Protective structure of semiconductor laser

Abstract

The utility model discloses a protection structure of a semiconductor laser, and relates to the technical field of semiconductor lasers, the protection structure of the semiconductor laser is used for being installed on the semiconductor laser, the protection structure of the semiconductor laser comprises a laser main body, a protection cover, an injection assembly and a heat dissipation assembly, and the laser main body is provided with a laser emission source; the protective cover is mounted on one side of the laser main body, an air inlet and an air outlet are formed in the protective cover, a light beam channel and an air flow channel which are independent are arranged in the protective cover, one port of the light beam channel faces a target piece, the other port of the light beam channel is communicated with an emission port of the laser emission source, and the air flow channel is communicated with the air inlet and the air outlet; the spraying assembly is arranged in the light beam channel so as to spray laser to the target piece; the heat dissipation assembly is detachably arranged in the air flow channel and used for accelerating flowing of air in the air flow channel. According to the technical scheme provided by the utility model, the problem that the welding material cannot be cooled by the existing semiconductor laser is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor laser technology, and in particular to a protective structure for semiconductor lasers. Background Technology

[0002] Semiconductor lasers are widely used in industrial processing, medical equipment, optical communication and defense technology due to their advantages such as small size, light weight, high reliability and long service life.

[0003] In industrial processing, when using lasers to cut materials, a high-temperature laser beam is required to achieve the cutting purpose. Throughout the entire processing, the surface of the material after laser welding is typically at a high temperature.

[0004] Most existing lasers do not have the function of air cooling the material surface after laser welding. This will bring some problems. For example, the material surface may be exposed to high temperature for a long time, which may cause changes in the microstructure of the material, affect the physical and chemical properties of the material, and reduce the quality of the material. Utility Model Content

[0005] The main purpose of this invention is to propose a protective structure for semiconductor lasers, which aims to solve the problem that existing semiconductor lasers cannot cool down the welding materials.

[0006] To achieve the above objectives, the present invention proposes a protective structure for a semiconductor laser, the protective structure of which includes:

[0007] The main body of the laser is equipped with a laser emission source;

[0008] A protective cover is installed on one side of the laser body. The protective cover has an air inlet and an exhaust outlet. The interior of the protective cover has an independent beam channel and an airflow channel. One end of the beam channel faces the target, and the other end of the beam channel is connected to the emission port of the laser emission source. The airflow channel connects the air inlet and the exhaust outlet.

[0009] A jetting assembly, disposed inside the beam channel, for jetting laser light toward the target; and

[0010] A heat dissipation component is detachably disposed inside the airflow channel to accelerate the flow of gas within the airflow channel.

[0011] In one embodiment, the heat dissipation assembly includes a heat sink and a plurality of heat dissipation fins. The heat sink has a vent that communicates with the airflow channel. The plurality of heat dissipation fins are arranged on the side of the heat sink facing the air inlet, and the gap between two adjacent heat dissipation fins forms a heat dissipation channel.

[0012] In one embodiment, the heat dissipation fins are wavy in a plane direction parallel to the heat sink.

[0013] In one embodiment, the heat dissipation assembly further includes a tongue, which is disposed on the outer periphery of the heat dissipation base and is detachably installed inside the airflow channel.

[0014] In one embodiment, the jetting assembly includes a nozzle detachably disposed inside the beam channel, and a plurality of jet holes are spaced apart on the sidewall of the nozzle.

[0015] In one embodiment, the injection assembly further includes an air blowing element detachably mounted on one end of the nozzle facing the target and located on the central axis of the nozzle.

[0016] In one embodiment, the protective structure of the semiconductor laser further includes a buffer assembly disposed between the protective shield and the laser body to connect the periphery of the protective shield and the periphery of the laser body.

[0017] In one embodiment, the buffer assembly is a multi-layer structure, which includes a shock-absorbing layer, a honeycomb plate, and a thermally conductive pad stacked sequentially. The shock-absorbing layer is connected to the laser body, and the thermally conductive pad is connected to the protective cover.

[0018] In one embodiment, the protective structure of the semiconductor laser further includes a purification component, which is detachably embedded in the exhaust port.

