Thermal management system and vehicle
By using multi-way valve components and liquid pump control in the thermal management system, selective connection between heat exchange circuits is achieved. The waste heat from the electric drive components and the air conditioning system are used to improve the cooling efficiency of the semiconductor vehicle refrigerator, solving the problem of insufficient cooling efficiency in high-temperature environments and reducing energy consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-03-13
AI Technical Summary
Semiconductor-based car refrigerators have insufficient cooling efficiency in high-temperature environments, resulting in slow cooling and temperatures that do not meet expectations.
A thermal management system is adopted, including a semiconductor cooler, a first heat exchange circuit, a second heat exchange circuit, and a third heat exchange circuit. Through multi-way valve assembly and liquid pump control, selective connection and disconnection between heat exchange circuits are realized, and the waste heat of the vehicle's electric drive components and the air conditioning system are used to improve cooling efficiency.
It improves the cooling efficiency of semiconductor-based automotive refrigerators, reduces overall vehicle energy consumption, enhances cooling capabilities in high-temperature environments, and saves energy consumption.
Smart Images

Figure CN223992363U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of vehicle-mounted refrigerator technology, and more particularly to a thermal management system and a vehicle. Background Technology
[0002] Vehicle-mounted refrigerators can use semiconductor chips instead of compressors for cooling and heating, reducing the space occupied by the refrigerator in the vehicle while providing both cooling and heating functions, and at a lower cost. However, at high ambient temperatures, the cooling efficiency of semiconductor chips is insufficient, leading to slow cooling and the refrigerator not reaching the expected temperature. Therefore, improving the cooling efficiency of semiconductor chip-based vehicle-mounted refrigerators while maintaining the size advantage of semiconductor chips has become a technical problem to be solved. Utility Model Content
[0003] This application provides a thermal management system and a vehicle, and is used to improve the cooling efficiency of a semiconductor vehicle refrigerator.
[0004] In a first aspect, this application provides a thermal management system, which includes a semiconductor refrigerator, a first heat exchange circuit, a second heat exchange circuit, and a third heat exchange circuit. The semiconductor refrigerator includes a first heat exchange end and a second heat exchange end. The first heat exchange end is thermally connected to a vehicle refrigerator. The first heat exchange circuit is used to regulate the temperature of the passenger compartment of the vehicle. The second heat exchange circuit is used to exchange heat with the vehicle's electric drive components. The third heat exchange circuit is thermally connected to the second heat exchange end and is capable of exchanging heat with the first heat exchange circuit and / or the second heat exchange circuit to regulate the temperature of the vehicle refrigerator.
[0005] In the thermal management system of this application embodiment, heat is exchanged between the third heat exchange circuit and the first heat exchange circuit and / or the second heat exchange circuit, so that the third heat exchange circuit can use the first heat exchange circuit and / or the second heat exchange circuit to discharge or transfer heat to the vehicle refrigerator, thereby realizing rapid cooling or heating of the vehicle refrigerator.
[0006] In some embodiments, the third heat exchange circuit includes a multi-way valve assembly connected between the second and third heat exchange circuits for selectively connecting or disconnecting the first and / or second heat exchange circuits from the third heat exchange circuit.
[0007] Thus, by connecting the second heat exchange circuit and the third heat exchange circuit through a multi-way valve assembly, and selectively connecting or disconnecting the first heat exchange circuit and / or the second heat exchange circuit with the third heat exchange circuit, one or both of the first heat exchange circuit and the second heat exchange circuit can exchange heat with the third heat exchange circuit, thereby improving the heat dissipation or heat storage conditions of the second heat exchange end, and thus realizing the rapid cooling or heating of the vehicle refrigerator by the first heat exchange end.
[0008] In some embodiments, the first heat exchange circuit includes a compressor, a first heat exchanger, and a second heat exchanger connected in sequence through a first pipeline. The second heat exchanger is used for heat exchange with the external environment. The second heat exchange circuit includes a second pipeline that is thermally connected to the electric drive component. The third heat exchange circuit includes a third pipeline that is thermally connected to the first heat exchanger.
[0009] The multi-way valve assembly includes a first three-way valve and a second three-way valve, which are connected to a second pipeline and a third pipeline. The first three-way valve and the second three-way valve are used to control the connection between the second pipeline and the third pipeline, and to control the on / off state of the third pipeline.
[0010] In this way, by connecting the second and third pipelines through the first and second three-way valves and controlling the opening and closing of the third pipeline, the mode of adjusting the heat exchange between the third heat exchange circuit and the first and second heat exchange circuits can be realized, thereby reducing the complexity of the thermal management system control.
[0011] In some embodiments, the third heat exchange circuit includes a check valve, a first liquid pump, and a third heat exchanger disposed on the third pipeline. The third heat exchanger is thermally connected to the second heat exchange end. The second three-way valve, the check valve, the first liquid pump, the third heat exchanger, and the first three-way valve are connected in sequence through the third pipeline. The first liquid pump is used to pump the heat exchange medium.
[0012] Thus, the third heat exchanger is thermally connected to the second heat exchange end. The second three-way valve, the one-way valve, the first liquid pump, the third heat exchanger, and the first three-way valve are sequentially connected through the third pipeline. The first three-way valve and the second three-way valve control the connection between the second pipeline and the third pipeline. The one-way valve controls the flow direction of the heat exchange medium in the third loop. When the first liquid pump pumps the heat exchange medium, the third loop can draw rapidly cooled heat exchange medium from the second loop, thereby accelerating the heat exchange between the third heat exchanger and the second heat exchange end, and thus improving the cooling efficiency of the first heat exchange end for the vehicle refrigerator.
[0013] In some embodiments, the thermal management system has a first operating mode in which both the first liquid pump and the compressor are started to operate, so that the third heat exchanger can exchange heat with the first heat exchange circuit.
[0014] Thus, in the first operating mode, both the first liquid pump and the compressor are started and running. The first heat exchange circuit uses the compressor and the first heat exchanger to achieve rapid cooling of the heat exchange medium. The first liquid pump can pump the low-temperature heat exchange medium from the first heat exchange circuit through the second heat exchange end, improve the heat dissipation conditions of the second heat exchange end, and thus improve the cooling efficiency of the semiconductor refrigerator.
[0015] In some implementations, the thermal management system has a second operating mode in which one of the first liquid pump and the compressor stops operating, so that the third heat exchange circuit can independently discharge the waste cold or waste heat from the thermoelectric cooler.
[0016] Thus, in the second operating mode, one of the first liquid pump and the compressor stops running, and the third heat exchange circuit does not exchange heat with the second heat exchange circuit or the first heat exchange circuit. It can independently discharge the waste cold or waste heat of the semiconductor refrigerator, thereby saving the vehicle's energy consumption when the vehicle refrigerator is running in steady state.
[0017] In some embodiments, the second heat exchange circuit includes a second liquid pump, and a first three-way valve, an electrically driven component, the second liquid pump, and the second three-way valve are connected in sequence through a second pipeline.
