Wafer stage

By designing a movable second gripper and an actuation mechanism, the problem of wafer edge wear during the clamping process of existing wafer stages is solved, achieving damage-free wafer positioning and protection.

CN223979080UActive Publication Date: 2026-03-06DELTA ELECTRONICS INC(CN)
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-14
Publication Date
2026-03-06

AI Technical Summary

Technical Problem

Existing wafer carriers are prone to abrading the edges of the wafer during clamping, resulting in surface damage.

Method used

A wafer stage was designed, which employs multiple positioning arms. Each positioning arm includes a first gripper and a second gripper. The second gripper is movably configured and synchronously linked by an actuation mechanism to avoid contact between the second gripper and the wafer surface during clamping. Instead, it only contacts the bearing slope at the wafer edge, thereby reducing wear.

Benefits of technology

It effectively avoids wear on the wafer edges, improves wafer protection, and extends the lifespan of the wafer stage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a wafer carrying table. The wafer carrying table comprises a body, a plurality of positioning arms and an actuating mechanism, the positioning arms are arranged on the body and are annularly arranged, each positioning arm comprises a first clamping jaw and a second clamping jaw which are arranged in parallel, the first clamping jaw is fixedly arranged on the body, the second clamping jaw is movably arranged relative to the body, the second clamping jaw is movably arranged in the radial direction of the body, and the first clamping jaw is provided with a bearing slope surface; the bearing slope face is arranged upwards and is slightly inclined towards the arrangement center of the second clamping jaws relative to the horizontal plane, each second clamping jaw is provided with a vertical face, the vertical face is arranged towards the body, at least one part of the vertical face is higher than the bearing slope face, and the second clamping jaws are movably arranged in the radial direction of the arrangement of the second clamping jaws. The actuating mechanism is connected with the second clamping jaws so that the second clamping jaws can be in synchronous linkage.
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Description

Technical Field

[0001] This application relates to wafer process equipment, and more particularly to a wafer stage for clamping wafers. Background Technology

[0002] Wafer stages are used to hold wafers and are commonly used in wafer processing or wafer inspection. Modern wafer stages often use jaws to hold the edge of the wafer for positioning. Generally, one edge of the wafer is first supported by the jaws, which then close to clamp the wafer at its edge. This structure, however, is prone to wear and tear on the wafer due to friction between the jaws and the wafer's surface or edge during movement.

[0003] In view of this, the applicant has devoted himself to studying the aforementioned prior art and applying theoretical principles to try his best to solve the above-mentioned problems, which has become the target of the applicant's improvement. Utility Model Content

[0004] This application provides a wafer stage for clamping wafers.

[0005] This application provides a wafer stage, comprising: a body; a plurality of positioning arms disposed on the body and arranged in a ring, each positioning arm including a first gripper and a second gripper arranged in parallel, the first gripper being fixed to the body, the second gripper being movably configured relative to the body, the second gripper being movably configured radially along the body, the first gripper having a bearing slope, the bearing slope being configured upward and slightly inclined relative to a horizontal plane toward the center of the plurality of second grippers, the second gripper having a vertical surface, the vertical surface being configured toward the body, and at least a portion of the vertical surface being higher than the bearing slope, each of the second grippers being movably configured radially along the arrangement of the plurality of second grippers; and a linkage mechanism, respectively connecting each of the second grippers to cause the plurality of second grippers to move synchronously.

[0006] In one embodiment of this application, in each positioning arm, the first gripper and the second gripper are arranged side by side.

[0007] In one embodiment of this application, in each positioning arm, the first gripper and the second gripper are arranged side by side, one above the other.

[0008] In one embodiment of this application, the actuation mechanism includes a rotary disk and a plurality of links corresponding to each positioning arm. The plurality of links are respectively connected between each corresponding second gripper and the rotary disk, and the plurality of second grippers can be synchronously translated by the rotation of the rotary disk.

