Crystal ingot stripping equipment

Abstract

The utility model is suitable for the technical field of semiconductor processing, and provides crystal ingot stripping equipment, which comprises a mounting component; the carrying platform is used for carrying and fixing a crystal ingot and is arranged on the mounting component; the placing seat is used for placing the crystal ingot and is arranged on the mounting part; the adsorption assembly is used for adsorbing the crystal ingot; and the moving assembly is connected to the adsorption assembly so as to drive the adsorption assembly to strip the sheet-shaped sub-component from the crystal ingot and drive the adsorption assembly to move from the carrying table to the placing seat in the length direction of the crystal ingot stripping equipment. According to the crystal ingot stripping equipment provided by the embodiment of the invention, the cost can be reduced.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor processing, and more particularly relates to a crystal ingot stripping device. BACKGROUND

[0002] Nowadays, laser internal modification is performed on a crystal ingot to achieve cutting and slicing. The laser internal modification cutting technology is to focus laser to the inside of a material, form a modified layer after laser scanning, and promote the material to naturally crack along a preset cutting direction by using the principle of laser-induced thermal cracks. After laser internal modification is performed on the crystal ingot, cracks are formed in the crystal ingot, and wafers are stripped from the crystal ingot through a stripping process. At present, the stripping is mainly completed manually, which is high in cost. CONTENT OF THE UTILITY MODEL

[0003] Embodiments of the present application provide a crystal ingot stripping device which can reduce cost.

[0004] Embodiments of the present application provide a crystal ingot stripping device, which comprises:

[0005] a mounting component;

[0006] a carrier for carrying and fixing a crystal ingot, which is arranged on the mounting component;

[0007] a placing seat for placing the crystal ingot, which is arranged on the mounting component;

[0008] a suction assembly for suctioning the crystal ingot;

[0009] a moving assembly connected to the suction assembly to drive the suction assembly to strip a sheet-shaped sub-component from the crystal ingot and to move the suction assembly from the carrier to the placing seat along the length direction of the crystal ingot stripping device.

[0010] In some possible embodiments, the placing seat comprises:

[0011] a bottom plate arranged on the mounting component;

[0012] a plurality of suction cups arranged on the bottom plate to jointly carry the crystal ingot.

[0013] In some possible embodiments, the suction cups are arranged on the bottom plate at intervals.

[0014] In some possible embodiments, in the height direction of the crystal ingot stripping device, there is a gap between the suction surface of the suction cup and the top surface of the bottom plate.

[0015] In some possible embodiments, the carrier is an adsorption carrier, and the moving assembly is an assembly capable of moving the adsorption assembly along a height direction of the crystal ingot stripping apparatus, so as to move the adsorption assembly along the height direction from above the carrier to adsorb the crystal ingot.

[0016] In some possible embodiments, the moving assembly comprises:

[0017] a first direction moving assembly connected to the adsorption assembly to move the adsorption assembly relative to the carrier along a first direction to strip the sheet-shaped sub-component from the crystal ingot;

[0018] a second direction moving assembly connected to the first direction moving assembly to move the first direction moving assembly relative to the carrier along a second direction;

[0019] The first direction is perpendicular to the second direction.

[0020] In some possible embodiments, the crystal ingot stripping apparatus further comprises:

[0021] a connecting component connected to the moving assembly and floatingly connected to the adsorption assembly.

[0022] In some possible embodiments, the crystal ingot stripping apparatus further comprises:

[0023] a guiding component;

[0024] a resilient component;

[0025] The connecting component is floatingly connected to the adsorption assembly through the guiding component and the resilient component.

[0026] In some possible embodiments, the crystal ingot stripping apparatus further comprises:

[0027] a sensor arranged on the connecting component;

[0028] a sensing sheet arranged on the adsorption assembly and capable of moving with the adsorption assembly to trigger the sensor, so as to stop the moving assembly from moving the adsorption assembly.

[0029] In some possible embodiments, the adsorption assembly comprises:

[0030] a porous ceramic plate provided with adsorption micropores;

[0031] a dense ceramic plate arranged on the porous ceramic plate.

