Electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of heat dissipation devices, and particularly discloses electronic equipment which comprises a shell and a control assembly, and the shell is provided with a first containing groove. The control assembly is contained in the first containing groove and abuts against the wall face of the first containing groove. The heat conduction rate between the control assembly and the shell is improved, and a plurality of heat dissipation fins are arranged on the outer surface, away from the first containing groove, of the shell. Through the mode, the contact area between the shell and the external environment can be increased by arranging the heat dissipation fins on the outer surface of the shell, so that the heat dissipation capacity of the shell is improved, heat of the control assembly abutting against the shell is transmitted to the external environment through the shell in time, and compared with an existing fan heat dissipation mode, the heat dissipation efficiency is improved. The heat dissipation mode does not damage the waterproof performance and the sealing performance of the shell.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and in particular to an electronic device. Background Technology

[0002] Electronic devices generate heat during actual use. To ensure the long-term stable operation of these devices, it is necessary to dissipate heat from the heat-generating components, keeping their temperatures within a stable operating range. Current technology generally employs active cooling, which involves installing heat sinks on the heat-generating components and using a cooling fan to accelerate airflow around the heat sinks, thereby cooling the components.

[0003] In the process of realizing this application, the inventors of this application discovered that the current active heat dissipation method of heat sink plus cooling fan is bulky and occupies limited space in electronic devices. Furthermore, the heat dissipation method of cooling fan plus heat sink fins requires ventilation holes to facilitate ventilation of the cooling fan. This method draws in cold air from outside the casing and then exhausts hot air outside the casing, thus affecting the dust and water resistance of electronic devices. Utility Model Content

[0004] This application provides an electronic device, which mainly solves the technical problem that the built-in fan commonly used in existing electronic devices for cooling has affected the dustproof and waterproof performance of the electronic devices.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a heat dissipation device including: a housing, a first receiving groove, a control component housed in the first receiving groove, the control component abutting against the wall of the first receiving groove, and a plurality of heat dissipation fins provided on the outer surface of the housing away from the first receiving groove.

[0006] Optionally, the electronic device includes a thermally conductive layer, one side of which is attached to the control component, and the other side of which is attached to the bottom of the first receiving groove.

[0007] Optionally, the thermally conductive layer may be made of ceramic sheets and / or thermally conductive putty.

[0008] Optionally, the electronic device further includes an insulating layer disposed between the thermally conductive layer and the housing at the bottom of the first receiving groove.

[0009] Optionally, the insulating layer is made of silicone.

[0010] Optionally, the electronic device further includes thermally conductive adhesive that covers at least a portion of the control component and is adhered to the housing on the inner wall of the first receiving groove.

[0011] Optionally, the control component includes a motherboard and a transformer board, both of which are housed in the first receiving groove. The housing has a second receiving groove at the bottom of the first receiving groove, which communicates with the first receiving groove. At least a portion of the transformer board is housed in the second receiving groove, and the thermally conductive adhesive fills the second receiving groove and covers the transformer board.

[0012] Optionally, the transformer plate includes a plate body and a transformer, the transformer being disposed on the side of the plate body facing the second receiving groove; the plate body covers the opening of the second receiving groove, and the transformer is housed in the second receiving groove.

[0013] Optionally, the board body is provided with a glue-filling hole, and when the board body covers the opening of the second receiving groove, the glue-filling hole is connected to the second receiving groove.

[0014] Optionally, some of the heat dissipation fins cover the second receiving groove away from the outer surface of the control component.

[0015] The beneficial effects of this application embodiment are as follows: Unlike the prior art, this application embodiment provides an electronic device including a housing and a control component. The housing is provided with a first receiving groove, the control component is housed in the first receiving groove, and the control component abuts against the wall of the first receiving groove. A plurality of heat dissipation fins are provided on the outer surface of the housing opposite to the first receiving groove, increasing the contact area between the housing and the external environment. Through the above structure, this application embodiment can increase the contact area between the housing and the external environment by combining the heat dissipation fins with the housing. Therefore, the housing not only provides protection for the control component but also achieves passive heat dissipation for the control component. Compared to using a fan for cooling, this application embodiment is beneficial in achieving dust and water protection for the control component while effectively cooling the control component. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the exploded structure of an electronic device from one perspective, provided in an embodiment of this application;

[0018] Figure 2 This is an exploded structural diagram of an electronic device provided in an embodiment of this application from another perspective;

[0019] Figure 3 This is a cross-sectional schematic diagram of an electronic device provided in an embodiment of this application;

[0020] Figure 4 yes Figure 3 Enlarged view of part A in the middle;

[0021] Figure 5 This is a schematic diagram of the structure of a motherboard of an electronic device provided in an embodiment of this application;

[0022] Figure 6 yes Figure 5 Enlarged view of part B in the middle;

[0023] Figure 7 This is a schematic diagram of the structure of a transformer board for an electronic device provided in an embodiment of this application.

