Wafer detection platform

Abstract

The utility model relates to the field of semiconductor wafer detection, and particularly provides a wafer detection platform, which comprises a base, a rotating mechanism and an adsorption platform, the rotating mechanism comprises a rotor, a rotating driving plate and a circular stator, the circular stator is fixedly connected with the base, the rotor is movably installed on the outer side of the circular stator, and the rotating driving plate is installed on the outer side of the rotor; the adsorption platform is mounted on the upper surface of the rotor and performs circular motion synchronously along with the rotor; the adsorption platform comprises an adsorption disc, a middle disc, a jacking mechanism, a base disc and an air cylinder. According to the utility model, the negative pressure cavity and the sealing cavity are matched for vacuumizing to provide stronger adsorption force, so that the adsorption effect of the adsorption platform on the wafer can be improved, and the position deviation of the wafer in the adjustment process can be prevented; and the air cylinder is matched with the jacking mechanism, so that the wafer can be jacked up after wafer detection is completed, adhesion of the wafer due to negative pressure adsorption is avoided, and the wafer taking fork can conveniently and quickly take the wafer for blanking.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer inspection, and specifically to a wafer inspection platform. Background Technology

[0002] In the semiconductor wafer inspection industry, wafer pickers are typically used to pick up wafers with the wafer attached and place them on an inspection platform for inspection. After inspection, wafer pickers are used again to remove wafers and unload them.

[0003] In existing technologies, wafers are typically placed directly on a platform for inspection. However, the wafer position needs to be adjusted during the inspection process, and the wafer is prone to falling off. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a wafer inspection platform to solve the problem that wafers are easily dropped in the existing method of placing wafers directly on the platform for inspection.

[0005] To achieve the above and other related objectives, this utility model provides a wafer inspection platform, including a base, a rotating mechanism, and an adsorption platform;

[0006] The rotating mechanism includes a mover, a rotating drive plate, and a circular stator. The circular stator is fixedly connected to the base, the mover is movably mounted on the outside of the circular stator, and the rotating drive plate is mounted on the outside of the mover. The mover rotates around the circular stator by driving the rotating drive plate. The adsorption platform is mounted on the upper surface of the mover and moves in a circular motion synchronously with the mover.

[0007] The adsorption platform includes an adsorption plate, an intermediate plate, a lifting mechanism, a base plate, and a cylinder. The adsorption plate and the intermediate plate are fixedly connected by screws, and a negative pressure cavity exists between them. The adsorption plate has multiple adsorption holes for adsorbing wafers, and multiple through holes for the lifting mechanism to pass through. The intermediate plate has multiple air holes for connecting to an air source. The base plate is fixedly connected to the intermediate plate, and a sealed cavity exists between them. The lifting mechanism is located in the sealed cavity, and the cylinder is fixedly connected to the lower end of the base plate, with the cylinder's output end passing through the base plate and fixedly connected to the central area of ​​the lifting mechanism.

[0008] In one embodiment of the present invention, a sensing baffle is provided on the side end of the moving part, and a photoelectric sensor is provided on the base, with the sensing baffle and the photoelectric sensor engaging in sensing cooperation.

[0009] In one embodiment of the present invention, the side end of the mover is further provided with a grating scale, and the base is provided with a reading head. The grating scale and the reading head are used to measure and cooperate to obtain the rotational displacement data of the mover.

[0010] In one embodiment of the present invention, the upper surface edge of the adsorption disk is provided with a plurality of positioning baffles at equal intervals, and the plurality of positioning baffles are positioned in cooperation on the outer side of the wafer.

[0011] In one embodiment of the present invention, the intermediate disk is provided with openings that are the same number as the through holes and are correspondingly connected.

[0012] In one embodiment of the present invention, the lifting mechanism includes a base and a top rod fixedly connected to the upper end of the base. The center of the base is fixedly connected to the output end of the cylinder. The number of the top rods is the same as the number of openings on the intermediate plate and the number of through holes on the adsorption plate, and their positions correspond. Under the drive of the cylinder, the lifting mechanism lifts multiple top rods to pass through the openings and through holes in sequence and extend them out of the adsorption platform to lift the wafer.

