Wafer box and semiconductor manufacturing equipment

Abstract

The utility model provides a wafer box and semiconductor manufacturing equipment, relates to the technical field of semiconductors, and aims to reduce the manufacturing cost of semiconductors. The wafer box can be used for transferring wafers and comprises a box body, a cover plate, a sealing ring, a magnet and a supporting structure, the box body comprises a first surface and a first wafer containing groove, and the first wafer containing groove extends into the box body from the first surface. The cover plate covers the first surface. The sealing rings are arranged on the first surface, and at least one sealing ring surrounds the first sheet containing groove. Each pair of magnets comprises a first magnet and a second magnet, the first magnet is arranged in the box body, the second magnet is arranged in the cover plate, and the orthographic projection of the second magnet and the orthographic projection of the first magnet are at least partially overlapped. The supporting structure is arranged in the first wafer containing groove, the supporting structure is used for supporting the wafer, when the wafer is placed or taken out, the surface, making contact with the wafer, of the supporting structure is higher than the first surface, and the surface of the wafer does not make contact with the surface of the cover plate when the wafer box contains the wafer and is in a closed state.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a wafer cassette and semiconductor manufacturing equipment. Background Technology

[0002] Semiconductor manufacturing, including wafer transfer, is carried out in clean rooms (CR) to ensure product quality and performance. Typically, to meet the demands of high-density semiconductor devices, it is necessary to minimize airborne particles. This requires high-efficiency particulate air (HEPA) filters in clean rooms for particle management, resulting in higher operating costs and increasing the overall cost of semiconductor manufacturing. Utility Model Content

[0003] This application proposes a wafer cassette and semiconductor manufacturing equipment, aiming to reduce the cost of semiconductor manufacturing.

[0004] To achieve the above objectives, embodiments of this application provide the following technical solutions:

[0005] On one hand, a wafer cassette is provided, comprising a cassette body, a cover plate, at least one sealing ring, at least one pair of magnets, and a support structure. The cassette body includes a first surface and a first wafer slot, the first wafer slot extending from the first surface into the cassette body for receiving a wafer. The cover plate covers the first surface. The sealing ring is disposed on the first surface, the at least one sealing ring surrounding the first wafer slot. Each pair of magnets includes a first magnet and a second magnet, the first magnet being disposed in the cassette body and the second magnet being disposed in the cover plate, the orthographic projection of the second magnet on the first surface at least partially overlapping the orthographic projection of the first magnet on the first surface. The support structure is disposed within the first wafer slot, the support structure for supporting the wafer, wherein when the wafer is placed or removed, the surface of the support structure in contact with the wafer is higher than the first surface, and when the wafer cassette contains the wafer and is in a closed state, the surface of the wafer does not contact the surface of the cover plate.

[0006] In the above embodiments of this application, the first wafer slot of the housing is used to accommodate the wafer. A cover plate covers the housing, and a second magnet in the cover plate and a first magnet in the housing generate an attractive force, attracting the cover plate and the housing together to achieve a seal for the first wafer slot. When the wafer cassette contains the wafer and is in a closed state, the surface of the wafer does not contact the surface of the cover plate, preventing contamination or scratches on the wafer surface. Furthermore, a sealing ring is provided between the cover plate and the housing, surrounding the outside of the first wafer slot, which further improves the sealing effect of the first wafer slot, maintaining a dust-free or vacuum state within the first wafer slot during wafer transfer.

[0007] Using the aforementioned wafer cassette for wafer transfer eliminates the need for high-level HEPA filters in cleanrooms, even if the transfer is performed outside of a cleanroom. This reduces or eliminates the need for cleanroom operating costs.

[0008] Furthermore, by providing a support structure at the bottom of the first wafer chute, the support structure is raised above the first surface to support the wafer outside the first wafer chute, so as to facilitate the placement or removal of the wafer by a robotic arm.

[0009] In some embodiments, the support structure is a first lifting support structure. During the placement or removal of the wafer, the top surface of the first lifting support structure can contact the wafer to drive the wafer to move upward or downward.

[0010] In some embodiments, a first groove is provided at the bottom of the first diaphragm slot, and a portion of the first lifting support structure is located within the first groove, and can rise or fall within the first groove.

[0011] In some embodiments, the support structure is a first fixed support structure, which is fixedly connected to the bottom of the first wafer chute, and the surface of the first fixed support structure that contacts the wafer is higher than the first surface.

[0012] The area of ​​the cover plate opposite to the first wafer slot has a second wafer slot, and when the wafer cassette is closed, the distance between the bottom surface of the first wafer slot and the bottom surface of the second wafer slot is greater than the sum of the height of the fixed support structure and the thickness of the wafer.

[0013] In some embodiments, the support structure includes a second fixed support structure and a second lifting support structure. The second fixed support structure is fixedly connected to the bottom of the first wafer chute. During the placement or removal of the wafer, the top surface of the second lifting support structure can contact the wafer to drive the wafer to move upward or downward.

[0014] In some embodiments, when the wafer cassette is closed, the top surface of the second fixed support structure is in contact with the wafer. During the placement or removal of the wafer, after the second lifting support structure drives the wafer to rise, the top surface of the second fixed support structure is no longer in contact with the wafer.

[0015] In some embodiments, the support structure is a first lifting support structure, or the support structure includes a second fixed support structure and a second lifting support structure.

[0016] The first lifting support structure is a mechanical lifting structure, or the first lifting support structure includes a third magnet, which is configured to move upward or downward under the action of an external magnetic field to drive the wafer to move upward or downward.

[0017] The second lifting support structure is a mechanical lifting structure, or the second lifting support structure includes a fourth magnet, which is configured to move upward or downward under the action of an external magnetic field to drive the wafer to move upward or downward.

[0018] In some embodiments, the first lifting support structure includes at least three third magnets, the shape of which is a dot-like projection onto the first surface. Along a direction parallel to the first surface, the lines connecting the at least three third magnets form a planar stable support pattern to stably support the wafer.

[0019] The second lifting support structure includes at least three fourth magnets, the shape of which is a dot-like projection onto the first surface. Along a direction parallel to the first surface, the lines connecting the at least three fourth magnets form a planar stable support pattern to stably support the wafer.

