Wafer clamping and cleaning equipment

Abstract

The utility model relates to the technical field of wafer cleaning and processing, and discloses wafer clamping and cleaning equipment which comprises a cleaning box, a cleaning disc is rotatably connected to the interior of the cleaning box, and lead screws arranged at equal intervals are rotatably connected to the interior of the cleaning disc. According to the wafer clamping and cleaning equipment, when a first bevel gear rotates, a lead screw is driven to rotate under the action of a second bevel gear, a threaded pipe is promoted to drive a connecting plate and a clamping jaw to synchronously retract and release, and then a wafer is positioned and reinforced in the wafer cleaning process; the high-pressure gas or the high-pressure water column with the large impact force is prevented from falling off and damaging the wafer, the stability of the wafer in the cleaning operation process is improved, and the normal proceeding of the cleaning operation is guaranteed, the cleaning disc is driven to rotate under the action of the outer gear ring when the stud gear rotates, and the cleaning efficiency is improved. The wafer can rotate slowly in the cleaning process, so that the uniformity and comprehensiveness of wafer cleaning are ensured, and the cleaning quality is guaranteed.

Description

Technical Field

[0001] This application relates to the field of wafer cleaning and processing technology, specifically to a wafer clamping and cleaning device. Background Technology

[0002] In current semiconductor manufacturing, cylindrical single-crystal silicon is often cut into multiple wafers from a circular cross-section. The wafers are then cut and polished at the edges to remove burrs, allowing them to be diced and separated into multiple wafer particles. These particles are then processed through electroplating and other procedures to become a semiconductor chip.

[0003] After wafers are cut and polished, many silicon crystal debris are often left on them. Currently, high-pressure gas and high-pressure water jets are commonly used to clean the cut wafers. However, high-pressure gas or high-pressure water jets have a large impact on the wafers, and there is a risk that the wafers may fall off the cleaning tray. Therefore, it is necessary to position and reinforce the wafers during cleaning to improve their stability. Utility Model Content

[0004] To address the shortcomings of existing technologies, this application provides a wafer clamping and cleaning device that can position and reinforce wafers during the wafer cleaning process, preventing wafers from falling due to the impact of high-pressure gas or water jets, thus avoiding wafer damage. This improves the stability of the wafer cleaning process and ensures the normal operation of the cleaning process. It solves the problem that the high impact of high-pressure gas or water jets on wafers during wafer cleaning poses a risk of wafers falling off the cleaning tray.

[0005] To achieve the above objectives, this application provides the following technical solution: a wafer clamping and cleaning device, comprising a cleaning tank, a cleaning disc rotatably connected inside the cleaning tank, and equally spaced lead screws rotatably connected inside the cleaning disc. Each lead screw has a threaded tube threaded to its outer circumferential surface, and a connecting plate is fixedly connected to the outer circumferential surface of each threaded tube. A gripper is fixedly connected to the end of the connecting plate away from the threaded tube. A first motor is provided inside the cleaning disc, and a first bevel gear is fixedly connected to the output end of the first motor. A second bevel gear is fixedly connected to the end of each lead screw away from the threaded tube, and the second bevel gear meshes with the first bevel gear. A second motor is provided inside the cleaning tank, and a spur gear is fixedly connected to the output end of the second motor. An external gear ring is fixedly sleeved on the outer circumferential surface of the cleaning disc, and the external gear ring meshes with the spur gear. A cleaning tube is fixedly inserted inside the cleaning tank, and equally spaced nozzles are provided at the bottom of the cleaning tube.

[0006] The above solution addresses the risk of wafers falling off the cleaning tray due to the significant impact of high-pressure gas or water jets during wafer cleaning. The rotation of the first bevel gear, coupled with the action of the second bevel gear, drives the lead screw, causing the threaded tube to synchronously move the connecting plate and grippers. This position and reinforces the wafers during cleaning, preventing damage from the impact of high-pressure gas or water jets, thus improving the stability of the wafer cleaning process and ensuring its proper operation.

[0007] Furthermore, a limiting ring is fixedly sleeved on the outer circumferential surface of each lead screw, and the limiting ring is rotatably connected to the inside of the cleaning disc.

[0008] The above method restricts the lead screw, enhancing its stability during rotation inside the cleaning disc and preventing it from shifting or shaking at high speeds.