[0032] In some possible embodiments, the adsorption assembly comprises:

[0033] an adsorption disc substrate provided with a plurality of adsorption holes.

[0034] An adsorption cover plate is arranged on the adsorption disc base plate.

[0035] In some possible embodiments, the adsorption assembly comprises:

[0036] A disc mounting component;

[0037] A plurality of adsorption discs are arranged on the disc mounting component.

[0038] The embodiments of the present application have the following beneficial effects:

[0039] The moving assembly is connected to the adsorption assembly to drive the adsorption assembly to adsorb the ingot, to strip the sheet-shaped sub-component from the ingot, and to drive the adsorption assembly to move from the carrier to the placing seat along the length direction of the ingot stripping device, so as to place the sheet-shaped sub-component on the placing seat, thereby realizing the mechanized stripping of the ingot and reducing the cost. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative labor.

[0041] Figure 1 A perspective view of the ingot stripping device according to an embodiment of the present application is provided;

[0042] Figure 2 A perspective view of the placing seat of the ingot stripping device according to an embodiment of the present application is provided;

[0043] Figure 3 A perspective view of a part of the structure of the ingot stripping device according to an embodiment of the present application is provided;

[0044] Figure 4 A perspective view of the adsorption assembly of the ingot stripping device according to an embodiment of the present application is provided;

[0045] Figure 5 A sectional view of the adsorption assembly of the ingot stripping device according to an embodiment of the present application is provided;

[0046] Figure 6 A perspective view of the adsorption assembly of the ingot stripping device according to another embodiment of the present application is provided;

[0047] Figure 7 A front projection view of the adsorption assembly of the ingot stripping device according to another embodiment of the present application is provided;

[0048] Figure 8 FIG. 7 is a front view of an adsorption assembly of a crystal ingot stripping apparatus according to another embodiment of the present application;

[0049] Figure 9 FIG. 8 is another front view of the adsorption assembly of the crystal ingot stripping apparatus according to another embodiment of the present application. DETAILED DESCRIPTION

[0050] In order to make the technical problems solved by the present application, the technical solutions and the beneficial effects clearer, the following further describes the present application with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present application, and not to limit the present application. Figures 1 to 9 It should be understood that the specific embodiments described herein are merely intended to explain the present application, and not to limit the present application.

[0051] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0052] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely intended to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0053] It should be understood that the term "and / or" used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0054] In addition, the terms "first", "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise specifically limited.

[0055] Embodiments of the present application provide a crystal ingot stripping apparatus for stripping a sheet-shaped sub-component from a crystal ingot. The aforementioned crystal ingot can be a silicon carbide crystal ingot, a sapphire crystal ingot, a gallium nitride crystal ingot or other semiconductor material crystal ingot, and the aforementioned sheet-shaped sub-component can be a wafer or a sheet.

[0056] Figure 1A perspective view of a crystal ingot stripping apparatus is provided for an embodiment of the present application. Referring to Figure 1 An embodiment of the present application provides a crystal ingot stripping apparatus including a mounting component 1, a carrier 2, a placing seat 3, a suction assembly 4, and a moving assembly 5.

[0057] The mounting component 1 is used for mounting and fixing various components. The mounting component 1 can be a bottom plate or a base in particular.

[0058] The carrier 2 is used for carrying and fixing the crystal ingot 100. The carrier 2 is arranged on the mounting component 1. The carrier 2 can achieve the fixing of the crystal ingot 100 through suction or clamping in particular.

[0059] The placing seat 3 is used for placing the crystal ingot. The placing seat 3 is arranged on the mounting component 1.

[0060] The suction assembly 4 is used for suctioning the crystal ingot 100. The suction assembly 4 can suction the crystal ingot 100 through vacuum in particular.

[0061] The moving assembly 5 is connected to the suction assembly 4 to drive the suction assembly 4 to strip the sheet-shaped sub-component 200 from the crystal ingot 100 and to move the suction assembly 4 from the carrier 2 to the placing seat 3 along the length direction L of the crystal ingot stripping apparatus.