[0018] Thus, by sequentially connecting the first three-way valve, the electric drive component, the second liquid pump, and the second three-way valve through the second pipeline, the second heat exchange circuit can be connected to the third heat exchange circuit and exchange heat when the second liquid pump starts running.
[0019] In some implementations, the thermal management system has a third operating mode in which both the first and second liquid pumps are activated to remove waste heat from the electrically driven components to the thermoelectric cooler.
[0020] Thus, in the third operating mode, both the first and second liquid pumps start running, allowing the waste heat of the electric drive components to be guided and exchanged from the second heat exchange circuit to the third heat exchange circuit, improving the heating efficiency of the semiconductor refrigerator for the vehicle refrigerator, and also helping to improve the resource utilization rate of the whole vehicle.
[0021] In some embodiments, the third pipeline includes a first branch, a second branch, a third branch, and a third heat exchanger. The multi-way valve assembly also includes a four-way valve having a first valve port, a second valve port, a third valve port, and a fourth valve port. The first valve port, the third heat exchanger, and the second valve port are connected sequentially through the first branch. The second branch connects the first three-way valve to the third valve port, and the third branch connects the second three-way valve to the fourth valve port.
[0022] Thus, the first and second valve ports of the four-way valve are connected to the third heat exchange circuit, while the third and fourth valve ports are connected to the first heat exchange circuit via the first three-way valve. Adjusting the internal connection of the four-way valve controls the on / off state of the first, second, and third heat exchange circuits, enabling the semiconductor refrigerator to switch between different operating modes of the vehicle refrigerator. When the four-way valve is manually controlled, the control complexity of the thermal management system can be reduced.
[0023] In some implementations, the thermal management system has a fourth operating mode in which the first valve port is connected to the third valve port and the second valve port is connected to the fourth valve port, so that the third heat exchange circuit is connected in series with the first heat exchanger and the waste heat of the semiconductor cooler is discharged through the second heat exchange circuit.
[0024] Thus, in the fourth operating mode, the first valve port is connected to the third valve port, and the second valve port is connected to the fourth valve port, so that the third heat exchange circuit is connected in series with the first heat exchanger. This allows the second heat exchange circuit to deliver a low-temperature heat exchange medium to the third heat exchange circuit for heat exchange with the second heat exchange end. The high-temperature heat exchange medium formed after heat exchange then returns to the second heat exchange circuit for rapid cooling, improving the heat dissipation efficiency of the second heat exchange end, thereby improving the cooling efficiency of the semiconductor refrigerator for the vehicle refrigerator.
[0025] In some implementations, the thermal management system has a fifth operating mode in which the first valve port is connected to the second valve port and the third valve port is disconnected from the fourth valve port, so that the third heat exchange circuit can independently discharge the waste cold or waste heat from the semiconductor cooler.
[0026] Thus, in the fifth operating mode, the third heat exchange circuit is disconnected from the second and first heat exchange circuits, allowing the waste cold or waste heat from the semiconductor refrigerator to be discharged independently, thereby saving the vehicle's energy consumption during steady-state operation of the vehicle refrigerator.
[0027] In some embodiments, the thermal management system has a sixth operating mode in which the first three-way valve, the electric drive component, and the second three-way valve are connected in sequence through a second pipeline, the first valve port is connected to the third valve port, and the second valve port is connected to the fourth valve port, so as to conduct the waste heat of the electric drive component to the semiconductor cooler.
[0028] Thus, in the sixth working mode, the first three-way valve, the electric drive component, and the second three-way valve are connected in sequence through the second pipeline, the first valve port is connected to the third valve port, and the second valve port is connected to the fourth valve port, so that the second pipeline is connected to the third heat exchange circuit. The electric drive component of the vehicle can be led to the third heat exchange circuit to exchange heat with the second heat exchange end, thereby assisting the semiconductor refrigerator in heating the vehicle refrigerator.
[0029] In some embodiments, the thermal management system includes a fourth heat exchange loop connected in parallel with the second heat exchange loop. The fourth heat exchange loop includes a fourth pipeline and a heat dissipation device and a second heat exchanger connected in sequence through the fourth pipeline. The heat dissipation device is used to exchange heat with the external environment.
[0030] Thus, through the fourth heat exchange circuit and the second heat exchange circuit, and the fourth heat exchange circuit includes a heat dissipation device and a second heat exchanger connected in sequence, the second heat exchange circuit can exchange heat with the fourth heat exchange circuit through the second heat exchanger, and the second heat exchange circuit can be connected to the third heat exchange circuit for heat exchange, thereby indirectly discharging the waste cold or waste heat of the vehicle refrigerator to the external environment.
[0031] In some embodiments, the thermal management system includes a blower located on one side of the second heat exchange end and close to the third heat exchange circuit, the blower being used to blow air to accelerate the cooling of the second heat exchange end.
[0032] In this way, by blowing air on one side of the second heat exchange end through the blower, airflow is generated to dissipate heat, improving the heat dissipation conditions of the second heat exchange end, which in turn helps the first heat exchange end to quickly regulate the temperature of the vehicle refrigerator.
[0033] Secondly, this application provides a vehicle that includes a thermal management system and an electric drive component, which are either drive motors or battery devices, according to any of the above embodiments.
[0034] The vehicle described in this application includes the thermal management system described above, and therefore has all the beneficial effects of the thermal management system provided in this application.
[0035] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description
[0036] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:
[0037] Figure 1 This is a schematic diagram of the thermal management system of some embodiments of this application;
[0038] Figure 2 This is a schematic diagram of the thermal management system of some embodiments of this application in the first working mode;
[0039] Figure 3 This is a schematic diagram of the thermal management system of some embodiments of this application in a fourth working mode;
[0040] Figure 4This is a schematic diagram of the thermal management system of some embodiments of this application in the fifth working mode;
[0041] Figure 5 This is a schematic diagram of the thermal management system of some embodiments of this application in the sixth working mode;
[0042] Figure 6 This is a schematic diagram of the structure of a vehicle according to some embodiments of this application.
[0043] Explanation of key component symbols:
[0044] 100 - Thermal Management System; 10 - First Heat Exchange Circuit; 11 - First Piping; 12 - Compressor; 13 - First Heat Exchanger; 14 - Second Heat Exchanger; 20 - Second Heat Exchange Circuit; 22 - Second Piping; 23 - Second Liquid Pump; 30 - Third Heat Exchange Circuit; 33 - Third Piping; 331 - First Branch; 332 - Second Branch; 333 - Third Branch; 34 - Check Valve; 35 - First Liquid Pump; 36 - Third Heat Exchanger; 40 - Semiconductor Refrigerator; 41 - First Heat Exchange End ; 42-Second heat exchange end; 50-Multi-way valve assembly; 51-First three-way valve; 52-Second three-way valve; 53-Four-way valve; 531-First valve port; 532-Second valve port; 533-Third valve port; 534-Fourth valve port; 60-Fourth heat exchange circuit; 61-Fourth pipeline; 62-Heat dissipation device; 70-Blower; 600-Vehicle refrigerator; 1000-Vehicle; 200-Electric drive component; 300-Drive motor; 400-Controller; 500-Battery device. Detailed Implementation
[0045] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.
