Packaging structure of Hall element

Abstract

The utility model discloses a packaging structure of a Hall element, which comprises a packaging shell, a chip and a pin, the chip is plastically packaged in the packaging shell, and the pin is connected with the chip and extends out of the packaging shell; the number of the pins is at least three, the pins comprise extending pins and / or close-fitting pins, two of the pins are arranged on the two transverse sides of the packaging shell respectively, and the remaining pins are arranged on the longitudinal side of the packaging shell. The packaging structure provided by the utility model is suitable for SMT automatic surface mounting, the anti-static problem does not need to be considered after a machine is grounded at one time, a special tool does not need to be manufactured to control the height of the Hall element, a pin cutting process is not needed, the center distance of the pins is very large for the SMT process for the large Hall element, no continuous tin exists basically, and the cost is low. Even if continuous tin exists, the tin can be quickly and automatically detected through AOI automatic testing equipment, and the efficiency is very high.

Description

Technical Field

[0001] This utility model relates to a packaging structure for a Hall element. Background Technology

[0002] A Hall element is an electronic component that operates using the Hall effect, primarily used to detect the presence, direction, and intensity of magnetic fields. Hall elements are widely used in various electronic devices, especially in sensors and control systems.

[0003] Most existing Hall effect sensors are plug-in type (see...) Figure 1 The installation of Hall effect sensors requires manual insertion, which is very inefficient. Furthermore, because Hall effect sensors are sensitive to static electricity, anti-static measures are necessary during operation, requiring high process precision and being highly susceptible to human error, making defects prone to occur. Additionally, controlling the insertion height of the Hall effect sensor requires specialized tooling for limiting its position, and any excess leads on the reverse side of the substrate after soldering need to be manually trimmed. Typically, the center-to-center distance between the three leads of a Hall effect sensor is only 1.27mm, so the center-to-center distance of the solder holes cannot be increased, resulting in limited pad size. Since the pads require insulation distance, and the pads are very close together, solder bridging is very easy to occur during soldering, usually requiring manual repair. Utility Model Content

[0004] The purpose of this invention is to provide a packaging structure for a Hall element to solve the technical problems mentioned in the background section.

[0005] The technical solution to achieve the purpose of this utility model is: a packaging structure for a Hall element, including a packaging shell, a chip and pins, wherein the chip is encapsulated in the packaging shell, and the pins are connected to the chip and extend out of the packaging shell; at least three pins are provided, including protruding pins and / or close-fitting pins, two of the pins are respectively provided on the lateral sides of the packaging shell, and the remaining pins are provided on the longitudinal side of the packaging shell.

[0006] Furthermore, the package housing uses an integrated circuit packaging material with a temperature resistance greater than 150 degrees Celsius.

[0007] Furthermore, at least three of the pins are functional pins.

[0008] Furthermore, the pin is provided in three parts, all of which are protruding pins. Two of the protruding pins are respectively located on the horizontal sides of the package housing, and the other protruding pin is located on the vertical side of the package housing.

[0009] Furthermore, there are more than three pins, all of which are protruding pins. Two of the protruding pins are respectively located on the horizontal sides of the package housing, and the remaining protruding pins are located on the vertical side of the package housing.

[0010] Furthermore, there are three pins, all of which are close-fitting pins. Two of the close-fitting pins are respectively located on the horizontal sides of the package housing, and the other close-fitting pin is located on the vertical side of the package housing.

[0011] Furthermore, there are more than three pins, all of which are close-fitting pins. Two of the close-fitting pins are respectively located on the horizontal sides of the package housing, and the remaining close-fitting pins are located on the vertical side of the package housing.

[0012] Furthermore, the pin configuration includes three pins: two close-fitting pins and one extended pin. The two close-fitting pins are respectively located on the lateral sides of the package housing, and the extended pin is located on the longitudinal side of the package housing.

[0013] Furthermore, the pin configuration includes more than three pins, including two in-line pins and multiple out-of-line pins. The two in-line pins are respectively located on the lateral sides of the package housing, and the multiple out-of-line pins are located on the longitudinal side of the package housing.

