Power module and inversion equipment
By using a segmented welding method, combined with reflow soldering and wave soldering, the problems of poor soldering and insufficient precision in traditional welding methods are solved, achieving stable welding and efficient heat dissipation of power devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2026-03-10
AI Technical Summary
Traditional power device soldering methods are prone to poor soldering or cold soldering, and are difficult to meet the high precision requirements of surface mount pins, which may lead to bridging or solder joint misalignment.
The device is connected by a segmented soldering method, and the component part, soldering part and pin group are connected by reflow soldering. The high thermal conductivity of the metal substrate is utilized, and the pin group is connected to the circuit board by wave soldering. The pin group extends out of the heat sink for insertion.
Stable soldering of power device pins was achieved, meeting high precision requirements, reducing short-circuit risk, and improving heat dissipation and production efficiency.
Smart Images
Figure CN223987030U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of inverter equipment, and particularly relates to a power module and an inverter equipment. BACKGROUND
[0002] The inverter equipment is usually connected with a power supply to realize AC / DC conversion control of the output current of the power supply. After the power device in the inverter equipment works for a long time, the temperature of the power device is increased, which affects the use of the inverter equipment. Therefore, the conventional power device usually adopts a patch packaging mode, that is, the power device is attached to a heat dissipation structure.
[0003] However, after the power device is attached to the heat dissipation structure, if the pins of the power device are directly subjected to overall reflow soldering, the heat dissipation structure will quickly absorb heat, so that the temperature of the pin soldering point is insufficient, resulting in false soldering or cold soldering; if wave soldering is directly used, the process characteristics (liquid solder flow coverage) are difficult to meet the high-precision requirement of the patch pin, which may result in bridging or soldering point deviation. CONTENT OF THE UTILITY MODEL
[0004] Therefore, the present application provides a power module and an inverter equipment, which can not only realize stable soldering of the pins of the power device, but also meet the high-precision requirement of the patch pin.
[0005] An embodiment of the present application provides a power module. The power module is configured to be vertically arranged on a circuit board. The power module comprises a heat dissipation member and a power device. The heat dissipation member is configured as a metal member. The power device comprises a device part, a soldering part and a pin group. The device part is attached to the heat dissipation member, the soldering part is arranged on the heat dissipation member, and the pin group is connected to the device part through the soldering part and is soldered through reflow soldering. The pin group at least partially extends out of the outer edge of the heat dissipation member, is configured to be inserted into the circuit board and is soldered through wave soldering.
[0006] In the power module, the segmented soldering mode is adopted, which can not only realize stable soldering of the pins of the power device, but also meet the high-precision requirement of the patch pin. Specifically, the device part, the soldering part and the pin group are connected through reflow soldering. The reflow soldering is suitable for the high thermal conductivity of the metal substrate, which is beneficial to ensure that reliable soldering points are formed between the device part, the soldering part and the pin group. The pin group is connected to the circuit board through wave soldering. The pin group extends out of the outer edge of the heat dissipation member and is inserted into the circuit board, which is beneficial to reduce the risk of insufficient soldering precision of the power device caused by small soldering points of the patch.
[0007] In some embodiments of the present application, the welding portion specifically includes a first end and a second end, the first end is connected with the device portion, and the second end is connected with the pin group. The welding portion includes a first branch and a second branch, and the first branch and the second branch are arranged at intervals on the heat dissipation member. The distance between the first branch and the second branch at the first end is defined as L1, and the distance between the first branch and the second branch at the second end is defined as L2, and L2>L1.
[0008] By limiting the distance between the first branch and the second branch at the end connected with the pin group to be greater than the distance between the first branch and the second branch at the end connected with the device portion, the distance between the adjacent two pins in the pin group is increased, and when the pin group is welded with the circuit board by wave soldering, the solder is not easy to form a connection, thereby reducing the risk of bridging (i.e., short circuit) between the pins.
