Heat dissipation plate and charging device

Abstract

The utility model provides a heat dissipation plate and a charging device, the heat dissipation plate is provided with a first surface and a second surface which are opposite, the first surface is used for arranging a circuit board, the second surface is provided with a bulge, and the bulge protrudes from the second surface and abuts against the inner wall of a shell, so that a heat insulation gap is formed between the second surface and the inner wall of the shell. The heat insulation gap can effectively prevent high temperature of the heat dissipation plate from being conducted to the surface of the shell, the probability of equipment shutdown caused by too fast temperature rise of the shell is reduced, the charging working time of each time is prolonged, a user can use the device conveniently, meanwhile, the high-temperature shell is prevented from scalding the user, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the technical field of vehicle chargers, and particularly to a heat sink and charging device. Background Technology

[0002] Currently, some new energy vehicles are equipped with a vehicle charger and an energy storage power supply. The energy storage power supply is electrically connected to the new energy vehicle's generator via the vehicle charger, and is also electrically connected to the vehicle's battery. During driving, some of the electricity generated by the generator charges the energy storage power supply through the vehicle charger. When the battery is low on power, the energy storage power supply can replenish the battery using its stored energy.

[0003] In related technologies, when a car charger is working, the internal components generate a lot of heat, which is quickly conducted to the casing, causing the casing to heat up too quickly and affecting user experience. Utility Model Content

[0004] Therefore, this application provides a heat sink and a charging device, which have the effect of slowing down the rate of temperature rise of the casing and improving the user experience.

[0005] The first aspect of this application provides a heat sink for use in a charging device. The charging device includes a housing and a circuit board. The heat sink is disposed inside the housing and is fixedly connected to the housing. The heat sink has a first side and a second side facing each other. The first side is used for mounting the circuit board, and the second side is provided with a protrusion that protrudes from the second side and abuts against the inner wall of the housing, so that a heat insulation gap is formed between the second side and the inner wall of the housing.

[0006] In some embodiments, the protrusions are multiple and spaced apart.

[0007] In some embodiments, the protrusions extend along a first direction, and a plurality of protrusions are spaced apart along a second direction, with an angle between the first direction and the second direction.

[0008] In some embodiments, the heat sink has openings that penetrate the first and second surfaces and are located near the protrusions. The openings are used for the electronic components of the circuit board to pass through.

[0009] In some embodiments, the heat sink has a fixing hole that extends through the first and second surfaces. The fixing hole is used for fixing screws to pass through, and the circuit board and the heat sink are fixed by the fixing screws.

[0010] In some embodiments, the end of the fixing screw is exposed on the second surface through a fixing hole and abuts against the inner wall of the housing to ground the circuit board.

[0011] The second aspect of this application provides a charging device, characterized in that the charging device includes a housing, a circuit board, and a heat sink as provided in the first aspect; the heat sink is disposed inside the housing and fixedly connected to the housing; the heat sink has a first side and a second side facing each other, the first side is used for mounting the circuit board, and a gap is left between the second side and the inner wall of the housing to form a heat insulation gap.

[0012] In some embodiments, the heat sink is provided with a connecting arm, and there is an angle between the connecting arm and the heat sink; a mounting member is provided on the inner side of the housing, and the mounting member is fixedly connected to the connecting arm.

[0013] In some embodiments, the mounting component has mounting holes for engaging with mounting screws to secure the connecting arm.

[0014] In some embodiments, the housing is provided with a receiving cavity for accommodating the circuit board and the heat sink, and the receiving cavity forms a mounting opening through one side of the housing; the connecting arm is disposed on the side of the heat sink near the mounting opening.

[0015] In actual operation, the heat generated by the circuit board can be directly conducted to the heat sink for even heat distribution. The protrusions create a thermally insulating gap between the second surface and the second inner wall, reducing the contact area between them and increasing the thermal resistance of heat transfer from the second surface to the second inner wall, thus mitigating heat conduction between the first surface and the housing. Similarly, a gap exists between the first surface and the second inner wall to further reduce heat conduction between the second surface and the housing.

[0016] The heat sink and charging device provided in this application can effectively block the high temperature of the heat sink from being conducted to the surface of the casing, reduce the probability of the device shutting down due to the casing temperature rising too quickly, increase the working time of each charge, make it convenient for users to use, and at the same time avoid burning users with the high temperature casing, thus improving the user experience. Attached Figure Description

[0017] Figure 1 A schematic diagram of the charging device in one embodiment is provided for this application.

