Projection heat dissipation structure for panel

Abstract

The utility model provides a projection heat dissipation structure for a flat panel, which relates to the technical field of projection heat dissipation and comprises a flat panel bottom shell, a flat panel mainboard and a heat dissipation module are fixed at the top of the flat panel bottom shell, a connecting flat cable is electrically connected to the top of the flat panel mainboard, and the other end of the connecting flat cable is electrically connected to the top of the heat dissipation module. A first heat exchange component and a second heat exchange component are fixed to one side of the heat dissipation module, a first air duct shell is fixed to the top of the flat bottom shell, a first heat dissipation copper plate is fixed to the top of the first air duct shell, first heat dissipation fins are fixed to the bottom of the first heat dissipation copper plate, and a first heat conduction copper pipe is fixed to the top of the first heat exchange component. A second heat conduction copper pipe is fixed to the top of the second heat exchange component, the other end of the second heat conduction copper pipe is fixed to the top of the first heat dissipation copper plate, a second air duct shell is fixed to the top of the flat plate bottom shell, and one end of the second air duct shell communicates with one end of the first air duct shell.

Description

Technical Field

[0001] This utility model relates to the field of projection heat dissipation technology, and in particular to a projection heat dissipation structure for flat panels. Background Technology

[0002] A projection tablet is a tablet computer with integrated projection capabilities, allowing screen content to be projected directly onto a wall or other flat surface for easy sharing and presentation. Many modern projection tablets are equipped with high-brightness built-in projectors that can display clearly in various lighting environments. They typically support multiple connectivity options, such as Wi-Fi, Bluetooth, and HDMI, making it easier to connect with other devices. In addition, projection tablets have good graphics processing capabilities and long-lasting batteries, making them suitable for various scenarios such as business meetings, teaching, and entertainment. The portability and versatility of these devices make them an ideal choice for modern users.

[0003] In existing technologies, projection tablets rely on heat conduction for heat dissipation. While this can effectively reduce device temperature to some extent, it still has some significant drawbacks. First, the thermal conductivity of the heat-conducting material decreases at high temperatures, leading to reduced thermal efficiency. This can cause the device to overheat, affecting projection quality and device lifespan. Second, the uniformity and stability of the heat-conducting material directly affect the heat dissipation effect. Localized overheating can cause device malfunctions. Furthermore, heat conduction typically requires a larger size and weight, which is not conducive to lightweight and thin designs and limits product portability. Finally, heat conduction cannot respond quickly to changing heat loads during high-speed operation, easily causing temperature fluctuations. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a projection heat dissipation structure for flat panels.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a projection heat dissipation structure for a flat panel, comprising a flat panel bottom shell, a flat panel motherboard and a heat dissipation module fixed to the top of the flat panel bottom shell, a connecting cable electrically connected to the top of the flat panel motherboard, the other end of the connecting cable electrically connected to the top of the heat dissipation module, a first heat exchange component and a second heat exchange component fixed to one side of the heat dissipation module, a first air duct shell fixed to the top of the flat panel bottom shell, a first heat dissipation copper plate fixed to the top of the first air duct shell, a first heat dissipation fin fixed to the bottom of the first heat dissipation copper plate, and a first heat-conducting copper pipe fixed to the top of the first heat exchange component. The other end of the first heat-conducting copper pipe is fixed to the top of the first heat-dissipating copper plate. The top of the second heat exchange component is fixed with a second heat-conducting copper pipe, and the other end of the second heat-conducting copper pipe is fixed to the top of the first heat-dissipating copper plate. The top of the flat bottom shell is fixed with a second air duct shell, one end of the second air duct shell is connected to one end of the first air duct shell, the top of the second air duct shell is fixed with a second heat-dissipating copper plate, the bottom of the second heat-dissipating copper plate is fixed with a second heat-dissipating fin, and the top of the flat bottom shell is fixed with a cooling fan shell. The cooling fan shell has fan blades inside, and the fan blades are driven to rotate by a built-in motor. The built-in motor is fixed to the inner wall of the cooling fan shell.