[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.
[0047] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.
[0048] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0049] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.
[0050] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).
[0051] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0052] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0053] In recent years, to facilitate users carrying necessary fresh food, medicine, or beverages while traveling, an increasing number of vehicles have been equipped with in-vehicle refrigerators. Currently, in-vehicle refrigerators on the market mainly include two types: semiconductor in-vehicle refrigerators and compressor in-vehicle refrigerators. Compressor in-vehicle refrigerators are similar to household refrigerators, using traditional compressor technology. They require separate compressors, condensers, expansion valves, cooling fans, and sensors, resulting in higher energy consumption and greater space and weight. Semiconductor in-vehicle refrigerators, on the other hand, utilize the Peltier effect generated by current flowing through a semiconductor PN junction structure. This causes one end of the semiconductor to cool while the other end heats up, thus achieving cooling or heating. Combining both cooling and heating functions, they can meet users' diverse storage needs and are more compact and lightweight, helping to reduce the overall vehicle weight and free up more passenger cabin space.
[0054] However, due to the limitations of the technical principles of semiconductor-based automotive refrigerators, their cooling efficiency is generally low. In related technologies, the heat exchanger in the refrigerator's hot water tank can be connected to the vehicle's existing air conditioning heat exchange components or battery cooling system. This allows the refrigerant from these components to flow into the heat exchanger, cooling the semiconductor refrigerant in the hot water tank. A circulating water pump then drives the refrigerant to cool the hot end of the semiconductor cooling element; a lower hot end temperature results in a lower cold end temperature, thus improving the refrigerator's cooling effect. However, in this type of technology, the refrigerator's refrigerant is connected in parallel with the air conditioning heat exchange components or battery cooling system, requiring the addition of an expansion tank and heat exchanger, leading to higher design and manufacturing costs.
[0055] To overcome the above problems, this application proposes a thermal management system for vehicles. The thermal management system includes a semiconductor refrigerator, a first heat exchange circuit, a second heat exchange circuit, and a third heat exchange circuit. The semiconductor refrigerator and the third heat exchange circuit are installed on an on-board refrigerator. The first heat exchange circuit is used to regulate the temperature of the passenger compartment of the vehicle. The second heat exchange circuit is used to exchange heat with the electric drive components of the vehicle. The third heat exchange circuit can exchange heat with the first heat exchange circuit and / or the second heat exchange circuit to quickly regulate the temperature of the on-board refrigerator.
[0056] Please refer to Figures 1 to 3The thermal management system 100 includes a semiconductor refrigerator 40, a first heat exchange circuit 10, a second heat exchange circuit 20, and a third heat exchange circuit 30. The semiconductor refrigerator 40 includes a first heat exchange end 41 and a second heat exchange end 42. The first heat exchange end 41 is thermally connected to the vehicle refrigerator 600. The first heat exchange circuit 10 is used to regulate the temperature of the passenger compartment of the vehicle 1000. The second heat exchange circuit 20 is used to exchange heat with the electric drive components 200 of the vehicle 1000. The third heat exchange circuit 30 is thermally connected to the second heat exchange end 42 and can exchange heat with the first heat exchange circuit 10 and / or the second heat exchange circuit 20 to regulate the temperature of the vehicle refrigerator 600.
[0057] Specifically, when the thermoelectric cooler 40 starts up, heat migrates between the first heat exchange end 41 and the second heat exchange end 42, creating a temperature difference. When the thermoelectric cooler 40 cools the vehicle refrigerator 600, the temperature of the first heat exchange end 41 is lower than the temperature of the second heat exchange end 42. When the thermoelectric cooler 40 heats the vehicle refrigerator 600, the temperature of the first heat exchange end 41 is higher than the temperature of the second heat exchange end 42. The temperatures of the first heat exchange end 41 and the second heat exchange end 42 are mutually restrictive. When the heat exchange efficiency between the second heat exchange end 42 and the third heat exchange circuit 30 increases, the rate of heat migration between the first heat exchange end 41 and the second heat exchange end 42 also increases. Therefore, the cooling / heating efficiency of the vehicle refrigerator 600 can be improved by increasing the heat exchange efficiency of the third heat exchange circuit 30.
[0058] The first heat exchange circuit 10 can be the air conditioning refrigerant circuit of the passenger compartment. In the first heat exchange circuit 10, rapid cooling can be achieved through the heat absorption and release phenomenon of the air conditioning refrigerant during the gas-liquid phase change process.
[0059] The second heat exchange circuit 20 and the third heat exchange circuit 30 can exchange heat through heat exchange media such as coolant and cooling water.
[0060] In the thermal management system 100 of this application embodiment, heat exchange is performed between the third heat exchange circuit 30 and the first heat exchange circuit 10 and / or the second heat exchange circuit 20, so that the third heat exchange circuit 30 can use the first heat exchange circuit 10 and / or the second heat exchange circuit 20 to discharge or transfer heat to the vehicle refrigerator 600, thereby realizing rapid cooling or heating of the vehicle refrigerator 600.
[0061] Please see Figure 1 In some embodiments, the third heat exchange circuit 30 includes a multi-way valve assembly 50 connected between the second heat exchange circuit 20 and the third heat exchange circuit 30, for selectively connecting or disconnecting the first heat exchange circuit 10 and / or the second heat exchange circuit 20 from the third heat exchange circuit 30.
[0062] Specifically, the multi-way valve assembly 50 may include, but is not limited to, a four-way valve 53, a three-way valve, or other valves with multiple ports. The multi-way valve assembly 50 includes at least three sets of interfaces, which are respectively connected to the first heat exchange circuit 10, the second heat exchange circuit 20, and the third heat exchange circuit 30. By controlling the on / off state of the third heat exchange circuit 30 with the first heat exchange circuit 10 and the second heat exchange circuit 20, the heat exchange mode of the third heat exchange circuit 30 can be controlled.
[0063] Thus, the multi-way valve assembly 50 connects the second heat exchange circuit 20 and the third heat exchange circuit 30, and selectively connects or disconnects the first heat exchange circuit 10 and / or the second heat exchange circuit 20 with the third heat exchange circuit 30, thereby allowing one or both of the first heat exchange circuit 10 and the second heat exchange circuit 20 to exchange heat with the third heat exchange circuit 30, thereby improving the heat dissipation or heat storage conditions of the second heat exchange end 42, and thus enabling the first heat exchange end 41 to quickly cool or heat the vehicle refrigerator 600.
[0064] Please see Figure 1 In some embodiments, the first heat exchange circuit 10 includes a compressor 12, a first heat exchanger 13 and a second heat exchanger 14 connected in sequence through a first pipeline 11. The second heat exchanger 14 is used to exchange heat with the external environment. The second heat exchange circuit 20 includes a second pipeline 22, which is thermally connected to the electric drive component 200. The third heat exchange circuit 30 includes a third pipeline 33 that is thermally connected to the first heat exchanger 13.