[0020] In some embodiments, the wafer cassette further includes an anti-slip layer disposed on the surface of the support structure in contact with the wafer.

[0021] In some embodiments, the wafer cassette further includes a vacuum coupler connected to a first wafer slot in the cassette.

[0022] In some embodiments, the outer edge of the cover plate is provided with a lug, which extends beyond the outer edge of the first surface in a direction parallel to the first surface.

[0023] In some embodiments, the cover plate includes a second surface near the housing and a second tumbler groove disposed on the second surface, the second tumbler groove extending from the second surface into the cover plate. The outer boundary of the orthographic projection of the second tumbler groove onto the first surface coincides with the edge of the first tumbler groove.

[0024] In some embodiments, the wafer size accommodated by the first wafer bay is greater than 0.5 inches.

[0025] On the other hand, a semiconductor manufacturing apparatus is provided, which includes a wafer cassette as described in any of the above embodiments, wherein a vacuum pump is connected to a first wafer slot of the wafer cassette.

[0026] In some embodiments, the semiconductor manufacturing equipment further includes a separation device comprising a first robotic arm and a fifth magnet. The first robotic arm is used to grasp the lugs of a cover plate. The fifth magnet is disposed on the side of the housing away from the cover plate and is used to eliminate the magnetic force between the first magnet and the second magnet, thereby separating the cover plate from the housing.

[0027] In some embodiments, the semiconductor manufacturing equipment further includes a lifting drive device. When the support structure includes a lifting support structure, the support structure is configured to move upward or downward under the drive of the lifting drive device to drive the wafer to move upward or downward.

[0028] The semiconductor manufacturing equipment described above has the same structure and beneficial technical effects as the wafer cassette provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not actual dimensions of the products or actual processes of the methods involved in the embodiments of this application.

[0030] Figure 1 A structural diagram of a wafer cassette provided in an embodiment of this application;

[0031] Figure 2 This is a structural diagram of another wafer cassette provided in an embodiment of this application;

[0032] Figure 3 for Figure 2 A top view of the wafer box;

[0033] Figure 4 for Figure 3 A sectional view of the box along section line AA';

[0034] Figure 5 This is a top view of the wafer-holding container provided in an embodiment of this application;

[0035] Figure 6 for Figure 5 A sectional view of the box along section line BB';

[0036] Figure 7 A top view of the cover plate of the wafer cassette provided in an embodiment of this application;

[0037] Figure 8 for Figure 7 A sectional view of the cover plate along section line CC';

[0038] Figure 9 This is a structural diagram of another wafer cassette provided in an embodiment of this application;

[0039] Figure 10 for Figure 9 A top view of the wafer box;

[0040] Figure 11 A structural diagram of another wafer cassette provided in an embodiment of this application;

[0041] Figure 12 for Figure 11 A top view of the wafer box;

[0042] Figure 13 for Figure 12 A sectional view of the box along section line DD';

[0043] Figure 14 This is a top view of the wafer-holding container provided in an embodiment of this application;

[0044] Figure 15 for Figure 14 A sectional view of the box along section line EE';

[0045] Figure 16 A structural diagram of a semiconductor manufacturing apparatus provided in an embodiment of this application;

[0046] Figure 17 Another structural diagram of the semiconductor manufacturing equipment provided in the embodiments of this application;

[0047] Figure 18 This is another structural diagram of a semiconductor manufacturing apparatus provided in an embodiment of this application. Detailed Implementation

[0048] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0049] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and encompassing, that is, "including, but not limited to".

[0050] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0051] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. For example, in describing some embodiments, the term "connection" may be used to indicate that two or more components have direct physical or electrical contact with each other.

[0052] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0053] Typically, semiconductor manufacturing processes include early-stage design, front-end processing, and back-end processing, as detailed in Table 1 below:

[0054] Preliminary design Front-end process Post-process Circuit and pattern design Wafer surface oxidation wafer dicing Prepare the mask. Thin film formation Lead wire connection Photoresist coating Molding Exposure and Development Final inspection Etching thin films for patterning Photoresist stripping Wash Ion implantation Surface planarization Electrode formation Wafer Inspection

[0055] Table 1

[0056] As can be seen, the front-end process of wafer fabrication includes a variety of steps, and different steps require different process equipment. Wafers need to be transferred between different types of process equipment. The transfer of wafers needs to be carried out in a clean room (CR) to ensure that the wafers are not contaminated.

[0057] As semiconductor devices become increasingly dense, the wiring width on wafers is becoming finer, and the size of environmental impurity particles that can cause wiring defects is also getting smaller. In order to remove these small environmental impurities, high-efficiency particulate air (HEPA) filters with high levels need to be installed in cleanrooms to manage the air particles, which leads to higher operating costs for cleanrooms.

[0058] To address the aforementioned problems, embodiments of this application provide a wafer cassette. Figure 1 A structural diagram of a wafer cassette provided in an embodiment of this application; Figure 2 This is a structural diagram of another wafer cassette provided in an embodiment of this application.

[0059] See Figure 1 and Figure 2 The wafer box 1 includes a box body 2, a cover plate 3, at least one sealing ring 4, at least one pair of magnets 5, and a support structure 6.

[0060] Figure 3 for Figure 2 A top view of the wafer box; Figure 4 for Figure 3 A sectional view of the box along section line AA'; Figure 5 This is a top view of the wafer-holding container provided in an embodiment of this application; Figure 6 for Figure 5 The box in the middle is a cross-sectional view along section line BB'.

[0061] See Figure 3 and Figure 4 The housing 2 includes a first surface P1 and a first wafer slot 9. The first wafer slot 9 extends from the first surface P1 into the housing 2. The surface of the first wafer slot 9 is not part of the first surface P1. The first wafer slot 9 is used to accommodate wafers. See also Figure 2 , Figure 5 and Figure 6 The first wafer slot 9 contains a wafer 10. For example, the size of the first wafer slot 9 along the plane XY is larger than the size of the wafer 10 so that the wafer 10 can be placed in the first wafer slot 9.

