Gas diffusion device

Abstract

The utility model discloses a gas diffusion device, comprising at least one gas diffusion member which is arranged between a front opening type wafer transmission box and a first door, is fixedly connected with the inner side surface of a door frame, and is used for introducing purging gas into a transition area between the front opening type wafer transmission box and the first door; the gas diffusion component comprises a shell which comprises a top plate and a bottom plate which are opposite to each other; the bottom plate is fixedly connected with the inner side of the door frame; an accommodating space is formed in the shell; the air inlet hole is formed in the bottom plate, communicates with the purging gas source and the containing space and is used for introducing purging gas into the containing space; the spoiler sets are located in the containing space, fixedly connected with the top plate and the bottom plate, arranged in the length direction of the shell at intervals and used for enabling the purging gas to be fully diffused in the containing space; the air outlet holes are formed in the top plate in a matrix mode and communicate with the containing space; and the purging gas in the accommodating space is introduced into the transition area through the gas outlet hole.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor fabrication technology, and in particular to a gas diffusion device. Background Technology

[0002] In semiconductor fabrication, the Front-opening Interface Mechanical Standard (FIMS) is a standard interface used to connect process equipment and the Front-opening Unified Pod (FOUP). FIMS can open and close the door of the FOUP and ensure that the FOUP remains sealed to the outside world both before and after the door is opened, allowing wafers to be transferred between the FOUP and the process equipment while maintaining wafer cleanliness.

[0003] However, when opening the front-opening wafer transfer box using the front-opening mechanical interface standard system, airflow from the standard system enters the box. Since this airflow typically contains particulate matter, it can cause particulate contamination of the wafers within the transfer box. Furthermore, in some fabrication processes, particularly atomic layer deposition (ALD), it is necessary to maintain a similar oxygen concentration between the standard system and the transfer box as between the standard system and the process equipment when opening the transfer box using the front-opening mechanical interface standard system, to meet process requirements. Utility Model Content

[0004] The purpose of this invention is to provide a gas diffusion device that can uniformly introduce purge gas between the front-opening mechanical interface standard system and the front-opening wafer transfer box. This not only makes the oxygen concentration between the front-opening mechanical interface standard system and the front-opening wafer transfer box similar to the oxygen concentration between the front-opening mechanical interface standard system and the process equipment, but also prevents particulate contamination of the wafer and avoids impact on the wafer.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0006] A gas diffusion device is used in a front-opening mechanical interface standard system; the front-opening mechanical interface standard system is used to connect process equipment and a front-opening wafer transfer box, and the front-opening mechanical interface standard system includes a door frame for fixing the front-opening wafer transfer box and a first door for opening and closing the front-opening wafer transfer box; the gas diffusion device includes:

[0007] At least one gas diffusion component is located between the front-opening wafer transfer box and the first door, and is fixedly connected to the inner side of the door frame, for introducing purge gas into the transition area between the front-opening wafer transfer box and the first door.

[0008] The gas diffusion component includes:

[0009] The housing includes a top plate and a bottom plate; the bottom plate is fixedly connected to the inner side of the door frame; and the housing has an accommodating space inside.

[0010] An air inlet is provided on the base plate and is connected to the purge gas source and the receiving space, for introducing the purge gas into the receiving space;

[0011] Multiple baffle assemblies, located within the accommodating space, are fixedly connected to the top plate and the bottom plate and spaced apart along the length of the housing, for ensuring sufficient diffusion of the purge gas within the accommodating space; and

[0012] Multiple air outlets are arranged in a matrix on the top plate and communicate with the receiving space; and the purging gas in the receiving space is introduced into the transition area through the air outlets.

[0013] Optionally, the base plate includes a first top end and a first bottom end opposite to each other, and the distance from the air inlet to the first top end and the distance from the air inlet to the first bottom end are equal.

