Full-automatic oven for wafer glue drying

Abstract

The utility model relates to a full-automatic oven for wafer glue drying, which comprises an FFU device, an SMIF device, a manipulator device, a hot plate device, a cold plate device, an edge finder device and an integrated exhaust system on a casing, and is matched with an internal lifting adjustable structure under the centralized control of a master controller. The objective of the utility model is to optimize the wafer baking process and set a plurality of work flows to improve the baking efficiency. Leveling pieces are arranged on the side edges of the hot plate device and the cold plate device. An ejector pin group which vertically reciprocates and a lifting mechanism for driving the ejector pin group are arranged in a hot plate shell of the hot plate device; according to the utility model, the purpose of easy disassembly and assembly is realized through the detachable shell structure; by arranging the lifting mechanism, the requirements of baking conditions of different heights are met; therefore, the characteristics that the internal structure of the whole machine is flexible and changeable, the area position is variable, and the device supports stacked adjustment are achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer glue drying equipment technical field especially a full -automatic oven for wafer glue drying. BACKGROUND

[0002] In the wafer manufacturing process, a small amount of photoresist liquid is added to the wafer, and the photoresist is dried after diffusion. The same batch of wafers requires to ensure that the photoetching hot plate, wafer and other components remain in a horizontal state during the baking process. Different specifications of wafers may need to adjust the working height according to the actual working conditions. SUMMARY

[0003] The applicant provides a full-automatic oven for wafer glue drying with a reasonable structure to meet the glue drying requirements of different heights and ensure that the top pin always remains in a horizontal state during the adjustment of the vertical height.

[0004] The technical scheme adopted by the utility model is as follows:

[0005] A full-automatic oven for wafer glue drying includes an oven body, a hot plate device and a cold plate device built in the working platform of the oven body, the hot plate device and the cold plate device are both equipped with leveling pieces; the hot plate device includes a hot plate shell, a top pin group vertically reciprocating in the hot plate shell, and a lifting mechanism driving the top pin group,

[0006] The lifting mechanism includes:

[0007] The lifting power source has a constant relative position with the hot plate shell,

[0008] The slide rail has a constant relative position with the hot plate shell,

[0009] The connecting assembly is pushed by the lifting power source and reciprocally slides along the slide rail,

[0010] The top pin group is driven by the connecting assembly and slides by the lifting power source; the horizontal state is maintained during the sliding process.

[0011] As a further improvement of the above technical scheme:

[0012] The lifting mechanism is attached to the hot plate shell and abuts against the side wall and the bottom wall of the hot plate shell.

[0013] The lifting mechanism is provided with a cover shell, and the cover shell is provided with a through slot on the side facing the wafer to accommodate the movement of the top pin group.

[0014] The output shaft of the lifting power source extends upward and is connected with a lifting flange; the lifting flange drives the connecting assembly and the top pin group to move along the slide rail.

[0015] The connecting assembly includes a connecting plate directly connected to the lifting flange and a slider connected to the connecting plate. A set of ejector pins is connected to the slider. The slider is simultaneously limited by the slide rail and the lifting flange.

[0016] The slider is partially enclosed and fastened to the slide rail.

[0017] The ejector pin assembly includes an arm extending from the slider and several ejector pins mounted on the arm; the end of the arm closest to the lifting power source is embedded in the slider for limiting.

[0018] The leveling components of the hot plate device and the cold plate device are independent of each other.

[0019] The beneficial effects of this utility model are as follows:

[0020] This utility model features a compact and reasonable structure, and is easy to operate. By incorporating a lifting mechanism, the ejector pins are kept horizontal and can be adjusted vertically. The cold and hot plate structures can also be adjusted vertically via a leveling mechanism. In other words, in the oven structure proposed in this solution, both the heat source / cold source for the processed part and the wafer lifted by the ejector pins can have their vertical height adjusted to meet the needs of baking at different heights.

[0021] The oven assembly provided by this utility model, based on the aforementioned structural improvements, incorporates a main control panel, three-color lights, and six modules for adjustable area positioning and stackable support: FFU device, SMIF device, robotic arm device, hot plate device, cold plate device, and edge finder device. This allows for easy disassembly of the outer shell, flexible and versatile internal structure, and suitability for processing various specifications and requirements. Compared to existing technologies with difficulties in cleaning, fixed processing procedures, and limited conveying methods, this utility model overcomes the problems of numerous cleaning dead spots and high cleaning difficulty through a detachable shell; solves the problem of low processing flexibility through adjustable lifting height; and solves the problem of limited conveying methods through a robotic arm, greatly optimizing the overall efficiency of the wafer baking process. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the external appearance of the entire machine of this utility model.

[0023] Figure 2 This is a schematic diagram of the hidden outer shell structure of the oven body of this utility model.

[0024] Figure 3 This is a schematic diagram of the hot plate device and cold plate device on the workbench of this utility model.