[0062] The moving assembly 5 can be a two-dimensional moving platform, a three-dimensional moving platform, or a mechanical arm in particular.

[0063] When the crystal ingot stripping apparatus provided by an embodiment of the present application is in operation, the crystal ingot 100 to be stripped is carried on and fixed by the carrier 2. The moving assembly 5 drives the suction assembly 4 to approach the carrier 2, so that the suction assembly 4 suctions the crystal ingot 100 on the carrier 2. The moving assembly 5 drives the suction assembly 4 to move away from the carrier 2, so that the suction assembly 4 strips the sheet-shaped sub-component 200 from the crystal ingot 100. Then, the moving assembly 5 drives the suction assembly 4 to move from the carrier 2 to the placing seat 3 along the length direction L of the crystal ingot stripping apparatus, so that the suction assembly 4 places the sheet-shaped sub-component on the placing seat 3. The moving assembly 5 drives the suction assembly 4 to return and approach the carrier 2, so as to carry out the next stripping.

[0064] According to the above content, the carrier 2 carries and fixes the crystal ingot 100. The moving assembly 5 is connected to the suction assembly 4 to drive the suction assembly 4 to approach the carrier 2 to suction the crystal ingot 100, to strip the sheet-shaped sub-component from the crystal ingot 100, and to move the suction assembly 4 from the carrier 2 to the placing seat 3 along the length direction L of the crystal ingot stripping apparatus to place the sheet-shaped sub-component on the placing seat 3, thereby realizing the mechanized stripping of the crystal ingot and reducing the cost.

[0065] The carrier 2 can be a suction carrier. The moving assembly 5 is configured to move the suction assembly 4 along the height direction H of the crystal ingot stripping apparatus, so as to move the suction assembly 4 to suck the crystal ingot from above the carrier 2 along the height direction H. The height direction H can be a vertical direction or a thickness direction.

[0066] The carrier (i.e., the carrier 2) is configured to carry and suck the crystal ingot 100. The moving assembly 5 is configured to move the suction assembly 4 to the carrier 2, and the suction assembly 4 is configured to suck the crystal ingot 100 from above the carrier 2 along the height direction H. The top of the carrier 2 does not need to have a relief position, so that the structure can be simplified and the production can be facilitated.

[0067] In addition, since the relief position is not required, the surface of the portion of the carrier 2 for carrying and sucking the crystal ingot 100 is smoother, so that the suction force can be improved and the crystal ingot 100 can be fixed better.

[0068] Figure 2 A perspective view of a placing table of a crystal ingot stripping apparatus according to an embodiment of the present application is provided. Referring to Figure 3 The placing seat 3 can include a bottom plate 31 and a suction disc 32.

[0069] The bottom plate 31 is arranged on the mounting member 1.

[0070] The number of the suction discs 32 can be one or more. Each suction disc 32 is arranged on the bottom plate 31 to jointly carry the sheet-shaped sub-member. The suction discs 32 are arranged on the bottom plate 31 at intervals, for example, on the top surface 310 of the bottom plate 31.

[0071] The sheet-shaped sub-member 200 is carried and sucked by the suction disc 32. The suction discs 32 are arranged on the bottom plate 31 at intervals, and there is a gap between the suction discs 32. The gap can be provided in the length direction (or the horizontal direction) to facilitate the operation of grasping the sheet-shaped sub-member.

[0072] The suction disc 32 can be an anti-static suction disc, which can stably and safely suck the stripped sheet-shaped sub-member.

[0073] In some embodiments, in the height direction H of the crystal ingot stripping apparatus, there is a gap D between the suction surface 320 of the suction disc 32 and the top surface 310 of the bottom plate 31. More gaps can be provided in the height direction H to facilitate the operation of grasping the sheet-shaped sub-member.

[0074] The suction surface 320 is an end surface of the suction disc 32, which can carry the sheet-shaped sub-member 200.

[0075] Referring to Figure 3 The placing seat 3 can further include a support column 33.