[0014] Optionally, each of the said spoiler assembly includes:

[0015] The first flexible spoiler has one end fixedly connected to the top plate, and the other end is free to move;

[0016] The second flexible spoiler is spaced apart from the first flexible spoiler along the length of the shell; one end of the second flexible spoiler is fixedly connected to the bottom plate, and the other end is free to move; in each spoiler group, the first flexible spoiler is close to the air inlet, and a row of air outlets is arranged between the first flexible spoiler and the second flexible spoiler.

[0017] Optionally, in each of the spoiler groups, the free-moving end of the first flexible spoiler has a first gap with the bottom plate and a second gap with the second flexible spoiler, and the free-moving end of the second flexible spoiler has a third gap with the top plate.

[0018] Optionally, both the first flexible spoiler and the second flexible spoiler are arc-shaped plates.

[0019] Optionally, in the matrix, the air outlets located in the same row have the same diameter, and the air outlets located in the same column increase in diameter from the direction closer to the air inlet to the direction farther away from the air inlet.

[0020] Optionally, a row of the matrix may include at least two air vents spaced apart along the width of the top plate.

[0021] Compared with the prior art, the present invention has at least one of the following advantages:

[0022] This utility model provides a gas diffusion device that, after a front-opening wafer transfer box is placed on the workstation of a front-opening mechanical interface standard system and before the first door of the front-opening mechanical interface standard system opens the front-opening wafer transfer box, can use a gas diffusion component to introduce purge gas into the transition area between the front-opening wafer transfer box and the first door to reduce the oxygen concentration in the transition area. This makes the oxygen concentration between the first door and the front-opening wafer transfer box similar to the oxygen concentration between the first door and the process equipment, thereby meeting the process requirements.

[0023] In this utility model, after the first door of the front-opening mechanical interface standard system is opened, the purging gas diffused in the transition area will also enter the front-opening wafer transfer box to purge the wafers inside the box and ensure that the box is always under positive pressure. This prevents external ambient gases from entering the front-opening wafer transfer box, thereby ensuring the cleanliness of the front-opening wafer transfer box and avoiding particulate contamination of the wafers.

[0024] In this invention, the baffle plate assembly and the air outlet work together to evenly introduce the purging gas into the transition area, so as to avoid the airflow brought by the purging gas from impacting the wafers in the front-opening wafer transfer box, thereby avoiding the phenomenon of wafer vibration and displacement, and thus ensuring the accuracy of the robot arm picking up the wafers.

[0025] This utility model has a compact overall structure, is easy to install, and is relatively convenient for subsequent maintenance and replacement. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a gas diffusion device provided in an embodiment of the present invention;

[0027] Figure 2 This is a perspective view of a gas diffusion component provided in an embodiment of the present invention;

[0028] Figure 3 yes Figure 2 A cross-sectional schematic diagram of region A in the middle. Detailed Implementation

[0029] The following detailed description of a gas diffusion device according to the present invention, in conjunction with the accompanying drawings and specific embodiments, will further clarify the advantages and features of the present invention. It should be noted that the drawings are in a very simplified form and use non-precise proportions, intended only to facilitate and clearly illustrate the embodiments of the present invention. Please refer to the drawings for a clearer understanding of the objectives, features, and advantages of the present invention. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes and to aid those skilled in the art, and are not intended to limit the implementation conditions of the present invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the present invention, should still fall within the scope of the technical content disclosed in the present invention.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] Combined with appendix Figures 1-3 As shown, this embodiment provides a gas diffusion device for a front-opening mechanical interface standard system; the front-opening mechanical interface standard system is used to connect process equipment (not shown in the figure) and a front-opening wafer transfer box (not shown in the figure), and the front-opening mechanical interface standard system includes a door frame 101 for fixing the front-opening wafer transfer box and a first door 102 for opening and closing the front-opening wafer transfer box.

