Ceramic wafer electroplating fixing device

Abstract

The utility model discloses a ceramic chip electroplating fixing device, which belongs to the technical field of ceramic chip surface electroplating and comprises a main board with conductivity and a plurality of stations arranged on the main board and used for placing and fixing ceramic chips. Each station comprises a through groove and a step mechanism connected with the through groove, and the upper surface and the lower surface of the step mechanism are staggered; the ceramic chip is placed in the through groove and attached to the lower surface of the step mechanism, the ceramic chip is rotated, the ceramic chip coincides with the upper surface of the step mechanism, and the ceramic chip is fixed in the station. According to the utility model, a plurality of stations are arranged on the conductive mainboard, the ceramic chip is placed on the lower surface of the step mechanism, and the ceramic chip is rotated to coincide with the upper surface of the step mechanism by utilizing a staggered structure of the upper surface and the lower surface of the step mechanism, so that the ceramic chip is fixed and the bottom of the ceramic chip is a through groove; the ceramic wafer is prevented from being directly hooked, the contact area between the ceramic wafer and the fixing piece is reduced, the electroplating area is increased, and the thickness of an electroplating factory is uniform.

Description

Technical Field

[0001] This utility model relates to a ceramic sheet electroplating fixing device, belonging to the field of ceramic sheet surface electroplating technology. Background Technology

[0002] Ceramic sheets are widely used in the circuit board industry due to their excellent heat dissipation and insulation properties. Before application, copper is usually plated on the surface of the ceramic sheet to form circuits. Due to the size of the ceramic sheet and the manufacturing process, rack plating is usually used, with single-sheet electroplating. During electroplating, the ceramic sheet is fixed at one end of the two corners by screws or hooks to achieve conductive connection. The ceramic sheets used in circuit boards are thin and brittle, and traditional rack plating fixtures cannot clamp the ceramic sheets tightly, which can easily lead to breakage and damage. In addition, the large contact area between the hook and the surface to be electroplated results in uneven copper plating thickness, leading to quality problems in the electroplated products and a high scrap rate. Utility Model Content

[0003] The purpose of this utility model is to overcome the shortcomings of the existing technology and provide a ceramic sheet electroplating fixing device, which avoids directly hooking the ceramic sheet, reduces the contact area between the ceramic sheet and the fixing part, increases the electroplating area and makes the electroplating thickness uniform, and solves the problem of high scrap rate of electroplated products caused by the current use of hooks.

[0004] To solve the above-mentioned technical problems, this utility model is implemented using the following technical solution:

[0005] This utility model provides a ceramic sheet electroplating fixing device, including: a conductive main board and multiple workstations on the main board for placing and fixing ceramic sheets;

[0006] The workstation includes a through groove and a stepped mechanism connected to the through groove with its upper and lower surfaces offset; a ceramic sheet is placed in the through groove and is attached to the lower surface of the stepped mechanism; the ceramic sheet is rotated so that it coincides with the upper surface of the stepped mechanism and is fixed in the workstation.

[0007] Optionally, the multiple workstations are evenly distributed from the center of the motherboard towards the outline of the motherboard. The multiple evenly distributed workstations facilitate the simultaneous electroplating of multiple ceramic sheets, thereby improving production efficiency.

[0008] Optionally, the upper surface of the step mechanism is connected to the upper surface of the main board, and the lower surface of the step mechanism is connected to the through groove.

[0009] Optionally, the step mechanism includes four first side edges corresponding to the outline of the ceramic sheet, four second side edges corresponding to the outline of the ceramic sheet, and a limiting mechanism connected to the first side edges and the second side edges respectively for fixing the ceramic sheet.

[0010] The first side coincides with the side of the through groove, forming the upper surface of the step mechanism;

[0011] The second side is offset from the side of the through groove and is provided with a platform for placing ceramic pieces, forming the lower surface of the stepped mechanism.

[0012] Optionally, the area enclosed by the first side is inclined at 15° compared to the area enclosed by the second side.

[0013] Optionally, the platform extends along the second side and coincides with the contour of the first side. The platform is "L" shaped, which reduces the contact area between the ceramic sheet and the motherboard after the ceramic sheet rotates, while preventing the ceramic sheet from falling out of the through groove.

[0014] Optionally, the limiting mechanism includes a protrusion on the first side for holding the ceramic piece and two grooves on the second side for placing the corners of the ceramic piece.

[0015] Optionally, the bump is on the same horizontal plane as the upper surface of the motherboard, and the groove is on the same horizontal plane as the platform and recessed to the outside of the second side. The groove provides a transition space for the corners of the ceramic sheet to be placed and rotated in the workstation, protecting the corners.

