Transfer device of wafer box
By setting limit protrusions and sensors in the wafer cassette transfer device, the problem of robotic arm collision caused by the obstruction not being fully opened is solved, and safe and reliable wafer cassette transfer is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-03-06
AI Technical Summary
In existing technologies, the inability of the shielding components on the wafer cassette to fully open leads to collisions between the robotic arm and the shielding components.
Limiting protrusions and sensors are installed in the wafer transfer device. The opening state of the blocking component is detected by the limiting protrusions, and the motion state of the robotic arm is fed back by the sensors.
This effectively avoids collisions between the robotic arm and the obstruction, improving the safety and reliability of the wafer cassette transfer process.
Smart Images
Figure CN223979064U_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor equipment technology, and more particularly to a wafer cassette transfer device. Background Technology
[0002] In the field of power devices, especially in the automotive industry, IGBT (Insulated Gate Bipolar Transistor) products are widely used due to their high efficiency and reliability. With the continuous advancement of automotive electrification, the demand for IGBT products is increasing daily. In the back-end manufacturing stage, IGBT wafers (a type of silicon wafer with circuitry already laid out on the front) require a series of intricate processing steps and are transferred to wafer cassettes using a transfer device.
[0003] In the prior art, the wafer cassette has a shield. After the wafer cassette is placed in the transfer device, it is impossible to determine whether the shield is fully open. If the shield is not fully open, the robotic arm will continue to work, which will cause the robotic arm to collide with the shield, damaging the wafer or the robotic arm.
[0004] Therefore, it is necessary to provide a new wafer cassette transfer device to solve the aforementioned problems existing in the prior art. Summary of the Invention
[0005] The purpose of this invention is to provide a wafer cassette transfer device that can improve the problem of collision between the robotic arm and the shielding component caused by the inability to determine whether the shielding component is fully open.
[0006] To achieve the above objectives, the technical solution of the present invention is as follows:
[0007] A wafer cassette transfer device, wherein a rotatable shield is provided on the side wall of the wafer cassette; the transfer device includes:
[0008] A placement cavity for placing the wafer cassette;
[0009] A limiting part is provided inside the placement cavity, and the limiting part has a limiting protrusion;
[0010] When the wafer cassette is placed in the placement cavity and the shielding member is fully opened, the position of the wafer cassette does not shift, the limiting protrusion is located between the opposite side walls of the wafer cassette, and the bottom of the wafer cassette is parallel to the bottom wall of the placement cavity.
[0011] When the wafer cassette is placed in the placement cavity and the shielding member is not fully opened, the wafer cassette is shifted in position, the shielding member abuts against the end face of the limiting protrusion, and the bottom wall of the wafer cassette is inclined, forming an angle with the bottom wall of the placement cavity.
[0012] By adopting the above technical solution, a limiting protrusion is set in the placement cavity. When the shielding component on the wafer cassette is not fully opened, the shielding component will contact the end face of the limiting protrusion, causing the wafer cassette to tilt. At this time, the position of the wafer cassette in the placement cavity shifts, and the robotic arm will not continue to move. When the shielding component on the wafer cassette is fully opened, the shielding component will not contact the end face of the limiting protrusion. At this time, the position of the wafer cassette in the placement cavity does not shift, and the robotic arm can continue to move. Because the limiting protrusion is set, the robotic arm will not continue to move when the shielding component on the wafer cassette is not fully opened, thus improving the problem of collision between the robotic arm and the shielding component caused by the inability to determine whether the shielding component is fully open.
[0013] Optionally, the bottom wall of the placement cavity is provided with a placement groove for accommodating the limiting part, so that the upper end surface of the limiting part is flush with or lower than the bottom wall of the placement cavity; the upper end surface of the limiting protrusion is higher than the bottom wall of the placement cavity.
[0014] Optionally, the limiting protrusion includes:
[0015] The first protrusion is located on the bottom wall of the placement cavity and is spaced from the side wall of the wafer cassette.