[0032] Specifically, the front-opening wafer transfer box includes a box body (not shown in the figure) and a second door sealed to the box body (not shown in the figure). The box body is used to store wafers. The second door is opened and closed by the first door 102 to realize the opening and closing of the front-opening wafer transfer box. More specifically, after the front-opening wafer transfer box is placed on the workstation of the front-opening mechanical interface standard system, the door frame 101 is detachably and sealed to the box body of the front-opening wafer transfer box, and a sealed transition area (not shown in the figure) is formed between the first door 102 and the second door of the front-opening wafer transfer box. Optionally, a sealing ring (not shown in the figure) is provided on the inner circumference of the door frame 101 to enable the door frame 101 to be detachably and sealed to the box body, but this utility model is not limited thereto.

[0033] Please continue to refer to this. Figure 1 and Figure 2 The gas diffusion device includes at least one gas diffusion member 200, located between the front-opening wafer transfer box and the first door 102, and fixedly connected to the inner side of the door frame 101, for introducing purge gas into the transition area between the front-opening wafer transfer box and the first door 102.

[0034] like Figure 1 and Figure 2 As shown, the gas diffusion component 200 includes: a housing 210, an air inlet 220, multiple baffle assemblies 230, and multiple air outlets 240. The housing 210 includes a top plate 2101 and a bottom plate 2102 facing each other; the bottom plate 2102 is fixedly connected to the inner side of the door frame 101; and the housing 210 has a receiving space (not shown in the figure). The air inlet 220 is disposed on the bottom plate 2102, communicating with the purge gas source and the receiving space, and is used to introduce the purge gas stored in the purge gas source into the receiving space. The multiple baffle assemblies 230 are located in the receiving space, fixedly connected to the top plate 2101 and the bottom plate 2102, and along the length direction of the housing 210 (e.g., ...). Figure 2 The purge gas is spaced apart in the Y direction (as shown) to allow it to diffuse sufficiently within the containment space. Multiple vents 240 are arranged in a matrix (n rows, m columns, where n and m are both positive integers) on the top plate 2101, communicating with the containment space; and the purge gas within the containment space is introduced into the transition region through the vents 240.

[0035] Specifically, in this embodiment, after the front-opening wafer transfer box is placed on the workstation of the front-opening mechanical interface standard system, and before the front-opening mechanical interface standard system opens the front-opening wafer transfer box, the gas diffusion member 200 can be used to introduce purge gas into the transition region to reduce the oxygen concentration in the transition region. This makes the oxygen concentration between the first gate 102 and the front-opening wafer transfer box (i.e., the oxygen concentration in the transition region) similar to the oxygen concentration between the first gate 102 and the process equipment, thereby meeting process requirements. More specifically, when the oxygen concentration in the transition region decreases to a preset value, i.e., when the oxygen concentration in the transition region is close to the oxygen concentration between the first gate 102 and the process equipment, the front-opening mechanical interface standard system opens the front-opening wafer transfer box to transfer the wafer to the process equipment at the preset oxygen concentration, thereby performing process processing on the wafer.

[0036] Furthermore, after the front-opening mechanical interface standard system opens the front-opening wafer transfer box, the purging gas diffused in the transition area will also enter the front-opening wafer transfer box to purge the wafers inside the box and ensure that the box is always under positive pressure. This prevents external ambient gases from entering the front-opening wafer transfer box, thereby ensuring the cleanliness of the front-opening wafer transfer box and avoiding particulate contamination of the wafers.

[0037] Furthermore, the specific process of introducing the purge gas into the transition region using the gas diffusion component 200 is as follows: the purge gas enters the accommodating space through the air inlet 220; after entering the accommodating space, under the obstruction of the baffle assembly 230, the purge gas freely expands within the accommodating space to achieve sufficient diffusion; finally, the fully diffused purge gas is evenly sprayed out to the transition region through the matrix-arranged air outlets 240. As can be seen from the above, in this embodiment, the cooperation of the baffle assembly 230 and the air outlets 240 allows the purge gas to be evenly introduced into the transition region, thereby preventing the airflow from the purge gas from impacting the wafers in the front-opening wafer transfer box, thus avoiding the phenomenon of wafer vibration and displacement, and ensuring the accuracy of the robotic arm's wafer handling.