[0016] Compared with the prior art, the beneficial effects achieved by this utility model are as follows:

[0017] This invention sets up multiple workstations on a conductive motherboard. A ceramic sheet is placed on the lower surface of a stepped mechanism. Utilizing the staggered structure of the upper and lower surfaces of the stepped mechanism, the ceramic sheet is rotated to make it coincide with the upper surface of the stepped mechanism. At this time, the ceramic sheet is fixed and the bottom of the ceramic sheet is a through groove, which avoids directly hooking the ceramic sheet, reduces the contact area between the ceramic sheet and the fixing part, increases the electroplating area, and makes the electroplating thickness uniform. This solves the problem of high scrap rate of electroplated products caused by the current use of hooks. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a ceramic sheet electroplating fixing device provided in an embodiment of this utility model;

[0019] Figure 2 This is a schematic diagram of the workstation structure of a ceramic sheet electroplating fixing device provided in an embodiment of this utility model;

[0020] Figure 3 This is a schematic diagram of the placement position of the ceramic sheet provided in this embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the ceramic sheet fixing position provided in an embodiment of this utility model.

[0022] In the diagram: 1. Main board; 2. Workstation; 201. Through slot; 202. Step mechanism; 2021. First side; 2022. Second side; 2031. Protrusion; 2032. Groove; 3. Platform; 4. Ceramic sheet. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0024] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example

[0026] like Figure 1 As shown, a ceramic sheet electroplating fixing device includes: a conductive main board 1 and a plurality of workstations 2 opened on the top of the main board 1 for placing and fixing ceramic sheets; wherein, the plurality of workstations 2 are evenly distributed from the center of the main board 1 toward the outline of the main board 1.

[0027] like Figure 2As shown, station 2 includes a through groove 201 and a stepped mechanism 202 connected to the through groove 201 and with its upper and lower surfaces offset. The upper surface of the stepped mechanism 202 is connected to the upper surface of the main board 1, and the lower surface of the stepped mechanism 202 is connected to the through groove 201. A ceramic sheet is placed in the through groove 201 and is attached to the lower surface of the stepped mechanism 202. Specifically:

[0028] The step mechanism 202 includes four first side edges 2021 corresponding to the outline of the ceramic sheet, four second side edges 2022 corresponding to the outline of the ceramic sheet, and a limiting mechanism connected to the first side edges 2021 and the second side edges 2022 respectively for fixing the ceramic sheet; wherein, the first side edge 2021 coincides with the side edge of the through groove 201 to form the upper surface of the step mechanism 202, and the second side edge 2022 is offset from the side edge of the through groove 201 and is provided with a platform 3 for placing the ceramic sheet to form the lower surface of the step mechanism 202;

[0029] The limiting mechanism includes a protrusion 2031 fixed to the first side 2021 and two grooves 2032 opened on the second side 2022 for placing the corners of the ceramic sheet; the protrusion 2031 is on the same horizontal plane as the upper surface of the main board 1, and the grooves 2032 are on the same horizontal plane as the platform 3 and recessed outward from the second side 2022. The grooves 2032 provide a transition space for the corners of the ceramic sheet to be placed and rotated in the station 2, protecting the corners;

[0030] The ceramic sheet is placed on the platform 3 along the second side 2022. The ceramic sheet is rotated counterclockwise so that the four sides of the ceramic sheet coincide with the first side 2021. The upper surface of the ceramic sheet is in contact with the lower surface of the protrusion 2031. At this time, the ceramic sheet is fixed in the station 2. Since the bottom of the ceramic sheet is a through groove 201 and only contacts part of the platform 3, it avoids directly hooking the ceramic sheet, reduces the contact area between the ceramic sheet and the fixing part, increases the electroplating area, and makes the electroplating thickness uniform. Example

[0031] like Figure 1 As shown, a ceramic sheet electroplating fixing device includes: a conductive main board 1 and a plurality of workstations 2 opened on the top of the main board 1 for placing and fixing ceramic sheets; wherein, the plurality of workstations 2 are evenly distributed from the center of the main board 1 toward the outline of the main board 1. In this embodiment, the number of workstations 2 is 9. By using the plurality of evenly distributed workstations 2, it is convenient to electroplat multiple ceramic sheets at the same time, thereby improving production efficiency.

[0032] like Figure 2 As shown, station 2 includes a through groove 201 and a stepped mechanism 202 connected to the through groove 201 and with its upper and lower surfaces offset. The upper surface of the stepped mechanism 202 is connected to the upper surface of the main board 1, and the lower surface of the stepped mechanism 202 is connected to the through groove 201. A ceramic sheet is placed in the through groove 201 and is attached to the lower surface of the stepped mechanism 202. Specifically:

[0033] The step mechanism 202 includes four first side edges 2021 corresponding to the outline of the ceramic sheet, four second side edges 2022 corresponding to the outline of the ceramic sheet, and a limiting mechanism connected to the first side edges 2021 and the second side edges 2022 respectively for fixing the ceramic sheet; wherein, the first side edge 2021 coincides with the side edge of the through groove 201 to form the upper surface of the step mechanism 202, and the second side edge 2022 is offset from the side edge of the through groove 201 and is provided with a platform 3 for placing the ceramic sheet to form the lower surface of the step mechanism 202;

[0034] Platform 3 extends along the second side 2022 and coincides with the outline of the first side 2021. Platform 3 is "L" shaped, which reduces the contact area between the ceramic sheet and the main board 1 after the ceramic sheet rotates, while preventing the ceramic sheet from falling out of the through groove 201.

