Wafer detecting and cleaning equipment

Abstract

The utility model belongs to the field of wafer detection equipment, and particularly relates to wafer detection and cleaning equipment which comprises an equipment body, a wafer ejector pin mechanism is arranged at the top of the equipment body, an XY-axis displacement platform is installed at the top of the equipment body, and a wafer ring fixing mechanism is arranged on the XY-axis displacement platform. A high-frequency ion tuyere is installed on the rear side of the top of the equipment body, a connecting frame is installed on the top of the equipment body, a display screen is arranged on the top of the connecting frame, a microscope lifting support is installed on the connecting frame, a continuous variable lens is arranged on one side of the microscope lifting support, and a CCD camera is installed on the top of the continuous variable lens. An LED annular light source is installed at the bottom of the continuous variable lens, and two probe seat supporting platforms are installed at the top of the equipment body. According to the utility model, the design is reasonable, through the probe seat, the wafer ring fixing mechanism and the wafer ejector pin mechanism, the wafer can be conveniently detected and ejected, and the angle of the display screen can be adjusted, thereby facilitating the use of different people.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection equipment technology, and in particular to a wafer inspection cleaning device. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to become IC products with specific electrical functions.

[0003] Currently, Chinese Patent Publication No. CN110838457B discloses a wafer cleaning apparatus and a wafer cleaning method. The apparatus includes a wafer holder, a cleaning nozzle, and a cleaning brush. The wafer holder is configured to hold the wafer. The cleaning nozzle is configured to dispense cleaning fluid onto a first surface (e.g., the front surface) of the wafer. The cleaning brush is configured to clean a second surface (e.g., the rear surface) of the wafer. Through the use of the cleaning fluid, the cleaning brush can clean the second surface of the wafer through brushing motion and ultrasonic vibration, thereby improving the removal of defects from the wafer.

[0004] In practical use, it was found that while it could clean wafers, it was not convenient for inspecting wafers or removing defective wafers. Furthermore, different operators needed to adjust the angle of the display screen differently, making it difficult to adjust the screen angle. Therefore, we proposed a wafer inspection and cleaning device to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer inspection and cleaning device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A wafer inspection and cleaning device includes a main body, a wafer ejector mechanism on the top of the main body, an XY-axis displacement platform mounted on the top of the main body, a wafer ring fixing mechanism on the XY-axis displacement platform, and a high-frequency ion nozzle mounted on the rear top of the main body.

[0008] A connecting frame is installed on the top of the main body of the device. A display screen is installed on the top of the connecting frame. A microscope lifting bracket is installed on the connecting frame. A continuous variable lens is installed on one side of the microscope lifting bracket. A CCD camera is installed on the top of the continuous variable lens. An LED ring light source is installed at the bottom of the continuous variable lens.

[0009] Two probe holder support platforms are mounted on the top of the main body of the device, and probe holders for wafer inspection are mounted on the probe holder support platforms.

[0010] Preferably, two vertical plates are fixedly installed on the top of the connecting frame, and a rotating mechanism is provided between the display screen and the vertical plates.

[0011] Preferably, the rotating mechanism includes a rotating hole and a rotating shaft. The rotating hole is formed on the vertical plate, and the rotating shaft is rotatably installed in the rotating hole. The rotating shaft is fixedly connected to the display screen through a detachable structure.

[0012] Preferably, one end of the rotating shaft extends to the outside of the vertical plate and is fixedly mounted with a rotating plate, and a fixing mechanism is provided between the rotating plate and the vertical plate.

[0013] Preferably, the fixing mechanism includes a fixing groove, a threaded hole, and a fixing bolt. The fixing groove is formed on the vertical plate, the threaded hole is formed on the rotating plate, and the fixing bolt is threaded into the threaded hole, and the fixing bolt is adapted to the corresponding fixing groove.

[0014] Preferably, the number of the plurality of fixing slots located on the same side is set to six to ten, and the six to ten fixing slots are arranged in a ring with equal spacing.

[0015] Preferably, the high-frequency ion nozzle can continuously blow air to remove dust and static electricity, and includes an XY-axis displacement platform, a four-way manual moving platform (left, right, front, and back), a wafer ring fixing mechanism, and an inner ring that lifts and tightens the blue film after fixing the wafer ring.

[0016] Preferably, the wafer ejection mechanism activates a vacuum ejector cap to hold the blue film, and the ejector pin rises to eject a single bare die. The probe holder, along with a coaxial cable, is used for wafer analysis and testing.