[0006] Preferably, an air inlet groove is provided on one side of the bottom shell of the flat plate, an air inlet dustproof net is provided on one side of the air inlet groove, an air inlet protective cover is provided on one side of the air inlet dustproof net, the air inlet dustproof net and the air inlet protective cover are fixed to one side of the bottom shell of the flat plate by fixing screws, and an air outlet protective cover is fixed on one side of the bottom shell of the flat plate. In existing technologies, the air inlet of the duct cooling structure lacks a dustproof mesh design, which brings significant drawbacks. First, dust and debris enter the device through the air inlet and easily accumulate on the fan and heat sink, affecting airflow and heat dissipation efficiency, leading to increased device temperature. This sustained temperature rise not only reduces the performance of the projection panel but also shortens its lifespan. Second, dust accumulation not only increases operating noise but also causes fan overload, increasing the risk of malfunction. Long-term dust accumulation also increases the difficulty of cleaning the device, requiring regular maintenance and increasing operating costs and time. Furthermore, the combination of dust and high temperatures can lead to serious consequences such as short circuits and even fire hazards. To address these issues, this invention employs a dustproof mesh structure. When external airflow enters the device through the outer groove of the air inlet, the dustproof mesh of the air inlet, through its own mesh structure, physically... By intercepting airborne dust and particles to prevent them from entering the equipment, the air inlet protective cover, in addition to securing the dust filter, further prevents large foreign objects from impacting or directly clogging it. The fixing screws ensure the structural stability of both under airflow and facilitate future disassembly and cleaning. Ultimately, this multi-level protection achieves dustproof functionality, effectively preventing dust and debris from entering the equipment, thus keeping the fan and heat sink clean, ensuring smooth airflow and improved heat dissipation efficiency. This allows for effective temperature control, extends the lifespan of the projection panel, reduces the risk of failure, and improves the stability and reliability of the entire system. Furthermore, the dust filter reduces operating noise, lowers the frequency of cleaning and maintenance, saves maintenance costs and time, and ultimately enhances the user experience, ensuring the equipment operates efficiently in a safe environment.

[0007] Preferably, the bottom shell of the tablet has a slot for the plug hole on one side, and a protective pad for the plug hole is provided on the inner wall of the slot. A protective point fixing rod is fixed to one side of the protective pad, and a fixing rod engaging block is fixed to the surface of the protective point fixing rod. The protective point fixing rod is nested in the inner wall of the slot. In the prior art, the plug hole of the tablet lacks effective protection measures. The main drawback is that it is easily affected by dust, moisture and physical impact, which can lead to poor contact, short circuit or damage to internal components, thereby affecting the normal use and life of the device. In addition, frequent exposure to external environmental damage can also cause inconvenience to users in daily operation, reducing the reliability of the tablet and the user experience. To address these problems, this utility model adopts a plug hole protection structure. When an external plug is inserted into the slot, the protective pad wraps around the surface of the plug through elastic deformation, buffering the mechanical impact during the insertion and removal process and filling the gap between the plug and the slot, reducing the impact. With low wear, the protective point fixing rod forms a rigid support through the locking structure between the fixing rod locking block and the inner wall of the socket outer groove, limiting excessive displacement of the socket protective pad. This maintains the sealing and positioning accuracy of the protective pad during repeated insertions and removals, thereby achieving the functions of dustproofing, impact resistance, and extending the socket life. It effectively blocks dust and moisture intrusion, reducing the risk of poor contact and short circuits. In addition, enhancing the durability and toughness of the socket material can improve its ability to resist physical impacts. Through these improvements, users can enjoy higher device reliability and a smoother operating experience, extend the life of the tablet, and improve overall user satisfaction.

