Channel-combining transportation device for silicon wafers

Abstract

The utility model discloses a silicon wafer channel-combining transportation device, which comprises a plurality of first conveying mechanisms, a second conveying mechanism and a transfer mechanism, and is characterized in that the first conveying mechanisms are used for conveying a plurality of silicon wafers; the second conveying mechanism is used for receiving the silicon wafers on the multiple first conveying mechanisms, the transferring mechanism comprises a transverse moving assembly and multiple fixing assemblies, the transverse moving assembly comprises a transverse piece, the transverse piece has the moving freedom degree in the left-right direction of the silicon wafer channel-combining conveying device, and each fixing assembly is connected with the transverse piece; each fixing assembly can fix a silicon wafer or be separated from the silicon wafer and is used for conveying the silicon wafers on the multiple first conveying mechanisms to the second conveying mechanism. Through the arrangement, the conveying efficiency of the silicon wafers can be improved.

Description

Technical Field

[0001] This application relates to the field of silicon wafer processing technology, and in particular to a silicon wafer consolidation and transportation device. Background Technology

[0002] In some semiconductor silicon wafer processing techniques, such as wafer cleaning and drying, multi-channel conveying is often required to improve processing efficiency. After multi-channel conveying is completed, the silicon wafers on the multi-channel conveyor line need to be merged into a single-channel conveyor line using transfer equipment, thereby reducing the space occupied by the conveyor line.

[0003] In the existing technology, the transfer equipment can only transport silicon wafers on one channel of the transfer line in one transfer process, which means that the transfer equipment needs to move the silicon wafers back and forth many times, reducing the efficiency of silicon wafer consolidation and thus reducing the efficiency of silicon wafer transport.

[0004] Therefore, how to improve the delivery efficiency of silicon wafers is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] To address the shortcomings of existing technologies, the purpose of this application is to provide a silicon wafer consolidation and transportation device with higher conveying efficiency.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] A silicon wafer consolidation and transport device includes multiple first conveying mechanisms, a second conveying mechanism, and a transfer mechanism. The first conveying mechanisms transport multiple silicon wafers. The second conveying mechanisms receive silicon wafers from the multiple first conveying mechanisms. The transfer mechanism includes a lateral moving assembly and multiple fixing assemblies. The lateral moving assembly includes a lateral member having a degree of freedom of movement in the left-right direction along the silicon wafer consolidation and transport device. Each fixing assembly is connected to the lateral member and can fix or separate from the silicon wafers, for transporting silicon wafers from the multiple first conveying mechanisms to the second conveying mechanism.

[0008] Furthermore, the longitudinal movement assembly includes a longitudinal member having a degree of freedom of movement in the back-and-forth direction along the silicon wafer conduit transport device. The longitudinal member is connected to a transverse movement assembly, and each fixed assembly is connected to the transverse member; or, the longitudinal movement assembly is connected to the transverse member, and each fixed assembly is connected to the longitudinal member and connected to the transverse member through the longitudinal movement assembly.

[0009] Furthermore, the longitudinal movement assembly includes a longitudinal drive member and a longitudinal support frame extending along the front-rear direction of the silicon wafer conveying device. The longitudinal member is slidably connected to the longitudinal support frame, and the longitudinal drive member drives the longitudinal member to move.

[0010] Furthermore, the lateral movement assembly includes a lateral drive component and a lateral support frame extending in the left-right direction along the silicon wafer conveying device. The lateral component is slidably connected to the lateral support frame, and the lateral drive component drives the lateral component to move. The lateral component is connected to a longitudinal support frame, or the longitudinal component is connected to the lateral support frame.

[0011] Furthermore, the multiple first conveying mechanisms are divided into two conveying groups, each conveying group including three first conveying mechanisms distributed along the left-right direction of the silicon wafer consolidation transport device, and a second conveying mechanism located between the two conveying groups along the left-right direction of the silicon wafer consolidation transport device. The multiple fixing components are divided into four fixing groups, the four fixing groups being distributed along the left-right direction of the silicon wafer consolidation transport device, each fixing group including three fixing components distributed along the front-back direction of the silicon wafer consolidation transport device.

[0012] Furthermore, the silicon wafer conveying device also includes a fixed support frame, which includes at least one longitudinal frame and multiple transverse frames connected to the longitudinal frame, with multiple fixing components installed at equal intervals on each transverse frame.

[0013] Furthermore, the fixing component includes an adsorption element for adsorbing silicon wafers, the adsorption element having at least one adsorption hole, and a negative pressure can be formed in the adsorption hole to adsorb the silicon wafers.

[0014] Furthermore, the silicon wafer consolidation transport device also includes multiple blocking mechanisms for restricting the position of the silicon wafers, with the same number of blocking mechanisms installed on each first transport mechanism. Along the left-right direction of the silicon wafer consolidation transport device, each blocking mechanism on one of the first transport mechanisms is aligned with a corresponding blocking mechanism on the other first transport mechanism.

[0015] Furthermore, the blocking mechanism includes a detection element for detecting the position of the silicon wafer and a blocking element capable of restricting the silicon wafer, the blocking element having a degree of freedom of movement. The blocking mechanism includes a blocking cylinder connected to the blocking element to drive the blocking element to move.