[0025] Figure 4 This is a schematic diagram of the internal structure of the hot plate device of this utility model.

[0026] Figure 5This is a schematic diagram of the lifting mechanism of this utility model.

[0027] The components include: 1. Oven body; 2. Hot plate assembly; 3. Cold plate assembly; 4. Leveling components; 5. Lifting mechanism; 6. Arm; 7. Ejector pin.

[0028] 201. Hot plate outer casing;

[0029] 501. Cover; 502. Through groove; 503. Lifting power source; 504. Lifting flange; 505. Connecting plate; 506. Slider; 507. Slide rail. Detailed Implementation

[0030] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0031] like Figures 1-5 As shown, the fully automatic wafer baking oven of this embodiment includes an oven body 1, a hot plate device 2 and a cold plate device 3 built into the working platform inside the oven body 1. Both the hot plate device 2 and the cold plate device 3 are equipped with leveling components 4. The hot plate device 2 includes a hot plate shell 201, and a vertically reciprocating ejector pin assembly is arranged inside the hot plate shell 201, as well as a lifting mechanism 5 that drives the ejector pin assembly.

[0032] The lifting mechanism 5 includes:

[0033] The lifting power source 503 maintains a constant relative position with the hot plate outer casing 201.

[0034] The relative position of the slide rail 507 and the hot plate outer shell 201 is constant.

[0035] The connecting component, driven by the lifting power source 503, slides back and forth along the slide rail 507.

[0036] The ejector pin assembly is driven by the connecting component and slides under the influence of the lifting power source 503; it remains horizontal during the sliding process.

[0037] The lifting mechanism 5 is installed against the wall of the hot plate housing 201, and abuts against the side wall and bottom wall of the hot plate housing 201.

[0038] The lifting mechanism 5 is provided with a cover 501, and the cover 501 has a through slot 502 facing the wafer side to accommodate the movement of the ejector pin assembly.

[0039] The output shaft of the lifting power source 503 extends upward and is connected to the lifting flange 504; the lifting flange 504 drives the connecting assembly and the ejector pin assembly to move along the slide rail 507.

[0040] The connecting assembly includes a connecting plate 505 directly connected to the lifting flange 504, a slider 506 connected to the connecting plate 505, and a set of ejector pins connected to the slider 506; the slider 506 is simultaneously limited by the slide rail 507 and the lifting flange 504.

[0041] The slider 506 is partially enclosed and fastened to the slide rail 507.

[0042] The ejector pin assembly includes an arm 6 extending from the slider 506, and several ejector pins 7 disposed on the arm 6; the end of the arm 6 near the lifting power source 503 is embedded in the slider 506 for limiting.

[0043] The leveling components 4 of the hot plate device 2 and the cold plate device 3 are independent of each other.

[0044] The specific structure and working process of this utility model are as follows:

[0045] The purpose of this invention is to provide an oven with adjustable baking height. The main improvements are the addition of leveling components 4 on the sides of the hot plate device 2 and the cold plate device 3, and the provision of a lifting mechanism 5 for the ejector pin. Other structures still utilize existing mature technologies, such as the heating principle of the hot plate device 2, which are prior art and will not be described in detail in this embodiment.

[0046] like Figure 2 and Figure 3 As shown, the hot plate device 2 and the cold plate device 3 are located on the worktable. The leveling component 4 is used to adjust the balance and lifting of the hot and cold plates. It can be a commercially available lifting cylinder, nut leveling, or lead screw leveling structure. In this embodiment, the hot plate device 2 and the cold plate device 3 are inclined to be cuboid structures with chamfers. In order to ensure that the hot plate device 2 and the cold plate device 3 can be subjected to uniform force and stable adjustment during the leveling process, multiple adjusting components, such as lifting cylinders, are provided and arranged around the hot plate device 2 and the cold plate device 3, and the spacing between adjacent adjusting components is inclined to be equal.

[0047] like Figure 4 The diagram shows the internal structure of the hot plate assembly 2. Part of the hot plate housing 201 is hidden, with only a side wall and bottom wall visible to show the relative positions of the housing 501 and the wafer. Inside the housing 501 is a lifting mechanism 5, which drives the ejector pin assembly to reciprocate up and down. The ejector pin assembly includes an arm 6 extending from inside the housing 501, extending to below the wafer support. Ejector pins 7 are positioned upwards at the ends of the arms 6 to subsequently lift the wafer.

[0048] like Figure 5The diagram shows a schematic of the lifting mechanism 5 of the concealed housing 501. The lifting power source 503 of the lifting mechanism 5 is a closed-loop lead screw stepper motor. The output axis of the stepper motor points upward and drives the lifting flange 504. A slide rail 507 is provided on the side of the stepper motor facing the wafer. The slide rail 507 is fixed to the bottom wall of the hot plate device 2, and a slider 506 is equipped on the slide rail 507. The lifting flange 504 drives a connecting plate 505. The connecting plate 505 extends from the stepper motor to the slider 506 and is assembled with the slider 506 to form a semi-enclosed "U"-shaped slider 506 that is fastened to the slide rail 507. The slider 506 is also connected to the lifting flange 504. During the up-and-down movement driven by the lifting flange 504, it is simultaneously limited by the slide rail 507 and the connection limit at the lifting flange 504, ensuring that the slider 506 moves vertically and horizontally relative to the slide rail 507.