[0024] 100. Electronic devices;

[0025] 1. Housing; 11. First receiving slot; 12. Heat dissipation fins; 12'. Partial heat dissipation fins; 13. Second receiving slot;

[0026] 2. Control components; 21. Main board; 211. First screw connector; 212. First through hole; 213. Second screw connector; 21a. Circuit board; 21b. Electron tube; 21b1. High-voltage side MOSFET; 21b2. Low-voltage side MOSFET; 21ba. Body; 21bb. Pin; 21c. Pressure block; 21d. Auxiliary board; 213. First screw hole;

[0027] 22. Transformer board; 22a. Board body; 22a1. Potting hole; 22a2. Power terminal; 22a21. Second through hole; 22a3. Second screw hole; 22b. Transformer; 221. Third screw connector;

[0028] 3. Thermal conductive layer; 3a. Ceramic sheet; 3b. Thermal conductive putty;

[0029] 4. Insulation layer; 4a. Thermally conductive silicone cloth;

[0030] 5. Thermal conductive adhesive. Detailed Implementation

[0031] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0033] Please see Figure 1 and Figure 2 This application provides an electronic device 100, including a housing 1 and a control component 2. The housing 1 is provided with a first receiving groove 11, and the control component 2 is housed in the first receiving groove 11. The control component 2 abuts against the wall of the first receiving groove 11 to increase the contact area between the control component 2 and the wall of the first receiving groove 11 of the housing 1, thereby increasing the rate at which heat from the control component 2 is transferred to the housing 1. The outer surface of the housing 1 opposite to the first receiving groove 11 is provided with a plurality of heat dissipation fins 12 to increase the contact area between the housing 1 and the external environment, thereby improving the heat dissipation capacity of the housing 1. This allows the heat from the control component 2 abutting against the housing 1 to be transferred to the external environment in a timely manner through the housing 1. Compared with existing fan cooling methods, the heat dissipation method of this application does not compromise the waterproofness and sealing of the housing 1. It is more suitable for electronic devices 100 where the control component 2 needs to operate in a sealed environment. Furthermore, the heat dissipation fins 12 form a 90° angle with the outer surface of the housing 1, which increases the contact area between the housing 1 and the external environment and also facilitates the flow of cold air between the multiple heat dissipation fins 12, thereby generating convection.

[0034] In some embodiments, the electronic device 100 includes a heat-conducting layer 3, one side of which is attached to the control component 2, and the other side of which is attached to the bottom of the first receiving groove 11. The heat-conducting layer 3, relying on its excellent thermal conductivity, promptly and quickly transfers the heat from the heat-generating parts of the control component 2 to the housing 1, thereby improving the heat dissipation efficiency of the control component 2.

[0035] Understandably, during the actual installation process, it is difficult to ensure that the heating part of the control component 2 can completely contact the inner wall of the housing 1. Therefore, the position of the heat-conducting layer 3 on the control component 2 should be the position corresponding to the heating element of the control component 2.

[0036] It should be noted that the thermally conductive layer 3, as a structure with high thermal conductivity, can be made of materials including, but not limited to, ceramic sheets, thermally conductive putty, thermally conductive gel, etc., or any combination of two or more of these. For example, in this embodiment, thermally conductive putty 3b and ceramic sheet 3a are selected as the thermally conductive layer 3. The thermally conductive putty 3b is disposed on the irregular surface of the heating part of the control component 2. The plasticity of the shape of the thermally conductive putty 3b increases the contact area between the irregular surface of the heating part of the control component 2 and the housing 1. The ceramic sheet 3a is disposed on the flat surface of the heating part of the control component 2, allowing the control component 2 to fit tightly against the ceramic sheet 3a when assembled onto the housing 1. The thermally conductive putty 3b is a high-performance putty-like thermally conductive material. It is made with silicone as the matrix and filled with various high-performance ceramic powders. The thermally conductive putty 3b has the characteristics of high thermal conductivity, low thermal resistance, good adhesion to heat dissipation components, permanent non-drying, insulation, automatic gap filling, increased limited contact area, and unlimited compressibility.

[0037] In some embodiments, the electronic device 100 further includes an insulating layer 4, which is disposed between the thermally conductive layer 3 and the bottom of the first receiving groove 11. The insulating layer 4 provides insulation between the thermally conductive layer 3 and the housing 1, thereby insulating the housing 1 from the control component 2. This protects the control component 2, improves the safety of the electronic device 100, and extends its service life.

