Wafer processing equipment

Abstract

The utility model is suitable for the technical field of semiconductor processing, and provides wafer processing equipment, which comprises a carrying table, a wafer processing module, a wafer processing module and a wafer processing module, and is characterized in that the carrying table comprises a base and an adsorption bearing assembly used for bearing and adsorbing crystal ingots, and the adsorption bearing assembly is arranged on the base; and the material taking and placing assembly comprises an adsorption mechanism and a moving mechanism, and the moving mechanism is connected to the adsorption mechanism so as to drive the adsorption mechanism to move to be close to or away from the adsorption bearing assembly, so that material taking or placing from the position above the adsorption bearing assembly in the height direction of the carrying table is achieved. According to the wafer processing equipment provided by the embodiment of the invention, the structure can be simplified.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, and more specifically, relates to a wafer processing equipment. Background Technology

[0002] In the semiconductor processing field, wafers are obtained by processing crystal ingots. During processing, it is necessary to handle the crystal ingots, such as removing them from the stage and placing them in designated locations. Currently, the methods for handling disc-shaped products (such as crystal ingots) include gripper gripping and pallet picking. Whether using grippers or pallets, the top surface of the stage must have clearance features when picking up materials from the stage; the presence of these clearance features complicates the equipment structure. Utility Model Content

[0003] Embodiments of this application provide a wafer processing apparatus that simplifies the structure.

[0004] A wafer processing device, comprising:

[0005] A stage, including a base and an adsorption support assembly for supporting and adsorbing crystal ingots, the adsorption support assembly being disposed on the base;

[0006] The material handling assembly includes an adsorption mechanism and a moving mechanism. The moving mechanism is connected to the adsorption mechanism to move the adsorption mechanism closer to or further away from the adsorption support assembly, so as to pick up or place material from above the adsorption support assembly in the height direction of the platform.

[0007] In some possible embodiments of the first aspect, the adsorption-supporting component includes:

[0008] The supporting component is provided with multiple adsorption parts and is disposed on the base;

[0009] A vacuum connector is attached to the supporting component.

[0010] In some possible embodiments of the first aspect, the supporting component is a ceramic adsorption plate with adsorption micropores.

[0011] In some possible implementations of the first aspect, the material handling assembly further includes:

[0012] A connecting component is connected to the moving mechanism and is floatingly connected to the adsorption mechanism.

[0013] In some possible implementations of the first aspect, the material handling assembly further includes:

[0014] Guide components;

[0015] Elastic components;

[0016] The connecting component is floatingly connected to the adsorption mechanism via the guiding component and the elastic component.

[0017] In some possible implementations of the first aspect, the material handling assembly further includes:

[0018] A sensor is disposed on the connecting component;

[0019] A sensing element is disposed on the adsorption mechanism and can move with the adsorption mechanism to trigger the sensor, so that the moving mechanism stops driving the adsorption mechanism to move.

[0020] In some possible embodiments of the first aspect, the adsorption mechanism includes:

[0021] Porous ceramic plate with adsorption micropores;

[0022] A dense ceramic plate is disposed on the porous ceramic plate.

[0023] In some possible embodiments of the first aspect, the adsorption mechanism includes:

[0024] The adsorption plate substrate has multiple adsorption holes;

[0025] An adsorption cover plate is disposed on the substrate of the adsorption disk.

[0026] In some possible embodiments of the first aspect, the adsorption mechanism includes:

[0027] Suction cup mounting components;

[0028] Multiple suction cups are disposed on the suction cup mounting component.

[0029] In some possible implementations of the first aspect, the moving mechanism includes:

[0030] A first-direction moving mechanism is connected to the adsorption mechanism to drive the adsorption mechanism to move relative to the stage along the first direction;

[0031] A second directional moving mechanism is connected to the first directional moving mechanism to drive the first directional moving mechanism to move relative to the platform along the second direction.

[0032] The first direction is perpendicular to the second direction.

