Liquid-cooled heat dissipation module and power supply

Abstract

The utility model relates to the technical field of power supplies, in particular to a liquid-cooled heat dissipation module and a power supply, the liquid-cooled heat dissipation module comprises a first shell and a second shell, a joint layer is arranged between the first shell and the second shell, and a flow channel is arranged in the joint layer; one side of the joint layer serves as the shell bottom of the first shell, and the other side of the joint layer serves as the shell bottom of the second shell; a liquid cooling input port and a liquid cooling output port are fixed on the outer walls of the first shell and the second shell; one end of the flow channel is connected with the liquid-cooling input port, and the other end is connected with the liquid-cooling output port. When cooling liquid circularly flows in the flow channel through the liquid cooling input port and the liquid cooling output port, heat dissipation is carried out on a heat source installed on the shell bottom, and the space volume of liquid cooling heat dissipation is effectively reduced. In addition, due to the structural arrangement, the distance between the heat source fixed to the shell bottom and the cooling liquid is close enough, the heat conduction efficiency is effectively improved, the liquid cooling heat dissipation capacity is improved, and the high-efficiency requirement for heat dissipation of the heat source is met.

Description

Technical Field

[0001] This utility model relates to the field of power supply technology, and in particular to a liquid-cooled heat dissipation module and power supply. Background Technology

[0002] With the development of electronic power technology, the design requirements for power supplies in diverse new electronic devices are becoming increasingly stringent. Some of these new electronic devices require power supplies to reduce size while increasing output power, leading to increased power supply design density. Conventional heat dissipation methods are no longer sufficient to meet the heat dissipation needs of such high-density power supplies.

[0003] Currently, many fields utilize liquid cooling technology to dissipate heat from large heat sources. This technology uses liquid instead of air as the refrigerant, allowing direct or indirect heat exchange between the heat source and the liquid, efficiently removing heat and dissipating it. However, existing liquid cooling technologies require significant space and complex structures, necessitating large liquid cooling modules for heat conduction from the heating element and coolant flow. The cooling pipes are difficult to install, maintenance is complex, and it is unsuitable for cooling small, high-density power supplies. Summary of the Invention

[0004] The purpose of this invention is to design a miniaturized liquid-cooled heat dissipation module and power supply, solving the problem of the large size of existing liquid-cooled heat dissipation technology and meeting the heat dissipation requirements of small-volume, high-density power supplies.

[0005] To achieve the above objectives, the first aspect of this utility model provides a liquid-cooled heat dissipation module, comprising a first housing and a second housing, wherein:

[0006] A bonding layer is provided between the first housing and the second housing, and the bonding layer has flow channels inside;

[0007] One side of the bonding layer serves as the bottom of the first housing, and the other side of the bonding layer serves as the bottom of the second housing.

[0008] The outer walls of the first housing and the second housing are fixed with a liquid cooling inlet and a liquid cooling outlet;

[0009] One end of the flow channel is connected to the liquid cooling inlet, and the other end of the flow channel is connected to the liquid cooling outlet.

[0010] The aforementioned liquid-cooled heat dissipation module directly incorporates a flow channel for coolant flow within the joint layer between the housings. As the coolant circulates through the liquid cooling inlet and outlet in this channel, it dissipates heat from the heat source mounted on the bottom of the housing. This eliminates the bulky liquid cooling modules and pipes found in existing liquid cooling technologies, effectively reducing the overall volume of the liquid cooling system. This structural design also ensures that the heat source fixed to the bottom of the housing is sufficiently close to the coolant, effectively improving heat transfer efficiency and enhancing the liquid cooling capacity to meet the high-efficiency heat dissipation requirements. Furthermore, the coolant flow channel's location within the joint layer between the housings allows for simultaneous heat dissipation from multiple heat sources installed in both housings.

[0011] In one possible implementation, the flow channel has a serpentine structure.

[0012] In this implementation, by designing the flow channel as a meandering serpentine shape, the contact area between the flow channel and the bottom shell is increased, thereby increasing the heat exchange space between the coolant and the heat source installed at the bottom of the shell when the coolant passes through the flow channel, effectively improving the heat conduction efficiency and enhancing the liquid cooling heat dissipation capacity.

[0013] In one possible implementation, several heat dissipation fins are uniformly distributed in the flow channel.

