Liquid cooling heat dissipation module and test equipment

Abstract

The utility model discloses a liquid cooling heat radiation module and a test device, comprising a support member, a pressing power member, a connecting plate, a floating plate and a radiator, the pressing power member is installed on the support member, the connecting plate is installed below the support member and is connected with the pressing power member, the floating plate is movably connected with the connecting plate, and the radiator is connected with the floating plate. A buffer elastic part is connected between the floating plate and the connecting plate, a first water inlet channel and a first water outlet channel are formed in the floating plate, the first water inlet channel communicates with a first water inlet and a first water outlet, and the first water outlet channel communicates with a second water inlet and a second water outlet; the radiator is hermetically mounted at the bottom of the floating plate and covers the first water outlet and the second water inlet, and a water cooling cavity is formed between the radiator and the floating plate. According to the utility model, the heat dissipation efficiency of the target workpiece can be improved during testing.

Description

Technical Field

[0001] This utility model relates to the field of automated testing technology, and in particular to a liquid cooling heat dissipation module and testing equipment. Background Technology

[0002] With the rapid development of artificial intelligence and high-performance computing, the market demand for GPUs, as the most mature general-purpose AI chips, has surged. Advances in semiconductor manufacturing processes have led to an increase in TDP (Thermal Design Power), resulting in increasingly higher heat flux density in chips. In the field of server motherboard testing, the maximum heat dissipation of conventional GPU and CPU chips is still around 500W. For kilowatt-level chip testing, the air cooling and conventional water cooling radiators in functional test fixtures are no longer sufficient to meet the requirements. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a liquid-cooled heat dissipation module and testing equipment, which can improve the heat dissipation efficiency of the target workpiece during testing.

[0004] On one hand, this utility model embodiment provides a liquid cooling heat dissipation module, including:

[0005] Support components;

[0006] A downward pressing power component is installed on the support component;

[0007] A connecting plate is installed below the support member and connected to the pressing power member;

[0008] A floating plate is movably connected to the connecting plate, and a buffer elastic element is connected between the floating plate and the connecting plate. The floating plate is provided with a first water inlet channel and a first water outlet channel. The first water inlet channel is connected to a first water inlet and a first water outlet, and the first water outlet channel is connected to a second water inlet and a second water outlet.

[0009] A radiator is sealed and installed at the bottom of the floating plate and covers the first water outlet and the second water inlet, forming a water-cooling cavity between the radiator and the floating plate.

[0010] According to some embodiments of the present invention, the floating plate includes a first flow channel plate and a second flow channel plate. The first water inlet channel and the first water outlet channel are both disposed in the first flow channel plate. The second flow channel plate is installed at the bottom of the first flow channel plate, and the second flow channel plate is provided with a first water inlet through hole and a first water outlet through hole. The first water inlet through hole is respectively connected to the first water outlet and the water cooling cavity. The first water outlet through hole is connected to the water cooling cavity. The first water outlet through hole is also connected to a water collection tank, and the water collection tank is connected to the second water inlet.

[0011] According to some embodiments of the present invention, the water collection tank and the water cooling cavity are respectively arranged on opposite sides of the second flow channel plate and are connected through the first water outlet hole.

[0012] According to some embodiments of this utility model, the first water outlet hole is an elongated through hole.

[0013] According to some embodiments of the present invention, there are two first water outlet holes, and the two first water outlet holes are distributed on opposite sides of the same surface of the second flow channel plate.

[0014] According to some embodiments of this utility model, the water collection tank is triangular in shape.

[0015] According to some embodiments of this utility model, there are two water collection tanks, and the two water collection tanks are symmetrically distributed relative to the second water inlet.

[0016] According to some embodiments of the present invention, the radiator includes a heat sink plate and heat sink fins connected to the surface of the heat sink plate, wherein the length direction of the heat sink fins is perpendicular to the length direction of the first water outlet hole.

