Wafer conveying device

Abstract

The utility model provides a wafer conveying device comprising a main body frame comprising a first end and a second end, and the first end is aligned with an opening of a wafer box; the fixing structure is arranged at the first end and is used for fixing the main body frame at the edge of the wafer box; the alignment structure is arranged on the main body frame, one end of the alignment structure extends out of the first end, and when the main body frame is fixed at the edge of the wafer box, the distance between the alignment structure and the wafer in the wafer box is at least L1; the conveying structure is arranged on the upper surface of the main body frame and is higher than the alignment structure, one end of the conveying structure extends out of the first end and does not exceed the edge of the alignment structure, the height difference between the upper surface of the conveying structure and the upper surface of the alignment structure is L2, and a wafer is placed on the conveying structure and enters a target slot position of the wafer box along the conveying structure. Through reasonable structural design and function configuration, the problems of low precision, poor stability, complex operation and the like in the manual wafer conveying process in the prior art are effectively solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor, especially relate to a wafer conveying device. BACKGROUND

[0002] In the production process of semiconductor manufacturing equipment, equipment failure occurs from time to time, which often needs to take out the wafer from the equipment and manually put into the wafer box in order to repair the equipment. Under normal circumstances, the operator will manually carry the wafer box and wafer to the special conveying equipment, and put the wafer into the wafer box accurately with the help of mechanical arm. However, the special conveying equipment is usually far away, in order to prevent the wafer from being contaminated during the carrying process, the most efficient and effective protection method is to manually put the exposed wafer into the wafer box immediately. During the manual operation, special attention should be paid to the fact that there may be other wafers that have completed or not completed the process in the wafer box, and the spacing between these wafers is only 10mm. This means that when putting in the new wafer, the operator only has a narrow space of 20mm for operation to ensure that there is no scratching during the placement process. Due to the complexity of manual operation and the high requirement for accuracy, any mistake may cause the wafer surface to be scratched, resulting in product scrap and unnecessary production loss. Therefore, how to safely and effectively put the new wafer into the box with the existing wafer in the limited space has become a technical problem to be solved. SUMMARY

[0003] In order to solve all or part of the problems of the prior art, the utility model provides a wafer conveying device, which has a clever structure design and can effectively realize accurate conveying of wafers while ensuring the safety and reliability of the operation process.

[0004] To achieve the above purpose, the utility model provides the following technical scheme:

[0005] A wafer conveying device, comprising:

[0006] A main frame comprising a first end and a second end, the first end being aligned with the opening of the wafer box;

[0007] A fixing structure arranged at the first end for fixing the main frame to the edge of the wafer box;

[0008] An alignment structure arranged on the main frame, one end of which extends out of the first end, and when the main frame is fixed to the edge of the wafer box, the distance between the alignment structure and the wafer in the wafer box is at least L1;

[0009] A transfer structure is disposed on the upper surface of the main frame, higher than the alignment structure, with one end extending beyond the first end and not exceeding the edge of the alignment structure. The height difference between the upper surface of the transfer structure and the upper surface of the alignment structure is L2. The wafer is placed on the transfer structure and enters the target slot of the wafer cassette along the transfer structure.

[0010] The wafer cassette has multiple slots equidistantly arranged along the vertical direction, with a spacing of L3 between adjacent slots. In use, the alignment structure is aligned with the wafer in the next slot after the target slot, so that the wafer on the transfer structure is higher than the target slot.

[0011] L1 is 1-5cm; L2 is equal to L3, specifically 5-15mm.

[0012] The alignment structure consists of two sets of parallel alignment plates. One end of each alignment plate is fixed to the second end, and the other end extends toward and protrudes from the first end. When the fixing structure fixes the main frame to the edge of the wafer cassette, this end is more than a distance from the wafer L1 inside the wafer cassette.

[0013] The conveying structure includes at least two conveying arms arranged parallel to the upper surface of the main frame. One end of each conveying arm is fixed to the upper surface of the second end, and the other end extends toward and protrudes from the first end, with the extension range of the other end not exceeding the edge of the alignment structure.