[0076] The number of support columns 33 can be one or more. The support columns 33 are used to support the suction plate 32. Each support column 33 is arranged on the base plate 31, and the suction plate 32 is arranged on the base plate 31 through the support columns 33, so as to lift the suction plate 32 and enable the suction plate 32 to better grasp the sheet-shaped subcomponent 200.

[0077] Reference Figure 1 The moving assembly 5 can include a first direction moving assembly 51 and a second direction moving assembly 52.

[0078] The first direction moving assembly 51 is connected to the adsorption assembly 4 to drive the adsorption assembly 4 to move relative to the carrier along a first direction, so as to peel off the sheet-shaped subcomponent 200 from the ingot. Specifically, the first direction moving assembly 51 drives the adsorption assembly 4 to descend to the upper surface of the ingot 100 along the first direction, and then drives the adsorption assembly 4 to ascend to achieve peeling.

[0079] The second direction moving assembly 52 is connected to the first direction moving assembly to drive the first direction moving assembly 51 to move relative to the carrier 2 along a second direction. The second direction moving assembly 52 can achieve adjustment of the peeling position and discharge of the sheet-shaped subcomponent 200 after peeling by driving the first direction moving assembly 51 to move.

[0080] The first direction is perpendicular to the second direction. The first direction can be the aforementioned height direction H, and the second direction can be the aforementioned length direction L.

[0081] The adsorption assembly 4 is driven by the first direction moving assembly 51 and the second direction moving assembly 52 to move relative to the carrier 2 along the first direction and the second direction, so as to approach or move away from the carrier 2 and approach or move away from the placement table 3, and the ingot peeling is performed at a suitable position. The adsorption of the ingot and the peeling of the sheet-shaped subcomponent from the ingot, as well as the placement of the sheet-shaped subcomponent on the placement table 3, can be achieved by moving in two directions, and the structure can be simplified.

[0082] The first direction moving assembly 51 and the second direction moving assembly 52 can specifically be a carrying servo module, which has high repeat positioning accuracy.

[0083] The above-mentioned ingot peeling device can further include a rack (not shown in the figure).

[0084] The rack is used to support and fix the entire ingot peeling device.

[0085] The mounting component 1 is arranged on the rack.

[0086] In other embodiments, the rack is optional, and the entire ingot peeling device can be arranged on the ground or other devices.

[0087] Reference Figure 1 The above-mentioned ingot peeling device can further include a connecting component 6.

[0088] The connecting component 6 is connected to the moving component 5 and is floatingly connected to the adsorption component 4.

[0089] The connecting component 6 is floatingly connected to the adsorption component 4. When the adsorption component 4 comes into contact with the crystal ingot 100, the adsorption component 4 can float relative to the crystal ingot 100, which can prevent the crystal ingot 100 from being damaged.

[0090] The connecting component 6 can be either a connector or a connecting plate.

[0091] Figure 3 This is a perspective view of a portion of the structure of an ingot stripping apparatus provided in one embodiment of this application. (See reference...) Figure 3 The aforementioned ingot stripping equipment may also include a guide component 7 and an elastic component 8.

[0092] The connecting component 6 is floatingly connected to the adsorption assembly 4 via the guide component 7 and the elastic component 8.

[0093] The elastic component 8 can specifically be a spring, a bellows, or a rubber block.

[0094] For example, one end of the guide component 7 is fixedly connected to the adsorption component 4, and the other end of the guide component 7 passes through the guide through hole of the connecting component 6. The guide component 7 can move back and forth in the guide through hole along the height direction H. The elastic component 8 is sleeved on the guide component 7. When the adsorption component 4 contacts the crystal ingot 100, the elastic component 8 is compressed, and the adsorption component 4 and the guide component 7 move upward relative to the connecting component 6 along the height direction H, so as to float relative to the connecting component 6 and play a buffering role.

[0095] In some other embodiments, it is optional for the elastic member 8 to be sleeved on the guide member 7, as long as the elastic member 8 is located between the adsorption component 4 and the connecting member 6 in the height direction H. This can also make the adsorption component 4 and the guide member 7 float relative to the connecting member 6. For example, one end of the elastic member 8 is fixedly connected to the adsorption component 4, and the other end is fixedly connected to the connecting member 6.