[0016] The second protrusion is located on the bottom wall of the placement cavity. One end is connected to the first protrusion, and the other end extends toward the side wall of the wafer cassette, so that when the shielding member is not fully opened, the shielding member contacts the end face of the first protrusion or the end face of the second protrusion.
[0017] Optionally, the distance between the first protrusion and the sidewall of the wafer cassette is less than or equal to the width of the shielding member, so that when the shielding member is perpendicular to the sidewall of the wafer cassette, it contacts the end face of the first protrusion.
[0018] Optionally, the length of the first protrusion is greater than the width of the blocking member, so that when the blocking member is not fully opened, it can be rotated to any angle to contact the end face of the first protrusion or the end face of the second protrusion.
[0019] Optionally, the other end of the second protrusion extends toward and abuts against the side wall of the wafer cassette, so that when the shield is not fully opened, it contacts the end face of the first protrusion or the end face of the second protrusion.
[0020] Optionally, the other end of the second protrusion extends toward the sidewall of the wafer cassette, such that the sidewall of the wafer cassette abuts against the sidewall of the second protrusion; or is spaced apart from the sidewall of the second protrusion.
[0021] When the sidewall of the wafer cassette is spaced from the sidewall of the second protrusion, the distance from the connection point of the second protrusion and the first protrusion to the rotation axis of the shielding member is less than the diameter of the shielding member; so that the shielding member can contact the end face of the first protrusion or the end face of the second protrusion when rotated to any angle.
[0022] Optional, also includes:
[0023] The sensor is located on the bottom wall of the placement cavity;
[0024] When the shielding component is fully open, the wafer cassette does not shift, and the sidewall of the wafer cassette is in contact with the sensor.
[0025] When the shielding element is not fully opened, the wafer cassette shifts, and there is a gap between the sidewall of the wafer cassette and the sensor.
[0026] Optionally, the bottom wall of the placement cavity is provided with a receiving hole, and the sensor is movably disposed in the receiving hole; when the wafer cassette does not shift, the side wall of the wafer cassette contacts the bottom wall of the placement cavity, and the sensor is placed inside the receiving hole.
[0027] Optionally, a control unit is also included, electrically connected to the sensor, for receiving electrical signals from the sensor. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the structure of the wafer cassette when the shielding member is fully opened according to an embodiment of the present invention;
[0029] Figure 2 This is a schematic diagram of the structure of the wafer cassette when the shielding component is not fully opened according to an embodiment of the present invention;
[0030] Figure 3 A top view showing the positional relationship of a wafer cassette placed within a placement cavity, according to an embodiment of the present invention;
[0031] Figure 4 A top view showing another positional relationship of the wafer cassette placed within the placement cavity according to an embodiment of the present invention;
[0032] Figure 5 A top view showing another positional relationship of the wafer cassette placed within the placement cavity according to an embodiment of the present invention;
[0033] Figure 6 A top view showing another positional relationship of the wafer cassette placed within the placement cavity according to an embodiment of the present invention;
[0034] Figure 7 for Figure 2 Enlarged view of section A in the middle.
[0035] Figure label:
[0036] 100, wafer box; 110, shielding component; 200, placement cavity; 210, placement slot; 220, receiving hole; 300, limiting part; 310, limiting protrusion; 311, first protrusion; 312, second protrusion; 400, sensor. Detailed Implementation
[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.
[0038] The following is in conjunction with the appendix Figure 1-7 The specific embodiments of the present invention will be further described in detail below.
[0039] An embodiment of the present invention provides a wafer cassette transfer device, wherein a shielding member 110 is provided on the side wall of the wafer cassette 100. The shielding member 110 is rotatably disposed on the side wall of the wafer cassette 100 and is used to fix the wafer inside the wafer cassette 100. Before placing the wafer into the transfer device, the shielding member 110 needs to be opened so that the subsequent robotic arm will not collide with the shielding member 110.