[0014] By adopting the above technical solution, this utility model has the following beneficial effects:

[0015] (1) The packaging structure of this utility model is suitable for SMT automatic placement. After the machine is grounded once, there is no need to consider the anti-static problem. There is no need to make special tooling to control the height of the Hall element. There is no need for lead cutting process. For such a large component as the Hall element, the center distance of the pins is already very large for the SMT process. There is basically no solder bridging. Even if there is solder bridging, it can be quickly and automatically detected by AOI automatic testing equipment, which is very efficient.

[0016] (2) This utility model can be configured with multiple pins, including at least power supply pins, input pins and output pins. It can also be configured with multiple pins with the same function, such as multiple power supply pins, to reduce the current in each pin. Alternatively, it can be configured with non-functional pins for easy installation and fixing.

[0017] (3) The Hall element of this utility model is too thin and is easy to fall over during the production process. Extending the pin can solve this problem well, making it more stable after mounting.

[0018] (4) The Hall element of this utility model adopts a close-fitting pin, which makes it very suitable for installation in small spaces.

[0019] (5) The Hall element of this utility model adopts a combination of close-fitting pins and extended pins, which makes the Hall element suitable for installation in small spaces and increases stability. Attached Figure Description

[0020] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein...

[0021] Figure 1 This is a schematic diagram of the structure of an existing plug-in Hall element.

[0022] Figure 2 This is a schematic diagram of the structure of Embodiment 1 of this utility model.

[0023] Figure 3 This is a schematic diagram of the structure of Embodiment 2 of this utility model.

[0024] Figure 4 This is a structural schematic diagram of Embodiment 3 of the present invention.

[0025] Figure 5 This is a schematic diagram of the structure of Embodiment 4 of this utility model.

[0026] Figure 6 This is a structural schematic diagram of Embodiment 5 of the present invention.

[0027] Figure 7 This is a schematic diagram of the structure of Embodiment 6 of this utility model.

[0028] The labels in the attached diagram are: package housing 1, pin 2, protruding pin 21, and in-body pin 22. Detailed Implementation

[0029] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of the embodiments of this utility model, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the utility model product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] In the description of the embodiments of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The utility model will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of this utility model and should not be used to limit the scope of protection of this utility model.

[0035] (Example 1)

[0036] See Figure 2 A packaging structure for a Hall element includes a packaging housing 1, a chip, and pins 2. The chip is encapsulated in the packaging housing 1, and the pins 2 are connected to the chip and extend out of the packaging housing 1. At least three pins 2 are provided, including protruding pins 21 and / or close-fitting pins 22. Two of the pins 2 are respectively provided on the lateral sides of the packaging housing 1, and the remaining pins 2 are provided on the longitudinal side of the packaging housing 1.

[0037] The material of the packaging shell 1 is an integrated circuit packaging material with a temperature resistance greater than 150 degrees Celsius.

[0038] At least three of the pins 2 are functional pins, including at least a power supply pin, an input pin, and an output pin. Multiple pins 2 with the same function can also be set, such as multiple power supply pins, to reduce the current in each pin 2, reduce the burden on a single pin 2, or provide redundancy so that even if one pin 2 fails, the other pins 2 can still continue to work. Alternatively, non-functional pins can be set for easy installation and fixation.

[0039] In this embodiment, pin 2 has three pins, all of which are protruding pins 21. Two of the protruding pins 21 are respectively located on the horizontal sides of the package housing 1, and the other protruding pin 21 is located on the vertical side of the package housing 1. The protruding pins 21 can effectively solve the problem that Hall elements are too thin and are prone to tipping over during production, resulting in greater stability after mounting.

[0040] (Example 2)

[0041] See Figure 3 In this embodiment, more than three pins 2 are provided. All pins 2 are extended pins 21. Two of the extended pins 21 are respectively set on the horizontal sides of the package housing 1, and the remaining extended pins 21 are set on the vertical side of the package housing 1.

[0042] (Example 3)

[0043] See Figure 4 In this embodiment, there are three pins 2. All three pins 2 are close-fitting pins 22. Two of the close-fitting pins 22 are respectively located on the horizontal sides of the package housing 1, and the other close-fitting pin 22 is located on the vertical side of the package housing 1, making it very suitable for installation in small spaces.

