Heat dissipation structure of power device

Abstract

The utility model discloses a heat radiation structure of a power device, comprising a heat radiator, the heat radiator is provided with a liquid inlet and a liquid outlet, the heat radiator is internally provided with a heat radiation flow channel, two ends of the heat radiation flow channel are respectively provided with a front liquid collection area and a rear liquid collection area, the front liquid collection area is communicated with the liquid inlet, and the front liquid collection area is provided with a shunting mechanism used for dispersing cooling liquid. The rear liquid collecting area is communicated with the liquid outlet; the surface of the radiator is provided with a plurality of heat dissipation grooves communicated with the heat dissipation flow channel, the power device is installed on the radiator, heat dissipation columns of the power device extend into the heat dissipation grooves, and a sealing piece is arranged between the power device and the radiator. According to the utility model, the heat dissipation part of the power device is directly immersed in the cooling liquid, and the heat dissipation part of the power device is directly contacted with the cooling liquid for heat exchange, so that the heat dissipation problem of silicon carbide of the high-power device can be effectively solved, and the heat dissipation performance and the working reliability of a product are improved.

Description

Technical Field

[0001] This utility model belongs to the field of power device heat dissipation technology, and specifically relates to a heat dissipation structure for power devices. Background Technology

[0002] Power devices (such as IGBTs) all experience losses during operation, most of which are converted into heat. In practical applications, IGBTs, as power devices, are widely used in frequency converters, inverters, and other fields. IGBTs generate significant losses during operation, which typically manifest as heat. To ensure proper IGBT operation, a cooling system is essential. The most common method is to mount the IGBT within a heatsink, allowing the heat to dissipate into the surrounding space. If necessary, a cooling fan or water cooling can be added to increase cooling efficiency. Furthermore, to reduce the operating temperature of the IGBT, common methods include: reducing the IGBT's operating current, selecting a larger IGBT, increasing the size of the heatsink, or replacing it with a copper heatsink or heat pipe heatsink with higher thermal conductivity.

[0003] In conventional high-power inverters, such as those with capacities of tens or even hundreds of kilowatts, the heat treatment of high-power IGBTs is typically achieved through water cooling. The IGBTs are mounted on a smooth, water-cooled copper or aluminum plate, and the heat is dissipated through circulating cooling water within the plate. A prerequisite for this technical requirement is that the mounting plate for the IGBTs be a smooth, flat copper plate to ensure proper contact with the water-cooling heat sink.

[0004] However, for the new high-power device SiC (silicon carbide), since the switching control frequency is more than 10 times higher than that of the traditional IGBT, the heat sink of the SiC device itself has been designed with adjustments: the bottom of the power device is designed with multiple spaced heat dissipation pillars, which are no longer smooth and flat copper plates. As a result, the power device cannot fit with the water-cooled heat sink base plate, and the original heat dissipation structure cannot carry away the heat. Therefore, the original heat dissipation structure no longer meets the heat dissipation requirements, and a new heat dissipation structure needs to be designed. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation structure for power devices to solve the aforementioned problems in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a heat dissipation structure for a power device, comprising a heat sink, wherein the heat sink is provided with an inlet and an outlet, and a heat dissipation channel is provided inside the heat sink. A front liquid collection area and a rear liquid collection area are respectively provided at both ends of the heat dissipation channel. The front liquid collection area is connected to the inlet and is provided with a flow-dividing mechanism for dispersing the coolant. The rear liquid collection area is connected to the outlet. A plurality of heat dissipation grooves communicating with the heat dissipation channel are opened on the surface of the heat sink. The power device is mounted on the heat sink, and the heat dissipation column of the power device extends into the heat dissipation groove. A sealing element is provided between the power device and the heat sink.

[0007] As an optional implementation of the above technical solution, the diversion mechanism includes a diversion block, on which a plurality of diversion holes are uniformly provided.

[0008] As an optional implementation of the above technical solution, the radiator is made of copper and has a nickel plating layer on its surface.

