Semiconductor wafer cleaning rack
By designing an adjustable semiconductor wafer cleaning rack, the problem of existing technologies being unable to adapt to wafers of different diameters is solved, realizing the multifunctionality and efficient transfer of the wafer cleaning rack.
Patent Information
- Application Number
- CN202423296404.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing wafer cleaning racks have fixed dimensions, which cannot accommodate wafers of different diameters, making them inconvenient to use and resulting in low wafer transfer efficiency after cleaning.
A semiconductor wafer cleaning rack has been designed, including a support plate, connecting rod, bearing ring, adjustment groove, connector, fastening screw sleeve, adjustment rod and adjustment ring, etc. It can be adjusted to accommodate wafers of different diameters, and the wafers are fixed by clamping and limiting mechanisms, thereby improving the applicability and transfer efficiency of the cleaning rack.
The wafer cleaning rack is adaptable to wafers of different diameters, reducing the risk of loosening and falling off during the cleaning process, and improving the transfer efficiency and storage space utilization of the wafers after cleaning.
Smart Images
Figure CN223979077U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of wafer processing technology, specifically a semiconductor wafer cleaning rack. Background Technology
[0002] A wafer is a circular thin film, mainly made of semiconductor materials, and is a key basic material in the semiconductor industry.
[0003] Wafer cleaning is a critical step in semiconductor manufacturing. In each stage of wafer manufacturing, the wafer surface inevitably becomes contaminated with various pollutants. If these pollutants are not removed, they will have a serious adverse effect on subsequent semiconductor manufacturing processes and the performance of the final device. When using ultrasonic cleaning to clean wafers, the wafers need to be placed on a cleaning rack, and then the cleaning rack is placed in an ultrasonic cleaning tank. However, the existing cleaning racks have fixed dimensions, which are not convenient for placing wafers of different diameters, making them inconvenient to use.
[0004] Therefore, this utility model provides a semiconductor wafer cleaning rack. Utility Model Content
[0005] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.
[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: A semiconductor wafer cleaning rack of this utility model includes a pair of support plates, a connecting rod fixedly connected between the pair of support plates, a plurality of bearing rings fixedly connected to the middle of the connecting rod, two sets of adjustment grooves opened in the middle of the pair of support plates, a connecting head slidably connected to the middle of the adjustment groove, a fastening sleeve threadedly connected to the middle of the connecting head, an adjustment rod installed in the middle of each set of connecting heads, a plurality of adjustment rings rotatably connected to the middle of the adjustment rod, and the plurality of adjustment rings rotatably connected to the two ends of the bearing ring respectively. Through the above structure, the wafer cleaning rack can be adjusted so that the wafer cleaning rack can adapt to wafers of different diameters, and after cleaning the wafers, the cleaning rack can be used as a wafer storage rack, and the cleaned wafers can be transferred in batches, improving the applicability of the device.
[0007] Preferably, a movable rod is slidably connected to the middle of a pair of support plates, and a plurality of first clamping rods are fixedly connected to the top of the movable rod. The first clamping rods are slidably connected to the middle of the connecting rod. A second clamping rod is fixedly connected to the side wall of the bearing ring, and a first spring is fixedly connected to the side wall of the support plate. The other end of the first spring is fixedly connected to the middle of the movable rod. A limiting plate is rotatably connected to the middle of the movable rod. With the above structure, the wafer can be clamped and fixed after it is placed on the cleaning rack, further reducing the possibility of the wafer loosening and falling and being damaged during the movement of the cleaning rack.
[0008] Preferably, the support plate has a first sliding groove in the middle, and a positioning groove in the middle of the first sliding groove. A handle is slidably connected to the middle of a pair of first sliding grooves. The side wall of the support plate is rotatably connected to a limit rod by a torsion spring. Through the above structure, the mobility of the cleaning rack can be improved and the transfer efficiency of the wafer can be improved.
[0009] Preferably, the connector has a second groove in the middle, a second spring is installed in the middle of the second groove, and the adjusting rod is slidably connected to the middle of the second groove. With the above structure, the installation of the wafer can be more convenient, and the adjusting ring can fit more closely with wafers of different diameters, further reducing the occurrence of wafer falling off.
[0010] Preferably, the bottom of the support plate is provided with a pair of slots, and the top of the support plate is fixed with a pair of blocks. With the above structure, multiple cleaning racks can be stacked and stored, improving the utilization rate of storage space and the convenience of using the device.
