Ejector pin cap, ejector pin system and patch packaging equipment

Abstract

The utility model discloses an ejector pin cap, an ejector pin system and patch packaging equipment, and relates to the technical field of semiconductor equipment. The ejector pin cap comprises an ejector pin cap body, an ejector pin hole, a vacuum hole and a material reducing groove are formed in the ejector pin cap body, the ejector pin hole is located in the middle of the ejector pin cap body, the vacuum hole is formed in the outer side of the ejector pin hole, and the material reducing groove is formed in the outer side of the vacuum hole. And the material reducing grooves are distributed along the edge of the ejector pin cap body. According to the ejector pin cap, the ejector pin system and the patch packaging equipment, the separation angle between the chip and the blue film is increased, so that the aim of separating the chip from the blue film can be achieved under the condition that the impact of the ejector pin on the chip is small, and meanwhile, the chip can be prevented from being broken.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a pin cap, a pin system, and a surface mount packaging device. Background Technology

[0002] With the rapid development of the semiconductor industry, surface mount packaging equipment commonly uses a method where a ejector pin lifts the blue film to separate the chip from the blue film via a ejector pin. The blue film around the ejector pin is then adsorbed through a vacuum hole in the pin cap, thus achieving separation. If the ejector pin speed is too low or the lifting force is too small, the separation angle between the chip and the blue film will be too small, making separation difficult. If the ejector pin speed is too high or the lifting force is too large, the impact on the chip increases, which can easily lead to chip breakage during separation. Utility Model Content

[0003] The purpose of this application is to provide a pin cap, a pin system, and a surface mount packaging device, which increases the separation angle between the chip and the blue film, thereby ensuring the separation of the chip and the blue film with less impact from the pin, while also avoiding chip breakage.

[0004] The embodiments of this application are implemented as follows:

[0005] A first aspect of this application provides a pin cap, including a pin cap body. The pin cap body has a pin hole, a vacuum hole, and a subtractive material groove. The pin hole is located in the middle of the pin cap body, the vacuum hole is located outside the pin hole, and the subtractive material groove is located outside the vacuum hole, with the subtractive material groove distributed along the edge of the pin cap body. This pin cap increases the separation angle between the chip and the blue film, thereby ensuring the separation of the chip and the blue film with minimal impact from the pin, while also preventing chip breakage.

[0006] In one possible implementation, the number of pin holes is multiple, and the multiple pin holes are distributed in an array.

[0007] In one possible implementation, the number of pin holes is multiple, and the multiple pin holes are radially distributed.

[0008] In one possible implementation, the number of vacuum holes is multiple, and the multiple vacuum holes are arranged in a ring around the outside of the ejector pin hole.

[0009] As one possible implementation, the plurality of vacuum holes are distributed at equal intervals.

[0010] As one possible implementation, the projected shape of the subtractive groove is adapted to the projected shape of the pin cap body.

[0011] As one possible implementation, the projected shape of the ejector pin body is circular, and the projected shape of the subtractive material groove is annular; or, the projected shape of the ejector pin body is square, and the projected shape of the subtractive material groove is U-shaped.

[0012] As one possible implementation, the width of the subtractive material groove is smaller than the diameter of the vacuum hole.

[0013] A second aspect of this application provides a ejector pin system, including the ejector pin cap described above. This ejector pin cap increases the separation angle between the chip and the blue film, thereby ensuring the separation of the chip and the blue film with minimal impact from the ejector pin, while also preventing chip breakage.

[0014] A third aspect of this application provides a surface mount packaging apparatus, including the aforementioned ejector pin system. This ejector pin cap increases the separation angle between the chip and the blue film, thereby ensuring the separation of the chip and the blue film with minimal impact from the ejector pin, while also preventing chip breakage.