[0009] Furthermore, each of the threaded tubes has a limiting block fixedly connected to its outer circumferential surface, and the outer surface of the limiting block is slidably connected to the cleaning disc through a slot opened inside the cleaning disc.

[0010] The above scheme restricts the threaded tube, preventing it from rotating with the lead screw and ensuring that the threaded tube always moves laterally, thereby driving the connecting plate and the gripper to move and retract.

[0011] Furthermore, each of the grippers has an arc-shaped structure, and a soft pad is fixedly connected to the inner wall of each gripper.

[0012] Through the above scheme, the arc-shaped gripper can be adapted to the circular wafer, improving the stability of the wafer clamping and fixing. The soft pad can play a certain buffering role, avoiding damage to the wafer during the gripper clamping and positioning process. At the same time, it can also increase the frictional resistance between the gripper and the wafer, thereby optimizing the positioning effect of the gripper.

[0013] Furthermore, a limiting protrusion is fixedly sleeved at the bottom of the cleaning tray, and the outer circumferential surface of the limiting protrusion is rotatably connected to the cleaning box through an annular groove opened inside the cleaning box.

[0014] The above method restricts the cleaning disc, preventing it from easily detaching from the cleaning tank and improving the stability of its movement.

[0015] Furthermore, the cleaning tank has two drainage holes inside, and a bracket is fixedly connected to the bottom of the cleaning tank, with a water storage tank inside the bracket.

[0016] The above solution allows the liquid generated during the cleaning process to flow into the water storage tank below through the drain hole for storage, facilitating subsequent processing. The bracket provides stable support for the cleaning tank.

[0017] Furthermore, the front of the cleaning box is hinged with a door, and the inside of the door is provided with an observation window.

[0018] The above design allows operators to easily open and close the cleaning chamber, place and remove wafers, and observe the rotation of the cleaning tray and the cleaning status of the wafers without opening the chamber door.

[0019] Furthermore, a placement platform is fixedly connected to the upper surface of the cleaning tray, and the bottom surface of the gripper contacts the upper surface of the cleaning tray.

[0020] The above solution facilitates the placement of wafers on the placement platform, while also raising the wafers to a certain height to make it easier for the grippers to hold and position them.

[0021] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0022] This wafer clamping and cleaning equipment utilizes a first bevel gear that, when rotated, drives a lead screw to rotate under the action of a second bevel gear. This causes the threaded tube to synchronously move the connecting plate and grippers, thus positioning and securing the wafers during the cleaning process. This prevents the wafers from falling due to the impact of high-pressure gas or water jets, which could damage them and improve the stability of the wafer cleaning operation. Furthermore, the rotation of the spur gear, under the action of the external gear ring, drives the cleaning disc to rotate, ensuring a slow and thorough cleaning process and guaranteeing the uniformity and quality of the wafer cleaning. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the entire application;

[0024] Figure 2 This is a structural diagram of the cleaning box in this application;

[0025] Figure 3 This is a partial cross-sectional side view of the structure of this application;

[0026] Figure 4 This is a structural diagram of the cleaning disc in this application;

[0027] Figure 5 This is a diagram of the lead screw structure of this application.

[0028] In the picture:

[0029] 1. Cleaning tank; 2. Cleaning tray; 3. Lead screw; 4. Threaded pipe; 5. Connecting plate; 6. Gripper; 7. First motor; 8. First bevel gear; 9. Second bevel gear; 10. Second motor; 11. Spur gear; 12. External gear ring; 13. Limiting ring; 14. Limiting block; 15. Soft gasket; 16. Limiting protrusion; 17. Drain hole; 18. Bracket; 19. Water tank; 20. Door; 21. Observation window; 22. Placement platform; 23. Cleaning pipe; 24. Nozzle. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Please see Figure 1 , Figure 3 and Figure 4 This embodiment of a wafer clamping and cleaning device includes a cleaning tank 1, a cleaning disc 2 rotatably connected inside the cleaning tank 1, and equally spaced lead screws 3 rotatably connected inside the cleaning disc 2. Each lead screw 3 has a threaded tube 4 threadedly connected to its outer circumference, and a connecting plate 5 is fixedly connected to the outer circumference of each threaded tube 4. A gripper 6 is fixedly connected to the end of the connecting plate 5 away from the threaded tube 4. A first motor 7 is provided inside the cleaning disc 2, and a first bevel gear 8 is fixedly connected to the output end of the first motor 7. A second bevel gear 9 is fixedly connected to the end of each lead screw 3 away from the threaded tube 4, and the second bevel gear 9 meshes with the first bevel gear 8. A second motor 10 is provided inside the cleaning tank 1, and a spur gear 11 is fixedly connected to the output end of the second motor 10. An external gear ring 12 is fixedly sleeved on the outer circumference of the cleaning disc 2, and the external gear ring 12 meshes with the spur gear 11. A cleaning tube 23 is fixedly inserted inside the cleaning tank 1, and equally spaced nozzles 24 are provided at the bottom of the cleaning tube 23.

