Cleaning carrier capable of preventing tin beads from invading circuit integrated board

Abstract

The utility model relates to a cleaning carrier capable of preventing tin beads from invading a circuit integrated board, which comprises a base and a cover plate, the base is provided with a bottom plate cleaning port, and the periphery of the bottom plate cleaning port is provided with a limiting column group; a cover plate cleaning opening is formed in the cover plate, the cover plate cleaning opening is connected with the chip protection shell through connecting ribs, the four limiting column sets are evenly distributed on the periphery of the bottom plate cleaning opening, and each limiting column set is composed of a plurality of limiting columns. The device is simple in structure and easy to process and maintain; use is easy, operation is convenient, and efficiency is improved; the bottom of the flip chip is protected from being influenced by tin beads during cleaning, and the circuit packaging quality is improved.

Description

Technical Field

[0001] This utility model belongs to the field of circuit manufacturing technology and relates to a cleaning carrier that can prevent solder balls from entering the circuit integrated board. Background Technology

[0002] The packaging industry is developing rapidly, and the requirements for circuit integration are becoming increasingly stringent, leading to a continuous increase in the degree of circuit integration. Circuit boards include circuit boards, on which chips and electronic components are connected by solder. The chip-to-circuit connection surface has bumps, creating gaps between the chip and the circuit. During cleaning, solder beads from electronic components can easily enter these gaps, causing chip malfunctions. Summary of the Invention

[0003] The purpose of this invention is to provide a cleaning carrier that can prevent solder balls from entering the circuit integrated board, thereby solving the above-mentioned problems and improving the circuit packaging quality.

[0004] According to the technical solution provided by this utility model: a cleaning carrier that can prevent solder balls from entering the circuit integrated board includes a base and a cover plate. The base is provided with a bottom plate cleaning port, and a set of limiting posts are provided around the bottom plate cleaning port. The cover plate has a cover plate cleaning port, and the cover plate cleaning port is connected to the chip protective shell through a connecting rib.

[0005] As a further improvement of this utility model, there are four sets of limiting posts, which are evenly distributed around the cleaning port of the bottom plate.

[0006] As a further improvement of this utility model, each group of limiting posts consists of a number of limiting posts.

[0007] As a further improvement of this utility model, the area between the limiting posts is a snap-fit ​​area.

[0008] As a further improvement of this utility model, the chip protective shell has a cover-type structure.

[0009] As a further improvement of this utility model, the base has column holes.

[0010] As a further improvement of this utility model, the connecting rib is cylindrical.

[0011] As a further improvement of this utility model, the base is provided with an array of bottom plate cleaning ports, specifically in rows and columns; the cover plate is also provided with an array of cover plate cleaning ports in the same rows and columns.

[0012] As a further improvement of this utility model, the base, limiting post and cover plate are made of corrosion-resistant alloy material.

[0013] As a further improvement to this utility model, the base and cover plate are deburred.

[0014] The positive and progressive effects of this application are as follows:

[0015] This invention has a simple structure, is easy to process and maintain; it is simple to use, easy to operate, and improves efficiency; it protects the bottom of the flip chip from solder balls during cleaning, thus improving the quality of circuit packaging. Attached Figure Description

[0016] Figure 1 This is a front view of the base of this utility model.

[0017] Figure 2 This is a side view of the base of this utility model.

[0018] Figure 3 This is a front view of the cover plate of this utility model.

[0019] Figure 4 This is a schematic diagram of the structure of this utility model during operation. Detailed Implementation

[0020] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this utility model described herein. Furthermore, terms such as "comprising" and "having" mean that in addition to those already listed in "comprising" and "having," other unlisted contents may also be included; for example, a process, method, system, product, or device may include a series of steps or units, not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices.

[0023] Due to the angle of the drawing, some parts may not be drawn, but their positions and connections can be understood from the text descriptions.

[0024] like Figures 1-3As shown, this utility model is a cleaning carrier that can prevent solder balls from entering the circuit integrated board. It includes a base 1 and a cover plate 2. The base 1 is provided with a bottom plate cleaning port 11, and a set of limiting posts are provided around the bottom plate cleaning port 11. The cover plate 2 has a cover plate cleaning port 22, and the cover plate cleaning port 22 is connected to the chip protective shell 21 through a connecting rib 23.