[0011] Preferably, a pair of rubber pads are fixed to the side wall of the support plate. The rubber pads are arranged around the adjustment groove. Through the above structure, the friction force on the fastening screw sleeve can be increased by the slight deformation of the rubber pads, reducing the occurrence of loosening of the fastening screw sleeve, and thus reducing the occurrence of multiple adjustment rings rotating due to loosening of the fastening screw sleeve.
[0012] Preferably, the bearing ring has multiple drainage holes in the middle, and the multiple drainage holes are evenly distributed in the middle of the bearing ring. With the above structure, the cleaning fluid residue in the groove of the bearing ring can be reduced after the wafer is cleaned, thereby reducing the impact of the cleaning fluid residue on the wafer.
[0013] The beneficial effects of this utility model are:
[0014] 1. The semiconductor wafer cleaning rack of this utility model, through the arrangement of a support plate, connecting rod, bearing ring, adjusting groove, connecting head, fastening screw sleeve, adjusting rod, and adjusting ring, allows for adjustment of the wafer cleaning rack to accommodate wafers of different diameters. After cleaning, the rack can be used as a wafer storage rack, enabling batch transfer of cleaned wafers and improving the applicability of the device.
[0015] 2. The semiconductor wafer cleaning rack described in this utility model, through the setting of a moving rod, a first clamping rod, a second clamping rod, a first spring, and a limiting plate, can clamp and fix the wafer after it is placed on the cleaning rack, further reducing the occurrence of wafer loosening and falling and being damaged during the movement of the cleaning rack. Attached Figure Description
[0016] Figure 1This is a perspective view of the present invention;
[0017] Figure 2 This is a schematic diagram of the support plate in this utility model;
[0018] Figure 3 This is a schematic diagram of the limiting plate in this utility model;
[0019] Figure 4 This is a schematic diagram of the structure of the bearing ring in this utility model;
[0020] Figure 5 This is a schematic diagram of the connector structure in this utility model.
[0021] Explanation of reference numerals in the attached figures:
[0022] 1. Support plate; 12. Connecting rod; 13. Bearing ring; 14. Adjusting groove; 15. Connector; 16. Fastening nut; 17. Adjusting rod; 18. Adjusting ring; 2. Moving rod; 21. First clamping rod; 22. Second clamping rod; 23. First spring; 24. Limiting plate; 3. First sliding groove; 31. Positioning groove; 32. Handle; 33. Limiting rod; 4. Second sliding groove; 41. Second spring; 5. Slot; 51. Block; 6. Rubber pad; 7. Drain hole. Detailed Implementation
[0023] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0024] like Figures 1 to 5As shown in the figure, a semiconductor wafer cleaning rack according to an embodiment of the present invention includes a pair of support plates 1, a connecting rod 12 fixedly connected between the pair of support plates 1, a plurality of bearing rings 13 fixedly connected to the middle of the connecting rod 12, two sets of adjusting grooves 14 opened in the middle of the pair of support plates 1, a connector 15 slidably connected to the middle of the adjusting groove 14, a fastening sleeve 16 threadedly connected to the middle of the connector 15, an adjusting rod 17 installed in the middle of each set of connectors 15, a plurality of adjusting rings 18 rotatably connected to the middle of the adjusting rod 17, and the plurality of adjusting rings 18 rotatably connected to both ends of the bearing ring 13 respectively. During operation, the sliding connector 15 can drive the adjusting rod 17 to move, and the pair of adjusting rings 18 at both ends of the bearing ring 13 rotates according to the diameter of the wafer. Adjust the distance between a pair of adjusting rings 18, and then rotate the fastening screw sleeve 16 to clamp the support plate 1 with the adjusting rod 17, making it difficult for the multiple connectors 15 to continue sliding. After completion, place the wafers to be cleaned into the grooves on the multiple bearing rings 13. At the same time, the pair of adjusting rings 18 at both ends of the bearing rings 13 will limit the wafers, preventing them from falling easily. Then, place the device into the ultrasonic cleaning tank to clean the wafers. Through the above structure, the wafer cleaning rack can be adjusted to accommodate wafers of different diameters. After cleaning the wafers, the cleaning rack can be used as a wafer storage rack, allowing for the batch transfer of cleaned wafers and improving the applicability of the device.