[0017] The beneficial effects of this utility model are:

[0018] 1. The inspection process of the wafer inspection and cleaning equipment is as follows: set the parameters of the CCD camera 12 through the display screen 6, turn on the LED ring light source 3, place the wafer ring into the fixing mechanism 9 to tighten the blue film, move the wafer to below the continuous lens 11 through the XY axis displacement platform 7, visually inspect the individual wafers on the display screen 6, clean the dust with ESD adhesive sticks, and remove the blue film of the defective products detected by the probe holder 10 through the wafer ejector mechanism 2 and remove them with tweezers. After the wafer inspection and cleaning is completed, open the wafer ring fixing mechanism 9 and take out the wafer.

[0019] 2. By rotating the fixing bolt, the bolt can move while rotating under the action of the threaded hole, allowing it to engage or disengage from the fixing groove. This achieves the purpose of fixing and releasing the rotating plate. By rotating the rotating plate, the rotating plate can drive the display screen to rotate via the rotating shaft, thereby achieving the purpose of adjusting the placement angle of the display screen. Attached Figure Description

[0020] Figure 1This is a three-dimensional structural diagram of a wafer inspection and cleaning device proposed in this utility model;

[0021] Figure 2 This is a schematic diagram of part A of a wafer inspection and cleaning device proposed in this utility model;

[0022] Figure 3 This is a schematic diagram of part B of a wafer inspection and cleaning device proposed in this utility model.

[0023] In the diagram: 1. Main body of the equipment; 2. Wafer ejector mechanism; 3. LED ring light source; 4. High-frequency ion nozzle; 5. Microscope lifting support; 6. Display screen; 7. XY axis displacement platform; 8. Probe holder support platform; 9. Wafer ring fixing mechanism; 10. Probe holder; 11. Continuous variable lens; 12. CCD camera; 13. Connecting frame; 14. Vertical plate; 15. Rotating hole; 16. Rotating shaft; 17. Rotating plate; 18. Fixing groove; 19. Threaded hole; 20. Fixing bolt. Detailed Implementation

[0024] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0025] Reference Figure 1-3 A wafer inspection and cleaning device includes a main body 1, a wafer ejector mechanism 2 on the top of the main body 1, an XY-axis displacement platform 7 mounted on the top of the main body 1, a wafer ring fixing mechanism 9 mounted on the XY-axis displacement platform 7, a high-frequency ion nozzle 4 mounted on the rear side of the top of the main body 1, a connecting frame 13 mounted on the top of the main body 1, a display screen 6 mounted on the top of the connecting frame 13, a microscope lifting bracket 5 mounted on the connecting frame 13, a variable lens 11 mounted on one side of the microscope lifting bracket 5, and a CCD camera 12 mounted on the top of the variable lens 11. The bottom of the continuous variable lens 11 is equipped with an LED ring light source 3. The top of the main body 1 is equipped with two probe holder support platforms 8. The probe holder support platforms 8 are equipped with probe holders 10 for wafer inspection. The high-frequency ion nozzle 4 can continuously blow air to remove dust and static electricity. The XY axis displacement platform 7 is a platform that can be manually moved in four directions: left, right, forward, and backward. The wafer ring fixing mechanism 9 can lift the inner ring to tighten the blue film after fixing the wafer ring. The wafer ejection mechanism can start the vacuum ejector cap to suck up the blue film and the ejector pin can rise to eject a single bare die. The probe holder 10, with a coaxial cable, is used for wafer analysis and testing.

[0026] In this embodiment, two vertical plates 14 are fixedly installed on the top of the connecting frame 13, and a rotating mechanism is provided between the display screen 6 and the vertical plates 14. The rotating mechanism includes a rotating hole 15 and a rotating shaft 16. The rotating hole 15 is opened on the vertical plate 14, and the rotating shaft 16 is rotatably installed in the rotating hole 15. The rotating shaft 16 is fixedly connected to the display screen through a detachable structure. By providing the rotating shaft 16, the display screen 6 can be rotated, thereby achieving the purpose of adjusting the angle of the display screen 6.

[0027] In this embodiment, one end of the rotating shaft 16 extends to the outside of the vertical plate 14 and is fixedly mounted on a rotating plate 17. A fixing mechanism is provided between the rotating plate 17 and the vertical plate 14. The fixing mechanism includes a fixing groove 18, a threaded hole 19, and a fixing bolt 20. The fixing groove 18 is opened on the vertical plate 14, and the threaded hole 19 is opened on the rotating plate 17. The fixing bolt 20 is installed in the threaded hole 19, and the fixing bolt 20 is adapted to the corresponding fixing groove 18. By providing the fixing bolt 20 and the fixing groove 18, the purpose of fixing and releasing the rotating plate can be achieved. The number of fixing grooves 18 located on the same side is set to six to ten, and the six to ten fixing grooves 18 are arranged in a ring with equal spacing. By providing multiple fixing grooves 18, the purpose of fixing the display screen 6 at different angle positions can be achieved.