[0015] The beneficial effects of the embodiments of this application include:

[0016] The ejector pin cap includes an ejector pin cap body, which has an ejector pin hole, a vacuum hole, and a subtractive material groove. The ejector pin hole is located in the middle of the ejector pin cap body, the vacuum hole is located outside the ejector pin hole, and the subtractive material groove is located outside the vacuum hole, with the subtractive material groove distributed along the edge of the ejector pin cap body. The ejector pin hole being located in the middle allows the ejector pin to apply force accurately. Combined with the negative pressure adsorption effect generated by the vacuum hole, this makes the force on the chip and the blue film more uniform and stable during separation, increasing the separation angle and allowing the chip to detach from the blue film at a more favorable angle, reducing adhesion and tearing, and improving separation efficiency and success rate. Furthermore, due to the presence of the subtractive material groove, the blue film cannot tightly adhere to the chip edge over a large area in the area where the subtractive material groove is located, thus effectively reducing the contact area between the chip and the blue film. As the ejector pin moves further, the blue film, under the negative pressure adsorption effect, is more prone to deformation and displacement near the subtractive material groove due to the reduced contact area with the chip. Compared to traditional pin caps without grooves, the blue film is more easily pulled up in the area where the subtractive material grooves are located, thus creating a larger angle difference between the chip edge and the blue film, increasing the separation angle between the blue film and the chip edge. This larger separation angle allows for more reasonable force distribution during chip and blue film separation, reducing the risk of chip damage caused by adhesion and small-angle tearing, and facilitating efficient and safe separation of the chip and blue film. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is one of the structural schematic diagrams of the thimble cap provided in the embodiments of this application;

[0019] Figure 2 This is a second schematic diagram of the structure of the pin cap provided in the embodiments of this application;

[0020] Figure 3 This is one of the structural schematic diagrams of the ejector pin system provided in the embodiments of this application;

[0021] Figure 4 This is a second schematic diagram of the structure of the ejector pin system provided in the embodiments of this application.

[0022] Icons: 100-Ejector cap; 10-Ejector cap body; 11-Ejector hole; 12-Vacuum hole; 13-Subtractive groove; 200-Ejector system; 210-Housing shell; 220-Lifting platform; 230-Ejector; 300-Blue film; 400-Chip. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0024] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "horizontal," "vertical," etc., do not indicate that the component must be absolutely horizontal or suspended, but can be slightly tilted. The terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] Please refer to the reference. Figure 1 and Figure 2 This application provides a pin cap 100, including a pin cap body 10. The pin cap body 10 has a pin hole 11, a vacuum hole 12, and a subtractive material groove 13. The pin hole 11 is located in the middle of the pin cap body 10, the vacuum hole 12 is located outside the pin hole 11, and the subtractive material groove 13 is located outside the vacuum hole 12 and distributed along the edge of the pin cap body 10. This pin cap 100 increases the separation angle between the chip 400 and the blue film 300, thereby ensuring the separation of the chip 400 and the blue film 300 with less impact from the pin 230 on the chip 400, while also preventing the chip 400 from breaking.

[0027] It should be noted that, as Figure 1 and Figure 2As shown, in this embodiment, the ejector cap 100 provided by this application includes an ejector cap body 10, on which an ejector hole 11 and a vacuum hole 12 are provided. The ejector hole 11 is located in the middle of the ejector cap body 10. The main function of the ejector hole 11 is to provide a precise working position for the ejector 230, so that the ejector 230 can accurately act on the chip 400, ensuring that the force is concentrated on a specific part of the chip 400, so as to achieve the separation of the chip 400 and the blue film 300. The vacuum hole 12 is located on the outside of the ejector hole 11. The main function of the vacuum hole 12 is to connect a vacuum device through the vacuum hole 12 during the separation process of the chip 400 and the blue film 300, generate negative pressure to adsorb the blue film 300, thereby assisting the separation of the chip 400 and the blue film 300, making the separation process more stable and controllable.