[0040] The transfer device includes:
[0041] Placement cavity 200 is used to place wafer cassette 100;
[0042] The limiting part 300 is disposed in the placement cavity 200, and the limiting part 300 has a limiting protrusion 310;
[0043] When the wafer cassette 100 is placed in the placement cavity 200 and the shielding member 110 is fully opened, the position of the wafer cassette 100 does not shift, the limiting protrusion 310 is located between the opposite side walls of the wafer cassette 100, and the bottom of the wafer cassette 100 is parallel to the bottom wall of the placement cavity 200.
[0044] When the wafer cassette 100 is placed in the placement cavity 200 and the shielding member 110 is not fully opened, the position of the wafer cassette 100 shifts, the shielding member 110 abuts against the end face of the limiting protrusion 310, and the bottom wall of the wafer cassette 100 is tilted, forming an angle with the bottom wall of the placement cavity 200.
[0045] The transfer device is used to load and transport wafers. Specifically, the wafer cassette 100 is placed in the placement cavity 200 for transfer.
[0046] To ensure that the shielding member 110 is fully open after the wafer cassette 100 is placed in the placement cavity 200, a limiting part 300 is provided inside the placement cavity 200, and the limiting part 300 has a limiting protrusion 310. In some embodiments, the limiting part 300 is detachably provided at the bottom of the placement cavity 200; its detachment method can be snap-fit, bolt fixing, etc., which is not limited here, as long as the position of the limiting part 300 can be adjusted.
[0047] In some specific embodiments, the limiting part 300 is plate-shaped, and the end face of the limiting part 300 is fixedly provided with a limiting protrusion 310. The fixing method can be integral molding, bonding, etc., which are not limited here. The main point is that there will be no relative movement between the limiting protrusion 310 and the limiting part 300.
[0048] Among them, reference Figure 1 After the wafer cassette 100 is transferred into the placement cavity 200, if the shielding member 110 is fully open, the position of the wafer cassette 100 will not shift; there will be no contact between the shielding member 110 and the limiting protrusion 310, while the bottom of the wafer cassette 100 and the bottom wall of the placement cavity 200 are parallel to each other and in contact. Furthermore, when the shielding member 110 is fully open, the limiting protrusion 310 is located between the opposite sidewalls of the wafer cassette 100. Since the shielding member 110 extends from one sidewall towards the opposite sidewall when it is not fully open, the limiting protrusion 310 will contact the wafer cassette when it is not fully open, but will not contact it when it is fully open.
[0049] Reference Figure 2 After the wafer cassette 100 is transferred into the placement cavity 200, if the shielding member 110 is not fully open, the wafer cassette 100 will shift in position within the placement cavity 200 due to the setting of the limiting protrusion 310. That is, when the shielding member 110 is not fully open, the shielding member 110 will contact the end face of the limiting protrusion 310, thereby causing the bottom of the wafer cassette 100 to tilt, and there is an angle between the bottom of the wafer cassette 100 and the bottom wall of the placement cavity 200.
[0050] In some embodiments, refer to Figure 2 and Figure 7To facilitate timely feedback and allow the robotic arm to stop moving promptly when the obstruction 110 is not open, a sensor 400 is also installed on the limiting part 300. When the obstruction 110 is not fully open, the obstruction 110 contacts the end face of the limiting protrusion 310, causing the wafer cassette 100 to tilt. At this time, there is no contact between the wafer cassette 100 and the sensor 400, and the robotic arm stops moving. The specific settings of the sensor 400 will be described later.
[0051] In some embodiments, the bottom wall of the placement cavity 200 is provided with a placement groove 210, which is used to accommodate the limiting part 300 so that the upper end surface of the limiting part 300 is flush with or lower than the bottom wall of the placement cavity 200; the upper end surface of the limiting protrusion 310 is higher than the bottom wall of the placement cavity 200.
[0052] The bottom wall of the placement cavity 200 is provided with a placement groove 210, and the limiting part 300 can be placed in the placement groove 210 so that when the shielding member 110 of the wafer cassette 100 is fully opened, the limiting part 300 will not interfere with the wafer cassette 100.