[0025] like Figures 1 to 4 As shown, a movable rod 2 is slidably connected to the middle of a pair of support plates 1. Multiple first clamping rods 21 are fixed to the top of the movable rod 2. The first clamping rods 21 are slidably connected to the middle of the connecting rod 12. A second clamping rod 22 is fixed to the side wall of the bearing ring 13. A first spring 23 is fixed to the side wall of the support plate 1. The other end of the first spring 23 is fixed to the middle of the movable rod 2. A limiting plate 24 is rotatably connected to the middle of the movable rod 2. During operation, before placing multiple wafers onto multiple bearing rings 13, the movable rod 2 is pulled and then the limiting plate 24 is rotated to one side of the support plate 1. At this time, the movable rod 2 is difficult to be stopped by the first spring 22. 3. Pushing, and the multiple first clamping rods 21 will move away from the second clamping rods 22. At this time, the wafer can be conveniently placed in the multiple first sliding grooves 3. Then rotate the limiting plate 24 so that the limiting plate 24 no longer abuts against the side wall of the support plate 1. At this time, the moving rod 2 will slide under the elastic force of the first spring 23. The multiple first clamping rods 21 will cooperate with the second clamping rods 22 to squeeze the middle of the wafer, so that the wafer will not easily fall off the bearing ring 13. Through the above structure, the wafer can be clamped and fixed after being placed on the cleaning rack, further reducing the occurrence of wafer loosening and falling off during the movement of the cleaning rack, which may cause damage.
[0026] like Figures 1 to 2As shown, a first groove 3 is provided in the middle of the support plate 1, and a positioning groove 31 is provided in the middle of the first groove 3. A handle 32 is slidably connected to the middle of a pair of first grooves 3. A limit rod 33 is rotatably connected to the side wall of the support plate 1 through a torsion spring. During operation, when it is necessary to place the wafer on the bearing ring 13, the handle 32 can be slid to one end of the first groove 3, and then the middle of the handle 32 can be hooked by the limit rod 33 to reduce the influence of the handle 32 on the placement of the wafer. After the wafer is placed, the handle 32 is slid to the positioning groove 31, and then the cleaning rack can be easily lifted and moved by holding the handle 32. Through the above structure, the mobility of the cleaning rack can be improved and the transfer efficiency of the wafer can be improved.
[0027] like Figures 1 to 5 As shown, a second groove 4 is provided in the middle of the connector 15, and a second spring 41 is installed in the middle of the second groove 4. The adjusting rod 17 is slidably connected to the middle of the second groove 4. During operation, when the wafer is placed on the bearing ring 13, the edge of the wafer easily comes into contact with the adjusting ring 18. When the adjusting ring 18 is squeezed by the wafer, the adjusting rod 17 slides to allow the adjusting ring 18 to rotate slightly and open, so that the wafer can be more easily installed between a pair of adjusting rings 18. After installation, the adjusting ring 18 will fit against the edge of the wafer under the elastic force of the second spring 41, improving the fixing effect of the wafer. Through the above structure, the installation of the wafer can be more convenient, and the adjusting ring 18 can fit better with wafers of different diameters, further reducing the occurrence of wafer falling off.
[0028] like Figures 1 to 3 As shown, a pair of slots 5 are provided at the bottom of the support plate 1, and a pair of blocks 51 are fixed to the top of the support plate 1. During operation, when storing the cleaned wafers, one cleaning rack can be placed on top of another cleaning rack. Through the combination of the slots 5 and the blocks 51, multiple cleaning racks can be stacked relatively stably. With the above structure, multiple cleaning racks can be stacked and stored, improving the utilization rate of storage space and enhancing the ease of use of the device.
[0029] like Figure 1 As shown, a pair of rubber pads 6 are fixed to the side wall of the support plate 1. The rubber pads 6 are arranged around the adjustment groove 14. Through the above structure, the friction force on the fastening screw sleeve 16 can be increased by the slight deformation of the rubber pads 6, reducing the occurrence of loosening of the fastening screw sleeve 16, and thus reducing the occurrence of multiple adjustment rings 18 rotating due to loosening of the fastening screw sleeve 16.
[0030] like Figure 4As shown, a plurality of drainage holes 7 are provided in the middle of the support ring 13. The plurality of drainage holes 7 are evenly distributed in the middle of the support ring 13. Through the above structure, the cleaning fluid residue in the groove of the support ring 13 can be reduced after the wafer is cleaned, thereby reducing the impact of the cleaning fluid residue on the wafer.