[0018] Figure 2 An exploded view of a charging device in one embodiment is provided for this application.

[0019] Figure 3 An application scenario diagram of the charging device in one embodiment is provided for this application.

[0020] Figure 4 A schematic diagram of the first side of a heat sink in one embodiment is provided for this application.

[0021] Figure 5 A schematic diagram of the second side of the heat sink in one embodiment is provided for this application.

[0022] Figure 6 A cross-sectional schematic diagram of a charging device in one embodiment is provided for the purposes of this application.

[0023] Figure 7 for Figure 6 A magnified view of a portion of point A in the middle.

[0024] Figure 8 A schematic diagram of the shell structure in one embodiment is provided for this application.

[0025] Figure 9 A schematic diagram of the connection between the fixing screw, circuit board and heat sink in one embodiment is provided for this application.

[0026] Figure 10 for Figure 8 A magnified view of a section at point B in the middle.

[0027] Explanation of main component symbols

[0028] 10. Heat sink; 11. First side; 12. Second side; 13. Protrusion; 14. Insulation gap; 15. Opening; 16. Fixing hole; 161. Fixing nut; 17. Connecting arm; 171. Connecting hole; 20. Circuit board; 21. Interface; 30. Housing; 31. Accommodating cavity; 32. Mounting port; 33. Terminal port; 34. First wall; 35. Second wall; 37. Mounting component; 371. Mounting hole; 372. Mounting part; 373. Connecting part; 40. First cover plate; 50. Second cover plate; 51. Through hole; 60. Fixing screw; 70. Mounting screw; 80. Locking screw; 100. Charging device; 200. Energy storage power supply; 300. Generator; 400. Battery. Detailed Implementation

[0029] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0030] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an element positioned in between. When an element is considered to be "set" on another element, it can be directly set on the other element or there may be an element positioned in between. In this application, unless otherwise expressly specified and limited, the terms "installed," "connected," "linked," "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms “comprising” and “equivalent to”, and any variations thereof, in the specification, claims, and foregoing description of the drawings, are intended to cover non-exclusive inclusion.

[0032] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0033] Currently, some new energy vehicles are equipped with a vehicle charger and an energy storage power supply. The energy storage power supply is electrically connected to the new energy vehicle's generator via the vehicle charger, and is also electrically connected to the vehicle's battery. During driving, some of the electricity generated by the generator charges the energy storage power supply through the vehicle charger. When the battery is low on power, the energy storage power supply can replenish the battery using its stored energy.

[0034] However, car chargers generate a lot of heat during operation. Furthermore, car chargers are subject to significant vibrations due to the movement of the vehicle, which can easily damage the components inside the charger.

[0035] Specifically, a vehicle charger typically includes a housing, a circuit board, and a heat sink (also known as a vapor chamber). Both the heat sink and the circuit board are housed within the housing. The circuit board is fixed to one side of the heat sink and is thermally connected to it. The side of the heat sink away from the circuit board is in close contact with the inner wall of the housing and is fixedly connected to it.

[0036] The heat generated by the circuit board during operation is directly conducted to the heat sink. Some of the heat from the heat sink can be dissipated through other heat dissipation structures. However, due to the large contact area between the heat sink and the housing, another part of the heat from the heat sink is quickly conducted to the housing, causing the housing temperature to rise rapidly.

[0037] To ensure the safety performance of the car charger, the temperature of the casing must not exceed a certain level (e.g., above 70°C). Therefore, if the casing temperature rises too quickly, the car charger must be paused and restarted only after the casing temperature has decreased. This causes inconvenience to users and affects the charging time. Furthermore, an excessively hot casing may burn the user, impacting the user experience.

[0038] To address the issue of rapid temperature rise in the casing, some vehicle chargers install additional heat dissipation components on the casing to provide air or liquid cooling. However, this increases hardware costs and results in a larger number of components, larger device size, and greater assembly difficulty.

[0039] Therefore, this application provides a heat sink and a charging device, which have the characteristics of slowing down the rise of the casing temperature, reducing hardware costs, and improving user experience.

[0040] Figure 1 A schematic diagram of the charging device in one embodiment is provided for this application. Figure 2 An exploded view of a charging device in one embodiment is provided for this application.

