Silicon wafer transfer device and battery piece production unit

Abstract

The utility model provides a silicon wafer transfer device and a battery piece production unit, and relates to the field of photovoltaic cells. The conveying assembly is installed on the base table and extends in the preset transferring direction; the first air return assembly is installed on the base table and located on one side of the conveying assembly, the first air return assembly extends in the preset transfer direction, and a plurality of first air return holes are formed in the side, facing the conveying assembly, of the first air return assembly. The first air return hole can continuously suck air, so that the first air return assembly can continuously suck air to the conveying assembly through the first air return hole, dust and other impurities on the surface of the conveying assembly are sucked into the first air return hole, and accumulation of dust on the conveying assembly, a flower basket and a silicon wafer is reduced; therefore, the situation that the production quality of follow-up battery pieces is affected due to the fact that the dust flies on the silicon wafers is relieved, the defect of the battery pieces is reduced, meanwhile, the machine does not need to be shut down for cleaning, manual cleaning is not needed, manpower is saved, and the overall productivity is improved.

Description

Technical Field

[0001] This application belongs to the field of photovoltaic cell technology, and in particular relates to a silicon wafer transfer device and a cell production unit. Background Technology

[0002] In the automated production process of solar cells, multiple silicon wafers can be carried in baskets and then moved by conveyor belts to transfer the silicon wafers.

[0003] As the machine runs for a period of time, the friction between the basket and the conveyor belt can generate dust. With the movement of the basket, this dust may fall onto the silicon wafers, affecting the quality of subsequent solar cell production, such as causing defects like pitting and black spots on the surface. To clean the dust, the machine needs to be stopped after running for a period of time, and personnel need to wipe the dust off the surface. However, this is a serious waste of manpower and also significantly impacts production capacity.

[0004] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Utility Model Content

[0005] This application provides a silicon wafer transfer device and a solar cell production unit to solve or alleviate one or more technical problems in the prior art.

[0006] The first aspect of this application provides a silicon wafer transfer device, comprising:

[0007] abutment;

[0008] A transfer assembly, mounted on the base and extending along a predetermined transfer direction, is used to carry and transfer silicon wafers; and

[0009] The first return air assembly is mounted on the base and located on one side of the conveying assembly. The first return air assembly extends along the predetermined transfer direction and has a plurality of first return air holes on the side facing the conveying assembly.

[0010] Optionally, the transmission component includes:

[0011] The first and second rotating shafts are set relative to each other, and both the first and second rotating shafts can rotate along their own axes;

[0012] The first conveyor belt has its two ends respectively fitted onto the first end of the first rotating shaft and the first end of the second rotating shaft.

[0013] The second conveyor belt has its two ends respectively fitted onto the second end of the first rotating shaft and the second end of the second rotating shaft.

[0014] Optionally, the first return air assembly includes:

[0015] The first side return air guide is located on the side of the first conveyor belt away from the second conveyor belt;

[0016] The second side return air guide is located on the side of the second conveyor belt away from the first conveyor belt;

[0017] The first return air hole is provided on both the first side return air guide rail and the second side return air guide rail.

[0018] Optionally, a first return air channel is provided in the first side return air guide rail, and the first return air channel is connected to the first return air hole in the first side return air guide rail;

[0019] The first side return air guide rail is also provided with a first exhaust port, which is connected to the first return air channel and is used to connect to the exhaust assembly so as to generate negative pressure by exhausting air from the first return air channel through the exhaust assembly.

[0020] Optionally, the first conveyor belt surrounds to form a first annular space;

[0021] The silicon wafer transfer device also includes:

[0022] The first return air base is located within the first annular space;

[0023] An extension is connected to the first return air base and extends out of the first annular space, and a second return air hole is provided on the extension.

[0024] Optionally, the vertical height of the first side return air guide rail is higher than the vertical height of the upper surface of the first conveyor belt, and it is fixed above the first return air base.