[0017] According to some embodiments of the present invention, the radiator includes a heat sink and heat dissipation fins connected to the surface of the heat sink, the heat dissipation fins being located inside the water-cooling cavity.

[0018] According to some embodiments of the present invention, a pressure sensor is connected between the connecting plate and the support member.

[0019] On the other hand, this utility model provides a testing device, including the above-mentioned liquid cooling heat dissipation module.

[0020] The embodiments of this utility model have at least the following beneficial effects:

[0021] The downward pressure component can use a floating plate to make the radiator fit tightly against the target workpiece, reducing the gap between the radiator and the target workpiece and improving heat dissipation efficiency. The buffer elastic component between the floating plate and the connecting plate can ensure that the radiator fits tightly against the target workpiece and avoid damage to the target workpiece due to excessive pressure. A water-cooling cavity is formed between the radiator and the floating plate, which can remove the heat from the radiator in time, which is conducive to improving heat dissipation efficiency.

[0022] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a schematic diagram of the liquid cooling heat dissipation module according to an embodiment of the present invention;

[0025] Figure 2 for Figure 1 The diagram shows an exploded view of the floating plate and heat sink of the liquid cooling module.

[0026] Figure 3 This is a perspective structural view of the first flow channel plate according to an embodiment of the present utility model;

[0027] Figure 4 This is a schematic diagram of the structure of the second flow channel plate according to an embodiment of the present utility model;

[0028] Figure 5 This is a partial structural diagram of the heat sink according to an embodiment of the present invention.

[0029] Figure label:

[0030] Support component 100, pressing power component 200, connecting plate 300, buffer elastic component 310, floating plate 400, first flow channel plate 410, first water inlet channel 411, first water outlet channel 412, first water inlet 413, first water outlet 414, second water inlet 415, second water outlet 416, second flow channel plate 420, water cooling cavity 421, first water inlet through hole 422, first water outlet through hole 423, water collection tank 424, radiator 500, heat dissipation plate 510, heat dissipation fins 520, pressure sensor 600. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first," "second," etc., are used in the description, they are only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the sequential relationship of the indicated technical features.

[0034] In the description of this utility model, unless otherwise explicitly defined, the terms "setting", "installation", "connection", etc. should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in combination with the specific content of the technical solution.

[0035] This embodiment discloses a testing device, including a liquid-cooled heat dissipation module. Please refer to... Figure 1 The liquid cooling module includes a support 100, a pressing power component 200, a connecting plate 300, a floating plate 400, and a heat sink 500. The pressing power component 200 is mounted on the support 100 and uses a stepper motor. The connecting plate 300 is mounted below the support 100 and connected to the pressing power component 200. The floating plate 400 is movably connected to the connecting plate 300, and a buffer elastic component 310, such as a spring, connects the floating plate 400 and the connecting plate 300. Please refer to [reference needed]. Figure 2 and Figure 3 The floating plate 400 is provided with a first water inlet channel 411 and a first water outlet channel 412. The first water inlet channel 411 is connected to a first water inlet 413 and a first water outlet 414. The first water outlet channel 412 is connected to a second water inlet 415 and a second water outlet 416. The radiator 500 is sealed and installed at the bottom of the floating plate 400 and covers the first water outlet 414 and the second water inlet 415. A water cooling cavity 421 is formed between the radiator 500 and the floating plate 400.

[0036] During use, the pressing power component 200 drives the connecting plate 300 and the floating plate 400 to press down. When the pressure reaches a certain height, the buffer elastic component 310 between the floating plate 400 and the connecting plate 300 is compressed to provide continuous pressure to the floating plate 400, thereby ensuring good contact between the radiator 500 and the target workpiece, reducing the gap between the radiator 500 and the target workpiece, and improving heat dissipation efficiency. The first inlet 413 and the second outlet 416 are respectively connected to the external liquid cooling system. The coolant enters the first inlet channel 411 from the first inlet 413 and enters the water cooling chamber 421 through the first outlet 414 to dissipate heat from the radiator 500. Then, it enters the first outlet channel 412 from the second inlet 415 and returns to the liquid cooling system through the second outlet 416.