[0038] It is understood that the housing 210 in the gas diffusion component 200 also includes a side plate 2103 connected to the bottom plate 2102 and the top plate 2101 (e.g., Figure 1As shown in the figure, the bottom plate 2102, the top plate 2101, and the side plate 2103 together form the accommodating space. Optionally, the purging gas is an inert gas; preferably, the purging gas is nitrogen, but this utility model is not limited thereto.

[0039] Please continue to refer to this. Figure 2 The base plate 2102 includes a first top end (not shown in the figure) and a first bottom end (not shown in the figure), and the direction from the first bottom end to the first top end is the length direction of the base plate 2102 and the housing 210 (e.g., Figure 2 (Y direction shown). Specifically, the distance from the air inlet 220 to the first top end and the distance from the air inlet 220 to the first bottom end are equal, that is, the air inlet 220 is located at the center of the base plate 2102, so that after the purge gas enters the accommodating space through the air inlet 220, it can diffuse freely to both the side from the air inlet 220 to the first top end and the side from the air inlet 220 to the first bottom end, thereby ensuring the air pressure on both sides is balanced, and thus allowing the purge gas to be evenly introduced into the transition area.

[0040] Please also refer to Figure 2 and Figure 3 Multiple spoiler groups 230 are symmetrically distributed along the length of the housing 210 with the air inlet 220 as the center. Each spoiler group 230 includes a first flexible spoiler 2301 and a second flexible spoiler 2302. One end of the first flexible spoiler 2301 is fixedly connected to the top plate 2101, and the other end is free to move. The second flexible spoiler 2302 is spaced apart from the first flexible spoiler 2301 along the length of the housing 210; one end of the second flexible spoiler 2302 is fixedly connected to the bottom plate 2102, and the other end is free to move. In each spoiler group 230, the first flexible spoiler 2301 is close to the air inlet 220, and a row of air outlets 240 is arranged between the first flexible spoiler 2301 and the second flexible spoiler 2302 in the same spoiler group 230.

[0041] Specifically, such as Figure 3As shown, in each of the spoiler groups 230, the free movable end of the first flexible spoiler 2301 has a first gap 2303 between itself and the bottom plate 2102 and a second gap 2304 between itself and the second flexible spoiler 2302; the free movable end of the second flexible spoiler 2302 has a third gap 2305 between itself and the top plate 2101; and the purging gas in the accommodating space flows through the first gap 2303 and the second gap 2304 to the air outlet 240 to enter the transition area, and flows through the third gap 2305 to the adjacent spoiler group 230.

[0042] More specifically, after the purge gas is introduced into the accommodating space through the air inlet 220, the purge gas will flow into the space between the first flexible spoiler 2301 and the second flexible spoiler 2302 of the spoiler group 230 (denoted as the first spoiler group) closest to the air inlet 220 along the first gap 2303 and the second gap 2304. Subsequently, part of the purge gas flowing into the space between the first flexible spoiler 2301 and the second flexible spoiler 2302 is introduced into the transition area through the corresponding air outlet 240, and the other part flows through the third gap 2305 into the spoiler group 230 (denoted as the second spoiler group) adjacent to the first spoiler group and far away from the air inlet 220. Similarly, the purge gas flows along the first gap 2303 and the second gap 2304 of the second baffle group into the space between the first flexible baffle 2301 and the second flexible baffle 2302 of the second baffle group. Part of the purge gas flowing into the space between the first flexible baffle 2301 and the second flexible baffle 2302 is introduced into the transition area through the corresponding air outlet 240, while another part flows through the third gap 2305 into the baffle group 230 (denoted as the third baffle group) which is adjacent to the second baffle group and far away from the air inlet 220, and so on. Finally, the purge gas is fully diffused and evenly introduced into the transition area throughout the entire containment space under the guidance of the multiple baffle groups 230.

