Data line magnetic induction type ultrathin keyboard attached with FPC (Flexible Printed Circuit)

Abstract

The utility model discloses a data line magnetic induction type ultra-thin keyboard attached with an FPC (Flexible Printed Circuit). The data line magnetic induction type ultra-thin keyboard comprises a plurality of integral scissor keys, a scissor supporting plate and a single single-sided FPC, the integral scissor foot key is fixed on the scissor foot supporting plate; a magnetic induction integrated circuit chip corresponding to the integral scissor foot key is arranged on the single single-sided FPC and is attached to the upper surface or the lower surface of the scissor foot supporting plate; the number of pins for communication between the FPC and the MCU is not more than 4; the magnetic induction integrated circuit chip is integrated with a magnetic induction circuit and a magical color RGB circuit or is only integrated with the magnetic induction circuit. The plurality of magnetic induction integrated circuit chips are connected in series or in parallel and then communicate with the MCU. According to the utility model, the circuit design requirement can be met only through the single-layer single-face FPC, the structure is simple, and the ghost key can be naturally prevented in principle; the FPC is attached to the lower surface of the scissor foot supporting plate, so that the assembly is convenient and the maintenance is convenient; and meanwhile, the digital switch type magnetic induction key is high in anti-interference capability.

Description

Technical Field

[0001] This utility model relates to the field of keyboards, and in particular to an ultra-thin keyboard with magnetic induction for attaching an FPC data cable. Background Technology

[0002] In the field of keyboards, especially laptop keyboards, the thickness of the keyboard is crucial. Ultra-thin keyboards are of great significance to the realization of the overall ultra-thin design of laptops.

[0003] Existing ultra-thin laptop keyboards are mostly achieved through membrane keyboards. For example, the technical solution with patent publication number CN103578828A and patent application title "Ultra-thin Keyboard" discloses an ultra-thin keyboard including a support layer, a flexible circuit board stacked on the support layer, a membrane switch, a silicone sheet, and a PET reinforcing layer. The membrane switch is attached to the corresponding key position on the flexible circuit board, and the silicone sheet is printed with keycap patterns and attached to the PET reinforcing layer, which is assembled with the flexible circuit board. This solution uses PET membrane switches to replace silicone buttons, reducing the weight and thickness of the keyboard and eliminating one silicone button layer. However, the structure is still relatively complex. As those skilled in the art know, this ultra-thin keyboard is a membrane keyboard, so the flexible circuit board alone requires three layers (including an upper and lower circuit layer, and an isolation layer between the upper and lower circuit layers). Adding the support layer, PET reinforcing layer, membrane switch, and silicone sheet, the structure is quite complex. This solution only improves the structure of the membrane keyboard by modifying the setting or position of the membrane button directly below the key; other structural elements must still be retained.

[0004] The structural complexity of the above solution is also reflected in the fact that: higher-end laptop keyboards may have backlighting (monochrome or RGB). To achieve this function, the above solution can only add a backlight layer with three layers (including circuit layer, diffusion layer, and reflective film layer) on the basis of the original structure, making the overall structure more than six layers, which is more complex and further increases the thickness of the keyboard.

[0005] In addition, existing ultra-thin keyboard MCUs use a matrix scanning method to operate several chips on a flexible circuit board in order to reduce power consumption, but the following problems still exist: they cannot solve the problem of ghost keys. The usual solution is to add a diode at the intersection of each row and column, but this undoubtedly makes the circuit more complex.

[0006] For example, the technical solution with authorization announcement number CN101860369B and utility model name "Matrix Keyboard and its Scanning Method" uses N first column lines and second column lines to intersect with N row lines to form N×(N+1) matrix intersection points. A diode is set at the intersection point of each row line and the corresponding first column line. The cathode of the diode at an intersection point is connected to the row line constituting the intersection point, and the anode is connected to the column line constituting the intersection point. Although the solution uses diodes, not every chip has a diode, and its function is not to prevent ghost keys (as stated in paragraph

[0008] of the technical solution specification, "If a key on the second column line is pressed, other keys on the same row line as the pressed key are blocked and not processed," indicating that it cannot prevent ghost keys), but rather to allow the row and column lines to be reused.

[0007] For example, the technical solution with authorization announcement number CN110660604B and utility model name "Anti-Ghosting Membrane Switch Device" also mentions in the background technology of the specification that "currently, membrane keyboards generally adopt a high-impedance design to avoid ghosting problems, such as connecting an additional diode to each key, so as to prevent ghosting by using the difference in forward and reverse impedance of the diode. However, this method will inevitably increase the process complexity of membrane switches, reduce process yield, and increase costs." The solution is to set a first thin film layer, a second thin film layer, and a spacer layer. One end of each second signal line through the second thin film layer is connected to the second trigger point, and the other end extends directly to the second output terminal, so that after each corresponding first trigger point and second trigger point make contact and conduct, an individual signal can be output to prevent ghosting. The core of this technical solution is to divide the chip matrix into more parts, and each chip matrix includes fewer chips. The problems caused by this are: 1. The number of I / O ports of the required MCU increases significantly (as shown in the attached figure of the technical solution specification). Figure 3 The wiring of flexible circuits is more complex. The solution proposed in this technical solution is to split a single layer of flexible circuit into two layers of flexible circuit and an isolation layer, namely a first thin film layer, a second thin film layer, and a spacer layer (as shown in the attached figure of the technical solution specification). Figure 1 2. This technical solution cannot achieve full keyboard anti-ghosting, but can only achieve anti-ghosting for some keys or key keys.

[0008] As the above analysis shows, in the history of ultra-thin keyboard development, the improvement path of membrane keyboards, as the mainstream design, has failed to completely solve the problems of complex multi-layer structures and ghost keys. Moreover, the solutions are often accompanied by new technical problems, which is a difficult obstacle to overcome in the realization of ultra-thin keyboards such as laptop keyboards. Utility Model Content

[0009] The purpose of this invention is to overcome the shortcomings and deficiencies of the prior art and provide a magnetic induction ultra-thin keyboard with an attached FPC data cable.

[0010] The objective of this utility model is achieved through the following technical solution:

[0011] A magnetic induction ultrathin keyboard with an attached FPC includes several integrated scissor-switch keys, a scissor-switch support plate, and a single-sided FPC. The integrated scissor-switch keys are fixed to the scissor-switch support plate by scissor-switch pins, and the single-sided FPC is attached to the upper or lower surface of the scissor-switch support plate. Several magnetic induction integrated circuit chips corresponding to the integrated scissor-switch keys are disposed on the single-sided FPC. The number of pins for communication between the FPC and the MCU does not exceed four.

[0012] The magnetic induction integrated circuit chip integrates a magnetic induction circuit and a RGB color circuit; the scissor-leg bracket and the scissor-leg support plate are integrally formed by a single aluminum substrate or the scissor-leg bracket is assembled onto the scissor-leg support plate.