[0025] Optionally, it also includes:

[0026] A dustproof base plate is located between the first conveyor belt and the second conveyor belt, and an adhesive layer is provided on the surface of the dustproof base plate.

[0027] Optionally, it also includes:

[0028] A dust cover is installed on the base and covers the conveying assembly and the first return air assembly. The top of the dust cover has an opening, and a dust filter is embedded in the opening.

[0029] Optionally, it also includes a deionization component, which is disposed on the inner walls of both sides of the dust cover and is disposed corresponding to the starting end of the conveying component;

[0030] The deionization component is used to blow charged gas onto the conveying component to neutralize the charge on the silicon wafer carried on the conveying component.

[0031] A second aspect of this application provides a solar cell production unit, including the silicon wafer transfer device described in any of the preceding claims.

[0032] The embodiments of this application employing the above-described technical solution may have the following advantages:

[0033] The first return air vent continuously draws in air, generating a sustained suction force. This allows the first return air assembly to continuously draw air into the conveyor assembly, thereby sucking in dust and other impurities from the surface of the conveyor assembly. This reduces dust accumulation on the conveyor assembly, basket, and silicon wafers, mitigating the impact of dust falling onto the silicon wafers on the production quality of subsequent solar cells. It also reduces defects such as pitting and black spots on the surface of the solar cells. Furthermore, the first return air assembly can continuously draw air, eliminating the need for machine shutdown and manual cleaning, thus saving manpower and increasing overall production capacity.

[0034] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0035] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0036] Figure 1 A schematic diagram of the silicon wafer transfer device provided in the embodiments of this application;

[0037] Figure 2 for Figure 1 A top view of a silicon wafer transfer device;

[0038] Figure 3 This is a schematic diagram of the loading basket of the silicon wafer transfer device provided in the embodiments of this application;

[0039] Figure 4 This is another schematic diagram of the silicon wafer transfer device provided in the embodiments of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] First rotating shaft 101; Second rotating shaft 102; First conveyor belt 104; Second conveyor belt 105; First return air vent 205; First side return air guide rail 201; Second side return air guide rail 202; First exhaust vent 206; First return air base 31; Second exhaust vent 315; Support part 313; Extension part 32; Second return air vent 321; Dustproof base plate 40; Side plate 51; Top plate 53; Dustproof filter element 55; Blower 57; First deionization air knife 61; Second deionization air knife 62; Flower basket 90. Detailed Implementation

[0042] The embodiments of this application are described in detail below, examples of which are illustrated in the accompanying drawings. In the drawings, for clarity, the dimensions of layers, regions, elements, and their relative dimensions may be exaggerated. The same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0043] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0044] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0045] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0046] In this application, when numerical intervals (i.e., numerical ranges) are involved, unless otherwise specified, the distribution of selectable numerical values ​​within the numerical interval is considered continuous, and includes the two endpoints of the numerical interval (i.e., the minimum and maximum values), as well as every numerical value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that numerical interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints, which is equivalent to directly listing every integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be merged. In other words, unless otherwise specified, the numerical ranges disclosed in this application should be understood to include any and all subranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, percentage, ratio, etc. The term "numerical interval" can be broadly included to include percentage intervals, ratio intervals, proportion intervals, etc.

[0047] This application provides a silicon wafer transfer device and a solar cell production unit technical solution. Based on this, dust on the silicon wafer surface is reduced, thus reducing defects in the solar cells. Details are provided below.

[0048] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. It should be understood that these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0049] Please see Figures 1 to 4 This application provides a silicon wafer transfer device, which includes a base, a conveying assembly, and a first return air assembly. The details are as follows:

[0050] The base plate, as the fundamental support structure in the entire silicon wafer transfer device, is used to support other components and provide stable support. The base plate has good rigidity and can be constructed using high-strength materials (such as aluminum alloy and stainless steel), and its flatness and stability are ensured through processing.

