Heat dissipation module and computing power host
By designing a combination of a base frame, a first heat dissipation module, and a second heat dissipation module in the computing host, and utilizing guide channels and guide fins to efficiently dissipate heat, the problem of insufficient heat dissipation in the computing host is solved, and the stability and assembly efficiency of the equipment are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-03-10
AI Technical Summary
Existing computing power servers have limitations in heat dissipation design, which cannot effectively meet users' heat dissipation needs, resulting in excessively high server temperatures, affecting stability and lifespan.
A heat dissipation module is designed, including a base frame, a first heat dissipation module and a second heat dissipation module. By setting a guide channel on the second side of the first heat dissipation module, the heat is dissipated by the airflow blown out by the second heat dissipation module and efficiently discharged through the guide channel. Combined with a baffle plate and guide fins, the heat dissipation and backflow are prevented.
It achieves efficient heat dissipation, meets the heat dissipation requirements of the computing host, improves the stability and service life of the equipment, and facilitates rapid assembly and reduces the weight of the equipment.
Smart Images
Figure CN223986311U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of host heat dissipation design technology, and in particular to a heat dissipation module and a computing host. Background Technology
[0002] A computing power unit is a multi-functional device designed to enhance the intelligence of home and office environments. In addition to traditional computing capabilities, it integrates various functional modules such as set-top boxes, screen projectors, video conferencing devices, smart speakers, and cameras to provide users with a richer interactive experience.
[0003] With the continuous advancement of technology, the development trends of computing power servers include:
[0004] Enhanced computing power: Improved computing performance of devices through continuous hardware and software upgrades.
[0005] Wider range of applications: Expanding from home entertainment to multiple fields such as office and education, providing richer functions and services.
[0006] Higher level of intelligence: By integrating more AI technologies, more intelligent scene recognition and task execution can be achieved.
[0007] With the rapid development of technologies such as artificial intelligence and big data, the computing speed and power consumption of computing power servers are constantly increasing, leading to a sharp increase in the heat generated by these servers. Traditional cooling methods, such as relying solely on fans or heat sinks, are no longer sufficient to meet the cooling needs of computing power servers, easily causing the server temperature to become too high, affecting the stability and lifespan of the computing power server.
[0008] In the process of developing this utility model, the applicant discovered at least the following problems in the prior art:
[0009] Existing computing power servers have certain limitations in heat dissipation design and cannot adequately meet users' needs. Utility Model Content
[0010] The purpose of this utility model is to provide a heat dissipation module and a computing host to solve the technical problem that existing computing hosts have certain limitations in heat dissipation design and cannot well meet the user's needs. The various technical effects of the preferred technical solutions provided by this utility model are detailed below.
[0011] To achieve the above objectives, the present invention provides the following technical solution:
[0012] This utility model provides a heat dissipation module, including a base frame, a first heat dissipation module, and a second heat dissipation module. The base frame includes a first mounting slot, a second mounting slot, and a guide slot. The first mounting slot is located in the middle of the base frame, the second mounting slot is located on a first side of the first mounting slot, and the guide slot is located on a second side of the first mounting slot. The first mounting slot is used to fix the first heat dissipation module, the second mounting slot is used to fix the second heat dissipation module, the second heat dissipation module is used to blow out the heat absorbed by the first heat dissipation module to form an airflow, and the guide slot is used to guide the airflow.
[0013] Optionally, the base frame is provided with wind baffles on both sides. The wind baffles are disposed on both sides of the first heat dissipation module and the guide groove. The mounting holes on the wind baffles correspond to the threaded holes on the first heat dissipation module. The wind baffles are fixedly connected to the first heat dissipation module by means of connectors that cooperate with the mounting holes and the threaded holes.
[0014] Optionally, a plurality of parallel guide fins are fixed on the bottom of the guide channel, and the guide fins are used to rectify the airflow.
[0015] Optionally, the first heat dissipation module is an aluminum extruded heat sink.
[0016] Optionally, the first heat dissipation module includes multiple heat dissipation fins, and an air duct is formed between two adjacent heat dissipation fins.
[0017] Optionally, the bottom of the second mounting slot is provided with a first air inlet, which is correspondingly provided with the second heat dissipation module. The first air inlet is used to introduce air into the second heat dissipation module. The second heat dissipation module is a centrifugal fan, and the exhaust port of the centrifugal fan is correspondingly provided with the air inlet of the air duct.