[0014] The conveyor arm is provided with an auxiliary sliding structure, which includes a plurality of balls that are evenly distributed along the length of the conveyor arm.

[0015] The upper surface of the conveying structure and the auxiliary sliding structure are both made of Teflon to prevent scratching the wafer during the conveying process.

[0016] The main frame is a rectangular frame, the width of which is greater than the width of the wafer box. The first end is provided with an opening to facilitate wafer transfer operations. The alignment structure and the transfer structure are both located within the range defined by the opening.

[0017] The first end has a fixing structure on both sides. The fixing structure includes a fixing block and a sliding block. The fixing block is fixedly installed at the end. The sliding block has a through hole and is movably assembled to the main frame through the through hole. The fixing block and the sliding block are connected by an elastic element. The clamping sides of the fixing block and the sliding block are provided with soft anti-slip pads.

[0018] Both the fixed block and the sliding block are provided with soft anti-slip pads on their clamping sides.

[0019] This utility model has at least the following beneficial effects:

[0020] 1) The alignment structure maintains a safe distance of at least L1 from the wafers in the wafer cassette, and the height difference L2 between the transport structure and the alignment structure provides strong assurance for the precise placement and transport of wafers. The alignment structure precisely aligns with the wafer in the next slot after the target slot, ensuring that the wafer on the transport structure is higher than the target slot. This provides ample space for the smooth insertion of the wafer and avoids collisions or scratches between the wafer and existing wafers in the slot above. This minimizes the risk of wafer surface damage and ensures the integrity and quality of the wafer.

[0021] 2) The main frame is fixed to the edge of the wafer cassette using a fixing structure, which enhances the stability of the transport device during operation. The stability of the device is crucial for protecting the wafers from damage during transport. Due to the high value and fragility of wafers, any collision caused by device movement can result in irreparable loss. The fixing structure of this invention effectively avoids such risks, ensuring the safety of the wafers during transport, reducing production costs, and improving production efficiency.

[0022] 3) Manual operation is possible, which is simple and easy to implement, eliminating the need for complex automated equipment and reducing equipment costs and maintenance difficulties. In actual production, the requirements for wafer transfer may vary under different circumstances. Manual operation allows operators to flexibly adjust the wafer transfer speed and position according to the actual situation. For example, in the event of an equipment malfunction requiring emergency handling, operators can quickly and manually place or remove wafers from the wafer cassette without waiting for the automated equipment to be adjusted and started. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a wafer transfer device according to an embodiment of the present invention.

[0025] Figure 2 This is a schematic diagram of a wafer transfer device in use according to an embodiment of the present invention.

[0026] Figure 3 Provided for the embodiments of this utility model Figure 2 A magnified view of a portion of the image.

[0027] Figure 4 Provided for the embodiments of this utility model Figure 2 A partial view of the interior of the wafer box.

[0028] Reference numerals: 1. Main frame; 2. Fixing structure; 201. Fixing block; 202. Sliding block; 203. Elastic element; 3. Alignment structure; 4. Transfer structure; 5. Wafer box; 501. Slot; 6. Target wafer. Detailed Implementation

[0029] The technical solutions in specific embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0030] In this embodiment of the utility model, in conjunction with reference to the reference Figures 1 to 4 As shown, a wafer transfer device is provided, featuring an ingenious structural design that effectively achieves precise wafer transfer. The device includes a main frame 1, which is elongated and has a first end and a second end. The first end is precisely aligned with the opening of a wafer cassette 5, ensuring accurate wafer entry. A fixing structure 2 is located at the first end of the main frame 1, securely fixing the main frame 1 to the edge of the wafer cassette 5. This stabilizes the transfer device during wafer transfer, preventing wafer damage or transfer errors due to device vibration. An alignment structure 3 is also provided on the main frame 1, with one end extending from the first end. When the main frame 1 is fixed to the edge of the wafer cassette 5, the distance between the alignment structure 3 and the wafer inside the cassette 5 is at least L1. This design provides sufficient safety distance for wafer placement and transfer, preventing collisions and damage to the wafers during transfer, and also facilitating accurate wafer placement by operators. The transfer structure 4 is positioned on the upper surface of the main frame 1, higher than the alignment structure 3. One end of the transfer structure 4 extends from the first end but does not exceed the edge of the alignment structure 3. This ensures that the transfer structure 4 has sufficient space to hold the wafer without interfering with the positioning function of the alignment structure 3. The height difference between the upper surface of the transfer structure 4 and the upper surface of the alignment structure 3 is L2, and L2 is the spacing between adjacent slots 501 inside the wafer cassette 5. This height difference design allows the wafer to form a reasonable relative position with the alignment structure 3 when placed on the transfer structure 4, facilitating manual operation by the operator to smoothly push the wafer from the second end into the target slot of the wafer cassette 5, effectively improving the accuracy and convenience of wafer transfer.