[0009] As an optional implementation of the above technical solution, the liquid inlet is connected to an inlet pipe, and the liquid outlet is connected to an outlet pipe.

[0010] As an optional embodiment of the above technical solution, the sealing element includes an annular sealing ring, and the surface of the radiator is provided with an embedding groove that matches the annular sealing ring.

[0011] As an optional implementation of the above technical solution, the power device is mounted on the heat sink by screws.

[0012] As an optional implementation of the above technical solution, the bottom surface of the heat dissipation channel is provided with a support plate, the support plate abuts against the heat dissipation column of the power device, and the end of the support plate is provided with a first guide slope.

[0013] As an optional implementation of the above technical solution, the surface of the radiator is provided with two heat dissipation grooves, and a flow guiding structure is provided between the two heat dissipation grooves.

[0014] As an optional implementation of the above technical solution, the flow guiding structure includes a flow guiding protrusion, which is disposed on the top surface of the heat dissipation channel, and the end of the flow guiding protrusion is provided with a second flow guiding slope.

[0015] As an optional implementation of the above technical solution, the coolant is cold water.

[0016] The beneficial effects of this utility model are as follows:

[0017] This invention provides a heat dissipation structure for power devices. The heat sink surface has several heat dissipation grooves communicating with heat dissipation channels. The power device is mounted on the heat sink, and the heat dissipation column of the power device extends into the heat dissipation grooves. A sealing element is provided between the power device and the heat sink. This invention directly immerses the heat dissipation part of the power device in coolant, allowing direct heat exchange between the heat dissipation part and the coolant. This effectively solves the heat dissipation problem of silicon carbide in high-power devices, improving the product's heat dissipation performance and operational reliability. This invention can be applied to new energy vehicles, improving driving range and power performance; it can be applied in the industrial field, reducing equipment failure rates and improving production efficiency; and it can be applied in data centers, reducing server temperature, improving operating efficiency, and reducing energy consumption. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the power device in one embodiment of the present invention;

[0019] Figure 2 This is a three-dimensional structural diagram of the heat dissipation structure in one embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the internal structure of the heat dissipation structure in one embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the diversion mechanism in one embodiment of the present invention;

[0022] Figure 5 This is a diagram showing the usage state of the heat dissipation structure in one embodiment of this utility model;

[0023] Figure 6 This is a flow diagram of the coolant in one embodiment of this utility model.

[0024] In the diagram: 1-Radiator; 2-Heat dissipation channel; 3-Front liquid collection area; 4-Rear liquid collection area; 5-Flow divider mechanism; 6-Heat dissipation groove; 7-Flow divider block; 8-Flow divider hole; 9-Inlet pipe; 10-Outlet pipe; 11-Annular sealing ring; 12-Support plate; 13-Flow guide protrusion; 14-Power device; 15-Heat dissipation column. Detailed Implementation

[0025] like Figures 1-6As shown, this embodiment provides a heat dissipation structure for a power device 14, including a heat sink 1. The heat sink 1 has a liquid inlet and a liquid outlet, which are located at opposite ends of the heat sink 1. The liquid inlet is connected to an inlet pipe 9, and the liquid outlet is connected to an outlet pipe 10. The heat sink 1 has a heat dissipation channel 2 inside, with a front liquid collection area 3 and a rear liquid collection area 4 at opposite ends. The front liquid collection area 3 communicates with the liquid inlet and has a flow-dividing mechanism 5 for dispersing the coolant. The rear liquid collection area 4 communicates with the liquid outlet. The surface of the heat sink 1 has several heat dissipation grooves 6 communicating with the heat dissipation channel 2. The power device 14 is mounted on the heat sink 1 with screws. The heat dissipation column 15 of the power device 14 extends into the heat dissipation groove 6. A sealing element is provided between the power device 14 and the heat sink 1 to prevent coolant leakage.