[0043] It is understood that the bending degree of the first flexible baffle 2301 and the second flexible baffle 2302 will change with the change of the air pressure and flow rate of the purge gas introduced through the air inlet 220, so that the width d1 of the first gap 2303, the height h of the second gap 2304 and the width d2 of the third gap 2305 will change with the change of the air pressure and flow rate of the purge gas introduced through the air inlet 220. That is, the width d1 of the first gap 2303, the height h of the second gap 2304 and the width d2 of the third gap 2305 can be freely adjusted with the air pressure and flow rate of the purge gas introduced through the air inlet 220, so as to ensure that the air pressure and flow rate of the purge gas are relatively uniform when it enters the transition area through the air outlet 240, thereby avoiding impact on the wafer.

[0044] For example, when the pressure and velocity of the purge gas introduced through the air inlet 220 are large, the bending degree of the first flexible baffle 2301 and the second flexible baffle 2302 will be large, and the height h of the second gap 2304 will be smaller, so as to suppress the velocity of the purge gas, thereby ensuring that the pressure and velocity of the purge gas are relatively uniform when it enters the transition area through the air outlet 240.

[0045] In such Figure 2 and Figure 3 In the preferred embodiment shown, both the first flexible baffle 2301 and the second flexible baffle 2302 are arc-shaped plates. In other embodiments, the first flexible baffle 2301 and the second flexible baffle 2302 may also have other shapes, such as wavy shapes, which are not limited here, as long as the width d1 of the first gap 2303, the height h of the second gap 2304, and the width d2 of the third gap 2305 can be freely adjusted according to the pressure and flow rate of the purge gas introduced through the air inlet 220. Optionally, the first flexible baffle 2301 and the second flexible baffle 2302 are made of silicone material to give them good flexibility, so that they can bend to a corresponding degree according to the changes in the pressure and flow rate of the purge gas introduced through the air inlet 220, but this utility model is not limited thereto.

[0046] Please continue to refer to this. Figure 2For the air outlets 240 arranged in a matrix, the air outlets 240 in the same row have the same diameter; the air outlets 240 in the same column increase in diameter from near the air inlet 220 to far away from the air inlet 220. That is, for the case where the gas flow rate is fast in the area near the air inlet 220 and slow in the area far away from the air inlet 220, by controlling the diameter of the air outlets 240 and setting the baffle group 230, the gas flow rate of different areas is made the same, thereby achieving the purpose of uniform gas diffusion and further ensuring the uniformity of the purging gas entering the transition area.

[0047] In some embodiments, the vents 240 in one row of the matrix include at least two along the width direction of the top plate 2101 (e.g., Figure 2 The air outlets 240, spaced apart in the X direction (as shown), are designed to allow the purging gas to be introduced more evenly into the transition region. Figure 2 and Figure 3 In the preferred embodiment shown, a row of vents 240 in the matrix includes two vents 240 spaced apart along the width direction of the top plate 2101. In other embodiments, a row of vents 240 in the matrix may include only one vent 240, but this invention is not limited thereto.

[0048] Furthermore, in this embodiment, the number of gas diffusion components 200 can be two, three, or even four. When there are two gas diffusion components 200, the two gas diffusion components 200 can be fixed to the two inner sides of the door frame 101, which can effectively shorten the time required to reduce the oxygen concentration in the transition area to a preset value. When there are four gas diffusion components 200, the four gas diffusion components 200 are fixed to the four inner sides of the door frame 101, but this utility model is not limited thereto.