[0053] In some embodiments, after the limiting part 300 is placed in the placement groove 210, the upper end surface of the limiting part 300 is flush with the bottom wall of the placement cavity 200, and the upper end surface of the limiting protrusion 310 is higher than the bottom wall of the placement cavity 200; when the shielding member 110 of the wafer cassette 100 is fully opened, the limiting part 300 will not interfere with the wafer cassette 100; when the shielding member 110 of the wafer cassette 100 is not fully opened, the shielding member 110 contacts the end surface of the limiting protrusion 310.
[0054] In some embodiments, after the limiting part 300 is placed in the placement groove 210, the upper end surface of the limiting part 300 is lower than the bottom wall of the placement cavity 200, and the upper end surface of the limiting protrusion 310 is higher than the bottom wall of the placement cavity 200; when the shielding member 110 of the wafer cassette 100 is fully opened, the limiting part 300 will not interfere with the wafer cassette 100; when the shielding member 110 of the wafer cassette 100 is not fully opened, the shielding member 110 contacts the end surface of the limiting protrusion 310.
[0055] Since the blocking member 110 can rotate, meaning that the blocking strip has multiple position states when it is not fully open, the limiting protrusion 310 was designed to ensure that the blocking strip can contact the limiting protrusion 310 in each position state when it is not fully open.
[0056] The limiting protrusion 310 includes:
[0057] The first protrusion 311 is provided on the bottom wall of the placement cavity 200 and is spaced from the side wall of the wafer box 100;
[0058] The second protrusion 312 is provided on the bottom wall of the placement cavity 200. One end is connected to the first protrusion 311, and the other end extends toward the side wall of the wafer box 100 so that when the shielding member 110 is not fully opened, the shielding member 110 contacts the end face of the first protrusion 311 or the end face of the second protrusion 312.
[0059] Specifically, when the shielding member 110 on the wafer cassette 100 rotates to be parallel to the side wall of the wafer cassette 100, it is fully open; when the angle between the shielding member 110 on the wafer cassette 100 and the inner side wall of the wafer cassette 100 is less than 90°, it is not fully open. In the case of not being fully open, when the shielding member 110 rotates toward the inside of the wafer cassette 100 to its limit position, there will still be a gap between the end of the shielding member 110 and the inner wall of the wafer cassette 100.
[0060] In some embodiments, refer to Figure 3 The distance between the first protrusion 311 and the side wall of the wafer cassette 100 is greater than the distance between the shielding member 110 and the inner wall of the wafer cassette 100 when the shielding member 110 is in the extreme position; so that the shielding member 110 can still contact the end face of the first protrusion 311 when the shielding member 110 is in the extreme position.
[0061] In some embodiments, one end of the second protrusion 312 is connected to the first protrusion 311, and the other end extends toward the wafer sidewall, so that when the shielding member 110 rotates to the point where the distance between the shielding member 110 and the inner wall of the wafer cassette 100 is less than the distance between the first protrusion 311 and the inner wall of the wafer cassette 100, it can contact the end face of the second protrusion 312.
[0062] This allows the shielding member 110 to contact the end face of the first protrusion 311 or the end face of the second protrusion 312 at any position when it is not fully opened, so that when the shielding member 110 is not fully opened, the position of the wafer cassette 100 in the placement cavity 200 is shifted, and the robotic arm stops moving at this time, thereby reducing the possibility of damage to the wafer or the robotic arm.
[0063] In some embodiments, refer to Figure 4 The distance between the first protrusion 311 and the side wall of the wafer cassette 100 is less than or equal to the width of the shielding member 110, so that when the shielding member 110 is perpendicular to the side wall of the wafer cassette 100, it contacts the end face of the first protrusion 311.
[0064] Since the furthest point of the end of the shielding member 110 from the side wall of the wafer cassette 100 is the distance when the shielding member 110 is perpendicular to the side wall of the wafer cassette 100, in some embodiments, the gap between the first protrusion 311 and the wafer cassette 100 is set to be less than the width of the shielding member 110, or the gap between the first protrusion 311 and the side wall of the wafer cassette 100 is set to be equal to the width of the shielding member 110. This allows the shielding member 110 to still contact the end face of the first protrusion 311 when it is not fully open and is perpendicular to the side wall of the wafer cassette 100.