[0051] A conveying assembly is mounted on a base and is responsible for carrying and transferring silicon wafers. The conveying assembly extends along a predetermined transport direction for carrying and transferring silicon wafers. In some embodiments, multiple silicon wafers can be carried by a basket 90, which is then placed on the conveying assembly to achieve wafer transfer. In some embodiments, the conveying assembly can consist of a conveyor belt, rollers, or chutes to guide the smooth movement of the silicon wafers carried on its surface.

[0052] The first return air assembly is mounted on the base and located on one side of the conveying assembly. The first return air assembly extends along the predetermined transfer direction and has a plurality of first return air holes 205 on the side of the first return air assembly facing the conveying assembly.

[0053] The first return air vent 205 can continuously draw in air to generate a continuous adsorption force, allowing the first return air assembly to continuously draw air into the conveying assembly through the first return air vent 205. This draws in dust and other impurities from the surface of the conveying assembly, reducing dust accumulation on the conveying assembly, basket 90, and silicon wafers. This alleviates the problem of dust falling onto the silicon wafers and affecting the production quality of subsequent solar cells, reducing defects such as pitting and black spots on the surface of the solar cells. At the same time, the first return air assembly can continuously draw air without stopping the machine for cleaning or requiring manual cleaning, which not only saves manpower but also increases overall production capacity.

[0054] It should be noted that the silicon wafers described in the embodiments of this application can be different types of silicon wafers such as battery cells, solar cells, and semiconductor silicon wafers.

[0055] In an optional embodiment, the conveying assembly includes a first rotating shaft 101, a second rotating shaft 102, a first conveyor belt 104, and a second conveyor belt 105. The first rotating shaft 101 and the second rotating shaft 102 are arranged opposite to each other, and both the first rotating shaft 101 and the second rotating shaft 102 can rotate along their own axes.

[0056] The two ends of the first conveyor belt 104 are respectively fitted onto the first end of the first rotating shaft 101 and the first end of the second rotating shaft 102, and the two ends of the second conveyor belt 105 are respectively fitted onto the second end of the first rotating shaft 101 and the second end of the second rotating shaft 102.

[0057] Specifically, the first rotating shaft 101 and the second rotating shaft 102 can be mounted on the base via their respective bearings or support structures. The first rotating shaft 101 and the second rotating shaft 102 can serve as driving components for the first conveyor belt 104 and the second conveyor belt 105. When the first rotating shaft 101 and the second rotating shaft 102 rotate in the same direction, they drive the first conveyor belt 104 and the second conveyor belt 105 to move together in the same direction, thereby moving the basket 90 and the silicon wafer on the conveyor belts. Specifically, the first conveyor belt 104 and the second conveyor belt 105 can be arranged in parallel, thereby evenly distributing the weight of the silicon wafer and preventing the silicon wafer from tilting or rolling.

[0058] In some embodiments, the first rotating shaft 101 can be divided into two first short shafts on the same straight line, and the second rotating shaft 102 can be divided into two second short shafts on the same straight line. The two first short shafts and the two second short shafts are arranged opposite to each other. The rotational speed and direction of the two first short shafts are the same, and the rotational speed and direction of the two second short shafts are the same. The two ends of the first conveyor belt 104 can be respectively fitted onto one first short shaft and one second short shaft, and the two ends of the second conveyor belt 105 can be respectively fitted onto another first short shaft and another second short shaft.

[0059] Furthermore, the first return air assembly includes: a first side return air guide rail 201 and a second side return air guide rail 202. The first side return air guide rail 201 is located on the side of the first conveyor belt 104 away from the second conveyor belt 105, and the second side return air guide rail 202 is located on the side of the second conveyor belt 105 away from the first conveyor belt 104. Both the first side return air guide rail 201 and the second side return air guide rail 202 are provided with the first return air hole 205.