[0016] Furthermore, the silicon wafer conveying device also includes a drying mechanism for drying the cleaned silicon wafers, which is connected to multiple first conveying mechanisms. The drying mechanism includes multiple pressure rods, multiple pressure rollers, multiple guide rollers, a drive mechanism, an upper drying component, and a lower drying component. Each pressure roller is fitted onto a pressure rod and rotatably connected to it. Each guide roller is located below a pressure roller. The drive mechanism drives the multiple guide rollers to rotate. The upper drying component is located above the multiple pressure rollers, and the lower drying component is located below the multiple guide rollers. A driving space is formed between the guide rollers and the pressure rollers to move the silicon wafers.

[0017] Furthermore, the silicon wafer consolidation and transport device includes multiple straightening mechanisms for straightening the position of silicon wafers, each straightening mechanism being at least partially located between a drying mechanism and a first conveying mechanism. Each straightening mechanism includes a first straightening element and a second straightening element, which are located on opposite sides of a first conveying mechanism along the left-right direction of the silicon wafer consolidation and transport device. At least one of the first straightening element and the second straightening element has a degree of freedom of movement along the left-right direction of the silicon wafer consolidation and transport device. A rotating element is rotatably connected to both the first straightening element and the second straightening element, and the rotating element is covered by a buffer element.

[0018] The aforementioned silicon wafer consolidation and transport device can simultaneously transfer multiple silicon wafers from the first transport mechanism to the second transport mechanism through multiple fixed components, thereby improving the consolidation efficiency of silicon wafers and thus improving the transport efficiency of silicon wafers. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer consolidation and transportation device provided in the embodiments of this application.

[0020] Figure 2 This is a schematic diagram of the transfer mechanism of the silicon wafer consolidation and transportation device provided in the embodiments of this application.

[0021] Figure 3 Examples of this application Figure 1 Enlarged diagram of point A in the diagram.

[0022] Figure 4 This is a schematic diagram of the drying mechanism of the silicon wafer conveying device provided in the embodiments of this application.

[0023] Figure 5 Examples of this application Figure 1 Enlarged diagram of point B in the image.

[0024] Among them, 100, silicon wafer conveying device; 11, first conveying mechanism; 12, second conveying mechanism; 13, transfer mechanism; 131, longitudinal moving assembly; 1311, longitudinal component; 1312, longitudinal driving component; 1313, longitudinal support frame; 132, transverse moving assembly; 1321, transverse component; 1322, transverse driving component; 1323, transverse support frame; 133, fixing assembly; 1331, adsorption component; 14 141. Fixed support frame; 142. Longitudinal frame; 143. Horizontal frame; 15. Blocking mechanism; 151. Detection component; 152. Blocking component; 153. Blocking cylinder; 16. Drying mechanism; 161. Pressure rod; 162. Pressure roller; 163. Guide transmission roller; 164. Transmission drive component; 165. Upper drying component; 17. Straightening mechanism; 171. First straightening component; 172. Second straightening component; 173. Rotating component; 174. Buffer component. Detailed Implementation

[0025] To enable those skilled in the art to better understand the present application, the technical solutions in specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0026] It should be noted that the terms "first," "second," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. "A plurality" or "several" indicates at least two. Unless otherwise stated, terms such as "front," "back," "left," "right," "lower," and / or "upper" are for illustrative purposes only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" indicate that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0027] The singular forms “a,” “the,” and “the” used in this application specification and appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0028] To clearly illustrate the technical solution of this application, the following are also defined: Figure 1 The directions shown are front, back, left, right, up, and down.

[0029] like Figure 1 and Figure 2 As shown, this application provides a silicon wafer merging and transporting device 100, which includes multiple first conveying mechanisms 11, second conveying mechanisms 12, and transfer mechanisms 13. The first conveying mechanisms 11 are used to convey multiple silicon wafers, the second conveying mechanisms 12 are used to receive silicon wafers from the multiple first conveying mechanisms 11, and the transfer mechanism 13 is used to transfer the silicon wafers from the multiple first conveying mechanisms 11 to the second conveying mechanisms 12, thereby merging the silicon wafers from a multi-channel conveying line to a single-channel conveying line, that is, merging the silicon wafers from multiple second conveying mechanisms 12 to the second conveying mechanism 12.

[0030] It should be noted that each first conveying mechanism 11 can simultaneously convey multiple silicon wafers, thereby improving the silicon wafer conveying efficiency. Furthermore, the consistent number of silicon wafers conveyed by each first conveying mechanism 11 ensures that the transfer mechanism 13 can transfer the same number of silicon wafers to each first conveying mechanism 11. This avoids insufficient silicon wafers on one or more first conveying mechanisms 11, which could lead to insufficient utilization of the transfer mechanism 13, thus improving the silicon wafer conveying efficiency. It also prevents an excessive number of silicon wafers on one or more first conveying mechanisms 11, which could prevent the transfer mechanism 13 from simultaneously transferring silicon wafers, thus facilitating synchronous operation between the first conveying mechanism 11 and the transfer mechanism 13.