[0038] It is understood that the optional materials for the insulating layer 4 include, but are not limited to, silicone, ceramic, polyethylene, rubber, and insulating coatings. For example, in this embodiment, the preferred material for the insulating layer 4 is silicone. It should be noted that many products are derived from silicone as the insulating layer 4, such as silicone pads and silicone tapes. In this embodiment, the insulating layer 4 is made of thermally conductive silicone cloth (also known as thermally conductive silicone cloth, an organosilicon polymer elastomer reinforced with glass fiber as the substrate). Due to the inherent adhesiveness of the thermally conductive silicone cloth, it can be adhered to any location as needed during installation, thereby reducing the need for fixing and improving the efficiency of installing the electronic device 100.

[0039] When the functional requirements of electronic device 100 are different, its internal structure and the corresponding electronic components will also be different. Under certain specific requirements, such as in power supply equipment, related electronic components will be used because voltage changes are required. These components with the ability to change voltage generate more heat and are larger in size. Therefore, separate heat dissipation optimization design is required for such electronic components with high heat generation.

[0040] In this embodiment, please refer to Figure 3 and Figure 4 The electronic device 100 uses thermally conductive adhesive 5 to optimize the heat dissipation of the aforementioned high-heat-generating electronic components. The thermally conductive adhesive 5 covers at least a portion of the control component 2, that is, the thermally conductive adhesive 5 covers the aforementioned high-heat-generating electronic components and is attached to the inner wall of the housing 1 in the first receiving groove 11. This arrangement allows the heat from the high-heat-generating electronic components to be quickly transferred to the housing 1 through the thermally conductive adhesive 5, thereby maintaining the high-heat-generating electronic components in a stable working environment.

[0041] It should be noted that electronic components that generate a lot of heat include, but are not limited to: transformers, resistors, capacitors, and electron tubes.

[0042] In this embodiment, the control component 2 includes a main board 21 and a transformer board 22, both of which are housed in the first receiving groove 11. The housing 1 has a second receiving groove 13 at the bottom of the first receiving groove 11, which communicates with the first receiving groove 11. At least a portion of the transformer board 22 is housed in the second receiving groove 13, and the thermally conductive adhesive 5 fills the second receiving groove 13 and covers the transformer board 22. It should be noted that the transformer board 22 here refers to the aforementioned electronic component with high heat generation. The second receiving groove 13 in the housing 1 allows the heat generated by the transformer board 22 during operation to be transferred to the wall of the second receiving groove 13 via the thermally conductive adhesive 5, increasing the contact area between the transformer board 22 and the housing 1, thereby improving the heat dissipation rate of the transformer board 22.

[0043] It is understood that the motherboard 21 can be disposed on the housing 1 in ways including but not limited to: screw connection, snap connection, adhesive connection, etc. For example, in this embodiment, the motherboard 21 is fixed to the housing 1 by screw connection. Specifically, the motherboard 21 includes a first screw connector 211 and the motherboard 21 is provided with a first through hole 212. The first screw connector 211 passes through the first through hole 212 and is screwed to the inner wall surface of the first receiving groove 11.

[0044] For the motherboard 21 mentioned above, please refer to... Figure 5 and Figure 6The mainboard 21 includes a circuit board 21a, an electron tube 21b, a pressure block 21c, and an auxiliary board 21d. The electron tube 21b is electrically connected to the circuit board 21a. The electron tube 21b includes a body 21ba and pins 21bb. One end of the pins 21bb is connected to the body 21ba, and the other end of the pins 21bb is fixed to the circuit board 21a. The body 21ba and the circuit board 21a are electrically connected through the pins 21bb. The pressure block 21c is fixed to the surface of the circuit board 21a facing the housing 1, and the body 21ba is located on the side of the pressure block 21c away from the circuit board 21a, so that the body 21ba is isolated from the circuit board 21a, reducing the risk of short circuit between the body 21ba and the lines or other electronic components on the circuit board 21a. Moreover, when the mainboard 21 is installed on the housing 1, the pressure block 21c also facilitates pressing the body 21ba against the housing 1, thereby allowing the heat of the body 21ba to be transferred to the housing 1.

[0045] It should be noted that the connection method by which the pressure block 21c presses the electron tube 21b to the housing 1 includes, but is not limited to, screw connection, snap connection, glue connection, etc. For example, in this embodiment, the electron tube 21b is pressed to the housing 1 by screw connection. Specifically, the main board 21 also includes a second screw member 213, which passes through the circuit board 21a and the pressure block 21c in sequence and is screwed to the housing 1.