[0065] In some embodiments, the length of the first protrusion 311 is greater than the width of the blocking member 110, so that when the blocking member 110 is not fully opened, it can be rotated to any angle to contact the end face of the first protrusion 311 or the end face of the second protrusion 312.
[0066] Specifically, the length of the first protrusion 311 is greater than the width of the shield 110. Since there will still be a gap between the end of the shield 110 and the inner wall of the wafer cassette 100 when the shield 110 is rotated to its limit position towards the inside of the wafer cassette 100, when the length of the first protrusion 311 is greater than the width of the shield 110, the shield 110 can contact the end face of the first protrusion 311 or the end face of the second protrusion 312 at any angle when it is not fully opened, so as to ensure that the position of the wafer cassette 100 in the placement cavity 200 will be shifted when the shield 110 is not fully opened.
[0067] In some embodiments, refer to Figure 3 The other end of the second protrusion 312 extends toward the side wall of the wafer cassette 100 and abuts against the side wall of the wafer cassette 100, so that when the shielding member 110 is not fully opened, it contacts the end face of the first protrusion 311 or the end face of the second protrusion 312.
[0068] In some embodiments, one end of the second protrusion 312 is connected to the first protrusion 311, and the other end extends toward the side wall of the wafer cassette 100 and abuts against the side wall of the wafer cassette 100. Since the second protrusion 312 abuts against the side wall of the wafer cassette 100, when the shielding strip is not fully opened, it will contact the end face of the first protrusion 311 or the end face of the second protrusion 312, causing the wafer cassette 100 to tilt. At the same time, the second protrusion 312 abutting against the side wall of the wafer cassette 100 can also play a positioning role for the wafer cassette 100.
[0069] In some embodiments, the other end of the second protrusion 312 extends toward the sidewall of the wafer cassette 100, such that the sidewall of the wafer cassette 100 abuts against the sidewall of the second protrusion 312; or is spaced apart from the sidewall of the second protrusion 312.
[0070] When there is a gap between the sidewall of the wafer cassette 100 and the sidewall of the second protrusion 312, the distance from the connection point of the second protrusion 312 and the first protrusion 311 to the pivot of the shield 110 is less than the diameter of the shield 110; so that the shield 110 can contact the end face of the first protrusion 311 or the end face of the second protrusion 312 when rotated to any angle.
[0071] The second protrusion 312 can not only abut against the side wall of the wafer cassette 100, but also allow the side wall of the wafer cassette 100 to abut against the side wall of the second protrusion 312, or there can be a gap between the side wall of the wafer cassette 100 and the side wall of the second protrusion 312.
[0072] Specifically, refer to Figure 5 When the side wall of the wafer cassette 100 abuts against the side wall of the second protrusion 312, if the interceptor is parallel to the side wall of the wafer cassette 100, after the wafer cassette 100 is placed in the placement cavity 200, the bottom of the interceptor abuts against the end face of the second protrusion 312, and the wafer cassette 100 is still in a positional offset state. It is necessary to further rotate the interceptor so that the interceptor is further rotated toward the outer wall of the wafer cassette 100 before the wafer cassette 100 is placed in the placement cavity 200 without offset. This can further ensure that there is no interference between the shielding member 110 and the robotic arm, and improve the safety of the wafer processing process.
[0073] Reference Figure 6 When there is a gap between the side wall of the wafer cassette 100 and the side wall of the second protrusion 312, the gap between the side wall of the wafer cassette 100 and the side wall of the second protrusion 312 is provided on the basis that the side wall of the wafer cassette 100 and the side wall of the second protrusion 312 abut against each other. The gap between the two is less than or equal to the width of the shielding member 110, so that the shielding member 110 can contact the end face of the second protrusion 312 when it is not fully opened.