[0096] refer to Figure 3 The aforementioned ingot stripping equipment may also include a sensor 9 and a sensor sheet 10.

[0097] Sensor 9 is located on connecting component 6.

[0098] The sensing plate 10 is disposed on the adsorption component 4 and can move with the adsorption component 4 to the trigger sensor 9 so that the moving component 5 stops driving the adsorption component 4 to move.

[0099] When the adsorption component 4 comes into contact with the crystal ingot 100, the adsorption component 4 can float relative to the connecting component 6 in the height direction H. The sensing plate 10 set on the adsorption component 4 moves with the adsorption component 4 to the trigger sensor 9, and then the sensor 9 sends a signal to control the moving component 5 to stop moving the adsorption component 4. This can prevent the adsorption component 4 from continuing to press down on the crystal ingot 100, further prevent damage to the crystal ingot 100, and further protect the crystal ingot.

[0100] Sensor 9 can be a contact sensor or a non-contact sensor.

[0101] The specific method by which the sensor 10 triggers the sensor 9 can be either contact-based or non-contact-based.

[0102] Figure 4 This is a perspective view of the adsorption component of a crystal stripping device provided in an embodiment of this application. Figure 5 This is a cross-sectional view of the adsorption component of a crystal stripping apparatus according to an embodiment of this application. (See reference...) Figure 4 and Figure 5 The aforementioned adsorption component 4 may include a porous ceramic plate 41A and a dense ceramic plate 42A.

[0103] The porous ceramic plate 41A is provided with adsorption micropores.

[0104] A dense ceramic plate 42A is disposed on a porous ceramic plate 41A.

[0105] The dense ceramic plate 42A serves as the frame for the adsorption component 4. The porous ceramic plate 41A is used for vacuum adsorption; specifically, vacuum can pass through the adsorption micropores of the porous ceramic plate 41A to adsorb the crystal ingot 100.

[0106] The distribution of porous ceramic plate 41A and dense ceramic plate 42A can be determined according to the size of ingot 100, thereby achieving compatibility with ingots 3 of various sizes.

[0107] The porous ceramic plate 41A and the dense ceramic plate 42A are made of ceramic, with high precision in flatness and parallelism, and can overlap and adsorb with the upper surface of the crystal ingot 100. The above-mentioned adsorption component 4 (which can be called a ceramic adsorption mechanism) can be used as a high-precision suction cup and can be applied to occasions with high precision requirements.

[0108] Figure 6 A perspective view of the adsorption component of a crystal stripping device provided in another embodiment of this application. Figure 7 A frontal projection view of the adsorption assembly of an ingot stripping apparatus according to another embodiment of this application. (Reference) Figure 6 and Figure 7 The aforementioned adsorption component 4 may include an adsorption plate substrate 41B and an adsorption cover plate 42B.

[0109] The adsorption plate substrate 41B has multiple adsorption holes. The adsorption holes are used to adsorb crystal ingots through vacuum.

[0110] An adsorption cover plate 42B is disposed on an adsorption disk substrate 41B.

[0111] The position of the adsorption holes on the adsorption plate substrate 41B can be determined according to the specifications of the crystal ingot, thereby forming different sets of adsorption holes. By connecting to different vacuum paths, crystal ingots of different specifications can be adsorbed.

[0112] The materials of the adsorption plate substrate 41B and the adsorption cover plate 42B can be metal materials, such as aluminum or copper. Such adsorption components 4 have slightly lower precision than ceramic adsorption mechanisms and are also less expensive, making them suitable for scenarios with relatively lower precision levels.

[0113] Figure 8 An orthographic projection view of the adsorption component of a crystal stripping apparatus provided in yet another embodiment of this application. Figure 9 Another orthographic projection view of the adsorption assembly of a crystal stripping apparatus provided in yet another embodiment of this application. (Refer to...) Figure 8 and Figure 9 The aforementioned adsorption component 4 may include a suction cup mounting component 41C and a suction cup 42C.