[0031] Specifically, the transfer mechanism 13 includes a lateral moving component 132 and multiple fixing components 133. The fixing components 133 are used to pick up and place silicon wafers. The lateral moving component 132 can move the silicon wafers to the second conveying mechanism 12, thereby achieving wafer alignment.

[0032] More specifically, the lateral movement assembly 132 includes a lateral member 1321, which has a degree of freedom of movement in the left-right direction along the silicon wafer consolidation transport device 100. In this application, the first conveying mechanism 11 and the second conveying mechanism 12 are arranged in the left-right direction along the silicon wafer consolidation transport device 100. Therefore, the lateral member 1321 can drive the fixing assembly 133 to move between the first conveying mechanism 11 and the second conveying mechanism 12, which facilitates the conveying of silicon wafers on the first conveying mechanism 11 to the second conveying mechanism 12, thereby facilitating the consolidation and conveying of silicon wafers. In addition, the lateral member 1321 can guide the movement of the fixing assembly 133 in the left-right direction along the silicon wafer consolidation transport device 100, further avoiding the occurrence of bumps during silicon wafer transport, thereby further improving the movement stability of the fixing assembly 133 and the transport stability of silicon wafers.

[0033] In this embodiment, each fixing component 133 is connected to the lateral component 1321 so that the lateral moving component 132 can drive the fixing component 133 to move. Specifically, each fixing component 133 can fix the silicon wafer or separate from the silicon wafer so that the fixing component 133 can pick up the silicon wafer from the first conveying mechanism 11 and place the silicon wafer on the second conveying mechanism 12 to realize the handling and merging of the silicon wafer.

[0034] With the above configuration, multiple fixed components 133 can simultaneously pick up multiple silicon wafers from the first conveying mechanism 11. Then, the lateral moving component 132 drives the fixed components 133 to move, so that the silicon wafers on the fixed components 133 can be moved to the second conveying mechanism 12 and placed. This enables the silicon wafers from multiple first conveying mechanisms 11 to be simultaneously conveyed to the second conveying mechanism 12, which helps to improve the efficiency of silicon wafer confluence between the first conveying mechanism 11 and the second conveying mechanism 12, thereby improving the silicon wafer conveying efficiency.

[0035] In one embodiment, the transfer mechanism 13 includes a longitudinal moving component 131, which can drive the silicon wafer to move along the front-back direction of the silicon wafer conveying device 100, so that the silicon wafer has an initial velocity parallel to the second conveying mechanism 12, so as to realize the follow-up of the silicon wafer and the second conveying mechanism 12, thereby adjusting the placement position of the silicon wafer on the second conveying mechanism 12, so that the silicon wafer to be placed on the fixing component 133 can avoid overlapping with the silicon wafers already placed on the second conveying mechanism 12, so as to avoid reorganizing the silicon wafers on the second conveying mechanism 12 and improve the silicon wafer conveying efficiency.

[0036] In this embodiment, the fixing component 133 picks up silicon wafers from multiple first conveying mechanisms 11, moves them to the second conveying mechanism 12 via the lateral moving component 132, and then moves the silicon wafers via the longitudinal moving component 131. This gives the silicon wafers an initial velocity parallel to the second conveying mechanism 12, which facilitates adjusting the position of the silicon wafers on the fixing component 133, thereby preventing overlap of silicon wafers on the second conveying mechanism 12. Finally, the fixing component 133 places the silicon wafers onto the second conveying mechanism 12, achieving combined silicon wafer transport and effectively improving the silicon wafer transport efficiency. Furthermore, the fixing component 133 can simultaneously pick up silicon wafers from multiple first conveying mechanisms 11 and, in conjunction with the lateral moving component 132 and the longitudinal moving component 131, combine the silicon wafers onto the second conveying mechanism 12, further improving the silicon wafer transport efficiency. In other words, the fixing component 133 is used to transport silicon wafers from multiple first conveying mechanisms 11 to the second conveying mechanism 12.

[0037] Secondly, after the fixing component 133 picks up the silicon wafers from the multiple first conveying mechanisms 11, it can first drive the silicon wafers to move through the longitudinal moving component 131 so that the silicon wafers have an initial velocity parallel to the second conveying mechanism 12, which is conducive to adjusting the position of the silicon wafers on the fixing component 133. Then, it moves to the second conveying mechanism 12 through the transverse moving component 132. Finally, the fixing component 133 places the silicon wafers on the second conveying mechanism 12 to realize the combined conveying of silicon wafers.

[0038] In addition, after the fixing component 133 picks up the silicon wafers from the multiple first conveying mechanisms 11, the lateral moving component 132 moves to the second conveying mechanism 12, while the longitudinal moving component 131 drives the silicon wafers to move, so that the silicon wafers have an initial velocity parallel to the second conveying mechanism 12. Finally, the fixing component 133 places the silicon wafers on the second conveying mechanism 12 to achieve the combined conveying of the silicon wafers.

[0039] In summary, this application does not restrict the working order of the lateral moving component 132 and the longitudinal moving component 131, as long as the silicon wafer can be transferred through the transfer mechanism 13.