[0074] It is worth noting that when there is a gap between the sidewall of the wafer cassette 100 and the sidewall of the second protrusion 312, it is necessary to ensure that the distance from the connection point of the second protrusion 312 and the first protrusion 311 to the pivot of the shield 110 is less than the diameter of the shield 110, so that the shield 110 can contact the end face of the first protrusion 311 or the end face of the second protrusion 312 when rotated to any angle.
[0075] In some embodiments, both the first protrusion 311 and the second protrusion 312 are strip-shaped.
[0076] In some embodiments, the first protrusion 311 and the second protrusion 312 are perpendicular to each other.
[0077] In some embodiments, there is an included angle between the first protrusion 311 and the second protrusion 312.
[0078] In some embodiments, the sensor 400 is disposed on the bottom wall of the placement cavity 200;
[0079] When the shield 110 is fully open, the wafer cassette 100 does not shift, and the sidewall of the wafer cassette 100 is in contact with the sensor 400.
[0080] When the shielding member 110 is not fully opened, the wafer cassette 100 shifts, and there is a gap between the side wall of the wafer cassette 100 and the sensor 400.
[0081] In some embodiments, refer to Figure 2 and Figure 7 In order to prevent the sensor 400 from interfering with the state of the wafer cassette 100, the bottom wall of the placement cavity 200 is provided with a receiving hole 220, and the sensor 400 is movably disposed in the receiving hole 220. When the wafer cassette 100 does not shift, the side wall of the wafer cassette 100 contacts the bottom wall of the placement cavity 200, and the sensor 400 is placed inside the receiving hole 220.
[0082] The sensor 400 can move axially within the receiving hole 220. Specifically, an elastic element is provided within the receiving hole 220. In the initial state, the elastic element pushes the sensor 400, causing part of the sensor 400 to be placed outside the receiving hole 220. When the side wall of the wafer cassette 100 contacts the sensor 400, under the gravity of the wafer cassette 100, the sensor 400 is pressed into the receiving hole 220 by the wafer cassette 100. At this time, the elastic element is compressed, which applies a force to the sensor 400 to move away from the receiving hole 220. Therefore, when the blocking member 110 is fully opened, the bottom of the wafer cassette 100 is parallel to the bottom wall of the placement cavity 200. At this time, the sensor 400 can detect the wafer cassette 100, and the robotic arm can operate normally.
[0083] When the shield 110 is not fully opened, there is a gap between the bottom of the side wall of the wafer box 100 and the sensor 400. At this time, the sensor 400 cannot detect the wafer box 100, and the robotic arm stops moving.
[0084] In some embodiments, sensor 400 is a pressure sensor 400.
[0085] In some embodiments, the elastic element is a spring.
[0086] In some embodiments, the transfer device further includes a control unit electrically connected to the sensor 400 for receiving electrical signals from the sensor 400. The control unit is also electrically connected to the robotic arm, enabling it to control the start and stop of the robotic arm. The transfer device also includes a power supply, control switches, etc., all of which are existing technologies and will not be described in detail here.
[0087] The implementation principle of the wafer cassette 100 transfer device in this application embodiment is as follows: a limiting protrusion 310 is provided in the placement cavity 200. When the shielding member 110 on the wafer cassette 100 is not fully opened, the shielding member 110 contacts the end face of the limiting protrusion 310. At this time, the wafer cassette 100 is tilted in the placement cavity 200, the sensor 400 cannot detect the wafer cassette 100, and the robotic arm will not continue to move. When the shielding member 110 on the wafer cassette 100 is fully opened, the position of the wafer cassette 100 in the placement cavity 200 will not shift. At this time, the bottom of the wafer cassette 100 contacts the sensor 400, the sensor 400 can detect the wafer cassette 100, and the robotic arm can continue to move. This setting effectively improves the problem of collision between the robotic arm and the shielding member 110 caused by the inability to determine whether the shielding member 110 is fully open.
[0088] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.