[0013] In one embodiment of the present invention, the adsorption plate is further provided with a plurality of concentric circular grooves, and a plurality of straight grooves are provided through the center of the circular grooves. The adsorption hole is provided on one of the concentric circular grooves and is located between two adjacent straight grooves.

[0014] In one embodiment of this utility model, the through hole is located at a distance of 1 / 2 of the wafer radius from the center of the adsorption disk.

[0015] As described above, the wafer inspection platform of this invention has the following beneficial effects:

[0016] This invention features an adsorption platform with an adsorption plate, an intermediate plate, and a base plate. A negative pressure cavity is formed between the adsorption plate and the intermediate plate, and a sealed cavity is formed between the base plate and the intermediate plate. A vacuum is achieved by connecting an air source through vents on the intermediate plate. The use of the negative pressure cavity and the sealed cavity improves the adsorption effect of the platform on wafers, prevents wafers from shifting during adjustment, and effectively improves wafer inspection results. Furthermore, the platform incorporates a lifting mechanism and cylinder to lift the wafers after inspection, preventing them from sticking due to negative pressure adsorption and facilitating quick wafer removal by the wafer pick-up fork. Attached Figure Description

[0017] Figure 1 The diagram shown is a structural schematic of this utility model.

[0018] Figure 2 The diagram shown is an exploded view of the present invention.

[0019] Figure 3 The diagram shown is an enlarged schematic of the exploded structure of the adsorption platform in this invention.

[0020] Figure 4 The diagram shown is a structural schematic of the positioning edge positioning wafer in this utility model.

[0021] Figure 5 This is a structural schematic diagram from another perspective of the present invention.

[0022] Component designation explanation

[0023] 1. Base; 2. Rotating mechanism; 21. Moving element; 22. Rotating drive plate; 23. Circular stator; 24. Reading head; 25. Grating scale; 26. Sensing baffle; 27. Photoelectric sensor;

[0024] Adsorption platform 3; adsorption plate 31; through hole 311; positioning guard 312; adsorption hole 313; intermediate plate 32; opening 321; air hole 322; lifting mechanism 33; top rod 331; base 332; base plate 34; cylinder 35; wafer 4. Detailed Implementation

[0025] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0026] Please see Figures 1 to 5 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0027] Please see Figures 1-5This utility model provides a wafer inspection platform, including a base 1, a rotating mechanism 2, and an adsorption platform 3. The rotating mechanism 2 includes a mover 21, a rotating drive plate 22, and a circular stator 23. The circular stator 23 is fixedly connected to the base 1, and the mover 21 is movably mounted on the outside of the circular stator 23. The rotating drive plate 22 is mounted on the outside of the mover 21. The mover 21 rotates circumferentially along the circular stator 23 by driving the rotating drive plate 22. The adsorption platform 3 is mounted on the upper surface of the mover 21 and rotates synchronously with the mover 21. The adsorption platform 3 includes an adsorption disk 31, an intermediate disk 32, a lifting mechanism 33, a base disk 34, and a cylinder 35. The adsorption disk 31 and the intermediate disk 32 are fixedly connected by screws, and a negative pressure cavity exists between them. The adsorption plate 32 has multiple air holes 322 for connecting to an air source to achieve vacuum adsorption. The adsorption plate has multiple adsorption holes 313 for adsorbing wafers 4. The adsorption plate 31 has multiple through holes 311 for the lifting mechanism 33 to pass through. The adsorption plate 31 also has multiple concentric circular grooves and multiple straight grooves through the center. The adsorption hole 313 is located on one of the concentric circular grooves and between two adjacent straight grooves. The grooves allow the adsorption platform 3 to form a negative pressure cavity when vacuuming, which helps to improve the adsorption effect on the wafers 4. The through holes 311 are located at a distance of 1 / 2 of the radius of the wafers 4 from the center of the adsorption plate 31 to ensure the stability of the wafers 4 when they are lifted. The base plate 34 is fixedly connected to the intermediate plate 32 and a sealed cavity exists between them; the lifting mechanism 33 is located in the sealed cavity, and the cylinder 35 is fixedly connected to the lower end of the base plate 34, and the output end of the cylinder 35 passes through the base plate 34 and is fixedly connected to the central area of ​​the lifting mechanism 33. Specifically, the lifting mechanism 33 includes a base 332 and a top rod 331 fixedly connected to the upper end of the base 332, and the center of the base 332 is fixedly connected to the output end of the cylinder 35.