[0065] The multi-way valve assembly 50 includes a first three-way valve 51 and a second three-way valve 52. The first three-way valve 51 and the second three-way valve 52 are connected to the second pipeline 22 and the third pipeline 33. The first three-way valve 51 and the second three-way valve 52 are used to control the connection between the second pipeline 22 and the third pipeline 33, and to control the on / off state of the third pipeline 33.
[0066] Specifically, the first heat exchange circuit 10, the second heat exchange circuit 20, and the third heat exchange circuit 30 can all use cooling water as the heat exchange medium. The first heat exchanger 13 can be a water-cooled cooler, and the second heat exchanger 14 can be a water-cooled condenser.
[0067] The first three-way valve 51 and the second three-way valve 52 are located between the first heat exchange circuit 10 and the third heat exchange circuit 30, and also between the second heat exchange circuit 20 and the third heat exchange circuit 30. Each of the first three-way valves 51 and 52 has an interface for connecting to the first pipeline 11, an interface for connecting to the second pipeline 22, and an interface for connecting to the third pipeline 33. The interfaces of the first three-way valves 51 and 52 for connecting to the third pipeline 33 can be selectively connected to or disconnected from the third pipeline 33.
[0068] Thus, by connecting the second pipeline 22 and the third pipeline 33 through the first three-way valve 51 and the second three-way valve 52 and controlling the opening and closing of the third pipeline 33, the mode of adjusting the heat exchange between the third heat exchange circuit 30 and the first heat exchange circuit 10 and the second heat exchange circuit 20 can be realized, thereby reducing the complexity of the control of the thermal management system 100.
[0069] Please see Figure 1 and Figure 2 In some embodiments, the third heat exchange circuit 30 includes a one-way valve 34, a first liquid pump 35 and a third heat exchanger 36 disposed on the third pipeline 33. The third heat exchanger 36 is thermally connected to the second heat exchange end 42. The second three-way valve 52, the one-way valve 34, the first liquid pump 35, the third heat exchanger 36 and the first three-way valve 51 are connected in sequence through the third pipeline 33. The first liquid pump 35 is used to pump the heat exchange medium.
[0070] Specifically, the one-way valve 34 is used to control the heat exchange medium in the third heat exchange circuit 30 to maintain a single flow direction. The second three-way valve 52, the one-way valve 34, the first liquid pump 35, the third heat exchanger 36, and the first three-way valve 51 can be connected in a single connection along the flow direction of the heat exchange medium in the third pipeline 33. In this embodiment, the third heat exchange circuit 30 is connected to the first heat exchange circuit 10. When both the first liquid pump 35 and the compressor 12 are running, the heat exchange medium in the first heat exchange circuit 10 can flow to the third heat exchange circuit 30, and the heat exchange medium in the third heat exchange circuit 30 can also flow to the third heat exchange circuit 30. However, when either the first liquid pump 35 or the compressor 12 is not running, the heat exchange medium does not flow between the first heat exchange circuit 10 and the third heat exchange circuit 30.
[0071] Thus, the third heat exchanger 36 is thermally connected to the second heat exchange end 42. The second three-way valve 52, the one-way valve 34, the first liquid pump 35, the third heat exchanger 36, and the first three-way valve 51 are sequentially connected through the third pipeline 33. The first three-way valve 51 and the second three-way valve 52 control the connection between the second pipeline 22 and the third pipeline 33. The one-way valve 34 controls the flow direction of the heat exchange medium in the third loop. When the first liquid pump 35 pumps the heat exchange medium, the third loop can draw the rapidly cooled heat exchange medium from the second loop, thereby accelerating the heat exchange between the third heat exchanger 36 and the second heat exchange end 42, and thus improving the cooling efficiency of the first heat exchange end 41 for the vehicle refrigerator 600.
[0072] Please see Figure 2 , Figure 1 This is a schematic diagram of the thermal management system 100 in a first operating mode according to some embodiments of this application. In some embodiments, the thermal management system 100 has a first operating mode in which both the first liquid pump 35 and the compressor 12 are started and running, so that the third heat exchanger 36 can exchange heat with the first heat exchange circuit 10.
[0073] Specifically, the first three-way valve 51 and the second three-way valve 52 each have one interface that is connected to the second pipeline 22, and each of them has another interface that is connected to the third pipeline 33. With both the first liquid pump 35 and the compressor 12 running, the first heat exchange circuit 10 cools the passenger cabin, and the first heat exchanger 13 can quickly cool the incoming heat exchange medium. The low-temperature heat exchange medium, cooled by the first heat exchanger 13, enters the third pipe 33 through the second pipe 22 and the second three-way valve 52, and flows sequentially through the one-way valve 34 and the third heat exchanger 36 in the third pipe 33 under the pumping of the first liquid pump 35. The low-temperature heat exchange medium flows into the third heat exchanger 36 to exchange heat with the second heat exchange end 42, accelerating the heat dissipation of the second heat exchange end 42. After the temperature of the heat exchange medium rises, it flows out of the third heat exchanger 36 and merges into the first three-way valve 51 along the third pipe 33, flowing back to the first heat exchanger 13 on the second pipe 22, and is cooled again by the first heat exchanger 13 before entering the third pipe 33 to exchange heat with the third heat exchanger 36. The heat exchange medium circulates between the first heat exchange circuit 10 and the third heat exchange circuit 30 to exchange heat. The heat exchange medium is cooled by the compressor 12 and the first heat exchange circuit 10, thereby improving the heat dissipation efficiency of the second heat exchange end 42.
[0074] Thus, in the first working mode, both the first liquid pump 35 and the compressor 12 are started and running. The first heat exchange circuit 10 uses the compressor 12 and the first heat exchanger 13 to achieve rapid cooling of the heat exchange medium. The first liquid pump 35 can pump the low-temperature heat exchange medium from the first heat exchange circuit 10 through the second heat exchange end 42 to improve the heat dissipation conditions of the second heat exchange end 42, thereby improving the cooling efficiency of the semiconductor cooler 40.
[0075] Please see Figure 1 , Figure 1 This is a schematic diagram illustrating the principle of the thermal management system 100 in a second or third operating mode according to some embodiments of this application. In some embodiments, the thermal management system 100 has a second operating mode in which one of the first liquid pump 35 and the compressor 12 stops operating, so that the third heat exchange circuit 30 independently discharges the waste cold or waste heat from the thermoelectric cooler 40.
[0076] Specifically, when the first liquid pump 35 is operating and the compressor 12 is not running, the first heat exchange circuit 10 does not perform heat exchange, and the first liquid pump 35 can accelerate the circulation of the heat exchange medium in the third heat exchange circuit 30. When the compressor 12 is operating and the first liquid pump 35 is not running, the first heat exchange circuit 10 can independently cool or heat the passenger compartment, and the third heat exchange circuit 30 can independently cool or heat the vehicle refrigerator 600. The heat exchange medium in the third pipeline 33 can circulate only in the third heat exchange circuit 30 and is not pumped to the first pipeline 11 to exchange heat with the first heat exchanger 13.