[0013] Several magnetic induction integrated circuit chips are connected in series and communicate with the MCU. The FPC has four pins for communication with the MCU. Each magnetic induction integrated circuit chip includes a power pin, a ground pin, a data input pin, and a data output pin. The power pin supplies power to the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding. The data output pin of each magnetic induction integrated circuit chip is connected to the data input pin of the next adjacent magnetic induction integrated circuit chip, and the data input pin of each magnetic induction integrated circuit chip is connected to the data output pin of the previous adjacent magnetic induction integrated circuit chip. The connections between the data input and output pins of several magnetic induction integrated circuit chips form a data line. Several magnetic induction integrated circuit chips are cascaded and connected to the MCU. One magnetic induction integrated circuit chip, in conjunction with a button with a magnetic element, obtains one button information. The RGB color circuit and the magnetic induction circuit share the data line and transmit RGB color grayscale information and button information in a time-division multiplexing manner.

[0014] Alternatively, several magnetic induction integrated circuit chips can be connected in parallel to communicate with the MCU. The FPC has three pins for communication with the MCU. Each magnetic induction integrated circuit chip contains a programmable address code, including a power pin, a ground pin, and a data pin. The power pin is used to supply power to the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding. The power pins of the n magnetic induction integrated circuit chips are connected in parallel to share the power network VCC, the ground pins are connected in parallel to share the ground network GND, and the data pins are connected in parallel to share the data line network DIO and are connected to the MCU. The data information of the magnetic induction integrated circuit chips is modulated on the data line network DIO for transmission. The sequence number of the magnetic induction integrated circuit chip on the FPC is written into the address code of the corresponding magnetic induction integrated circuit chip. The data information code period sequence number sent by the MCU after the address code corresponds one-to-one with the sequence number of the magnetic induction integrated circuit chip on the FPC.

[0015] Alternatively, several magnetic induction integrated circuit chips can be connected in parallel to communicate with the MCU, with the FPC having two pins for communication with the MCU. Each magnetic induction integrated circuit chip contains a programmable address code, including a power supply pin and a ground pin. The power supply pin is used to power the magnetic induction integrated circuit chip and transmit information, while the ground pin is used for signal grounding and power grounding. The power supply pins of the n magnetic induction integrated circuit chips are connected in parallel to share a common power network VCC and are connected to the MCU. The ground pins are connected in parallel to share a common ground network GND. The data information of the magnetic induction integrated circuit chips is modulated onto the power network VCC for transmission. The sequence number of the magnetic induction integrated circuit chip on the FPC is written into the address code of the corresponding magnetic induction integrated circuit chip. The data information code period sequence number sent by the MCU after the address code corresponds one-to-one with the sequence number of the magnetic induction integrated circuit chip on the FPC.

[0016] A magnetic induction ultrathin keyboard with an attached FPC includes several integrated scissor-switch keys, a scissor-switch support plate, and a single-sided FPC. The integrated scissor-switch keys are fixed to the scissor-switch support plate by scissor-switch pins, and the single-sided FPC is attached to the upper or lower surface of the scissor-switch support plate. Several magnetic induction integrated circuit chips corresponding to the integrated scissor-switch keys are disposed on the single-sided FPC. The number of pins for communication between the FPC and the MCU does not exceed four.

[0017] The magnetic induction integrated circuit chip only integrates the magnetic induction circuit; the scissor-leg bracket and the scissor-leg support plate are integrally formed by a single aluminum substrate or the scissor-leg bracket is assembled onto the scissor-leg support plate.

[0018] Several magnetic induction integrated circuit chips are connected in series and communicate with an MCU. The FPC has four pins for communication with the MCU. Each magnetic induction integrated circuit chip includes a power supply pin, a ground pin, a data input pin, and a data output pin. The power supply pin is used to power the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding. The data output pin of each magnetic induction integrated circuit chip is connected to the data input pin of the next adjacent magnetic induction integrated circuit chip, and the data input pin of each magnetic induction integrated circuit chip is connected to the data output pin of the previous adjacent magnetic induction integrated circuit chip. Several magnetic induction integrated circuit chips are cascaded together and connected to the MCU. The connections between the data input and data output pins of the integrated circuit chips form a data line. One magnetic induction integrated circuit chip, in conjunction with a button with a magnetic element, generates one button message, and multiple button messages are transmitted through the data line.

[0019] Alternatively, several magnetic induction integrated circuit chips can be connected in parallel to communicate with the MCU. The FPC has three pins for communication with the MCU. Each magnetic induction integrated circuit chip contains a programmable address code, including a power pin, a ground pin, and a data pin. The power pin is used to supply power to the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding. The power pins of the n magnetic induction integrated circuit chips are connected in parallel to share the power network VCC, the ground pins are connected in parallel to share the ground network GND, and the data pins are connected in parallel to share the data line network DIO and are connected to the MCU. The data information of the magnetic induction integrated circuit chips is modulated on the data line network DIO for transmission. The sequence number of the magnetic induction integrated circuit chip on the FPC is written into the address code of the corresponding magnetic induction integrated circuit chip. The data information code period sequence number sent by the MCU after the address code corresponds one-to-one with the sequence number of the magnetic induction integrated circuit chip on the FPC.

[0020] Alternatively, several magnetic induction integrated circuit chips can be connected in parallel to communicate with the MCU, with the FPC having two pins for communication with the MCU. Each magnetic induction integrated circuit chip contains a programmable address code, including a power supply pin and a ground pin. The power supply pin is used to power the magnetic induction integrated circuit chip and transmit information, while the ground pin is used for signal grounding and power grounding. The power supply pins of the n magnetic induction integrated circuit chips are connected in parallel to share a common power network VCC and are connected to the MCU. The ground pins are connected in parallel to share a common ground network GND. The data information of the magnetic induction integrated circuit chips is modulated onto the power network VCC for transmission. The sequence number of the magnetic induction integrated circuit chip on the FPC is written into the address code of the corresponding magnetic induction integrated circuit chip. The data information code period sequence number sent by the MCU after the address code corresponds one-to-one with the sequence number of the magnetic induction integrated circuit chip on the FPC.

[0021] The integral scissor-switch key includes a keycap, a magnetic element, scissor feet, a spring, and a spring countersunk plate. The bottom of the keycap is provided with a magnetic element that moves up and down in the hollow part of the spring. The spring is mounted on the spring countersunk plate, and the spring countersunk plate is mounted on the scissor foot support plate. After the spring passes through the hollow part of the scissor feet, it contacts the bottom of the keycap. The scissor feet are fixed to the scissor foot bracket provided on the scissor foot support plate.

[0022] Furthermore, the magnetic induction direction of the magnetic induction integrated circuit chip is vertical, and the magnetic element will move up and down on the horizontal magnetic induction surface of the magnetic induction integrated circuit chip, and the N and S poles of the magnetic element are either horizontal or vertical.