[0014] In this implementation, by uniformly arranging multiple sets of heat dissipation fins in the flow channel, the contact area between the coolant and the shell is increased when the coolant flows through the flow channel, enabling the coolant to exchange more heat with the heat source installed at the bottom of the shell, effectively improving the heat conduction efficiency and enhancing the liquid cooling heat dissipation capacity.

[0015] In one possible implementation, the bottom of the first housing has a plurality of first thermally conductive protrusions, and the bottom of the second housing has a plurality of second thermally conductive protrusions.

[0016] In this implementation, a heat-conducting protrusion is provided at the bottom of the shell, increasing the contact area between the heat source and the shell. When the hottest portion of the heat source contacts the heat-conducting protrusion, its heat is transferred through the protrusion to the liquid cooling source within the flow channel of the bonding layer. The circulating flow of the liquid cooling source then carries away the heat from the heat source, rapidly achieving heat dissipation and effectively improving heat transfer efficiency and enhancing liquid cooling capacity.

[0017] In one possible implementation, the liquid-cooled heat dissipation module further includes a first cover plate and a second cover plate, wherein: the first cover plate and the first housing are combined to form a first cavity; and the second cover plate and the second housing are combined to form a second cavity.

[0018] In this implementation, a sealed first cavity is formed by combining a cover plate with the housing, preventing the heat source installed inside the housing from being exposed to the external environment and damaged in the event of impacts or other accidents. This improves the protection of the liquid-cooled heat dissipation module against the heat source installed inside the housing, thus enhancing the safety of the liquid-cooled heat dissipation module.

[0019] In one possible implementation, a third cavity is further divided between the first cavity and the second cavity, wherein the third cavity has a plug-in structure.

[0020] In one possible implementation, the third cavity does not require heat dissipation, and its height is the sum of the heights of the first and second cavities; that is, the third cavity is a full-height cavity, while the first and second cavities are half-height cavities. Multiple independent cavities resembling the third cavity can be divided at both ends of the first and second cavities, allowing users to insert modules with different functions into these independent cavities to improve the versatility of the heat dissipation module.

[0021] In this implementation, additional independent cavities are created at one or both ends of the heat-conducting cavity to handle additional functions, further enhancing the functionality of the liquid cooling module. These newly created independent cavities have plug-in structures, allowing modules, circuit boards, or devices with different functions to be plugged in and fixed within the independent cavities to achieve their corresponding functions.

[0022] A second aspect of this utility model provides a liquid-cooled power supply, comprising a liquid-cooled heat dissipation module, a first power supply module, and a second power supply module as described in any possible implementation of the first aspect, wherein:

[0023] The first power module is fixed to the bottom of the first housing, thereby fitting the bonding layer;

[0024] The second power module is fixed to the bottom of the second housing, thereby fitting the bonding layer.

[0025] The aforementioned liquid-cooled power supply has power modules fixed to the bottom of two housings, allowing the two power modules to adhere to the bonding layer. When the two power modules are operating, the coolant (liquid cooling source) circulating in the flow channel of the bonding layer can efficiently remove the heat from the two power modules, achieving liquid cooling heat dissipation of the power supply and meeting the heat dissipation requirements of small-volume, high-density power supplies.

[0026] In one possible implementation, the high-power-density devices on the power module can make good contact with the heat-conducting bosses, so that the heat generated by the high-power-density devices on the power module can be transferred to the coolant in the flow channel of the bonding layer through the contact heat-conducting bosses, effectively improving the heat conduction efficiency and enhancing the liquid cooling heat dissipation capability.

[0027] In one possible implementation, the bottom of the first housing is provided with a first mounting flange, and the bottom of the second housing is provided with a second mounting flange, wherein:

[0028] The first mounting flange secures the first power module to the bottom of the first housing.

[0029] The second mounting flange secures the second power module to the bottom of the second housing.

[0030] In this implementation, mounting flanges are installed around the bottom of the housing, allowing the power module to be tightly installed and fixed to the bottom of the housing. This avoids potential damage such as sliding or bumping of the power module due to unstable fixing, while also ensuring a tighter and better contact between the power module and the bottom of the housing. This effectively improves heat conduction efficiency, enhances liquid cooling capacity, and meets the high-efficiency heat dissipation requirements of small-volume, high-density power supplies.

[0031] In one possible implementation, a first power output connector and a second power output connector are fixed to the outer walls of the first housing and the second housing, wherein:

[0032] The first power output connector is connected to the first power module;

[0033] The second power output connector is connected to the second power module.

