Semiconductor substrate cleaning agent proportioning device

By designing a semiconductor substrate cleaning agent mixing device, a motor-driven rotating rod and turntable are used to quantitatively add ingredients, and a stirring rod and stirring blades are used to ensure uniform mixing of components. This solves the problems of cumbersome and low-precision traditional manual operation, and improves the mixing accuracy and cleaning effect of the cleaning agent.

CN223988357UActive Publication Date: 2026-03-13SUZHOU JIMCEL ELECTRONICS NEW MATERIAL
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-18
Publication Date
2026-03-13

AI Technical Summary

Technical Problem

The traditional semiconductor substrate cleaning agent mixing process relies on manual operation, which is cumbersome, inefficient, and makes it difficult to achieve accurate mixing, thus affecting the quality and effectiveness of the cleaning agent.

Method used

A semiconductor substrate cleaning agent mixing device was designed. The device uses a motor-driven rotating rod and turntable to add ingredients in a quantitative manner, and a stirring rod and stirring blades to ensure uniform mixing of the components. The device also uses a motor-driven rotating shaft and stirring blades for stirring to ensure accurate and uniform mixing.

Benefits of technology

It achieves precise proportioning and uniform mixing of cleaning agent components, improving the quality and cleaning effect of the cleaning agent, avoiding component stratification or sedimentation, and enhancing the overall quality of the product.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of cleaning agent proportioning, and discloses a semiconductor substrate cleaning agent proportioning device which comprises a supporting frame, a processing box is fixedly connected to the interior of the supporting frame, a supporting plate is fixedly connected to the interior of the processing box, and fixing frames are fixedly connected to the two sides of the upper portion of the supporting plate. Storage tanks are fixedly connected to the opposite sides of the two fixing frames, circular plates are fixedly connected to the interiors of the storage tanks, second motors are fixedly connected to the upper portions of the circular plates, rotating rods are fixedly connected to the output ends of the second motors, rotating discs are fixedly connected to the bottoms of the rotating rods, and baffles are fixedly connected to the upper portions of the rotating discs; and a supporting plate is fixedly connected to the interior of the storage tank. According to the device disclosed by the utility model, ingredients can be quantitatively added, accurate and consistent component proportion of a cleaning agent prepared each time can be ensured, the ingredients can be effectively stirred, and uniform distribution of all the components is ensured.
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Description

Technical Field

[0001] This utility model relates to the field of cleaning agent proportioning technology, and in particular to a semiconductor substrate cleaning agent proportioning device. Background Technology

[0002] Semiconductor substrates, also known as semiconductor substrates, are the fundamental materials in semiconductor device manufacturing. They are typically made of single-crystal silicon or other semiconductor materials and serve as the physical basis for other semiconductor devices, providing a platform for supporting and electrically connecting the various layers of the semiconductor device. In the semiconductor industry, substrate cleaning is a crucial step in ensuring the performance and reliability of semiconductor devices. As an indispensable chemical agent in the cleaning process, the accuracy of the formulation of the cleaning agent has a vital impact on the cleaning effect; therefore, a semiconductor substrate cleaning agent mixing device is required.

[0003] Traditional semiconductor substrate cleaning agent mixing processes largely rely on manual operation, which is not only cumbersome and inefficient but also prone to mixing errors, thus affecting the quality of the cleaning agent and the cleaning effect. In the semiconductor device manufacturing process, the requirements for cleaning agent mixing are becoming increasingly stringent, requiring precise control of the proportions of various chemical components to ensure that the cleaning agent can effectively remove contaminants from the substrate. However, in manual mixing, it is often difficult to achieve accurate mixing due to individual differences in operators, environmental factors, and equipment precision issues. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a semiconductor substrate cleaning agent proportioning device, which aims to improve the problem that the existing semiconductor substrate cleaning agent proportioning device cannot add ingredients quantitatively.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor substrate cleaning agent mixing device, comprising a support frame, a processing box fixedly connected inside the support frame, a support plate fixedly connected inside the processing box, fixed frames fixedly connected to both sides of the upper part of the support plate, a storage tank fixedly connected to one side of each of the two fixed frames, a circular plate fixedly connected inside the storage tank, a second motor fixedly connected to the upper part of the circular plate, a rotating rod fixedly connected to the output end of the second motor, a turntable fixedly connected to the bottom of the rotating rod, a baffle fixedly connected to the upper part of the turntable, a support plate fixedly connected inside the storage tank, a feed pipe fixedly connected inside the support plate, and a baffle slidably connected to the bottom of the feed pipe.

[0006] Furthermore, a pad is fixedly connected to the right side of the processing box, a motor is fixedly connected to the upper part of the pad, a rotating shaft is fixedly connected to the output end of the motor, stirring rods are fixedly connected to the outer periphery of the rotating shaft, and stirring blades are fixedly connected to the outer periphery of the rotating shaft.

[0007] Furthermore, a limiting groove is formed inside the tray, and a limiting rod is fixedly connected to the upper part of the turntable, with the limiting rod slidably connected inside the limiting groove.

[0008] Furthermore, the turntable is rotatably connected to the inside of the storage tank, and the baffle is rotatably connected to the bottom of the tray.