[0041] like Figure 1 and Figure 2 As shown, this application embodiment first provides a heat sink 10, which is applied to a charging device 100. The charging device 100 includes a housing 30, a circuit board 20, and the heat sink 10. Both the circuit board 20 and the heat sink 10 are disposed within the housing 30.

[0042] The circuit board 20 is fixed to the heat sink 10 and is thermally connected to the heat sink 10. The heat sink 10 is fixedly connected to the housing 30. The circuit board 20 generates heat during operation. The heat sink 10 supports and fixes the circuit board 20, and the heat from the circuit board 20 can be quickly conducted to the heat sink 10, achieving a uniform heat distribution. In the example of this application, the housing 30 can adopt a metal sheet metal structure, and the material includes, but is not limited to, aluminum, copper, iron, etc., which can be selected according to the heat dissipation requirements.

[0043] In the example of this application, the housing 30 is provided with a receiving cavity 31 for accommodating the circuit board 20 and the heat sink 10. One side of the receiving cavity 31 extends through the housing 30 to form a mounting opening 32, and the other side extends through the housing 30 to form a terminal opening 33. The housing 30 is also provided with a first cover plate 40 and a second cover plate 50. The first cover plate 40 blocks the mounting opening 32 and is detachably connected to the housing 30. The second cover plate 50 blocks the terminal opening 33 and is detachably connected to the housing 30. The second cover plate 50 has a through hole 51. An interface 21 is provided on the side of the circuit board 20 near the second cover plate 50. The interface 21 is exposed through the through hole 51 to the second cover plate 50 for terminal insertion of external devices.

[0044] In the assembly process of the charging device 100, the circuit board 20 can be fixed to the heat sink 10, and the heat sink 10 and the circuit board 20 can be placed into the housing 30 together through the mounting port 32 and the heat sink 10 can be fixed. Then, the first cover plate 40 is installed on the housing 30 and the mounting port 32 is blocked, and the second cover plate 50 is installed on the housing 30 and the terminal port 33 is blocked. The first cover plate 40 and the second cover plate 50 protect the circuit board 20, the heat sink 10 and various devices in the accommodating cavity 31. External devices can be connected to the interface 21 exposed on the second cover plate 50 through the port.

[0045] Figure 3 An application scenario diagram of the charging device in one embodiment is provided for this application.

[0046] Please refer to the following: Figure 3 The charging device 100 can be applied to energy storage devices such as vehicle energy storage devices and home energy storage devices. In the example of this application, the charging device 100 is applied to a vehicle energy storage device. The vehicle energy storage device includes a charging device 100 and an energy storage power supply 200, and the circuit board 20 of the charging device 100 is electrically connected to the energy storage power supply 200. The vehicle energy storage device can be installed in a new energy vehicle, which has a generator 300 and a battery 400. The charging device 100 is electrically connected to the generator 300, and the battery 400 is electrically connected to the energy storage power supply 200.

[0047] During the operation of the new energy vehicle, some of the electrical energy generated by the generator 300 charges the energy storage power supply 200 through the vehicle charger. When the battery 400 is depleted, the energy storage power supply 200 can replenish the battery 400 with its stored electrical energy.

[0048] Figure 4 A schematic diagram of the first side of a heat sink in one embodiment is provided for this application. Figure 5 A schematic diagram of the second side of the heat sink in one embodiment is provided for this application. Figure 6 A cross-sectional schematic diagram of a charging device in one embodiment is provided for the purposes of this application. Figure 7 forFigure 6 A magnified view of a portion of point A in the middle.

[0049] Please refer to the following: Figure 4 to Figure 7 In this embodiment, the heat sink 10 has a first surface 11 and a second surface 12 opposite to each other. The first surface 11 is provided for the circuit board 20, and the second surface 12 is provided with a protrusion 13. The protrusion 13 protrudes from the second surface 12 and abuts against the inner wall of the housing 30, so that a heat insulation gap 14 is formed between the second surface 12 and the inner wall of the housing 30.

[0050] Figure 8 A schematic diagram of the shell structure in one embodiment is provided for this application.

