Test board for high-temperature bias test

Abstract

The utility model discloses a test board for a high temperature bias test, which relates to the technical field of test boards, and comprises a test board main body, pin jacks and a connector, and the top end of the test board main body is uniformly provided with the pin jacks. According to the utility model, the sliding blocks are inserted into the sliding grooves by pushing the heat dissipation fins, the clamping blocks extrude the limiting blocks in the process of continuously pushing the heat dissipation fins until the sliding blocks and the sliding grooves are mutually attached, and the sliding blocks are conveniently limited under the action of the limiting blocks and the clamping blocks; the heat dissipation fins are arranged, so that effective heat dissipation treatment can be performed on the test board body, on one hand, the temperature can be prevented from exceeding an expected range, the test accuracy is improved, on the other hand, the test board body can be prevented from being in a high-temperature environment for a long time, and the test efficiency is improved. Therefore, the service life of the test board body is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of test board technology, and in particular to a test board for high temperature bias testing. Background Technology

[0002] The high-temperature bias test board is a test equipment component specifically designed for high-temperature bias testing. It is mainly used to conduct bias tests on semiconductor devices (such as diodes, transistors, MOSFETs, IGBTs, SiC, etc.) in high-temperature environments, thereby simulating the harsh conditions that semiconductor devices (such as diodes, transistors, MOSFETs, IGBTs, SiC, etc.) may encounter in actual use, in order to evaluate their performance, stability, tolerance, and service life.

[0003] However, existing high-temperature bias test boards still have the following drawbacks in use: they cannot effectively dissipate heat, which may cause their temperature to exceed the expected range, thereby activating their protection mechanisms or altering the behavior of their circuits, thus affecting the test results and leading to incorrect results. At the same time, since the high-temperature bias test boards operate in high-temperature environments for a long time, they may also be affected by thermal stress, resulting in performance degradation or damage, thereby reducing the reliability and service life of the high-temperature bias test boards. Utility Model Content

[0004] The purpose of this invention is to provide a test board for high-temperature bias testing, so as to solve the problem mentioned in the background art that the existing high-temperature bias test boards cannot effectively dissipate heat during use.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a test board for high-temperature bias testing, comprising a test board body, pin sockets, and connectors, wherein pin sockets are uniformly provided at the top of the test board body, and connectors are provided on one side of the test board body;

[0006] The test board body is equipped with heat dissipation mechanisms on both sides, an overload protector inside the test board body, and limit mechanisms on both sides of the top of the test board body.

[0007] When using a test board for high-temperature bias testing according to this technical solution, the heat dissipation mechanism can effectively dissipate heat from the main body of the test board during use, thereby improving the accuracy of the test and reducing the impact of high temperature on the test.

[0008] Preferably, the limiting mechanism includes a guide groove, which is disposed inside the test plate body. Guide blocks are slidably disposed inside the guide groove, and a reset spring is fixed on one side of each guide block. A limiting plate is disposed at the top of each guide block.

[0009] Preferably, there are two limiting plates, which are symmetrically distributed, and a protective pad is attached to one side of each limiting plate.

[0010] Preferably, there are two reset springs, both of which are made of stainless steel and are symmetrically distributed.

[0011] Preferably, the heat dissipation mechanism includes heat dissipation fins, which are disposed on one side of the test board body. A slider is fixed on one side of the heat dissipation fins, and locking blocks are fixed on both sides of the slider. A sliding groove is provided on the outer side of the slider and is opened inside the test board body. Two limiting blocks are fixed inside the sliding groove.

[0012] Preferably, multiple sets of the limiting blocks and the locking blocks are provided, with two limiting blocks and locking blocks in each set, and the cross-section of each set of limiting blocks and locking blocks is circular, and the material of each set of limiting blocks and locking blocks is silicone rubber.

[0013] Preferably, there are two slides and two sliders, both of which have T-shaped cross-sections and slides slide inside the slider. The heat dissipation fins are slidably connected to the test board body through the slides and sliders.

[0014] Compared with the prior art, the beneficial effects of this utility model are: the test board for high temperature bias test not only has heat dissipation function, but also has limiting function;

[0015] By pushing the heat dissipation fins, the slider is inserted into the groove. During the continuous pushing of the heat dissipation fins, the locking block squeezes the limiting block until the slider and the groove are in contact. Under the action of the limiting block and the locking block, the slider is limited, which facilitates the fixing of the heat dissipation fins to both sides of the test board body. By setting the heat dissipation fins, the test board body can be effectively cooled. On the one hand, it can prevent the temperature from exceeding the expected range, thereby improving the accuracy of the test. On the other hand, it can also prevent the test board body from being in a high-temperature environment for a long time, thereby improving the service life of the test board body.