[0040] It should be noted that, in this application, the lateral moving component 132 may be connected to the longitudinal moving component 131, and the longitudinal moving component 131 may be connected to the fixed component 133, so that the lateral moving component 132 can synchronously drive the longitudinal moving component 131 and the fixed component 133 to move in the left-right direction of the silicon wafer consolidation transport device 100, and the longitudinal moving component 131 drives the fixed component 133 to move in the front-back direction of the silicon wafer consolidation transport device 100. Alternatively, the longitudinal moving component 131 may be connected to the lateral moving component 132, and the lateral moving component 132 may be connected to the fixed component 133, so that the longitudinal moving component 131 can synchronously drive the lateral moving component 132 and the fixed component 133 to move in the front-back direction of the silicon wafer consolidation transport device 100, and the lateral moving component 132 drives the fixed component 133 to move in the left-right direction of the silicon wafer consolidation transport device 100. This application does not impose any limitations on this.

[0041] Specifically, the longitudinal moving assembly 131 includes a longitudinal member 1311, which has a degree of freedom of movement along the front-back direction of the silicon wafer consolidation transport device 100. In this application, the conveying direction of the first conveying mechanism 11 and the conveying direction of the second conveying mechanism 12 are both consistent with the front-back direction of the silicon wafer consolidation transport device 100. This arrangement allows the silicon wafers on the fixed assembly 133 to move along the conveying direction of the second conveying mechanism 12 via the longitudinal member 1311, giving them an initial velocity parallel to the conveying direction of the second conveying mechanism 12. This facilitates adjusting the position of the silicon wafers on the fixed assembly 133 as they fall onto the second conveying mechanism 12. Furthermore, the longitudinal member 1311 provides guidance for the movement of the fixed assembly 133 along the front-back direction of the silicon wafer consolidation transport device 100, preventing bumps during silicon wafer transport and thus improving the movement stability of the fixed assembly 133 and the transport stability of the silicon wafers.

[0042] Furthermore, the longitudinal member 1311 is connected to the lateral moving assembly 132, and each fixed assembly 133 is connected to the lateral member 1321; or, the longitudinal moving assembly 131 is connected to the lateral member 1321, and each fixed assembly 133 is connected to the longitudinal member 1311, and the lateral member 1321 is connected through the longitudinal moving assembly 131. Therefore, this application does not limit the connection form of the lateral moving assembly 132 and the longitudinal moving assembly 131.

[0043] In one embodiment, the longitudinal moving assembly 131 includes a longitudinal driving member 1312 and a longitudinal support frame 1313. The longitudinal support frame 1313 extends along the front-rear direction of the silicon wafer consolidation transport device 100. The longitudinal member 1311 is slidably connected to the longitudinal support frame 1313, so that the longitudinal member 1311 can extend and move along the front-rear direction of the silicon wafer consolidation transport device 100. The longitudinal driving member 1312 drives the longitudinal member 1311 to move.

[0044] For example, the longitudinal drive member 1312 can be a drive cylinder. The drive cylinder drives the longitudinal member 1311 to move along the front and back direction of the silicon wafer conveying device 100, thereby driving the silicon wafer on the fixing component 133 to move. This allows the silicon wafer to have an initial velocity parallel to the conveying direction of the second conveying mechanism 12, so as to avoid the silicon wafer on the fixing component 133 from overlapping with the silicon wafer on the second conveying mechanism 12, thereby improving the conveying efficiency of the silicon wafer.

[0045] For example, the longitudinal support frame 1313 is provided with a slide rail, and the longitudinal member 1311 is provided with a slider. The slider is slidably connected to the slide rail, so that the longitudinal member 1311 is slidably connected to the longitudinal support frame 1313. In addition, the connection between the slide rail and the slider can guide the movement of the longitudinal member 1311, thereby improving the movement stability of the longitudinal member 1311.

[0046] In one embodiment, the lateral movement assembly 132 includes a lateral drive member 1322 and a lateral support frame 1323. The lateral support frame 1323 extends in the left-right direction along the silicon wafer consolidation transport device 100. The lateral member 1321 is slidably connected to the lateral support frame 1323. The lateral drive member 1322 drives the lateral member 1321 to move, so that the lateral member 1321 can extend and move in the left-right direction along the silicon wafer consolidation transport device 100.

[0047] For example, the horizontal drive component can be a cable chain, which drives the horizontal component 1321 to move in the left-right direction along the silicon wafer merging transport device 100, thereby causing the silicon wafers on the fixed component 133 to move between the first transport mechanism 11 and the second transport mechanism 12, so as to facilitate the merging and transport of silicon wafers.

[0048] For example, the transverse support frame 1323 is provided with a slide rail, and the transverse member 1321 is provided with a slider. The slider is slidably connected to the slide rail, so that the transverse member 1321 is slidably connected to the transverse support frame 1323. In addition, the connection between the slide rail and the slider can guide the movement of the transverse member 1321, thereby improving the movement stability of the transverse member 1321.