[0023] After the polarity of the magnetic element is reversed relative to the magnetic induction integrated circuit chip, the conduction and cutoff travel of the button can be adjusted by setting the values ​​of the magnetic parameters BOP and BRP of the magnetic induction integrated circuit chip.

[0024] When several magnetic induction integrated circuit chips are connected in parallel to communicate with the MCU, the address code of the magnetic induction integrated circuit chip has several bits. When n magnetic induction integrated circuit chips with address codes are used together in parallel, the initial address code of the magnetic induction integrated circuit chip is reprogrammed by a custom address code instruction. The sequence bit of the magnetic induction integrated circuit chip on the FPC is written into the address code of the corresponding magnetic induction integrated circuit chip. The operation on the address code of the magnetic induction integrated circuit chip is the operation on the magnetic induction integrated circuit chip corresponding to the address code. Each magnetic induction integrated circuit chip also corresponds to a button, so the operation on the address code of the magnetic induction integrated circuit chip is the operation on the button corresponding to the magnetic induction integrated circuit chip.

[0025] When several magnetic induction integrated circuit chips are connected in parallel to communicate with the MCU, the address code of each magnetic induction integrated circuit chip has n bits, and each magnetic induction integrated circuit chip also has its own identification code UID. After the custom address code instruction reads the UID code, it writes this UID code along with a natural sequence code to be set into the magnetic induction integrated circuit chip. After the magnetic induction integrated circuit chip compares this UID code with its own UID code and finds that they are correct, it stores the corresponding sequence bit of the magnetic induction integrated circuit chip into the address code. The operation on the address code of the magnetic induction integrated circuit chip is the operation on the magnetic induction integrated circuit chip corresponding to the address code. Each magnetic induction integrated circuit chip also corresponds to a button, so the operation on the address code of the magnetic induction integrated circuit chip is the operation on the button corresponding to the magnetic induction integrated circuit chip.

[0026] When several magnetic induction integrated circuit chips are connected in parallel and communicate with the MCU, the address codes of the magnetic induction integrated circuit chips are melted using laser fusing technology to fuse the initial address codes of the n magnetic induction integrated circuit chips, so that their address codes become the sequence positions of the magnetic induction integrated circuit chips on the FPC. The operation on the address code of the magnetic induction integrated circuit chip is the operation on the magnetic induction integrated circuit chip corresponding to the address code. Each magnetic induction integrated circuit chip also corresponds to a button, so the operation on the address code of the magnetic induction integrated circuit chip is the operation on the button corresponding to the magnetic induction integrated circuit chip.

[0027] When several magnetic induction integrated circuit chips are connected in series and communicate with the MCU, the information of a single key is transmitted bit by bit. The n keys of the entire keyboard correspond to n bits of information. The n bits of information and the reset information form the key information of one cycle. The operating frequency of each magnetic induction integrated circuit chip is adjusted according to the cycle of the MCU reading all key information.

[0028] The MCU sends out n bit codes corresponding to n magnetic induction integrated circuit chips at once, and the n bit codes are passed through n buttons in sequence;

[0029] Each button corresponds to one bit, and each bit corresponds to a unipolar return-to-zero code. The initial code 0 state of the button is set to a high level occupying an integer period that is no greater than a first set value. When a button is passed, if the button is not pressed, the button's code is adjusted to the placeholder code 0 state, which is a high level occupying an integer period that is no greater than a second set value and greater than the first set value. If the button is pressed, the button's code is adjusted to the code 1 state, which is a high level occupying an integer period that is greater than a third set value, and the third set value is greater than the second set value.

[0030] Alternatively, after the MCU issues a reset code, several key presses are transmitted in an accumulative manner until they are transmitted to the MCU.

[0031] When several of the aforementioned magnetic induction integrated circuit chips are connected in series and communicate with the MCU, the information of a single button is transmitted in one byte. The information of a single button includes the synchronization information of the x bit, the operating frequency information of the magnetic induction integrated circuit chip of the y bit, and the button voltage information of the z bit; the sum of the x bit, y bit, and z bit is one byte; the button voltage information is continuous voltage information or digital voltage value.

[0032] The n keys on the keyboard correspond to n bytes of information, and the n bytes of information and the reset information together form the key information for one cycle.

[0033] After the MCU sends a reset code, the information from several buttons is transmitted in an accumulating manner until it is transmitted to the MCU.

[0034] Alternatively, the MCU can send out n bytes of encoding corresponding to n magnetic induction integrated circuit chips at once, and the n bytes of encoding will pass through n buttons in sequence;

[0035] Each button corresponds to one byte, and each bit in the byte corresponds to a unipolar return-to-zero code.

[0036] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0037] 1. The number of pins for communication between the FPC and the MCU in this utility model does not exceed 4. Only one layer of FPC is needed to meet the circuit design requirements. The circuit is simple and achieves the same effect as the original circuit that required at least 6 layers, truly realizing an ultra-thin effect.

[0038] 2. The circuit of this utility model can naturally prevent ghost keys in principle: When the magnetic induction integrated circuit chip is connected in series and communicates with the MCU, the key information is transmitted from one key to another. The key information is independent and there is no ghost key; When the magnetic induction integrated circuit chip is connected in parallel and communicates with the MCU, the key information is simultaneous in time, but there is an address code, which can naturally distinguish each key.

[0039] 3. The FPC of this utility model can be attached to the lower surface of the scissor-switch support plate, which is easy to assemble and convenient to maintain. In contrast, existing ultra-thin keyboard PBCs or FPCs can only be placed on the support plate because membrane keyboards must place the support layer at the bottom. The FPC of this utility model can be attached to either the lower or upper surface of the scissor-switch support plate.

[0040] 4. The magnetic induction direction of the magnetic induction integrated circuit chip of the button of this utility model is vertical, and the N and N poles of the magnetic element are horizontal or vertical. It is a digital magnetic induction button (the button is turned on by the change of high level 1 and low level 0). Its anti-interference ability is much higher than that of ordinary analog magnetic induction buttons (the button is turned on by the magnitude of the sensed magnetic flux).

[0041] 5. In this invention, after the polarity of the magnetic element relative to the magnetic induction integrated circuit chip is reversed, the conduction and cut-off travel of the button are adjusted by setting the magnetic parameters BOP and BRP of the magnetic induction integrated circuit chip, thereby achieving an adjustable travel in a switch-type manner with strong anti-interference capability.

[0042] 6. This utility model has only two layers: a scissor-leg support plate and an FPC. The scissor-leg support plate itself does not contain any circuitry. After drilling holes in the scissor-leg support plate, a single-sided FPC sheet is attached to its upper or lower surface, thus avoiding the impact of impacts and vibrations during production on the circuit structure. Attached Figure Description

[0043] Figure 1 An exploded view of a magnetic induction ultrathin keyboard with an FPC-attached data cable.

[0044] Figure 2 This is a side view of a magnetic induction ultra-thin keyboard with an attached FPC data cable.

[0045] Figure 3 for Figure 2 A magnified view of a portion of the image.