[0009] In one embodiment of this application, a plurality of slide rails corresponding to each second gripper are provided on the main body, and the plurality of second grippers are respectively disposed on each corresponding slide rail.

[0010] In one embodiment of this application, a plurality of the slide rails are arranged radially.

[0011] In one embodiment of this application, the actuation mechanism includes an actuation component, and the actuation component is connected to one of the plurality of second grippers to drive the second grippers to translate.

[0012] In one embodiment of this application, the actuation mechanism includes an actuation component, and the actuation component is connected to one of the plurality of second grippers.

[0013] In one embodiment of this application, in each positioning arm, a second gripper is disposed on a first gripper.

[0014] In one embodiment of this application, the actuation mechanism includes a plurality of actuation components corresponding to each positioning arm, and the plurality of actuation mechanisms are respectively disposed in each first gripper and respectively connected to each corresponding second gripper.

[0015] When the wafer stage of this application is used, the periphery of the wafer is supported on multiple positioning arms and laid flat. The wafer only partially contacts the supporting slope at its edge to avoid contact with the wafer surface. When the wafer is clamped by the positioning arms, during the clamping process, the moving second jaw separates from the first jaw supporting the wafer, so the clamping action does not abrade the edge of the wafer. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of a wafer stage according to the first embodiment of this application.

[0017] Figure 2 This is a three-dimensional schematic diagram of the positioning arm of the wafer stage according to the first embodiment of this application.

[0018] Figure 3 This is a schematic diagram of the wafer stage in use according to the first embodiment of this application.

[0019] Figure 4 yes Figure 3 The middle frame shows a magnified view of a portion of area 4.

[0020] Figure 5 This is a side view of the wafer stage in use according to the first embodiment of this application.

[0021] Figure 6 yes Figure 5 The middle frame shows a magnified view of a portion of area 6.

[0022] Figure 7 This is a top view of the wafer stage in use according to the first embodiment of this application.

[0023] Figure 8 This is a schematic diagram of another usage state of the wafer stage according to the first embodiment of this application.

[0024] Figure 9 yes Figure 8 The middle frame shows a magnified view of a portion of area 9.

[0025] Figure 10 This is a top view of another usage state of the wafer stage according to the first embodiment of this application.

[0026] Figure 11 This is a side view of the wafer stage in another usage state according to the first embodiment of this application.

[0027] Figure 12 This is a three-dimensional schematic diagram of the wafer stage in use according to the second embodiment of this application.

[0028] Figure 13 This is a three-dimensional schematic diagram of the positioning arm of the wafer stage according to the second embodiment of this application.

[0029] Explanation of reference numerals in the attached figures

[0030] 100: Ontology,

[0031] 120: Slide rail,

[0032] 200: Positioning arm,

[0033] 210: First gripper,

[0034] 211: Bearing slope,

[0035] 220: Second gripper,

[0036] 221: Facade

[0037] 230: Second gripper,

[0038] 231: Facade,

[0039] 300: Actuation mechanism,

[0040] 310: Rotating disk

[0041] 320: Linkage,

[0042] 321: Rods,

[0043] 322: Terminal components

[0044] 331: Reset component

[0045] 332, 333: Actuation components. Detailed Implementation

[0046] In the description of this application, it should be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0047] Unless otherwise defined, terms such as "substantially" and "approximately" are used to describe and narrate small changes. When used in connection with an event or situation, these terms may include the exact moment the event or situation occurred, or an approximate point in time. For example, when used in connection with a numerical value, these terms may include a range of variation less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0048] The detailed description and technical content of this application will be explained in conjunction with the accompanying drawings. However, the accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application.