[0037] Thus, the downward pressing power component 200 can make the radiator 500 fit tightly against the target workpiece through the floating plate 400, reducing the gap between the radiator 500 and the target workpiece and improving heat dissipation efficiency. The buffer elastic component 310 between the floating plate 400 and the connecting plate 300 can ensure that the radiator 500 fits tightly against the target workpiece and avoid damage to the target workpiece due to excessive pressure. A water-cooling cavity 421 is formed between the radiator 500 and the floating plate 400, which can remove the heat of the radiator 500 in time, which is conducive to improving heat dissipation efficiency.

[0038] Please refer to Figure 2 , Figure 3 and Figure 4 The floating plate 400 includes a first flow channel plate 410 and a second flow channel plate 420. A first water inlet channel 411 and a first water outlet channel 412 are both disposed in the first flow channel plate 410. A first water inlet 413 and a second water outlet 416 are disposed on the side wall of the first flow channel plate 410. A first water outlet 414 and a second water inlet 415 are disposed at the bottom of the first flow channel plate 410. The second flow channel plate 420 is installed at the bottom of the first flow channel plate 410 and is provided with a first water inlet through hole 422 and a first water outlet through hole 423. The first water inlet through hole 422 is connected to the first water outlet 414 and the water cooling cavity 421 respectively. The first water outlet through hole 423 is connected to the water cooling cavity 421. The first water outlet through hole 423 is also connected to a water collection tank 424, which is connected to the second water inlet 415. Coolant enters the water-cooling chamber 421 from the first outlet 414 through the first inlet hole 422 to dissipate heat from the radiator 500 in the water-cooling chamber 421, and enters the water collection tank 424 from the first outlet hole 423, and is discharged from the second inlet 415. The water collection tank 424 is used to collect the cooled coolant and converge it to the second inlet 415.

[0039] Please refer to Figure 2 and Figure 4 The water collection tank 424 and the water cooling cavity 421 are respectively arranged on opposite sides of the second flow channel plate 420 and connected through the first water outlet hole 423. This allows the coolant before and after heat dissipation to be separated on the upper and lower sides by the second flow channel plate 420, increasing the distribution area of ​​the coolant in a limited space, accelerating the flow of heat, and improving heat dissipation efficiency.

[0040] Please refer to Figure 4The first water outlet hole 423 is an elongated through hole, with its length parallel to the length of the edge of the second flow channel plate 420. This allows coolant from multiple locations within the water-cooling cavity 421 to flow simultaneously through the first water outlet hole 423, accelerating heat flow and improving heat dissipation efficiency. There are two first water outlet holes 423, distributed on opposite sides of the same surface of the second flow channel plate 420. Coolant can flow synchronously into the water collection tank 424 through these opposite first water outlet holes 423, further accelerating heat flow and improving heat dissipation efficiency.

[0041] Please continue to refer to Figure 4 The water collection tank 424 is triangular in shape, and its width gradually decreases from the first water outlet 423 towards the second water inlet 415. This allows the coolant to converge and discharge towards the second water inlet 415 under the guidance of the water collection tank 424, accelerating heat flow. There are two water collection tanks 424, symmetrically distributed relative to the second water inlet 415. The number of water collection tanks 424 is the same as the number of first water outlets 423. The coolant from the corresponding first water outlet 423 is collected through the corresponding water collection tank 424 and discharged from the second water inlet 415.