[0046] Figure 4 This is an exploded view of the buttons.

[0047] Figure 5 This is a schematic diagram of a structure in which several magnetic induction integrated circuit chips are connected in series with an MCU.

[0048] Figure 6 This is a schematic diagram illustrating the magnetic induction principle of a magnetic element moving up and down when the cross-section of the magnetic element is circular and the N and S poles of the magnetic element are horizontal.

[0049] Figure 7 This is a schematic diagram illustrating the magnetic induction principle of a magnetic element moving up and down when the cross-section of the magnetic element is rectangular and the N and S poles of the magnetic element are horizontal.

[0050] Figure 8 This is a schematic diagram illustrating the time-division transmission of data information from the RGB color-changing driver circuit and the magnetic induction circuit.

[0051] Figure 9 This is a schematic diagram of a structure in which several magnetic induction integrated circuit chips are connected in parallel with an MCU.

[0052] Figure 10 This is another schematic diagram of a structure in which several magnetic induction integrated circuit chips are connected in parallel with an MCU.

[0053] Figure 11 This is a schematic diagram illustrating the magnetic induction principle of a magnetic element moving up and down when the cross-section of the magnetic element is circular and the N and S poles of the magnetic element are perpendicular.

[0054] Figure 12 This is a circuit diagram of an integrated circuit chip with three address codes and a weak pull-up resistor R on the data line DIO.

[0055] Figure 13 This is a schematic diagram of obtaining button information from three integrated circuit chips with address codes.

[0056] Figure 14 This is a schematic diagram of high and low level encoding.

[0057] Figure 15 This is a schematic diagram of a complete GRB (Grammar) color code cycle.

[0058] Figure 16 This is a schematic diagram of a complete magnetic parameter code period.

[0059] Figure 17 This is a schematic diagram of a complete key press information code cycle.

[0060] The meanings of the reference numerals in the attached figures are as follows:

[0061] 1-Keycap, 2-Scissor-switch support plate, 3-Single-sided FPC sheet, 4-Scissor-switch, 5-Magnetic induction integrated circuit chip, 6-Magnetic component, 7-Spring, 8-Spring sink, 9-Scissor-switch bracket, 101-First magnetic component, 102-Second magnetic component, 103-Third magnetic component. Detailed Implementation

[0062] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of the present invention is not limited thereto.

[0063] Example 1

[0064] like Figures 1 to 4 A magnetic induction ultrathin keyboard with an attached FPC data cable includes several integrated scissor-switch keys, a scissor-switch support plate 2, and a single-sided FPC 3. The several integrated scissor-switch keys are fixed to the scissor-switch support plate 2 by scissor-switch 4, and the single-sided FPC 3 is attached to the upper or lower surface of the scissor-switch support plate 2. Several magnetic induction integrated circuit chips 5 corresponding to the integrated scissor-switch keys are disposed on the single-sided FPC 3. The number of pins for communication between the FPC and the MCU does not exceed 4.

[0065] The magnetic induction integrated circuit chip 5 integrates a magnetic induction circuit and a RGB color circuit;

[0066] like Figure 5Several magnetic induction integrated circuit chips are connected in series and communicate with the MCU. The FPC has four pins for communication with the MCU. Each magnetic induction integrated circuit chip includes a power pin, a ground pin, a data input pin, and a data output pin. The power pin is used to supply power to the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding. The data output pin of the magnetic induction integrated circuit chip is connected to the data input pin of the next adjacent magnetic induction integrated circuit chip, and the data input pin of the magnetic induction integrated circuit chip is connected to the data output pin of the previous adjacent magnetic induction integrated circuit chip. The connections between the data input pins and data output pins of several magnetic induction integrated circuit chips form a data line. Several magnetic induction integrated circuit chips are cascaded and connected to the MCU. One magnetic induction integrated circuit chip, in conjunction with a button with a magnetic element, obtains one button information. The RGB color circuit and the magnetic induction circuit share the data line and transmit RGB color grayscale information and button information in a time-division multiplexing manner.

[0067] like Figure 4 The integral scissor-switch key includes a keycap 1, a magnetic element 6, scissor legs 4, a spring 7, and a spring base 8. The bottom of the keycap 1 is provided with a magnetic element 6 that moves up and down in the hollow part of the spring 7. The spring 7 is mounted on the spring base 8, and the spring base 8 is mounted on the scissor leg support plate 2. After passing through the hollow part of the scissor legs 4, the spring 7 contacts the bottom of the keycap 1. The scissor legs 4 are fixed to a scissor leg bracket 9 provided on the scissor leg support plate 2. The magnetic induction direction of the magnetic induction integrated circuit chip 5 is vertical. The magnetic element 6 moves up and down in the horizontal magnetic induction surface of the magnetic induction integrated circuit chip 5 through the hollow part of the spring 7, and the N and N poles of the magnetic element are horizontal.

[0068] The cross-section of the magnetic element is circular (e.g., ...). Figure 6 ) or rectangle (such as Figure 7 When the magnetic element 6 is stationary, it is located above one side of the magnetic induction integrated circuit chip 5. As the magnetic element 6 moves up and down, it passes through the opening on the FPC and reciprocates vertically along the horizontal plane of the magnetic induction integrated circuit chip 5, causing the magnetic induction integrated circuit chip 5 to close or open. During the up and down movement of the magnetic element 6, it always remains parallel to the horizontal plane of the magnetic induction integrated circuit chip 5, either on the opposite plane or on the same plane. When the magnetic element is parallel to the horizontal plane of the magnetic induction integrated circuit chip 5, the N pole or S pole of the magnetic element is directly opposite the horizontal plane of the magnetic induction integrated circuit chip 5.

[0069] The magnetic parameters BOP and BRP of the magnetic induction integrated circuit chip are programmable. After the polarity of the magnetic element is reversed relative to the magnetic induction integrated circuit chip, the conduction and cutoff travel of the integrated scissor-switch button can be adjusted by setting the values ​​of the magnetic parameters BOP and BRP of the magnetic induction integrated circuit chip. The magnetic polarity of the integrated circuit chip is programmable.

[0070] BOP stands for Operating Point, which refers to the minimum magnetic field strength required for a Hall switch to begin conducting under magnetic influence.

[0071] BRP stands for Release Point, which refers to the maximum magnetic field strength at which a Hall switch closes under magnetic influence.

[0072] FPC, or FPCB, stands for Flexible Printed Circuit Board.

[0073] n magnetic induction integrated circuit chips with data lines are cascaded. Each magnetic induction integrated circuit chip integrates a magnetic induction circuit and a RGB color circuit. Each magnetic induction integrated circuit chip includes a power pin, a ground pin, a data information input pin, and a data information output pin. The power pin is used to supply power to the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding. The RGB color circuit and the magnetic induction circuit share the data information input pin and the data information output pin.