[0049] In this embodiment, the lateral member 1321 is connected to the longitudinal support frame 1313, enabling the lateral member 1321 to drive the longitudinal support frame 1313 to move, thereby driving the longitudinal moving assembly 131 to move in the left-right direction of the silicon wafer consolidation transport device 100. Alternatively, the longitudinal member 1311 is connected to the lateral support frame 1323, enabling the longitudinal member 1311 to drive the lateral support frame 1323 to move, thereby driving the lateral moving assembly 132 to move in the front-back direction of the silicon wafer consolidation transport device 100. Furthermore, in this application, the lateral member 1321 is connected to the longitudinal support frame 1313.

[0050] In one implementation, the plurality of first conveying mechanisms 11 are divided into two conveying groups. Each conveying group includes three first conveying mechanisms 11 distributed along the left-right direction of the silicon wafer consolidation transport device 100. A second conveying mechanism 12 is located between the two conveying groups along the left-right direction of the silicon wafer consolidation transport device 100. Specifically, the plurality of fixing components 133 are divided into four fixing groups. The four fixing groups are distributed along the left-right direction of the silicon wafer consolidation transport device 100. Each fixing group includes three fixing components 133 distributed along the front-back direction of the silicon wafer consolidation transport device 100. With this configuration, when the lateral moving component 132 drives the fixing component 133 to pick up the silicon wafer from the first conveying mechanism 11, the station distance of one first conveying mechanism 11 can be reduced in the movement stroke of the fixing component 133 picking up the silicon wafer. This improves the efficiency of the lateral moving component 132 driving the fixing component 133 to pick up the silicon wafer from the first conveying mechanism 11, thereby improving the consolidation efficiency of the silicon wafer consolidation transport device 100.

[0051] For example, four fixing groups are defined as the first fixing group 1332, the second fixing group 1333, the third fixing group 1334, and the fourth fixing group 1335. Along the left-right direction of the silicon wafer conveying device 100, the conveying group on the left is defined as the first conveying group, and the conveying group on the right is defined as the second conveying group. When the fixing component 133 picks up a silicon wafer from the first conveying group, the first fixing group 1332, the second fixing group 1333, and the third fixing group 1334 can respectively pick up three silicon wafers from the first conveying mechanism 11. The fourth fixing group 1335 is located above the second conveying mechanism 12, so that the fourth fixing group 1335 does not need to pick up silicon wafers from the first conveying group. Then, the lateral moving component 132 drives the fixing component 133 to move to the right, so that the silicon wafers from the first fixing group 1332, the second fixing group 1333, and the third fixing group 1334 can be placed on the second conveying mechanism 12. When the lateral moving component 132 moves the first fixing group 1332 above the second conveying mechanism 12, the second fixing group 1333, the third fixing group 1334, and the fourth fixing group 1335 can be positioned above the second conveying group, allowing them to pick up silicon wafers from the three first conveying mechanisms 11 within the second conveying group, thus eliminating the need for the first fixing group 1332 to pick up silicon wafers from the second conveying group. Then, the lateral moving component 132 moves the fixing component 133 to the left, allowing the silicon wafers from the second fixing group 1333, the third fixing group 1334, and the fourth fixing group 1335 to be placed on the second conveying mechanism 12. When the lateral moving component 132 moves the fourth fixed group 1335 above the second conveying mechanism 12, the first fixed group 1332, the second fixed group 1333 and the third fixed group 1334 can be positioned above the first conveying group, which is beneficial for picking up silicon wafers on the first and second conveying groups, thereby improving the consolidation efficiency of the silicon wafer consolidation transport device 100.

[0052] Through the above steps, it is not necessary to place the silicon wafer in the first fixed group 1332 and then move it to the second conveying group to pick up the silicon wafer, nor is it necessary to place the silicon wafer in the fourth fixed group 1335 and then move it to the first conveying group to pick up the silicon wafer. This reduces the working distance of the first conveying mechanism 11 in the moving stroke of the fixed component 133 picking up the silicon wafer, thereby improving the efficiency of silicon wafer transportation.

[0053] In one embodiment, the silicon wafer consolidation transport device 100 further includes a fixed support frame 14, which includes at least one longitudinal frame 141 and multiple transverse frames 142 connected to the longitudinal frame 141. Multiple fixing components 133 are equally spaced on each transverse frame 142. The multiple longitudinal frames 141 improve the connection stability between the fixing components 133 and the fixed support frame 14, thereby improving the stability of the transfer mechanism 13 in transporting silicon wafers. Along the front-rear direction of the silicon wafer consolidation transport device 100, the spacing between two adjacent fixing components 133 on each transverse frame 142 is consistent with the spacing between two adjacent silicon wafers on each first conveying mechanism 11, further improving the ease with which the fixing components 133 pick up silicon wafers.

[0054] In one embodiment, the fixing assembly 133 includes an adsorption member 1331 for adsorbing silicon wafers. Specifically, the adsorption member 1331 has at least one adsorption hole, and a negative pressure can be formed within the adsorption hole to adsorb the silicon wafer. With this configuration, when the fixing assembly 133 moves to the first conveying mechanism 11, a negative pressure is formed within the adsorption hole, allowing the adsorption member 1331 to adsorb the silicon wafer on the first conveying mechanism 11. When the fixing assembly 133 moves to the second conveying mechanism 12, the negative pressure is no longer formed within the adsorption hole, allowing the silicon wafer on the adsorption member 1331 to fall onto the second conveying mechanism 12, thereby realizing the transfer of the silicon wafer.