[0019] In one embodiment, the protective structure of the semiconductor laser further includes a dustproof component, which is detachably embedded in the air inlet.

[0020] In one embodiment, the purification component includes a filter screen and a breathable baffle that are stacked on top of each other, with the filter screen located on the outside of the exhaust port and the breathable baffle located on the inside of the exhaust port.

[0021] The technical solution of this utility model involves setting a protective cover below the laser body, and setting independent beam channels and airflow channels inside the protective cover; the laser emission source in the laser body emits laser light, which is transmitted through the beam channel, with one end of the beam channel facing the target part. The internal jetting component accurately jets the laser light onto the target part, thereby realizing the processing of the target part (such as cutting, welding, etc.); external air enters the airflow channel inside the protective cover from the air inlet, and the heat dissipation component accelerates the flow of gas in the airflow channel, causing the air to flow rapidly in the airflow channel, carrying away the heat generated during laser processing. Then the hot air is discharged from the exhaust port, forming an air circulation system that meets the dual requirements of welding and heat dissipation, thereby improving the welding quality of the target part. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 A schematic diagram of an embodiment of the protective structure for a semiconductor laser provided by this utility model;

[0024] Figure 2 A schematic diagram of the internal structure of the protective cover in one embodiment of the protective structure for the semiconductor laser provided by this utility model;

[0025] Figure 3 A schematic diagram of the heat dissipation component in another embodiment of the protective structure for the semiconductor laser provided by this utility model;

[0026] Figure 4 A schematic diagram of the jet assembly in another embodiment of the protective structure for the semiconductor laser provided by this utility model;

[0027] Figure 5 A schematic diagram of the buffer component in another embodiment of the protective structure for the semiconductor laser provided by this utility model;

[0028] Figure 6 for Figure 2 Enlarged view of point A in the middle.

[0029] Explanation of icon numbers:

[0030] 100. Protective Structure of Semiconductor Laser; 1. Laser Body; 2. Protective Cover; 21. Air Inlet; 22. Exhaust Outlet; 23. Beam Channel; 24. Airflow Channel; 3. Jet Assembly; 31. Nozzle; 311. Spray Hole; 32. Air Blowing Component; 4. Heat Dissipation Assembly; 41. Heat Dissipation Base; 411. Ventilation Port; 42. Heat Dissipation Fins; 43. Extension Tongue; 5. Buffer Assembly; 51. Shock Absorbing Layer; 52. Honeycomb Panel; 53. Thermal Conductive Pad; 6. Purification Assembly; 61. Filter Screen; 62. Breathable Baffle; 7. Dustproof Assembly.

[0031] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0033] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0034] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0035] Most existing lasers do not have the function of air cooling the material surface after laser welding. This will bring some problems. For example, the material surface may be exposed to high temperature for a long time, which may cause changes in the microstructure of the material, affect the physical and chemical properties of the material, and reduce the quality of the material.

[0036] This invention proposes a protective structure for semiconductor lasers, which is used for mounting on semiconductor lasers.

[0037] Please see Figure 1 and Figure 2 In one embodiment of this utility model, the protective structure 100 of the semiconductor laser includes:

[0038] Laser body 1, equipped with a laser emission source;

[0039] The protective cover 2 is installed on one side of the laser body 1. The protective cover 2 is provided with an air inlet 21 and an exhaust outlet 22. The interior of the protective cover 2 is provided with an independent beam channel 23 and an airflow channel 24. One end of the beam channel 23 faces the target, and the other end of the beam channel 23 is connected to the emission port of the laser emission source. The airflow channel 24 connects the air inlet 21 and the exhaust outlet 22.

[0040] The jetting assembly 3 is disposed inside the beam channel 23 to jet laser light onto the target component; and

[0041] The heat dissipation component 4 is detachably located inside the airflow channel 24 to accelerate the flow of gas within the airflow channel 24.

