Heat dissipation assembly and electronic equipment

Abstract

The utility model provides a heat dissipation assembly and electronic equipment, and in the electronic equipment, one side, facing a chip, of the heat dissipation assembly is provided with a first protruding part; the side, away from the chip, of the first protruding part is provided with a first concave part which is concave towards one side of the chip, the side, facing the chip, of the heat dissipation assembly is provided with the first protruding part, the distance between the heat dissipation assembly and the chip is shortened, thermal resistance between the heat dissipation assembly and the chip is reduced, the heat dissipation effect on the chip is improved, and meanwhile the heat dissipation efficiency of the chip is improved. In the area provided with the chip, the distance between the display assembly and the heat dissipation assembly is increased through the first concave part, the heat transfer speed is reduced, the speed of transferring the heat of the chip into the display assembly is reduced, and the experience of a user when the electronic product is used is improved.

Description

Technical Field

[0001] This application relates to the field of terminal device hardware, and more specifically, to a heat dissipation component and an electronic device. Background Technology

[0002] During use, electronic devices typically generate heat. Currently, the most common heat dissipation solution for electronic devices involves attaching a vapor chamber (VC) to the device's frame to cool the chips on the circuit board. However, the significant distance between the VC and the chips results in high thermal resistance, hindering heat dissipation. Therefore, a heat dissipation component with high efficiency is urgently needed. Utility Model Content

[0003] This application provides a heat dissipation component and an electronic device that can effectively improve the heat dissipation capacity of the electronic device.

[0004] In a first aspect, a heat dissipation component is provided for use in an electronic device, wherein the heat dissipation component has a first protrusion on the side facing the chip; and the first protrusion has a first recess on the side away from the chip that is recessed towards the chip.

[0005] Based on the above technical solution, the first protrusion of the heat dissipation component facing the chip shortens the distance between the heat dissipation component and the chip, reduces the thermal resistance between the heat dissipation component and the chip, and improves the heat dissipation effect on the chip. At the same time, in the area where the chip is located, the first recess increases the distance between the heat dissipation component and the component above the heat dissipation component, slowing down the speed at which the heat from the chip is transferred to the component above the heat dissipation component.

[0006] In conjunction with the first aspect, in some implementations of the first aspect, a second protrusion is further provided on the surface of the first protrusion facing the chip.

[0007] Based on the above technical solution, a second protrusion is provided on the surface of the first protrusion facing the chip, which further shortens the distance between the heat dissipation component and the chip, reduces the thermal resistance between the heat dissipation component and the chip, and improves the heat dissipation effect on the chip.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the heat dissipation assembly includes a stacked middle frame and a vacuum chamber heat spreader.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the middle frame is located on the side closer to the chip, the first protrusion is disposed on the side of the middle frame closer to the chip, and the first recess is disposed on the side of the vacuum chamber heat spreader away from the chip.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, the vacuum chamber heat spreader is located on the side closer to the chip, the first protrusion is disposed on the side of the vacuum chamber heat spreader close to the chip, and the first recess is disposed on the side of the vacuum chamber heat spreader away from the chip.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the first protrusion is integrally disposed on the vapor chamber heat spreader, and the second protrusion includes a metal component disposed on the surface of the first protrusion near the chip.

[0012] Based on the above technical solution, the second protrusion is set on the surface of the vacuum chamber heat spreader, which reduces the difficulty of forming the vacuum chamber heat spreader.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, the first protrusion and the second protrusion are integrally disposed on the vapor chamber heat exchange plate.

[0014] Based on the above technical solution, the vacuum chamber heat spreader is integrally provided with a first protrusion and a second protrusion, so that the vacuum chamber heat spreader is integrally formed, which reduces the process steps of heat dissipation component forming and improves the production efficiency of heat dissipation component.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, a cover layer is provided on the surface of the vacuum chamber heat spreader away from the chip, the cover layer including any one of graphite film, graphene film, copper foil or aluminum foil.

[0016] Based on the above technical solution, a covering layer is provided on the surface of the vacuum cavity heat exchange plate, which can further improve the heat dissipation effect of the vacuum cavity heat exchange plate.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, a receiving channel is provided between the covering layer and the vacuum cavity heat exchange plate, and a heat storage material is provided in the receiving channel.