[0049] In summary, this embodiment provides a gas diffusion device, including at least one gas diffusion component. After the front-opening wafer transfer box is placed on the workstation of the front-opening mechanical interface standard system, and before the first door of the front-opening mechanical interface standard system opens the front-opening wafer transfer box, purge gas can be introduced into the transition area between the front-opening wafer transfer box and the first door using the gas diffusion component. This reduces the oxygen concentration in the transition area, making the oxygen concentration between the first door and the front-opening wafer transfer box similar to the oxygen concentration between the first door and the process equipment, thereby meeting process requirements. Furthermore, after the first door of the front-opening mechanical interface standard system opens the front-opening wafer transfer box, the purge gas diffused in the transition area also enters the front-opening wafer transfer box to purge the wafers inside and ensure that the box is always under positive pressure. This prevents external ambient gases from entering the front-opening wafer transfer box, thereby ensuring the cleanliness of the front-opening wafer transfer box and avoiding particulate contamination of the wafers. In this embodiment, the baffle plate group and the air outlet in the gas diffusion structure can be used to uniformly introduce the purging gas into the transition area, so as to avoid the airflow brought by the purging gas from impacting the wafer in the front-opening wafer transfer box, thereby avoiding the phenomenon of wafer vibration and displacement, and thus ensuring the accuracy of the robot arm picking up the wafer.

[0050] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A gas diffusion device for a front opening unified pod (FOUP) standard system; the FOUP standard system is used to connect a process equipment and a FOUP, and the FOUP standard system comprises a door frame (101) for fixing the FOUP and a first door (102) for opening and closing the FOUP; characterized in that, The gas diffusion device comprises: at least one gas diffusion member (200) located between the front opening unified pod and the first door (102) and fixedly connected to the inner side of the door frame (101), for supplying purge gas to the transition area between the front opening unified pod and the first door (102); wherein the gas diffusion member (200) comprises: a housing (210) comprising opposite top plate (2101) and bottom plate (2102); the bottom plate (2102) is fixedly connected to the inner side of the door frame (101); and the housing (210) has a containing space inside; an air inlet hole (220) provided on the bottom plate (2102) and in communication with a purge gas source and the containing space, for supplying the purge gas into the containing space; a plurality of spoiler groups (230) located in the containing space, fixedly connected to the top plate (2101) and the bottom plate (2102) and spaced apart along the length direction of the housing (210), for fully diffusing the purge gas in the containing space; and a plurality of air outlet holes (240) arranged in a matrix on the top plate (2101) and in communication with the containing space; and the purge gas in the containing space is supplied into the transition area through the air outlet holes (240).

2. The gas diffusion device according to claim 1, wherein The bottom plate (2102) comprises opposite first top end and first bottom end, and the distance from the air inlet hole (220) to the first top end is equal to the distance from the air inlet hole (220) to the first bottom end.

3. The gas diffusion device of claim 1, wherein Each of the spoiler groups (230) comprises: a first flexible spoiler (2301) having one end fixedly connected to the top plate (2101) and the other end freely movable; a second flexible spoiler (2302) spaced apart from the first flexible spoiler (2301) along the length direction of the housing (210); one end of the second flexible spoiler (2302) is fixedly connected to the bottom plate (2102) and the other end is freely movable; In each of the spoiler groups (230), the first flexible spoiler (2301) is close to the air inlet hole (220), and a row of air outlet holes (240) is arranged between the first flexible spoiler (2301) and the second flexible spoiler (2302).

4. The gas diffusion device of claim 3, wherein In each of the spoiler groups (230), the freely movable end of the first flexible spoiler (2301) has a first gap (2303) with the bottom plate (2102) and a second gap (2304) with the second flexible spoiler (2302), and the freely movable end of the second flexible spoiler (2302) has a third gap (2305) with the top plate (2101).

5. The gas diffusion device of claim 3, wherein The first flexible spoiler (2301) and the second flexible spoiler (2302) are both arc-shaped plates.

6. The gas diffusion device of claim 1, wherein The hole diameters of the air outlet holes (240) in the same row are the same; and the hole diameters of the air outlet holes (240) in the same column increase from the direction close to the air inlet hole (220) to the direction away from the air inlet hole (220).

7. The gas diffusion device of claim 1, wherein A row of the air outlet holes (240) comprises at least two air outlet holes (240) arranged at intervals along the width direction of the top plate (2101).

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