[0028] In use, the negative pressure cavity between the adsorption plate 31 and the intermediate plate 32 is in a vacuum state. At this time, the lifting mechanism 33 is retracted into the sealed cavity, and the push rod 331 is located below the adsorption plate 31. The wafer 4 is placed on the adsorption plate 31 and is adsorbed and fixed by the vacuum cavity for testing. During the testing process, the position of the wafer 4 can be adjusted by rotating the actuator 21 to drive the adsorption platform 3 to rotate. After the testing is completed, the cylinder 35 drives the lifting mechanism 33 to lift up, and the push rod 331 extends above the adsorption plate 31 to lift the wafer 4 for unloading.

[0029] This invention features an adsorption platform 3 with an adsorption plate 31, an intermediate plate 32, and a base plate 34. A negative pressure cavity is formed between the adsorption plate 31 and the intermediate plate 32, and a sealed cavity is formed between the base plate 34 and the intermediate plate 32. A vacuum is achieved by connecting an air source through the air hole 322 on the intermediate plate 32. This negative pressure cavity is used to adsorb wafers 4 onto the adsorption platform, preventing the wafers 4 from shifting position during adjustment and effectively improving the wafer inspection effect. Furthermore, the adsorption platform 3 includes a lifting mechanism 34 and a cylinder 35 for lifting. After wafer inspection, the wafers 4 can be lifted to prevent them from sticking due to negative pressure adsorption, facilitating quick picking up of the wafers 4 by the pick-up fork.

[0030] The side end of the mover 21 is provided with a grating scale 25 and a sensing baffle 26. The base 1 is provided with a reading head 24 and a photoelectric sensor 27. The sensing baffle 26 and the photoelectric sensor 27 work together to detect the rotational position of the mover 21. The grating scale 25 and the reading head 24 work together to measure and obtain the rotational displacement data of the mover 21. Specifically, as the mover 21 rotates, the sensing baffle 26 will reach the position of the photoelectric sensor 27, causing the photoelectric sensor 27 to be in a light-blocking state, which indicates that the rotation is in place.

[0031] The upper surface edge of the adsorption plate 31 is provided with multiple positioning baffles 312 at equal intervals. The multiple positioning baffles 312 are positioned on the outside of the wafer 4 to prevent the wafer 4 from falling off during the loading process. The number and position of the positioning baffles 312 can be reasonably set according to the size of the wafer 4, which helps to improve the accuracy of wafer loading.

[0032] The intermediate disk 32 is provided with openings 321 in the same number as the through holes 311 and corresponding to form a connection; the number of top rods 332 is the same as the number of openings 321 on the intermediate disk 32 and the number of through holes 311 on the adsorption disk 31 and their positions are corresponding. The cross-sectional shape of the top rods 332 is adapted to the shape of the through holes 311 and the openings 321 to ensure the placement accuracy of the wafer; the lifting mechanism 33, driven by the cylinder 35, lifts up multiple top rods 332 and passes them through the openings 321 and through holes 311 in sequence and extends them out of the adsorption platform 3 to lift the wafer 4.