[0018] Based on the above technical solution, the heat storage material in the containment channel formed between the cover layer and the vacuum cavity heat spreader can improve the heat absorption capacity of the vacuum cavity heat spreader. The vacuum cavity heat spreader can store the heat of the chip, slow down the speed at which heat is transferred to the components above the heat dissipation assembly, and reduce the temperature rise rate of the electronic device.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, the first recess is provided with a heat insulation material or a heat storage material; the heat insulation material includes foam or aerogel, and the heat storage material includes any one of paraffin-based heat storage material, metal-based heat storage material, and hydrated salt-based heat storage material.

[0020] Based on the above technical solution, by setting heat insulation material or heat storage material in the first recess, the heat of the chip can be absorbed by the heat storage material when it is transferred to the first recess, which further slows down the speed at which the heat of the chip is transferred to the components above the heat dissipation assembly, and further reduces the temperature rise rate of the electronic device.

[0021] In a second aspect, an electronic device is provided, comprising a heat dissipation component as described in the first aspect and any implementation thereof, the electronic device further comprising: a circuit board having a chip disposed on its surface; a metal shielding cover comprising a side plate and a top plate, the side plate surrounding the chip, the top plate comprising a second recessed portion recessed toward one side of the chip, and a second protrusion further disposed on the surface of the first protrusion toward one side of the chip; the second protrusion being disposed in a position corresponding to the second recessed portion, the second protrusion extending into the second recessed portion.

[0022] Based on the above technical solution, the distance between the heat dissipation component and the chip in electronic devices is shortened, the thermal resistance between the heat dissipation component and the chip is reduced, and the heat dissipation effect on the chip is improved.

[0023] In conjunction with the second aspect, some implementations of the second aspect further include a battery assembly, wherein the battery assembly and the chip are located on the same side of the heat dissipation assembly, and the heat dissipation assembly has a third recess on the side facing the battery assembly that is away from the recess of the battery assembly.

[0024] Based on the above technical solution, the third recessed portion is provided so that the vacuum chamber heat spreader can have a thicker thickness in the chip area, thereby increasing the size of the vacuum chamber heat spreader and improving its heat dissipation performance.

[0025] In conjunction with the second aspect, in some implementations of the second aspect, the top plate is provided with an opening, and the second protrusion passes through the opening and is disposed above the chip; a thermally conductive material is also disposed in contact between the second protrusion and the chip; a conductive material is disposed in contact between the first protrusion and the top plate; the conductive material includes any one of conductive adhesive, conductive cloth, copper, aluminum or graphite.

[0026] Based on the above technical solution, the distance between the second protrusion and the chip is further shortened by the opening in the top plate of the metal shielding cover, which reduces the thermal resistance between the heat dissipation component and the chip and improves the heat dissipation effect on the chip. At the same time, conductive material is provided between the first protrusion and the metal shielding cover with the opening to achieve electromagnetic shielding effect on the chip. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of an electronic device provided in an embodiment of this application.

[0028] Figure 2 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0029] Figure 3 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0030] Figure 4 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0031] Figure 5 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0032] Figure 6 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0033] Figure 7 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0034] Figure 8 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0035] Figure 9 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0036] Figure 10 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0037] Figure 11 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0038] Figure 12 This is a schematic diagram of another electronic device provided in an embodiment of this application.

[0039] Figure 13 This is a schematic diagram of a vacuum chamber heat exchanger provided in an embodiment of this application.

[0040] Figure 14 This is a schematic diagram of the temperature rise curve of an electronic device provided in an embodiment of this application. Detailed Implementation

[0041] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0042] It should be noted that in the embodiments of this application, the terms "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the embodiments of this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. The terms "comprising," "including," "having," and their variations all mean "including but not limited to," unless otherwise specifically emphasized. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The sequence numbers of the processes below do not imply the order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0043] In the description of the embodiments of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range.

[0044] In this embodiment, references to "one embodiment" or "some embodiments" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. In this application, words such as "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized. In the embodiments of this application, descriptions such as "when," "in the case of," "if," and "if" all refer to the device taking corresponding actions under certain objective circumstances, not to limiting the time, nor to requiring the device to perform a judgment action during implementation, nor implying any other limitations.

[0045] The term "and / or" in the embodiments of this application is merely a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. Additionally, the character " / " in the embodiments of this application generally indicates that the preceding and following related objects have an "or" relationship.

[0046] Furthermore, it should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0047] Figure 1 This is a schematic diagram of an electronic device provided in an embodiment of this application.