[0028] In this invention, the wafer inspection and cleaning equipment operates as follows: CCD camera 12 parameters are set on display screen 6, LED ring light source 3 is turned on, wafer ring is placed in fixing mechanism 9 to tighten the blue film, the wafer is moved to below continuous lens 11 via XY axis displacement platform 7, and individual wafers are visually inspected on display screen 6. Dust is cleaned using ESD adhesive sticks. Defective products detected by probe holder 10 have their blue film removed via wafer ejector mechanism 2 and are removed with tweezers. After wafer inspection and cleaning are completed, wafer ring fixing mechanism 9 is opened, wafer is removed, and fixing bolts are rotated. The bolts move while rotating due to the threaded hole, allowing them to engage or disengage from the fixing slot. This achieves the purpose of fixing and disengaging the rotating plate. Rotating the rotating plate, via the rotating shaft, drives display screen 6 to rotate, thereby adjusting the placement angle of display screen 6.

[0029] The wafer inspection and cleaning equipment provided by this utility model has been described in detail above. Specific embodiments have been used to illustrate the principle and implementation of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core idea of ​​this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A wafer inspection and cleaning apparatus, comprising: Including device body (1), the top of device body (1) is equipped with wafer top needle mechanism (2), the top of device body (1) is installed XY axis displacement platform (7), and the top of device body (1) is equipped with wafer ring fixed mechanism (9), the top rear side of device body (1) is installed high-frequency ion wind nozzle (4); The top of the device body (1) is installed with a connecting frame (13), and the top of the connecting frame (13) is provided with a display screen (6). The connecting frame (13) is installed with a microscope lifting support (5), one side of the microscope lifting support (5) is provided with a zoom lens (11), the top of the zoom lens (11) is installed with a CCD camera (12), and the bottom of the zoom lens (11) is installed with an LED ring light source (3). The top of the device body (1) is installed with two probe station support platforms (8), and the probe station support platforms (8) are installed with probe stations (10) for wafer detection.

2. The wafer inspection and cleaning apparatus of claim 1, wherein The top of the connecting frame (13) is fixedly installed with two vertical plates (14), and a rotating mechanism is arranged between the display screen (6) and the vertical plate (14).

3. The wafer inspection and cleaning apparatus of claim 2, wherein The rotating mechanism comprises a rotating hole (15) and a rotating shaft (16), the rotating hole (15) is formed in the vertical plate (14), and the rotating shaft (16) is rotatably installed in the rotating hole (15). The rotating shaft (16) is fixedly connected with the display screen (6) through a detachable structure.

4. The wafer inspection and cleaning apparatus of claim 3, wherein One end of the rotating shaft (16) extends to the outside of the vertical plate (14) and is fixedly installed with a rotating plate (17), and a fixing mechanism is arranged between the rotating plate (17) and the vertical plate (14).

5. The wafer inspection and cleaning apparatus of claim 4, wherein The fixing mechanism comprises a fixing groove (18), a threaded hole (19) and a fixing bolt (20), the fixing groove (18) is formed in the vertical plate (14), the threaded hole (19) is formed in the rotating plate (17), and the fixing bolt (20) is screwedly installed in the threaded hole (19). The fixing bolt (20) is matched with the corresponding fixing groove (18).

6. The wafer inspection and cleaning apparatus of claim 5, wherein The number of the fixing grooves (18) on the same side is six to ten, and the six to ten fixing grooves (18) are arranged in a ring shape at equal intervals.

7. The wafer inspection and cleaning apparatus of claim 1, wherein The high-frequency ion wind nozzle (4) can continuously blow and remove dust, remove static electricity, the XY axis displacement platform (7) moves manually in four directions, the wafer ring fixing mechanism (9) fixes the wafer ring, and the inner ring lifts and tightens the blue film.

8. The wafer inspection and cleaning apparatus of claim 1, wherein The wafer ejection mechanism starts the vacuum needle cap to suck the blue film, the needle rises to eject a single die, the probe station (10) is matched with the coaxial cable, and the wafer analysis test is carried out.

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