[0026] In this embodiment, the coolant is cold water. Figure 2 and Figure 3 As shown, the coolant enters the front collection zone 3 from the inlet. Under the action of the diversion mechanism 5, the coolant is dispersed into the heat dissipation channel 2. Then, the coolant comes into contact with the power device 14 in the heat dissipation tank 6, carries away the heat of the power device 14, and enters the rear collection zone 4. Finally, it is discharged from the outlet.

[0027] This invention directly immerses the heat dissipation portion of the power device 14 in the coolant, allowing direct heat exchange between the heat dissipation portion and the coolant. This effectively solves the heat dissipation problem of the high-power silicon carbide device 14, improving the product's heat dissipation performance and operational reliability. This invention can be applied to new energy vehicles, improving driving range and power performance; it can be applied in the industrial field, reducing equipment failure rates and increasing production efficiency; and it can be applied in data centers, reducing server temperature, improving operating efficiency, and reducing energy consumption.

[0028] like Figure 4 As shown, specifically, the flow distribution mechanism 5 includes a flow distribution block 7, on which a plurality of flow distribution holes 8 are uniformly provided. The flow distribution mechanism 5 adopts a multi-stage flow channel structure, which distributes the coolant evenly into the heat dissipation channel 2 through the plurality of flow distribution holes 8, thereby achieving uniform distribution of coolant in the heat dissipation tank 6, effectively reducing the temperature difference between chips and improving the uniformity of heat dissipation.

[0029] The radiator 1 is made of copper, and its surface is plated with a nickel layer. The use of copper with nickel plating in this invention improves the heat transfer performance of the radiator 1 and reduces the corrosion of the material by the coolant.

[0030] like Figure 2As shown, in one specific embodiment, the sealing element includes an annular sealing ring 11, and the surface of the heat sink 1 has an insertion groove adapted to the annular sealing ring 11. The annular sealing ring 11 is located around the heat dissipation portion of the power device 14, sealing the power device 14 and the heat sink 1 to prevent coolant leakage.

[0031] like Figure 3 As shown, the bottom surface of the heat dissipation channel 2 is provided with a support plate 12, which abuts against the heat dissipation column 15 of the power device 14. The end of the support plate 12 is provided with a first guiding slope. The surface of the radiator 1 can be provided with a certain number of heat dissipation grooves 6 as needed. In this embodiment, the surface of the radiator 1 has two heat dissipation grooves 6, and a guiding structure is provided between the two heat dissipation grooves 6. Specifically, the guiding structure includes a guiding protrusion 13, which is disposed on the top surface of the heat dissipation channel 2. The end of the guiding protrusion 13 is provided with a second guiding slope. The first and second guiding slopes reduce the flow resistance of the coolant, facilitating the circulation of the coolant.

[0032] like Figure 1 As shown, in the prior art, the new high-power device SiC (silicon carbide) has a switching control frequency that is more than 10 times higher than that of the traditional IGBT. Therefore, the heat sink of the SiC device itself has been designed with adjustments: the bottom of the power device 14 is cylindrical (heat sink 15) and is no longer a smooth and flat copper plate. As a result, the SiC device cannot be attached to the original water-cooled heat sink base plate, and the original heat dissipation structure cannot carry away the heat. This technology no longer meets the requirements, and a new heat dissipation structure needs to be designed.

[0033] like Figure 5 and Figure 6 As shown, the overall design concept of the new heat dissipation structure is as follows: A rectangular heat dissipation slot 6, roughly the same size as the power device 14, is created on the heat sink 1 and filled with circulating cooling water. The heat dissipation column 15 of the power device 14 is embedded in the heat dissipation slot 6, and the heat dissipation part of the power device 14 is directly immersed in the cooling water. This direct connection between the heat dissipation part and the cooling water greatly improves the heat dissipation effect of the power device 14. Ensuring airtightness is crucial for this design; therefore, the seal between the power device 14 and the heat sink 1 is critical. Poor sealing could lead to leakage during operation, potentially causing a short circuit and pipe bursting, resulting in significant losses. To avoid this problem, a comprehensive design considering materials, water channels, and other factors is required.