[0033] The beneficial effects of the embodiments of this application are:

[0034] The adsorption support component of the platform carries and adsorbs the crystal ingot. The moving mechanism drives the adsorption mechanism to move close to the adsorption support component. The adsorption mechanism adsorbs the crystal ingot above the adsorption support component of the platform to realize material picking. It does not require the top of the platform to have a clearance space, which simplifies the structure and facilitates production. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 A perspective view of a wafer processing apparatus provided in an embodiment of this application;

[0037] Figure 2 A perspective view of a portion of the structure of a wafer processing apparatus provided in an embodiment of this application;

[0038] Figure 3 An orthographic projection view of the adsorption mechanism of a wafer processing apparatus provided in an embodiment of this application;

[0039] Figure 4 A cross-sectional view of the adsorption mechanism of a wafer processing apparatus provided in an embodiment of this application;

[0040] Figure 5 A perspective view of the adsorption mechanism of a wafer processing apparatus provided in another embodiment of this application;

[0041] Figure 6 An orthographic view of the adsorption mechanism of a wafer processing apparatus provided in another embodiment of this application;

[0042] Figure 7 An orthographic projection view of the adsorption mechanism of a wafer processing apparatus provided in yet another embodiment of this application;

[0043] Figure 8 Another orthographic projection view of the adsorption mechanism of a wafer processing apparatus provided in yet another embodiment of this application. Detailed Implementation

[0044] To make the technical problem to be solved, the technical solution and the beneficial effects of this application clearer, the following is in conjunction with the appendix. Figures 1 to 8 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0046] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] It should be understood that the term "and / or" as used in this application specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0049] Embodiments of this application provide a wafer processing apparatus for processing ingots to obtain wafers.

[0050] Figure 1 This is a perspective view of a wafer fabrication apparatus provided according to an embodiment of this application. (Reference) Figure 1 The wafer processing equipment provided in the embodiments of this application includes a stage 100 and a material handling assembly 200.

[0051] The stage 100 is used to support and adsorb the crystal ingot 300.

[0052] refer to Figure 1 The stage 100 includes a base 1 and an adsorption support component 2 for supporting and adsorbing the crystal ingot 300.

[0053] The adsorption support component 2 is disposed on the base 1. Specifically, the adsorption support component 2 fixes the crystal ingot 300 by vacuum adsorption.

[0054] The material handling assembly 200 is used for picking up and discharging materials.

[0055] refer to Figure 1 The material handling assembly 200 includes an adsorption mechanism 3 and a moving mechanism 4.

[0056] The moving mechanism 4 is connected to the adsorption mechanism 3 to move the adsorption mechanism 3 closer to or further away from the adsorption support component 2, so as to pick up or drop material from above the adsorption support component 2 in the height direction H of the platform 100. The height direction H can be the thickness direction or the vertical direction.

[0057] The adsorption mechanism 3 specifically achieves material collection by adsorbing the crystal ingot 300 under vacuum and discharging the crystal ingot 300 by releasing it under vacuum.

[0058] The mobile mechanism 4 can be a two-dimensional mobile platform, a three-dimensional mobile platform, or a robotic arm.

[0059] In actual operation, the adsorption support component 2 carries and adsorbs the crystal ingot 300 for processing. After processing, the moving mechanism 4 moves the adsorption mechanism 3 closer to the adsorption support component 2, so that the adsorption support component 2 is positioned above the adsorption support component 2 in the height direction H of the platform 100. The adsorption support component 2 adsorbs the crystal ingot 300 located on the adsorption support component 2, specifically adsorbing the top surface of the crystal ingot 300, thus achieving material removal. After the adsorption support component 2 releases the adsorption of the crystal ingot 300, the moving mechanism 4 moves the adsorption mechanism 3 away from the adsorption support component 2, and then the adsorption support component 2 releases the adsorption of the crystal ingot 300 to place the crystal ingot 300 in the designated position, thus achieving material discharge.

[0060] As can be seen from the above, the adsorption and bearing component 2 of the stage 100 carries and adsorbs the crystal ingot 300. The moving mechanism 4 drives the adsorption mechanism 3 to move close to the adsorption and bearing component 2. The adsorption mechanism 3 adsorbs the crystal ingot 100 above the adsorption and bearing component 2 of the stage 100 to realize material picking. It does not require the top of the stage 100 to have a clearance space, which simplifies the structure and facilitates production.

