Temporary storage device for wafers to be taken

Abstract

The utility model belongs to the field of semiconductors, and particularly relates to a to-be-taken wafer temporary storage device which comprises a support and a supporting shaft, a working plate is arranged on the support, a through hole is formed in the working plate, the through hole penetrates through the portion between the two ends of the supporting shaft, and a driving motor is arranged on the support and located below the working plate. An output shaft of the driving motor is in transmission connection with the lower end of the supporting shaft through a lifting transmission device, a position sensor is arranged on the portion, below the working plate, of the support, and the position sensor is in signal connection with the driving motor. The supporting shaft penetrating through the through hole formed in the working plate enters and exits from the stroke range of the mechanical arm in a lifting mode, and a device used for temporarily storing the wafer to be grabbed by the mechanical arm is arranged, so that the risk that the wafer is collided by the mechanical arm when the wafer is added is relieved; the problem of how to prevent the wafer from being collided by a manipulator when the wafer is added is solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of semiconductors, and particularly relates to a temporary storage device for wafers to be taken. BACKGROUND

[0002] A wafer is a material for manufacturing a semiconductor. In the process of manufacturing a semiconductor, the wafer is placed, and then a mechanical hand is used to grab the wafer to a processing station. Therefore, a device for containing the wafer needs to be placed in the range of the mechanical hand. However, when the wafers in the device for containing the wafers are grabbed by the mechanical hand, workers need to add wafers to the device for containing the wafers. At this time, the device for containing the wafers is in the range of the mechanical hand. Therefore, the workers have the risk of being hit by the mechanical hand when adding the wafers. CONTENT OF THE UTILITY MODEL

[0003] The application aims at the defects of the prior art. A support shaft penetrating through a through hole arranged on a working plate is used to enter and exit the range of the mechanical hand in a lifting manner. A device for temporarily storing wafers to be taken by the mechanical hand is arranged. Therefore, the risk of being hit by the mechanical hand when adding the wafers is eliminated. The problem of how to prevent the workers from being hit by the mechanical hand when adding the wafers is solved.

[0004] In order to achieve the above-mentioned purpose, the application adopts the following technical scheme:

[0005] A temporary storage device for wafers to be taken includes a support, a support shaft, a working plate arranged on the support, a through hole arranged on the working plate, the support shaft penetrating through the through hole between two ends of the support shaft, a driving motor arranged below the working plate on the support, an output shaft of the driving motor being connected to the lower end of the support shaft through a lifting transmission, a position sensor arranged below the working plate on the support, the position sensor being connected to the driving motor, and an inductive sheet arranged on the support shaft or the output end of the lifting transmission and matched with the position sensor.

[0006] Preferably, a suction disc is arranged at the top end of the support shaft.

[0007] Preferably, a support disc is arranged at the top end of the support shaft, and at least three limiting columns are uniformly arranged on the upper surface of the support disc around the center of the support disc.

[0008] Preferably, a plurality of support blocks are uniformly arranged on the support disc around the center of the support disc in the area surrounded by all the limiting columns, and the height of the upper end of the support block is lower than the height of the upper end of the limiting column.

[0009] Preferably, the side wall of each of the limiting columns towards the central axis of the support disc is a slope, the distance from the upper end of the slope to the central axis of the support disc is greater than the distance from the lower end of the slope to the central axis of the support disc.

[0010] Preferably, the lifting transmission comprises a sliding rail, a sliding block, a sliding groove and an eccentric wheel, the driving motor is a rotating motor, the eccentric wheel is arranged on the output shaft of the driving motor, the output shaft of the driving motor is parallel to the working plate, the vertical sliding rail is arranged on the support, the sliding block is arranged between the two ends of the sliding rail, the sliding groove is arranged on the side wall of the sliding block perpendicular to the working plate, the length line of the sliding groove is parallel to the working plate, the circumferential surface of the eccentric wheel is in sliding connection with the sliding groove, the length of the sliding groove is greater than the outer diameter of the eccentric wheel, and the sliding block is fixedly connected with the support shaft.