[0008] Preferably, the inner wall of the outer groove of the socket is provided with an inclined groove. This not only makes it easier for users to easily remove the socket protective pad, but also improves the overall ease of use. This structural innovation makes the protective pad easier to remove, enhances the cleaning and maintenance efficiency of the socket, and ensures the excellent performance and longer service life of the equipment during use.

[0009] Preferably, the top of the cooling fan housing is provided with a fan upper shell, which is detachably fixed to the top of the cooling fan housing. The detachable fan upper shell facilitates cleaning and maintenance by the user, allowing for easy removal of dust and dirt from inside the fan, thereby improving heat dissipation efficiency and extending the fan's lifespan. Secondly, the detachable structure allows for convenient replacement of fan components or upgrades to adapt to different usage needs. Furthermore, when troubleshooting or replacing parts is required, the user can quickly access the internal structure, reducing maintenance costs.

[0010] Preferably, the bottom of the tablet's base shell has a base fixing groove. This allows users to flexibly configure the device according to their needs. This design not only simplifies the installation process but also ensures the stability of the base, improving the overall stability and user experience of the tablet. At the same time, the reserved fixing groove also provides flexibility for future upgrades or replacements of the base, enhancing the product's adaptability and service life.

[0011] Preferably, the bottom edge of the tablet is made of sharp corners. The sharp corners effectively enhance the aesthetics of the tablet, making it look more modern and stylish. Secondly, the sharp corners increase the strength of the tablet, reducing the risk of damage during drops or collisions, thereby improving its durability. In addition, the sharp corners provide a better grip for the user, preventing slippage and facilitating operation, thus improving the overall user experience.

[0012] Beneficial effects:

[0013] 1. In existing technologies, projection tablets rely on heat conduction for heat dissipation. While this can effectively reduce device temperature to some extent, it still has some significant drawbacks. First, the thermal conductivity of the heat-conducting material decreases at high temperatures, leading to reduced thermal efficiency and overheating, which affects projection quality and device lifespan. Second, the uniformity and stability of the heat-conducting material directly affect the heat dissipation effect; localized overheating can cause device malfunction. Furthermore, heat conduction typically requires a larger volume and weight, hindering lightweight and thin designs and limiting product portability. Finally, heat conduction cannot quickly respond to changing heat loads during high-speed operation, easily causing temperature fluctuations. To address these issues, this invention employs an airflow cooling structure to significantly improve thermal efficiency. Simultaneously, optimized design to achieve uniformity and redundancy in the heat-conducting material helps avoid malfunctions caused by localized overheating. Additionally, a lightweight and compact heat dissipation solution enhances product portability. Finally, an intelligent thermal management system can monitor and adjust the heat dissipation strategy in real time to quickly respond to changing heat loads, reducing temperature fluctuations and thus improving projection quality and extending device lifespan.

[0014] 2. In existing technologies, the air inlet of the duct cooling structure lacks a dust filter, which brings significant drawbacks. First, dust and debris enter the device through the air inlet and easily accumulate on the fan and heat sink, affecting airflow and heat dissipation efficiency, leading to increased device temperature. This sustained temperature rise not only reduces the performance of the projection panel but also shortens its lifespan. Second, dust accumulation not only increases operating noise but also causes fan overload, increasing the risk of malfunction. Long-term dust accumulation also increases the difficulty of cleaning the device, requiring regular maintenance and increasing operating costs and time. Furthermore, the combination of dust and high temperatures can... This can lead to serious consequences such as short circuits and even fire hazards. To address these issues, this invention employs a dustproof mesh structure to effectively prevent dust and debris from entering the equipment, thereby keeping the fan and heat sink clean, ensuring smooth airflow and improved heat dissipation efficiency. As a result, the equipment temperature can be effectively controlled, extending the lifespan of the projection panel, reducing the risk of failure, and thus improving the stability and reliability of the entire system. In addition, the application of the dustproof mesh can also reduce operating noise, reduce the frequency of cleaning and maintenance for users, save maintenance costs and time, thereby improving the user experience and ensuring that the equipment operates efficiently in a safe environment.