[0034] In this implementation, power generated by the power module can be output through a power output connector. Furthermore, various types of power output connectors can be installed on the outer wall of the casing to meet the different power connector requirements of power transmission cables in different application scenarios, thus improving the applicability of this liquid-cooled power supply.

[0035] In one possible implementation, a filter module is inserted into the third cavity, and a power input connector is fixed to the outside of the third cavity, wherein the filter module is connected to the power input connector.

[0036] In this implementation, the filtering module is plugged into and fixed in an independent cavity, so that the filtering module can filter the external input source through the power input connector. In addition, this liquid-cooled power supply can also perform filtering function on the basis of power supply, which increases the applicability of this liquid-cooled power supply.

[0037] The liquid-cooled heat dissipation module and power supply provided in the first and second aspects above have at least the following advantages compared to the prior art:

[0038] This application provides a liquid-cooled heat dissipation module with a flow channel for coolant flow directly inside the joint layer between the housings. When the coolant circulates in the flow channel through the liquid cooling inlet and outlet, it dissipates heat from the heat source installed on the bottom of the housing. This eliminates the bulky liquid cooling module and pipes required in existing liquid cooling technologies, effectively reducing the space required for liquid cooling. This structural design also allows the heat source fixed on the bottom of the housing to be sufficiently close to the coolant, effectively improving heat transfer efficiency and enhancing the liquid cooling capacity, thus meeting the high-efficiency heat dissipation requirements of the heat source. Furthermore, since the coolant flow channel is located in the joint layer between the housings, it can simultaneously dissipate heat from multiple heat sources installed in the two housings.

[0039] The liquid-cooled power supply provided in this application has power modules fixed to the bottom of two housings respectively, so that the two power modules are attached to the bonding layer. When the two power modules are operating, the coolant (liquid cooling source) circulating in the flow channel of the bonding layer can efficiently remove the heat of the two power modules, realize liquid cooling heat dissipation of the power supply, and meet the heat dissipation requirements of small volume high density power supply. Attached Figure Description

[0040] Figure 1 This is a structural diagram of a liquid-cooled heat dissipation module provided in an embodiment of this utility model;

[0041] Figure 2 This is a partial structural diagram of a liquid-cooled heat dissipation module provided in an embodiment of this utility model;

[0042] Figure 3 This is a partial structural diagram of a liquid-cooled power supply provided in an embodiment of the present invention;

[0043] Figure 4 This is a structural cross-sectional view of a liquid-cooled heat dissipation module provided in an embodiment of this utility model;

[0044] Wherein: 1. First cover plate; 2. Housing; 21. First housing; 22. Second housing; 23. Flow channel; 24. Third cavity; 25. Fourth cavity; 26. Heat-conducting boss; 3. Second cover plate; 4. First power module; 5. Second power module; 6. Liquid cooling input port; 7. Liquid cooling output port; 8. Power input connector; 9. Power output connector. Detailed Implementation

[0045] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0046] The following detailed descriptions are exemplary and intended to provide further detailed explanation of the present invention. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings are used to distinguish different objects and not to describe a particular order.

[0047] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0048] See Figure 1 and Figure 2 The first aspect of this utility model provides a liquid-cooled heat dissipation module, including a housing 2, a first housing 21, and a second housing 22, wherein:

[0049] The housing 2 is composed of a first housing 21 and a second housing 22, with a bonding layer between the first housing 21 and the second housing 22, and a flow channel 23 inside the bonding layer;

[0050] One side of the bonding layer serves as the bottom of the first housing 21, and the other side of the bonding layer serves as the bottom of the second housing 22;

[0051] The outer wall of the housing 2, which consists of the first housing 21 and the second housing 22, is fixed with a liquid cooling inlet 6 and a liquid cooling outlet 7;

[0052] One end of the flow channel 23 is connected to the liquid cooling inlet 6, and the other end of the flow channel 23 is connected to the liquid cooling outlet 7.