[0060] The first return air holes 205 on the first side return air guide rail 201 and the second side return air guide rail 202 draw in air to form a continuous airflow, thereby removing dust and impurities from the surface of the conveying components, silicon wafers, and surrounding areas. This reduces the impact on the quality of cell production and prevents the formation of surface pits and black spots. Furthermore, the continuous generation of adsorption airflow enables automated cleaning without requiring manual cleaning during downtime.

[0061] The first side return air guide rail 201 and the second side return air guide rail 202 can be symmetrically arranged so that airflow can be effectively drawn in from both sides to form a uniform airflow, avoiding dust accumulation or adverse effects on the silicon wafer.

[0062] Furthermore, in this embodiment, a first return air channel is provided inside the first side return air guide rail 201, and the first return air channel is connected to the first return air hole 205 inside the first side return air guide rail 201.

[0063] The first side return air guide rail 201 is also provided with a first exhaust port 206. The first exhaust port 206 is connected to the first return air channel and is used to connect to the exhaust assembly so as to generate negative pressure by exhausting air from the first return air channel through the exhaust assembly.

[0064] The first return air duct is connected to the first return air hole 205, allowing the air drawn in by the return air hole to flow smoothly into the first side return air guide rail 201. The first exhaust port 206 is connected to the exhaust assembly, which generates negative pressure to enhance air suction. Under the action of negative pressure, the first return air hole 205 can more effectively extract dust and impurities from the conveyor belt, silicon wafers, and the surrounding environment. The dust passes through the first return air duct to the exhaust assembly or is directly discharged to avoid accumulation in the first return air duct and blockage.

[0065] Specifically, the exhaust assembly can be integrated into the base, and the exhaust assembly within the base can be connected to the first exhaust port 206 via an air duct. In some embodiments, the exhaust assembly can be an exhaust fan, vacuum pump, etc., such as a centrifugal fan and an axial fan. A centrifugal fan can generate relatively strong negative pressure, while an axial fan is suitable for more compact spaces and can provide a stable airflow. In some embodiments, the exhaust assembly can also be installed in other locations, simply by connecting the exhaust assembly to the first exhaust port 206 via an air duct.

[0066] Correspondingly, the structure inside the second side return air guide rail 202 can be the same as that of the first side return air guide rail 201, and the terminal adsorption force is provided by the exhaust assembly, which will not be described in detail here.

[0067] In an optional embodiment, the first conveyor belt 104 surrounds to form a first annular space (not shown in the figure). The silicon wafer transfer device further includes a first return air base 31 and an extension 32. The first return air base 31 is located within the first annular space, and the extension 32 is connected to the first return air base 31 and extends out of the first annular space. A second return air hole 321 is provided on the extension 32.

[0068] The first return air base 31 is also provided with a second exhaust port 315 for connecting with the exhaust assembly. A second return air channel can be opened inside the first return air base 31. The exhaust assembly can generate negative pressure by exhausting air into the second return air channel, so that the second exhaust port 315 on the first return air base 31 generates negative pressure to suck up dust.

[0069] The first return air base 31 can extend along the length of the first conveyor belt 104, and its specific length can correspond to the first side return air guide rail 201.

[0070] In this embodiment, the first return air hole 205 and the second return air hole 321 are located on both sides of the first conveyor belt 104. The first return air hole 205 can adsorb dust on the side of the first conveyor belt 104 away from the second conveyor belt 105, and the second return air hole 321 can adsorb dust on the side of the first conveyor belt 104 close to the second conveyor belt 105. Thus, air can be drawn from both sides of the first conveyor belt 104 at the same time, and the air can cover a wider area, avoiding dust accumulation between the first conveyor belt 104 and the second conveyor belt 105, ensuring the uniformity of airflow, and further improving the dust and impurity adsorption efficiency.

[0071] Correspondingly, the second conveyor belt 105 surrounds to form a second annular space. The silicon wafer transfer device may also include a second return air base, which is located in the second annular space. The structure of the second return air base may be the same as that of the first return air base 31. An extension 32 extending out of the second annular space is provided on the second return air base, and a corresponding return air hole is opened on the extension 32 to improve the uniformity of the return airflow.