[0032] Please see Figure 4 and Figure 5 Each lead screw 3 is fixedly fitted with a limiting ring 13 on its outer circumference. The limiting ring 13 is rotatably connected to the inside of the cleaning disc 2 to restrict the lead screw 3, thereby enhancing the stability of the lead screw 3 rotating inside the cleaning disc 2 and preventing it from deviating or shaking when rotating at high speed.

[0033] Please see Figure 4 and Figure 5Each threaded tube 4 has a fixed limit block 14 on its outer circumference. The outer surface of the limit block 14 is slidably connected to the cleaning plate 2 through the slots opened inside the cleaning plate 2 to restrict the threaded tube 4, prevent the threaded tube 4 from rotating with the screw 3, and make the threaded tube 4 move laterally, thereby driving the connecting plate 5 and the gripper 6 to move and retract.

[0034] Please see Figure 4 and Figure 5 Each gripper 6 has an arc-shaped structure, and a soft pad 15 is fixedly connected to the inner wall of each gripper 6. The arc-shaped gripper 6 can be adapted to the circular wafer, improving the stability of the wafer clamping and fixing. The soft pad 15 can play a certain buffering role, avoiding damage to the wafer during the clamping and positioning process of the gripper 6. At the same time, it can also increase the frictional resistance between the gripper 6 and the wafer, thereby optimizing the positioning effect of the gripper 6.

[0035] Please see Figure 2 , Figure 3 and Figure 4 The bottom of the cleaning disc 2 is fixedly fitted with a limiting protrusion 16. The outer circumferential surface of the limiting protrusion 16 is rotatably connected to the cleaning box 1 through an annular groove opened inside the cleaning box 1, which restricts the cleaning disc 2 and prevents the cleaning disc 2 from easily falling out of the cleaning box 1, thereby improving the stability of the movement of the cleaning disc 2.

[0036] Please see Figure 1 and Figure 2 The cleaning tank 1 has two drain holes 17 inside. A bracket 18 is fixedly connected to the bottom of the cleaning tank 1. A water storage tank 19 is provided inside the bracket 18, so that the liquid during the cleaning process can flow into the water storage tank 19 below through the drain holes 17 for storage, which is convenient for subsequent processing. The bracket 18 can provide stable support for the cleaning tank 1.

[0037] Please see Figure 1 The front of the cleaning chamber 1 is hinged with a door 20. The inside of the door 20 is provided with an observation window 21. The door 20 is designed to facilitate the operator to open and close the cleaning chamber 1 and to place and remove the wafers. The observation window 21 allows the operator to observe the rotation status of the cleaning tray 2 and the cleaning status of the wafers without opening the door 20.

[0038] Please see Figure 1 , Figure 2 and Figure 4 A placement platform 22 is fixedly connected to the upper surface of the cleaning tray 2. The bottom surface of the gripper 6 contacts the upper surface of the cleaning tray 2. The placement platform 22 facilitates the placement of wafers and can also lift the wafers to a certain height, making it convenient for the gripper 6 to clamp and position the wafers.

[0039] In this embodiment, a wafer clamping and cleaning device utilizes a first bevel gear 8 to rotate, which in turn drives a lead screw 3 to rotate under the action of a second bevel gear 9. This causes the threaded tube 4 to synchronously move the connecting plate 5 and the gripper 6, thereby positioning and reinforcing the wafer during the cleaning process. This prevents the wafer from falling due to the impact of high-pressure gas or water jets, which could damage the wafer and improve the stability of the wafer cleaning operation. This ensures the normal operation of the cleaning process. Furthermore, the rotation of the spur gear 11, under the action of the external gear ring 12, drives the cleaning disc 2 to rotate, allowing for slow rotation during the wafer cleaning process. This ensures the uniformity and comprehensiveness of the wafer cleaning, guaranteeing the cleaning quality.