[0049] Figure 1 This is a three-dimensional schematic diagram of a wafer stage according to the first embodiment of this application. (See attached diagram) Figure 1 The first embodiment of this application provides a wafer stage, which includes a body 100, a plurality of positioning arms 200, and a paving mechanism 300. The positioning arms 200 are disposed on the body 100 and arranged in a ring. In this embodiment, the body 100 is a cylindrical base to facilitate the ring arrangement of the positioning arms 200, but the disclosure does not limit the form of the body 100. In this embodiment, the positioning arms 200 are arranged in a ring along the periphery of the body 100 relative to the center of the body 100. In this embodiment, three positioning arms 200 are configured, but this application does not limit the number of positioning arms 200.

[0050] Figure 2 This is a perspective view of the positioning arm 200 of the wafer stage according to the first embodiment of this application. (See attached image) Figure 1 and Figure 2Each positioning arm 200 includes a first gripper 210 and a second gripper 220. In each positioning arm 200, the first gripper 210 and the second gripper 220 are disposed on the body and arranged side-by-side. In this embodiment, the first gripper 210 and the second gripper 220 are arranged side-by-side, but this application is not limited to this; for example, the first gripper 210 and the second gripper 220 may also be arranged vertically. In this embodiment, the first gripper 210 is fixed to the body 100, while the second gripper 220 is movably disposed on the body 100. Specifically, the second gripper 220 is movably disposed along the radial direction of the body 100.

[0051] See Figure 2 The first gripper 210 has a bearing slope 211 and the second gripper 220 has a vertical surface 221. The bearing slope 211 is arranged at an upward inclination, and at least a portion of the vertical surface 221 is higher than the bearing slope 211. (See also...) Figure 1 and Figure 2 In this embodiment, the bearing slope 211 is arranged at a slight inclination relative to the horizontal plane toward the center of the arrangement of the plurality of second grippers 220 (i.e., the center of the body 100), while the vertical surface 221 is arranged toward the body 100. The actuation mechanism 300 is connected to each of the second grippers 220 to enable the plurality of second grippers 220 to move synchronously.

[0052] See Figure 1 and Figure 2 In this embodiment, the actuation mechanism 300 includes a rotating disk 310 and a plurality of connecting rods 320. The rotating disk 310 is pivotally mounted at the center of the body 100. The plurality of connecting rods 320 are arranged around the rotating disk 310 corresponding to each positioning arm 200. Each connecting rod 320 is connected between the corresponding second gripper 220 and the rotating disk 310. Specifically, each connecting rod 320 forms a linkage cam structure by pivotally connecting one end to the edge of the rotating disk 310. A reset component, such as a spring, can be provided at the edge of the rotating disk 310. The reset component can define the rotating disk 310 in a predetermined position when the positioning arm 200 is not driven. In this embodiment, when the rotating disk 310 is located as shown in the figure, the actuation mechanism 300 includes a rotating disk 310 and a plurality of connecting rods 320. Figure 1 When the predetermined position is reached, the second gripper 220... Figure 2The lever 320 opens outwards as shown. Each link 320 is pivotally connected at its other end to the corresponding second gripper 220. Therefore, the multiple second grippers 220 can be synchronously translated in conjunction with the rotation of the rotating disk 310. Multiple slide rails 120 corresponding to each second gripper 220 are provided on the body 100. These slide rails 120 are arranged radially along the radial direction of the body 100, and the multiple second grippers 220 are respectively disposed on their respective slide rails 120, thereby defining the translational stroke of the multiple second grippers 220. Specifically, the multiple second grippers 220 synchronously move radially inwards or outwards relative to the center of the body 100.

[0053] In this embodiment, each link 320 includes a rod 321 and two end pieces 322. The two end pieces 322 are respectively used to pivotally connect the rotating disk 310 and the second gripper 220. Each end piece 322 is screwed to the two ends of the rod 321 along the longitudinal direction of the rod 321. Therefore, by adjusting the depth of each end piece 322 screwed into the rod 321, the overall length of the link 320 can be adjusted, thereby adjusting the travel length of the second gripper 220.