[0015] 3. In the existing technology, the ports of tablet computers lack effective protection measures. The main drawback is that they are easily affected by dust, moisture, and physical impact, which can lead to poor contact, short circuits, or damage to internal components, thereby affecting the normal use and lifespan of the device. In addition, frequent exposure to external environmental damage can also cause inconvenience to users in daily operation, reducing the reliability of the tablet computer and the user experience. To address these issues, this utility model adopts a port protection structure to effectively prevent dust and moisture from entering, reducing the risk of poor contact and short circuits. Furthermore, enhancing the durability and toughness of the port material can improve its ability to resist physical impact. Through these improvements, users can enjoy higher device reliability and a smoother operating experience, extend the lifespan of the tablet computer, and improve overall user satisfaction. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a three-dimensional structural diagram of the heat dissipation air duct of this utility model;

[0018] Figure 3 This is a three-dimensional structural diagram of the heat dissipation fins of this utility model;

[0019] Figure 4 This is a three-dimensional structural diagram of the bottom of this utility model;

[0020] Figure 5This is an exploded view of the air inlet of this utility model;

[0021] Figure 6 This is a three-dimensional structural diagram of the bottom shell of this utility model;

[0022] Figure 7 This is a three-dimensional structural diagram of the socket protective pad of this utility model.

[0023] Legend:

[0024] 1. Tablet bottom shell; 101. Tablet motherboard; 102. Heat dissipation module; 103. Connecting cable; 104. First heat exchange component; 105. Second heat exchange component; 106. First air duct shell; 107. First heat dissipation copper plate; 108. First heat dissipation fin; 109. First heat conduction copper pipe; 110. Second heat conduction copper pipe; 111. Second air duct shell; 112. Second heat dissipation copper plate; 113. Second heat dissipation fin; 114. Cooling fan shell; 2. Air inlet outer slot; 201. Air inlet dust filter; 202. Air inlet protective cover; 203. Fixing screw; 204. Air outlet protective cover; 3. Socket outer slot; 301. Socket protective pad; 302. Protective point fixing rod; 303. Fixing rod locking block; 4. Slanted slot; 5. Fan upper shell; 6. Base fixing slot. Detailed Implementation

[0025] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0026] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Specific implementation examples:

[0028] Reference Figure 1-7A projection heat dissipation structure for a flat panel includes a flat panel bottom shell 1. A flat panel motherboard 101 and a heat dissipation module 102 are fixed to the top of the flat panel bottom shell 1. A connecting cable 103 is electrically connected to the top of the flat panel motherboard 101, and the other end of the connecting cable 103 is electrically connected to the top of the heat dissipation module 102. A first heat exchange component 104 and a second heat exchange component 105 are fixed to one side of the heat dissipation module 102. A first air duct shell 106 is fixed to the top of the flat panel bottom shell 1. A first heat dissipation copper plate 107 is fixed to the top of the first air duct shell 106. A first heat dissipation fin 108 is fixed to the bottom of the first heat dissipation copper plate 107. A first heat conduction copper pipe 109 is fixed to the top of the first heat exchange component 104. The first heat conduction copper pipe 109 is further... One end is fixed to the top of the first heat dissipation copper plate 107, the top of the second heat exchange component 105 is fixed with a second heat-conducting copper pipe 110, the other end of the second heat-conducting copper pipe 110 is fixed to the top of the first heat dissipation copper plate 107, the top of the flat bottom shell 1 is fixed with a second air duct shell 111, one end of the second air duct shell 111 is connected to one end of the first air duct shell 106, the top of the second air duct shell 111 is fixed with a second heat dissipation copper plate 112, the bottom of the second heat dissipation copper plate 112 is fixed with a second heat dissipation fin 113, the top of the flat bottom shell 1 is fixed with a cooling fan shell 114, the cooling fan shell 114 is provided with fan blades inside, the fan blades are driven to rotate by a built-in motor, and the built-in motor is fixed to the inner wall of the cooling fan shell 114. In existing technologies, projection tablets rely on heat conduction for heat dissipation. While this effectively reduces device temperature to some extent, it still has several significant drawbacks. First, the thermal conductivity of the heat-conducting material decreases at high temperatures, leading to reduced thermal efficiency and potentially causing overheating, which affects projection quality and device lifespan. Second, the uniformity and stability of the heat-conducting material directly impact heat dissipation; localized overheating can cause device malfunctions. Furthermore, heat conduction typically requires a larger size and weight, hindering lightweight and slim designs and limiting product portability. Finally, heat conduction cannot respond quickly to changing heat loads during high-speed operation, easily causing temperature fluctuations. To address these issues, this… The utility model adopts a duct heat dissipation structure. The heat generated by the heat dissipation module 102 is absorbed by the first heat exchange component 104 and the second heat exchange component 105 respectively. The heat is then conducted to the first heat dissipation copper plate 107 and the second heat dissipation copper plate 112 through the first heat-conducting copper pipe 109 and the second heat-conducting copper pipe 110. Subsequently, the heat diffuses to the surface of the first heat dissipation fin 108 and the second heat dissipation fin 113. At the same time, the fan blades in the cooling fan housing 114 rotate to generate airflow. The airflow passes through the series air duct formed by the first air duct housing 106 and the second air duct housing 111, forcibly convecting and dissipating the heat on the first heat dissipation fin 108 and the second heat dissipation fin 113, thereby realizing dual-path heat conduction and air cooling combined heat dissipation.

[0029] An air inlet slot 2 is provided on one side of the flat panel bottom shell 1. An air inlet dustproof mesh 201 is provided on one side of the air inlet slot 2, and an air inlet protective cover 202 is provided on one side of the air inlet dustproof mesh 201. The air inlet dustproof mesh 201 and the air inlet protective cover 202 are fixed to one side of the flat panel bottom shell 1 by fixing screws 203. An air outlet protective cover 204 is fixed to one side of the flat panel bottom shell 1. In the prior art, the air inlet of the air duct heat dissipation structure lacks a dustproof mesh design, which brings significant drawbacks. First, dust and debris enter the device through the air inlet and easily accumulate on the fan and heat sink, thereby affecting airflow and heat dissipation efficiency, causing the device temperature to rise. The continuous rise in temperature not only reduces the performance of the projection flat panel but also shortens its service life. Second, dust accumulation not only increases operating noise but also causes fan overload, thereby increasing the risk of failure. Long-term dust accumulation also increases the difficulty of cleaning the device, requiring users to perform regular maintenance, increasing the cost and time of use. In addition, dust and high temperature... If the airflow is not properly sealed, it can lead to serious consequences such as short circuits and even fire hazards. To address this issue, this utility model adopts a dustproof mesh structure. When external airflow enters the equipment through the outer groove 2 of the air inlet, the dustproof mesh 201 of the air inlet physically intercepts dust and particulate matter in the air through its own mesh structure, preventing them from entering the equipment. At the same time, the protective cover 202 of the air inlet, in addition to fixing the dustproof mesh 201, further blocks large foreign objects from impacting or directly blocking the dustproof mesh 201. The fixing screws 203 ensure the structural stability of both under the action of airflow and facilitate easy disassembly and cleaning in the future. Finally, the dustproof function is achieved through multi-level protection.