[0042] The technical solution of this utility model is to set a protective cover 2 below the laser body 1, and set an independent beam channel 23 and airflow channel 24 inside the protective cover 2; the laser emission source in the laser body 1 emits laser light, which is transmitted through the beam channel 23. One end of the beam channel 23 faces the target part, and the internal jet assembly 3 accurately jets the laser light onto the target part, thereby realizing the processing of the target part (such as cutting, welding, etc.); external air enters the airflow channel 24 inside the protective cover 2 from the air inlet 21, and the heat dissipation assembly 4 accelerates the flow of gas in the airflow channel 24, so that the air flows rapidly in the airflow channel 24, carrying away the heat generated during the laser processing. Then the hot air is discharged from the exhaust port 22, forming an air circulation system, which meets the dual requirements of welding and heat dissipation, and improves the welding quality of the target part.

[0043] Specifically, the protective cover 2 can be a conical cover with multiple internal partitions that divide the internal space of the protective cover 2 into independent beam channels 23 and airflow channels 24. Optionally, the partitions can be elastic plates, utilizing their retractable properties to fold into the desired shape. For example, the beam channel 23 can be a conical channel, and the airflow channel 24 can be an annular channel located around the beam channel 23. That is, air from the target surface can flow through the airflow channel 24 around the beam channel 23 and be discharged through the exhaust port 22. It should be noted that the air inlet 21 and the exhaust port 22 can be circular or square holes, and a threaded structure can be provided around the air inlet 21 to facilitate the installation of air intake pipes or filters. The protective cover 2 and the laser body 1 can be installed by bolt connection or snap-fit, ensuring a stable connection. The jetting assembly 3 can be an optical system composed of lenses and mirrors. These optical elements can be mounted on a bracket, which is then fixed inside the beam channel 23 with screws or glue. The lens is used to focus the laser beam, enabling the laser to be accurately focused on the target object and improving the laser energy density. The mirror can adjust the propagation direction of the laser, ensuring that the laser is transmitted to the target object along a predetermined path. The heat dissipation assembly 4 can be a small fan, which is fixed inside the airflow channel 24 with screws or clips. When the fan rotates, it can accelerate the flow of gas within the airflow channel 24, improving heat dissipation efficiency.

[0044] In the embodiments of this utility model, please refer to Figure 3 The heat dissipation assembly 4 includes a heat sink 41 and multiple heat dissipation fins 42. The heat sink 41 has vents 411 that communicate with the airflow channel 24. The multiple heat dissipation fins 42 are arranged on the side of the heat sink 41 facing the air inlet 21, and the gap between two adjacent heat dissipation fins 42 forms a heat dissipation channel. The number of vents 411 is not specifically limited and can be evenly distributed along one side of the heat sink 41. The heat sink 41 can be made of a metal alloy with high thermal conductivity. The heat dissipation fins 42 are long and thin rectangular plates, and the distance between two adjacent heat dissipation fins 42 can be 1.5-2mm to ensure smooth airflow and provide sufficient heat dissipation area. The heat dissipation fins 42 and the heat sink 41 can be connected by riveting or thermally conductive adhesive to ensure a firm connection.

[0045] In this embodiment of the invention, the heat dissipation fins 42 are wavy in the plane parallel to the heat sink 41. Compared to a straight fin structure, the airflow path becomes more complex and tortuous when air flows through the wavy heat dissipation fins 42. This increases both the contact time and the contact area between the air and the heat dissipation fins 42. The heat dissipation fins 42 conduct heat to the air, and the hot air continues to flow in the airflow channel 24 and is eventually discharged from the exhaust port 22, thereby effectively maintaining the internal temperature stability of the laser. The wavelength and wave amplitude of the wavy fins are not limited and can be adaptively designed according to the size of the heat sink 41.

[0046] In the embodiments of this utility model, please refer to Figure 3 The heat dissipation assembly 4 also includes a tongue 43, which is located on the outer periphery of the heat sink 41 and is detachably installed inside the airflow channel 24. The tongue 43 can be elongated, and one end of the tongue 43 can be provided with a hook structure for engaging with a slot inside the airflow channel 24 to achieve detachable installation. The surface of the tongue 43 can also be provided with some heat dissipation protrusions, which further increase the contact area between the tongue 43 and the air, improving heat dissipation efficiency.

