Injection mold for middle frame of notebook computer

Abstract

The utility model discloses an injection mold for a middle frame of a notebook computer, which belongs to the technical field of injection molds and comprises a base, a lower mold, an upper mold and a cooling component. The cooling assembly comprises a water cooling cavity, one side of the water cooling cavity is located at the top of the base and communicates with a water cooling box through a pipeline, an air cooling mechanism is arranged at the top of the water cooling box, a refrigeration mechanism is arranged on one side of the air cooling mechanism, and the other side of the water cooling cavity communicates with a water return mechanism; the water cooling cavity, the water cooling box, the air cooling mechanism, the refrigeration mechanism and the water return mechanism are used in cooperation, efficient heat dissipation of the injection mold can be achieved through two cooling heat dissipation modes of air cooling and water cooling, and compared with single air cooling heat dissipation in a comparison file, the device reduces the injection molding period, improves the injection molding efficiency and reduces the production cost. And the production efficiency of injection molding of the middle frame of the notebook computer is improved.

Description

Technical Field

[0001] This utility model relates to the field of injection mold technology, specifically to an injection mold for the mid-frame of a laptop computer. Background Technology

[0002] Injection molds are tools used to produce plastic products; they also give plastic products their complete structure and precise dimensions. Injection molding is a processing method used for the mass production of certain complex-shaped parts. Specifically, it refers to injecting molten plastic into a mold cavity under high pressure using an injection molding machine, and then cooling and solidifying it to obtain the molded product. Injection molds are classified into two types according to molding characteristics: thermosetting plastic molds and thermoplastic plastic molds; according to molding process: transfer molds, blow molds, casting molds, thermoforming molds, hot press molds (compression molds), injection molds, etc. Among them, hot press molds can be further divided into three types according to overflow method: overflow type, semi-overflow type, and non-overflow type; injection molds can be divided into two types according to gating system: cold runner molds and hot runner molds; and according to loading and unloading method: movable type and fixed type.

[0003] Chinese Patent Publication No. CN222387503U discloses an injection mold for a laptop computer top cover, including a demolding assembly for quick demolding of the laptop computer top cover. The demolding assembly is provided in two sets and is symmetrically arranged. The side of the demolding assembly is provided with a transmission assembly for providing power to the demolding assembly. The bottom of the transmission assembly is provided with an air-cooling assembly for cooling the laptop computer top cover after demolding.

[0004] The injection mold for the laptop top cover involved in the above patent still has some obvious shortcomings in actual use. The injection mold is cooled by air, but its heat dissipation method is singular and the effect is generally poor, resulting in low injection efficiency and affecting the production efficiency of the injection-molded laptop frame. Therefore, we need to propose an injection mold for the laptop frame. Utility Model Content

[0005] The purpose of this invention is to provide an injection mold for the mid-frame of a laptop computer, which has the advantages of both air cooling and water cooling for heat dissipation, thereby solving the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an injection mold for a laptop computer frame, comprising a base, a lower mold, an upper mold, and a cooling assembly, wherein the lower mold is disposed on the top of the base, the upper mold is disposed above the lower mold, and a cooling assembly for cooling the lower mold is disposed on one side of the lower mold and located on the top of the base.

[0007] The cooling assembly includes a water-cooling cavity located at the lower end of the lower mold. A water-cooling box is connected to one side of the water-cooling cavity and the top of the base via a pipe. An air-cooling mechanism for air-cooling the injection molded part is provided on the top of the water-cooling box. A refrigeration mechanism for cooling the liquid inside the water-cooling box is provided on one side of the air-cooling mechanism. A water return mechanism for returning the liquid to the inside of the water-cooling box is connected to the other side of the water-cooling cavity.

[0008] Preferably, the air-cooling mechanism includes an air outlet chamber located at one end of the top of the water-cooled box, a fan is installed inside the air outlet chamber, a protective grille is fixedly installed on one side of the fan and at one end of the air outlet chamber, and the other end of the air outlet chamber is connected to the refrigeration mechanism.

[0009] Preferably, the refrigeration mechanism includes a semiconductor cooler disposed above the water-cooled box, the bottom of the semiconductor cooler is connected to a three-way pipe, and the other two ends of the three-way pipe are respectively connected to the interior of the water-cooled box and one end of the air outlet chamber.

[0010] Preferably, the water return mechanism includes a water pump located on one side of the water-cooled box. One end of the water pump is connected to the water-cooled box via a pipe. A water return pipe is connected to one side of the water pump. One end of the water return pipe is connected to the interior of the water-cooled cavity. Several sets of heat dissipation fins are uniformly fixedly installed on the surface of the water return pipe.