[0028] The ejector pin hole 11 is located in the middle, which allows the ejector pin 230 to apply force accurately. Combined with the negative pressure adsorption effect generated by the vacuum hole 12, the force on the chip 400 and the blue film 300 is more uniform and stable during separation, increasing the separation angle and allowing the chip 400 to detach from the blue film 300 at a more favorable angle, reducing adhesion and tearing, and improving separation efficiency and success rate.

[0029] Unlike existing technologies, the ejector cap 100 provided in this application also has a subtractive material groove 13 on the ejector cap body 10, such as... Figure 1 and Figure 2 As shown, in this embodiment, the subtractive material groove 13 is disposed on the outside of the vacuum hole 12 and distributed along the edge of the ejector cap body 10. When the ejector cap 100 acts on the chip 400 and the blue film 300, a relatively weak structure is formed in the area where the subtractive material groove 13 is located. During the process of the ejector pin 230 applying a lifting force to separate the chip 400 and the blue film 300, due to the presence of the subtractive material groove 13, the contact between the edge portion of the blue film 300 and the chip 400 is not continuous and complete. In this area, the blue film 300 cannot adhere tightly to the edge of the chip 400 over a large area as it would without the subtractive material groove 13, thereby effectively reducing the contact area between the chip 400 and the blue film 300.

[0030] As the ejector pin 230 moves further, the blue film 300, under negative pressure adsorption, is more prone to deformation and displacement near the subtractive molding groove 13 due to the reduced contact area with the chip 400. Compared to the traditional grooveless case, the blue film 300 is more easily pulled up in the subtractive molding groove 13 area, thus creating a larger angle difference between the chip 400 edge and the blue film 300, increasing the separation angle between them. This larger separation angle allows for more reasonable force distribution during separation of the chip 400 and the blue film 300, reducing the risk of chip 400 damage due to adhesion and small-angle tearing, and facilitating efficient and safe separation of the chip 400 and the blue film 300.

[0031] As one possible implementation method, such as Figure 1 and Figure 2 As shown, in this embodiment, there are multiple pin holes 11, and the multiple pin holes 11 are arranged in an array.

[0032] It should be noted that, as Figure 1 and Figure 2 As shown, in this embodiment, the number of pin holes 11 on the pin cap body 10 is multiple, and these pin holes 11 are distributed in an array or an approximately arrayed distribution. This array distribution means that the pin holes 11 are arranged in an orderly manner on the pin cap body 10 according to a certain pattern, such as the common neat row and column arrangement.

[0033] Multiple arrayed pin holes 11 allow the pins 230 to simultaneously apply force to the chip 400 from multiple positions. Compared to a single pin hole 11, this design distributes the lifting force applied by the pins 230 evenly across all parts of the chip 400. During the separation process between the chip 400 and the blue film 300, the force on the surface of the chip 400 is more even, avoiding damage caused by excessive local stress due to single-point or uneven force application, thus greatly improving the safety of the chip 400 during the separation operation.

[0034] Because multiple ejector pins 230 act on the chip 400 from different positions, the attitude of the chip 400 during the separation process can be controlled more effectively. When the chip 400 is subjected to a relatively balanced lifting force from multiple directions, its movement on the blue film 300 is more stable, and it is less prone to instability such as deviation or tilting. This makes the separation process between the chip 400 and the blue film 300 more stable, which is conducive to improving the success rate and accuracy of the separation operation.

[0035] Furthermore, the array of pin holes 11 provides greater versatility in practical applications. For chips 400 of different sizes, pin holes 11 can be flexibly selected to mount pins 230 based on the size and shape of the chip 400. For example, smaller chips 400 can use the pin holes 11 in the center of the array, while larger chips 400 can utilize more pin holes 11 to ensure uniform force application and stable separation, meeting the needs of diverse chip 400 production and expanding the applicability of the pin cap 100.

[0036] As one possible implementation, in other embodiments, the number of pin holes 11 is multiple, and the multiple pin holes 11 are radially distributed.