[0077] Thus, in the second operating mode, one of the first liquid pump 35 and the compressor 12 stops operating, and the third heat exchange circuit 30 does not exchange heat with the second heat exchange circuit 20 and the first heat exchange circuit 10. The waste cold or waste heat of the semiconductor refrigerator 40 can be discharged independently, thereby saving the energy consumption of the whole vehicle when the vehicle refrigerator 600 is running in steady state.
[0078] Please see Figure 1 In some embodiments, the second heat exchange circuit 20 includes a second liquid pump 23, and the first three-way valve 51, the electric drive component 200, the second liquid pump 23 and the second three-way valve 52 are connected in sequence through the second pipeline 22.
[0079] Specifically, the three ports of the first three-way valve 51 can be connected to the first pipeline 11, the second pipeline 22, and the third pipeline 33, respectively, and the three ports of the second three-way valve 52 are also connected to the first pipeline 11, the second pipeline 22, and the third pipeline 33, respectively. In the second pipeline 22, the first three-way valve 51, the electric drive component 200, the second liquid pump 23, and the second three-way valve 52 are connected sequentially along the flow direction of the heat exchange medium. The heat exchange medium exchanges heat with the electric drive component 200 and can carry the waste heat of the electric drive component 200 into the third heat exchange circuit 30.
[0080] Thus, the first three-way valve 51, the electric drive component 200, the second liquid pump 23, and the second three-way valve 52 are connected in sequence through the second pipeline 22, so that when the second liquid pump 23 is started, the second heat exchange circuit 20 can be connected to the third heat exchange circuit 30 and perform heat exchange.
[0081] Please see Figure 1 In some embodiments, the thermal management system 100 has a third operating mode in which both the first liquid pump 35 and the second liquid pump 23 are started to operate, so as to exhaust the waste heat of the electrically driven component 200 to the semiconductor cooler 40.
[0082] Specifically, in the third operating mode, the electric drive component 200 may be equipped with a temperature detection device. The temperature detection device is used to detect the temperature of the electric drive component 200 and feed it back to the thermal management system 100. The thermal management system 100 can determine whether the electric drive component 200 has residual heat that can be used by the vehicle refrigerator 600 based on the temperature of the electric drive component 200. The electric drive component 200 may be a drive motor 300 or a battery device 500.
[0083] In the third operating mode, the second liquid pump 23 starts, and the heat exchange medium carrying the waste heat of the electric drive component 200 enters the third heat exchange circuit 30. The first liquid pump 35 starts and pumps the heat exchange medium carrying the waste heat of the electric drive component 200 to the third heat exchanger 36. The heat exchange medium exchanges heat with the second heat exchange end 42 in the third heat exchanger 36, raising the temperature of the second heat exchange end 42, thereby accelerating the transfer of heat from the second heat exchange end 42 to the first heat exchange end 41, and improving the heating efficiency of the vehicle refrigerator 600 by utilizing the waste heat of the electric drive component 200.
[0084] Thus, in the third working mode, both the first liquid pump 35 and the second liquid pump 23 are started and running, so that the waste heat of the electric drive component 200 can be guided and exchanged from the second heat exchange circuit 20 to the third heat exchange circuit 30, thereby improving the heating efficiency of the semiconductor refrigerator 40 for the vehicle refrigerator 600 and also helping to improve the resource utilization rate of the whole vehicle.
[0085] In some implementations, the control method of the thermal management system 100 is as follows:
[0086] (1) The vehicle refrigerator 600 starts and receives the customer's command to cool or heat;
[0087] (2a) If a heating command is received, the vehicle refrigerator 600 operates in heating mode and determines whether the electric drive component 200 can provide residual heat.
[0088] (3a) If there is residual heat in the electric drive component 200 that can be utilized, the first liquid pump 35 and the second liquid pump 23 are started so that the thermal management system 100 operates in the third working mode, utilizing the residual heat of the electric drive component 200 to work in conjunction with the vehicle refrigerator 600 to generate heat, thereby reducing the heating power consumption of the semiconductor cooler 40.
[0089] (4a) If the electric drive component 200 cannot provide waste heat to the vehicle refrigerator 600, the first liquid pump 35 or the second liquid pump 23 is turned off so that the thermal management system 100 operates in the second working mode, the semiconductor cooler 40 heats the vehicle refrigerator 600, and the third heat exchange circuit 30 independently discharges the waste heat from the vehicle refrigerator 600.
[0090] (2b) If a cooling command is received, the vehicle refrigerator 600 operates in cooling mode and determines whether the passenger compartment or battery device 500 has received a cooling / cooling command.
[0091] (3a) If either the passenger compartment or the battery device 500 receives a cooling command, the compressor 12 and the first liquid pump 35 are started to make the thermal management system 100 operate in the first working mode. The compressor starts to operate, and the first heat exchange circuit 10 can cool the passenger compartment or the battery device 500 accordingly. The first heat exchanger 13 generates low-temperature coolant and flows to the third heat exchange circuit 30 to dissipate heat from the second heat exchange end 42. After exchanging heat with the second heat exchange end 42, the high-temperature coolant returns to the second heat exchange circuit 20 to cool down quickly. The newly generated low-temperature coolant circulates into the third heat exchange circuit 30.
[0092] In step (3a), if the passenger cabin receives a cooling command, the compressor 12 adjusts its speed to achieve the target temperature of the passenger cabin; if the battery device 500 receives a cooling command, the compressor 12 adjusts its speed to achieve the target cooling temperature of the battery device 500.
[0093] (4a) If neither the passenger compartment nor the battery unit 500 receives a cooling / cooling command, the compressor 12 stops moving, the first liquid pump 35 can be started or stopped to make the thermal management system 100 operate in the second working mode, the semiconductor cooler 40 cools the vehicle refrigerator 600, and the third heat exchange circuit 30 independently discharges the waste heat of the vehicle refrigerator 600.
[0094] In some embodiments, the vehicle refrigerator 600 is equipped with a temperature detection device. When the thermal management system 100 is operating in a second working mode and the semiconductor cooler 40 is cooling the vehicle refrigerator 600, the temperature detection device detects the actual temperature and the initial temperature of the vehicle refrigerator 600, and compares the difference between the actual temperature and the initial temperature with a set difference value.
[0095] If the difference between the actual temperature and the initial temperature of the vehicle refrigerator 600 is less than or equal to the set difference, the compressor 12 and the first liquid pump 35 are started, and the thermal management system 100 automatically adjusts to the first working mode to accelerate the cooling of the vehicle refrigerator 600 until the difference between the actual temperature and the initial temperature of the vehicle refrigerator 600 is greater than the set difference. Then, the thermal management system 100 adjusts to the second working mode again.
[0096] If the difference between the actual temperature and the initial temperature of the vehicle refrigerator 600 is greater than the set difference, it will continue to operate in the second working mode, and the first liquid pump 35 can stop operating.