[0016] By pushing the limiting plate under the action of the guide block, the two limiting plates move horizontally in opposite directions, which makes it easier to place the device under test on the test board body. Under the action of the reset spring, the two guide blocks move horizontally relative to each other, which makes it easier to limit the device under test of different models, thereby improving its practicality. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a top view of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the front cross-sectional structure of this utility model;

[0020] Figure 3 This is a side sectional view of the present invention.

[0021] Figure 4 This is a three-dimensional structural diagram of the heat dissipation mechanism of this utility model;

[0022] Figure 5 This is a three-dimensional structural diagram of the limiting mechanism of this utility model.

[0023] The following are the annotations in the figure: 1. Test board body; 2. Pin socket; 3. Limiting mechanism; 301. Limiting plate; 302. Guide groove; 303. Guide block; 304. Reset spring; 4. Heat dissipation mechanism; 401. Heat dissipation fins; 402. Limiting block; 403. Slide groove; 404. Slider; 405. Locking block; 5. Connector; 6. Overload protector. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] Please see Figures 1-5 The present invention provides an embodiment of a test board for high temperature bias test, comprising a test board body 1, pin sockets 2, and connectors 5. The top of the test board body 1 is uniformly provided with pin sockets 2, and each side of the test board body 1 is provided with a connector 5. Both sides of the test board body 1 are provided with heat dissipation mechanisms 4.

[0026] The heat dissipation mechanism 4 includes heat dissipation fins 401, which are disposed on one side of the test board body 1. A slider 404 is fixed on one side of the heat dissipation fins 401. A locking block 405 is fixed on both sides of the slider 404. A sliding groove 403 is provided on the outer side of the slider 404, and the sliding groove 403 is opened inside the test board body 1. Two limiting blocks 402 are fixed inside the sliding groove 403.

[0027] Multiple sets of limit blocks 402 and locking blocks 405 are provided. Each set of limit blocks 402 and locking blocks 405 has two sets. The cross-section of each set of limit blocks 402 and locking blocks 405 is circular. The material of each set of limit blocks 402 and locking blocks 405 is silicone rubber.

[0028] There are two slides 403 and two sliders 404. The cross-sections of the two slides 403 and the sliders 404 are T-shaped, and the two slides 403 slide inside the sliders 404. The heat dissipation fins 401 are slidably connected to the test plate body 1 through the slides 403 and the sliders 404.

[0029] Specifically, such as Figure 1 , Figure 2 , Figure 4 As shown, during use, the heat dissipation fins 401 can be provided to dissipate heat from the test board body 1, which can improve the accuracy of the test and extend the service life of the test board body 1, thereby reducing the cost of maintenance and replacement.

[0030] An overload protector 6 is installed inside the test board body 1, and limit mechanisms 3 are installed on both sides of the top of the test board body 1.

[0031] The limiting mechanism 3 includes a guide groove 302, which is located inside the test plate body 1. Guide blocks 303 are slidably arranged inside the guide groove 302, and a reset spring 304 is fixed on one side of the guide block 303. A limiting plate 301 is provided at the top of the guide block 303.

[0032] There are two limit plates 301, which are symmetrically distributed, and a protective pad is attached to one side of each limit plate 301.

[0033] There are two return springs 304, both of which are made of stainless steel and are symmetrically distributed.

[0034] Specifically, such as Figure 1 , Figure 2 , Figure 3 , Figure 5As shown, during use, the reset spring 304 resets the guide block 303, causing the limiting plate 301 to limit the device under test, thereby preventing it from moving in position and improving the accuracy of the test.

[0035] Working principle: In use, the present invention first pushes the heat dissipation fins 401 to insert the slider 404 into the groove 403. During the continuous pushing of the heat dissipation fins 401, the slider 404 slides inside the groove 403, thereby causing the locking block 405 to move synchronously. When one side of the locking block 405 and one side of the limiting block 402 come into contact with each other, the locking block 405 squeezes the limiting block 402 during the continuous pushing process, thereby causing the locking block 405 and the limiting block 402 to undergo elastic deformation until one side of the slider 404 and one side of the groove 403 are in contact with each other, so that the squeezing force on the limiting block 402 and the locking block 405 disappears, thus restoring their original state. Through the above operation, the heat dissipation fins 401 can be fixed to one side of the test board body 1, thereby facilitating heat dissipation treatment of the test board body 1, thereby reducing the impact of high temperature on the test board body 1 and the tested device, and thus improving the accuracy of test data.