[0053] The aforementioned liquid-cooled heat dissipation module directly incorporates a flow channel 23 for coolant flow within the joint layer between the housings. When the coolant circulates through the liquid cooling inlet 6 and outlet 7 within the flow channel 23, it dissipates heat from the heat source installed on the bottom of the housing. This eliminates the bulky liquid cooling module and pipes required in existing liquid cooling technologies, effectively reducing the space required for liquid cooling. This structural design also ensures that the heat source fixed to the bottom of the housing is sufficiently close to the coolant, effectively improving heat transfer efficiency and enhancing the liquid cooling capacity, thus meeting the high-efficiency heat dissipation requirements of the heat source. Furthermore, since the coolant flow channel 23 is located in the joint layer between the housings, it can simultaneously dissipate heat from multiple heat sources installed in both housings.

[0054] In one possible embodiment, the flow channel 23 has a serpentine structure.

[0055] In this embodiment, by designing the flow channel 23 as a meandering serpentine shape, the contact area between the flow channel 23 and the bottom shell is increased, thereby increasing the heat exchange space between the coolant and the heat source installed at the bottom of the shell when the coolant passes through the flow channel 23, effectively improving the heat conduction efficiency and enhancing the liquid cooling heat dissipation capacity.

[0056] In one possible embodiment, a plurality of heat dissipation fins are uniformly distributed in the flow channel 23.

[0057] In this embodiment, by uniformly arranging multiple sets of heat dissipation fins in the flow channel 23, the contact area between the coolant and the shell when the coolant flows through the flow channel 23 is increased, enabling the coolant to exchange more heat with the heat source installed at the bottom of the shell, effectively improving the heat conduction efficiency and enhancing the liquid cooling heat dissipation capacity.

[0058] See Figure 4 In one possible embodiment, the bottom of the first housing 21 has a plurality of heat-conducting protrusions 26.

[0059] In this embodiment, by providing a heat-conducting protrusion 26 at the bottom of the shell, the contact area between the heat source installed at the bottom of the shell and the shell is increased. After the high-heat portion of the heat source comes into contact with the heat-conducting protrusion 26, its heat is transferred through the heat-conducting protrusion 26 to the liquid cooling source in the joint layer flow channel 23. Then, the heat of the heat source is carried away by the circulation of the liquid cooling source, thereby quickly achieving the purpose of heat dissipation, effectively improving the heat conduction efficiency and enhancing the liquid cooling heat dissipation capacity.

[0060] See Figure 3 In one possible embodiment, the liquid-cooled heat dissipation module further includes a first cover plate 1 and a second cover plate 3, wherein: the first cover plate 1 and the first housing 21 are combined to form a first cavity; the second cover plate 3 and the second housing 22 are combined to form a second cavity.

[0061] In this embodiment, by adding a cover plate and combining it with the housing to form a sealed first cavity, the heat source installed inside the housing is prevented from being exposed to the external environment during use and from being damaged in the event of an accident such as an impact. This improves the protection capability of the liquid-cooled heat dissipation module against the heat source installed inside the housing, thereby enhancing the safety of the liquid-cooled heat dissipation module.

[0062] See Figure 4 In one possible embodiment, a third cavity 24 is further divided between the first cavity and the second cavity, wherein the third cavity 24 has a plug-in structure.

[0063] In this embodiment, additional independent cavities are created at one or both ends of the heat-conducting cavity to handle additional functions, further enhancing the functionality of the liquid cooling module. These newly created independent cavities have plug-in structures, allowing modules, circuit boards, or devices with different functions to be plugged in and fixed within the independent cavities to achieve their respective functions.

[0064] See Figure 2 and Figure 3 The second aspect of this utility model provides a liquid-cooled power supply, including a liquid-cooled heat dissipation module, a first power module 4, and a second power module 5 as described in any possible implementation of the first aspect, wherein:

[0065] The first power module 4 is fixed to the bottom of the first housing 21, thereby fitting the bonding layer;

[0066] The second power module 5 is fixed to the bottom of the second housing 22, thereby fitting the bonding layer.

[0067] In the aforementioned liquid-cooled power supply, power modules are fixed to the bottom of the two housings respectively, so that the two power modules are attached to the bonding layer. When the two power modules are operating, the coolant (liquid cooling source) circulating in the flow channel 23 of the bonding layer can efficiently remove the heat of the two power modules, thereby achieving liquid cooling heat dissipation of the power supply and meeting the heat dissipation requirements of small-volume high-density power supplies.

[0068] See Figure 3 and Figure 4 In one possible embodiment, the high power density devices on the power module can make good contact with the heat-conducting boss 26, so that the heat generated by the high power density devices on the power module can be transferred to the coolant in the bonding layer channel 23 through the contact heat-conducting boss 26, effectively improving the heat conduction efficiency and enhancing the liquid cooling heat dissipation capability.