[0062] For example, in the wafer cassette 1, the wafer 10 contained in the first wafer slot 9 can be a large-size wafer or a small-size wafer. The wafer cassette of this embodiment is not limited in the size of the wafers it contains; for example, it is applicable to wafers with a size of 0.5 inches or larger. Based on Moore's Law and predictions of semiconductor development trends, the process yield of large-size wafers is approximately 65% ​​to 75%, while the process yield of small-size wafers is approximately 80% to 90%. In order to adapt to semiconductor manufacturing equipment and production lines of different sizes, the size, external shape, and diameter of the first wafer slot of this embodiment can be adaptively adjusted.

[0063] In today's diverse semiconductor device landscape, wafer sizes vary widely, resulting in inconsistent sizes, structures, and systems for semiconductor devices. Producing different sizes and types of semiconductor devices necessitates different equipment and production lines, leading to high costs for small-batch wafer production. The wafer cassette in this embodiment can accommodate wafers of various sizes. For example, if the diameter of the first wafer slot in the cassette is 4 inches or larger, it can be used to transfer all wafers of 4 inches and smaller. Therefore, the wafer cassette in this embodiment is compatible with various semiconductor manufacturing equipment, reducing the cost of producing small batches of diverse wafers.

[0064] Furthermore, by using the wafer cassette 1 of this application to transfer wafers with high semiconductor device density, it is possible to avoid the wafers coming into contact with small particulate impurities in the air during the transfer process. This can reduce the use of high-level high-efficiency particulate air filters, lower the cost of cleanrooms, and even eliminate the need for transfer in a cleanroom.

[0065] See Figure 3 and Figure 4 A sealing ring 4 is disposed on the first surface P1 of the housing 2, and the sealing ring 4 surrounds the first wafer groove 9. Exemplarily, the wafer housing 1 includes a plurality of sealing rings 4, which are sequentially arranged around the outer side of the first wafer groove 9. Figure 3 and Figure 4 The illustration shows a wafer cassette 1 with two sealing rings 4, but it can also have one or three sealing rings, etc., and this application does not limit this.

[0066] For example, a portion of the sealing ring 4 is disposed within the first surface P1. For instance, a recessed first annular groove is provided on the first surface P1, the lower half of the sealing ring 4 is installed in the first annular groove, and the upper half of the sealing ring 4 protrudes above the first surface P1, thereby enabling the sealing ring 4 to be installed in a limited position.

[0067] See Figure 2 The cover plate 3 covers the first surface P1 of the housing 2. The cover plate 3 includes a second surface P2 near the side of the housing 2. The second surface P2 of the cover plate 3 is used to seal the first wafer slot 9 to maintain the vacuum state inside the first wafer slot 9 and ensure the cleanliness of the first wafer slot 9. Furthermore, when the wafer cassette 1 contains the wafer 10 and is in a closed state, that is, when the cover plate 3 covers the housing 2, the surface of the wafer 10 does not contact the surface of the cover plate 3, which can prevent the surface of the wafer 10 from being contaminated or scratched.

[0068] Figure 7 A top view of the cover plate of the wafer cassette provided in an embodiment of this application; Figure 8 for Figure 7 The cover plate is shown in a sectional view along section line CC'.

[0069] For example, see Figure 2 , Figure 7 and Figure 8 A recessed second annular groove 11 is provided on the second surface P2 of the cover plate 3, and in the Z direction, the second annular groove 11 is directly opposite to the first annular groove. The upper part of the sealing ring 4 can be installed in the second annular groove 11.

[0070] For example, see Figure 2 , Figure 7 and Figure 8 In other embodiments, the outer edge E1 of the cover plate 3 is provided with a lug 14. Along the direction U parallel to the first surface P1, the lug 14 extends beyond the outer edge E2 of the first surface P1. The lug 14 is used to separate the cover plate 3 from the box body 2. This separation process requires the use of a corresponding separation device, which will be described later with reference to the structural diagram of the separation device.

[0071] See Figure 2 Each pair of magnets 5 includes a first magnet 51 and a second magnet 52. The first magnet 51 is disposed in the housing 2, and the second magnet 52 is disposed in the cover plate 3. The orthographic projection of the second magnet 52 on the first surface P1 overlaps at least partially with the orthographic projection of the first magnet 51 on the first surface P1. That is, in the Z direction, the second magnet 52 and the first magnet 51 are at least partially opposite to each other, so that an attraction is generated between the first magnet 51 and the second magnet 52, thereby attracting the cover plate 3 and the housing 2 together to achieve the sealing of the wafer housing 1.

[0072] It is understood that the wafer cell 1 may include a pair of magnets 5, or it may include multiple pairs of magnets 5, see [reference]. Figure 3 When the wafer box 1 includes multiple pairs of magnets 5, the multiple pairs of magnets 5 can be arranged at intervals along the circumference of the first wafer slot 9, which can ensure that the adsorption force between the cover plate 3 and the box body 2 meets the sealing requirements.

[0073] For example, when the wafer cassette 1 includes two sealing rings 4, the orthographic projection of the first magnet 51 on the first surface P1 is located between the two sealing rings 4, and the orthographic projection of the second magnet 52 on the first surface P1 is located between the two sealing rings 4. When there are multiple pairs of magnets 5, multiple sealing rings 4 can be provided, with the orthographic projection of the magnet 5 on the first surface P1 located between two sealing rings 4, to further improve the sealing performance.

[0074] For example, the first magnet 51 can be completely embedded in the housing 2, that is, the first surface P1 of the housing 2 does not expose the first magnet 51. Alternatively, the first surface P1 of the housing 2 can also expose the first magnet 51.

[0075] For example, the second magnet 52 can be completely embedded in the cover plate 3, that is, the second surface P2 of the cover plate 3 does not expose the second magnet 52. Alternatively, the second surface P2 of the cover plate 3 can also expose the second magnet 52.

[0076] For example, see Figure 2 , Figure 7 and Figure 8 The cover plate 3 also includes a second wafer accommodating groove 13 disposed on the second surface P2. The second wafer accommodating groove 13 extends from the second surface P2 into the cover plate 3, and the surface of the second wafer accommodating groove 13 does not belong to the second surface P2. In the Z direction, the second wafer accommodating groove 13 is opposite to the first wafer accommodating groove 9, that is, the second wafer accommodating groove 13 and the first wafer accommodating groove 9 are directly opposite each other to form a cavity for accommodating the wafer 10. For example, the outer boundary of the orthographic projection of the second wafer accommodating groove 13 on the first surface P1 coincides with the edge of the first wafer accommodating groove 9.