[0049] It should be noted that the function of the connecting plate 505 is to connect other components, so the connecting plate 505 can be a simple plate or a splicing assembly of multiple plates.

[0050] The arm 6 of the ejector pin assembly extends into the splicing structure of the slider 506, is limited and driven by the slider 506, and achieves the purpose of the stepper motor driving the ejector pin assembly with high precision.

[0051] The middle area of ​​the oven includes an FFU device, an SMIF device, and a robotic arm device. These devices are existing technologies. In this solution, they are mainly used in combination with the aforementioned improved structure to achieve the goal of overall machine optimization. Therefore, a brief explanation of the effects of these devices is sufficient here.

[0052] The FFU (Fan Filter Unit) is placed above the oven and can actively draw in air, as well as regulate the working environment air pressure and filter the air. The SMIF (Steam Filter Unit) has the function of carrying wafers, scanning the number and status of wafers, and isolating the wafers from the outside world during operation. The robotic arm device has a high degree of freedom and can realize functions such as lifting, rotating, and extending.

[0053] The oven is also equipped with an edge finder and an exhaust box. The edge finder can calibrate the wafer center position and align the wafer edge to a set direction. The exhaust box can be used with FFU to achieve a higher level of cleanliness throughout the equipment.

[0054] The positions of the aforementioned existing modules within the oven are not entirely fixed and can be arranged according to actual working conditions.

[0055] In this invention, all shell components are assembled using fasteners such as screws, facilitating disassembly and resolving issues such as cleaning dead spots and maintenance. Simultaneously, all material feeding is performed by a robotic arm mounted on the worktable, making the feeding process more convenient. Using this improved solution in drying equipment enables baking at different heights during the process.

[0056] The above description is an explanation of the present utility model and not a limitation thereof. The scope of the present utility model is defined by the claims. Within the protection scope of the present utility model, any form of modification may be made.

Claims

1. A full-automatic oven for wafer baking, comprising an oven body (1), a hot plate device (2) and a cold plate device (3) which are arranged on a working platform in the oven body (1), characterized in that: The hot plate device (2) and the cold plate device (3) are each provided with a leveling piece (4); the hot plate device (2) comprises a hot plate shell (201), a vertical reciprocating needle group is arranged in the hot plate shell (201), and a lifting mechanism (5) for driving the needle group, The lifting mechanism (5) comprises: A lifting power source (503) with a constant relative position to the hot plate shell (201), A slide rail (507) with a constant relative position to the hot plate shell (201), A connecting assembly driven by the lifting power source (503) and reciprocally sliding along the slide rail (507), The needle group is driven by the connecting assembly and slides by the lifting power source (503); the needle group keeps a horizontal state during the sliding process.

2. The full-automatic oven for wafer baking adhesive as claimed in claim 1, characterized in that: The lifting mechanism (5) is arranged in abutment in the hot plate shell (201) and abuts against the side wall and the bottom wall of the hot plate shell (201).

3. The full-automatic baking oven for wafer baking glue according to claim 1, characterized in that: The lifting mechanism (5) is provided with a cover shell (501), and a through slot (502) for accommodating the movement of the needle group is formed in the side of the cover shell (501) facing the wafer.

4. The full-automatic baking oven for wafer baking glue according to claim 1, characterized in that: The output shaft of the lifting power source (503) extends upward and is connected with a lifting flange (504); the lifting flange (504) drives the connecting assembly and the needle group to move along the slide rail (507).

5. The full-automatic baking oven for wafer adhesive baking according to claim 4, characterized in that: The connecting assembly comprises a connecting plate (505) directly connected with the lifting flange (504) and a sliding block (506) connected with the connecting plate (505), and the needle group is connected to the sliding block (506); the sliding block (506) is limited by the slide rail (507) and the lifting flange (504) at the same time.

6. The full-automatic baking oven for wafer adhesive baking according to claim 5, characterized in that: The sliding block (506) is in a half-clad state and is buckled on the slide rail (507).

7. The full-automatic baking oven for wafer adhesive baking according to claim 4, characterized in that: The needle group comprises an arm (6) extending from the sliding block (506) and a plurality of needles (7) arranged on the arm (6); The arm (6) is embedded in the sliding block (506) at the end close to the lifting power source (503).

8. The full-automatic oven for wafer baking adhesive as claimed in claim 1, characterized in that: The leveling pieces (4) of the hot plate device (2) and the cold plate device (3) are independent of each other.

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