[0033] In summary, this invention utilizes a negative pressure chamber and a sealed chamber in conjunction with vacuuming to provide strong adsorption force, ensuring stable wafer positioning and preventing wafer 4 from shifting during adjustment. The cylinder 35, in conjunction with the lifting mechanism 33, can lift the wafer 4 after wafer inspection, preventing it from sticking due to negative pressure adsorption and facilitating quick removal of the wafer 4 by the pick-up fork. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and possesses high industrial applicability.

[0034] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer inspection platform, comprising: The base (1), the rotating mechanism (2) and the adsorption platform (3) are included. The rotating mechanism (2) includes a rotor (21), a rotating drive plate (22) and a circular stator (23), the circular stator (23) is fixedly connected with the base (1), the rotor (21) is movably arranged outside the circular stator (23), and the rotating drive plate (22) is arranged outside the rotor (21); the rotor (21) is driven to rotate along the circular stator (23) by driving the rotating drive plate (22); the adsorption platform (3) is installed on the upper surface of the rotor (21) and synchronously rotates with the rotor (21). The adsorption platform (3) includes an adsorption disc (31), an intermediate disc (32), a lifting mechanism (33), a base disc (34) and a cylinder (35), the adsorption disc (31) is fixedly connected with the intermediate disc (32) through screws and a negative pressure cavity is formed between the two; a plurality of adsorption holes (313) are formed in the adsorption disc (31) and used for adsorbing a wafer (4), a plurality of through holes (311) are formed in the adsorption disc (31) and used for allowing the lifting mechanism (33) to pass through; a plurality of air holes (322) are arranged on the intermediate disc (32) and used for connecting an air source; the base disc (34) is fixedly connected with the intermediate disc (32) and a sealed cavity is formed between the two; the lifting mechanism (33) is arranged in the sealed cavity, the cylinder (35) is fixedly connected to the lower end of the base disc (34), and the output end of the cylinder (35) is fixedly connected with the central region of the lifting mechanism (33) through the base disc (34).

2. The wafer inspection platform of claim 1, wherein: The side end of the rotor (21) is provided with an induction baffle (26), the base (1) is provided with a photoelectric sensor (27), the induction baffle (26) is in induction cooperation with the photoelectric sensor (27), and the rotation position of the rotor (21) is detected.

3. The wafer inspection platform of claim 2, wherein: The side end of the rotor (21) is also provided with a grating scale (25), the base (1) is provided with a reading head (24), the grating scale (25) is in measurement cooperation with the reading head (24), and the rotation displacement data of the rotor (21) is acquired.

4. The wafer inspection platform of claim 1, wherein: A plurality of positioning baffle edges (312) are arranged on the upper surface of the adsorption disc (31) at equal intervals, and the plurality of positioning baffle edges (312) are positioned on the outer side of the wafer (4).

5. The wafer inspection platform of claim 1, wherein: The intermediate disc (32) is provided with a plurality of open holes (321) which are formed in correspondence with the through holes (311).

6. The wafer inspection platform of claim 5, wherein: The lifting mechanism (33) includes a base (332) and a top rod (331) fixedly connected to the upper end of the base (332), and the center of the base (332) is fixedly connected with the output end of the cylinder (35); the number of the top rods (331) is same as that of the open holes (321) on the intermediate disc (32) and that of the through holes (311) on the adsorption disc (31), and the positions of the top rods (331) correspond to those of the open holes (321) and the through holes (311); the lifting mechanism (33) is driven by the cylinder (35) to lift a plurality of top rods (331) to sequentially pass through the open holes (321), the through holes (311) and extend out of the adsorption platform (3) to lift the wafer (4).

7. The wafer inspection platform of claim 1, wherein: A plurality of concentric circular grooves are formed on the adsorption disc (31), and a plurality of straight grooves are formed through the center of the adsorption disc (31), and the adsorption hole (313) is formed on one of the concentric circular grooves and between two adjacent straight grooves.

8. The wafer inspection platform of claim 1, wherein: The through hole (311) is located at a distance of 1 / 2 of the radius of the wafer (4) from the center of the adsorption disc (31).

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