[0009] In some embodiments of the present application, the first branch and the second branch are arranged in an "eight" shape, and the distance between the first branch and the second branch gradually increases from the first end to the second end.
[0010] In some embodiments of the present application, the pin group includes a plurality of pins, and all the pins are connected with the device portion through the welding portion. The pin includes a connecting segment, an extending segment, and a bending segment, and the connecting segment is connected with the extending segment through the bending segment. In the direction perpendicular to the insertion direction of the pin group, the extending segment and the connecting segment are arranged at intervals. The connecting segment is connected with the device portion through the welding portion, and the extending segment is located at the outer edge of the heat dissipation member and is configured to be inserted into the circuit board.
[0011] By arranging the extending segment and the connecting segment at intervals (i.e., arranging the extending segment away from the heat dissipation member), on the one hand, it is beneficial to reduce the risk of bridging (i.e., short circuit) between the pins due to the adhesion between the extending segment and the metal substrate; on the other hand, it is beneficial to reduce the heat absorption of the heat dissipation member to the extending segment in the support leg, thereby reducing the heat dissipation of the extending segment in the pin and ensuring the welding temperature.
[0012] In some embodiments of the present application, the power module further includes a plurality of heat dissipation fins arranged on the heat dissipation member. By arranging a plurality of heat dissipation fins, it is beneficial to increase the surface area of the heat dissipation member in contact with air, thereby improving the heat dissipation effect of the heat dissipation member.
[0013] In some embodiments of the present application, the heat dissipation member has a first surface and a second surface arranged oppositely, the heat dissipation fins are located on the first surface, and the power device is located on the second surface. By arranging the heat dissipation fins and the power device on different surfaces (specifically, the first surface and the second surface) of the heat dissipation member, the risk of interference between the heat dissipation fins and the power device can be avoided, the position of the power device does not need to be adjusted repeatedly when the power device and the heat dissipation member are welded, the operation is simple, and it is beneficial to improve the production efficiency of the power module.
[0014] In some embodiments of this application, the heat sink fins and the heat sink are constructed as an integral structure. By directly integrating the heat sink fins into the heat sink, not only can the contact thermal resistance be reduced and the heat dissipation effect of the heat sink be improved, but the installation steps of the heat sink fins and the heat sink can also be omitted, thereby improving the production efficiency of the power module.
[0015] In some embodiments of this application, the power module further includes a heat-conducting component, which is mounted on the heat sink and located on the second side. By providing the heat-conducting component, heat dissipation can be achieved on both sides (specifically the first and second sides) of the heat sink, which is beneficial to improving the heat dissipation effect of the heat sink.
[0016] In some embodiments of this application, the heat sink is further provided with a plug-in portion, which is configured to mate with a plug-in hole in the circuit board. The plug-in portion serves two purposes: firstly, it improves the assembly accuracy of the power module and the circuit board, ensuring accurate alignment between the power module and the circuit board; secondly, it facilitates pre-fixation of the pin group before wave soldering of the circuit board, making subsequent wave soldering of the pin group to the circuit board easier.
[0017] One embodiment of this application provides an inverter device. The inverter device includes a circuit board and a power module as described in any of the above embodiments. The power module is configured to be vertically mounted on the circuit board.
[0018] In the aforementioned inverter equipment, the power module described above is used. By employing a segmented soldering method, the power module not only achieves stable soldering of the power device pins but also meets the high-precision requirements of surface-mount pins. Specifically, the device section, soldering section, and pin group are connected using reflow soldering. Reflow soldering is well-suited to the high thermal conductivity of the metal substrate, ensuring reliable solder joints between the device section, soldering section, and pin group. The pin group is connected to the circuit board using wave soldering. The pin group extends beyond the outer edge of the heat sink and interlocks with the circuit board, helping to avoid the problem of insufficient soldering precision due to small surface-mount solder joints of the power devices. Furthermore, the vertical assembly method of the power module helps reduce the area occupied by the power module on the circuit board and improves the heat dissipation effect of the heat sink on the power devices. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope.