[0114] The suction cup mounting component 41C is the frame of the suction assembly 4.

[0115] The number of suction cups 42C can be one or more. Each suction cup 42C is disposed on the suction cup mounting component 41C.

[0116] The suction cup 42C is used to adsorb crystal ingot 100.

[0117] The suction cups 42C are arranged according to the specifications and compatibility requirements of the crystal ingots. With a reasonable distribution of the suction cups, multiple crystal ingots of different sizes can be compatible.

[0118] Since the suction cup 42C of the above-mentioned adsorption component 4 is compressible, the surface precision requirements of the product are relatively low, and it can be applied to occasions where the product precision requirements are relatively low.

[0119] The crystal ingot stripping equipment provided in the embodiments of this application can achieve mechanized stripping of crystal ingots, reduce costs, simplify the structure, improve the adsorption force, stably and safely adsorb the stripped sheet-like components, prevent damage to the crystal ingot, protect the crystal ingot, and is applicable to various occasions.

[0120] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A crystal ingot stripping apparatus characterized by comprising: The crystal ingot stripping device comprises: a mounting component; a carrier provided on the mounting component for carrying and fixing a crystal ingot; a placing seat provided on the mounting component for placing the crystal ingot; an adsorption assembly for adsorbing the crystal ingot; a moving assembly connected to the adsorption assembly to drive the adsorption assembly to strip off a sheet-shaped sub-component from the crystal ingot and to move the adsorption assembly from the carrier to the placing seat along a length direction of the crystal ingot stripping device.

2. The ingot stripping apparatus as claimed in claim 1, wherein The placing seat comprises: a bottom plate provided on the mounting component; a plurality of suction cups provided on the bottom plate to jointly carry the crystal ingot, and each of the suction cups is spaced apart from the bottom plate.

3. The ingot stripping apparatus as claimed in claim 2, wherein In a height direction of the crystal ingot stripping device, there is a gap between an adsorption surface of the suction cup and a top surface of the bottom plate.

4. The ingot stripping apparatus as claimed in claim 1, wherein The carrier is an adsorption carrier, and the moving assembly is a component capable of driving the adsorption assembly to move along a height direction of the crystal ingot stripping device, so as to drive the adsorption assembly to adsorb the crystal ingot from above the carrier in the height direction.

5. The ingot stripping apparatus as claimed in claim 1, wherein The moving assembly comprises: a first direction moving assembly connected to the adsorption assembly to drive the adsorption assembly to move relative to the carrier along a first direction to strip off a sheet-shaped sub-component from the crystal ingot; a second direction moving assembly connected to the first direction moving assembly to drive the first direction moving assembly to move relative to the carrier along a second direction; The first direction is perpendicular to the second direction.

6. The ingot stripping apparatus as claimed in claim 1, wherein The crystal ingot stripping device further comprises: a connecting component connected to the moving assembly and floatingly connected to the adsorption assembly.

7. The ingot stripping apparatus as claimed in claim 6, wherein The crystal ingot stripping device further comprises: a guide component; a resilient component; The connecting component is floatingly connected to the adsorption assembly through the guide component and the resilient component.

8. The ingot stripping apparatus as claimed in claim 6, wherein The crystal ingot stripping device further comprises: a sensor provided on the connecting component; a sensing sheet provided on the adsorption assembly and capable of moving with the adsorption assembly to trigger the sensor to stop the moving assembly from moving the adsorption assembly.

9. The ingot stripping apparatus according to any one of claims 1 to 8, wherein The adsorption assembly comprises: a porous ceramic plate provided with adsorption micropores; a dense ceramic plate provided on the porous ceramic plate; Alternatively, the adsorption assembly comprises: an adsorption disc substrate provided with a plurality of adsorption holes; an adsorption cover plate provided on the adsorption disc substrate.

10. The ingot stripping apparatus according to any one of claims 1 to 8, wherein The adsorption assembly comprises: a suction cup mounting component; a plurality of suction cups provided on the suction cup mounting component.

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