[0030] The bottom shell 1 of the flat plate has an outer groove 3 for the insertion hole on one side. The inner wall of the outer groove 3 is provided with a protective pad 301 for the insertion hole. A protective point fixing rod 302 is fixed on one side of the protective pad 301. A fixing rod locking block 303 is fixed on the surface of the protective point fixing rod 302. The protective point fixing rod 302 is nested in the inner wall of the outer groove 3. In the prior art, tablet computer sockets lack effective protection measures. The main drawback is that they are easily affected by dust, moisture, and physical impacts, which can lead to poor contact, short circuits, or damage to internal components, thereby affecting the normal use and lifespan of the device. In addition, frequent exposure to external environmental damage can also cause inconvenience to users in daily operation, reducing the reliability and user experience of the tablet computer. To address these issues, this utility model adopts a socket protection structure. When an external plug is inserted into the socket outer groove 3, the socket protection pad 301 elastically deforms to wrap around the plug surface, buffering the mechanical impact during insertion and removal and filling the gap between the plug and the socket outer groove 3, reducing wear. At the same time, the protection point fixing rod 302 forms a rigid support with the inner wall of the socket outer groove 3 through the fixing rod locking block 303, limiting the excessive displacement of the socket protection pad 301. During repeated insertion and removal, the sealing and positioning accuracy of the protection pad 301 are maintained, thereby achieving the functions of dustproof, impact-proof, and extending the life of the socket.

[0031] The inner wall of the socket outer groove 3 has a slanted groove 4, which not only makes it easy for users to pry open the socket protective pad 301, but also improves the overall ease of use. This innovative structure makes the protective pad easier to remove, enhances the cleaning and maintenance efficiency of the socket, and ensures the excellent performance and longer service life of the equipment during use. The top of the cooling fan housing 114 has a fan upper shell 5, which is detachably fixed to the top of the cooling fan housing 114. The detachable cooling fan upper shell 5 facilitates cleaning and maintenance by users, allowing dust and dirt inside the fan to be easily removed, thereby improving heat dissipation efficiency and extending the fan's service life. Secondly, the detachable structure allows for easy replacement of fan components or upgrades to adapt to different usage needs. In addition, when troubleshooting or replacing parts is required, users can quickly... The tablet's bottom shell 1 features a base mounting slot 6 at its bottom, allowing users to flexibly configure the mounting according to their needs. This design not only simplifies the installation process but also ensures the stability of the base, improving the overall stability and user experience of the tablet. Furthermore, the reserved mounting slot provides flexibility for future upgrades or base replacements, enhancing the product's adaptability and lifespan. The tablet's bottom shell 1 has sharp edges, which effectively enhance the tablet's aesthetics, making it appear more modern and stylish. Secondly, the sharp edges increase the tablet's strength, reducing the risk of damage from drops or collisions, thus improving its durability. In addition, the sharp edges provide a better grip, preventing slippage and facilitating operation, thus improving the overall user experience.