[0020] Figure 1 This is a schematic diagram of the structure of an inverter device provided in one embodiment of this application;
[0021] Figure 2 for Figure 1 A partially exploded structural diagram of the inverter device shown.
[0022] Figure 3 Fig. 1 shows a schematic diagram of a power module and a circuit board according to an embodiment of the present application;
[0023] Figure 4 Fig. 2 shows a schematic diagram of a power module according to an embodiment of the present application;
[0024] Figure 5 Fig. 3 shows a schematic diagram of a power device according to an embodiment of the present application; Figure 4
[0025] Figure 6 Fig. 4 shows a side view of the power device according to an embodiment of the present application. Figure 5 Main component symbol description:
[0026] 100, inverter device; 10, power module; 20, circuit board; 30, housing; 11, heat dissipation member; 12, power device; 13, heat dissipation fin; 14, heat conduction member; 111, first surface; 112, second surface; 113, plug-in part; 121, device part; 122, soldering part; 123, pin group; 1221, first end; 1222, second end; 1223, first branch; 1224, second branch; 1231, pin; 1232, first pin; 1233, second pin; 12311, connecting section; 12312, extending section; 12313, bending section.
[0027] The following detailed description will further describe the present application with reference to the above-mentioned drawings.
[0028] DETAILED DESCRIPTION The technical solutions in the embodiments of the present application will be described below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0031] The inverter device is usually connected with a power supply to realize AC / DC conversion control of the power supply output current. The temperature of the power device in the inverter device will rise after long time work, which will affect the use of the inverter device. Therefore, the conventional power device generally adopts a surface mount package way to mount the power device on a heat dissipation structure.
[0032] However, after the power device is attached to the heat dissipation structure, if the pins of the power device are directly subjected to integral reflow soldering, the heat dissipation structure will rapidly absorb heat, resulting in insufficient temperature of the pin end soldering points, and forming false soldering or cold soldering; if peak soldering is directly used, the process characteristics (liquid solder flow coverage) are difficult to meet the high-precision requirements of the patch pins, and may result in bridging or soldering point deviation.
[0033] An embodiment of the present application provides a power module. The power module is configured to be vertically attached to a circuit board. The power module comprises a heat dissipation member and a power device. The heat dissipation member is configured as a metal member. The power device comprises a device part, a soldering part and a pin group. The device part is attached to the heat dissipation member, the soldering part is arranged on the heat dissipation member, the pin group is connected to the device part through the soldering part, and the pin group is welded by reflow soldering. The pin group at least partially extends out of the outer edge of the heat dissipation member, and is configured to be inserted into the circuit board and welded by peak soldering.
[0034] In the power module, by using the segmented welding manner, stable welding of the pin end of the power device can be realized, and the high-precision requirements of the patch pins can be met. Specifically, the device part, the soldering part and the pin group are connected by reflow soldering. The reflow soldering can adapt to the high thermal conductivity of the metal substrate, and is beneficial to ensure that reliable soldering points are formed between the device part, the soldering part and the pin group. The pin group and the circuit board are connected by peak soldering. The pin group extends out of the outer edge of the heat dissipation member, and is inserted into the circuit board. This is beneficial to reduce the risk of insufficient welding precision caused by small soldering points of the power device patch.
[0035] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments and features in the embodiments can be combined with each other without conflict.
[0036] Please refer to Figures 1 to 3 An embodiment of the present application provides an inverter device 100. The inverter device 100 comprises a circuit board 20 and a power module 10.
[0037] In some embodiments, the power module 10 is configured to be vertically attached to the circuit board 20. By using the vertical assembly manner, the area of the power module 10 occupying the circuit board 20 can be reduced, and the heat dissipation effect of the power module 10 can be improved.