[0048] like Figure 1 As shown, the electronic device 100 may include components such as a display component 110, a heat dissipation component 120, a battery component 130, a circuit board 140, and a base plate 150. The display component 110 may be a component with display function, such as a light-emitting diode (LED) screen. The outer surface of the display component 110 is usually also the outer surface of the electronic device 100, used to present images to the user. The heat dissipation component 120 is usually located on the back of the display component. The heat dissipation component 120 may include a middle frame 120a, which may be an intermediate structure in the electronic device 100 that supports various components. The middle frame 120a may be a square structure with a concave center and convex ends. The middle frame 120a can be used to absorb heat generated by heat-generating devices such as the circuit board 140 and the processor in the electronic device. The battery component 130 may include a lithium battery, a nickel-metal hydride battery, or other types of batteries, and can be used to provide power to the electronic device 100. The battery component 130 and the circuit board 140 are usually located on the same side of the heat dissipation component 120. The heat dissipation component 120 may also include a vacuum chamber heat spreader 120b, such as... Figure 1 As shown, the vacuum chamber heat spreader 120b is embedded on the surface of the middle frame 120a away from the circuit board 140. The middle frame 120a and the vacuum chamber heat spreader 120b (vapor chamber, VC) can be connected by means of bonding, dispensing, or bolts, or by a combination of the above connection methods.

[0049] The surface of the circuit board 140 is provided with a chip 141 and a metal shield 142 covering the chip 141. The metal shield 142 includes a side plate 1421 and a top plate 1422 surrounding the chip 141. The metal shield 142 can shield external electromagnetic interference to ensure the normal operation of the chip 141. The base plate 150 is used to support various components in the electronic device 100, and is usually the back of the electronic device 100.

[0050] During user operation of electronic device 100, the device typically generates heat. Currently, the most common heat dissipation solution for electronic device 100 involves attaching a vacuum chamber heat sink 120b to the mid-frame 120a of the device to dissipate heat from the chip 141 on the circuit board 140. However, the distance between the heat sink 120 and the chip 141 on the circuit board 140 is relatively large, resulting in high thermal resistance and hindering heat dissipation from the chip 141. Therefore, a heat sink 120 and electronic device 100 with high heat dissipation efficiency are needed.

[0051] To address the aforementioned issues, embodiments of this application provide a heat dissipation component 120 and an electronic device 100. The heat dissipation component 120 in the electronic device 100 can reduce the distance between the heat dissipation component 120 and the chip 141, thereby improving the heat dissipation efficiency of the electronic device 100.

[0052] The electronic device 100 provided in this application embodiment can be a mobile phone, tablet computer, laptop computer, smartwatch, e-reader, wearable device, camera, in-vehicle computer, smart screen, or other electronic device 100 with heat-generating components. This application embodiment does not limit the specific form of the electronic device 100; for ease of explanation and understanding, a mobile phone will be used as an example for the following description.

[0053] Figure 2 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0054] The heat dissipation assembly 120 has a first protrusion 121 on the side facing the chip 141, and a first recess 122 is provided on the side of the first protrusion 121 away from the chip 141, which is recessed towards the chip 141.

[0055] It is understandable that the chip 141 in the electronic device 100 generates a relatively high amount of heat, and the corresponding display component 110 will also generate a relatively high amount of heat. Since users usually need to come into contact with the display component 110 when using the electronic device 100, excessive heat will cause a poor user experience. After the first recess 122 is provided on the side of the first protrusion 121 away from the chip 141, the distance between the vacuum cavity heat spreader 120b and the display component 110 in the area where the chip 141 is located is increased, which slows down the heat transfer speed and helps to improve the user experience.

[0056] Based on the above technical solution, the heat dissipation component 120 is provided with a first protrusion 121 on the side facing the chip 141, which shortens the distance between the heat dissipation component 120 and the chip 141 and improves the heat dissipation effect on the chip 141. At the same time, in the area where the chip 141 is provided, the first recess 122 increases the distance between the display component 110 and the heat dissipation component 120, slows down the heat transfer speed, and helps to improve the user experience when using electronic products.

[0057] Figure 3 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0058] In some possible implementations, the first recess 122 may also be provided with heat insulation material or heat storage material 160, such as... Figure 3 As shown, a heat insulation material or a heat storage material 160 is provided in the first recess. The heat insulation material can be a material such as foam or aerogel, and the heat storage material 160 can be a phase change material (PCM). For example, it can be any one of the following heat storage materials: paraffin-based heat storage material 160, organic heat storage material 160, metal-based heat storage material 160, or hydrated salt-based heat storage material 160.