[0077] See Figure 6 The support structure 6 is located at the bottom of the first wafer slot 9. The support structure 6 is used to support the wafer 10. The support structure 6 can be fixedly connected to the housing 2 or movably connected to the housing 2. The support structure 6 can also have three structures: one is fixedly connected to the housing 2, another is movably connected to the housing 2, and the third is a structure that has both a fixed connection to the housing 2 and a movably connected structure to the housing 2. Figure 6 The image shows a structural example of the movable connection between the support structure 6 and the box 2. Figure 9 This shows a structural example of the fixed connection between the support structure 6 and the box 2. Figure 11 Examples of support structures 6, including structures fixedly connected to the housing 2 and structures movably connected to the housing 2, are shown. In the following embodiments, different support structures are illustrated by example.

[0078] When placing or removing wafer 10, the surface of support structure 6 that contacts wafer 10 is higher than the first surface P1, so that the lower surface of wafer 10 is higher than the height of the first surface P1. Wafer 10 is located outside the first wafer slot 9 of housing 2, so that the robotic arm can place wafer 10 on support structure 6, or facilitate the robotic arm to reach under wafer 10 to remove it.

[0079] The wafer cassette 1 provided in the embodiments of this application has a first wafer slot 9 in the cassette body 2 for accommodating a wafer 10. A cover plate 3 covers the cassette body 2, and a second magnet 52 in the cover plate 3 and a first magnet 51 in the cassette body 2 generate an attraction force, attracting the cover plate 3 and the cassette body 2 together to achieve a seal for the first wafer slot 9. When the wafer cassette 1 contains the wafer 10 and is in a closed state, the surface of the wafer 10 does not contact the surface of the cover plate 3, which can prevent the surface of the wafer 10 from being contaminated or scratched. Furthermore, a sealing ring 4 is provided between the cover plate 3 and the cassette body 2, surrounding the outside of the first wafer slot 9, which can further improve the sealing effect of the first wafer slot 9 and maintain the cleanliness inside the first wafer slot 9.

[0080] For example, see Figure 3 and Figure 4 In other embodiments, the wafer cassette 1 further includes a vacuum coupler 8, which is connected to the first wafer slot 9 in the cassette 2. The vacuum coupler 8 can be connected to a vacuum pump, such as a vacuum pump, to evacuate the first wafer slot 9, further improving the vacuum level inside the wafer cassette and enhancing its sealing and cleanliness. It is understood that the vacuum pump can be a component structure mounted on the wafer cassette 1 or an external device independent of the wafer cassette 1.

[0081] Using the wafer cassette 1 described above to transfer the wafer 10, even if the transfer is carried out in a cleanroom, there is no need to install a high-level high-efficiency particulate air filter in the cleanroom, or the transfer process can be carried out outside the cleanroom, which can reduce or save the operating costs of the cleanroom.

[0082] Furthermore, by providing a support structure 6 at the bottom of the first wafer trough 9, the support structure 6 is higher than the first surface P1 to support the wafer 10 outside the first wafer trough 9, so as to facilitate the placement or removal of the wafer 10 by a robotic arm.

[0083] In addition, regarding the material selection of wafer cell 1, it can block light that affects the performance of photoresist. Preferably, the wafer cell can block light with wavelengths below 570nm. For example, wafer cell 1 can block g-lines (wavelength 436nm), h-lines (wavelength 405nm), and i-lines (wavelength 365nm). When photoresist is coated on the surface of wafer 10, g-lines, h-lines, and i-lines can be prevented from transmitting into wafer cell 1 and exposing the photoresist.

[0084] In some embodiments, combined with Figure 2 and Figure 6 The support structure 6 is a first lifting support structure 60. The top surface of the first lifting support structure 60 can contact the wafer 10 and provide movable support for the wafer 10.

[0085] During the placement of wafer 10, the first lifting support structure 60 is raised so that the top surface of the first lifting support structure 60 is higher than the first surface P1. The robotic arm places wafer 10 on the top surface of the first lifting support structure 60. Then, the first lifting support structure 60 drives wafer 10 to make a downward movement so as to place wafer 10 in the first wafer slot 9.

[0086] During the process of removing wafer 10, the first lifting support structure 60 drives wafer 10 to move upward. The first lifting support structure 60 drives the bottom surface of wafer 10 to be higher than the first surface P1, that is, wafer 10 is located outside the first wafer slot 9, which makes it convenient for the robotic arm to reach under wafer 10 and remove it.

[0087] It should be noted that when the support structure 6 is the first lifting support structure 60, the cover plate 3 may or may not have a second wafer slot 13, as long as the distance between the bottom surface of the first wafer slot 9 and the lower surface of the cover plate 3 is greater than the distance between the bottom surface of the first wafer slot 9 and the upper surface of the wafer 10 when the wafer box 1 is in the closed state. In other words, the upper surface of the wafer 10 does not contact the lower surface of the cover plate 3 when the wafer box 1 is in the closed state.

[0088] In some embodiments, see Figure 6 The bottom surface of the first receiving slot 9 may be provided with a first groove 16, which is adapted to the shape of the first lifting support structure 60. A portion of the first lifting support structure 60 is located within the first groove 16 and can rise or fall within the first groove 16. The first groove 16 not only realizes the positioning and installation of the first lifting support structure 60, but also enables the first lifting support structure 60 to rise or fall along the Z direction.

[0089] In other embodiments, the first lifting support structure 60 may also be directly fixed to the bottom surface of the first receiving slot 9.

[0090] In some embodiments, see Figure 6 The first lifting support structure 60 can be a mechanical lifting structure, which can use screw drive or worm gear drive to achieve lifting motion.

[0091] In other embodiments, the first lifting support structure 60 includes a third magnet configured to move upward or downward under the action of an external magnetic field to drive the wafer 10 to move upward or downward.