[0069] In one possible embodiment, the bottom of the first housing 21 is provided with a first mounting flange, and the bottom of the second housing 22 is provided with a second mounting flange, wherein:

[0070] The first mounting flange secures the first power module 4 to the bottom of the first housing 21.

[0071] The second mounting flange secures the second power module 5 to the bottom of the second housing 22.

[0072] In this embodiment, by setting mounting flanges around the bottom of the housing, the power module can be tightly installed and fixed to the bottom of the housing. This avoids potential damage such as sliding and bumping of the power module due to unstable fixing, while making the contact between the power module and the bottom of the housing more tight and good, effectively improving the heat conduction efficiency, enhancing the liquid cooling heat dissipation capacity, and meeting the high efficiency requirements of heat dissipation for small-volume, high-density power supplies.

[0073] See Figure 2 and Figure 3 In one possible embodiment, a power output connector 9 is fixed to the outer wall of the housing 2, which is composed of the first housing 21 and the second housing 22, wherein:

[0074] The power output connector 9 is connected to the first power module 4 and the second power module 5.

[0075] In this embodiment, the power generated by the power module can be output through the power output connector 9. Furthermore, various types of power output connectors 9 can be provided on the outer wall of the housing to meet the different requirements of power transmission cables for power connector types in different usage scenarios, thereby improving the applicability of this liquid-cooled power supply.

[0076] See Figure 3 and Figure 4 In one possible embodiment, a filter module can be inserted into the third cavity 24, and a power input connector 8 is fixed on the outside of the third cavity 24, wherein the filter module is connected to the power input connector 8.

[0077] In this embodiment, the module with filtering function is plugged into and fixed in an independent cavity, so that the filtering module can filter the external input source through the power input connector 8. In addition, this liquid-cooled power supply can also achieve the filtering function on the basis of the power supply, which increases the applicability of this liquid-cooled power supply.

[0078] See Figure 1 , Figure 2 and Figure 3 This application provides a liquid-cooled power supply, including a first cover plate 1, a housing 2, a second cover plate 3, a first power module 4, a second power module 5, a liquid-cooled input port 6, a liquid-cooled output port 7, a power input connector 8, a power output connector 9, a first housing 21, a second housing 22, and a flow channel 23, wherein:

[0079] The housing 2 is composed of a first housing 21 and a second housing 22;

[0080] A bonding layer is provided between the first housing 21 and the second housing 22, and the bonding layer has a flow channel 23 inside;

[0081] One side of the bonding layer serves as the bottom of the first housing 21, and the other side of the bonding layer serves as the bottom of the second housing 22;

[0082] The outer wall of the housing 2 is fixed with a liquid cooling inlet 6 and a liquid cooling outlet 7;

[0083] One end of the flow channel 23 is connected to the liquid cooling inlet 6, and the other end of the flow channel is connected to the liquid cooling outlet 7;

[0084] The first cover plate 1 can be combined with the first housing 21 to form a first cavity; the second cover plate 3 can be combined with the second housing 22 to form a second cavity; specifically, the first cover plate 1 is fastened to the first housing 21 with a number of screws, and the second cover plate 3 is fastened to the second housing 22 with a number of screws.

[0085] The first power module 4 can be fixed to the bottom of the first housing 21; the second power module 5 can be fixed to the bottom of the second housing 22.

[0086] A power output connector 9 is fixed to the outer wall of the housing 2, and the power output connector is connected to the first power module 4 and the second power module 5 respectively.

[0087] In one possible embodiment, the first power module 4 and the second power module 5 are power conversion boards, which can connect to external devices through the power output connector 9 to realize current-voltage conversion function and connection function.

[0088] In one possible embodiment, the housing 2 has through holes at its four corners for securing the liquid-cooled power supply to other electronic devices.

[0089] In one possible embodiment, the housing 2 is made of aluminum alloy and is assembled and welded from multiple components. Specifically, friction stir welding or vacuum brazing is used depending on the structural design of the flow channel 23 in the bonding layer.