[0047] In the embodiments of this utility model, please refer to Figure 4 The jet assembly 3 includes a nozzle 31, which is detachably disposed inside the beam channel 23. Multiple nozzle holes 311 are spaced apart on the sidewall of the nozzle 31. The nozzle 31 can be a combination of a cone and a cylinder, with the conical portion located at the front end for easy laser beam focusing, and the cylindrical portion located at the rear end, with multiple nozzle holes 311 on its sidewall. The nozzle 31 can be detachably mounted inside the beam channel 23 via a threaded structure, facilitating replacement and position adjustment.

[0048] In the embodiments of this utility model, please refer to Figure 4 The jet assembly 3 also includes an air blowing component 32, which is detachably mounted on the end of the nozzle 31 facing the target part and located on the central axis of the nozzle 31. The air blowing component 32 can be a slender cylindrical sleeve with an external thread at one end for engaging with the internal thread on the nozzle 31 to achieve detachable installation. The air outlet of the air blowing component 32 can be circular, and an inclined guide vane can also be provided at the air outlet to control the direction of gas blowing. The laser body 1 can have a structure such as an air pump inside. After laser welding or cutting is completed, the air pump structure is connected to the air blowing component 32 through a pipeline, and the air blowing component 32 is used to blow gas onto the target part to clean the residual welding debris and other impurities on the target part.

[0049] In the embodiments of this utility model, please refer to Figure 1 and Figure 5The protective structure 100 of the semiconductor laser also includes a buffer assembly 5, which is disposed between the protective cover 2 and the laser body 1 to connect the periphery of the protective cover 2 and the periphery of the laser body 1. The buffer assembly 5 can be a rubber-metal composite structure, and its shape can be ring-shaped. Its inner diameter matches the outer diameter of the laser body 1, and its outer diameter matches the inner diameter of the protective cover 2. Multiple elastic support columns are evenly distributed on the upper surface of the ring-shaped structure. This allows the vibration generated by the laser body 1 during operation to be buffered before being transmitted to the protective cover 2, reducing the shaking of the protective cover 2.

[0050] In the embodiments of this utility model, please refer to Figure 5 The buffer assembly 5 has a multi-layer structure, which includes a shock-absorbing layer 51, a honeycomb panel 52, and a thermally conductive pad 53 stacked sequentially. The shock-absorbing layer 51 is connected to the laser body 1, and the thermally conductive pad 53 is connected to the protective cover 2. The shock-absorbing layer 51 can be made of rubber, the honeycomb panel 52 can be made of hexagonal aluminum alloy honeycomb holes, and the thermally conductive pad 53 can be made of graphite-copper composite material. The shock-absorbing layer 51 and the laser body 1 can be connected by adhesive, and the thermally conductive pad 53 is fixed to the protective cover 2 by screws. The honeycomb panel 52 is sandwiched between the shock-absorbing layer 51 and the thermally conductive pad 53. The three components are fixed into a whole buffer assembly 5 by adhesive or clips.

[0051] In the embodiments of this utility model, please refer to Figure 2 and Figure 6 The protective structure 100 of the semiconductor laser also includes a purification component 6, which is detachably embedded in the exhaust port 22. The purification component 6 can employ a multi-layer filtration structure. For example, the outer layer is a coarse filter made of woven stainless steel wire with a mesh size of approximately 0.5-1 mm, primarily used to intercept larger dust particles. The middle layer is an activated carbon filter layer, approximately 2-3 cm thick, used to adsorb harmful gases and odors. The inner layer is a high-efficiency particulate air (HEPA) filter, capable of filtering out particles larger than 0.3 micrometers in diameter. The purification component 6 is detachably embedded in the exhaust port 22 via a snap-fit ​​structure, facilitating regular cleaning and replacement. When hot air is discharged from the exhaust port 22, the purification component 6 purifies the discharged air, removing any dust, impurities, and harmful gases that may be present, preventing these pollutants from dispersing into the surrounding environment.