[0009] Furthermore, a connecting pipe is fixedly connected inside the turntable, and the connecting pipe is located at the lower part of the feed pipe.

[0010] Furthermore, multiple stirring rods and stirring blades are rotatably connected inside the processing box, and a discharge pipe is fixedly connected to the bottom of the processing box.

[0011] Furthermore, the feed pipe is inserted inside the circular plate.

[0012] Furthermore, a discharge pipe is fixedly connected to the bottom of the storage tank, and the discharge pipe is inserted inside the support plate.

[0013] This utility model has the following beneficial effects:

[0014] 1. In this utility model, the cleaning agent is injected through the feed pipe, the second motor is started, driving the rotating rod and turntable to rotate, thereby causing the baffle to rotate and move away, and the ingredients are discharged through the connecting pipe, so that the ingredients can be added quantitatively, ensuring the accurate proportion of cleaning agent components and improving the overall quality of the product.

[0015] 2. In this utility model, by starting motor one, the rotating shaft, stirring rod and blades are driven to rotate, and the ingredients are stirred until uniform, so as to achieve effective stirring, prevent stratification and sedimentation, and improve the cleaning effect. Attached Figure Description

[0016] Figure 1 This is a front view of a semiconductor substrate cleaning agent mixing device proposed in this utility model;

[0017] Figure 2 This is a top view of a semiconductor substrate cleaning agent mixing device proposed in this utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of the processing box of a semiconductor substrate cleaning agent proportioning device proposed in this utility model;

[0019] Figure 4 This is a schematic diagram of the internal structure of the storage tank of a semiconductor substrate cleaning agent proportioning device proposed in this utility model.

[0020] Legend:

[0021] 1. Support frame; 2. Processing box; 3. Pad plate; 4. Motor 1; 5. Rotating shaft; 6. Stirring rod; 7. Stirring blade; 8. Discharge pipe; 9. Support plate; 10. Fixing frame; 11. Storage tank; 12. Feed pipe; 13. Motor 2; 14. Rotating rod; 15. Turntable; 16. Baffle; 17. Limiting rod; 18. Limiting groove; 19. Connecting pipe; 20. Circular plate; 21. Support plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Reference Figure 1 , Figure 2 and Figure 4 This utility model provides an embodiment of a semiconductor substrate cleaning agent mixing device, comprising a support frame 1, a processing box 2 fixedly connected inside the support frame 1, a support plate 9 fixedly connected inside the processing box 2, and fixed frames 10 fixedly connected to both sides of the upper part of the support plate 9. Storage tanks 11 are fixedly connected to opposite sides of the two fixed frames 10. A circular plate 20 is fixedly connected inside the storage tank 11, a second motor 13 is fixedly connected to the upper part of the circular plate 20, a rotating rod 14 is fixedly connected to the output end of the second motor 13, a turntable 15 is fixedly connected to the bottom of the rotating rod 14, and a baffle 16 is fixedly connected to the upper part of the turntable 15. The storage tank 11 is fixedly... A support plate 21 is fixedly connected, and a feed pipe 12 is fixedly connected inside the support plate 21. A baffle 16 is slidably connected to the bottom of the feed pipe 12. A limiting groove 18 is opened inside the support plate 21. A limiting rod 17 is fixedly connected to the upper part of the turntable 15. The limiting rod 17 is slidably connected inside the limiting groove 18. The turntable 15 is rotatably connected to the inside of the storage tank 11. The baffle 16 is rotatably connected to the bottom of the support plate 21. A connecting pipe 19 is fixedly connected inside the turntable 15. The connecting pipe 19 is located at the lower part of the feed pipe 12. The feed pipe 12 passes through the inside of the circular plate 20. A discharge pipe is fixedly connected to the bottom of the storage tank 11. The discharge pipe passes through the inside of the support plate 9.

[0024] The cleaning agent is slowly injected through the feed pipe 12. After an appropriate amount of the agent is added, the motor 13 is started, and its output end drives the rotating rod 14 to rotate. The rotation of the rotating rod 14 further drives the turntable 15 to move. As the turntable 15 rotates, the limiting rod 17 connected to the turntable 15 slides smoothly in the limiting groove 18. The limiting rod 17 is a control rod that is connected to the turntable 15 and slides in the limiting groove 18 to control the movement range and position of the baffle 16. The limiting groove 18 is a groove-shaped structure that provides guidance for the limiting rod 17, ensuring that the movement trajectory of the limiting rod 17 is accurate. Under the precise control of the limiting rod 17, the turntable 15 guides the baffle 16 to rotate. The baffle 16 gradually moves away from the bottom of the feed pipe 12, allowing the connecting pipe 19 to rotate to directly below the bottom of the feed pipe 12, so that the agent in the feed pipe 12 can be smoothly discharged through the connecting pipe 19. Subsequently, the agent is transported to the processing box 2 through the discharge pipe.