[0054] See Figure 1 and Figure 2 In this embodiment, the actuation mechanism 300 further includes an actuation component for linear movement. This application does not limit the form of the actuation component. For example, the actuation component can be a linear actuator (electric cylinder) or a pneumatic cylinder, etc., and the actuation component is connected to one of the plurality of second grippers 220 to drive the second gripper 220 to translate. However, this application is not limited to this. For example, the actuation component can also be connected to the rotary disk 310.

[0055] Figure 3 This is a schematic diagram of the wafer stage in use according to the first embodiment of this application, with the second gripper 220 opening outwards. Figure 4 yes Figure 3 The middle frame shows a magnified view of area 4. (See also...) Figures 3 to 4 When the wafer stage of this application is used, the periphery of the wafer is supported on multiple positioning arms 200 and laid flat.

[0056] Figure 5 This is a side view of the wafer stage in use according to the first embodiment of this application, with the second gripper 220 open outwards. Figure 6 yes Figure 5 The middle frame shows a magnified view of a portion of area 6. Figure 7 This is a top view of the wafer stage in use according to the first embodiment of this application, with the second gripper 220 open outwards. (See also...) Figures 5 to 7Specifically, the periphery of the wafer rests on the bearing slope 211 of the first gripper 210 without contacting the second gripper 220. Because the wafer is laid flat, it only partially contacts the bearing slope 211 at its edge, thereby preventing the positioning arm 200 from contacting the wafer surface. Multiple second grippers 220 can be driven to move radially synchronously relative to the center of the body 100 via an actuation assembly.

[0057] Figure 8 This is a schematic diagram of another usage state of the wafer stage according to the first embodiment of this application, with the second gripper 220 clamping inward. Figure 9 yes Figure 8 The middle frame shows a magnified view of a portion of area 9. Figure 10 This is a top view of another usage state of the wafer stage according to the first embodiment of this application, with the second gripper 220 clamping inward. Figure 11 This is a side view of the wafer stage in another usage state according to the first embodiment of this application, with the second gripper 220 clamping inward. (See also...) Figures 8 to 11 When the positioning arm 200 clamps the wafer, the actuation component drives multiple second grippers 220 to move radially synchronously relative to the center of the body 100 to the edge of the wafer. During the clamping process of the positioning arm 200, because the moving second grippers 220 separate from the first gripper 210 carrying the wafer, the clamping action will not wear down the edge of the wafer.

[0058] Figure 12 This is a perspective view of another embodiment of the positioning arm 200 of the wafer stage according to the second embodiment of this application. Figure 13 This is a perspective view of the positioning arm 200 of the wafer stage according to the second embodiment of this application. (See attached diagram) Figures 12 to 13 The wafer stage of the second embodiment of this application has the same body 100 as the first embodiment. The difference between this embodiment and the first embodiment lies in the construction of the positioning arm 200 and the actuation mechanism 300. In the second embodiment of this application, three positioning arms 200 with the same structure are also configured, but this application does not limit the number of them.

[0059] The following text uses one of the positioning arms, 200, as an example for illustration. (See attached text.) Figure 13 In each positioning arm 200, the positioning arm 200 includes a first gripper 210 and a second gripper 230. The first gripper 210 is fixed to the body 100 as in the first embodiment. The difference between this embodiment and the first embodiment is that the second gripper 230 is movably disposed on the first gripper 210.

[0060] Specifically, the first gripper 210 has a bearing slope 211 and the second gripper 220 has a vertical surface 231. The bearing slope 211 is arranged at an upward inclination, and at least a portion of the vertical surface 231 is higher than the bearing slope 211. See also Figure 1 and Figure 2 In this embodiment, the bearing slope 211 is slightly inclined relative to the horizontal plane toward the center of the arrangement of the plurality of second grippers 220 (i.e., the center of the body 100), while the vertical surface 231 is arranged toward the body 100. The actuation mechanism 300 is connected to each of the second grippers 220 to enable the plurality of second grippers 220 to move synchronously.