[0037] It should be noted that in other embodiments, there may be multiple pin holes 11, which are radially distributed, i.e., arranged radially outward from the center of the pin cap body 10. This distribution allows the pins 230 to apply force symmetrically with the center of the chip 400 as a reference when acting on the chip 400. Regardless of whether the chip 400 is circular, square, or other regular or irregular in shape, the radial arrangement of the pins 230 can evenly distribute the lifting force applied by the pins 230 according to the geometric center of the chip 400, avoiding local stress concentration due to uneven force on the chip 400, thereby effectively reducing the possibility of the chip 400 breaking or being damaged due to improper force during separation.

[0038] For the separation of the edge portion of chip 400 and blue film 300, the radially distributed ejector pins 230 can work together more effectively. At the edge of chip 400, the ejector pins 230, radially distributed in different directions, can apply separation force to the adhesion point between chip 400 and blue film 300 from various angles. Especially when the subtractive groove 13 increases the separation angle between the edge of blue film 300 and chip 400, the radially distributed ejector pins 230 can assist the pulling action of blue film 300 from multiple directions, further expanding the separation angle between the edge of chip 400 and blue film 300, making the separation between the edge of chip 400 and blue film 300 smoother, and improving separation efficiency and quality.

[0039] Furthermore, this radial distribution design also possesses good versatility, adapting to chips 400 of various shapes. Whether it's a circular chip 400 or an irregularly shaped chip 400 such as a polygon, the radial pin hole layout 11 can flexibly adjust the force applied by the pins 230 at different positions according to the shape characteristics of the chip 400. By selecting pins 230 at different angles and positions to precisely adapt to the outer contour of the chip 400, uniform force application and stable separation operation can be achieved under various conditions, greatly expanding the applicability of the pin cap 100 in chip 400 production.

[0040] As one possible implementation method, such as Figure 1 and Figure 2 As shown, in this embodiment, there are multiple vacuum holes 12, which are arranged around the outside of the pin hole 11.

[0041] It should be noted that, as Figure 1 and Figure 2As shown, in this embodiment, there are multiple vacuum holes 12, and these vacuum holes 12 are arranged in a surrounding manner outside the ejector pin hole 11. This ring arrangement means that the vacuum holes 12 are evenly distributed around the ejector pin hole 11, forming one or more concentric rings. When the ejector pin cap 100 is used for the separation operation of the chip 400 and the blue film 300, the multiple vacuum holes 12 can be connected to an external vacuum device. After the vacuum device is activated, the vacuum holes 12 will generate negative pressure, forming an adsorption force on the surface of the blue film 300. Since the vacuum holes 12 are distributed around the ejector pin hole 11, adsorption can be applied simultaneously at different locations on the blue film 300.

[0042] The surrounding adsorption force formed by multiple vacuum holes 12 can evenly pull the chip 400 or the blue film 300 from multiple directions. Compared with a single vacuum hole 12, this multi-directional adsorption can effectively avoid instability such as displacement or shaking of the chip 400 or the blue film 300 during the separation process due to uneven adsorption force, greatly improving the stability of adsorption and laying the foundation for the safe and efficient separation of the chip 400 and the blue film 300.

[0043] The surrounding vacuum holes 12 can apply a relatively uniform adsorption force to the contact area between the chip 400 and the blue film 300 during the separation process. This helps to ensure that the chip 400 and the blue film 300 separate synchronously at various points when the ejector pin 230 applies a lifting force to push them apart, avoiding asynchronous separation due to insufficient or excessive local adsorption force. This improves the uniformity of the separation between the chip 400 and the blue film 300 and reduces the risk of damage to the chip 400 due to uneven separation.

[0044] Furthermore, when multiple vacuum holes 12 are arranged in a concentric ring, the design of multiple vacuum holes 12 in a ring provides great flexibility and versatility for chips 400 of different sizes. Smaller chips 400 can be adsorbed using the inner vacuum holes 12 near the ejector pin hole 11; while for larger chips 400, more outer vacuum holes 12 can be used simultaneously to ensure that the entire surface of the chip 400 receives effective adsorption force, meeting the adsorption requirements of chips 400 of different sizes during the separation process and broadening the applicability of the ejector pin cap 100.