[0042] Please refer to Figure 5 The radiator 500 includes a heat sink 510 and heat sink fins 520 connected to the surface of the heat sink 510. The length direction of the heat sink fins 520 is perpendicular to the length direction of the first water outlet hole 423. Multiple heat sink fins 520 are present, and heat dissipation channels are formed between adjacent fins. Coolant carries away heat from the radiator 500 through these channels and flows towards the first water outlet holes 423 on both sides under the guidance of the heat sink fins 520, thus entering the water collection tank 424 through the first water outlet holes 423. It should be noted that the heat sink fins 520 are located within the water-cooling cavity 421, and the coolant cools the heat sink fins 520, improving heat dissipation efficiency.

[0043] Please refer to Figure 1 A pressure sensor 600 is connected between the connecting plate 300 and the support member 100 to detect the pressure of the radiator 500 pressing down, ensuring that the pressure of the radiator 500 on the target workpiece is within the preset range, avoiding damage to the target workpiece due to excessive pressure, and improving the reliability of the test. The structural design of the radiator 500 and water cooling can improve heat dissipation efficiency, ensure the reliable operation of the target workpiece, and thus ensure the reliability of the test.

[0044] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A liquid cooling heat dissipation module, characterized in that, include: Support component (100); A downward pressing power component (200) is installed on the support component (100); A connecting plate (300) is installed below the support member (100) and connected to the pressing power member (200); A floating plate (400) is movably connected to the connecting plate (300), and a buffer elastic element (310) is connected between the floating plate (400) and the connecting plate (300). The floating plate (400) is provided with a first water inlet channel (411) and a first water outlet channel (412). The first water inlet channel (411) is connected to a first water inlet (413) and a first water outlet (414). The first water outlet channel (412) is connected to a second water inlet (415) and a second water outlet (416). A radiator (500) is sealed and installed at the bottom of the floating plate (400) and covers the first water outlet (414) and the second water inlet (415), and a water-cooling cavity (421) is formed between the radiator (500) and the floating plate (400).

2. The liquid cooling heat dissipation module of claim 1, wherein, The floating plate (400) includes a first flow channel plate (410) and a second flow channel plate (420). The first water inlet channel (411) and the first water outlet channel (412) are both disposed in the first flow channel plate (410). The second flow channel plate (420) is installed at the bottom of the first flow channel plate (410). The second flow channel plate (420) is provided with a first water inlet hole (422) and a first water outlet hole (423). The first water inlet hole (422) is connected to the first water outlet (414) and the water cooling cavity (421). The first water outlet hole (423) is connected to the water cooling cavity (421). The first water outlet hole (423) is also connected to a water collection tank (424). The water collection tank (424) is connected to the second water inlet (415).

3. The liquid cooling heat dissipation module of claim 2, wherein, The water collection tank (424) and the water cooling chamber (421) are respectively arranged on opposite sides of the second flow channel plate (420) and are connected through the first water outlet hole (423).

4. The liquid cooling heat dissipation module according to claim 2 or 3, characterized in that, The first water outlet through hole (423) is a long strip-shaped through hole.

5. The liquid cooling heat dissipation module of claim 4, wherein, There are two first water outlet holes (423), and the two first water outlet holes (423) are distributed on opposite sides of the same surface of the second flow channel plate (420).

6. The liquid cooling heat dissipation module of claim 2, 3 or 5, wherein, The water collection tank (424) is triangular in shape.

7. The liquid cooling heat dissipation module of claim 4, wherein, The radiator (500) includes a heat sink (510) and heat sink fins (520) connected to the surface of the heat sink (510), wherein the length direction of the heat sink fins (520) is perpendicular to the length direction of the first water outlet hole (423).

8. The liquid cooling heat sink module of any of claims 1 to 3 or 5, wherein, The radiator (500) includes a heat sink (510) and heat sink fins (520) connected to the surface of the heat sink (510), the heat sink fins (520) being located inside the water cooling cavity (421).

9. The liquid-cooled heat sink module of any of claims 1-3, 5, or 7, wherein, A pressure sensor (600) is connected between the connecting plate (300) and the support member (100).

10. A test apparatus, characterized by, Includes the liquid cooling heat dissipation module as described in any one of claims 1 to 9.

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