[0031] The wafer cassette 5 has multiple slots 501 arranged equidistantly along the vertical direction inside, with the spacing between adjacent slots 501 set to L3. In this embodiment, L3 is specifically 10mm. This equidistant arrangement ensures the orderly arrangement of the slots 501 within the wafer cassette 5, providing a foundation for the orderly storage and transport of wafers. In this embodiment, the alignment structure 3 employs two sets of parallel alignment tabs, one end of which is firmly fixed to the second end of the main frame 1, while the other end extends towards and protrudes from the first end. When the fixing structure 2 fixes the main frame 1 to the edge of the wafer cassette 5, the distance between the protruding end of the alignment tab and the wafer inside the wafer cassette 5 is at least L1, which is set to 1cm in this embodiment. This design has significant advantages. First, the 1cm safety distance provides ample space for wafer placement and transport, effectively preventing collisions between the alignment tab and existing wafers within the wafer cassette 5 during transport, thereby minimizing the risk of wafer surface damage and ensuring wafer integrity and quality. Secondly, the two sets of parallel alignment plates provide a precise positioning reference for the wafers on the transfer structure 4. Operators can more accurately control the transfer direction and position of the wafers based on the relative positions of the alignment plates and the wafers within the wafer cassette 5, improving the accuracy and reliability of wafer transfer. Furthermore, the parallel arrangement of the alignment plates enhances the stability of the structure, allowing it to remain more fixed during transfer, further ensuring the smoothness of wafer transfer.

[0032] In this embodiment, the transfer structure 4 consists of at least two transfer arms, which are arranged parallel to each other on the upper surface of the main frame 1. One end of each transfer arm is fixedly connected to the upper surface of the second end of the main frame 1, while the other end extends towards the first end and protrudes from it, but the extension range of this end is controlled to not exceed the edge of the alignment structure 3. This design ensures that the transfer arm provides sufficient support and transfer space without interfering with the normal function of the alignment structure 3, thus guaranteeing the accuracy of wafer transfer. To further optimize the wafer transfer effect, an auxiliary sliding structure can also be provided on the transfer arm. This auxiliary sliding structure consists of multiple balls, which are evenly distributed along the length of the transfer arm. The arrangement of the balls can significantly reduce the friction of the wafer during the transfer process, allowing the wafer to slide more smoothly on the transfer arm, reducing potential surface damage to the wafer due to friction, and improving the stability and safety of wafer transfer. The upper surface of the transfer structure 4 and the auxiliary sliding structure are both made of Teflon. Teflon has excellent wear resistance, corrosion resistance and low coefficient of friction, which make it an ideal material choice for wafer transfer. It can effectively prevent scratches when the wafer comes into contact with the transfer structure 4 during the transfer process, thereby protecting the surface quality of the wafer to the greatest extent.