[0097] Please see Figures 3 to 4In some embodiments, the third pipeline 33 includes a first branch 331, a second branch 332, a third branch 333, and a third heat exchanger 36. The multi-way valve assembly 50 also includes a four-way valve 53, which has a first valve port 531, a second valve port 532, a third valve port 533, and a fourth valve port 534. The first valve port 531, the third heat exchanger 36, and the second valve port 532 are connected in sequence through the first branch 331. The second branch 332 connects the first three-way valve 51 and the third valve port 533, and the third branch 333 connects the second three-way valve 52 and the fourth valve port 534.
[0098] Specifically, the third heat exchanger 36 can be a plate heat exchanger, and it has an outlet and an inlet for the heat exchange medium to flow in and out. The first branch 331 connects the first valve port 531 to the outlet of the third heat exchanger 36, and the second valve port 532 to the inlet of the third heat exchanger 36. The four-way valve 53 can be a mechanical valve or an electronic valve. The four-way valve 53 internally adjusts the flow between the first valve port 531, the second valve port 532, the third valve port 533, and the fourth valve port 534. The flow between the four valve ports can be automatically controlled by the thermal management system 100 or manually controlled.
[0099] Thus, the first valve port 531 and the second valve port 532 of the four-way valve 53 are connected to the third heat exchange circuit 30, and the third valve port 533 and the fourth valve port 534 are connected to the first heat exchange circuit 10 through the first three-way valve 51. Adjusting the connection within the four-way valve 53 controls the on / off state of the first heat exchange circuit 10, the second heat exchange circuit 20, and the third heat exchange circuit 30, enabling the semiconductor refrigerator 40 to switch between different operating modes of the vehicle refrigerator 600. When the four-way valve 53 is manually controlled, the control complexity of the thermal management system 100 can be reduced.
[0100] Please see Figure 3 In some embodiments, the thermal management system 100 has a fourth operating mode in which the first valve port 531 is connected to the third valve port 533 and the second valve port 532 is connected to the fourth valve port 534, so that the third heat exchange circuit 30 is connected in series with the first heat exchanger 13 and the waste heat of the semiconductor cooler 40 is discharged through the second heat exchange circuit 20.
[0101] Specifically, the first valve port 531 is connected to the third valve port 533, the first branch 331 is connected to the second branch 332, the third pipe 33 is connected to the first three-way valve 51, the second valve port 532 is connected to the fourth valve port 534, the first branch 331 is also connected to the third branch 333, and the third pipe 33 is connected to the second three-way valve 52. Since the first three-way valve 51 and the second three-way valve 52 each have an interface connected to the inlet and outlet of the first heat exchanger 13, the third heat exchange circuit 30 and the first heat exchange circuit 10 are connected in series.
[0102] Optionally, a first liquid pump 35 may also be provided on the first branch 331 to accelerate the flow rate of the heat exchange medium.
[0103] In the fourth operating mode, the outlet of the first heat exchanger 13, the first three-way valve 51, the first liquid pump 35, the third heat exchanger 36, the second three-way valve 52, and the inlet of the first heat exchanger 13 are connected sequentially along the flow direction of the heat exchange medium. The low-temperature heat exchange medium, cooled by the first heat exchanger 13, enters the third heat exchanger 36 through the first three-way valve 51 and the four-way valve 53, and exchanges heat with the second heat exchange end 42, accelerating the heat dissipation of the second heat exchange end 42 and causing the first heat exchange end 41 and the vehicle refrigerator 600 to cool down rapidly. After flowing out of the third heat exchanger 36, the heat exchange medium re-enters the first heat exchanger 13 along the four-way valve 53 and the second three-way valve 52 and is cooled by the first heat exchanger 13. After cooling, it re-enters the third heat exchange circuit 30 to discharge waste heat from the vehicle refrigerator 600.
[0104] Thus, in the fourth operating mode, the first valve port 531 is connected to the third valve port 533, and the second valve port 532 is connected to the fourth valve port 534, so that the third heat exchange circuit 30 is connected in series with the first heat exchanger 13. This allows the second heat exchange circuit 20 to deliver a low-temperature heat exchange medium to the third heat exchange circuit 30 for heat exchange with the second heat exchange end 42. The high-temperature heat exchange medium formed after heat exchange then returns to the second heat exchange circuit 20 for rapid cooling, improving the heat dissipation efficiency of the second heat exchange end 42, thereby improving the cooling efficiency of the semiconductor refrigerator 40 for the vehicle refrigerator 600.
[0105] Please see Figure 4 In some embodiments, the thermal management system 100 has a fifth operating mode in which the first valve port 531 is connected to the second valve port 532, and the third valve port 533 is disconnected from the fourth valve port 534, so that the third heat exchange circuit 30 can independently discharge the waste cold or waste heat of the semiconductor cooler 40.
[0106] Specifically, the internal connection of the four-way valve 53 is adjusted so that the first valve port 531 is connected to the second valve port 532, and the third valve port 533 is disconnected from the fourth valve port 534. This allows the outlet and inlet of the third heat exchanger 36 to be connected through the first branch 331 and the four-way valve 53, forming a closed loop in the third heat exchange circuit 30. The third heat exchanger 36 exchanges heat with the second heat exchange end 42 to achieve cooling or heating of the second heat exchange end 42, promoting temperature transfer between the first heat exchange end 41 and the second heat exchange end 42, and enabling the first heat exchange end 41 to cool or heat the vehicle refrigerator 600.
[0107] In some application scenarios, such as when the ambient temperature is low and the vehicle refrigerator 600 needs to cool, the thermal management system 100 continues to work in the fifth working mode. The heat exchange efficiency of the semiconductor cooler 40 and the third heat exchanger 36 can meet the requirements of the vehicle refrigerator 600 for cooling speed and cooling range at the beginning of startup.
[0108] In other application scenarios, such as when the ambient temperature is high and the vehicle refrigerator 600 needs cooling, the thermal management system 100 can first start operating in the fourth working mode. Through the second heat exchange loop 20 and the third heat exchange loop 30, heat exchange is accelerated, allowing the third heat exchanger 36 to dissipate heat from the second heat exchange end 42, thereby achieving rapid cooling of the first heat exchange end 41 and the vehicle refrigerator 600. After the vehicle refrigerator 600 reaches a steady state, the thermal management system 100 can switch to the fifth working mode, independently dissipating the waste heat or cold from the vehicle refrigerator 600 and the semiconductor cooler 40 through the third heat exchange loop 30.
[0109] Thus, in the fifth working mode, the third heat exchange circuit 30 is disconnected from the second heat exchange circuit 20 and the first heat exchange circuit 10, and the waste cold or waste heat of the semiconductor refrigerator 40 can be discharged independently, thereby saving the energy consumption of the whole vehicle when the vehicle refrigerator 600 is running in steady state.
[0110] Please see Figure 5 In some embodiments, the thermal management system 100 has a sixth operating mode. In the sixth operating mode, the first three-way valve 51, the electric drive component 200, and the second three-way valve 52 are connected in sequence through the second pipeline 22. The first valve port 531 is connected to the third valve port 533, and the second valve port 532 is connected to the fourth valve port 534, so as to conduct the waste heat of the electric drive component 200 to the semiconductor cooler 40.