[0011] Compared with the prior art, the application has the following beneficial effects:

[0012] The support shaft arranged through the through hole on the working plate enters and exits the stroke range of the mechanical hand in a lifting manner, and a device for temporarily storing wafers to be grabbed by the mechanical hand is arranged, so that the risk of being hit by the mechanical hand when adding wafers is eliminated, and the problem of how to prevent being hit by the mechanical hand when adding wafers is solved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a structural schematic view of the embodiment in which the support shaft is provided with a support disc;

[0014] Figure 2 It is an exploded view of the application;

[0015] Figure 3 It is Figure 2 It is a schematic view of the back;

[0016] Figure 4 It is Figure 3 It is an enlarged view of A in the middle;

[0017] Figure 5 It is a schematic view of the embodiment in which the support shaft is provided with a suction disc.

[0018] 1, support; 2, support shaft; 3, through hole; 4, driving motor; 5, position sensor; 6, inductive sheet; 7, suction disc; 8, limiting column; 9, support block; 10, slope; 11, sliding rail; 12, sliding block; 13, sliding groove; 14, eccentric wheel; 15, support disc. DETAILED DESCRIPTION

[0019] As Figures 1-5As shown, a wafer to be taken temporary storage device, including support 1, support shaft 2, the support 1 is provided with a work plate, the work plate is provided with a through hole 3, the support shaft 2 between the two ends through the through hole 3, the support 1 in the work plate below is provided with a drive motor 4, the output shaft of the drive motor 4 is driven connected with the lower end of the support shaft 2 through the lifting transmission, the support 1 in the work plate below is provided with a position sensor 5, the position sensor 5 signal connection drive motor 4, the support shaft 2 or the output end of the lifting transmission is provided with a sensing sheet 6 matched with the position sensor 5.

[0020] In this embodiment, due to the setting of the through hole 3, the support shaft 2 rises and falls will not affect the work plate, that is, in practical application, the work plate can be placed on some other tools, second is the work plate, so that the staff can easily identify the stroke range of the support shaft 2 up and down movement, not easy to hit the support shaft 2 and produce danger. When you need to add wafer, start the drive motor 4, at this time, due to the setting of the position sensor 5 and the sensing sheet 6, in practice, it can be set according to the situation, for example, the position sensor 5 is set to the highest point of the support shaft 2 when sensing the sensing sheet 6, then the worker starts the drive motor 4, the drive motor 4 drives the support shaft 2 to descend through the lifting transmission, after descending, the support shaft 2 is out of the travel range of the mechanical hand, the worker adds wafer; When the position sensor 5 does not sense the sensing sheet 6, the worker adds the wafer, the worker starts the drive motor 4, the drive motor 4 drives the support shaft 2 to rise to the travel range of the mechanical hand through the lifting transmission for the mechanical hand to grab the wafer. When the wafer is placed on the support shaft 2, as long as the area of the upper end surface of the support shaft 2 is sufficient, it is generally stable.

[0021] In order to make the wafer can be stable placed on the support shaft 2, one of the setting way is: the top of the support shaft 2 is provided with a suction cup 7. In this way, through the setting of the suction cup 7, the wafer will not fall off during the rising and falling of the support shaft 2.

[0022] In order to make the wafer can be stable placed on the support shaft 2, the second setting way is: the top of the support shaft 2 is provided with a support disc 15, and at least three limit columns 8 are uniformly arranged on the upper surface of the support disc 15 around the center of the support disc 15. In this way, the wafer is placed in the area surrounded by the three limit columns 8, and the limit column 8 limits the wafer to prevent the wafer from falling off the support disc 15.

[0023] In actual application, the worker may find that the placed wafer is damaged or does not meet the specifications after the wafer is placed on the support disc 15. Therefore, in order to facilitate the worker to replace the wafer after the wafer is placed on the support disc 15, a plurality of support blocks 9 are evenly arranged around the center of the support disc 15 in the area surrounded by the limiting columns 8 on the support disc 15, and the height of the upper end of the support block 9 is lower than the height of the upper end of the limiting column 8. In this way, the lower surface of the wafer placed on the support disc 15 is not tightly attached to the upper surface of the support disc 15, so that the worker can easily take off the damaged wafer on the support disc 15. If the lower surface of the wafer is tightly attached to the support disc 15, it is not convenient to take off, which will not be described in detail, for example, it is not easy to take off the poker placed on the table in life, and generally the poker is taken by smearing saliva on the fingers to stick the poker, but the wafer cannot be stuck by saliva, and it is not sanitary.