[0059] Based on the above technical solution, by providing heat insulation material or heat storage material 160 in the first recess 122, the heat of the chip 141 is absorbed by the heat storage material 160 when it is conducted to the first recess 122, which slows down the process of heat being further conducted to the display component 110, further reducing the temperature rise rate of the electronic device 100, which is conducive to improving the user experience.

[0060] In some possible implementations, thermally conductive material 170 is also provided in contact between the chip 141 and the top plate 1422 of the metal shield 142, and between the first protrusion 121 and the top plate 1422 of the metal shield 142, respectively. For example, it can be a thermal interface material (TIM), so that the heat of the chip 141 can be conducted to the heat dissipation component 120 more quickly, thereby improving the heat dissipation efficiency of the electronic device 100.

[0061] In some possible implementations, in a first direction, the size of the first protrusion 121 is larger than the size of the first recess 122, and the first direction is perpendicular to the thickness direction of the electronic device, as... Figure 2 As shown, the size of the first protrusion 121 is L1, and the size of the first recess 122 is L2, that is, L1 > L2.

[0062] Figure 4 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0063] like Figure 4 As shown, the surface of the first protrusion 121 of the heat dissipation assembly 120 facing the chip 141 is also provided with a second protrusion 123. Correspondingly, the chip 141 and the metal shield 142 are provided on the surface of the circuit board 140 of the electronic device 100. The metal shield 142 includes a side plate 1421 surrounding the chip 141 and a top plate 1422. The top plate 1422 includes a second recessed portion 1422a recessed towards the chip 141. The second protrusion 123 of the heat dissipation assembly 120 is positioned corresponding to the second recessed portion 1422a, and the second protrusion 123 extends into the second recessed portion 1422a.

[0064] Still Figure 4 As shown, there is usually a certain space between the chip 141 and the top plate 1422 of the metal shield 142, and there is also a certain space between the second protrusion 123 and the top plate 1422 of the metal shield 142. In order to improve the heat conduction efficiency of the chip 141, thermally conductive materials 170 can be respectively provided between the chip 141 and the metal shield 142 and between the second protrusion and the metal shield 142. For example, it can be a thermal interface material (TIM) to make the heat of the chip 141 conduct to the heat dissipation component 120 more quickly, thereby improving the heat dissipation efficiency of the electronic device 100.

[0065] Based on the above technical solution, the second protrusion 123 of the heat dissipation component 120 is correspondingly provided with the second recess 1422a, which shortens the distance between the heat dissipation component 120 and the chip 141, and is more conducive to the rapid conduction of heat from the chip 141 to the heat dissipation component 120, thereby improving the heat dissipation efficiency of the electronic device 100.

[0066] Figure 5 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0067] and Figure 4 The difference of the electronic device 100 shown is that the top plate 1422 of the metal shield 142 of the electronic device 100 is provided with an opening 1422b, the second protrusion 123 of the heat dissipation assembly 120 passes through the opening 1422b and is disposed above the chip 141, a thermally conductive material 170 is disposed in contact between the second protrusion 123 and the chip 141, and a conductive material 180 is disposed in contact between the first protrusion 121 and the top plate 1422.

[0068] Based on the above technical solution, the opening 1422b of the top plate 1422 of the metal shielding cover 142 makes the distance between the second protrusion 123 of the heat dissipation component 120 and the chip 141 shorter, so that the second protrusion 123 can directly pass through the opening 1422b and be positioned above the chip 141.

[0069] The second protrusion 123 can directly contact the chip 141 through the opening 1422b. Alternatively, a thermally conductive material 170, such as TIM material, can be provided between the second protrusion 123 and the chip 141 to improve the thermal conductivity between the second protrusion 123 and the chip 141.

[0070] Since the top plate 1422 of the metal shielding cover 142 has an opening 1422b, the electromagnetic shielding of the originally closed metal shielding cover 142 will fail. Therefore, it is necessary to provide a conductive material 180 between the first protrusion 121 and the top plate 1422, so that the first protrusion 121, the conductive material 180 and the metal shielding cover 142 together form a closed structure to achieve the electromagnetic shielding effect.

[0071] The conductive material 180 can be any one of conductive adhesive, conductive cloth, copper, aluminum, or graphite that has good electrical conductivity.