[0036] Secondly, the device under test is placed on the test board body 1. During placement, the two limiting plates 301 are pushed to move horizontally in opposite directions, so that the guide block 303 slides inside the guide groove 302. By setting the guide block 303, the moving limiting plate 301 can be limited to avoid its positional deviation, which would affect subsequent operations. On the other hand, the moving limiting plate 301 can also be guided to improve its stability during movement. When the guide block 303 moves, it compresses the return spring 304, so that the return spring 304 is compressed by the compressing force until the pin of the device under test is inserted into the pin socket 2. Then, the limiting plate 301 is slowly released, so that the compressing force on the return spring 304 disappears, thereby pushing the guide block 303 to move horizontally. Then, the two limiting plates 301 move horizontally relative to each other until one side of the limiting plate 301 and one side of the device under test are in contact with each other. The above operation makes it easy to limit the device under test of different models, avoid its positional movement during the test, and improve its practicality.

[0037] Finally, the test board body 1 is correctly connected to the test equipment, test instruments, and power supply via connector 5, and the connection is checked to ensure it is secure and to avoid poor contact. Simultaneously, the test equipment is started under the set test conditions to apply a specific bias voltage to the device under test and place it in a high-temperature environment. This simulates the harsh conditions the device under test may encounter in actual use, facilitating observation of performance changes in the test board body 1 and the device under test, ensuring everything is normal. During the high-temperature bias test of the device under test, test data and parameters, such as temperature and current, can be recorded periodically. The above operations facilitate the high-temperature bias test of the device under test, allowing for the evaluation of its performance, stability, tolerance, and lifespan.

[0038] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A test board for high temperature bias test, comprising a test board body (1), a pin jack (2), a connector (5), the top of the test board body (1) is uniformly provided with a pin jack (2), and one side of the test board body (1) is provided with a connector (5). characterized in that Both sides of the test board body (1) are provided with a heat dissipation mechanism (4), the inside of the test board body (1) is provided with an overload protector (6), and both sides of the top of the test board body (1) are provided with a limiting mechanism (3).

2. The test board for high temperature bias test according to claim 1, characterized in that: The limiting mechanism (3) comprises a guide groove (302), and the guide groove (302) is arranged in the inside of the test board body (1), the inside of the guide groove (302) is slidably provided with a guide block (303), one side of the guide block (303) is fixedly provided with a reset spring (304), and the top of the guide block (303) is provided with a limiting plate (301).

3. The test board for high temperature bias test according to claim 2, characterized in that: The limiting plate (301) is provided with two, the two limiting plates (301) are symmetrically distributed, and the two limiting plates (301) are symmetrically distributed.

4. The test board for high temperature bias test according to claim 2, characterized in that: The reset spring (304) is provided with two, the material of the two reset springs (304) is stainless steel, and the two reset springs (304) are symmetrically distributed.

5. The test board for high temperature bias test according to claim 1, characterized in that: The heat dissipation mechanism (4) comprises a heat dissipation fin (401), and the heat dissipation fin (401) is arranged on one side of the test board body (1), one side of the heat dissipation fin (401) is fixedly provided with a sliding block (404), both sides of the sliding block (404) are fixedly provided with a clamping block (405), the outer side of the sliding block (404) is provided with a sliding groove (403), and the sliding groove (403) is arranged in the inside of the test board body (1), and the inside of the sliding groove (403) is fixedly provided with two limiting blocks (402).

6. The test board for high temperature bias testing of claim 5, wherein: The limiting block (402) and the clamping block (405) are provided with a plurality of groups, each group of the limiting block (402) and the clamping block (405) is provided with two, the cross section of each group of the limiting block (402) and the clamping block (405) is circular, and the material of each group of the limiting block (402) and the clamping block (405) is silicone rubber.

7. The test board for high temperature bias testing of claim 5, wherein: The sliding groove (403) and the sliding block (404) are provided with two, the cross section of the two sliding grooves (403) and the sliding blocks (404) is T-shaped, the two sliding grooves (403) are slidably arranged in the sliding blocks (404), and the heat dissipation fins (401) are slidably connected with the test board body (1) through the sliding grooves (403) and the sliding blocks (404).

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