[0051] Please refer to the following: Figure 8 For example, the housing 30 has a first wall 34, a second wall 35 and two side walls 36, wherein the first wall 34 and the second wall 35 are disposed opposite each other along the thickness direction of the housing 30, and the two side walls 36 are respectively disposed between the first wall 34 and the second wall 35, and the first wall 34, the second wall 35 and the two side walls 36 together form a receiving cavity 31.

[0052] The side of the heat sink 10 facing the first wall 34 is designated as the first surface 11. A gap is left between the first surface 11 and the first wall 34 to form an interstitial space for accommodating the circuit board 20. The circuit board 20 is fixed to the first surface 11 and is thermally connected to the heat sink 10. The side of the heat sink 10 facing the second wall 35 is designated as the second surface 12. A gap is left between the second surface 12 and the second wall 35 using the protrusion 13 to form a heat insulation gap 14.

[0053] In actual operation, the heat generated by the circuit board 20 can be directly conducted to the heat sink 10 for uniform heat distribution. The protrusion 13 forms a thermal insulation gap 14 between the second surface 12 and the second wall 35, reducing the contact area between them and increasing the thermal resistance of heat transfer from the second surface 12 to the second wall 35, thereby mitigating heat conduction between the first surface 11 and the housing 30. Similarly, a gap also exists between the first surface 11 and the second wall 35 to reduce heat conduction between the second surface 12 and the housing 30.

[0054] In this way, the high temperature of the heat sink 10 can be effectively blocked from being conducted to the surface of the housing 30, reducing the chance of the housing 30 heating up too quickly and causing the device to shut down, increasing the working time of each charge, making it convenient for users to use, and at the same time preventing the high temperature of the housing 30 from burning users, thus improving the user experience.

[0055] Furthermore, the heat insulation effect is achieved by utilizing the heat insulation gap 14 between the heat sink 10 and the housing 30, eliminating the need for additional heat dissipation components for the housing 30, thus reducing hardware costs, decreasing equipment size, and facilitating production and assembly.

[0056] On the other hand, by abutting against the inner wall of the housing 30 with the protrusion 13, the housing 30 can support the heat sink 10, thereby strengthening the connection between the heat sink 10 and the housing 30, providing more stable support for the circuit board 20, and reducing the risk of damage to the heat sink 10 or the circuit board 20 during vehicle bumps.

[0057] In some embodiments, the heat sink 10 is rectangular. For ease of understanding, the length direction of the heat sink 10 is defined as the first direction (i.e., the X-axis direction in the figure), the width direction of the heat sink 10 is defined as the second direction (i.e., the Y-axis direction in the figure), and the thickness direction of the heat sink 10 is defined as the third direction (i.e., the Z-axis direction in the figure). The first direction, the second direction, and the third direction are perpendicular to each other. The heat sink 10 has a first surface 11 and a second surface 12 on its two sides in the third direction, respectively.

[0058] It is worth noting that the description of the heat sink 10 as rectangular in this application refers to the fact that the main body of the heat sink 10 is rectangular or rectangular. Other shapes may also be provided in some areas of the heat sink 10. In other embodiments, the main body shape of the heat sink 10 may be designed according to specific installation requirements, such as using polygons or irregular shapes. This application does not impose any restrictions on this.

[0059] In some embodiments, the heat sink 10 adopts a metal sheet structure, and the materials include, but are not limited to, aluminum, copper, and iron, so that the heat sink 10 has good heat dissipation and electrical conductivity. The circuit board 20 is electrically connected to the heat sink 10, and the heat sink 10 is electrically connected to the housing 30 to ground the circuit board 20, so that the circuit board 20 has reliable EMC (Electromagnetic Compatibility) grounding performance, achieving the effects of interference suppression and electromagnetic shielding.

[0060] In some embodiments, the heat sink 10 is cast using a one-piece molding process, and the protrusion 13 is formed by bending the heat sink 10. The bent portion is recessed on the first surface 11 and protrudes on the second surface 12 to form the protrusion 13. In this way, the protrusion 13 is integrated with the heat sink 10, which simplifies the overall processing and assembly process of the heat sink 10, reduces material costs, and improves production efficiency.

[0061] It is worth noting that in other embodiments, the protrusion 13 can also be designed as a separate unit. For example, the protrusion 13 can be fixed to the second surface 12 by riveting, bonding, welding or other methods. The specific design can be made according to the actual application requirements, and this application does not limit it.