[0033] The main frame 1 adopts a rectangular frame structure, with its width designed to be greater than the width of the wafer cassette 5. This ensures that the main frame 1 can completely cover and fit the wafer cassette 5. In this embodiment, the width of the rectangular frame is between 650mm and 700mm, and its length is greater than 300mm. An opening is provided at the first end of the main frame 1, providing a convenient channel for wafer transfer operations, allowing the wafer to smoothly enter the main frame 1 and undergo subsequent transfer operations. The alignment structure 3 and the transfer structure 4 are both located within the area defined by the opening. This layout design effectively prevents the fixing structures 2 located at both ends of the opening from obstructing the wafer, ensuring a clear view and precise operation during wafer transfer. Furthermore, to improve the versatility and applicability of this device, in other specific embodiments, the main frame 1, alignment structure 3, and transfer structure 4 are all designed as retractable structures. This innovative design allows the device to flexibly match wafer cassettes 5 and wafers of different sizes, greatly expanding the applicability of the device. Whether it is a standard-sized or non-standard-sized wafer box 5, or a wafer of different diameters, this device can precisely adapt by shrinking and adjusting, achieving efficient and stable wafer transfer.

[0034] A fixing structure 2 is provided at both ends of the first end of the main frame 1. This fixing structure 2 consists of a fixing block 201 and a sliding block 202. The fixing block 201 is securely installed at the end of the main frame 1, while the sliding block 202 has a through hole, allowing it to be movably mounted on the main frame 1 and slide flexibly on the frame. The fixing block 201 and the sliding block 202 are connected by an elastic element 203. This elastic connection not only provides clamping force but also absorbs impact forces caused by improper operation or equipment vibration to a certain extent, protecting the wafer from damage. Furthermore, soft anti-slip pads are provided on the clamping sides of both the fixing block 201 and the sliding block 202. These pads increase friction during clamping, ensuring the stability of the wafer cassette 5 during transport and effectively preventing scratches on the surface of the wafer cassette 5. The fixing structure 2 is simple and efficient to use. First, the main frame 1 is placed stably from above, and the fixing block 201 is aligned with the inner side of the opening edge of the wafer cassette 5 for initial positioning. Next, the sliding block 202 is manually pulled outward along the main frame 1, forming a certain gap with the fixed block 201, so that the edge of the wafer cassette 5 opening can smoothly enter between the fixed block 201 and the sliding block 202. Once the edge of the wafer cassette 5 opening is accurately positioned between them, the sliding block 202 is released. Under the elastic restoring force of the elastic element 203, the fixed block 201 and the sliding block 202 quickly and automatically clamp the edge of the wafer cassette 5 opening, thereby firmly fixing the wafer cassette 5 and providing stable support for subsequent wafer transfer operations. In other specific embodiments, the setting of the fixing structure 2 can be flexibly designed according to actual application requirements.

[0035] This utility model also provides a method for transporting wafers, which is implemented using the above-mentioned transport device, and the specific steps are as follows:

[0036] S1. Place the target wafer 6 smoothly on the transfer structure 4, and then accurately place the main frame 1 from directly above the wafer box 5. Use the fixing structure 2 to fix the main frame 1 to the edge of the opening of the wafer box 5 to complete the initial positioning and lay the foundation for the subsequent transfer operation.

[0037] S2. Loosen the fixing structure 2 and finely adjust the height of the main frame 1 within the wafer cassette 5 until the alignment structure 3 is precisely aligned with the wafer in the next slot of the target slot. This step ensures that the wafer on the transfer structure 4 can accurately enter the predetermined target slot when pushed into the wafer cassette 5, avoiding wafer damage or transfer failure due to positional deviation.

[0038] S3. Fix the main frame 1 again using the fixing structure 2, and then manually push the wafer smoothly into the wafer box 5 along the transfer structure 4 to complete the wafer transfer operation.

[0039] The method offers significant advantages. First, preliminary positioning ensures accurate alignment between the main frame 1 and the wafer cassette 5, providing a prerequisite for stable wafer transport. Second, precise alignment through height fine-tuning and alignment structure 3 greatly improves the accuracy of wafer transport, reducing the risk of wafer collisions or scratches caused by inaccurate positioning. Finally, manual pushing is simple and easy to perform, requiring no complex automated equipment, reducing equipment costs and operational difficulty, while also allowing operators to flexibly control the transport speed and force according to actual conditions.