[0061] Furthermore, since no clearance is required, the surface of the part of the adsorption-bearing component 2 used to support and adsorb the crystal ingot 300 is flatter, which can improve the adsorption force and better fix the crystal ingot 300.

[0062] refer to Figure 1 The aforementioned adsorption support component 2 may include a support component 21 and a vacuum connector 22.

[0063] The support component 21 is disposed on the base 1. The support component 21 is provided with multiple adsorption parts. The adsorption parts can be holes, slits, or suction cups.

[0064] Vacuum connector 22 is connected to support component 21.

[0065] The carrier component 21 is used to carry the crystal ingot 300, and the vacuum connector 22 is used to connect the carrier component 21 to a vacuum, so that the adsorption part of the carrier component 21 can adsorb the crystal ingot 300 and fix the crystal ingot 300.

[0066] The supporting component 21 can be a ceramic adsorption plate with adsorption micropores. Since the adsorption mechanism 3 adsorbs the crystal ingot 100 above the adsorption supporting component 2 of the stage 100, the top surface of the ceramic adsorption plate can remain flat, with higher precision, stronger adsorption force, and better fixation of the crystal ingot 300.

[0067] Figure 2 This is a perspective view of a portion of the structure of a wafer fabrication apparatus provided in an embodiment of this application. (Reference) Figure 2 The aforementioned material handling assembly 200 may also include a connecting component 5.

[0068] The connecting component 5 is connected to the moving mechanism 4 and is floatingly connected to the adsorption mechanism 3.

[0069] The connecting component 5 is floatingly connected to the adsorption mechanism 3. When the adsorption mechanism 3 comes into contact with the crystal ingot 300, the adsorption mechanism 3 can float relative to the crystal ingot 300, which can prevent the crystal ingot 300 from being damaged.

[0070] The connecting component 5 can be either a connector or a connecting plate.

[0071] refer to Figure 2 The aforementioned material handling assembly 200 may further include a guide component 6 and an elastic component 7.

[0072] The connecting component 5 is floatingly connected to the adsorption mechanism 3 via the guide component 6 and the elastic component 7.

[0073] The elastic component 7 can specifically be a spring, a bellows, or a rubber block.

[0074] For example, one end of the guide component 6 is fixedly connected to the adsorption mechanism 3, and the other end of the guide component 6 passes through the guide through hole of the connecting component 5. The guide component 6 can move back and forth in the guide through hole along the height direction H. The elastic component 7 is sleeved on the guide component 6. When the adsorption mechanism 3 contacts the crystal ingot 300, the elastic component 7 is compressed, and the adsorption mechanism 3 and the guide component 6 move upward relative to the connecting component 5 along the height direction H, so as to float relative to the connecting component 5 and play a buffering role.

[0075] In some other embodiments, it is optional for the elastic member 7 to be sleeved on the guide member 6, as long as the elastic member 7 is located between the adsorption mechanism 3 and the connecting member 5 in the height direction H. This can also enable the adsorption mechanism 3 and the guide member 6 to float relative to the connecting member 5. For example, one end of the elastic member 7 is fixedly connected to the adsorption mechanism 3, and the other end is fixedly connected to the connecting member 5.

[0076] refer to Figure 2 The aforementioned material handling assembly 200 may also include a sensor 8 and a sensor sheet 9.

[0077] Sensor 8 is located on connecting component 5.

[0078] The sensing plate 9 is disposed on the adsorption mechanism 3 and can move with the adsorption mechanism 3 to the trigger sensor 8 so that the moving mechanism 4 stops driving the adsorption mechanism 3 to move.

[0079] When the adsorption mechanism 3 comes into contact with the crystal ingot 300, the adsorption mechanism 3 can float relative to the connecting component 5 in the height direction H. The sensing plate 9 set on the adsorption mechanism 3 moves with the adsorption mechanism 3 to the trigger sensor 8, and then the sensor 8 sends a signal to control the moving mechanism 4 to stop moving the adsorption mechanism 3. This can prevent the adsorption mechanism 3 from continuing to press down on the crystal ingot 300, further prevent damage to the crystal ingot 300, and further protect the crystal ingot.