[0061] In addition, in this embodiment, the actuation mechanism 300 includes a plurality of actuation components 333 corresponding to each positioning arm 200. The following description uses one of the positioning arms 200 as an example. The plurality of actuation components 333 are respectively disposed on each of the first grippers 210 and are respectively connected to the corresponding second grippers 230. The actuation components 333 have the same structure; in this embodiment, the description uses one actuation component 333 in conjunction with the corresponding positioning arm 200 as an example. In this embodiment, the actuation component 333 can be a linear actuator (electric cylinder), used to linearly move the second gripper 230 corresponding to the positioning arm 200. Furthermore, the actuation directions of the plurality of actuation components 333 can be arranged radially relative to the center of the body 100, and the plurality of actuation components 333 can drive the plurality of second grippers 230 to move radially inward or outward synchronously relative to the center of the body 100.

[0062] Compared to the first embodiment which uses a single actuation component 332 to drive multiple second grippers 220, the structure of this embodiment does not require the linkage 320 and cam structure used for linkage as in the first embodiment. Each actuation component 333 in this embodiment can directly define the linear actuation stroke of the corresponding second gripper 230, so it is not necessary to set a slide rail 120 to guide each second gripper 220 to define the linear actuation stroke of each second gripper 220 as in the first embodiment.

[0063] The above description is merely a preferred embodiment of this application and is not intended to limit the patent scope of this application. Other equivalent variations that utilize the patent spirit of this application should all fall within the patent scope of this application.

Claims

1. A wafer stage, wherein, Comprising: a body; a plurality of positioning arms disposed on the body and arranged in a circle, each of the positioning arms comprising a first jaw and a second jaw arranged side by side, the first jaw being fixedly arranged on the body, the second jaw being movably arranged relative to the body, the second jaw being movably arranged along a radial direction of the body, the first jaw having a load bearing slope surface arranged upwardly and slightly inclined relative to a horizontal plane toward a center of arrangement of the plurality of second jaws, the second jaw having a vertical surface arranged toward the body, at least a portion of the vertical surface being higher than the load bearing slope surface, each of the second jaws being movably arranged along a radial direction of the plurality of second jaws, respectively; and an actuating mechanism connected to each of the second jaws to synchronously move the plurality of second jaws.

2. The wafer stage of claim 1, wherein, In each of the positioning arms, the first jaw and the second jaw are arranged side by side.

3. The wafer stage of claim 1, wherein, In each of the positioning arms, the first jaw and the second jaw are arranged vertically.

4. The wafer stage of claim 1, wherein, The actuating mechanism comprises a rotating disc and a plurality of connecting rods corresponding to each of the positioning arms, each of the connecting rods being connected between a corresponding one of the second jaws and the rotating disc, the plurality of second jaws being capable of being synchronously moved by a rotating action of the rotating disc.

5. The wafer stage of claim 4, wherein, A plurality of sliding rails corresponding to each of the second jaws are disposed on the body, and each of the second jaws is disposed on a corresponding one of the sliding rails.

6. The wafer stage of claim 5, wherein, The plurality of sliding rails are arranged in a radial manner.

7. The wafer stage of claim 4, wherein, The actuating mechanism comprises an actuating assembly, and the actuating assembly is connected to one of the second jaws to drive the second jaw to move.

8. The wafer stage of claim 4, wherein, The actuating mechanism comprises an actuating assembly, and the actuating assembly is connected to one of the second jaws.

9. The wafer stage of claim 1, wherein, In each of the positioning arms, the second jaw is disposed on the first jaw.

10. The wafer stage of claim 9, wherein, The actuating mechanism comprises a plurality of actuating assemblies corresponding to each of the positioning arms, each of the actuating assemblies being disposed on a corresponding one of the first jaws, and each of the actuating assemblies being connected to a corresponding one of the second jaws.