[0062] In some embodiments, there are multiple protrusions 13, which are spaced apart. For example, the protrusions 13 are generally elongated and extend along a first direction. The multiple protrusions 13 are arranged at intervals along a second direction.

[0063] Thus, a single protrusion 13 can span multiple locations of the heat sink 10 along the length direction in the first direction, and multiple protrusions 13 can be arranged side by side in the second direction and span multiple locations of the heat sink 10 along the width direction, thereby providing more comprehensive and stable support for the heat sink 10.

[0064] It is worth noting that in other embodiments, the protrusions 13 may also adopt other shapes or arrangements. For example, the protrusions 13 may also be dot-shaped, curved, etc., and multiple protrusions 13 may also be distributed in a matrix or irregular manner. The specific design can be made according to the actual application requirements, and this application does not limit it.

[0065] In some embodiments, the heat sink 10 has an opening 15 that extends through the first surface 11 and the second surface 12, and the opening 15 is used for the electronic components of the circuit board 20 to pass through.

[0066] For example, electronic components are provided on both sides of the circuit board 20. The electronic components located on the side of the circuit board 20 away from the heat sink 10 can be disposed between the first side 11 and the first wall 34. The electronic components located on the side of the circuit board 20 facing the heat sink 10 can be accommodated in the opening 15 to avoid positional interference between the electronic components and the heat sink 10.

[0067] In some embodiments, the openings 15 are located adjacent to the protrusions 13. Exemplarily, the openings 15 are elongated and extend along a first direction, and the length of the opening 15 is less than the length of the protrusion 13. There are multiple openings 15, and each opening 15 is adjacent to the side of at least one protrusion 13. In the description of this application, "one object is adjacent to another object" means that the distance between the two objects is within a specified range, which can be designed according to actual needs.

[0068] In this way, the position of the heat sink 10 near the opening 15 can be structurally reinforced by the protrusion 13 to compensate for the reduction in thickness of the heat sink 10 caused by the opening 15 itself, ensure the structural strength of the heat sink 10, and provide more stable support for the circuit board 20.

[0069] Figure 9 A schematic diagram of the connection between the fixing screw, circuit board and heat sink in one embodiment is provided for this application.

[0070] Please refer to the following: Figure 9In some embodiments, the heat sink 10 has a fixing hole 16 that extends through the first surface 11 and the second surface 12. The fixing hole 16 is used for a fixing screw 60 to pass through, and the circuit board 20 and the heat sink 10 are fixed by the fixing screw 60. For example, the fixing hole 16 is provided with a fixing nut 161, which can be fixed to the heat sink 10 by riveting, welding, bonding, etc. The fixing screw 60 passes through the circuit board 20 and is threadedly connected to the fixing nut 161 to fix the circuit board 20 to the heat sink 10.

[0071] In some embodiments, there are multiple fixing holes 16, which are spaced apart and can be used to pass through multiple fixing screws 60 and fix them to the circuit board 20, thereby improving the connection stability between the circuit board 20 and the heat sink 10.

[0072] In some embodiments, the end of the fixing screw 60 is exposed on the second surface 12 through the fixing hole 16 and abuts against the inner wall of the housing 30 to ground the circuit board 20. Exemplarily, the fixing screw 60 is made of metal, the nut of the fixing screw 60 contacts the circuit board 20, the threaded shank of the fixing screw 60 contacts the heat sink 10 through the fixing nut 161, and the end of the screw shank of the fixing screw 60 protrudes from the second surface 12 and contacts the second wall 35.

[0073] Thus, both the circuit board 20 and the heat sink 10 are electrically connected to the fixing screw 60, and the fixing screw 60 is in contact with the housing 30 to conduct electricity, thereby achieving grounding. The fixing screw 60 can not only fix the circuit board 20 and the heat sink 10, but also ground the circuit board 20 and the heat sink 10, thereby simplifying the fixing connection structure and grounding structure, reducing hardware costs, and shrinking the size of the equipment.

[0074] In some embodiments, the heat sink 10 is provided with a connecting arm 17, and the connecting arm 17 and the heat sink 10 form an angle. A mounting member 37 is provided on the inner side of the housing 30, and the mounting member 37 is fixedly connected to the connecting arm 17. The fixed connection between the connecting arm 17 and the mounting member 37 fixes and limits the heat sink 10, and, in conjunction with the support of the protrusion 13, allows the heat sink 10 to be stably installed within the housing 30.