[0092] Understandably, utilizing the principle of repulsion between like magnets, by placing an external magnet below the third magnet, with the same polarity as the third magnet, the third magnet can be driven to rise, thereby driving the wafer 10 to rise. Similarly, utilizing the principle of repulsion between opposite magnets, by placing an external magnet below the third magnet, with the opposite polarity as the third magnet, the third magnet can be attracted to fall, thereby driving the wafer 10 to fall.

[0093] In some embodiments, see Figure 3 and Figure 4 The first lifting support structure 60 includes at least three third magnets, the shape of which is a dot-shaped projection on the first surface P1. Along a direction parallel to the first surface P1 (along the XY plane), the line connecting the at least three third magnets forms a planar stable support pattern to stably support the wafer 10.

[0094] It is understood that the aforementioned "planar stable support pattern" is formed by connecting at least three third magnets. That is, the planar stable support pattern can be a triangle formed by connecting three third magnets, a quadrilateral formed by connecting four third magnets, or a pentagon formed by connecting five third magnets, etc. The specific number of support points or third magnets provided in the first lifting support structure 60 can be determined according to the size of the first wafer accommodating slot. That is, for cases accommodating larger wafers, more support points or third magnets can be provided to ensure the stability of the wafer support.

[0095] Figure 3 The diagram shows the first lifting support structure 60 including three third magnets. The planar stable support pattern formed by the connection of the three third magnets is a triangle, which can provide stable support for the wafer 10.

[0096] In the above embodiments of this application, taking the first lifting support structure 60 as an example, the loading process of the wafer 10 includes: First, placing the wafer 10 on the top surface of the first lifting support structure 60, which then returns to its original position under gravity. Next, covering the box 2 with the cover plate 3, the first magnet 51 and the second magnet 52 attract each other, causing the cover plate 3 to adhere to the box 2. Finally, evacuating the first wafer slot 9 using a vacuum pump, bringing the first wafer slot 9 to a low vacuum state of approximately 10 Pa.

[0097] It should be noted that during the process of the first lifting support structure 60 resetting downward under the action of gravity, an upward force can be applied to the first lifting support structure 60, and this force should be less than the gravity acting on the first lifting support structure 60. This can reduce the acceleration of the first lifting support structure 60 moving downward and ensure that the first lifting support structure 60 descends smoothly.

[0098] For example, the first lifting support structure 60 is a magnet. An external magnetic field can be set below the box 2, and the polarity of the external magnetic field is the same as that of the first lifting support structure 60. It can exert an upward repulsive force on the first lifting support structure 60, and the repulsive force is less than the gravity of the first lifting support structure 60.

[0099] The process of removing wafer 10 includes: first, separating the cover plate 3 of wafer cassette 1 from the cassette 2; then, placing a magnet below the cassette 2, generating a repulsive force between the magnet and the first lifting support structure 60, which can drive the first lifting support structure 60 to move upward, thereby driving the wafer 10 to move upward and removing it while the wafer 10 is lifted.

[0100] Embodiments of this application also provide another wafer cassette. Figure 9 This is a structural diagram of another wafer cassette provided in an embodiment of this application.

[0101] See Figure 9 The wafer cassette 1 includes a support structure 6, which is a first fixed support structure 61. The top surface of the first fixed support structure 61 can contact the wafer 10, providing fixed support for the wafer 10. The first fixed support structure 61 is fixedly connected to the bottom of the first wafer hopper 9, and the surface of the first fixed support structure 61 that contacts the wafer 10 is higher than the first surface P1, so as to support the wafer 10 outside the first wafer hopper 9, so as to facilitate the placement or removal of the wafer 10 by a robotic arm.

[0102] Furthermore, when the support structure 6 is the first fixed support structure 61, the area of ​​the cover plate 3 opposite to the first wafer slot 9 has a second wafer slot 13. In the closed state, the distance between the bottom surface of the first wafer slot 9 and the bottom surface of the second wafer slot 13 is greater than the sum of the height of the fixed support structure 61 and the thickness of the wafer 10. That is, in the closed state, the upper surface of the wafer 10 does not contact the bottom surface of the second wafer slot 13, which can prevent the surface of the wafer 10 from being contaminated or scratched.

[0103] Figure 10 for Figure 9 A top view of the wafer box.

[0104] In some embodiments, see Figure 10 The first fixed support structure 61 may include at least three separate claw-shaped structures or support pillars. The shape of the orthographic projection of the top surface of the claw-shaped structure or support pillar onto the first surface P1 can be a polygon such as a triangle, quadrilateral, or pentagon. The multiple claw-shaped structures provide stable support for the wafer 10. Figure 10 The first fixed support structure 61 is shown to include four claw-shaped structures, the claw-shaped structures being triangular in shape, but this application does not limit this.

[0105] In the above embodiments of this application, the loading process of wafer 10 includes: first, placing wafer 10 on the top surface of the first fixed support structure 61; then, covering the housing 2 with a cover plate 3; and attracting the first magnet 51 and the second magnet 52 to attach the cover plate 3 to the housing 2. Finally, evacuating the first wafer slot 9 using a vacuum pump to bring the first wafer slot 9 to a low vacuum state of approximately 10 Pa.

[0106] The process of removing wafer 10 includes: first, separating the cover plate 3 of wafer cassette 1 from the cassette body 2, and then directly removing wafer 10.

[0107] Embodiments of this application also provide yet another wafer cassette. Figure 11 A structural diagram of another wafer cassette provided in an embodiment of this application; Figure 12 for Figure 11 A top view of the wafer box; Figure 13 for Figure 12 A sectional view of the box along section line DD'; Figure 14 This is a top view of the wafer-holding container provided in an embodiment of this application; Figure 15 for Figure 14 The box in the middle is a cross-sectional view along section line EE'.

[0108] In some embodiments, see Figures 11-15 The wafer cassette 1 includes a support structure 6, which includes a second fixed support structure 62 and a second lifting support structure 63. The second fixed support structure 62 is fixedly connected to the bottom of the first wafer slot 9, and the top surface of the second fixed support structure 62 can contact the wafer 10 to provide fixed support for the wafer 10.

[0109] During the placement or removal of wafer 10, the top surface of the second lifting support structure 63 can contact wafer 10, providing movable support for wafer 10 to drive wafer 10 to move up or down.