[0111] Specifically, the first valve port 531 is connected to the third valve port 533, the first branch 331 is connected to the second branch 332, and the third pipe 33 is connected to the first three-way valve 51. Simultaneously, the second valve port 532 is connected to the fourth valve port 534, the first branch 331 is also connected to the third branch 333, and the third pipe 33 is connected to the second three-way valve 52. Since both the first and second three-way valves 51 and 52 have an interface connected to the second pipe 22, the second heat exchange circuit 20 and the third heat exchange circuit 30 are connected in series. The waste heat from the electrically driven component 200 can flow with the heat exchange medium to the third heat exchanger 36 and exchange heat with the second heat exchange end 42, accelerating the temperature rise of the second heat exchange end 42. As the temperature rise of the second heat exchange end 42 accelerates, the heat transfer between the first heat exchange end 41 and the second heat exchange end 42 also accelerates, thereby improving the heating efficiency of the first heat exchange end 41 for the vehicle refrigerator 600.
[0112] Optionally, a second liquid pump 23 may also be provided on the second pipeline 22 to accelerate the flow of the heat exchange medium in the second heat exchange circuit 20.
[0113] Thus, in the sixth working mode, the first three-way valve 51, the electric drive component 200, and the second three-way valve 52 are connected in sequence through the second pipeline 22. The first valve port 531 is connected to the third valve port 533, and the second valve port 532 is connected to the fourth valve port 534, so that the second pipeline 22 is connected to the third heat exchange circuit 30. The electric drive component 200 of the vehicle 1000 can be led to the third heat exchange circuit 30 to exchange heat with the second heat exchange end 42, thereby assisting the semiconductor refrigerator 40 in heating the vehicle refrigerator 600.
[0114] In some implementations, the control method of the thermal management system 100 is as follows:
[0115] (1) The vehicle refrigerator 600 starts and receives the customer's command to cool or heat;
[0116] (2a) If a heating command is received, the vehicle refrigerator 600 operates in heating mode and determines whether the electric drive component 200 can provide residual heat.
[0117] (3a) If there is residual heat in the electric drive component 200 that can be utilized, the angle of the four-way valve 53 is adjusted so that the thermal management system 100 operates in the sixth working mode, utilizing the residual heat of the electric drive component 200 to work in conjunction with the vehicle refrigerator 600 to provide heating, thereby reducing the heating power consumption of the semiconductor cooler 40.
[0118] (4a) If the electric drive component 200 cannot provide waste heat to the vehicle refrigerator 600, the angle of the four-way valve 53 is adjusted so that the thermal management system 100 operates in the fifth working mode, the semiconductor cooler 40 heats the vehicle refrigerator 600, and the third heat exchange circuit 30 independently discharges the waste heat from the vehicle refrigerator 600.
[0119] (2b) If a cooling command is received, the vehicle refrigerator 600 operates in cooling mode and determines whether the passenger compartment or battery device 500 has received a cooling / cooling command.
[0120] (3a) If either the passenger compartment or the battery unit 500 receives a cooling command, the angle of the four-way valve 53 is adjusted so that the thermal management system 100 operates in the fourth working mode, the compressor starts running, the first heat exchange circuit 10 can cool the passenger compartment or the battery accordingly, the first heat exchanger 13 generates low-temperature coolant and flows to the third heat exchange circuit 30 to dissipate heat from the second heat exchange end 42, and the high-temperature coolant formed after exchanging heat with the second heat exchange end 42 returns to the second heat exchange circuit 20 for rapid cooling, and the newly generated low-temperature coolant circulates into the third heat exchange circuit 30; the third heat exchange circuit 30 may be equipped with a first liquid pump 35 and the first liquid pump 35 starts running synchronously with the compressor 12 to accelerate the pumping of coolant.
[0121] In step (3a), if the passenger cabin receives a cooling command, the compressor 12 adjusts its speed to achieve the target temperature of the passenger cabin; if the battery device 500 receives a cooling command, the compressor 12 adjusts its speed to achieve the target cooling temperature of the battery device 500.
[0122] (4a) If neither the passenger compartment nor the battery unit 500 receives a cooling / cooling command, the angle of the four-way valve 53 is adjusted so that the thermal management system 100 operates in the fifth working mode, the semiconductor cooler 40 cools the vehicle refrigerator 600, and the third heat exchange circuit 30 independently discharges the waste heat of the vehicle refrigerator 600.
[0123] In some embodiments, the vehicle refrigerator 600 is equipped with a temperature detection device. When the thermal management system 100 is operating in a second working mode and the semiconductor cooler 40 is cooling the vehicle refrigerator 600, the temperature detection device detects the actual temperature of the vehicle refrigerator 600 and the initial temperature, and compares the difference between the actual temperature and the initial temperature with a set difference value.
[0124] If the difference between the actual temperature and the initial temperature of the vehicle refrigerator 600 is less than or equal to the set difference, the four-way valve 53 is controlled to change the internal connection status, so as to adjust the thermal management system 100 to the first working mode and accelerate the cooling of the vehicle refrigerator 600 until the difference between the actual temperature and the initial temperature of the vehicle refrigerator 600 is greater than the set difference, and the thermal management system 100 is adjusted to the second working mode again.
[0125] If the difference between the actual temperature and the initial temperature of the vehicle refrigerator 600 is greater than the set difference, it will continue to operate in the second working mode.
[0126] Please see Figure 4 In some embodiments, the thermal management system 100 includes a fourth heat exchange circuit 60 connected in parallel with the second heat exchange circuit 20. The fourth heat exchange circuit 60 includes a fourth pipe 61 and a heat dissipation device 62 and a second heat exchanger 14 connected in sequence through the fourth pipe 61. The heat dissipation device 62 is used to exchange heat with the external environment.
[0127] Specifically, the heat dissipation device 62 can be the front-end heat dissipation assembly of the vehicle 1000. The fourth heat exchange circuit 60 can exchange heat through flowing coolant, coolant, cooling water, etc.
[0128] Thus, through the fourth heat exchange circuit 60 and the second heat exchange circuit 20, and the fourth heat exchange circuit 60 including the heat dissipation device 62 and the second heat exchanger 14 connected in sequence, the second heat exchange circuit 20 can exchange heat with the fourth heat exchange circuit 60 through the second heat exchanger 14. The second heat exchange circuit 20 can be connected to the third heat exchange circuit 30 and exchange heat, thereby indirectly discharging the waste cold or waste heat of the vehicle refrigerator 600 to the external environment.
[0129] Please see Figure 4 In some embodiments, the thermal management system 100 includes a blower 70, which is disposed on one side of the second heat exchange end 42 and close to the third heat exchange circuit 30. The blower 70 is used to blow air to accelerate the cooling of the second heat exchange end 42.
[0130] Specifically, the blower 70 may include a fan, etc., and is positioned close to the second heat exchange end 42 of the vehicle refrigerator 600. The blower 70 can be activated and operated in any of the first, second, fourth, and fifth operating modes. Especially in the second and fifth operating modes, when the semiconductor cooler 40 is cooling the vehicle refrigerator 600, the blower 70 blows air onto the second heat exchange end 42 and accelerates the heat dissipation of the second heat exchange end 42 through airflow.