[0075] In some embodiments, the circuit board 20 and the heat sink 10 are both housed in the accommodating cavity 31, and the connecting arm 17 is disposed on the side of the heat sink 10 near the mounting port 32 of the accommodating cavity 31.

[0076] In the assembly process of the charging device 100, the circuit board 20 can be fixed to the heat sink 10, and the heat sink 10 and the circuit board 20 can be put into the housing 30 together through the mounting port 32. During the insertion process, the side of the heat sink 10 away from the connecting arm 17 can be put into the housing 30 first. After the heat sink 10 is completely inserted into the housing 30, the position of the connecting arm 17 reaches the mounting port 32, so that the connecting arm 17 can directly dock with the mounting part 37 located at the mounting port 32 and complete the fixation, thereby improving the assembly efficiency.

[0077] In some embodiments, the connecting arm 17 is integrally formed with the heat sink 10, and the connecting arm 17 is located on the side of the heat sink 10 away from the interface 21. The connecting arm 17 is bent relative to the heat sink 10. There are multiple connecting arms 17, which are distributed on both sides of the heat sink 10 in the first direction. A plurality of mounting members 37 corresponding to the connecting arms 17 are provided inside the housing 30, and each mounting member 37 is fixedly connected to the corresponding connecting arm 17.

[0078] Figure 10 for Figure 8 A magnified view of a section at point B in the middle.

[0079] Please refer to the following: Figure 10 In some embodiments, the mounting member 37 has a mounting hole 371 for engaging with the mounting screw 70 to fix the connecting arm 17. For example, the mounting member 37 is integrally formed with the housing 30, the mounting member 37 extends entirely along a second direction, and the mounting hole 371 extends through both ends of the mounting member 37 along the second direction.

[0080] The connecting arm 17 has a connecting hole 171 for the mounting screw 70 to pass through. When the heat sink 10 is fully inserted into the housing 30, the connecting arm 17 abuts against the corresponding mounting member 37, and the connecting hole 171 is aligned with the mounting hole 371. The mounting screw 70 passes through the connecting hole 171 and is threaded into the corresponding mounting hole 371 to fix the connecting arm 17 to the mounting member 37.

[0081] By placing the mounting piece 37 inside the housing 30 and fixing the heat sink 10 and the housing 30 together via the connecting arm 17 and the mounting piece 37, the connection points and contact area between the heat sink 10 and the housing 30 can be reduced, the gap between the heat sink 10 and the inner side of the housing 30 can be increased, and the heat conduction from the heat sink 10 to the housing 30 can be hindered.

[0082] In some embodiments, the mounting member 37 has a mounting portion 372 and a connecting portion 373, wherein the mounting portion 372 is fixedly connected to the connecting arm 17, and the connecting portion 373 is connected to the side wall 36 of the housing 30. The mounting portion 372 has a mounting hole 371 that extends through both ends of the mounting portion 372 along a second direction. The thickness of the mounting portion 372 in a third direction is greater than the thickness of the connecting portion 373 in a third direction.

[0083] Thus, the thickness of the mounting part 37 gradually decreases from the mounting part 372 to the connecting part 373, so that the thermal resistance of the mounting part 37 gradually increases from the mounting part 372 to the connecting part 373, reducing the heat conduction from the connecting arm 17 to the mounting part 37 to the housing 30, and further improving the heat insulation effect.

[0084] In some embodiments, the first cover plate 40 can be fixed to the housing 30 by snap-fit, interference fit, or other means, and seal the mounting opening 32 to cover the connecting arm 17 and the mounting screw 70. In this way, the screw structure exposed on the surface of the housing 30 can be reduced, protecting the overall appearance integrity of the housing 30.

[0085] In some embodiments, the second cover plate 50 can be fixed to the end of the mounting member 37 away from the first cover plate 40 by locking screws 80. The interface 21 on the circuit board 20 can be exposed to the housing 30 through the through hole 51 of the second cover plate 50. The through hole 51 has a positioning effect on the interface 21, thereby positioning the circuit board 20 and the heat sink 10 and improving the installation stability of the circuit board 20 and the heat sink 10.