[0018] Optionally, it also includes a thermally conductive silicone pad, which is fixed to the bottom of the first heat dissipation module, and the thermally conductive silicone pad is provided with a tearable plastic film.
[0019] Optionally, the base frame is made of plastic or metal.
[0020] A computing host includes a heat dissipation module, a housing, and a PCBA board as described above. The heat dissipation module is fixed on the PCBA board. The first heat dissipation module of the heat dissipation module is correspondingly arranged with the heat source of the PCBA board. The housing accommodates the heat dissipation module and the PCBA board. The abutment structure of the airflow channel of the heat dissipation module matches and abuts against the housing.
[0021] Optionally, the housing includes an upper housing and a lower housing, the upper housing and the lower housing are matched and fixedly connected to each other to form a receiving cavity; a second air inlet is provided at the bottom of the lower housing, an air outlet is provided on the first side of the upper housing, the air outlet corresponds to the guide groove, and a third air inlet is provided on the second side of the upper housing.
[0022] Implementing one of the above-described technical solutions of this utility model has the following advantages or beneficial effects:
[0023] This utility model provides a second heat dissipation module on the first side of the first heat dissipation module and a guide groove on the second side of the first heat dissipation module. This allows the airflow blown out by the second heat dissipation module to carry away the heat from the first heat dissipation module to be guided by the guide groove. This design of the heat dissipation module is superior, enabling efficient exhaust of hot air and meeting heat dissipation requirements.
[0024] Meanwhile, the heat dissipation module of this invention adopts an integrated design, which facilitates subsequent assembly and improves assembly efficiency. The base frame of the heat dissipation module is made of lightweight materials, which can reduce the weight of the equipment.
[0025] The end of the airflow channel matches and abuts against the casing of the computing host, ensuring that the airflow will not leak or dissipate before flowing out of the casing, thus avoiding the risk of hot air flowing back into the casing. Attached Figure Description
[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:
[0027] Figure 1 This is a perspective view of an embodiment of the heat dissipation module of this utility model;
[0028] Figure 2 This is an exploded view of an embodiment of the heat dissipation module of this utility model;
[0029] Figure 3 This is a first exploded view of an embodiment of the computing power host of this utility model;
[0030] Figure 4 This is a second exploded view of an embodiment of the computing power host of this utility model;
[0031] Figure 5 This is a perspective view of an embodiment of the computing power host of this utility model.
[0032] In the diagram: 1. Base frame; 11. First mounting slot; 12. Second mounting slot; 121. First air inlet; 13. Guide channel; 131. Guide fin; 132. Abutment structure; 14. Baffle plate; 141. Mounting hole; 2. First heat dissipation module; 21. Threaded hole; 3. Second heat dissipation module; 4. Housing; 41. Upper housing; 411. Air outlet; 412. Third air inlet; 42. Lower housing; 421. Second air inlet; 5. PCBA board. Detailed Implementation
[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments, illustrating various exemplary embodiments that may be adopted to implement this utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this utility model disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this utility model.
[0034] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0035] To illustrate the technical solution described in this utility model, specific embodiments are described below, showing only the parts related to the embodiments of this utility model.
[0036] Example 1:
[0037] like Figure 1As shown, this utility model provides a heat dissipation module, including a base frame 1, a first heat dissipation module 2, and a second heat dissipation module 3. The base frame 1 includes a first mounting groove 11, a second mounting groove 12, and a guide groove 13. The first mounting groove 11 is located in the middle of the base frame 1, the second mounting groove 12 is located on the first side of the first mounting groove 11, and the guide groove 13 is located on the second side of the first mounting groove 11. The first mounting groove 11 is used to fix the first heat dissipation module 2, the second mounting groove 12 is used to fix the second heat dissipation module 3, the second heat dissipation module 3 is used to blow out the heat absorbed by the first heat dissipation module 2 and form an airflow, and the guide groove 13 is used to guide the airflow. Specifically, the first mounting slot 11 has a through-hole structure on the base frame 1. The first heat dissipation module 2 matches the first mounting slot 11. When the first heat dissipation module 2 is fixed in the first mounting slot 11, it is fixedly connected to the side of the base frame 1. The second heat dissipation module 3 matches the second mounting slot 12. The second heat dissipation module 3 is fixed in the second mounting slot 12 and is located on the first side of the first heat dissipation module 2. A guide groove 13 is provided on the second side of the first heat dissipation module 2, thus forming an integrated heat dissipation module design for easy and quick installation and use. When using the heat dissipation module, simply fix the base frame 1 of the heat dissipation module on the PCBA board 5 (as described below) to complete the installation of the heat dissipation module, so that the first heat dissipation module 2 is in contact with the heat source of the PCBA board 5. Since the second heat dissipation module 3 is located on the first side of the first heat dissipation module 2 and the guide channel 13 is located on the second side of the first heat dissipation module 2, the second heat dissipation module 3 can blow the heat absorbed by the first heat dissipation module 2 from the first side of the first heat dissipation module 2 to the second side, thereby blowing it into the guide channel 13. The guide channel 13 guides the airflow to flow out efficiently, avoiding the hot air from dissipating and reducing the heat dissipation efficiency after leaving the first heat dissipation module 2.