[0038] In some embodiments, the inverter device 100 further comprises a housing 30. The circuit board 20 and the power module 10 are both arranged inside the housing 30. By arranging the housing 30, the power module 10 can be protected, and the service life can be prolonged.
[0039] Please refer to Figure 3 and Figure 4In some embodiments, the power module 10 comprises a heat sink 11 and a power device 12. The power device 12 can be an electronic component such as a MOS tube, a thyristor, etc. The present application does not limit the power device 12, and a person skilled in the art can select the power device 12 according to actual conditions.
[0040] In some embodiments, the heat sink 11 is configured as a metal member. For example, the heat sink 11 is an aluminum alloy plate formed by aluminum alloy die casting. The aluminum alloy material not only has good thermal conductivity to ensure the heat dissipation efficiency of the heat sink 11, but also has a small mass, which is beneficial to reduce the weight of the entire power module 10.
[0041] In other embodiments, the heat sink 11 can also be a plate body made of iron. Iron is inexpensive, which is beneficial to reduce the production cost of the power module 10 and meet the needs of large-scale and low-cost production. The heat sink 11 can also be a plate body made of copper. Copper not only has good thermal conductivity to quickly transfer heat to the heat dissipation surface, but also has good ductility, which is beneficial to meet different shape requirements.
[0042] Please refer to Figure 3 and Figure 4 In some embodiments, the power device 12 comprises a device portion 121, a soldering portion 122, and a pin group 123. The device portion 121 is attached to the heat sink 11, the soldering portion 122 is arranged on the heat sink 11, and the pin group 123 is connected to the device portion 121 through the soldering portion 122 and is welded by reflow soldering. The reflow soldering can adapt to the high thermal conductivity of the heat sink 11, which is beneficial to ensure the reliable welding between the device portion 121, the soldering portion 122, and the pin group 123.
[0043] In some embodiments, the pin group 123 at least partially extends out of the outer edge of the heat sink 11 and is configured to be plugged with the circuit board 20 and welded by wave soldering. By connecting the pin group 123 with the circuit board 20 by wave soldering, a person skilled in the art can design the pin group 123 as needed, which is beneficial to reduce the risk of insufficient welding precision caused by the small soldering points of the power device 12.
[0044] For example, when the power module 10 needs to be assembled with the circuit board 20, a person skilled in the art fixes the device portion 121, the soldering portion 122, and the pin group 123 on the heat sink 11, connects the pin group 123 with the device portion 121 through the soldering portion 122, and welds by reflow soldering.
[0045] After the device portion 121, the soldering portion 122, and the pin group 123 are reflow soldering welded on the heat sink 11, the part of the pin group 123 located outside the heat sink 11 is plugged into the circuit board 20 and welded by wave soldering, that is, the assembly of the power module 10 and the circuit board 20 is achieved.
[0046] The power module 10 provided in the application can realize stable welding of the pin end of the power device 12 and meet the high-precision requirement of the patch pin by adopting the segmented welding mode.
[0047] Please refer to Figure 4 and Figure 5 In some embodiments, the welding part 122 includes a first end 1221 connected to the device part 121 and a second end 1222 connected to the pin group 123.
[0048] The welding part 122 includes a first branch 1223 and a second branch 1224, which are arranged at intervals on the heat dissipation member 11. The distance between the first branch 1223 and the second branch 1224 at the first end 1221 is defined as L1, and the distance between the first branch 1223 and the second branch 1224 at the second end 1222 is defined as L2, L2>L1.
[0049] By setting the distance between the first branch 1223 and the second branch 1224 connected to one end of the pin group 123 to be greater than the distance between the first branch 1223 and the second branch 1224 connected to one end of the device part 121, the distance between the adjacent two pins 1231 in the pin group 123 can be increased, and when the pin group 123 is welded to the circuit board 20 by wave soldering, the solder is not easy to form a connection, thereby reducing the risk of bridging (i.e., short circuiting) between the adjacent pins 1231.