[0086] In summary, the heat sink 10 provided in this application has multiple functions. On the one hand, it can serve as a structural component to support and fix the circuit board 20. While achieving a high-strength support effect by utilizing the protrusion 13 and connecting arm 17, it reduces the installation of screw structures between the circuit board 20 and the housing 30, making the structure simpler and more flexible. On the other hand, the heat sink 10 can also serve as a heat dissipation component to conduct heat from the circuit board 20 and block heat conduction to the housing 30, thereby slowing down the heating rate of the housing 30, extending the working time of the device, and improving the user experience.

[0087] like Figure 1 to Figure 3 As shown in the illustration, this application also provides a charging device 100, which includes a housing 30, a circuit board 20, and a heat sink 10 as described in any of the above embodiments. Both the circuit board 20 and the heat sink 10 are disposed within the housing 30. The circuit board 20 is fixed to the heat sink 10 and is thermally connected to it. The heat sink 10 is fixedly connected to the housing 30.

[0088] The charging device 100 can be applied to energy storage devices such as vehicle energy storage devices and home energy storage devices. In the example of this application, the charging device 100 is applied to a vehicle energy storage device. The vehicle energy storage device includes a charging device 100 and an energy storage power supply 200, and the circuit board 20 of the charging device 100 is electrically connected to the energy storage power supply 200. The vehicle energy storage device can be installed in a new energy vehicle, which has a generator 300 and a battery 400. The charging device 100 is electrically connected to the generator 300, and the battery 400 is electrically connected to the energy storage power supply 200.

[0089] During the operation of the new energy vehicle, some of the electrical energy generated by the generator 300 charges the energy storage power supply 200 through the vehicle charger. When the battery 400 is depleted, the energy storage power supply 200 can replenish the battery 400 with its stored electrical energy.

[0090] This application provides the working principle and beneficial effects of the charging device 100, which can be seen in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A heat dissipation plate applied to a charging device, the charging device comprising a housing and a circuit board, characterized in that, The heat dissipation plate is arranged in the shell and fixedly connected with the shell; the heat dissipation plate has opposite first and second surfaces, the first surface is used for arranging the circuit board, and the second surface is provided with protrusions protruding from the second surface and abutting against the inner wall of the shell to form a heat insulation gap between the second surface and the inner wall of the shell.

2. The heat spreader of claim 1, wherein, The protrusions are multiple, and the multiple protrusions are distributed at intervals.

3. The heat spreader of claim 2, wherein, The protrusions extend along a first direction, and the multiple protrusions are arranged at intervals along a second direction, and the first direction and the second direction have an included angle.

4. The heat spreader of claim 1, wherein, The heat dissipation plate is provided with an opening, the opening penetrates the first surface and the second surface, and the position of the opening is adjacent to the protrusions, and the opening is used for penetrating the electronic elements of the circuit board.

5. The heat spreader of claim 1, wherein, The heat dissipation plate is provided with a fixing hole, the fixing hole penetrates the first surface and the second surface, the fixing hole is used for penetrating the fixing screw, and the circuit board and the heat dissipation plate are fixed by the fixing screw.

6. The heat spreader of claim 5, wherein, The end of the fixing screw is exposed to the second surface through the fixing hole and abuts against the inner wall of the shell, so that the circuit board is grounded.

7. A charging device, characterized by The charging device comprises a shell, a circuit board and the heat dissipation plate according to any one of claims 1-6. The heat dissipation plate is arranged in the shell and fixedly connected with the shell; the heat dissipation plate has opposite first and second surfaces, the first surface is used for arranging the circuit board, and the second surface is provided with protrusions protruding from the second surface and abutting against the inner wall of the shell to form a heat insulation gap between the second surface and the inner wall of the shell.

8. The charging device of claim 7, wherein, The heat dissipation plate is provided with a connecting arm, and the connecting arm and the heat dissipation plate have an included angle; the inner side of the shell is provided with a mounting piece, and the mounting piece is fixedly connected with the connecting arm.

9. The charging device of claim 8, wherein, The mounting piece is provided with a mounting hole, and the mounting hole is used for cooperating with a mounting screw to fix the connecting arm.

10. The charging device of claim 8, wherein, The shell is provided with a containing cavity for accommodating the circuit board and the heat dissipation plate, the containing cavity penetrates one surface of the shell to form a mounting port; and the connecting arm is arranged on the side of the heat dissipation plate close to the mounting port.

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