[0038] This utility model provides a second heat dissipation module 3 on the first side of the first heat dissipation module 2 and a guide groove 13 on the second side of the first heat dissipation module 2. This allows the airflow blown out by the second heat dissipation module 3 to carry away the heat from the first heat dissipation module 2 to be guided by the guide groove 13. This design of the heat dissipation module is superior and can efficiently exhaust hot air to meet heat dissipation requirements.
[0039] As an optional implementation method, such as Figure 2As shown, baffles 14 are provided on both sides of the base frame 1. The baffles 14 are located on both sides of the first heat dissipation module 2 and the guide channel 13. The mounting holes 141 on the baffles 14 correspond to the threaded holes 21 on the first heat dissipation module 2. The baffles 14 are fixedly connected to the first heat dissipation module 2 by means of connectors that cooperate with the mounting holes 141 and the threaded holes 21. Specifically, the baffles 14 are provided on both sides of the base frame 1, and the baffles 14 are located on both sides of the first heat dissipation module 2 and the guide channel 13. The baffles 14 can confine the air blown out by the second heat dissipation module 3 within the first heat dissipation module 2 and the guide channel 13, thus playing a guiding role and ensuring that the hot air does not deviate, leak, or dissipate to the sides of the heat dissipation module, avoiding the risk of hot air flowing back into the casing. The baffles 14 are fixedly connected to the first heat dissipation module 2. During installation, the baffles 14 are fixedly connected to the first heat dissipation module 2 by means of connectors (such as screws or bolts) that pass through the mounting holes 141 and the threaded holes 21 in sequence.
[0040] As an optional implementation method, such as Figure 2 As shown, multiple parallel guide fins 131 are fixed on the bottom of the flow channel 13. The guide fins 131 are used to rectify the airflow. Specifically, multiple guide fins 131 for rectifying the airflow are fixedly arranged at the bottom of the flow channel 13. The multiple guide fins 131 are parallel to each other, dividing the flow channel 13 into multiple channels, which can guide the airflow to flow out more smoothly.
[0041] As an optional implementation, the first heat dissipation module 2 is an aluminum extruded heat sink. Specifically, the first heat dissipation module 2 is preferably an aluminum extruded heat sink, which is easy to manufacture and has low cost. The first heat dissipation module 2 can also be selected from other heat sinks that can achieve the same function, such as a snap-fit fin heat sink, etc., depending on the requirements.
[0042] As an optional implementation method, such as Figure 2 As shown, the first heat dissipation module 2 includes multiple heat dissipation fins, with air ducts formed between adjacent heat dissipation fins. Specifically, the first heat dissipation module 2 consists of multiple parallel heat dissipation fins, with gaps between adjacent heat dissipation fins to form air ducts. The number of heat dissipation fins is adaptively set according to actual needs and the size of the base frame 1, and the size of the gaps between adjacent heat dissipation fins is also adaptively set according to actual needs. The first end of the air duct (i.e., the air inlet of the air duct) corresponds to the exhaust port of the second heat dissipation module 3, and the second end of the air duct corresponds to the air inlet of the guide groove 13, ensuring that the air blown into the first heat dissipation module 2 by the second heat dissipation module 3 flows through the air duct sequentially, carrying away the heat on the air duct, and then flows into the guide groove 13, where the heat is discharged.