[0011] Preferably, a fixing component for fixing the lower mold is provided between the bottom end of the lower mold and the top end of the base;

[0012] The fixing component includes a fixing groove formed on the top of the base. The interior of the fixing groove is adapted to the bottom end of the lower mold. A fixing mechanism is provided between the fixing groove and the lower mold, and the lower mold is installed inside the fixing groove through the fixing mechanism.

[0013] Preferably, the fixing mechanism includes four sets of fixing blocks fixedly installed on both sides of the fixing groove and located on the top of the base, and a fixing rod is provided on one side of each fixing block.

[0014] Preferably, the fixing mechanism further includes four sets of fixing holes opened at the lower ends of both sides of the lower mold. The interior of the fixing holes is adapted to one end of the fixing rod, and one end of the fixing rod passes through one side of the fixing block and extends to the other side of the fixing block to be threadedly connected to the inner cavity of the fixing hole.

[0015] Preferably, the top of the upper mold and the base are provided with a closing component for controlling the closing between the upper mold and the lower mold;

[0016] The closing assembly includes four sets of support rods fixedly installed on the top of the base. A top plate is fixedly installed on the top of the four sets of support rods, and a hydraulic cylinder is fixedly installed on the bottom of the top plate. The output end of the hydraulic cylinder is fixedly connected to the top of the upper mold.

[0017] Preferably, four sets of connecting blocks are slidably connected to the surfaces of the four sets of support rods, and one end of each connecting block is fixedly installed at both ends of the upper mold.

[0018] Preferably, four sets of positioning rods are provided at the four corners of the top of the lower mold, and four sets of positioning holes are provided through the four corners of the bottom of the upper mold. The positioning holes are corresponding to the positioning rods, and the upper end of the positioning rods is connected to the inner cavity of the positioning hole.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] This invention utilizes a combination of a water-cooling cavity, a water-cooling box, an air-cooling mechanism, a refrigeration mechanism, and a water return mechanism. The refrigeration mechanism cools the liquid inside the water-cooling box, while the water return mechanism and pipes connect the interior of the water-cooling cavity to the interior of the water-cooling box. This allows for rapid absorption of high temperatures in the core area of ​​the mold through water cooling circulation (especially for thick-walled or complex structures), significantly shortening the main cooling stage time. The refrigeration mechanism then provides cool air to the air-cooling mechanism, allowing for directional airflow cooling after demolding or in specific areas (such as the gate or ribs). This avoids temperature gradients that may result from water cooling alone, achieving dynamic temperature balance. Thus, it utilizes both air cooling and water cooling to achieve efficient heat dissipation for the injection mold. Compared to the single air cooling method in the prior art, this device reduces the injection molding cycle, improves injection efficiency, and enhances the production efficiency of injection-molded laptop frames.

[0021] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of this utility model;

[0023] Figure 2 This is a structural schematic diagram from another perspective of the present invention;

[0024] Figure 3 This is a front view structural diagram of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of the fixing groove of this utility model;

[0026] Figure 5 This is a schematic diagram of the structure of the fan of this utility model.

[0027] In the diagram: 1. Base; 2. Lower mold; 3. Upper mold; 4. Water-cooled cavity; 5. Water-cooled box; 6. Air outlet chamber; 7. Fan; 8. Protective grille; 9. Semiconductor cooler; 10. T-connector; 11. Water pump; 12. Return water pipe; 13. Heat dissipation fins; 14. Fixing groove; 15. Fixing block; 16. Fixing rod; 17. Fixing hole; 18. Support rod; 19. Top plate; 20. Hydraulic cylinder; 21. Connecting block; 22. Positioning rod; 23. Positioning hole. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-5 This utility model provides a technical solution: an injection mold for the middle frame of a laptop computer, including a base 1, a lower mold 2, an upper mold 3, a cooling component, a fixing component, and a closing component.

[0030] like Figure 1-5 As shown, preferably, a lower mold 2 is provided on the top of the base 1, an upper mold 3 is provided above the lower mold 2, a cooling component for cooling the lower mold 2 is provided on one side of the lower mold 2 and on the top of the base 1, a fixing component for fixing the lower mold 2 is provided between the bottom end of the lower mold 2 and the top of the base 1, and a closing component for controlling the closing between the upper mold 3 and the lower mold 2 is provided between the top of the base 1 and the upper mold 3.

[0031] like Figure 1-3 and Figure 5 As shown, preferably, the cooling assembly includes: a water-cooled cavity 4, a water-cooled box 5, an air-cooling mechanism, a refrigeration mechanism, and a water return mechanism. The water-cooled cavity 4 is located at the lower end inside the lower mold 2. The water-cooled cavity 4 is connected to the water-cooled box 5 via a pipe on one side of the water-cooled cavity 4 and at the top of the base 1. The top of the water-cooled box 5 is provided with an air-cooling mechanism for air-cooling the injection molded parts. A refrigeration mechanism for cooling the liquid inside the water-cooled box 5 is provided on one side of the air-cooling mechanism. The other side of the water-cooled cavity 4 is connected to a water return mechanism for returning the liquid to the inside of the water-cooled box 5.