[0110] For example, during the placement of wafer 10, the second lifting support structure 63 is higher than the first surface P1. A robotic arm places wafer 10 on the top surface of the second lifting support structure 63, at which point wafer 10 is not in contact with the top surface of the second fixed support structure 62. Then, the second lifting support structure 63 drives wafer 10 to descend until wafer 10 contacts the top surface of the second fixed support structure 62, ensuring the stability of wafer support during transportation. Wafer 10 is placed in the first wafer tray 9, and then the cover plate 3 is placed over the housing 2 to seal the wafer cassette 1.

[0111] During the removal of wafer 10, in the initial state, wafer 10 is in contact with the top surface of the second fixed support structure 62. As the second lifting support structure 63 drives wafer 10 to move upward, wafer 10 disengages from the top surface of the second fixed support structure 62. The second lifting support structure 63 drives wafer 10 to rise above the first surface P1, and wafer 10 is located outside the first wafer slot 9, making it convenient for the robotic arm to reach under wafer 10 and remove it.

[0112] It should be noted that when the support structure 6 includes the second fixed support structure 62 and the second lifting support structure 63, the cover plate 3 may or may not have a second wafer slot 13. As long as the distance between the bottom surface of the first wafer slot 9 and the lower surface of the cover plate 3 is greater than the distance between the bottom surface of the first wafer slot 9 and the upper surface of the wafer 10 when the wafer cassette 1 is in the closed state, that is, the upper surface of the wafer 10 does not contact the lower surface of the cover plate 3 when the wafer cassette 1 is in the closed state, the surface of the wafer 10 can be prevented from being contaminated or scratched.

[0113] In some embodiments, see Figure 12 The second fixed support structure 62 may include at least three separate claw-shaped structures or support pillars. The shape of the orthographic projection of the claw-shaped structure or support pillar on the first surface P1 can be a polygon such as a triangle, quadrilateral, or pentagon. The multiple claw-shaped structures provide stable support for the wafer 10. Figure 12 The second fixed support structure 62 is shown to include four claw-shaped structures, the shape of which is triangular, but this application does not limit this.

[0114] In some embodiments, see Figure 14 and Figure 15 The bottom surface of the first receiving slot 9 may be provided with a second groove 7, which is adapted to the shape of the second lifting support structure 63. A portion of the second lifting support structure 63 is located within the second groove 7 and can rise or fall within the second groove 7. The second groove 7 not only realizes the positioning and installation of the second lifting support structure 63, but also enables the second lifting support structure 63 to rise or fall along the Z direction.

[0115] In other embodiments, the second lifting support structure 63 can also be directly fixed to the bottom surface of the first receiving slot 9.

[0116] In some embodiments, see Figure 14 and Figure 15 The second lifting support structure 63 can be a mechanical lifting structure, which can use screw drive or worm gear drive to achieve lifting motion.

[0117] In other embodiments, the second lifting support structure 63 includes a fourth magnet configured to move upward or downward under the action of an external magnetic field to drive the wafer 10 to move upward or downward.

[0118] Understandably, utilizing the principle of repulsion between like magnets, by placing an external magnet below the fourth magnet, with the same polarity as the fourth magnet, the fourth magnet can be driven to rise, thereby driving the wafer 10 to rise. Similarly, utilizing the principle of repulsion between opposite magnets, by placing an external magnet below the fourth magnet, with the opposite polarity as the fourth magnet, the fourth magnet can be attracted to fall, thereby driving the wafer 10 to fall.

[0119] In some embodiments, see Figure 12 and Figure 13 The second lifting support structure 63 includes at least three fourth magnets, the shape of which is a dot-shaped projection on the first surface P1. The line connecting the at least three fourth magnets along the direction parallel to the first surface P1 (along the XY plane) forms a planar stable support pattern to stably support the wafer 10.

[0120] It is understood that the aforementioned “planar stable support pattern” is formed by the connection of at least three fourth magnets. That is, the planar stable support pattern can be a triangle formed by the connection of three fourth magnets, a quadrilateral formed by the connection of four fourth magnets, a pentagon formed by the connection of five fourth magnets, and so on. The number of fourth magnets is not specifically limited.

[0121] Figure 12 The diagram shows the second lifting support structure 63 including three fourth magnets. The planar stable support pattern formed by the connection of the three fourth magnets is a triangle, which can provide stable support for the wafer 10.

[0122] In some embodiments, see Figure 13 and Figure 15 The wafer box 1 also includes an anti-slip layer 23, which is disposed on the surface of the support structure 6 that contacts the wafer 10. The wafer 10 contacts the anti-slip layer 23 located on the top surface of the support structure 6, which can prevent the wafer 10 from sliding sideways and improve the support stability of the wafer 10.

[0123] For example, the anti-slip layer 23 can be disposed on the top surface of the second fixed support structure 62. When the wafer 10 is in contact with the top surface of the second fixed support structure 62, it can prevent the wafer 10 from sliding sideways on the second fixed support structure 62 and improve the stability of the fixed support of the second fixed support structure 62.

[0124] Alternatively, the anti-slip layer 23 can be disposed on the top surface of the second lifting support structure 63. When the second lifting support structure 63 drives the wafer 10 to move up or down, it can prevent the wafer 10 from sliding sideways on the second lifting support structure 63 and improve the stability of the movable support of the second lifting support structure 63.

[0125] Alternatively, the anti-slip layer 23 can be set on the top surface of the second fixed support structure 62 and the second lifting support structure 63, which can improve the stability of the fixed support of the second fixed support structure 62 and the stability of the movable support of the second lifting support structure 63.

[0126] In the above embodiments of this application, taking the second lifting support structure 63 as an example, the loading process of the wafer 10 includes: First, placing the wafer 10 on the top surface of the second lifting support structure 63, which is then lowered by gravity until the wafer 10 contacts the top surface of the second fixed support structure 62. Then, covering the box 2 with the cover plate 3, the first magnet 51 and the second magnet 52 attract each other, adsorbing the cover plate 3 and the box 2 together. Finally, evacuating the first wafer slot 9 using a vacuum pump, bringing the first wafer slot 9 to a low vacuum state of approximately 10 Pa.