[0072] Furthermore, in this embodiment, the vertical height of the first side return air guide rail 201 is higher than the vertical height of the upper surface of the first conveyor belt 104, and it is fixed above the first return air base 31.

[0073] The height of the first side return air guide rail 201 is higher than the surface of the first conveyor belt 104, allowing the first return air hole 205 to fully draw in the air around the first conveyor belt 104 without being blocked by the first conveyor belt 104 in its adsorption path. The first side return air guide rail 201 can effectively cover the area outside the first conveyor belt 104, thereby optimizing the airflow path and enhancing the adsorption effect of dust and impurities. In this embodiment, the first side return air guide rail 201 and the first conveyor belt 104 are spaced apart to avoid interfering with the transmission of the first conveyor belt 104.

[0074] The first return air base 31 is also provided with a support part 313 at the end away from the second conveyor belt 105. The support part 313 can be used to support the first side return air guide rail 201 so that the first side return air guide rail 201 can be fixed above the first return air base 31. The top height of the first side return air guide rail 201 is higher than the top height of the first conveyor belt 104. The first side return air guide rail 201 and the first return air base 31 form an "L" shaped structure, so that the first side return air guide rail 201 can play a role in positioning and limiting the basket 90 and silicon wafer on the first conveyor belt 104, and prevent the basket 90 and silicon wafer from slipping off the conveyor assembly during the transmission process.

[0075] In an optional embodiment, the silicon wafer transfer device further includes a dustproof base plate 40, which is located between the first conveyor belt 104 and the second conveyor belt 105, and the surface of the dustproof base plate 40 is provided with an adhesive layer.

[0076] The dustproof base plate 40 between the first conveyor belt 104 and the second conveyor belt 105 can effectively prevent dust from falling from the conveyor belts above or to the area below the conveyor assembly or the surrounding environment. The adhesive layer on the surface of the dustproof base plate 40 can stick to the tiny particles and dust falling from the conveyor belts, preventing these particles from depositing on the lower surface of the conveyor belts and reducing dust generation.

[0077] Specifically, the adhesive layer can be made of polyurethane or silicone. The adhesive layer can be attached to the surface of the dustproof base plate 40 in the form of a film. When the adhesive layer is covered with a lot of dust and needs to be replaced, the adhesive layer can simply be peeled off from the dustproof base plate 40 and replaced without replacing the dustproof base plate 40.

[0078] In an optional embodiment, the silicon wafer transfer device further includes a dust cover, which is mounted on the base and covers the transfer assembly and the first return air assembly. The top of the dust cover has an opening, and a dust filter element 55 is embedded in the opening.

[0079] By covering key components such as the conveyor assembly, basket 90, silicon wafers, and first return air assembly with dust covers, it is possible to prevent dust and impurities from the external environment from entering the dust cover, thus isolating external pollution sources. On the other hand, it can also avoid interference from the airflow of the external environment and prevent external turbulence from causing dust.

[0080] Specifically, the dust cover may include two side plates 51 and a top plate 53. The two side plates 51 are mounted on the base and located at opposite ends of the conveying assembly, with their horizontal height higher than the horizontal height of the basket 90 on the conveying assembly. The top plate 53 spans between the two side plates 51 and is located on the side of the side plates 51 away from the base, thus shielding the conveying assembly, basket 90, and other components between the two side plates 51. The two side plates 51 and the top plate 53 of the dust cover, together with the base, form a dustproof channel with openings at both ends, corresponding to the start and end ends of the conveying assembly.

[0081] The dust filter 55 embedded in the top plate 53 allows outside air to enter the dustproof channel from the top of the dustproof cover. The dust filter 55 can filter dust, particulate matter and impurities in the air, ensuring that the air entering the dustproof channel is as clean as possible, effectively isolating external pollution sources, preventing dust and particles from contaminating the silicon wafer, and also maintaining the airflow in the dustproof channel to avoid the dustproof cover shaking due to uneven pressure in the dustproof channel.