[0045] Meanwhile, as the subtractive material groove 13 increases the edge separation angle between the blue film 300 and the chip 400, the adsorption force generated by the multiple vacuum holes 12 arranged around it can apply a stable pulling force to the blue film 300 from all sides during the process of the blue film 300 being pulled up by the ejector pin 230. This further assists the blue film 300 in deforming and displacing near the subtractive material groove 13, thereby more effectively increasing the edge separation angle between the blue film 300 and the chip 400, making the separation of the chip 400 and the blue film 300 smoother and more efficient.

[0046] As one possible implementation method, such as Figure 1 and Figure 2 As shown, in this embodiment, the multiple vacuum holes 12 are distributed at equal intervals.

[0047] It should be noted that, as Figure 1 and Figure 2 As shown, in this embodiment, multiple vacuum holes 12 are arranged around the ejector pin hole 11, and these vacuum holes 12 are distributed at equal intervals. This means that with the ejector pin hole 11 as the center, the spacing between each vacuum hole 12 is consistent, and they are evenly distributed on the circumference or multiple concentric circles surrounding the ejector pin hole 11. For example, if there is a ring of vacuum holes 12 surrounding the ejector pin hole 11, and this ring is divided at equal angles, each vacuum hole 12 is located at the corresponding position after the division, so that the arc length between two adjacent vacuum holes 12 is equal, thereby ensuring the uniformity of the spacing.

[0048] When connected to an external vacuum device, these equally spaced vacuum holes 12 simultaneously generate negative pressure. Due to the uniform spacing, the adsorption force they form on the surface of the chip 400 or the blue film 300 is also relatively uniformly distributed, applying a relatively balanced pulling force to the chip 400 or the blue film 300 from all directions.

[0049] The evenly spaced distribution ensures that the adsorption force generated by the vacuum holes 12 on the surface of the blue film 300 is uniformly covered. Regardless of whether the chip 400 is round, square, or other irregular in shape, the uniformly distributed adsorption force ensures that the tension on the blue film 300 is consistent in all parts, avoiding deformation or displacement of the chip 400 during adsorption due to excessive or insufficient local adsorption force. This ensures the stability of the chip 400 before separation and facilitates the smooth progress of subsequent separation operations.

[0050] When the chip 400 separates from the blue film 300, the uniform adsorption force allows the separation force applied by the ejector pin 230 to act more evenly between the chip 400 and the blue film 300. Because the adsorption force is balanced at all locations, the adhesion points between the chip 400 and the blue film 300 can be broken more synchronously during the separation process, making the separation process of the chip 400 and the blue film 300 more stable and precise. This reduces the risk of damage to the chip 400 due to asynchronous separation and improves the accuracy and quality of the separation between the chip 400 and the blue film 300.

[0051] As one possible implementation method, such as Figure 1 and Figure 2 As shown, in this embodiment, the projected shape of the subtractive groove 13 is adapted to the projected shape of the ejector cap body 10. As one possible implementation, such as... Figure 1 and Figure 2As shown, in this embodiment, the projected shape of the ejector cap body 10 is circular, and the projected shape of the subtractive material groove 13 is annular; or, in other embodiments, the projected shape of the ejector cap body 10 is square, and the projected shape of the subtractive material groove 13 is U-shaped.

[0052] It should be noted that, when viewed in a direction perpendicular to the surface of the thimble cap 100, the shape and contour of the subtractive groove 13 are similar to or complementary to the overall shape and contour of the thimble cap body 10. For example, if the projected shape of the thimble cap body 10 is circular, then the subtractive groove 13 will also be distributed on the projected surface in the form of a ring or multiple arc segments around the center, and its curvature corresponds to the circular contour of the thimble cap body 10; if the projected shape of the thimble cap body 10 is square, then the subtractive groove 13 can be distributed in the form of a square frame or in segments along the square edge, closely fitting the square contour of the thimble cap body 10.