[0046] It is understood that there are multiple electron tubes 21b, which are spaced apart, and in this application, the electron tubes 21b are the heating elements. The heat-conducting layer 3 and the insulating layer 4 are sequentially sandwiched between the electron tubes 21b and the housing 1. For a clearer understanding of where the heat-conducting layer 3 is located, please refer to [the relevant documentation / reference needed]. Figure 5 and Figure 6 In this embodiment, some electron tubes 21b are designated as high-voltage side MOSFETs 21b1, and the other part of electron tubes 21b are designated as low-voltage side MOSFETs 21b2. The high-voltage side MOSFETs 21b1 are fixed to one side of the circuit board 21a, and the low-voltage side MOSFETs 21b2 are fixed to the other side of the circuit board 21a. The high-voltage side MOSFETs 21b1 and 21b2 work together to achieve voltage changes. A ceramic sheet 3a and a thermally conductive silicone cloth 4a are sequentially sandwiched between the high-voltage side MOSFET 21b1 and the housing 1, and a thermally conductive putty 3b and a thermally conductive silicone cloth 4a are sequentially sandwiched between the low-voltage side MOSFET 21b2 and the housing 1, thereby greatly improving the utilization rate of the thermally conductive putty 3b and the thermally conductive silicone cloth 4a.

[0047] In this embodiment, the auxiliary board 21d is electrically connected to the circuit board 21a, and the auxiliary board 21d is connected to components that carry large currents and generate a lot of heat (such as battery packs, DC-DC converters, etc.), thereby increasing the trace area of ​​the circuit board 21a connected to the auxiliary board 21d, reducing the operating impedance, and thus reducing the heat generated there. Thermal conductive putty 3b and thermal conductive silicone cloth 4a are sequentially sandwiched between the auxiliary board 21d and the housing 1 to fill the gap between the auxiliary board 21d and the housing 1, facilitating the transfer of heat from the auxiliary board 21d to the housing 1, whereby heat is dissipated through the heat dissipation fins 12 on the housing 1.

[0048] For the transformer board 22 mentioned above, please refer to... Figure 7 The transformer plate 22 includes a plate body 22a and a transformer 22b. The transformer 22b is disposed on the side of the plate body 22a facing the second receiving groove 13. The plate body 22a covers the opening of the second receiving groove 13, and the transformer 22b is housed in the second receiving groove 13. The depth of the second receiving groove 13 is adapted to the height of the transformer 22b so that the end of the transformer 22b away from the plate body 22a abuts against the bottom of the second receiving groove 13, or a gap is left between the transformer 22b and the bottom of the second receiving groove 13 for the thermally conductive adhesive 5 to fill. This structure allows the transformer 22b, a high-heat-generating electronic component, to be housed separately in the second receiving groove 13. The heat generated by the transformer 22b is transferred to the wall of the second receiving groove 13 through the thermally conductive adhesive 5, and then the housing 1 transfers the heat to the heat dissipation fins 12. This allows the thermally conductive adhesive 5 to specifically enhance the heat dissipation capacity of the transformer 22b, thereby ensuring the stability of the electronic device 100 operation.

[0049] Furthermore, to facilitate the filling of thermally conductive adhesive 5 between the transformer 22b and the wall of the second receiving groove 13, in some embodiments, the plate 22a is provided with an adhesive filling hole 22a1; when the plate 22a covers the opening of the second receiving groove 13, the adhesive filling hole 22a1 communicates with the second receiving groove 13. This structure allows the transformer plate 22, after being installed in the second receiving groove 13, to be filled only with thermally conductive adhesive 5 through the adhesive filling hole 22a1, reducing the difficulty of filling the thermally conductive adhesive 5, simplifying the assembly steps of the electronic device 100, and improving the installation efficiency of the electronic device 100.

[0050] In some embodiments, a power terminal 22a2 is provided on the surface of the board 22a facing away from the transformer 22b, for electrically connecting the board 22a to external cables or electronic components (e.g., the motherboard 21) within the electronic device 100. In this embodiment, the power terminal 22a2 is preferably electrically connected to the motherboard 21. Specifically, the transformer board 22 includes a third screw connector 221, the power terminal 22a2 is provided with a second through hole 22a21, the motherboard 21 is provided with a first screw hole 213, and the third screw connector 221 passes through the second through hole 22a21 and is screwed into the first screw hole 213.

[0051] It is understood that the transformer plate 22 can be disposed on the housing 1 by means including but not limited to: screw connection, snap connection, adhesive connection, etc. For example, in this embodiment, a screw connection is used to fix the transformer plate 22 to the housing 1. Specifically, the transformer plate 22 includes a fourth screw connector (not shown in the figure), the plate body 22a is provided with a second screw hole 22a3, and the fourth screw connector passes through the second screw hole 22a3 and is screwed to the housing 1.