Claims
1. A transfer device for a wafer cassette, a side wall of the wafer cassette (100) being provided with a rotatable shield (110); characterized in that, The transfer device comprises: a placing cavity (200) for placing the wafer box (100); a limiting part (300) arranged in the placing cavity (200), and the limiting part (300) is provided with a limiting protrusion (310); when the wafer box (100) is placed in the placing cavity (200) and the shielding piece (110) is fully opened, the position of the wafer box (100) does not deviate, the limiting protrusion (310) is located between the opposite side walls of the wafer box (100), and the bottom of the wafer box (100) is parallel to the bottom wall of the placing cavity (200); when the wafer box (100) is placed in the placing cavity (200) and the shielding piece (110) is not fully opened, the position of the wafer box (100) deviates, the shielding piece (110) abuts against the end face of the limiting protrusion (310), and the bottom wall of the wafer box (100) is inclined and has an included angle with the bottom wall of the placing cavity (200).
2. The transfer device of claim 1, wherein, The bottom wall of the placing cavity (200) is provided with a placing groove (210) for accommodating the limiting part (300), so that the upper end face of the limiting part (300) is flush with or lower than the bottom wall of the placing cavity (200); and the upper end face of the limiting protrusion (310) is higher than the bottom wall of the placing cavity (200).
3. The transfer device of claim 1, wherein, The limiting protrusion (310) comprises: a first protruding part (311) arranged on the bottom wall of the placing cavity (200) and having a spacing with the side wall of the wafer box (100); a second protruding part (312) arranged on the bottom wall of the placing cavity (200), one end of which is connected with the first protruding part (311) and the other end of which extends towards the side wall of the wafer box (100), so that when the shielding piece (110) is not fully opened, the shielding piece (110) contacts the end face of the first protruding part (311) or the end face of the second protruding part (312).
4. The transfer device of claim 3, wherein, The spacing between the first protruding part (311) and the side wall of the wafer box (100) is less than or equal to the width of the shielding piece (110), so that when the shielding piece (110) is perpendicular to the side wall of the wafer box (100), the end face of the first protruding part (311) is contacted.
5. The transfer device of claim 3, wherein, The length of the first protruding part (311) is greater than the width of the shielding piece (110), so that when the shielding piece (110) is not fully opened, it can be rotated to any angle to contact the end face of the first protruding part (311) or the end face of the second protruding part (312).
6. The transfer device of claim 3, wherein, The other end of the second protruding part (312) extends towards the side wall of the wafer box (100) and abuts against the side wall of the wafer box (100), so that when the shielding piece (110) is not fully opened, it contacts the end face of the first protruding part (311) or the end face of the second protruding part (312).
7. The transfer device of claim 3, wherein The other end of the second protruding part (312) extends towards the sidewall of the wafer box (100), so that the sidewall of the wafer box (100) abuts against the sidewall of the second protruding part (312); or has a gap with the sidewall of the second protruding part (312); When the sidewall of the wafer box (100) has a gap with the sidewall of the second protruding part (312), the distance from the connection of the second protruding part (312) and the first protruding part (311) to the rotating shaft of the shielding piece (110) is less than the diameter of the shielding piece (110); so that the shielding piece (110) can be in contact with the end surface of the first protruding part (311) or the end surface of the second protruding part (312) at any angle.
8. The transfer device of any of claims 1-7, wherein, Further comprising: a sensor (400) arranged on the bottom wall of the placing cavity (200); When the shielding piece (110) is fully opened, the wafer box (100) does not deviate, and the sidewall of the wafer box (100) is in contact with the sensor (400); When the shielding piece (110) is not fully opened, the wafer box (100) deviates, and the sidewall of the wafer box (100) has a gap with the sensor (400).
9. The transfer device of claim 8, wherein, The bottom wall of the placing cavity (200) is provided with a containing hole (220), and the sensor (400) is movably arranged in the containing hole (220); when the wafer box (100) does not deviate, the sidewall of the wafer box (100) is in contact with the bottom wall of the placing cavity (200), and the sensor (400) is arranged inside the containing hole (220).
10. The transfer device of claim 8, wherein, Further comprising a control machine table electrically connected with the sensor (400) and used for receiving the electrical signal of the sensor (400).