[0053] Because the shape of the subtractive groove 13 closely matches the shape of the ejector cap body 10, the blue film 300 is affected equally at all positions on the edge of the ejector cap 100 during the process of the ejector pin 230 pushing the chip 400 and the blue film 300 apart. For example, at the edge of the circular ejector cap 100, the annularly distributed subtractive groove 13 ensures that the contact area between the blue film 300 and the chip 400 is reduced to a uniform degree in the circumferential direction. This results in the same effect of increasing the separation angle between the edges of the blue film 300 and the chip 400 in all directions, preventing abnormal local separation angles and improving the stability and consistency of the separation process between the chip 400 and the blue film 300, thus helping to improve the yield of the chip 400.

[0054] As one possible implementation method, such as Figure 1 and Figure 2 As shown, in this embodiment, the width of the subtractive material groove 13 is smaller than the diameter of the vacuum hole 12.

[0055] It should be noted that, since the vacuum hole 12 needs to connect to the vacuum device to generate sufficient adsorption force, a certain hole diameter is required to ensure the airflow. The narrower width of the subtractive groove 13 allows for a reduction in the contact area between the chip 400 and the blue film 300 and an increase in the separation angle without affecting the adsorption function of the vacuum hole 12, while also not excessively weakening the structural strength of the ejector cap 100. Therefore, when the blue film 300 is adsorbed by the vacuum hole 12, it can maintain a stable state through adsorption and achieve efficient separation using the subtractive groove 13. When the ejector pin 230 pushes the chip 400, the edge of the ejector cap 100 will not easily deform or break due to the excessive width of the subtractive groove 13, ensuring the durability and reliability of the ejector cap 100 and extending its service life.

[0056] Please refer to the reference again. Figure 3 and Figure 4 This application also provides a ejector pin system 200, including a housing 210, a lifting platform 220 movably disposed within the housing 210, an ejector pin 230 fixedly disposed on the lifting platform 220, and an ejector pin cap 100 fixedly disposed on the top of the housing 210. Since the structure and beneficial effects of the ejector pin cap 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0057] This application also provides a surface mount packaging device, including the ejector pin system 200 described above. Since the structure and beneficial effects of the ejector pin system 200 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0058] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0059] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A needle cap, characterized in that The ejector pin cap body is provided with an ejector pin hole, a vacuum hole and a subtractive groove, the ejector pin hole is located in the middle of the ejector pin cap body, the vacuum hole is arranged outside the ejector pin hole, the subtractive groove is arranged outside the vacuum hole, and the subtractive groove is distributed along the edge of the ejector pin cap body.

2. The pim hat of claim 1, wherein The number of the ejector pin holes is multiple, and the multiple ejector pin holes are arranged in an array.

3. The pim hat of claim 1, wherein The number of the ejector pin holes is multiple, and the multiple ejector pin holes are arranged in a radial manner.

4. The pim hat of claim 1, wherein The number of the vacuum holes is multiple, and the multiple vacuum holes are arranged outside the ejector pin hole in a ring shape.

5. The pim hat of claim 4, wherein The multiple vacuum holes are arranged at equal intervals.

6. The pim hat of claim 1, wherein The projection shape of the subtractive groove is matched with the projection shape of the ejector pin cap body.

7. The pim hat of claim 6, wherein The projection shape of the ejector pin cap body is a circular shape, and the projection shape of the subtractive groove is a circular ring shape; or the projection shape of the ejector pin cap body is a square shape, and the projection shape of the subtractive groove is a character-shaped.

8. The pim hat of claim 1, wherein The width of the subtractive groove is smaller than the hole diameter of the vacuum hole.

9. A system of ejector pins, characterized in that The ejector pin system comprises the ejector pin cap.

10. A patch packaging apparatus characterized by comprising: The ejector pin system comprises the ejector pin cap.

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