[0127] It should be noted that during the process of the second lifting support structure 63 resetting downward under the action of gravity, an upward force can be applied to the second lifting support structure 63, and this force should be less than the gravity acting on the second lifting support structure 63. This can reduce the acceleration of the second lifting support structure 63 moving downward and ensure that the second lifting support structure 63 descends smoothly.

[0128] For example, the second lifting support structure 63 is a magnet. An external magnetic field can be set below the box 2, and the polarity of the external magnetic field is the same as that of the second lifting support structure 63. It can exert an upward repulsive force on the second lifting support structure 63, and the repulsive force is less than the gravity of the second lifting support structure 63.

[0129] The process of removing wafer 10 includes: first, separating the cover plate 3 of wafer cassette 1 from the cassette 2; then, placing a magnet below the cassette 2, generating a repulsive force between the magnet and the second lifting support structure 63, which can drive the second lifting support structure 63 to move upward, thereby driving the wafer 10 to move upward and removing it while the wafer 10 is lifted.

[0130] Embodiments of this application also provide a semiconductor manufacturing apparatus. Figure 16 This is a structural diagram of a semiconductor manufacturing apparatus provided in an embodiment of this application.

[0131] See Figure 16The semiconductor manufacturing equipment 100 includes the wafer cassette 1 in any of the foregoing embodiments. The semiconductor manufacturing equipment 100 also includes a vacuum pump 16, which is connected to a vacuum coupler 8. The vacuum pump 16 is used to evacuate the first wafer cassette 9 to ensure the cleanliness of the first wafer cassette 9, thereby ensuring the cleanliness of the wafer 10.

[0132] Figure 17 This is another structural diagram of the semiconductor manufacturing equipment provided in the embodiments of this application.

[0133] See Figure 17 The semiconductor manufacturing equipment 100 also includes a separation device 17, which includes a first robotic arm 18 and a fifth magnet 19. The first robotic arm 18 is used to grasp the lug 14 of the cover plate 3. Exemplarily, the first robotic arm 18 can be a robotic hand, which can be a V-shaped or mountain-shaped insert.

[0134] As described above, the lug 14 of the cover plate 3 extends beyond the edge of the box body 2 so that the first robotic arm 18 can grasp the lug 14. For example, the first robotic arm 18 can grasp the lug 14 by placing the first robotic arm 18 below the lug 14, and the first robotic arm 18 can support the cover plate 3 upward.

[0135] The fifth magnet 19 is located on the side of the box 2 away from the cover plate 3. The fifth magnet 19 is used to eliminate the magnetic force between the first magnet 51 and the second magnet 52, so that the cover plate 3 is separated from the box 2.

[0136] Understandably, under the influence of the magnetic field from the fifth magnet 19, the magnetic force that attracts the first magnet 51 and the second magnet 52 is eliminated. For example, when the first robotic arm 18 supports the cover plate 3 upward, the box 2 will move downward under the action of gravity due to the elimination of the magnetic force between the first magnet 51 and the second magnet 52, so as to separate the cover plate 3 from the box 2.

[0137] Figure 18 This is another structural diagram of a semiconductor manufacturing apparatus provided in an embodiment of this application.

[0138] See Figure 18 In the case where the support structure 6 of the wafer cassette 1 includes a lifting support structure, the semiconductor manufacturing equipment 100 also includes a lifting drive device 20. The support structure 6 is configured to move up or down under the drive of the lifting drive device 20 to drive the wafer 10 to move up or down.

[0139] For example, when the support structure 6 is a mechanical lifting structure, the lifting drive device 20 can be a mechanical drive device. For instance, if the support structure 6 is a lead screw drive structure, the lifting drive device 20 can be a motor to drive the lead screw to rotate, thereby causing the support structure 6 to move up or down. As another example, if the support structure 6 is a worm gear drive structure, the lifting drive device 20 can also be a motor to drive the worm gear to rotate, thereby causing the support structure 6 to move up or down.

[0140] For example, when the support structure 6 is a magnet, the lifting drive device 20 can also be a magnet. The lifting drive device 20 is located on the side of the housing 2 away from the cover plate 3, that is, at the bottom of the housing 2. Utilizing the principle of repulsion between like poles of magnets, a repulsive force is generated between the lifting drive device 20 and the support structure 6, which can drive the support structure 6 to move upward, thereby driving the wafer 10 to move upward. Similarly, utilizing the principle of attraction between opposite poles of magnets, an attractive force is generated between the lifting drive device 20 and the support structure 6, which can drive the support structure 6 to move downward, thereby driving the wafer 10 to move downward.

[0141] For example, the semiconductor manufacturing equipment 100 also includes a second robotic arm 21. For instance, the second robotic arm 21 can be a robotic hand, which can be a V-shaped or mountain-shaped insert. When the wafer 10 is lifted, typically the wafer 10 is 2mm to 3mm higher than the housing. The second robotic arm 21 can extend to the bottom of the wafer 10 to grasp the wafer 10, thereby transferring the wafer 10 to the loading / unloading (L / UL) station of the process unit. Subsequently, the wafer 10 is transferred from the loading / unloading station to the process chamber for processing.

[0142] In the embodiments of this application, taking the support structure 6 as including a second fixed support structure 62 and a second lifting support structure 63, with the second lifting support structure 63 being a magnet, the loading process of the wafer 10 includes: First, placing the wafer 10 on the top surface of the second lifting support structure 63, and then lowering the second lifting support structure 63 until the wafer 10 contacts the top surface of the second fixed support structure 62. Then, covering the housing 2 with a cover plate 3, the first magnet 51 and the second magnet 52 attract each other, adsorbing the cover plate 3 and the housing 2 together. Finally, evacuating the first wafer slot 9 using a vacuum pump, so that the first wafer slot 9 is in a low vacuum state of approximately 10 Pa.

[0143] It should be noted that during the process of the second lifting support structure 63 resetting downward under the action of gravity, an upward force can be applied to the second lifting support structure 63, and this force should be less than the gravity acting on the second lifting support structure 63. This can reduce the acceleration of the second lifting support structure 63 moving downward and ensure that the second lifting support structure 63 descends smoothly.