[0025] There are four sets of limit posts, which are evenly distributed around the bottom plate cleaning port 11. Each set of limit posts consists of two limit posts 13. The limit posts 13 are in a snap-fit ​​area.

[0026] The chip protective shell 21 has a cover-type structure that can cover the chip 4.

[0027] The base 1 has a column hole 12 for installing the limit column 13.

[0028] The connecting rib 23 is cylindrical, which allows for easier access to the snap-fit ​​area.

[0029] The base 1 is provided with a bottom plate cleaning port 11 arranged in 3 rows and 3 columns; correspondingly, the cover plate 2 is also provided with a cover plate cleaning port 22 arranged in 3 rows and 3 columns; this can maximize the utilization rate of the base 1 and the cover plate 2.

[0030] The base 1, the limiting post 13, and the cover plate 2 are made of corrosion-resistant alloy materials and are treated with anti-oxidation to avoid oxidation and corrosion from high-temperature alkaline cleaning solution during the cleaning process; and the base 1 and the cover plate 2 are deburred and have a smooth surface to avoid scratching the circuit.

[0031] The working process of this utility model is as follows:

[0032] First, place the circuit board 3 in the bottom plate cleaning port 11. The four corners of the circuit board 3 are locked between the limiting posts 13 to form the locking area. Then, assemble the cover plate 2 with the base 1. Specifically, the connecting rib 23 is locked between the limiting posts 13 to form the locking area. The chip protective shell 21 covers the chip 4. The gap between the bottom of the chip protective shell 21 and the base 1 is smaller than the size of the solder ball 6.

[0033] During cleaning, the carrier and circuit board are placed in the equipment. The electronic components 5 on the circuit board 3 are exposed at the cleaning port 22 of the cover plate. They are cleaned in the equipment. Solder beads 6 flow away from the cleaning port 22 of the cover plate. The chip protective shell 21 covers the flip chip 4, protecting the bottom of the flip chip from being invaded by solder beads 6.

[0034] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A cleaning carrier for preventing solder balls from entering a circuit integrated board, characterized in that, It comprises a base (1) and a cover plate (2), the base (1) is provided with a bottom plate cleaning port (11), the bottom plate cleaning port (11) is provided with a limiting column group around; the cover plate (2) is provided with a cover plate cleaning port (22), the cover plate cleaning port (22) is connected with a chip protection shell (21) through a connecting rib (23).

2. The cleaning carrier capable of preventing tin beads from invading a circuit integrated board according to claim 1, wherein The limiting column group has four groups, and is distributed around the bottom plate cleaning port (11).

3. The cleaning carrier capable of preventing tin beads from invading a circuit integrated board according to claim 2, wherein Each limiting column group is composed of two limiting columns (13).

4. The cleaning carrier capable of preventing tin beads from invading a circuit integrated board according to claim 3, wherein The limiting columns (13) are connected through a clamping area.

5. The cleaning carrier capable of preventing tin beads from invading a circuit integrated board according to claim 1, wherein The chip protection shell (21) is a cover type structure.

6. The cleaning carrier capable of preventing tin whiskers from invading a circuit integrated board according to claim 1, wherein The base (1) is provided with a column hole (12).

7. The cleaning carrier capable of preventing tin whiskers from invading a circuit integrated board according to claim 1, wherein The connecting rib (23) is a cylindrical shape.

8. The cleaning carrier capable of preventing tin whiskers from invading a circuit integrated board according to claim 1, wherein The base (1) is provided with the bottom plate cleaning port (11) in an array, specifically three rows and three columns; the cover plate (2) is also provided with the cover plate cleaning port (22) in an array, specifically three rows and three columns.

9. The cleaning carrier capable of preventing tin whiskers from invading a circuit integrated board according to Claim 1, wherein The base (1), the limiting column (13) and the cover plate (2) are made of corrosion-resistant alloy material.

10. The cleaning carrier capable of preventing tin whiskers from invading a circuit integrated board according to claim 1, wherein The base (1) and the cover plate (2) are deburred.

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