[0074] like Figure 5 The data input pin of the first magnetic induction integrated circuit chip is DIA(1) and the data output pin is DOA(1). The data input pin of the second magnetic induction integrated circuit chip is DIA(2) and the data output pin is DOA(2). The data input pin of the third magnetic induction integrated circuit chip is DIA(3) and the data output pin is DOA(3). The remaining magnetic induction integrated circuit chips follow the same pattern.

[0075] like Figure 8 In this embodiment, the following communication protocol is adopted: LED data codes and key data codes of the RGB circuit are transmitted in a time-division manner according to different read / write commands. The RGB circuit writes to the data line, while the magnetic induction circuit reads from the data line. The magnetic induction circuit, in conjunction with a switch with a magnetic component, obtains key information to form key data codes. The biggest advantage of time-division transmission is that it can increase the frequency of key information code acquisition, thereby improving key response speed.

[0076] When several magnetic induction integrated circuit chips are connected in series and communicate with the MCU, the information of a single key is transmitted bit by bit. The n keys of the entire keyboard correspond to n bits of information. The n bits of information and the reset information form the key information of one cycle. The operating frequency of each magnetic induction integrated circuit chip is adjusted according to the cycle of the MCU reading all key information.

[0077] The MCU sends out n bit codes corresponding to n magnetic induction integrated circuit chips at once, and the n bit codes are passed through n buttons in sequence;

[0078] Each button corresponds to one bit, and each bit corresponds to a unipolar return-to-zero code. The initial code 0 state of the button is set to a high level occupying an integer period that is no greater than a first set value. When a button is passed, if the button is not pressed, the button's code is adjusted to the placeholder code 0 state, which is a high level occupying an integer period that is no greater than a second set value and greater than the first set value. If the button is pressed, the button's code is adjusted to the code 1 state, which is a high level occupying an integer period that is greater than a third set value, and the third set value is greater than the second set value.

[0079] Alternatively, after the MCU issues a reset code, several key presses are transmitted in an accumulative manner until they are transmitted to the MCU.

[0080] Example 2

[0081] Example 2 is identical to Example 1 except for the following content:

[0082] like Figure 9 Several magnetic induction integrated circuit chips are connected in parallel to communicate with the MCU. The FPC has three pins for communication with the MCU. Each magnetic induction integrated circuit chip contains a programmable address code, including a power pin, a ground pin, and a data pin. The power pin is used to supply power to the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding. The power pins of the n magnetic induction integrated circuit chips are connected in parallel to share the power network VCC, the ground pins are connected in parallel to share the ground network GND, and the data pins are connected in parallel to share the data line network DIO and are connected to the MCU. The data information of the magnetic induction integrated circuit chips is modulated on the data line network DIO for transmission. The sequence number of the magnetic induction integrated circuit chip on the FPC is written into the address code of the corresponding magnetic induction integrated circuit chip. The data information code period sequence number sent by the MCU after the address code corresponds one-to-one with the sequence number of the magnetic induction integrated circuit chip on the FPC.

[0083] When several magnetic induction integrated circuit chips are connected in parallel and communicate with the MCU, the address code of each magnetic induction integrated circuit chip has several bits. When n magnetic induction integrated circuit chips with address codes are used together in parallel, the initial address code of the magnetic induction integrated circuit chips is reprogrammed through a custom address code instruction. The sequence number of the magnetic induction integrated circuit chip on the FPC is written into the address code of the corresponding magnetic induction integrated circuit chip. The operation on the address code of the magnetic induction integrated circuit chip is the operation on the magnetic induction integrated circuit chip corresponding to the address code. Each magnetic induction integrated circuit chip also corresponds to a button, so the operation on the address code of the magnetic induction integrated circuit chip is the operation on the button corresponding to the magnetic induction integrated circuit chip. That is to say: the T1 time period sequence of the data information code period sequence 1 sent by the MCU after the address code corresponds to the magnetic induction integrated circuit chip with sequence 1 on the FPC; the T2 time period sequence of the data information code period sequence 2 sent by the MCU after the address code corresponds to the magnetic induction integrated circuit chip with sequence 2 on the FPC; and the T3 time period sequence of the data information code period sequence 3 sent by the MCU after the address code corresponds to the magnetic induction integrated circuit chip with sequence 3 on the FPC.

[0084] like Figure 9 There are n magnetic induction integrated circuit chips with address codes connected in parallel to form a row, forming a VCC network, a ground GND network, and a data line DIO network; all networks with the same name are electrically connected. The n magnetic induction integrated circuit chips with address codes are sequenced from left to right as sequence 1, sequence 2, sequence 3... sequence n chips in the coordinate system. The first magnetic element moves from beginning to end above each magnetic induction integrated circuit chip with an address code, according to a custom sequence. When the first magnetic element moves above the first-position magnetic induction integrated circuit chip, the chip senses a voltage change through magnetic induction and receives an address code instruction and address code 1. It then saves the number 1 as the address code. Next, when the first magnetic element moves above the second-position magnetic induction integrated circuit chip, it senses a voltage change through magnetic induction and receives an address code instruction and address code 2. It then saves the number 2 as the address code. Similarly, when the first magnetic element moves above the third-position magnetic induction integrated circuit chip, it senses a voltage change through magnetic induction and receives an address code assignment instruction and address code 3. It then saves the number 3 as the address code. This process continues, thus completing the regular natural sequence address codes for the chips in sequence 1, sequence 2, sequence 3… sequence n. This natural sequence address code greatly facilitates information communication. The same applies to n integrated chips.

[0085] like Figure 12 , 13The data line DIO has a weak pull-up resistor R=1K, and the three magnetic induction integrated circuit chips with address codes are numbered 1, 2, and 3 from left to right.

[0086] like Figure 13 Only the magnetic induction integrated circuit chip with address 2 is affected by the second magnetic element 102. For the sake of logical relationship description, it is assumed that the magnetic induction integrated circuit chip with address code that is not affected by the magnetic element is in logic 1 state, and the magnetic induction integrated circuit chip with address code that is affected by the magnetic element is in logic 0 state.

[0087] according to Figure 14 The 0 code specification shows that the typical value of TOH1 is 1 / 4Tt, and the typical value of TOL1 is 3 / 4Tt; according to Figure 14 As shown in the code, the typical value of TOH2 is 3 / 4Tt, and the typical value of TOL2 is 1 / 4Tt. Figure 13 In the T2 time sequence code, there are a total of 6 time nodes, namely T20, T21, T22, T23, T24, and T30. DIO_TX and DIO_RX are waveforms of the same data line at the same time. Theoretically, it is the DIO_TX waveform, but due to the magnetic induction integrated circuit chip of address code 2 being affected by the second magnetic element 102, only the DIO_RX waveform can be seen on the oscilloscope.

[0088] The following is the complete process of the button waveform change: The MCU provides a complete button information code cycle, the bus reset code RESET, the instruction code CMD to obtain button information, the start address code ADDR1, and then... Figure 13 The 3-bit button information code following the start address code ADDR1 on the DIO_TX line is described in detail, focusing on the change process of the button's high and low levels in DIO_TX.