[0072] Figure 6 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0073] To further improve the heat dissipation efficiency of the heat dissipation component 120, a vacuum chamber heat spreader 120b can be provided in the heat dissipation component 120 to further improve the heat dissipation efficiency of the heat dissipation component 120. Figure 2The difference in the electronic device 100 shown is that the heat dissipation assembly 120 may further include a vacuum chamber heat spreader 120b, which is disposed inside the middle frame 120a. The middle frame 120a can be used to support the vacuum chamber heat spreader 120b. A first protrusion 121b is integrally disposed in the vacuum chamber heat spreader 120b, and correspondingly, a first recess 122b is also disposed in the vacuum chamber heat spreader 120b.

[0074] Figure 7 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0075] like Figure 7 As shown, the middle frame 120a and the vacuum chamber heat spreader 120b are stacked. The middle frame 120a is located on the side closer to the chip 141. The first protrusion 121a is located on the side of the middle frame 120a close to the chip 141, and the first recess 122b is located on the side of the vacuum chamber heat spreader 120b away from the chip 141.

[0076] In some possible implementations, the heat dissipation component 120 has a third recess 124 on the side facing the battery component 130, away from the recess of the battery component 130, as... Figure 7 As shown, the third recess 124 can be disposed on the vacuum chamber heat spreader 120b. The third recess 124 allows the vacuum chamber heat spreader 120b to have a thicker thickness in the chip 141 region, so as to facilitate the setting of larger vapor channels or multi-layer, multi-scale capillary structures, which is beneficial to improving the heat dissipation performance of the vacuum chamber heat spreader 120b.

[0077] It should be noted that when the vacuum chamber heat spreader 120b is provided with the third recess 124, the vacuum chamber heat spreader 120b needs to be made of a material with sufficient strength to ensure the structural stability of the electronic device 100.

[0078] Figure 8 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0079] The heat dissipation assembly 120 includes a middle frame 120a and a vacuum chamber heat spreader 120b disposed on the middle frame 120a. The vacuum chamber heat spreader 120b has a first protrusion 121b on the side facing the chip 141, and a second protrusion 123a is also provided on the surface of the first protrusion 121b on the side facing the chip 141. A first recessed portion 122b is provided on the side of the first protrusion 121b away from the chip 141, which is recessed toward the chip 141.

[0080] A chip 141 and a metal shield 142 are disposed on the surface of the circuit board 140 of the electronic device 100. The metal shield 142 includes a side plate 1421 and a top plate 1422 surrounding the chip 141. The top plate 1422 includes a second recessed portion 1422a recessed towards the chip 141. The second protrusion 123a of the heat dissipation assembly 120 is disposed corresponding to the position of the second recessed portion 1422a, and the second protrusion 123a extends into the second recessed portion 1422a.

[0081] The second protrusion 123a includes a metal component, which is disposed on the surface of the first protrusion 121b near the chip 141. The metal component and the first protrusion 121b can be connected by welding.

[0082] Based on the above technical solution, the second protrusion 123a and the second recess 1422a of the heat dissipation component 120 are configured to cooperate, which shortens the distance between the heat dissipation component 120 and the chip 141, which is conducive to the rapid conduction of heat from the chip 141 to the heat dissipation component 120 and improves the heat dissipation efficiency of the electronic device 100.

[0083] Figure 9 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0084] like Figure 9 As shown, the middle frame 120a and the vacuum chamber heat spreader 120b are stacked. The middle frame 120a is located on the side closer to the chip 141. The first protrusion 121a is located on the side of the middle frame 120a close to the chip 141, and the second protrusion 123a is located on the side of the middle frame 120a where the first protrusion 121a faces the chip 141. That is, the first protrusion 121a and the second protrusion 123a are integrally disposed on the middle frame 120a. The first recess 122b is located on the side of the vacuum chamber heat spreader 120b away from the chip 141.

[0085] Figure 10 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0086] and Figure 6 The difference in the electronic device 100 shown is that the first protrusion 121b and the second protrusion 123b are both disposed on the vacuum chamber heat spreader 120b, that is, the first protrusion 121b and the second protrusion 123b are integrally disposed on the vacuum chamber heat spreader 120b. The vacuum chamber heat spreader 120b can be integrally formed by a stamping process, and the first protrusion 121b and the second protrusion 123b are formed by the stamping process.

[0087] In some possible implementations, both the first protrusion and the second protrusion can be located on the middle frame 120a.

[0088] In some possible implementations, the first protrusion can be disposed on the vacuum chamber heat spreader 120b, and the second protrusion can be disposed on the middle frame 120a.