[0080] Sensor 8 can be a contact sensor or a non-contact sensor.

[0081] The specific method by which the sensor 9 triggers the sensor 8 can be either contact-based or non-contact-based.

[0082] Figure 3 This is a frontal projection view of the adsorption mechanism of a wafer processing apparatus provided in an embodiment of this application. Figure 4 This is a cross-sectional view of the adsorption mechanism of a wafer processing apparatus provided in an embodiment of this application. (See reference...) Figure 3 and Figure 4 The aforementioned adsorption mechanism 3 may include a porous ceramic plate 31A and a dense ceramic plate 32A.

[0083] The porous ceramic plate 31A is provided with adsorption micropores.

[0084] A dense ceramic plate 32A is disposed on a porous ceramic plate 31A.

[0085] The dense ceramic plate 32A serves as the frame for the adsorption mechanism 3. The porous ceramic plate 31A is used for vacuum adsorption; specifically, the vacuum can pass through the adsorption micropores of the porous ceramic to adsorb the crystal ingot 300.

[0086] The distribution of porous ceramic plate 31A and dense ceramic plate 32A can be determined according to the size of ingot 300, thereby achieving compatibility with ingots 3 of various sizes.

[0087] The porous ceramic plate 31A and the dense ceramic plate 32A are made of ceramic, which has high precision. The above-mentioned adsorption mechanism 3 (which can be called ceramic adsorption mechanism) can be used as a high-precision suction cup and can be applied to occasions with high precision requirements.

[0088] Figure 5 A perspective view of the adsorption mechanism of a wafer processing apparatus provided in another embodiment of this application. Figure 6 A frontal projection view of the adsorption mechanism of a wafer processing apparatus provided in another embodiment of this application. (Reference) Figure 5 and Figure 6 The aforementioned adsorption mechanism 3 may include an adsorption plate substrate 31B and an adsorption cover plate 32B.

[0089] The adsorption plate substrate 31B has multiple adsorption holes. The adsorption holes are used to adsorb the crystal ingot 300 through vacuum.

[0090] The adsorption cover plate 32B is disposed on the adsorption plate substrate 31B.

[0091] The position of the adsorption holes on the adsorption plate substrate 31B can be determined according to the specifications of the crystal ingot, thereby forming different sets of adsorption holes. By connecting to different vacuum paths, crystal ingots of different specifications can be adsorbed.

[0092] The materials of the adsorption plate substrate 31B and the adsorption cover plate 32B can be metal materials, such as aluminum or copper. The accuracy of such adsorption mechanism 3 is slightly lower than that of ceramic adsorption mechanism, and the cost is also lower, making it suitable for scenarios with relatively lower accuracy levels.

[0093] Figure 7 An orthographic projection view of the adsorption mechanism of a wafer processing apparatus provided in another embodiment of this application. Figure 8 Another orthographic projection view of the adsorption mechanism of a wafer processing apparatus provided in yet another embodiment of this application. (See reference) Figure 7 and Figure 8 The aforementioned adsorption mechanism 3 may include a suction cup mounting component 31C, a suction cup 32C, a sealing component 33C, an adsorption mounting plate 34C, and a vacuum connector 35C.

[0094] Multiple suction cups 32C are provided on the suction cup mounting component 31C.

[0095] The suction cup 32C is used to adsorb crystal ingot 300.

[0096] The sealing component 33C is located between the suction cup mounting component 31C and the adsorption mounting plate 34C, and is used to seal the suction cup mounting component 31C and the adsorption mounting plate 34C to prevent air leakage.

[0097] The adsorption mounting plate 34C is used to fix the entire adsorption mechanism 3.

[0098] Vacuum connector 35C is connected to suction cup 32C and is used to connect suction cup 32C to a vacuum.

[0099] The suction cups 32C are arranged according to the specifications and compatibility requirements of the crystal ingots. With a reasonable distribution of suction cups, multiple crystal ingots of different sizes can be compatible.