[0089] In practice, we do not need to set the address code of the corresponding integrated circuit chip before obtaining each key information code; we only need to provide the starting address code. Figure 13 The DIO_TX waveform in the example is like this, with the starting address code being 1, followed by the first time series period T1, the second time series period T2, and the third time series period T3.

[0090] The address code corresponding to the sequence 1 integrated circuit chip is 1, corresponding to the first time series period T1. The sequence 1 magnetic induction integrated circuit chip is not acted upon by the first magnetic element 101, and is in a logic 1 state. The sequence 1 magnetic induction integrated circuit chip in a logic 1 state does not make any changes to the waveform of DIO_TX within period T1. In time series period T1, DIO_RX can be read... Figure 14 The code shown is 1.

[0091] At time T10, the MCU control unit outputs a weak pull-up level in DIO_TX. At time T12, it detects that the weak pull-up level has not changed, and at this point, the MCU control unit has read the integrated circuit output at address code 1 in DIO_RX. Figure 14 The code shown indicates that the button switch at position 1 was not pressed, and the MCU control unit outputs a low level from time T13 until time node T20.

[0092] The address code corresponding to the sequence 2 magnetic induction integrated circuit chip is 2. The sequence 2 magnetic induction integrated circuit chip corresponds to the time series period T2. The sequence 2 magnetic induction integrated circuit chip is acted upon by the second magnetic element 102. This magnetic induction integrated circuit chip is in the logic 0 state. The sequence 2 magnetic induction integrated circuit chip in the logic 0 state pulls the high level of DIO_TX low at time T21 within the corresponding period T2, and continues to do so until time T24. The sequence 2 magnetic induction integrated circuit chip pulls the high level of DIO_TX low. Figure 14 The code shown has been changed to DIO_RX. Figure 14 The code shown is 0. At time series period T2, DIO_RX can read... Figure 14 The code shown is 0.

[0093] At time T20, the MCU control unit outputs a weak pull-up level in DIO_TX. At time T22, it detects that the weak pull-up level has changed to a low level. At this point, the MCU control unit has read the output of the magnetic induction integrated circuit chip at sequence bit 2 of DIO_RX. Figure 14 The code 0 indicates that the button switch with sequence code 2 was pressed and recognized. The MCU control unit outputs a low level at time T23 until time node T30. Time T23 is slightly earlier than time T24.

[0094] The address code corresponding to the sequence 3 magnetic induction integrated circuit chip is 3. The sequence 3 magnetic induction integrated circuit chip corresponds to time series period T3. The sequence 3 magnetic induction integrated circuit chip is not affected by the third magnetic element 103; it is in logic 1 state. The magnetic induction integrated circuit chip with address code 3, in logic 1 state, does not make any changes to the waveform of DIO_TX within period T3. During time series period T3, DIO_RX can be read... Figure 14 The code shown is 1.

[0095] At time T30, the MCU control unit outputs a weak pull-up level in DIO_TX. At time T32, it detects that the weak pull-up level has not changed. At this point, the MCU control unit has read the output of the magnetic induction integrated circuit chip at sequence 3 of DIO_RX. Figure 14The code 1 shown indicates that the button switch for address code 3 is not pressed. The MCU control unit outputs a low level at time T33 until the time series period T3 ends.

[0096] The button information of the magnetic induction integrated circuit chip with sequence number 1 corresponds to timing period T1, the button information of the magnetic induction integrated circuit chip with sequence number 2 corresponds to timing period T2, and the button information of the magnetic induction integrated circuit chip with sequence number 3 corresponds to timing period T3. That is to say, T1, T2, and T3 can be continuously output and correspond to the button information of the integrated circuit chips with address codes 1, 2, and 3 respectively, without needing to add their respective address codes before the button information.

[0097] In summary: When all magnetic induction integrated circuit chips are arrayed using an FPC, they are sequentially arranged into a natural number sequence 1, 2, 3...n. The address code of the first magnetic induction integrated circuit chip is written as 1, the address code of the second chip is written as 2, the address code of the third chip is written as 3, and the address code of the nth chip is written as n. This one-to-one correspondence facilitates convenient and correct operation by the MCU. For the operation of n consecutive magnetic induction integrated circuit chips, the MCU only needs to provide a starting address code after the operation command, and then... The following are T1, T2, T3...Tn information code timing cycles. At this time, the starting address code is set to 1, indicating that the operation starts from the first magnetic induction integrated circuit chip. The data information of the first timing code cycle T1 is the information output to the first magnetic induction integrated circuit chip, the data information of the second timing cycle T2 is the information output to the second magnetic induction integrated circuit chip, the data information of the third timing cycle T3 is the information output to the third magnetic induction integrated circuit chip, and the data information of the nth timing cycle Tn is the information output to the nth magnetic induction integrated circuit chip.

[0098] After the magnetic parameter command, T1, T2, T3...Tn represent the timing cycle of the magnetic parameter code; after the color command code, T1, T2, T3...Tn represent the timing cycle of the color grayscale code GRB; after the key information acquisition command code, T1, T2, T3...Tn represent the timing cycle of the key information code.

[0099] This completes the sequential positioning of the magnetic induction integrated circuit chips on the FPC board space, with the starting address code corresponding one-to-one with the timing cycle of the data information; each magnetic induction integrated circuit chip corresponds to a button, and the operation of the magnetic induction integrated circuit chip corresponds to the operation of the button.

[0100] A complete information code cycle process:

[0101] A complete GRB color coding cycle (e.g.) Figure 15Add a complete magnetic parameter encoding cycle (e.g.) Figure 16 Add another complete key press information code cycle (e.g.) Figure 17 A complete information code cycle is represented by a single address code. The address codes for n magnetic induction integrated circuit chips with address codes form a natural sequence 1, 2, 3…n. This address code can be used as a direct address code, meaning that a data cycle code is added after a specified address code. In other words, there is an address code after a custom instruction code, and each address code is followed by a corresponding data information code cycle. This means that each data information code cycle is preceded by a corresponding address code. For example, this method can be used to individually correspond one or more non-contiguous address codes to a specific GRB (Grammar Inspiration) code or magnetic parameter code.

[0102] In most cases, the address code following the instruction code is used as the starting address code. This means that n consecutive data information code cycles are sent after this starting address. The sequence of the data information code cycles sent by the MCU after the address code corresponds one-to-one with the sequence of the magnetic induction integrated circuit chip on the FPC. That is, data information code cycle timing T1 corresponds to magnetic induction integrated circuit chip sequence 1, data information code cycle timing T2 corresponds to magnetic induction integrated circuit chip sequence 2, data information code cycle timing T3 corresponds to magnetic induction integrated circuit chip sequence 3, and data information code cycle timing Tn corresponds to magnetic induction integrated circuit chip sequence n. This is more commonly used when operating n complete magnetic induction integrated circuit chips or dozens of consecutive magnetic induction integrated circuit chips. In these cases, only the starting address code needs to be given in the instruction code; it is not necessary to list the address codes of all natural sequences after the instruction code.