[0082] In this embodiment, a blower 57 can also be installed on the top of the dust filter element 55. The blower 57 can blow air into the dust cover through the dust filter element 55, so that the airflow inside the dust cover forms a top-down state, effectively guiding the airflow to the conveying component and the first return air component, ensuring continuous airflow in the dustproof channel, thereby avoiding the formation of dead corners for dust accumulation. At the same time, the first return air component and the first return air base 31 can continuously exhaust air to remove the dust generated by friction on the conveyor belt, thereby improving the cleanliness of the working area (conveying component, basket, silicon wafer, dustproof channel).

[0083] In some embodiments, the air inlet of the blower 57 may be connected to a clean air source to minimize dust at the source.

[0084] During transport, silicon wafers may accumulate static electricity on their surface due to friction, contact, or other factors. This static electricity can cause dust and particulate matter to be attracted to the silicon wafer surface, making it difficult for the first return air assembly to remove the dust and reducing its suction efficiency.

[0085] Based on this, in this embodiment, the silicon wafer transfer device further includes a deionization component, which is disposed on the inner walls of both sides of the dust cover and is disposed corresponding to the starting end of the transfer component. The deionization component is used to blow charged gas onto the transfer component to neutralize the charge on the silicon wafer carried on the transfer component.

[0086] Specifically, taking a deionization component, including a deionizer fan, as an example, the deionizer fan can be equipped with a high-voltage power supply. This high voltage generates a high voltage on the electrodes of the deionizer fan, ionizing the surrounding air molecules (such as oxygen and nitrogen) to produce positive ions (O2⁺, N2⁺) and negative ions (O2⁻, N2⁻). These charged ions are then blown by the airflow towards the surface of the object requiring destatication (such as silicon wafers, baskets, conveyor belt surfaces, etc.). The charged airflow comes into contact with and interacts with the charged ions on the object's surface, neutralizing the surface charge and removing static electricity. This reduces or eliminates the static force adsorbed on the object's surface, making it easier for the object to detach.

[0087] In addition, deionizers can improve the air quality of the working environment. The ions released by deionizers can combine with airborne particulate matter (such as dust), causing the particles to settle and further purifying the air, reducing dust pollution to the production environment.

[0088] In this embodiment, by neutralizing the static electricity on the silicon wafer, the adsorption of dust on the silicon wafer surface can be reduced, making it easier for the first return air assembly to remove the dust from the silicon wafer surface.

[0089] The deionization component may include a first deionization air knife 61 and a second deionization air knife 62. The first deionization air knife 61 and the second deionization air knife 62 may be respectively disposed on two different side plates 51 of the dust cover and disposed close to the starting end of the conveying component, and respectively blow out charged gas to remove static electricity from the basket 90 and the silicon wafer surface that enter the dust cover, thereby improving the dust collection efficiency.

[0090] This application also provides a solar cell production unit, including the silicon wafer transfer device described in any of the above embodiments.

[0091] In some embodiments, the cell production unit may further include a coating assembly, an etching assembly, a welding assembly, etc.

[0092] Coated components can be used to deposit thin film materials on the surface of silicon wafers to form functional layers for solar cells, such as anti-reflective layers and back electrode layers. Specifically, coating can be performed using methods such as vapor deposition and magnetron sputtering to increase the photoelectric conversion efficiency of the silicon wafer and optimize cell performance.

[0093] Etching components can be used to etch specific patterns or structures onto silicon wafers to create electrodes and conductive paths for solar cells. Specifically, wet or dry etching can be used to remove unwanted areas from the silicon wafer surface, forming conductive electrodes, contact points, and other structures to ensure the electrical performance and stability of the solar cells.