[0032] Specifically, through the coordinated use of water-cooled cavity 4, water-cooled box 5, air-cooling mechanism, refrigeration mechanism, and water return mechanism, the refrigeration mechanism can cool the liquid inside the water-cooled box 5. Then, the water return mechanism and pipes connect the inside of water-cooled cavity 4 with the inside of water-cooled box 5. The high temperature in the core area of ​​the lower mold 2 can be quickly absorbed through water cooling circulation (especially for thick-walled or complex structures), significantly shortening the main cooling stage time. Then, the refrigeration mechanism provides cold air to the air-cooling mechanism, which can supplement the cooling of local areas (such as gates and ribs) after demolding, avoiding the temperature gradient that may be caused by water cooling alone, and achieving dynamic temperature balance. Thus, the injection mold can be efficiently cooled by using both air cooling and water cooling. Compared with the single air cooling in the comparative document, this device reduces the injection molding cycle, improves injection efficiency, and enhances the production efficiency of injection-molded laptop frames.

[0033] like Figure 1-3 and Figure 5 As shown, preferably, the air-cooling mechanism includes: an air outlet chamber 6, a fan 7, and a protective grille 8. The air outlet chamber 6 is located at one end of the top of the water-cooled box 5. The fan 7 is installed inside the air outlet chamber 6. The protective grille 8 is fixedly installed on one side of the fan 7 and at one end of the air outlet chamber 6. The other end of the air outlet chamber 6 is connected to the refrigeration mechanism, which can perform air-cooling heat dissipation on the injection mold.

[0034] like Figure 1-3 and Figure 5 As shown, preferably, the refrigeration mechanism includes a semiconductor cooler 9 and a three-way pipe 10. The semiconductor cooler 9 is located above the water-cooled box 5, and the bottom of the semiconductor cooler 9 is connected to the three-way pipe 10. The other two ends of the three-way pipe 10 are respectively connected to the interior of the water-cooled box 5 and one end of the air outlet 6, which can cool the liquid inside the water-cooled box 5 and provide cold air to the air-cooling mechanism.

[0035] like Figure 1-2 and Figure 5 As shown, preferably, the water return mechanism includes: a water pump 11, a water return pipe 12, and heat dissipation fins 13. The water pump 11 is located on one side of the water-cooled box 5. One end of the water pump 11 is connected to the water-cooled box 5 through a pipe. The water return pipe 12 is connected to one side of the water pump 11. One end of the water return pipe 12 is connected to the inside of the water-cooled cavity 4. Several sets of heat dissipation fins 13 are uniformly fixedly installed on the surface of the water return pipe 12, which can connect the inside of the water-cooled cavity 4 with the inside of the water-cooled box 5, so that the liquid inside the two can circulate.

[0036] like Figure 4As shown, preferably, the fixing component includes a fixing groove 14 and a fixing mechanism. The fixing groove 14 is opened on the top of the base 1. The interior of the fixing groove 14 is adapted to the bottom end of the lower mold 2. A fixing mechanism is provided between the fixing groove 14 and the lower mold 2. The lower mold 2 is installed inside the fixing groove 14 through the fixing mechanism, which can fix the lower mold 2 and prevent the lower mold 2 from shifting position during the injection molding process.

[0037] like Figure 4 As shown, preferably, the fixing mechanism includes: fixing blocks 15, fixing rods 16, and fixing holes 17. Four sets of fixing blocks 15 are fixedly installed on both sides of the fixing groove 14 and located on the top of the base 1. A fixing rod 16 is provided on one side of the fixing block 15. Four sets of fixing holes 17 are opened at the lower ends of both sides of the lower mold 2. The interior of the fixing hole 17 is adapted to one end of the fixing rod 16, and one end of the fixing rod 16 passes through one side of the fixing block 15 and extends to the other side of the fixing block 15 and is threadedly connected to the inner cavity of the fixing hole 17.

[0038] like Figure 1-3 As shown, preferably, the closing assembly includes: support rods 18, top plate 19, hydraulic cylinder 20 and connecting block 21. Four sets of support rods 18 are fixedly installed on the top of the base 1. The top plate 19 is fixedly installed on the top of the four sets of support rods 18. The hydraulic cylinder 20 is fixedly installed on the bottom of the top plate 19, and the output end of the hydraulic cylinder 20 is fixedly connected to the top of the upper mold 3. Four sets of connecting blocks 21 are slidably connected to the surfaces of the four sets of support rods 18, and one end of the connecting block 21 is fixedly installed on both ends of the upper mold 3.