[0052] In the embodiments of this utility model, please refer to Figure 6The purification component 6 includes a filter screen 61 and a breathable baffle 62 stacked on top of each other. The filter screen 61 is located on the outside of the exhaust port 22, and the breathable baffle 62 is located on the inside of the exhaust port 22. At the exhaust port 22, the purification component 6 functions. The outer filter screen 61 first filters the exhaust air, intercepting dust, impurities, and other particles. The breathable baffle 62, located inside the exhaust port 22, allows the filtered air to exit smoothly while preventing external impurities from re-entering the protective structure from the exhaust port 22. It also guides and stabilizes the airflow.

[0053] In the embodiments of this utility model, please refer to Figure 2 The protective structure 100 of the semiconductor laser also includes a dustproof component 7, which is detachably embedded in the air inlet 21. This prevents large particles such as dust and hair from entering the protective structure when air enters, reducing dust accumulation on internal components. The dustproof component 7 can employ a dual-layer filtration structure. The outer layer is a pre-filter made of porous plastic with pores approximately 1-2 mm in diameter, primarily blocking larger dust and hair particles. The inner layer is a fine filter made of nylon fiber with pores approximately 0.1-0.3 mm in size, filtering out smaller dust particles. The dustproof component 7 is detachably embedded in the air inlet 21 via a slotted structure.

[0054] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A protection structure of a semiconductor laser for mounting on a semiconductor laser, characterized by, The semiconductor laser protection structure comprises a laser body provided with a laser emission source; a protective cover installed on one side of the laser body, the protective cover being provided with an air inlet and an air outlet, and the interior of the protective cover being provided with independent light beam channels and air flow channels, one end of the light beam channels being directed towards a target object, the other end of the light beam channels being connected to the emission port of the laser emission source, and the air flow channels being connected to the air inlet and the air outlet; a spraying assembly arranged in the interior of the light beam channels to spray laser beams towards the target object; and a heat dissipation assembly arranged in the interior of the air flow channels to accelerate the flow of gas in the air flow channels. The heat dissipation assembly comprises a heat dissipation seat provided with a ventilation port connected to the air flow channels, and a plurality of heat dissipation fins arranged on the side of the heat dissipation seat facing the air inlet, the gaps between two adjacent heat dissipation fins forming heat dissipation channels. The heat dissipation fins are wavy in the direction parallel to the plane of the heat dissipation seat. The heat dissipation assembly further comprises a tongue arranged on the outer periphery of the heat dissipation seat and detachably installed in the interior of the air flow channels. The spraying assembly comprises a nozzle detachably arranged in the interior of the light beam channels, the side wall of the nozzle being provided with a plurality of spray holes at intervals. The spraying assembly further comprises a blowing member detachably installed on one end of the nozzle facing the target object and located on the central axis of the nozzle.

2. The protection structure for a semiconductor laser as claimed in claim 1, wherein The semiconductor laser protection structure further comprises a buffer assembly arranged between the protective cover and the laser body to connect the periphery of the protective cover and the periphery of the laser body.

3. The protection structure for a semiconductor laser as claimed in claim 2, wherein The buffer assembly is a multi-layer structure comprising a shock-absorbing layer, a honeycomb panel and a heat-conducting gasket arranged in sequence, the shock-absorbing layer being connected to the laser body, and the heat-conducting gasket being connected to the protective cover.

4. The protection structure for a semiconductor laser as claimed in claim 3, wherein The semiconductor laser protection structure further comprises a purification assembly detachably embedded at the air outlet.

5. The protection structure for a semiconductor laser as claimed in claim 1, wherein The semiconductor laser protection structure further comprises a dustproof assembly detachably embedded at the air inlet.

6. The protection structure for a semiconductor laser as claimed in claim 5, wherein The purification assembly comprises a filter screen and a gas-permeable baffle arranged in sequence, the filter screen being arranged on the outside of the air outlet, and the gas-permeable baffle being arranged on the inside of the air outlet.

7. The protection structure for a semiconductor laser as claimed in claim 1, wherein ​ 8. The protection structure for a semiconductor laser as claimed in claim 7, wherein ​ 9. The protection structure for a semiconductor laser as claimed in any one of claims 1 to 8, wherein ​ 10. The protection structure for a semiconductor laser as claimed in claim 9, wherein ​ ​ ​

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