[0043] As an optional implementation method, such as Figure 2As shown, the bottom of the second mounting slot 12 is provided with a first air inlet 121, which is correspondingly arranged with the second heat dissipation module 3. The first air inlet 121 is used to introduce air into the second heat dissipation module 3. The second heat dissipation module 3 is a centrifugal fan, and the exhaust port of the centrifugal fan is correspondingly arranged with the air inlet of the air duct. Specifically, the first air inlet 121 at the bottom of the second mounting slot 12 is correspondingly arranged with the second heat dissipation module 3, which facilitates the second heat dissipation module 3 to draw in air from the vertical direction. The exhaust port of the centrifugal fan is correspondingly arranged with the air inlet of the air duct, which facilitates the air blown out by the centrifugal fan to enter the air duct, carry away the heat absorbed by the first heat dissipation module 2, and improve the heat dissipation effect of the first heat dissipation module 2.
[0044] As an optional implementation, a thermally conductive silicone pad is also included. The thermally conductive silicone pad is fixed to the bottom of the first heat dissipation module 2, and a peelable plastic film is provided on the thermally conductive silicone pad. Specifically, a thermally conductive silicone pad is provided at the bottom of the first heat dissipation module 2 to fill the gap between the first heat dissipation module 2 and the heat source, thereby improving the heat conduction capacity between the heat source and the first heat dissipation module 2. The thermally conductive silicone pad is pre-attached to the bottom of the first heat dissipation module 2, and a peelable plastic film is provided at the bottom of the thermally conductive silicone pad. This film protects the thermally conductive silicone pad before the heat dissipation module is installed. Furthermore, when installing the heat dissipation module onto the PCBA board 5, simply peeling off the plastic film at the bottom of the thermally conductive silicone pad allows the first heat dissipation module 2 and the thermally conductive silicone pad to adhere to the heat source.
[0045] As an optional implementation, the base frame 1 can be made of plastic or metal. Specifically, the base frame 1 is preferably made of plastic, which can effectively reduce the weight of the heat dissipation module, thereby reducing the weight of the entire device.
[0046] Example 2:
[0047] like Figure 3 and Figure 5As shown, a computing power host includes a heat dissipation module, a housing 4, and a PCBA board 5 as described in Embodiment 1. The heat dissipation module is fixed on the PCBA board 5. The first heat dissipation module 2 of the heat dissipation module is correspondingly arranged with the heat source of the PCBA board 5. The housing 4 houses the heat dissipation module and the PCBA board 5. The abutment structure 132 of the heat dissipation module's guide groove 13 matches and abuts against the housing 4. Specifically, when the heat dissipation module is fixed on the PCBA board 5, the first heat dissipation module 2 is correspondingly arranged with the heat source of the PCBA board 5, so that the heat generated by the heat source can be effectively conducted to the first heat dissipation module 2 for heat dissipation. The housing 4 houses the heat dissipation module and the PCBA board 5, and the PCBA board 5 is fixedly connected to the housing 4. The housing 4 is used to protect the PCBA board 5 and the heat dissipation module, improving the service life of the computing power host. The heat dissipation module structure adopts an integrated design, which facilitates rapid assembly into the computing power host. When the PCBA board 5 and the heat dissipation module are fixed inside the housing 4, the end of the guide channel 13 is provided with an abutment structure 132 that matches the housing 4. The abutment structure 132 can directly and tightly contact the housing 4, thereby ensuring that the airflow guided by the guide channel 13 is directly guided to the outside of the housing 4, and will not leak out of the guide channel 13 before the airflow flows out of the housing 4. The airflow is smoothly discharged from the housing 4, improving the heat dissipation effect of the heat dissipation module. The shape of the abutment structure 132 is adapted to the shape of the housing 4.
[0048] This utility model adopts an integrated heat dissipation module, which facilitates the rapid assembly of the computing host. At the same time, a flow guide groove 13 for rectification is provided at the rear end of the first heat dissipation module 2 of the heat dissipation module. The flow guide groove 13 abuts against the shell 4, which can rectify the airflow after heat absorption and discharge it from the shell 4 efficiently and smoothly. This gives the computing host a certain advantage in heat dissipation design and can well meet the user's heat dissipation needs for the computing host.