[0039] like Figure 1-4 As shown, preferably, four sets of positioning rods 22 are provided at the four corners of the top of the lower mold 2, and four sets of positioning holes 23 are provided through the four corners of the bottom of the upper mold 3. The positioning holes 23 are corresponding to the positioning rods 22, and the upper end of the positioning rods 22 is connected to the inner cavity of the positioning holes 23, so that the upper mold 3 and the lower mold 2 can be connected vertically.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An injection mold for a notebook computer middle frame, characterized in that: The utility model provides a cooling mechanism for injection mould, it includes base (1), lower mould (2), upper mould (3) and cooling assembly, the top of base (1) is provided with lower mould (2), the top of lower mould (2) is provided with upper mould (3), one side of lower mould (2) and located the top of base (1) is provided with cooling assembly for cooling lower mould (2), The cooling assembly includes water cooling cavity (4) that is arranged at the lower end inside the lower mould (2), one side of the water cooling cavity (4) and located the top of base (1) is communicated with water cooling box (5) through pipeline, the top of water cooling box (5) is provided with air cooling mechanism for air cooling injection molded part, one side of the air cooling mechanism is provided with refrigeration mechanism for refrigeration liquid inside water cooling box (5), the other side of water cooling cavity (4) is communicated with backwater mechanism for backflowing liquid to the inside of water cooling box (5).

2. The injection mold for a notebook computer middle frame according to claim 1, wherein: The air cooling mechanism includes air outlet bin (6) that is arranged at one end of the top of water cooling box (5), the inside of air outlet bin (6) is provided with fan (7), one side of fan (7) and located one end of air outlet bin (6) is fixedly installed with guard grid (8), the other end of air outlet bin (6) is connected with the refrigeration mechanism.

3. The injection mold for a notebook computer middle frame according to claim 2, wherein: The refrigeration mechanism includes semiconductor refrigerator (9) that is arranged above water cooling box (5), the bottom of semiconductor refrigerator (9) is communicated with three-way pipe (10), the other two ends of three-way pipe (10) are communicated with the inside of water cooling box (5) and one end of air outlet bin (6) respectively.

4. The injection mold for a notebook computer middle frame according to claim 1, wherein: The backwater mechanism includes water suction pump (11) that is arranged at one side of water cooling box (5), one end of water suction pump (11) is communicated with water cooling box (5) through pipeline, one side of water suction pump (11) is communicated with backwater pipe (12), one end of backwater pipe (12) is communicated with the inside of water cooling cavity (4), the surface of backwater pipe (12) is uniformly fixedly installed with a plurality of groups of heat dissipation fins (13).

5. The injection mold for a notebook computer middle frame according to claim 1, wherein: The bottom end of lower mould (2) and the top of base (1) are provided with fixing assembly for fixing lower mould (2); The fixing assembly includes fixing groove (14) that is arranged at the top of base (1), the inside of fixing groove (14) is matched with the bottom end of lower mould (2), fixing mechanism is arranged between fixing groove (14) and lower mould (2), and lower mould (2) is installed in the inside of fixing groove (14) through fixing mechanism.

6. The injection mold for a notebook computer middle frame according to claim 5, wherein: The fixing mechanism includes four groups of fixing blocks (15) that are fixedly installed at both sides of fixing groove (14) and located at the top of base (1), one side of fixing block (15) is provided with fixed rod (16).

7. The injection mold for a notebook computer middle frame according to claim 6, wherein: The fixing mechanism further includes four groups of fixing holes (17) that are arranged at the lower end of both sides of lower mould (2), the inside of fixing hole (17) is matched with one end of fixed rod (16), and one end of fixed rod (16) penetrates through one side of fixing block (15) and extends to the other side of fixing block (15) and is screw-connected with the inner cavity of fixing hole (17).

8. The injection mold for a notebook computer middle frame according to claim 1, wherein: The upper die (3) is provided with a closing assembly on the top of the base (1) for controlling the closing between the upper die (3) and the lower die (2); The closing assembly comprises four groups of supporting rods (18) fixedly installed on the top of the base (1), the top of the four groups of supporting rods (18) is fixedly installed with a top plate (19), the bottom of the top plate (19) is fixedly installed with a hydraulic cylinder (20), and the output end of the hydraulic cylinder (20) is fixedly connected with the top of the upper die (3).

9. The injection mold for a notebook computer middle frame according to claim 8, wherein: The surfaces of the four groups of supporting rods (18) are slidably connected with four groups of connecting blocks (21), and one end of the connecting blocks (21) is fixedly installed on both ends of the upper die (3) respectively.

10. The injection mold for a notebook computer middle frame according to claim 1, wherein: Four groups of positioning rods (22) are arranged at the four corners of the top of the lower die (2), four groups of positioning holes (23) are arranged through the bottom of the upper die (3), the positioning holes (23) are arranged in correspondence with the positioning rods (22), and the upper end of the positioning rod (22) is connected with the inner cavity of the positioning hole (23).

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