[0052] To optimize the heat dissipation capability of the heat dissipation fins 12 of the housing 1 for the transformer 22b housed in the second receiving groove 13, in some embodiments, a portion of the heat dissipation fins 12' covers the outer surface of the second receiving groove 13 away from the outer surface of the control component 2. This further increases the contact area between the outer surface of the protrusion structure of the housing 1 that forms the second receiving groove 13 and the portion of the heat dissipation fins 12', thereby increasing the rate at which heat from high-heat electronic components (i.e., the transformer 22b) is transferred to the portion of the heat dissipation fins 12. This improves the heat dissipation efficiency of the electronic device 100.

[0053] In this embodiment, the electronic device 100 includes a housing 1, a control component 2, a thermally conductive layer 3, an insulating layer 4, and thermally conductive adhesive 5. The housing 1 has a first receiving groove 11. The control component 2 is housed in the first receiving groove 11, and the control component 2 sequentially abuts against the thermally conductive layer 3 and the insulating layer 4 before abutting against the wall of the bottom of the first receiving groove 11. The excellent thermal conductivity of the thermally conductive layer 3 transfers the heat generated by the control component 2 to the housing 1, thereby accelerating the heat dissipation efficiency of the control component 2. The insulating layer 4 is disposed between the housing and the thermally conductive layer 3, thereby insulating the control component 2 from the housing 1, protecting the control component, and reducing the risk of short circuit due to contact between the control component 2 and the housing 1. Heat dissipation fins 12 are provided on the outer surface of the housing 1 away from the first receiving groove 11 to further increase the contact area between the housing 1 and the external environment, improving the heat dissipation efficiency of the housing 1. Furthermore, the integrated design of the housing 1 and the heat dissipation fins 12 enhances the structural strength of the housing 1. The thermally conductive adhesive 5 covers a portion of the control component 2 to improve the heat dissipation efficiency of that local area. The above-described structure improves the heat dissipation efficiency of the electronic device 100 compared to heat dissipation methods that rely solely on the flat outer surface of the casing. Compared to a built-in cooling fan, the structure of this application does not compromise the integrity of the casing 1, ensuring its waterproofness and sealing.

[0054] It should be noted that while preferred embodiments of this application are provided in the specification and accompanying drawings, this application can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this application; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this application. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this application's specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An electronic device, comprising: The electronic device comprises: a shell provided with a first receiving groove; a control assembly accommodated in the first receiving groove, the control assembly abutting against a wall surface of the first receiving groove; an outer surface of the shell away from the first receiving groove is provided with a plurality of heat dissipation fins.

2. The electronic device according to claim 1, wherein the electronic device comprises a heat conduction layer, one side of the heat conduction layer is attached to the control assembly, and the other side of the heat conduction layer is attached to a groove bottom of the first receiving groove.

3. The electronic device according to claim 2, wherein a material of the heat conduction layer is ceramic sheet and / or heat conduction mud.

4. The electronic device according to claim 2, wherein the electronic device further comprises an insulating layer, the insulating layer is arranged between the heat conduction layer and the shell at the groove bottom of the first receiving groove.

5. The electronic device according to claim 4, wherein a material of the insulating layer is silica gel.

6. The electronic device according to any one of claims 1-5, wherein the electronic device further comprises heat conduction glue, the heat conduction glue wraps at least a part of the control assembly and is attached to an inner wall of the shell at the first receiving groove.

7. The electronic device according to claim 6, wherein the control assembly comprises a main board and a transformer board, the main board and the transformer board are both accommodated in the first receiving groove; the shell is provided with a second receiving groove at the groove bottom of the first receiving groove, the second receiving groove is in communication with the first receiving groove, at least a part of the transformer board is accommodated in the second receiving groove, and the heat conduction glue is filled in the second receiving groove and wraps the transformer board.

8. The electronic device according to claim 7, wherein the transformer board comprises a board body and a transformer, the transformer is arranged on a side of the board body facing the second receiving groove; the board body covers a groove opening of the second receiving groove, and the transformer is accommodated in the second receiving groove.

9. The electronic device according to claim 8, wherein the board body is provided with a glue filling hole; when the board body covers the groove opening of the second receiving groove, the glue filling hole is in communication with the second receiving groove.

10. The electronic device according to claim 7, wherein part of the heat dissipation fins cover an outer surface of the second receiving groove away from the control assembly. ​ ​ ​ ​ ​ ​ ​ ​ ​

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