[0055] In one implementation, the silicon wafer consolidation and transport device 100 further includes a plurality of blocking mechanisms 15, which are used to limit the position of the silicon wafers on the first transport mechanism 11. Specifically, each first transport mechanism 11 is equipped with the same number of blocking mechanisms 15. This arrangement ensures that each first transport mechanism 11 can block the same number of silicon wafers, so that the number of silicon wafers to be picked up on each first transport mechanism 11 is consistent, thereby improving the synchronization of the fixing assembly 133 in picking up silicon wafers on each first transport mechanism 11.

[0056] More specifically, along the left-right direction of the silicon wafer consolidation transport device 100, each blocking mechanism 15 on one of the first conveying mechanisms 11 is aligned with a corresponding blocking mechanism 15 on other first conveying mechanisms 11. This arrangement ensures that the corresponding silicon wafers on multiple first conveying mechanisms 11 are aligned along the left-right direction of the silicon wafer consolidation transport device 100, preventing misalignment of the silicon wafers on the first conveying mechanisms 11 that would prevent the fixing component 133 from adsorbing the silicon wafers. This improves the ease with which the fixing component 133 adsorbs the silicon wafers, thereby further enhancing the silicon wafer transport efficiency.

[0057] like Figure 3As shown, in one embodiment, the blocking mechanism 15 includes a detection element 151 and a blocking element 152. The detection element 151 is used to detect the position of the silicon wafer. The blocking element 152 has a degree of freedom of movement and can restrict the silicon wafer, thereby limiting the position of the silicon wafer on the first conveying mechanism 11 to facilitate the positioning of the silicon wafer on the first conveying mechanism 11. For example, the detection element 151 can be a position sensor. During the movement of the silicon wafer on the first conveying mechanism 11, the position sensor can detect the position of the silicon wafer. When the silicon wafer moves to a designated position, the blocking element 152 can block the movement of the silicon wafer, thereby limiting the position of the silicon wafer on the first conveying mechanism 11.

[0058] In this application, the designated position refers to the position corresponding to the position of the silicon wafer and the corresponding adsorption member 1331 when the fixing component 133 moves to the first conveying mechanism 11.

[0059] Specifically, the blocking mechanism 15 includes a blocking cylinder 153, which is connected to the blocking member 152 so that the blocking cylinder 153 can drive the blocking member 152 to move. This configuration allows the blocking member 152 to block the silicon wafer, thereby limiting the position of the silicon wafer on the first conveying mechanism 11.

[0060] It should be noted that the blocking mechanism 15 may also include a motor, which is connected to the blocking member 152 to drive the blocking member 152 to move and limit the silicon wafer. Therefore, this application does not limit the way the blocking mechanism 15 drives the blocking sheet to move.

[0061] like Figure 4 As shown, in one embodiment, the silicon wafer consolidation and transport device 100 further includes a drying mechanism 16, which is used to dry the cleaned silicon wafers. Specifically, the drying mechanism 16 is connected to a plurality of first conveying mechanisms 11. This arrangement allows the silicon wafers to be conveyed to the plurality of first conveying mechanisms 11 after drying, and then combined and conveyed to the second conveying mechanism 12 by the transfer mechanism 13.

[0062] In this embodiment, the drying mechanism 16 includes multiple pressure rods 161, multiple pressure rollers 162, multiple guide rollers 163, a transmission drive 164, an upper drying component 165, and a lower drying component (not shown). Each pressure roller 162 is sleeved on a pressure rod 161 and rotatably connected to the corresponding pressure rod 161. Each guide roller 163 is located below a pressure roller 162. The silicon wafer passes between the pressure rollers 162 and the guide rollers 163. The pressure rollers 162 and the guide rollers 163 drive the silicon wafer to move within the drying mechanism 16, facilitating the drying process. The transmission drive 164 drives the multiple guide rollers 163 to rotate, thereby moving the silicon wafer between the pressure rollers 162 and the guide rollers 163. The upper drying component 165 is located above the multiple pressure rollers 162 and is used to dry the upper surface of the silicon wafer. The lower drying element is located below multiple guide rollers 163. The lower drying element is used to dry the lower surface of the silicon wafer, which helps to improve the drying efficiency of the silicon wafer.

[0063] More specifically, a drive space is formed between the guide roller 163 and the pressure roller 162 to drive the silicon wafer to move. With this arrangement, the silicon wafer is located in the drive space, thereby enabling the silicon wafer to move and be dried by the upper drying member 165 and the lower drying member.

[0064] For example, the transmission drive 164 includes a drive motor and a plurality of driven gears, with each guide transmission roller 163 connected to a driven gear. The drive motor is connected to the plurality of transmission gears and drives the plurality of transmission gears to rotate, and each transmission gear meshes with a driven gear, so that the transmission gear drives the driven gear to rotate, thereby driving the guide transmission roller 163 to rotate, and thus driving the silicon wafer located in the drive space to move.