[0049] As an optional implementation method, such as Figure 3 and Figure 4As shown, the housing 4 includes an upper housing 41 and a lower housing 42, which are matched and fixedly connected to form a receiving cavity. A second air inlet 421 is provided at the bottom of the lower housing 42, and an air outlet 411 is provided on the first side of the upper housing 41, corresponding to the air guide groove 13. A third air inlet 412 is provided on the second side of the upper housing 41. Specifically, the housing 4 includes an upper housing 41 and a lower housing 42, facilitating the fixing of the PCBA board 5 and the heat dissipation module within the receiving cavity formed by the upper housing 41 and the lower housing 42, after which the upper housing 41 is fixed onto the lower housing 42. The second air inlet 421 at the bottom of the lower housing 42 is used to introduce air into the first air inlet 121 adjacent to the second air inlet 421, thereby introducing air into the second heat dissipation module 3. The second heat dissipation module 3 draws in air vertically and blows it into the first heat dissipation module 2 through the exhaust port of the second heat dissipation module 3. The heat absorbed by the first heat dissipation module 2 is blown into the guide groove 13 and then discharged through the air outlet 411 of the upper housing 41. The third air inlet 412 of the upper housing 41 is correspondingly arranged with the air outlet 411 to facilitate convection within the upper housing 41 and improve the heat dissipation effect.
[0050] The above description is merely a preferred embodiment of the present utility model. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present utility model. Furthermore, under the teachings of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present utility model.
Claims
1. A heat dissipation module, characterized in that, The application relates to a heat dissipation module, which comprises a base frame (1), a first heat dissipation module (2) and a second heat dissipation module (3), wherein the base frame (1) comprises a first mounting groove (11), a second mounting groove (12) and a flow guide groove (13), the first mounting groove (11) is arranged at the middle of the base frame (1), the second mounting groove (12) is arranged at the first side of the first mounting groove (11), the flow guide groove (13) is arranged at the second side of the first mounting groove (11), the first mounting groove (11) is used for fixing the first heat dissipation module (2), the second mounting groove (12) is used for fixing the second heat dissipation module (3), the second heat dissipation module (3) is used for blowing out the heat absorbed by the first heat dissipation module (2) and forming an air flow, and the flow guide groove (13) is used for guiding the air flow.
2. The heat dissipation module of claim 1, wherein, The base frame (1) is provided with wind baffles (14) at two sides, the wind baffles (14) are arranged at the two sides of the first heat dissipation module (2) and the flow guide groove (13), mounting holes (141) on the wind baffles (14) correspond to threaded holes (21) on the first heat dissipation module (2), connecting pieces are matched with the mounting holes (141) and the threaded holes (21), and the wind baffles (14) are fixedly connected with the first heat dissipation module (2).
3. The heat dissipation module of claim 1, wherein, The bottom of the flow guide groove (13) is fixed with a plurality of flow guide fins (131) which are parallel to each other and are used for rectifying the air flow.
4. The heat dissipation module of claim 1, wherein, The first heat dissipation module (2) is an aluminum extrusion radiator.
5. The heat dissipation module of claim 4, wherein, The first heat dissipation module (2) comprises a plurality of heat dissipation fins, and air ducts are formed between adjacent two heat dissipation fins.
6. The heat dissipation module of claim 5, wherein, The bottom of the second mounting groove (12) is provided with a first air inlet (121), the first air inlet (121) is arranged in correspondence with the second heat dissipation module (3), the first air inlet (121) is used for introducing air into the second heat dissipation module (3), and the second heat dissipation module (3) is a centrifugal fan, and the air outlet of the centrifugal fan is arranged in correspondence with the air inlet of the air duct.
7. The heat dissipation module of claim 1, wherein, The heat conduction silica gel pad is fixed to the bottom of the first heat dissipation module (2), and a tearable plastic film is arranged on the heat conduction silica gel pad.
8. The heat dissipation module of claim 1, wherein, The base frame (1) is made of plastic or metal.
9. A hashpower host, comprising: The application further relates to a heat dissipation module, a shell (4) and a PCBA board (5), the heat dissipation module is fixed on the PCBA board (5), the first heat dissipation module (2) of the heat dissipation module is arranged in correspondence with a heat source of the PCBA board (5), the shell (4) contains the heat dissipation module and the PCBA board (5), and the abutting structure (132) of the flow guide groove (13) of the heat dissipation module is matched with and abuts against the shell (4).
10. The computing power host of claim 9, wherein, The shell (4) comprises an upper shell (41) and a lower shell (42), the upper shell (41) and the lower shell (42) are matched and fixedly connected to form a containing cavity; the bottom of the lower shell (42) is provided with a second air inlet (421), the first side of the upper shell (41) is provided with an air outlet (411), the air outlet (411) corresponds to the flow guide groove (13), and the second side of the upper shell (41) is provided with a third air inlet (412).