[0044] (Example 4)

[0045] See Figure 5 In this embodiment, more than three pins 2 are provided. All pins 2 are close-fitting pins 22. Two of the close-fitting pins 22 are respectively located on the horizontal sides of the packaging housing 1, and the remaining close-fitting pins 22 are located on the vertical side of the packaging housing 1.

[0046] (Example 5)

[0047] See Figure 6 In this embodiment, pin 2 is provided with three pins, including two close-fitting pins 22 and one extended pin 21. The two close-fitting pins 22 are respectively provided on the horizontal sides of the package housing 1, and the extended pin 21 is provided on the vertical side of the package housing 1. The combination of close-fitting pins 22 and extended pin 21 makes the Hall element suitable for installation in small spaces and increases stability.

[0048] (Example 6)

[0049] See Figure 7 In this embodiment, more than three pins 2 are provided, including two close-fitting pins 22 and multiple protruding pins 21. The two close-fitting pins 22 are respectively provided on the horizontal sides of the packaging housing 1, and the multiple protruding pins 21 are provided on the vertical side of the packaging housing 2.

[0050] The packaging structure of this invention is suitable for SMT automatic placement. After the machine is grounded once, there is no need to consider anti-static issues. There is no need to make special tooling to control the height of the Hall element, and there is no need for lead trimming process. For such a large component as the Hall element, the center distance of the pins is already very large for the SMT process, and there is basically no solder bridging. Even if there is solder bridging, it can be quickly and automatically detected by AOI automatic testing equipment, which is very efficient.

[0051] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A packaging structure for a Hall element, characterized in that: The package shell (1), the chip and the pin (2), the chip is molded in the package shell (1), the pin (2) is connected with the chip and extends out of the package shell (1), the pin (2) is provided with at least three, the pin (2) includes the extension pin (21) and / or the close-fitting pin (22), two of the pin (2) are arranged on the transverse two sides of the package shell (1) respectively, and the remaining pin (2) is arranged on the longitudinal side of the package shell (1).

2. The packaging structure of a Hall element according to claim 1, wherein: The package shell (1) uses integrated circuit packaging material with temperature resistance greater than 150 degrees.

3. The packaging structure of a Hall element according to claim 1, wherein: At least three of the pins (2) are functional pins.

4. The packaging structure of a Hall element according to claim 1, wherein: The pin (2) is provided with three, the pin (2) is all the extension pin (21), two of the extension pin (21) are arranged on the transverse two sides of the package shell (1) respectively, and the other extension pin (21) is arranged on the longitudinal side of the package shell (1).

5. The packaging structure of a Hall element according to claim 1, wherein: The pin (2) is provided with more than three, the pin (2) is all the extension pin (21), two of the extension pin (21) are arranged on the transverse two sides of the package shell (1) respectively, and the remaining extension pin (21) is arranged on the longitudinal side of the package shell (1).

6. The packaging structure of a Hall element according to claim 1, wherein: The pin (2) is provided with three, the pin (2) is all the close-fitting pin (22), two of the close-fitting pin (22) are arranged on the transverse two sides of the package shell (1) respectively, and the other close-fitting pin (22) is arranged on the longitudinal side of the package shell (1).

7. The packaging structure of a Hall element according to claim 1, wherein: The pin (2) is provided with more than three, the pin (2) is all the close-fitting pin (22), two of the close-fitting pin (22) are arranged on the transverse two sides of the package shell (1) respectively, and the remaining close-fitting pin (22) is arranged on the longitudinal side of the package shell (1).

8. The packaging structure of a Hall element according to claim 1, wherein: The pin (2) is provided with three, including two close-fitting pins (22) and an extension pin (21), two close-fitting pins (22) are arranged on the transverse two sides of the package shell (1) respectively, and the extension pin (21) is arranged on the longitudinal side of the package shell (1).

9. The packaging structure of a Hall element according to claim 1, wherein: The pin (2) is provided with more than three, including two close-fitting pins (22) and a plurality of extension pins (21), two close-fitting pins (22) are arranged on the transverse two sides of the package shell (1) respectively, and a plurality of extension pins (21) are arranged on the longitudinal side of the package shell (1).

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