[0025] Reference Figure 1 and Figure 3 A pad 3 is fixedly connected to the right side of the processing box 2. A motor 4 is fixedly connected to the upper part of the pad 3. A rotating shaft 5 is fixedly connected to the output end of the motor 4. Stirring rods 6 are fixedly connected to the outer periphery of the rotating shaft 5. Stirring blades 7 are fixedly connected to the outer periphery of the rotating shaft 5. Multiple stirring rods 6 and stirring blades 7 are rotatably connected inside the processing box 2. A discharge pipe 8 is fixedly connected to the bottom of the processing box 2.

[0026] The processing tank 2 is the main container for mixing and stirring the cleaning agent ingredients. The ingredients are stirred and mixed in this container to ensure uniform composition. Once the ingredients are introduced into the processing tank 2, the motor 4 starts immediately, and its output end activates the rotating shaft 5, driving the stirring rod 6 and stirring blade 7 to rotate together. Once the stirring process is completed, the homogenized cleaning agent is discharged through the discharge pipe 8.

[0027] Working principle: First, the cleaning agent is poured in through the feed pipe 12. After a certain amount of the agent is poured in, the second motor 13 is started. The output end of the second motor 13 drives the rotating rod 14 to rotate, which in turn drives the turntable 15 to rotate. When the turntable 15 rotates, it causes the limiting rod 17 to slide inside the limiting groove 18. Under the action of the limiting rod 17, the turntable 15 drives the baffle 16 to rotate, causing the baffle 16 to move away from the bottom of the feed pipe 12. The connecting pipe 19 then rotates to the bottom of the feed pipe 12. Next, the agent inside the feed pipe 12 can be discharged through the connecting pipe 19 and transported to the processing box through the discharge pipe. Inside the processing tank 2, the ingredients can be added in precise quantities, ensuring that the proportions of the cleaning agent components are accurate and consistent each time, thus improving the overall quality of the product. After the ingredients enter the processing tank 2, the motor 4 is started. The output of the motor 4 drives the rotating shaft 5 to rotate. The rotation of the rotating shaft 5 drives the stirring rod 6 and the stirring blade 7 to rotate synchronously. The stirring rod 6 and the stirring blade 7 rotate to stir the ingredients. Finally, the stirred cleaning agent is discharged through the discharge pipe 8, which effectively stirs the ingredients, ensures that all components are evenly distributed, avoids component stratification or sedimentation, and improves the cleaning effect of the cleaning agent.

[0028] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor substrate cleaning agent proportioning device comprising a support frame (1), characterized in that: The inside of the support frame (1) is fixedly connected with a processing box (2), the inside of the processing box (2) is fixedly connected with a support plate (9), the upper two sides of the support plate (9) are fixedly connected with a fixed frame (10), the opposite sides of the two fixed frames (10) are fixedly connected with a storage tank (11), the inside of the storage tank (11) is fixedly connected with a round plate (20), the upper part of the round plate (20) is fixedly connected with a motor two (13), the output end of the motor two (13) is fixedly connected with a rotating rod (14), the bottom of the rotating rod (14) is fixedly connected with a rotating disc (15), the upper part of the rotating disc (15) is fixedly connected with a baffle (16), the inside of the storage tank (11) is fixedly connected with a supporting plate (21), the inside of the supporting plate (21) is fixedly connected with a feeding pipe (12), the baffle (16) is slidingly connected at the bottom of the feeding pipe (12).

2. The semiconductor substrate cleaning agent proportioning device according to claim 1, characterized in that: The right part of the processing box (2) is fixedly connected with a backing plate (3), the upper part of the backing plate (3) is fixedly connected with a motor one (4), the output end of the motor one (4) is fixedly connected with a rotating shaft (5), the outer four sides of the rotating shaft (5) are fixedly connected with stirring rods (6), the outer four sides of the rotating shaft (5) are fixedly connected with stirring blades (7).

3. The semiconductor substrate cleaning agent proportioning device of claim 1, wherein: The inside of the supporting plate (21) is provided with a limiting groove (18), the upper part of the rotating disc (15) is fixedly connected with a limiting rod (17), the limiting rod (17) is slidingly connected in the inside of the limiting groove (18).

4. The semiconductor substrate cleaning agent proportioning device according to claim 1, characterized in that: The rotating disc (15) is rotatably connected in the inside of the storage tank (11), and the baffle (16) is rotatably connected at the bottom of the supporting plate (21).

5. The semiconductor substrate cleaning agent proportioning device of claim 1, wherein: The inside of the rotating disc (15) is fixedly connected with a connecting pipe (19), and the connecting pipe (19) is arranged at the lower part of the feeding pipe (12).

6. The semiconductor substrate cleaning agent proportioning device according to claim 2, characterized in that: The inside of the processing box (2) is rotatably connected with a plurality of stirring rods (6) and stirring blades (7), and the bottom of the processing box (2) is fixedly connected with a discharge pipe (8).

7. The semiconductor substrate cleaning agent proportioning device of claim 1, wherein: The feeding pipe (12) penetrates in the inside of the round plate (20).

8. The semiconductor substrate cleaning agent proportioning device of claim 1, wherein: The bottom of the storage tank (11) is fixedly connected with a discharging pipe, and the discharging pipe penetrates in the inside of the support plate (9).