[0035] In this embodiment, the area enclosed by the first side 2021 is inclined at 15° compared to the area enclosed by the second side 2022;

[0036] The limiting mechanism includes a protrusion 2031 fixed to the first side 2021 and two grooves 2032 opened on the second side 2022 for placing the corner of the ceramic piece.

[0037] The bump 2031 is on the same horizontal plane as the upper surface of the motherboard 1, and is used to hold the ceramic sheet in place;

[0038] The groove 2032 is on the same horizontal plane as the platform 3 and is recessed outward from the second side 2022. The groove 2032 provides a transition space for the corners of the ceramic sheet to be placed and rotated in the station 2, protecting the corners.

[0039] The ceramic sheet is placed on the platform 3 along the second side 2022. The ceramic sheet is rotated counterclockwise so that the four sides of the ceramic sheet coincide with the first side 2021. The upper surface of the ceramic sheet is in contact with the lower surface of the protrusion 2031. At this time, the ceramic sheet is fixed in the station 2. Since the bottom of the ceramic sheet is a through groove 201 and only contacts part of the platform 3, it avoids directly hooking the ceramic sheet, reduces the contact area between the ceramic sheet and the fixing part, increases the electroplating area, and makes the electroplating thickness uniform.

[0040] Working principle

[0041] like Figure 3 and Figure 4 As shown, ceramic sheet 4 is placed in station 2 so that the side of ceramic sheet 4 is attached to the second side 2022. After placement, ceramic sheet 4 is rotated counterclockwise by 15° so that the four sides of ceramic sheet 4 coincide with the first side 2021. The upper surface of ceramic sheet 4 is attached to the lower surface of protrusion 2031. At this time, ceramic sheet 4 is fixed in station 2.

[0042] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A ceramic sheet electroplating fixing device, characterized in that, The utility model relates to a ceramic sheet fixing device, including: A main plate (1) with electric conductivity and a plurality of stations (2) for placing and fixing ceramic sheets on the main plate (1); The station (2) includes a through slot (201) and a stepped mechanism (202) connected with the through slot (201) and staggered on the upper and lower surfaces; the ceramic sheet is placed in the through slot (201) and adheres to the lower surface of the stepped mechanism (202), the ceramic sheet is rotated and coincides with the upper surface of the stepped mechanism (202), and the ceramic sheet is fixed in the station (2).

2. The ceramic sheet plating fixture of claim 1, wherein, The plurality of stations (2) are uniformly distributed from the center of the main plate (1) to the outline of the main plate (1).

3. The ceramic sheet plating fixture of claim 1, wherein, The upper surface of the stepped mechanism (202) is connected with the upper surface of the main plate (1), and the lower surface of the stepped mechanism (202) is connected with the through slot (201).

4. The ceramic sheet plating fixture of claim 1 or 2, wherein The stepped mechanism (202) includes four first side edges (2021) corresponding to the outline of the ceramic sheet, four second side edges (2022) corresponding to the outline of the ceramic sheet, and a limiting mechanism connected with the first side edge (2021) and the second side edge (2022) for fixing the ceramic sheet; The first side edge (2021) coincides with the side edge of the through slot (201) to form the upper surface of the stepped mechanism (202); The second side edge (2022) is staggered with the side edge of the through slot (201) and is provided with a platform (3) for placing the ceramic sheet to form the lower surface of the stepped mechanism (202).

5. The ceramic sheet plating fixture of claim 4, wherein, The area surrounded by the first side edge (2021) is inclined by 15° compared with the area surrounded by the second side edge (2022).

6. The ceramic sheet plating fixture of claim 4, wherein, The platform (3) extends along the second side edge (2022) and coincides with the outline of the first side edge (2021), and the platform (3) is in the shape of "L".

7. The ceramic sheet plating fixture of claim 4, wherein The limiting mechanism includes a protrusion (2031) provided on the first side edge (2021) for clamping the ceramic sheet and two grooves (2032) provided on the second side edge (2022) for placing the corners of the ceramic sheet.

8. The ceramic sheet plating fixture of claim 7, wherein, The protrusion (2031) is in the same horizontal plane as the upper surface of the main plate (1), and the groove (2032) is in the same horizontal plane as the platform (3) and is recessed outward from the second side edge (2022).

Images