[0065] like Figure 5 As shown, in one embodiment, the silicon wafer consolidation and transport device 100 includes a plurality of straightening mechanisms 17 for straightening the position of the silicon wafers. Each straightening mechanism 17 is at least partially located between the drying mechanism 16 and a first conveying mechanism 11. This arrangement allows the straightening mechanisms 17 to straighten the position of the dried silicon wafers, preventing the wafers on the first conveying mechanism 11 from shifting and causing the fixing assembly 133 to be unable to pick up the wafers, thereby improving the silicon wafer transport efficiency.

[0066] Specifically, each straightening mechanism 17 includes a first straightening element 171 and a second straightening element 172. The first straightening element 171 and the second straightening element 172 are located on both sides of a first conveying mechanism 11 along the left-right direction of the silicon wafer consolidation transport device 100. At least one of the first straightening element 171 and the second straightening element 172 has a degree of freedom of movement along the left-right direction of the silicon wafer consolidation transport device 100. With this configuration, when the silicon wafer on the first conveying mechanism 11 moves between the first straightening element 171 and the second straightening element 172, the first straightening element 171 and / or the second straightening element 172 move along the left-right direction of the silicon wafer consolidation transport device 100, thereby adjusting the position of the silicon wafer in the left-right direction of the silicon wafer consolidation transport device 100. This prevents the silicon wafer from shifting and causing the transfer mechanism 13 to be unable to pick up the silicon wafer, thereby further improving the silicon wafer conveying efficiency.

[0067] In some embodiments, the straightening mechanism 17 further includes a detection element for detecting the position of the silicon wafer. This configuration allows the detection element to detect the position of the silicon wafer. When the detection element detects that the silicon wafer has moved between the first straightening element 171 and the second straightening element 172, the first straightening element 171 and / or the second straightening element 172 move in a left-right direction along the silicon wafer consolidation transport device 100, thereby achieving silicon wafer straightening. For example, the detection element can be a position sensor, which detects the position of the silicon wafer to facilitate precise silicon wafer straightening.

[0068] More specifically, a rotating member 173 is rotatably connected to both the first alignment member 171 and the second alignment member 172. The rotating member 173 has rotational freedom so that rolling friction is formed between the rotating member 173 and the silicon wafer, which helps to reduce wear between the rotating member 173 and the silicon wafer. Furthermore, the rotating member 173 will not interfere with the movement of the silicon wafer, and it also facilitates the movement of the silicon wafer on the first conveying mechanism 11.

[0069] Specifically, the rotating component 173 is wrapped with a buffer component 174. With this configuration, during the process of straightening the silicon wafer by the first straightening component 171 and the second straightening component 172, the buffer component 174 can buffer the silicon wafer to avoid the silicon wafer being excessively clamped by the first straightening component 171 and the second straightening component 172, which could lead to the silicon wafer breaking. This can reduce the production cost of the silicon wafer consolidation and transport device 100.

[0070] It should be noted that the rotation axis of the rotating component 173 is parallel to the vertical direction of the silicon wafer consolidation transport device 100, thereby preventing the rotating component 173 from interfering with the movement of the silicon wafers on the first conveying mechanism 11 along the front-back direction of the silicon wafer consolidation transport device 100, which in turn helps to improve the silicon wafer conveying efficiency of the silicon wafer consolidation transport device 100.

[0071] In some embodiments, the buffer 174 may be rubber, which is wrapped around the rotating member 173 to buffer the silicon wafer and protect it.

[0072] In one implementation, each straightening mechanism 17 further includes a first driving member and / or a second driving member (not shown). The first driving member is connected to and drives the first straightening member 171 to move, and the second driving member is connected to and drives the second straightening member 172 to move. With this configuration, the first straightening mechanism 17 is driven to move by the first driving member and / or the second straightening mechanism 17 is driven to move by the second driving member, thereby achieving the straightening of the silicon wafer.

[0073] For example, the straightening mechanism 17 includes a gripper cylinder with a first driving member and a second driving member. The gripper cylinder can drive the first straightening member 171 and the second straightening member 172 to move towards each other, thereby straightening the silicon wafer and improving the conveying efficiency of the silicon wafer.

[0074] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A silicon wafer gangway transport device (100) characterized by, The utility model relates to a silicon wafer combined channel conveying device, which comprises: a plurality of first conveying mechanisms (11) for conveying a plurality of silicon wafers; a second conveying mechanism (12) for receiving the silicon wafers on the plurality of first conveying mechanisms (11); a transfer mechanism (13), which comprises: a lateral moving assembly (132) comprising a lateral piece (1321) having a moving degree of freedom in the left-right direction of the silicon wafer combined channel conveying device (100); a plurality of fixing assemblies (133), each of which is connected to the lateral piece (1321) and can fix or separate the silicon wafers, for conveying the silicon wafers on the plurality of first conveying mechanisms (11) to the second conveying mechanism (12).

