicon wafers 6 forward. The motor 35 drives the lead screw 34 to rotate. Since the water jet fixing block 31 is threadedly connected to the lead screw 34 through the connecting frame 33, the water jet fixing block 31 is driven to move up and down along the guide rod 32, thereby driving the water jet nozzle 36 to move up and down, uniformly impacting and separating the silicon wafers 6 with water flow. By setting the motor 35... The forward and reverse rotation enables the water jet nozzle 36 to move up and down reciprocally, allowing the water jet to evenly impact the end of the silicon wafer 6. This allows the water to quickly and evenly enter the gaps between the silicon wafers 6, thus separating them. This replaces the existing fixed water jet which can only impact one position at the end of the silicon wafer 6, resulting in slower wafer separation. This invention improves the separation efficiency. The pressure gauge 5 can detect the water pressure of the water jet in real time, making it easy to adjust the water pressure to maintain stability. The water pressure can be precisely adjusted according to the thickness of the silicon wafer 6, ensuring smooth separation. By constantly monitoring the water pressure, blockages in the water jet can be detected in time.

[0020] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although the utility model has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to it in form and detail without departing from the scope defined by the claims of this utility model.

Claims

1. A water jet wafer slitting structure for an easily adjustable wafer inserter, characterized in that: The utility model relates to a silicon wafer cutting device, including frame (1), silicon wafer conveying mechanism (2), water jet installation device (3), be provided with water tank (11) on frame (1), silicon wafer conveying mechanism (2) and water jet installation device (3) are installed in water tank (11), the front end of silicon wafer conveying mechanism (2) is butt joint and is connected on the guide support frame (4) of the inner wall of water tank (11) both sides, water jet installation device (3) is installed in the rear side of guide support frame (4), including water jet fixed block (31), guide rod (32), the connection frame (33) of U shape, lead screw (34), motor (35), two guide rod (32) vertical installation is in water tank (11), and the both ends of water jet fixed block (31) are slidably installed on two guide rods (32), and multiple water jet nozzles (36) are evenly installed on water jet fixed block (31), the both ends of connection frame (33) are connected in the top and bottom of water jet fixed block (31) respectively, the both ends of lead screw (34) are rotatably connected in the bottom of water tank (11) and the wall upper end of water tank (11), and connection frame (33) is screw -threaded connection in lead screw (34), and motor (35) is installed in the outer wall of frame (1) and is transmission connection with the upper end of lead screw (34).

2. The water jet dicing structure of claim 1, wherein: The silicon wafer conveying mechanism (2) includes a bottom conveying belt (21) installed at the bottom of the water tank (11) and supporting the bottom of the silicon wafer (6), and a side conveying belt (22) installed on the side wall of the water tank (11) and supporting the two ends of the silicon wafer (6).

3. The water jet dicing structure of claim 1 or 2, wherein: The guide support frame (4) includes an L-shaped support plate (41) and a baffle (42), the baffle (42) is located above the support plate (41), the support plate (41) supports the bottom of the two ends of the silicon wafer (6), and the baffle (42) blocks the two ends of the silicon wafer (6).

4. The water jet slicer wafer slicing structure of claim 3, wherein: A pressure gauge (5) capable of detecting water pressure is connected to the water pipe connected to the water jet nozzle (36).

Images