[0089] In some possible implementations, the first protrusion 121b may be disposed within the vapor chamber heat spreader 120b, and the second protrusion may be a metal component different from the vapor chamber heat spreader 120b, disposed on the surface of the first protrusion near the chip 141. The metal component may be made of a metal or composite metal with good thermal conductivity, such as aluminum or copper. The metal component may be connected to the first protrusion 121b by welding, or it may be disposed on the surface of the first protrusion 121b near the chip 141 via the middle frame 120a, for example, it may be embedded in the corresponding area of ​​the middle frame 120a.

[0090] Figure 11 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0091] The heat dissipation assembly 120 includes a middle frame 120a and a vacuum chamber heat spreader 120b disposed on the middle frame 120a. The vacuum chamber heat spreader 120b has a first protrusion 121b on the side facing the chip 141, and a second protrusion 123a is also provided on the surface of the first protrusion 121b on the side facing the chip 141. A first recessed portion 122b is provided on the side of the first protrusion 121b away from the chip 141, which is recessed toward the chip 141.

[0092] A chip 141 and a metal shield 142 are disposed on the surface of a circuit board 140 of an electronic device 100. The metal shield 142 includes a side plate 1421 surrounding the chip 141 and a top plate 1422. The top plate 1422 is provided with an opening 1422b, and a second protrusion 123a of a heat dissipation assembly 120 passes through the opening 1422b and is disposed above the chip 141. A thermally conductive material 170 is disposed in contact between the second protrusion 123a and the chip 141, and a conductive material 180 is disposed in contact between the first protrusion 121b and the top plate 1422.

[0093] Based on the above technical solution, the opening 1422b of the top plate 1422 of the metal shielding cover 142 makes the distance between the second protrusion 123a of the heat dissipation component 120 and the chip 141 shorter, so that the second protrusion 123 can directly pass through the opening 1422b and be positioned above the chip 141.

[0094] The second protrusion 123a can directly contact the chip 141 through the opening 1422b. Alternatively, a thermally conductive material 170, such as TIM material, can be provided between the second protrusion 123a and the chip 141 to improve the thermal conductivity between the second protrusion 123a and the chip 141.

[0095] Since the top plate 1422 of the metal shielding cover 142 has an opening 1422b, the electromagnetic shielding of the originally closed metal shielding cover 142 will fail. Therefore, it is necessary to set a conductive material 180 between the first protrusion 121b and the top plate 1422, so that the first protrusion 121b, the conductive material 180 and the metal shielding cover 142 together form a closed structure to achieve the electromagnetic shielding effect.

[0096] The second protrusion 123a includes a metal component, which is disposed on the surface of the first protrusion 121b near the chip 141. The metal component and the first protrusion 121b can be connected by welding.

[0097] Based on the above technical solution, the second protrusion 123a of the heat dissipation component 120 extends into the metal shield 142 through the opening 1422b, further shortening the distance between the second protrusion 123a and the chip 141, which is conducive to the rapid conduction of heat from the chip 141 to the heat dissipation component 120, thereby improving the heat dissipation efficiency of the electronic device 100.

[0098] Figure 12 This is a schematic diagram of another electronic device 100 provided in an embodiment of this application.

[0099] The heat dissipation assembly 120 includes a middle frame 120a and a vacuum chamber heat spreader 120b disposed on the middle frame 120a. The vacuum chamber heat spreader 120b has a first protrusion 121b on the side facing the chip 141, and a second protrusion 123b is also provided on the surface of the first protrusion 121b on the side facing the chip 141. A first recessed portion 122b is provided on the side of the first protrusion 121b away from the chip 141, which is recessed toward the chip 141.

[0100] A chip 141 and a metal shield 142 are disposed on the surface of a circuit board 140 of an electronic device 100. The metal shield 142 includes a side plate 1421 surrounding the chip 141 and a top plate 1422. The top plate 1422 has an opening 1422b, and a second protrusion 123b of a heat dissipation assembly 120 passes through the opening 1422b and is disposed above the chip 141. A thermally conductive material 170 is disposed in contact between the second protrusion 123b and the chip 141, and a conductive material 180 is disposed in contact between the first protrusion 121b and the top plate 1422.

[0101] Based on the above technical solution, the opening 1422b of the top plate 1422 of the metal shielding cover 142 makes the distance between the second protrusion 123b of the heat dissipation component 120 and the chip 141 shorter, so that the second protrusion 123 can directly pass through the opening 1422b and be positioned above the chip 141.