[0040] It should be noted that the inner top wall of the cleaning tank 1 is equipped with a light, which can provide good lighting conditions for the cleaning operation, and the lead screw 3 is arranged in a ring.

[0041] The working principle of the above embodiments is as follows:

[0042] During wafer cleaning, the wafer is placed on the placement stage 22. The first motor 7 is started to drive the first bevel gear 8 to rotate. The first bevel gear 8 drives the lead screw 3 to rotate through the second bevel gear 9. The lead screw 3 drives the connecting plate 5 and the gripper 6 to move inward through the threaded tube 4. Then, the gripper 6 clamps the wafer through the soft pad 15 to position the wafer. After that, the second motor 10 is started to drive the column gear 11 to rotate. The column gear 11 drives the cleaning tray 2 to rotate slowly through the external gear ring 12. The cleaning tray 2 then drives the wafer to rotate slowly. The cleaning tube 23 is connected to the external cleaning equipment. The external cleaning equipment is started to blow air or spray cleaning fluid onto the rotating wafer through the nozzle 24 on the cleaning tube 23 to complete the wafer cleaning operation. When cleaning fluid is used, the sprayed cleaning fluid will flow into the water storage tank 19 below through the drain hole 17 for subsequent processing.

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0044] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer chucking cleaning apparatus comprising a cleaning tank (1), characterized in that: The inside of the cleaning box (1) is rotationally connected with a cleaning disc (2), the inside of the cleaning disc (2) is rotationally connected with equidistantly arranged lead screws (3), the outer circumferential surface of each lead screw (3) is threadedly connected with a threaded tube (4), the outer circumferential surface of each threaded tube (4) is fixedly connected with a connecting plate (5), one end of the connecting plate (5) away from the threaded tube (4) is fixedly connected with a clamping jaw (6), the inside of the cleaning disc (2) is provided with a first motor (7), the output end of the first motor (7) is fixedly connected with a first bevel gear (8), one end of each lead screw (3) away from the threaded tube (4) is fixedly connected with a second bevel gear (9), the second bevel gear (9) is engaged with the first bevel gear (8), the inside of the cleaning box (1) is provided with a second motor (10), the output end of the second motor (10) is fixedly connected with a spur gear (11), the outer circumferential surface of the cleaning disc (2) is fixedly sleeved with an external gear ring (12), the external gear ring (12) is engaged with the spur gear (11), the inside of the cleaning box (1) is fixedly inserted with a cleaning pipe (23), the bottom of the cleaning pipe (23) is provided with equidistantly arranged spray heads (24).

2. The wafer chucking and cleaning apparatus according to claim 1, wherein: The outer circumferential surface of each lead screw (3) is fixedly sleeved with a limiting ring (13), and the limiting ring (13) is rotationally connected with the inside of the cleaning disc (2).

3. The wafer chucking and cleaning apparatus according to claim 1, wherein: The outer circumferential surface of each threaded tube (4) is fixedly connected with a limiting block (14), and the outer surface of the limiting block (14) is respectively slidably connected with the cleaning disc (2) through the air slots formed in the inside of the cleaning disc (2).

4. The wafer chucking and cleaning apparatus according to claim 1, wherein: Each clamping jaw (6) is in an arc-shaped structure, and the inner wall of each clamping jaw (6) is fixedly connected with a soft gasket (15).

5. The wafer chucking and cleaning apparatus according to claim 1, wherein: The bottom of the cleaning disc (2) is fixedly sleeved with a limiting protrusion (16), and the outer circumferential surface of the limiting protrusion (16) is rotationally connected with the cleaning box (1) through the annular air slot formed in the inside of the cleaning box (1).

6. The wafer chucking and cleaning apparatus according to claim 1, wherein: The inside of the cleaning box (1) is provided with two drainage holes (17), the bottom of the cleaning box (1) is fixedly connected with a support (18), and the inside of the support (18) is provided with a water storage tank (19).

7. The wafer chucking and cleaning apparatus according to claim 1, wherein: The front of the cleaning box (1) is hingedly connected with a box door (20), and the inside of the box door (20) is provided with an observation window (21).

8. The wafer chucking and cleaning apparatus according to claim 1, wherein: The upper surface of the cleaning disc (2) is fixedly connected with a placing table (22), and the bottom surface of the clamping jaw (6) is in contact with the upper surface of the cleaning disc (2).

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