[0034] 1. Material selection: The heat sink 1 is made of copper with nickel plating, which makes the heat sink 1 have better heat transfer effect and reduces the corrosion of the material by the coolant.

[0035] 2. Water channel design: A multi-stage flow channel structure is adopted to evenly distribute the coolant into the heat dissipation channel 2 through multiple flow holes 8, so that the water flow into the heat dissipation channel 2 is balanced, and the coolant is evenly distributed in the heat dissipation tank 6, which effectively reduces the temperature difference between chips and improves the temperature uniformity.

[0036] 3. Sealing design: The power device 14 and the heat sink 1 are sealed by an annular sealing ring 11 and screws, so that it can operate under a water pressure of 2MPa for a long time and ensure its safety.

[0037] In this description of the utility model, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. They can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model. Furthermore, the specific features and structures described in the embodiments are included in at least one implementation method. Those skilled in the art can combine features from different implementation methods without contradiction. The scope of protection of this utility model is not limited to the specific implementation methods described above. Based on the basic technical concept of this utility model, implementation methods that can be conceived by those skilled in the art without creative effort are all within the scope of protection of this utility model.

Claims

1. A heat dissipation structure of a power device comprising a heat sink (1), characterized in that, The radiator (1) is provided with an inlet and an outlet, and a heat dissipation flow channel (2) is arranged in the radiator (1), the two ends of the heat dissipation flow channel (2) are respectively provided with a front liquid collecting area (3) and a rear liquid collecting area (4), the front liquid collecting area (3) is communicated with the inlet, the front liquid collecting area (3) is provided with a flow dividing mechanism (5) for dividing the cooling liquid, the rear liquid collecting area (4) is communicated with the outlet; a plurality of heat dissipation grooves (6) communicated with the heat dissipation flow channel (2) are arranged on the surface of the radiator (1), a power device (14) is arranged on the radiator (1), a heat dissipation column (15) of the power device (14) extends into the heat dissipation groove (6), and a sealing element is arranged between the power device (14) and the radiator (1).

2. The heat dissipating structure of a power device according to claim 1, wherein The flow dividing mechanism (5) comprises a flow dividing block (7), and a plurality of flow dividing holes (8) are uniformly arranged on the flow dividing block (7).

3. The heat dissipating structure of a power device according to claim 1, wherein The radiator (1) is made of red copper, and a nickel plating layer is arranged on the surface of the radiator (1).

4. The heat dissipating structure of a power device according to Claim 1, wherein The inlet is connected with an inlet pipe (9), and the outlet is connected with an outlet pipe (10).

5. The heat dissipating structure of a power device according to Claim 1, wherein The sealing element comprises an annular sealing ring (11), and an embedding groove adapted to the annular sealing ring (11) is arranged on the surface of the radiator (1).

6. The heat dissipating structure of a power device according to Claim 1, wherein The power device (14) is arranged on the radiator (1) by means of screws.

7. The heat dissipating structure of a power device according to Claim 1, wherein A support plate (12) is arranged on the bottom surface of the heat dissipation flow channel (2), the support plate (12) is in abutment with the heat dissipation column (15) of the power device (14), and a first flow guiding inclined surface is arranged at the end of the support plate (12).

8. The heat dissipating structure of a power device according to claim 7, wherein Two heat dissipation grooves (6) are arranged on the surface of the radiator (1), and a flow guiding structure is arranged between the two heat dissipation grooves (6).

9. The heat dissipating structure of a power device according to claim 8, wherein The flow guiding structure comprises a flow guiding protrusion (13), the flow guiding protrusion (13) is arranged on the top surface of the heat dissipation flow channel (2), and a second flow guiding inclined surface is arranged at the end of the flow guiding protrusion (13).

10. The heat dissipating structure of a power device according to Claim 1, wherein The cooling liquid is cold water.

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