[0103] Assuming the starting address code is 1, there are n key information codes. Subtracting this starting address code from the address code corresponding to the magnetic induction integrated circuit chip will allow us to find the chip's corresponding code among the n codes. According to this rule, the first code corresponds to the first magnetic induction integrated circuit chip, the second code corresponds to the second magnetic induction integrated circuit chip, the third code corresponds to the third magnetic induction integrated circuit chip, and so on, with the nth code corresponding to the nth magnetic induction integrated circuit chip. This instruction code format is more efficient.

[0104] For example, suppose the starting address code is 51. At this time, there are 50 key information codes. According to this rule, the first code corresponds to the 51st magnetic induction integrated circuit chip, the second code corresponds to the 52nd magnetic induction integrated circuit chip, and the third code corresponds to the 53rd magnetic induction integrated circuit chip. This instruction code performs corresponding operations on the 51st to 100th magnetic induction integrated circuit chips.

[0105] For example, if all magnetic induction integrated circuit chips are required to light up with the same grayscale level, a custom broadcast command code can be defined and broadcast directly. This means using a broadcast command code with GRB bytecode, without needing an address code. Similarly, if all magnetic induction integrated circuit chips are required to have the same magnetic parameter settings, a custom broadcast command code can be defined and broadcast directly, with the magnetic parameter code included, without needing an address code. This address-code-free broadcast command code is more convenient and efficient.

[0106] If the PC is in sleep mode, the MCU can send an instruction code to all magnetic induction integrated circuit chips to put them into sleep mode and then into interrupt wake-up mode. If a key is pressed in this mode, an interrupt reporting mode is activated. This interrupt reporting mode uses an address code along with the key code, allowing the magnetic induction integrated circuit chips to actively report, resulting in lower power consumption. If the keyboard is not used for an extended period, the MCU can, based on the actual situation, allow the magnetic induction integrated circuit chips to enter or exit this mode at any time.

[0107] Example 3

[0108] Example 3 is identical to Example 1 except for the following content:

[0109] like Figure 10 Several magnetic induction integrated circuit chips are connected in parallel to communicate with the MCU. The FPC has two pins for communication with the MCU. Each magnetic induction integrated circuit chip contains a programmable address code, including a power supply pin and a ground pin. The power supply pin is used to supply power to the magnetic induction integrated circuit chip and transmit information, while the ground pin is used for signal grounding and power grounding. The power supply pins of n magnetic induction integrated circuit chips are connected in parallel to share a power network VCC and are connected to the MCU. The ground pins are connected in parallel to share a ground network GND. The data information of the magnetic induction integrated circuit chips is modulated on the power network VCC for transmission. The sequence number of the magnetic induction integrated circuit chip on the FPC is written into the address code of the corresponding magnetic induction integrated circuit chip. The data information code period sequence number sent by the MCU after the address code corresponds one-to-one with the sequence number of the magnetic induction integrated circuit chip on the FPC.

[0110] When several magnetic induction integrated circuit chips are connected in parallel to communicate with the MCU, the address code of each magnetic induction integrated circuit chip has n bits, and each magnetic induction integrated circuit chip also has its own identification code UID. After the custom address code instruction reads the UID code, it writes this UID code along with a natural sequence code to be set into the magnetic induction integrated circuit chip. After the magnetic induction integrated circuit chip compares this UID code with its own UID code and finds that they are correct, it stores the corresponding sequence bit of the magnetic induction integrated circuit chip into the address code. The operation on the address code of the magnetic induction integrated circuit chip is the operation on the magnetic induction integrated circuit chip corresponding to the address code. Each magnetic induction integrated circuit chip also corresponds to a button, so the operation on the address code of the magnetic induction integrated circuit chip is the operation on the button corresponding to the magnetic induction integrated circuit chip.

[0111] Example 4

[0112] Example 4 is identical to Example 1 except for the following content:

[0113] The magnetic induction integrated circuit chip only integrates magnetic induction circuitry;

[0114] Several magnetic induction integrated circuit chips are connected in series and communicate with an MCU. The FPC has four pins for communication with the MCU. Each magnetic induction integrated circuit chip includes a power supply pin, a ground pin, a data input pin, and a data output pin. The power supply pin is used to power the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding. The data output pin of each magnetic induction integrated circuit chip is connected to the data input pin of the next adjacent magnetic induction integrated circuit chip, and the data input pin of each magnetic induction integrated circuit chip is connected to the data output pin of the previous adjacent magnetic induction integrated circuit chip. Several magnetic induction integrated circuit chips are cascaded together and connected to the MCU. The connections between the data input and data output pins of the integrated circuit chips form a data line. Each magnetic induction integrated circuit chip, in conjunction with a button with a magnetic element, generates a button message, and multiple button messages are transmitted through the data line.

[0115] like Figure 11 The magnetic element has a circular cross-section, and the N and N poles of the magnetic element 6 are perpendicular to each other.

[0116] When several of the aforementioned magnetic induction integrated circuit chips are connected in series and communicate with the MCU, the information of a single button is transmitted in one byte. The information of a single button includes the synchronization information of the x bit, the operating frequency information of the magnetic induction integrated circuit chip of the y bit, and the button voltage information of the z bit; the sum of the x bit, y bit, and z bit is one byte; the button voltage information is continuous voltage information or digital voltage value.

[0117] The n keys on the keyboard correspond to n bytes of information, and the n bytes of information and the reset information together form the key information for one cycle.

[0118] After the MCU sends a reset code, the information from several buttons is transmitted in an accumulating manner until it is transmitted to the MCU.

[0119] Alternatively, the MCU can send out n bytes of encoding corresponding to n magnetic induction integrated circuit chips at once, and the n bytes of encoding will pass through n buttons in sequence;

[0120] Each button corresponds to one byte, and each bit in the byte corresponds to a unipolar return-to-zero code.

[0121] Example 5

[0122] Example 5 is identical to Example 2 except for the following content:

[0123] The magnetic induction integrated circuit chip only integrates the magnetic induction circuit.

[0124] When several magnetic induction integrated circuit chips are connected in parallel and communicate with the MCU, the address codes of the magnetic induction integrated circuit chips are melted using laser fusing technology to fuse the initial address codes of the n magnetic induction integrated circuit chips, so that their address codes become the sequence positions of the magnetic induction integrated circuit chips on the FPC. The operation on the address code of the magnetic induction integrated circuit chip is the operation on the magnetic induction integrated circuit chip corresponding to the address code. Each magnetic induction integrated circuit chip also corresponds to a button, so the operation on the address code of the magnetic induction integrated circuit chip is the operation on the button corresponding to the magnetic induction integrated circuit chip.