[0102] The second protrusion 123b can directly contact the chip 141 through the opening 1422b. Alternatively, a thermally conductive material 170, such as TIM material, can be provided between the second protrusion 123b and the chip 141 to improve the thermal conductivity between the second protrusion 123b and the chip 141.

[0103] Since the top plate 1422 of the metal shielding cover 142 has an opening 1422b, the electromagnetic shielding of the originally closed metal shielding cover 142 will fail. Therefore, it is necessary to set a conductive material 180 between the first protrusion 121b and the top plate 1422, so that the first protrusion 121b, the conductive material 180 and the metal shielding cover 142 together form a closed structure to achieve the electromagnetic shielding effect.

[0104] The second protrusion 123b includes a metal component, which is disposed on the surface of the first protrusion 121b near the chip 141. The metal component and the first protrusion 121b can be connected by welding.

[0105] Based on the above technical solution, the second protrusion 123b of the heat dissipation component 120 extends into the metal shield 142 through the opening 1422b, further shortening the distance between the second protrusion 123b and the chip 141, which is conducive to the rapid conduction of heat from the chip 141 to the heat dissipation component 120, thereby improving the heat dissipation efficiency of the electronic device 100.

[0106] Figure 13 This is a schematic diagram of a vacuum chamber heat spreader 120b provided in an embodiment of this application.

[0107] The vacuum chamber heat spreader 120b is usually made of a metal material with good thermal conductivity, such as aluminum or copper. In order to prevent the vapor channel in the vacuum chamber heat spreader 120b from collapsing, a support column 1201b is often set inside the vacuum chamber heat spreader 120b. The bottom of the vacuum chamber heat spreader 120b is also provided with an internal capillary structure.

[0108] For the vacuum chamber heat spreader 120b with a stamped cover plate, the support column 1201b forms the vapor channel inside the vacuum chamber heat spreader 120b and the space outside the vacuum chamber heat spreader 120b, such as Figure 10 The diagram illustrates the structural changes of the vacuum chamber heat exchanger 120b during the stamping process. Figure 13 The vacuum chamber heat exchange plate 120b shown in (a) is formed after a stamping process. Figure 13 The vacuum chamber heat exchange plate 120b shown in (b) has a support column 1201b formed by a stamping process. The support column 1201b can also be regarded as the upper cover plate of the vacuum chamber heat exchange plate 120b. The support column 1201b divides the vacuum chamber heat exchange plate 120b into an internal vapor channel and an external space. An internal capillary structure is also provided between the upper cover plate and the lower cover plate of the vacuum chamber heat exchange plate 120b.

[0109] like Figure 13 As shown in (c), after the vacuum chamber heat spreader 120b is formed into support pillars 1201b through a stamping process, a cover layer 1202b is provided on the side of the vacuum chamber heat spreader 120b away from the chip 141. The cover layer 1202b can be attached to the surface of the vacuum chamber heat spreader 120b and can be any one of graphite film, graphene film, copper foil, or aluminum foil. The cover layer 1202b and the external space of the vacuum chamber heat spreader 120b form a receiving channel 1203b. The receiving channel 1203b can also be filled with the heat storage material 160 mentioned above to further improve the heat absorption capacity of the vacuum chamber heat spreader 120b.

[0110] It should be noted that the covering layer 1202b itself also has heat absorption capacity, which can improve the heat absorption capacity of the vacuum cavity heat spreader 120b.

[0111] Based on the above technical solution, by setting heat storage material 160 in the receiving channel 1203b of the vacuum cavity heat spreader 120b, the heat absorption capacity of the vacuum cavity heat spreader 120b is further improved, the temperature rise rate of the electronic device 100 is reduced, and the user experience is improved.

[0112] Figure 14 This is a schematic diagram showing the temperature-time relationship of the electronic device 100 provided in the embodiments of this application.

[0113] Figure 14The diagram shows the temperature and time of the area in the electronic device 100 where the chip 141 is located. It illustrates the temperature change trends when the electronic device 100 has a heat storage material 160 and when it does not. The heat storage material 160 can be located in the first recess 122b or in the receiving channel 1203b of the vacuum chamber heat spreader 120b. The example given is the first recess 122b. When the electronic device 100 heats up at the same power, at the first moment, the temperature reaches 44.9°C when the heat storage material 160 is not provided in the first recess 122b, while when the heat storage material 160 is provided in the first recess 122b, the temperature only rises to 42.3°C, with a peak temperature gain of 2.6°C. Subsequently, when the electronic device 100 heats up again at the same power, the peak temperature gains at the second and third moments are 2.5°C and 2°C respectively. This indicates that providing the heat storage material 160 in the first recess 122b can effectively reduce the maximum temperature of the electronic device 100 when it heats up. This is especially true for reducing the heating temperature of the chip 141 region.