[0090] This is a structural cross-sectional view of a liquid-cooled heat dissipation module provided in an embodiment of this utility model. See also... Figure 4 This application provides another liquid-cooled power supply, including a first housing 21, a flow channel 23, a third cavity 24, a fourth cavity 25, and a heat-conducting boss 26, wherein:

[0091] The bottom of the first housing 21 has several heat-conducting protrusions 26, which increases the contact area between the heat source installed on the bottom of the housing and the housing. After the high-heat part of the heat source comes into contact with the heat-conducting protrusions, its heat is transferred through the heat-conducting protrusions to the liquid cooling source in the flow channel of the bonding layer. Then, the heat of the heat source is carried away by the circulation of the liquid cooling source, so as to quickly achieve the purpose of heat dissipation.

[0092] A bonding layer is provided between the first housing 21 and the second housing 22, and the bonding layer has flow channels 23 inside; it should be understood that Figure 4 The cross-sectional view shown does not reveal the specific structure of the second housing 22;

[0093] The first housing 21 is divided into a third cavity 24 and a fourth cavity 25 at both ends. The third cavity 24 and the fourth cavity 25 have plug-in structures. The first housing 21, the third cavity 24 and the fourth cavity 25 are three sealed independent spaces with good electromagnetic shielding performance.

[0094] In one possible embodiment, a filter module is inserted into the third cavity 24 and the fourth cavity 25, and the filter module is connected to... Figure 2 The power input connector 8 shown is connected so that the filtering module can filter external input sources through the power input connector 8.

[0095] In one possible embodiment, see Figure 2 and Figure 4 The liquid cooling inlet 6 is located on the outer wall of the housing 2, close to the third cavity 24 and the fourth cavity 25. One end of the flow channel 23 is connected to the liquid cooling inlet 6, passes through the cavity walls of the third cavity 24 and the fourth cavity 25, and returns to the joint layer of the first housing 21 and the second housing 22. Finally, the other end is connected to the liquid cooling outlet 7.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various improvements and substitutions without departing from the concept of this application, and these improvements and substitutions should also be considered within the scope of protection of this utility model. Therefore, the scope of protection of this application should be determined by the appended claims.

Claims

1. A liquid-cooled heat dissipation module, characterized by, It comprises a first shell and a second shell, wherein: The first shell and the second shell have a joint layer between them, and the joint layer has a flow channel inside; One side of the joint layer serves as the shell bottom of the first shell, and the other side of the joint layer serves as the shell bottom of the second shell; The outer walls of the first shell and the second shell are fixed with liquid cooling input and output ports; One end of the flow channel is connected to the liquid cooling input port, and the other end of the flow channel is connected to the liquid cooling output port.

2. A liquid-cooled heat dissipation module according to claim 1, wherein, The flow channel is a serpentine structure.

3. A liquid-cooled heat dissipation module according to claim 1, wherein, The flow channel is uniformly distributed with several heat dissipation fins.

4. The liquid-cooled heat sink module of claim 1, wherein, The shell bottom of the first shell has several first heat conduction bosses, and the shell bottom of the second shell has several second heat conduction bosses.

5. The liquid-cooled heat-dissipation module of claim 1, wherein, It also comprises a first cover plate and a second cover plate, wherein: The first cover plate and the first shell combine to form a first cavity; The second cover plate and the second shell combine to form a second cavity.

6. A liquid-cooled heat dissipation module according to claim 5, wherein, The first cavity and the second cavity are further divided into a third cavity, wherein: The third cavity has a plug-in structure.

7. A liquid-cooled power supply, characterized by, It comprises a liquid cooling heat dissipation module as claimed in claim 6, a first power module and a second power module, wherein: The first power module is fixed to the shell bottom of the first shell, thereby fitting the joint layer; The second power module is fixed to the shell bottom of the second shell, thereby fitting the joint layer.

8. The liquid-cooled power supply of claim 7, wherein, The shell bottom of the first shell is provided with a first mounting flange, and the shell bottom of the second shell is provided with a second mounting flange, wherein: The first mounting flange fastens the first power module to the shell bottom of the first shell; The second mounting flange fastens the second power module to the shell bottom of the second shell.

9. The liquid-cooled power supply of claim 7, wherein, The outer walls of the first shell and the second shell are fixed with a first power output connector and a second power output connector, wherein: The first power output connector is connected to the first power module; The second power output connector is connected to the second power module.

10. The liquid-cooled power supply of claim 7, wherein, The third cavity is plugged with a filter module, and the outside of the third cavity is fixed with a power input connector, wherein: The filter module is connected to the power input connector.

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