[0125] When several of the aforementioned magnetic induction integrated circuit chips are connected in parallel to communicate with the MCU, the magnetic induction integrated circuit chip is a unipolar magnetic induction integrated circuit chip or a linear magnetic induction integrated circuit chip. The unipolar magnetic induction integrated circuit chip includes unipolar magnetic induction chips, unipolar magnetoresistive chips (AMR, GMR, TMR).

[0126] Example 6

[0127] Example 6 is identical to Example 3 except for the following content:

[0128] The magnetic induction integrated circuit chip only integrates the magnetic induction circuit.

[0129] In Examples 1 to 6, the scissor legs are fixed to the scissor leg support plate by scissor leg brackets. The scissor leg brackets and the scissor leg support plate are either integral (the scissor leg brackets and the scissor leg support plate are integrally formed by a single aluminum substrate) or combined (the scissor leg brackets are assembled onto the scissor leg support plate).

[0130] The total thickness of the FPC after being attached to the lower surface of the scissor-switch support plate is between 0.08mm and 0.18mm. The height of the scissor-switch feet plus keycaps and the thinnest scissor-switch bracket can be 3.5mm to 3.7mm. The height of the LED light is 0.3mm to 0.4mm (typical value 0.35mm, using an inverted mounting process, installed on the upper surface of the scissor-switch support plate). The LED light does not occupy the total thickness. Therefore, the total thickness of the ultra-thin keyboard can be 3.58mm to 3.88mm, which is thinner than existing keyboards and more suitable for ultra-thin laptops and other applications. At the same time, it has more powerful functions, natural anti-ghosting, and strong anti-interference ability.

[0131] The ultra-thin keyboard of this invention is particularly suitable for laptop applications. At the same time, depending on the needs of different applications, it can also be made thicker. By adjusting the height of accessories such as scissor-switch feet and scissor-switch feet brackets, keyboards of different thicknesses can be achieved.

[0132] The above embodiments are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present utility model shall be considered equivalent substitutions and shall be included within the protection scope of the present utility model.

Claims

1. A data line magnetic induction type ultra-thin keyboard with FPC attached, characterized in that, The application relates to a keyboard, which comprises a plurality of integral scissors-leg buttons, a scissors-leg support plate and a single-face FPC; the plurality of integral scissors-leg buttons are fixed on the scissors-leg support plate through scissors-legs, and the single-face FPC is attached to the upper surface or the lower surface of the scissors-leg support plate; a plurality of magnetic induction integrated circuit chips corresponding to the integral scissors-leg buttons are arranged on the single-face FPC; the number of pins for communication between the FPC and the MCU is not more than four; the magnetic induction integrated circuit chip only integrates a magnetic induction circuit; the scissors-leg support of the scissors-leg is integrally formed with the scissors-leg support plate through an aluminum base plate or is assembled to the scissors-leg support plate.

2. A data line magnetic induction type ultra-thin keyboard with FPC attached, characterized in that, The application relates to a keyboard, which comprises a plurality of integral scissors-leg buttons, a scissors-leg support plate and a single-face FPC; the plurality of integral scissors-leg buttons are fixed on the scissors-leg support plate through scissors-legs, and the single-face FPC is attached to the upper surface or the lower surface of the scissors-leg support plate; a plurality of magnetic induction integrated circuit chips corresponding to the integral scissors-leg buttons are arranged on the single-face FPC; the number of pins for communication between the FPC and the MCU is not more than four; the magnetic induction integrated circuit chip only integrates a magnetic induction circuit; the scissors-leg support of the scissors-leg is integrally formed with the scissors-leg support plate through an aluminum base plate or is assembled to the scissors-leg support plate.

3. The data line magnetic induction type ultra-thin keyboard with attached FPC according to claim 1 or 2, characterized in that, The integral scissors-leg button comprises a key cap, a magnetic element, scissors-legs, a spring and a spring sink; the magnetic element moves up and down in the hollow part of the spring; the spring is installed on the spring sink which is installed on the scissors-leg support plate; the spring passes through the hollow part of the scissors-leg and contacts the bottom of the key cap; the scissors-leg is fixed on the scissors-leg support of the scissors-leg support plate; The magnetic induction direction of the magnetic induction integrated circuit chip is the vertical direction, the magnetic element moves up and down on the horizontal magnetic induction interface of the magnetic induction integrated circuit chip, and the NS pole direction of the magnetic element is the horizontal direction or the vertical direction.

4. The data line magnetic induction type ultra-thin keyboard with attached FPC according to claim 3, wherein, After the polarity of the magnetic element relative to the magnetic induction integrated circuit chip is reversed, the size of the magnetic parameter BOP and BRP of the magnetic induction integrated circuit chip can be used to adjust the on stroke and the off stroke of the button.

5. The data line magnetic induction type ultra-thin keyboard with attached FPC according to claim 1 or 2, characterized in that, A plurality of magnetic induction integrated circuit chips are connected in series and communicate with the MCU, and the number of pins for communication between the FPC and the MCU is four; the magnetic induction integrated circuit chip comprises a power supply pin, a grounding pin, a data information input pin and a data information output pin; the power supply pin is used for power supply of the magnetic induction integrated circuit chip, and the grounding pin is used for signal grounding and power supply grounding; the data information output pin of the magnetic induction integrated circuit chip is connected with the data information input pin of the next magnetic induction integrated circuit chip, and the data information input pin of the magnetic induction integrated circuit chip is connected with the data information output pin of the previous magnetic induction integrated circuit chip; the connection line between the data information input pin and the data information output pin of the plurality of magnetic induction integrated circuit chips forms a data line.

6. The data line magnetic induction type ultra-thin keyboard with attached FPC according to claim 1 or 2, characterized in that, Several magnetic induction integrated circuit chips are connected in parallel and communicate with MCU, the number of pins for FPC to communicate with MCU is 3; the magnetic induction integrated circuit chip contains programmable address code, including power pin, ground pin and data pin, the power pin is used to supply power for the magnetic induction integrated circuit chip, and the ground pin is used for signal grounding and power grounding; the power pins of n magnetic induction integrated circuit chips are connected in parallel to share power network VCC, the ground pins are connected in parallel to share ground network GND, and the data pins are connected in parallel to share data line network DIO and are connected to MCU; the data information of the magnetic induction integrated circuit chip is modulated and transmitted on the data line network DIO.

7. The data line magnetic induction type ultra-thin keyboard with attached FPC according to claim 1 or 2, characterized in that, Several magnetic induction integrated circuit chips are connected in parallel and communicate with MCU, the number of pins for FPC to communicate with MCU is 2; the magnetic induction integrated circuit chip contains programmable address code, including power pin and ground pin, the power pin is used to supply power for the magnetic induction integrated circuit chip and transmit information, and the ground pin is used for signal grounding and power grounding; the power pins of n magnetic induction integrated circuit chips are connected in parallel to share power network VCC and are connected to MCU, and the ground pins are connected in parallel to share ground network GND; the data information of the magnetic induction integrated circuit chip is modulated and transmitted on the power network VCC.

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