[0040] The conveying device designed in this utility model securely fixes the main frame 1 to the edge of the wafer cassette 5 through the fixing structure 2, ensuring the stability of the conveying device during operation and reducing the risk of wafer damage due to device shaking. The alignment structure 3 maintains a safe distance of at least L1 from the wafers inside the wafer cassette 5, and the height difference L2 between the conveying structure 4 and the alignment structure 3 provides strong guarantees for the precise placement and conveying of wafers, improving the success rate and reliability of wafer conveying. In actual use, the alignment structure 3 accurately aligns with the wafer in the next slot after the target slot, ensuring that the wafer on the conveying structure 4 is higher than the target slot, providing ample space for smooth wafer insertion. It also provides operators with an intuitive and clear reference point. Based on this reference, operators can more accurately control the conveying position and direction of the wafer, improving the operational precision and efficiency of wafer conveying and ensuring that the wafer is accurately pushed into the predetermined target slot.

[0041] It should be noted that, for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the scope of protection of the claims of this utility model.

Claims

1. A wafer transfer device, characterized by, The application relates to a wafer conveying device, which comprises the following parts: a main frame (1) comprising a first end and a second end, the first end being aligned with the opening of a wafer box (5); a fixing structure (2) arranged at the first end and used for fixing the main frame (1) to the edge of the wafer box (5); an alignment structure (3) arranged on the main frame (1) and extending out of the first end, the distance between the alignment structure (3) and the wafer in the wafer box (5) being at least L1 when the main frame (1) is fixed to the edge of the wafer box (5); and a conveying structure (4) arranged on the upper surface of the main frame (1) and higher than the alignment structure (3), the conveying structure (4) extending out of the first end and not exceeding the edge of the alignment structure (3), the height difference between the upper surface of the conveying structure (4) and the upper surface of the alignment structure (3) being L2, and the wafer being placed on the conveying structure (4) and entering the target slot of the wafer box (5) along the conveying structure (4). The wafer box (5) is provided with a plurality of slots (501) equidistantly arranged in the vertical direction, and the distance between adjacent slots (501) is L3; the alignment structure (3) is used for aligning the wafer in the next slot of the target slot, and the wafer on the conveying structure (4) is higher than the target slot. L1 is 1-5 cm; L2 is equal to L3, and specifically 5-15 mm. The alignment structure (3) is two groups of parallel alignment sheets, one end of the alignment sheets being fixed to the second end, the other end extending towards the first end and protruding out of the first end, and the distance between the other end and the wafer in the wafer box (5) being more than L1 when the fixing structure (2) fixes the main frame (1) to the edge of the wafer box (5). The conveying structure (4) comprises at least two conveying arms arranged in parallel on the upper surface of the main frame (1), one end of the conveying arms being fixed to the upper surface of the second end, the other end extending towards the first end and protruding out of the first end, and the extension range of the other end not exceeding the edge of the alignment structure (3).

2. The apparatus of claim 1, wherein, The conveying arm is provided with an auxiliary sliding structure, and the auxiliary sliding structure comprises a plurality of rolling balls which are uniformly distributed along the length direction of the conveying arm.

3. The apparatus of claim 2, wherein, The upper surface of the conveying structure (4) and the auxiliary sliding structure are made of Teflon material to avoid scratching the wafer during conveying.

4. The apparatus of claim 1, wherein, The main frame (1) is a rectangular frame, the width of the main frame (1) is greater than the width of the wafer box (5), the first end is provided with an opening to facilitate wafer conveying operation, and the alignment structure (3) and the conveying structure (4) are located within the range defined by the opening.

5. The apparatus of claim 1, wherein, The end portions on both sides of the first end are provided with the fixing structure (2), the fixing structure (2) comprises a fixing block (201) and a sliding block (202), the fixing block (201) is fixedly installed at the end portion, the sliding block (202) is internally provided with a through hole and movably assembled on the main frame (1) through the through hole, and the fixing block (201) and the sliding block (202) are connected through an elastic element (203).

6. The apparatus of claim 5, wherein, ​ 7. The apparatus of claim 6, wherein, ​ 8. The apparatus of claim 1, wherein, ​ 9. The apparatus of claim 8, wherein, ​ 10. The apparatus of claim 9, wherein, The fixed block (201) and the sliding block (202) are provided with soft anti-skid pads on the clamping sides.

Images