[0131] Thus, by blowing air through the blower 70 on one side of the second heat exchange end 42, airflow is generated to dissipate heat, improving the heat dissipation conditions of the second heat exchange end 42, which in turn helps the first heat exchange end 41 to quickly adjust the temperature of the vehicle refrigerator 600.
[0132] Please see Figure 6 , Figure 6 This is a schematic diagram of the structure of a vehicle 1000 provided in some embodiments of this application. This application provides a vehicle 100, which includes a thermal management system 100 and an electric drive component 200 in any of the above embodiments, wherein the electric drive component 200 is a drive motor 300 and / or a battery device 500.
[0133] Specifically, vehicle 1000 can be a gasoline-powered vehicle, a natural gas-powered vehicle, or a new energy vehicle. New energy vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles, etc. Battery device 500 can serve as a power source for the energy storage system and power supply system of vehicle 1000. Drive motor 300 can be used to provide electricity to drive vehicle 1000.
[0134] The vehicle 1000 has a battery device 500 installed inside, which can be located at the bottom, front, or rear of the vehicle 1000. The battery device 500 can be used to power the vehicle 1000; for example, it can serve as the vehicle 1000's operating power source. The vehicle 1000 may also include a controller 400 and a drive motor 300. The controller 400 controls the battery device 500 to supply power to the drive motor 300, for example, to meet the power needs of the vehicle 1000 during starting, navigation, and driving.
[0135] In some embodiments of this application, the battery device 500 can not only serve as the operating power source for the vehicle 1000, but also as the driving power source for the vehicle 1000, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1000.
[0136] The vehicle 1000 of this application includes the thermal management system described above, and therefore has all the beneficial effects of the thermal management system 100 provided in this application embodiment.
[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A thermal management system, characterized by, The application relates to a heat management system for a vehicle, comprising: a semiconductor refrigerator comprising a first heat exchange end and a second heat exchange end, the first heat exchange end being used for heat-conductively connecting with a vehicle-mounted refrigerator; a first heat exchange circuit used for adjusting the temperature of a passenger compartment of the vehicle; a second heat exchange circuit used for heat exchanging with electric drive components of the vehicle; and a third heat exchange circuit heat-conductively connected with the second heat exchange end, the third heat exchange circuit being capable of heat exchanging with the first heat exchange circuit and / or the second heat exchange circuit to adjust the temperature of the vehicle-mounted refrigerator.
2. The thermal management system of claim 1, wherein, The third heat exchange circuit comprises a multi-way valve assembly connected between the second heat exchange circuit and the third heat exchange circuit, and used for selectively heat exchanging connecting or disconnecting the first heat exchange circuit and / or the second heat exchange circuit with the third heat exchange circuit.
3. The thermal management system of claim 2, wherein, The first heat exchange circuit comprises a compressor, a first heat exchanger and a second heat exchanger connected in sequence through a first pipeline, the second heat exchanger being used for heat exchanging with an external environment, the second heat exchange circuit comprises a second pipeline heat-conductively connected with the electric drive components, and the third heat exchange circuit comprises a third pipeline heat-conductively connected with the first heat exchanger. The multi-way valve assembly comprises a first three-way valve and a second three-way valve, the first three-way valve and the second three-way valve are connected with the second pipeline and the third pipeline, and are used for controlling the second pipeline and the third pipeline to be communicated and for controlling the third pipeline to be turned on or off.
4. The thermal management system of claim 3, wherein, The third heat exchange circuit comprises a one-way valve, a first liquid pump and a third heat exchanger arranged on the third pipeline, the third heat exchanger is heat-conductively connected with the second heat exchange end, the second three-way valve, the one-way valve, the first liquid pump, the third heat exchanger and the first three-way valve are connected in sequence through the third pipeline, and the first liquid pump is used for pumping heat exchange medium.
5. The thermal management system of claim 4, wherein, The heat management system has a first working mode, in the first working mode, the first liquid pump and the compressor are both started to run, so that the third heat exchanger can heat exchange with the first heat exchange circuit.
6. The thermal management system of claim 4, wherein, The heat management system has a second working mode, in the second working mode, one of the first liquid pump and the compressor is stopped to run, so that the third heat exchange circuit independently discharges waste cold or waste heat of the semiconductor refrigerator.
7. The thermal management system of claim 4, wherein, The second heat exchange circuit comprises a second liquid pump, the first three-way valve, the electric drive components, the second liquid pump and the second three-way valve are connected in sequence through the second pipeline.
8. The thermal management system of claim 7, wherein, The heat management system has a third working mode, in the third working mode, the first liquid pump and the second liquid pump are both started to run, so that waste heat of the electric drive components is conducted out to the semiconductor refrigerator.
9. The thermal management system of claim 3, wherein, The third pipeline comprises a first branch, a second branch, a third branch and a third heat exchanger. The multi-way valve assembly further comprises a four-way valve having a first valve port, a second valve port, a third valve port and a fourth valve port. The first valve port, the third heat exchanger and the second valve port are connected in sequence through the first branch. The second branch connects the first three-way valve with the third valve port. The third branch connects the second three-way valve with the fourth valve port.
10. The thermal management system of claim 9, wherein, The thermal management system has a fourth working mode. In the fourth working mode, the first valve port and the third valve port are connected, and the second valve port and the fourth valve port are connected, so that the third heat exchange circuit is connected in series with the first heat exchanger and the waste heat of the semiconductor refrigerator is discharged through the second heat exchange circuit.
11. The thermal management system of claim 9, wherein, The thermal management system has a fifth working mode. In the fifth working mode, the first valve port and the second valve port are connected, and the third valve port and the fourth valve port are disconnected, so that the third heat exchange circuit independently discharges the waste cold or waste heat of the semiconductor refrigerator.
12. The thermal management system of claim 9, wherein, The thermal management system has a sixth working mode. In the sixth working mode, the first three-way valve, the electrically driven component and the second three-way valve are connected in sequence through the second pipeline. The first valve port and the third valve port are connected, and the second valve port and the fourth valve port are connected, so as to guide the waste heat of the electrically driven component to the semiconductor refrigerator.
13. The thermal management system of claim 3, wherein, The thermal management system comprises a fourth heat exchange circuit connected in parallel with the second heat exchange circuit. The fourth heat exchange circuit comprises a fourth pipeline and a heat dissipation device and the second heat exchanger connected in sequence through the fourth pipeline. The heat dissipation device is used for heat exchange with the external environment.
14. The thermal management system of claim 1, wherein, The thermal management system comprises a blowing device arranged on one side of the second heat exchange end and close to the third heat exchange circuit. The blowing device is used for blowing air to accelerate the cooling of the second heat exchange end.
15. A vehicle characterized by comprising: The thermal management system comprises: The thermal management system of any one of claims 1-14; and The electrically driven component is a driving motor and / or a battery device.