[0050] For example, the distance between the first branch 1223 and the second branch 1224 at the first end 1221 is 4 mm, and the distance between the first branch 1223 and the second branch 1224 at the second end 1222 is 6 mm.
[0051] In some embodiments, the first branch 1223 and the second branch 1224 are in the shape of an "eight" and gradually increase in distance from the first end 1221 to the second end 1222.
[0052] In other embodiments, the first branch 1223 and the second branch 1224 can also have other shapes, as long as the distance between the first branch 1223 and the second branch 1224 at the first end 1221 is greater than the distance between the first branch 1223 and the second branch 1224 at the second end 1222, which is not limited in the application.
[0053] Please refer to Figure 4 and Figure 5 In some embodiments, the pin group 123 includes a plurality of pins 1231, and all the pins 1231 are connected to the device part 121 through the welding part 122.
[0054] Exemplarily, the number of the pins 1231 is two, and the two pins 1231 are defined as a first pin 1232 and a second pin 1233. The first pin 1232 is connected to the device part 121 through the first branch 1223, and the second pin 1233 is connected to the device part 121 through the second branch 1224.
[0055] It is worth noting that the pins 1231 and the branches of the soldering part 122 are in one-to-one correspondence. When one pin 1231 is added, one branch needs to be added correspondingly.
[0056] Please refer to Figure 4 and Figure 6 In some embodiments, the pin 1231 includes a connecting segment 12311, an extending segment 12312, and a bending segment 12313. The connecting segment 12311 is connected to the extending segment 12312 through the bending segment 12313.
[0057] In the direction of plugging the group 123 of the pins 1231, the extending segments 12312 are distributed apart from the connecting segments 12311. The connecting segments 12311 are connected to the device part 121 through the soldering part 122, and the extending segments 12312 are located at the outer edge of the heat dissipation part 11 and are configured to be plugged into the circuit board 20.
[0058] By distributing the extending segments 12312 apart from the connecting segments 12311 (i.e., moving the extending segments 12312 away from the heat dissipation part 11), on the one hand, it is beneficial to reduce the risk of bridging (i.e., short circuit) between the pins 1231 due to the adhesion between the extending segments 12312 and the heat dissipation part 11; on the other hand, it is beneficial to reduce the heat absorption of the heat dissipation part 11 to the extending segments 12312 of the pins 1231, thereby reducing the heat dissipation of the extending segments 12312 of the pins 1231 and ensuring the soldering temperature.
[0059] Please refer to Figure 4 In some embodiments, the power module 10 further includes a plurality of heat dissipation fins 13 arranged (such as vertically or horizontally) on the heat dissipation part 11. By arranging the plurality of heat dissipation fins 13, it is beneficial to increase the surface area of the heat dissipation part 11 in contact with air, thereby improving the heat dissipation effect of the heat dissipation part 11.
[0060] In some embodiments, the heat sink 11 has a first surface 111 and a second surface 112 disposed opposite to each other, with the heat sink fins 13 located on the first surface 111 and the power device 12 located on the second surface 112. By mounting the heat sink fins 13 and the power device 12 on different surfaces of the heat sink 11 (specifically the first surface 111 and the second surface 112), the risk of interference between the heat sink fins 13 and the power device 12 can be avoided. Technicians do not need to repeatedly adjust the position of the power device 12 when soldering it to the heat sink 11, simplifying the operation and improving the production efficiency of the power module 10.
[0061] In other embodiments, the heat sink fins 13 and the power device 12 may also be disposed on the same side (specifically, the first side 111 or the second side 112). This application does not limit this, and those skilled in the art can choose according to the actual situation.
[0062] In some embodiments, the heat sink 13 and the heat sink 11 are constructed as an integral structure. By directly integrating the heat sink 13 into the heat sink 11, not only can the contact thermal resistance (i.e., the thermal resistance of multi-layer interfaces such as thermally conductive adhesive and insulating layers) be reduced, but the heat dissipation effect of the heat sink 11 can also be improved. Furthermore, the installation steps of the heat sink 13 and the heat sink 11 can be omitted, thereby improving the production efficiency of the power module 10.