[0032] The working principle of this utility model is as follows: The heat generated by the heat dissipation module 102 is absorbed by the first heat exchange component 104 and the second heat exchange component 105 respectively. Then, the heat is conducted to the first heat dissipation copper plate 107 and the second heat dissipation copper plate 112 through the first heat-conducting copper pipe 109 and the second heat-conducting copper pipe 110. Subsequently, the heat diffuses to the surfaces of the first heat dissipation fins 108 and the second heat dissipation fins 113. Simultaneously, the fan blades inside the cooling fan housing 114 rotate to generate airflow. This airflow passes through the series air duct formed by the first air duct housing 106 and the second air duct housing 111, forcibly convecting and expelling the heat from the first heat dissipation fins 108 and the second heat dissipation fins 113, achieving dual-path heat conduction and coordinated air cooling. When external airflow enters the device through the air inlet outer slot 2, the air inlet dustproof net 201 physically intercepts dust and particulate matter in the air through its mesh structure, preventing... When the plug enters the equipment, the air inlet protective cover 202, on the basis of fixing the dustproof net 201, further blocks the impact of large-sized foreign objects or directly blocks the dustproof net 201. The fixing screw 203 ensures the structural stability of both under the action of airflow and facilitates easy disassembly and cleaning in the future. Finally, the dustproof function is achieved through multi-level protection. When the external plug is inserted into the socket outer groove 3, the socket protective pad 301 wraps the plug surface through elastic deformation, buffers the mechanical impact during the insertion and removal process and fills the gap between the plug and the socket outer groove 3, reducing wear. At the same time, the protection point fixing rod 302 forms a rigid support through the fixing rod locking block 303 and the locking structure of the inner wall of the socket outer groove 3, limiting the excessive displacement of the socket protective pad 301. During multiple insertions and removals, the sealing and positioning accuracy of the protective pad 301 are maintained, thereby achieving the functions of dustproof, impact-proof and extending the socket life.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A projection heat dissipation structure for a flat panel, comprising a flat panel bottom shell (1), wherein a flat panel motherboard (101) and a heat dissipation module (102) are fixedly mounted on the top of the flat panel bottom shell (1), and a connecting cable (103) is electrically connected to the top of the flat panel motherboard (101), the other end of the connecting cable (103) being electrically connected to the top of the heat dissipation module (102), characterized in that: The heat dissipation module (102) is fixed with a first heat exchange component (104) and a second heat exchange component (105) on one side, the flat bottom shell (1) is fixed with a first air duct shell (106) on the top, the first air duct shell (106) is fixed with a first heat dissipation copper plate (107) on the top, the first heat dissipation copper plate (107) is fixed with a first heat dissipation fin (108) on the bottom, the first heat exchange component (104) is fixed with a first heat conduction copper pipe (109) on the top, the other end of the first heat conduction copper pipe (109) is fixed on the top of the first heat dissipation copper plate (107), the second heat exchange component (105) is fixed with a second heat conduction copper pipe (110) on the top, the other end of the second heat conduction copper pipe (110) is fixed on the top of the first heat dissipation copper plate (107), the flat bottom shell (1) is fixed with a second air duct shell (111) on the top, one end of the second air duct shell (111) is communicated with one end of the first air duct shell (106), the second air duct shell (111) is fixed with a second heat dissipation copper plate (112) on the top, the second heat dissipation copper plate (112) is fixed with a second heat dissipation fin (113) on the bottom, the flat bottom shell (1) is fixed with a heat dissipation fan shell (114) on the top, the heat dissipation fan shell (114) is internally provided with a fan blade, the fan blade is driven to rotate by an internal motor, and the internal motor is fixed to the inner wall of the heat dissipation fan shell (114).

2. The projection heat dissipation structure for a tablet according to claim 1, characterized in that: The flat bottom shell (1) is provided with an air inlet outer groove (2) on one side, the air inlet outer groove (2) is provided with an air inlet dustproof net (201) on one side, the air inlet dustproof net (201) is provided with an air inlet protection cover plate (202) on one side, and the air inlet dustproof net (201) and the air inlet protection cover plate (202) are fixed to one side of the flat bottom shell (1) through fixing screws (203).

3. The projection heat dissipation structure for flat panel according to claim 1, characterized in that: The flat bottom shell (1) is provided with a jack outer groove (3) on one side, the inner wall of the jack outer groove (3) is provided with a jack protection pad (301), the jack protection pad (301) is fixed with a protection point fixed rod (302) on one side, the surface of the protection point fixed rod (302) is fixed with a fixed rod clamping block (303), and the protection point fixed rod (302) is nested on the inner wall of the jack outer groove (3).

4. The projection heat dissipation structure for a tablet according to claim 3, characterized in that: The inner wall of the jack outer groove (3) is provided with an inclined groove (4).

5. The projection heat dissipation structure for flat panel according to claim 1, characterized in that: The heat dissipation fan shell (114) is provided with a fan upper shell (5) on the top, and the fan upper shell (5) is detachably fixed on the top of the heat dissipation fan shell (114).

6. The projection heat sink structure for a tablet according to claim 1, wherein: The flat bottom shell (1) is provided with a base fixed groove (6) on the bottom.

7. The projection heat sink structure for a tablet according to claim 1, wherein: The corners of the flat bottom shell (1) are all edges.

Images