[0031] During operation, the sliding connector 15 can move the adjusting rod 17, causing a pair of adjusting rings 18 at both ends of the bearing ring 13 to rotate. The distance between the pair of adjusting rings 18 is adjusted according to the diameter of the wafer. Then, the fastening sleeve 16 is rotated to clamp the support plate 1 with the adjusting rod 17, making it difficult for the multiple connectors 15 to continue sliding. After completion, the wafer to be cleaned is placed in the grooves on the multiple bearing rings 13. At the same time, the pair of adjusting rings 18 at both ends of the bearing ring 13 will limit the wafer, preventing it from easily falling off. Then, the device is placed... In the ultrasonic cleaning tank, wafers are cleaned. Before placing multiple wafers on multiple support rings 13, the moving rod 2 is pulled and the limiting plate 24 is rotated to one side of the support plate 1. At this time, the moving rod 2 is difficult to push by the first spring 23, and the multiple first clamping rods 21 will move away from the second clamping rods 22. At this time, the wafers can be easily placed in multiple first sliding grooves 3. Then, the limiting plate 24 is rotated so that it no longer abuts against the side wall of the support plate 1. At this time, the moving rod 2 will slide under the elastic force of the first spring 23, and the multiple first clamping rods... 21 will work with the second clamping rod 22 to compress the center of the wafer, thus preventing the wafer from easily falling off the support ring 13. When it is necessary to place the wafer on the support ring 13, the handle 32 can be slid to one end of the first slide groove 3, and then the center of the handle 32 can be hooked by the limiting rod 33 to reduce the impact of the handle 32 on the placement of the wafer. After the wafer is placed, the handle 32 is slid to the positioning groove 31, and then the cleaning rack can be easily lifted and moved by holding the handle 32. When placing the wafer on the support ring 13, the edges of the wafer are easily... When the adjusting ring 18 is pressed by the wafer, the adjusting ring 18 can be slightly rotated and opened by the sliding of the adjusting rod 17, so that the wafer can be more easily installed between a pair of adjusting rings 18. After installation, the adjusting ring 18 will fit against the edge of the wafer under the elastic force of the second spring 41, improving the fixing effect of the wafer. When storing the cleaned wafer, one cleaning rack can be placed on top of another cleaning rack. Through the combination of the slot 5 and the block 51, multiple cleaning racks can be stacked more stably.
[0032] The above embodiments merely illustrate specific implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model.
Claims
1. A semiconductor wafer cleaning rack comprising a pair of support plates (1), characterised in that: A pair of the support plate (1) between the fixed connection rod (12), the middle part of the connecting rod (12) is fixed with a plurality of bearing ring (13), a pair of the support plate (1) in the middle part of two groups of adjusting groove (14), the middle part of the adjusting groove (14) is connected with the connecting head (15), the middle part of the connecting head (15) is connected with the fastening sleeve (16), each group of the connecting head (15) in the middle part is provided with adjusting rod (17), the middle part of the adjusting rod (17) is rotatably connected with a plurality of adjusting ring (18), a plurality of adjusting ring (18) are rotatably connected to the two ends of the bearing ring (13).
2. A semiconductor wafer cleaning rack as defined in claim 1, wherein: The middle part of a pair of the support plate (1) is connected with the moving rod (2), the top of the moving rod (2) is fixed with a plurality of first clamping rod (21), the first clamping rod (21) is connected to the middle part of the connecting rod (12), the side wall of the bearing ring (13) is fixed with the second clamping rod (22), the side wall of the support plate (1) is fixed with the first spring (23), the other end of the first spring (23) is fixed to the middle part of the moving rod (2), the middle part of the moving rod (2) is rotatably connected with the limiting plate (24).
3. A semiconductor wafer cleaning rack as defined in claim 1 wherein: The middle part of the support plate (1) is provided with a first sliding groove (3), the middle part of the first sliding groove (3) is provided with a positioning groove (31), a pair of the first sliding groove (3) is connected with the handle (32), the side wall of the support plate (1) is rotatably connected with the limiting rod (33) through the torsion spring.
4. The semiconductor wafer cleaning rack of claim 1 wherein: The middle part of the connecting head (15) is provided with a second sliding groove (4), the middle part of the second sliding groove (4) is provided with a second spring (41), the adjusting rod (17) is connected to the middle part of the second sliding groove (4).
5. The semiconductor wafer cleaning rack of claim 1 wherein: The bottom of the support plate (1) is provided with a pair of clamping grooves (5), the top of the support plate (1) is fixed with a pair of clamping blocks (51).
6. A semiconductor wafer cleaning rack as defined in claim 1, wherein: The side wall of the support plate (1) is fixed with a pair of rubber pads (6), the rubber pad (6) is arranged around the adjusting groove (14).
7. The semiconductor wafer cleaning rack of claim 1 wherein: The middle part of the bearing ring (13) is provided with a plurality of drainage holes (7), a plurality of drainage holes (7) are evenly distributed in the middle part of the bearing ring (13).