[0063] In some embodiments, the heat dissipation fins 13 are integrally formed with the heat sink 11 through an aluminum extrusion process. In other embodiments, the heat dissipation fins 13 may also be welded to the heat sink 11. This application does not limit this, and those skilled in the art can choose according to the actual situation.
[0064] Please refer to the following: Figure 3 and Figure 4 In some embodiments, the power module 10 further includes a heat-conducting element 14, which is mounted on the heat sink 11 and located on the second surface 112. By providing the heat-conducting element 14, heat dissipation can be achieved on both sides of the heat sink 11 (specifically the first surface 111 and the second surface 112), which is beneficial to improve the heat dissipation effect of the heat sink 11.
[0065] In some embodiments, the heat sink 11 is further provided with a plug-in portion 113, which is configured to mate with a plug-in hole (not shown) in the circuit board 20. The plug-in portion 113 is provided in two ways: firstly, it helps to improve the assembly accuracy of the power module 10 and the circuit board 20, ensuring accurate alignment between the power module 10 and the circuit board 20; secondly, it helps to pre-fix the pin group 123 to the circuit board 20 before wave soldering, which facilitates the subsequent wave soldering between the pin group 123 and the circuit board 20.
[0066] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.
Claims
1. A power module configured to be mounted upright on a circuit board, characterized by The power module comprises: The heat dissipation member is configured as a metal member; The power device comprises a device portion, a welding portion, and a pin group, the device portion is attached to the heat dissipation member, the welding portion is arranged on the heat dissipation member, the pin group is connected to the device portion through the welding portion, and is welded through reflow soldering; the pin group at least partially extends out of the outer edge of the heat dissipation member, and is configured to be plugged into the circuit board and welded through wave soldering.
2. The power module of claim 1, wherein, The welding portion specifically comprises a first end and a second end, the first end is connected to the device portion, and the second end is connected to the pin group; The welding portion comprises a first branch portion and a second branch portion, the first branch portion and the second branch portion are arranged at intervals on the heat dissipation member, the distance between the first branch portion and the second branch portion at the first end is defined as L1, and the distance between the first branch portion and the second branch portion at the second end is defined as L2, L2>L1.
3. The power module of claim 2, wherein, The first branch portion and the second branch portion are distributed in an "eight" shape, and the distance between the first branch portion and the second branch portion gradually increases from the first end to the second end.
4. The power module of claim 1, wherein, The pin group comprises a plurality of pins, all the pins are connected to the device portion through the welding portion; The pin comprises a connecting segment, an extending segment, and a bending segment, the connecting segment is connected to the extending segment through the bending segment, and the extending segment and the connecting segment are arranged at intervals in a direction perpendicular to the plugging direction of the pin group; the connecting segment is connected to the device portion through the welding portion, and the extending segment is located at the outer edge of the heat dissipation member and is configured to be plugged into the circuit board.
5. The power module of any one of claims 1 to 4, wherein, The power module further comprises a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on the heat dissipation member.
6. The power module of claim 5, wherein, The heat dissipation member has a first surface and a second surface arranged oppositely, the heat dissipation fins are located on the first surface, and the power device is located on the second surface.
7. The power module of claim 6, wherein, The heat dissipation fins and the heat dissipation member are configured as an integral structure.
8. The power module of claim 6, wherein, The power module further comprises a heat conduction member, and the heat conduction member is arranged on the heat dissipation member and located on the second surface.
9. The power module of any one of claims 1 to 4, wherein, The heat dissipation member further comprises a plugging portion, and the plugging portion is configured to be plugged into a plugging hole in the circuit board.
10. An inverter device, characterized by comprising: The power module comprises a circuit board and a power module as claimed in any one of claims 1 to 9, and the power module is configured to be vertically arranged on the circuit board.