[0100] Since the suction cup 32C of the above-mentioned adsorption mechanism 3 is compressible, the surface precision requirements of the product are relatively low, and it can be applied to occasions where the product precision requirements are relatively low.

[0101] refer to Figure 1 The aforementioned moving mechanism 4 may include a first-direction moving mechanism 41 and a second-direction moving mechanism 42.

[0102] The first direction moving mechanism 41 is connected to the adsorption mechanism 3 to drive the adsorption mechanism 3 to move relative to the stage 100 in the first direction.

[0103] The second direction moving mechanism 42 is connected to the first direction moving mechanism 41 to drive the first direction moving mechanism 41 to move relative to the platform 100 in the second direction.

[0104] The first direction can be perpendicular to the second direction. The first direction can be the Z-axis direction or the height direction H, and the second direction can be the Y-axis direction.

[0105] The first direction moving mechanism 41 and the second direction moving mechanism 42 can drive the adsorption mechanism 3 to move relative to the platform 100 along the first and second directions, thereby moving closer to or further away from the platform 100 to achieve material picking and discharging.

[0106] The first direction moving mechanism 41 and the second direction moving mechanism 42 can specifically be a lead screw moving mechanism or a linear motor moving mechanism.

[0107] The wafer processing equipment provided in the embodiments of this application simplifies the structure, facilitates production, is safe and reliable, can better fix the wafer ingot, and can protect the wafer ingot.

[0108] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer processing apparatus characterized by comprising: The application relates to a crystal ingot taking and placing device. The device comprises a carrier, a taking and placing assembly, and a moving mechanism. The carrier comprises a base and an adsorbing and carrying assembly arranged on the base.

2. The wafer processing apparatus of claim 1, wherein The taking and placing assembly comprises an adsorbing mechanism and a moving mechanism connected to the adsorbing mechanism to drive the adsorbing mechanism to move close to or away from the adsorbing and carrying assembly to realize taking or placing of the crystal ingot above the adsorbing and carrying assembly in the height direction of the carrier. The adsorbing and carrying assembly comprises a carrying component provided with a plurality of adsorbing parts and arranged on the base, and a vacuum connector connected to the carrying component. The carrying component is a ceramic adsorbing plate provided with adsorbing micropores.

3. The wafer processing apparatus of claim 2, wherein The taking and placing assembly further comprises a connecting component connected to the moving mechanism and floatingly connected to the adsorbing mechanism.

4. The wafer processing apparatus of claim 1, wherein The taking and placing assembly further comprises a guiding component and an elastic component. The connecting component is floatingly connected to the adsorbing mechanism through the guiding component and the elastic component.

5. The wafer processing apparatus of claim 4, wherein The taking and placing assembly further comprises a sensor arranged on the connecting component and a sensing sheet arranged on the adsorbing mechanism and capable of moving with the adsorbing mechanism to trigger the sensor to stop the moving mechanism from driving the adsorbing mechanism to move. The adsorbing mechanism comprises a porous ceramic plate provided with adsorbing micropores and a dense ceramic plate arranged on the porous ceramic plate. The adsorbing mechanism comprises an adsorbing disc base plate provided with a plurality of adsorbing holes and an adsorbing cover plate arranged on the adsorbing disc base plate. The adsorbing mechanism comprises an adsorbing disc mounting component and a plurality of adsorbing discs arranged on the adsorbing disc mounting component.

6. The wafer processing apparatus of claim 4, wherein The moving mechanism comprises a first direction moving mechanism connected to the adsorbing mechanism to drive the adsorbing mechanism to move in a first direction relative to the carrier, and a second direction moving mechanism connected to the first direction moving mechanism to drive the first direction moving mechanism to move in a second direction relative to the carrier. The first direction is perpendicular to the second direction. ​ 7. The wafer processing apparatus of claim 1, wherein ​ ​ ​ 8. The wafer processing apparatus of claim 1, wherein ​ ​ ​ 9. The wafer processing apparatus of claim 1, wherein, ​ ​ ​ 10. The wafer processing apparatus according to any one of claims 1 to 9, wherein ​ ​ ​ ​

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