[0024] As a preferred mode, the side wall of each limiting column 8 towards the central axis of the support disc 15 is a slope 10, and the distance from the upper end of the slope 10 to the central axis of the support disc 15 is greater than the distance from the lower end of the slope 10 to the central axis of the support disc 15. In this way, the wafer is placed on the support disc 15 by the arrangement of the slope 10, that is, in actual application, the radius of the virtual circle formed by the top end of the slope 10 on each limiting column 8 is greater than the radius of the wafer, so that the wafer is placed in the area surrounded by the limiting columns 8 on the support disc 15; and the radius of the virtual circle formed by the bottom end of the slope 10 on each limiting column 8 is less than the radius of the wafer, so that the wafer is placed coaxially with the support shaft 2 in the support disc 15, which facilitates the positioning of the wafer.

[0025] As a preferred mode, the lifting transmission device includes a sliding rail 11, a sliding block 12, a sliding groove 13, and an eccentric wheel 14. The driving motor 4 is a rotating motor, the eccentric wheel 14 is arranged on the output shaft of the driving motor 4, the output shaft of the driving motor 4 is parallel to the working plate, the vertical sliding rail 11 is arranged on the support 1, the sliding block 12 is slidingly arranged between the two ends of the sliding rail 11, the sliding groove 13 is arranged on the side wall of the sliding block 12 perpendicular to the working plate, the length line of the sliding groove 13 is parallel to the working plate, the circumferential surface of the eccentric wheel 14 is slidingly connected with the sliding groove 13, the length of the sliding groove 13 is greater than the outer diameter of the eccentric wheel 14, and the sliding block 12 is fixedly connected with the support shaft 2. In this way, the driving motor 4 does not need to adopt the forward rotation and reverse rotation mode to realize lifting, and the rotation mode of the output shaft of the driving motor 4 is converted into lifting motion by the arrangement of the sliding groove 13 and the eccentric wheel 14. The arrangement of the sliding rail 11 and the sliding block 12 ensures that the lifting of the support shaft 2 does not deviate from the specified path.

Claims

1. A temporary storage device for wafers to be retrieved, characterized in that, The utility model provides a kind of supporting shaft (2) including support (1), the support (1) is equipped with work plate, the work plate is equipped with through-hole (3), the both ends of the supporting shaft (2) are passed through the through-hole (3), the support (1) is equipped with drive motor (4) below the work plate, the output shaft of the drive motor (4) is connected with the lower end of the supporting shaft (2) by lifting transmission, the support (1) is equipped with position sensor (5) below the work plate, the position sensor (5) signal connection drive motor (4), the supporting shaft (2) or the output end of the lifting transmission is equipped with inductive sheet (6) matched with the position sensor (5).

2. The temporary storage device for a wafer to be taken out according to claim 1, wherein, The top end of the supporting shaft (2) is provided with a suction disc (7).

3. The temporary storage device for a wafer to be taken out according to claim 1, wherein, The top end of the supporting shaft (2) is provided with a support disc (15), and the upper surface of the support disc (15) is uniformly provided with at least three limiting columns (8) around the center of the support disc (15).

4. The temporary storage device for a wafer to be taken out according to claim 3, wherein, The support disc (15) is uniformly provided with a plurality of support blocks (9) around the center of the support disc (15) in the area surrounded by all the limiting columns (8), and the upper end of the support block (9) is lower than the upper end of the limiting column (8).

5. The temporary storage device for a wafer to be taken out according to claim 3, wherein, The sidewall of each limiting column (8) towards the central axis of the support disc (15) is a slope (10), and the distance from the upper end of the slope (10) to the central axis of the support disc (15) is greater than the distance from the lower end of the slope (10) to the central axis of the support disc (15).

6. The temporary storage device for a wafer to be taken out according to claim 1, wherein, The lifting transmission includes a slide rail (11), a sliding block (12), a sliding groove (13), and an eccentric wheel (14). The drive motor (4) is a rotating motor, the eccentric wheel (14) is arranged on the output shaft of the drive motor (4), the output shaft of the drive motor (4) is parallel to the work plate, the slide rail (11) is arranged vertically on the support (1), the sliding block (12) is slidingly arranged between the two ends of the slide rail (11), the sliding groove (13) is arranged on the sidewall of the sliding block (12) perpendicular to the work plate, the length of the sliding groove (13) is parallel to the work plate, the circumferential surface of the eccentric wheel (14) is slidingly connected with the sliding groove (13), the length of the sliding groove (13) is greater than the outer diameter of the eccentric wheel (14), and the sliding block (12) is fixedly connected with the supporting shaft (2).

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