[0094] Welding components can be used to connect multiple solar cells into modules or to connect solar cells to external circuits. Specifically, they can be connected by methods such as spot welding, laser welding, or conductive adhesive, allowing multiple solar cells to be connected in series or parallel to form large-scale battery packs or modules.

[0095] The cell production unit may also include other components or devices, which will not be described in detail here.

[0096] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The directional terms "inner" and "outer" refer to the inside or outside relative to the outline of the component itself. For example, if a device in the drawings is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0097] It should also be noted that the terms "one embodiment," "another embodiment," and "embodiment" used in this application refer to specific features, structures, or characteristics described in connection with that embodiment, which are included in at least one embodiment described in the general description of this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in connection with any embodiment, the intention is to suggest that implementing such a feature, structure, or characteristic in conjunction with other embodiments also falls within the scope of this application.

[0098] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0099] It should also be noted that the above are merely preferred embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A silicon wafer transfer device, comprising: The silicon wafer transfer device comprises: a base; a conveying assembly mounted on the base and extending along a predetermined transfer direction for carrying and transferring silicon wafers; a first return air assembly mounted on the base and located on one side of the conveying assembly, the first return air assembly extending along the predetermined transfer direction, and the first return air assembly being provided with a plurality of first return air holes on one side facing the conveying assembly. The conveying assembly comprises:

2. The silicon wafer transfer device of claim 1, wherein a first rotating shaft and a second rotating shaft arranged oppositely, the first rotating shaft and the second rotating shaft being rotatable along their own axes; a first conveying belt, both ends of the first conveying belt being sleeved on a first end of the first rotating shaft and a first end of the second rotating shaft respectively; a second conveying belt, both ends of the second conveying belt being sleeved on a second end of the first rotating shaft and a second end of the second rotating shaft respectively. The first return air assembly comprises:

3. The silicon wafer transfer device of claim 2, wherein a first side return air guide rail located on a side of the first conveying belt away from the second conveying belt; a second side return air guide rail located on a side of the second conveying belt away from the first conveying belt; wherein the first side return air guide rail and the second side return air guide rail are both provided with the first return air holes. The first side return air guide rail is provided with a first return air channel therein, the first return air channel being in communication with the first return air holes on the first side return air guide rail; 4. The silicon wafer transfer device of claim 3, wherein the first side return air guide rail is further provided with a first air suction port, the first air suction port being in communication with the first return air channel and being used for being in communication with an air suction assembly to generate negative pressure in the first return air channel through the air suction assembly. The first conveying belt forms a first annular space around it.

5. The silicon wafer transfer device of claim 3, wherein The silicon wafer transfer device further comprises: a first return air base located in the first annular space; an extension part connected to the first return air base and extending out of the first annular space, the extension part being provided with second return air holes. The vertical height of the first side return air guide rail is higher than the vertical height of the upper surface of the first conveying belt, and the first side return air guide rail is fixed above the first return air base.

6. The silicon wafer transfer device of claim 5, wherein, The silicon wafer transfer device further comprises:

7. The silicon wafer transfer device of any one of claims 2 to 6, wherein, a dustproof bottom plate located between the first conveying belt and the second conveying belt, the surface of the dustproof bottom plate being provided with an adhesive layer. The silicon wafer transfer device further comprises:

8. The silicon wafer transfer device according to any one of claims 2 to 6, wherein a dustproof cover mounted on the base and covering the conveying assembly and the first return air assembly, the top of the dustproof cover being provided with an opening, and a dustproof filter element being embedded in the opening. The silicon wafer transfer device further comprises a deionization assembly, the deionization assembly being arranged on the inner walls of both sides of the dustproof cover and being arranged correspondingly to the starting end of the conveying assembly; 9. The silicon wafer transfer device of claim 8, wherein, wherein the deionization assembly is used for blowing charged gas towards the conveying assembly to neutralize the charges on the silicon wafers carried on the conveying assembly. The silicon wafer transfer device comprises any one of claims 1-9.

10. A cell sheet production unit, characterized by, ​

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