[0144] For example, the second lifting support structure 63 is a magnet. An external magnetic field can be set below the box 2, and the polarity of the external magnetic field is the same as that of the second lifting support structure 63. It can exert an upward repulsive force on the second lifting support structure 63, and the repulsive force is less than the gravity of the second lifting support structure 63.

[0145] The unloading process of wafer 10 includes: First, placing wafer cassette 1 on separation device 17, and using first robotic arm 18 to grasp the lug 14 of cover plate 3. Then, placing fifth magnet 19 below wafer cassette 1, the attraction between first magnet 51 and second magnet 52 is eliminated by the action of fifth magnet 19, and cassette 2 moves downward under the action of gravity to separate cover plate 3 from cassette 2. Finally, placing sixth magnet 20 below cassette 2, the repulsive force between sixth magnet 20 and second lifting support structure 63 can drive the second lifting support structure 63 to move upward, thereby driving wafer 10 to move upward. While wafer 10 is being lifted, second robotic arm 21 extends to the bottom of wafer 10 and transfers wafer 10 to the loading and unloading station of the process unit.

[0146] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer cassette, characterized by, The wafer box comprises: a box body comprising a first surface and a first wafer slot extending from the first surface into the box body, the first wafer slot being configured to accommodate a wafer; at least one sealing ring arranged on the first surface, the at least one sealing ring surrounding the first wafer slot; a cover plate covering the first surface; at least one pair of magnets, each pair of magnets comprising a first magnet and a second magnet, the first magnet being arranged in the box body and the second magnet being arranged in the cover plate, a projection of the second magnet on the first surface at least partially overlapping a projection of the first magnet on the first surface; a support structure arranged in the first wafer slot, the support structure being configured to support the wafer, a surface of the support structure contacting the wafer being higher than the first surface when the wafer is placed or removed; and, in a closed state, a surface of the wafer does not contact a surface of the cover plate when the wafer box accommodates the wafer.

2. The wafer cassette of claim 1, wherein, The support structure is a first lifting support structure, a top surface of the first lifting support structure being configured to contact the wafer to drive the wafer to move upward or downward when the wafer is placed or removed.

3. The wafer cassette of claim 2, wherein, The first wafer slot is provided with a first groove, and a portion of the first lifting support structure is located in the first groove and can move upward or downward in the first groove.

4. The wafer cassette of claim 1, wherein, The support structure is a first fixed support structure, the first fixed support structure being fixedly connected to a bottom of the first wafer slot, and a surface of the first fixed support structure contacting the wafer being higher than the first surface. An area of the cover plate opposite to the first wafer slot is provided with a second wafer slot, and a distance between a bottom surface of the first wafer slot and a bottom surface of the second wafer slot is greater than a sum of a height of the fixed support structure and a thickness of the wafer when the wafer box is in the closed state.

5. The wafer cassette of claim 1, wherein, The support structure comprises a second fixed support structure and a second lifting support structure, the second fixed support structure being fixedly connected to the bottom of the first wafer slot, and a top surface of the second lifting support structure being configured to contact the wafer to drive the wafer to move upward or downward when the wafer is placed or removed.

6. The wafer cassette of claim 5, wherein, The top surface of the second fixed support structure contacts the wafer when the wafer box is in the closed state, and the top surface of the second fixed support structure does not contact the wafer after the second lifting support structure drives the wafer to move upward during the process of placing or removing the wafer.

7. The wafer cassette of claim 1, wherein, The support structure is a first lifting support structure, or the support structure comprises a second fixed support structure and a second lifting support structure. The first lifting support structure is a mechanical lifting structure; or the first lifting support structure comprises a third magnet configured to move upward or downward under the action of an external magnetic field to drive the wafer to move upward or downward. The second lifting support structure is a mechanical lifting structure. Alternatively, the second lifting support structure comprises a fourth magnet configured to move upward or downward under the action of an external magnetic field to drive the wafer to move upward or downward.

8. The wafer cassette of claim 7, wherein, The first lifting support structure comprises at least three third magnets, and a shape of a projection of the at least three third magnets on the first surface is a point; In a direction parallel to the first surface, a line connecting the at least three third magnets forms a planar stable support pattern to stably support the wafer. The second lifting support structure comprises at least three fourth magnets, and a shape of a projection of the at least three fourth magnets on the first surface is a point; In a direction parallel to the first surface, a line connecting the at least three fourth magnets forms a planar stable support pattern to stably support the wafer.

9. The wafer boat of any one of claims 1-8, wherein, The wafer box further comprises an anti-skid layer arranged on a surface of the support structure in contact with the wafer.

10. The wafer cassette of claim 1, wherein, The wafer box further comprises a vacuum coupler in communication with the first wafer receiving groove in the box body.

11. The wafer boat of claim 1, wherein, An outer edge of the cover plate is provided with a lug, and the lug exceeds an outer edge of the first surface in a direction parallel to the first surface.

12. The wafer boat of claim 1, wherein, The cover plate comprises a second surface close to one side of the box body, and a second wafer receiving groove arranged on the second surface and extending from the second surface into the cover plate; An outer boundary of a projection of the second wafer receiving groove on the first surface coincides with an edge of the first wafer receiving groove.

13. The wafer boat of claim 1, wherein, A size of the wafer received in the first wafer receiving groove is greater than or equal to 0.5 inch.

14. A semiconductor manufacturing apparatus, characterized by comprising: The wafer box comprises: The wafer box according to any one of claims 1-13; A vacuum pump in communication with the first wafer receiving groove of the wafer box.

15. The semiconductor manufacturing apparatus according to claim 14, wherein The semiconductor manufacturing equipment further comprises a separation device comprising a first mechanical arm and a fifth magnet; The first mechanical arm is used to grab the lug of the cover plate; The fifth magnet is arranged on a side of the box body away from the cover plate, and the fifth magnet is used to eliminate the magnetic force between the first magnet and the second magnet to separate the cover plate from the box body.

16. The semiconductor manufacturing apparatus according to Claim 14, wherein The semiconductor manufacturing equipment further comprises a lifting driving device; When the support structure comprises a lifting support structure, the support structure is configured to move upward or downward under the driving of the lifting driving device to drive the wafer to move upward or downward.

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