[0114] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation assembly applied to an electronic device, characterized in that, one side of the heat dissipation assembly (120) facing the chip (141) is provided with a first protruding part (121); one side of the first protruding part (121) away from the chip (141) is provided with a first recessed part (122) recessed toward the side of the chip (141).

2. The heat dissipation assembly according to claim 1, characterized in that, the surface of the first protruding part (121) on the side facing the chip (141) is further provided with a second protruding part (123).

3. The heat dissipation assembly according to claim 2, characterized in that, the heat dissipation assembly (120) comprises a middle frame (120a) and a vacuum cavity vapor chamber (120b) arranged in layers.

4. The heat dissipation assembly according to claim 3, characterized in that, the middle frame (120a) is located on the side close to the chip (141), the first protruding part (121) is arranged on the side of the middle frame (120a) close to the chip (141), and the first recessed part (122) is arranged on the side of the vacuum cavity vapor chamber (120b) away from the chip (141).

5. The heat dissipation assembly according to claim 3, characterized in that, the vacuum cavity vapor chamber (120b) is located on the side close to the chip (141), the first protruding part (121) is arranged on the side of the vacuum cavity vapor chamber (120b) close to the chip (141), and the first recessed part (122) is arranged on the side of the vacuum cavity vapor chamber (120b) away from the chip (141).

6. The heat dissipation assembly according to claim 5, characterized in that, the first protruding part (121) is integrally arranged on the vacuum cavity vapor chamber (120b), the second protruding part (123) comprises a metal piece arranged on the surface of the first protruding part (121) on the side close to the chip (141).

7. The heat dissipation assembly according to claim 5, characterized in that, the first protruding part (121) and the second protruding part (123) are integrally arranged on the vacuum cavity vapor chamber (120b).

8. The heat dissipation assembly according to claim 3, characterized in that, the surface of the side of the vacuum cavity vapor chamber (120b) away from the chip (141) is provided with a covering layer (1202b), and the covering layer (1202b) comprises any one of a graphite film, a graphene film, a copper foil or an aluminum foil.

9. The heat dissipation assembly according to claim 8, characterized in that, a containing channel (1203b) is arranged between the covering layer (1202b) and the vacuum cavity vapor chamber (120b), and a heat storage material (160) is arranged in the containing channel (1203b).

10. The heat dissipation assembly according to any one of claims 1-9, characterized in that, the first recessed part (122) is provided with a heat insulation material or a heat storage material (160). The thermal insulation material comprises foam or aerogel, and the thermal storage material (160) comprises any one of a paraffin-based thermal storage material, a metal-based thermal storage material, and a hydrated salt-based thermal storage material.

11. An electronic device, comprising: The electronic device comprises the heat dissipation assembly according to any one of claims 1-10, and further comprises: a circuit board (140) provided with a chip (141) on a surface thereof; a metal shielding cover (142) comprising a side plate (1421) surrounding the chip (141) and a top plate (1422) comprising a second recess (1422a) recessed towards a side of the chip (141), wherein a surface of the first protruding portion (121) towards the side of the chip (141) is further provided with a second protruding portion (123); the second protruding portion (123) is arranged corresponding to a position of the second recess (1422a), and the second protruding portion (123) extends into the second recess (1422a).

12. The electronic device of claim 11, wherein, further comprising a battery assembly (130), the battery assembly (130) is located on the same side of the chip (141) as the heat dissipation assembly (120), and a side of the heat dissipation assembly (120) facing the battery assembly (130) is provided with a third recess (124) recessed away from the battery assembly (130).

13. The electronic device according to claim 11 or 12, wherein the top plate (1422) is provided with an opening (1422b), and the second protruding portion (123) is arranged above the chip (141) through the opening (1422b); a thermally conductive material (170) is further arranged in contact between the second protruding portion (123) and the chip (141); an electrically conductive material (180) is arranged in contact between the first protruding portion (121) and the top plate (1422); the electrically conductive material (180) comprises any one of electrically conductive glue, electrically conductive cloth, copper, aluminum or graphite.

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