2. The silicon wafer gang transport apparatus (100) according to claim 1, characterized in that The transfer mechanism (13) comprises a longitudinal moving assembly (131) comprising a longitudinal piece (1311) having a moving degree of freedom in the front-back direction of the silicon wafer combined channel conveying device (100); the longitudinal piece (1311) is connected to the lateral moving assembly (132), and each of the fixing assemblies (133) is connected to the lateral piece (1321); or, the longitudinal moving assembly (131) is connected to the lateral piece (1321), and each of the fixing assemblies (133) is connected to the longitudinal piece (1311) and connected to the lateral piece (1321) through the longitudinal moving assembly (131).

3. The silicon wafer gang transport apparatus (100) according to claim 2, characterized in that The longitudinal moving assembly (131) comprises a longitudinal driving piece (1312) and a longitudinal support frame (1313) extending in the front-back direction of the silicon wafer combined channel conveying device (100), the longitudinal piece (1311) is slidably connected to the longitudinal support frame (1313), and the longitudinal driving piece (1312) drives the longitudinal piece (1311) to move.

4. The silicon wafer gang transport apparatus (100) according to claim 3, characterized in that The lateral moving assembly (132) comprises a lateral driving piece (1322) and a lateral support frame (1323) extending in the left-right direction of the silicon wafer combined channel conveying device (100), the lateral piece (1321) is slidably connected to the lateral support frame (1323), and the lateral driving piece (1322) drives the lateral piece (1321) to move; the lateral piece (1321) is connected to the longitudinal support frame (1313), or the longitudinal piece (1311) is connected to the lateral support frame (1323).

5. The silicon wafer gang transport apparatus (100) of claim 1, wherein, The plurality of first conveying mechanisms (11) are divided into two conveying groups, each of which comprises three first conveying mechanisms (11) distributed in the left-right direction of the silicon wafer combined channel conveying device (100), and the second conveying mechanism (12) is located between the two conveying groups in the left-right direction of the silicon wafer combined channel conveying device (100). The plurality of fixing assemblies (133) are divided into four fixing groups, and the four fixing groups are distributed along the left-right direction of the silicon wafer combined channel transportation device (100). Each fixing group comprises three fixing assemblies (133) distributed along the front-rear direction of the silicon wafer combined channel transportation device (100).

6. The silicon wafer gang transport apparatus (100) of claim 1, wherein, The silicon wafer combined channel transportation device (100) further comprises a fixing support frame (14), wherein the fixing support frame (14) comprises at least one longitudinal frame (141) and a plurality of transverse frames (142) connected with the longitudinal frame (141). A plurality of fixing assemblies (133) are equidistantly arranged on each transverse frame (142). The fixing assembly (133) comprises a suction member (1331) for suctioning the silicon wafer. At least one suction hole is formed on the suction member (1331), and a negative pressure can be formed in the suction hole to suction the silicon wafer.

7. The silicon wafer gang transport apparatus (100) as set forth in claim 1, characterized by The silicon wafer combined channel transportation device (100) further comprises a plurality of blocking mechanisms (15) for limiting the position of the silicon wafer. The number of the blocking mechanisms (15) arranged on each first conveying mechanism (11) is consistent. In the left-right direction of the silicon wafer combined channel transportation device (100), each blocking mechanism (15) on one first conveying mechanism (11) is aligned with a corresponding blocking mechanism (15) on another first conveying mechanism (11).

8. The silicon wafer gang transport apparatus (100) according to claim 7, characterized by The blocking mechanism (15) comprises a detection member (151) for detecting the position of the silicon wafer and a blocking member (152) capable of limiting the silicon wafer. The blocking member (152) has a moving degree of freedom. The blocking mechanism (15) comprises a blocking air cylinder (153) connected with the blocking member (152) to drive the blocking member (152) to move.

9. The silicon wafer gang transport apparatus (100) of claim 1, wherein, The silicon wafer combined channel transportation device (100) further comprises a drying mechanism (16) for drying the cleaned silicon wafer. The drying mechanism (16) is connected with a plurality of first conveying mechanisms (11). The drying mechanism (16) comprises: a plurality of pressing rods (161) and a plurality of pressing wheels (162). Each pressing wheel (162) is sleeved on a pressing rod (161) and rotationally connected with the pressing rod (161); a plurality of guide transmission rollers (163). Each guide transmission roller (163) is located below a pressing wheel (162); a transmission driving member (164) for driving the plurality of guide transmission rollers (163) to rotate; an upper drying member (165) located above the plurality of pressing wheels (162); a lower drying member located below the plurality of guide transmission rollers (163); a driving space formed between the guide transmission roller (163) and the pressing wheel (162) for driving the silicon wafer to move.

10. The silicon wafer gang transport apparatus (100) of claim 9, wherein, The silicon wafer combined channel transportation device (100) comprises a plurality of shaping mechanisms (17) for shaping the position of the silicon wafer. Each shaping mechanism (17) is at least partially located between the drying mechanism (16) and a first conveying mechanism (11). Each of the shaping mechanisms (17) comprises a first shaping member (171) and a second shaping member (172), the first shaping member (171) and the second shaping member (172) are located on both sides of a first conveying mechanism (11) along the left-right direction of the silicon wafer lane conveying device (100), at least one of the first shaping member (171) and the second shaping member (172) has a moving degree of freedom along the left-right direction of the silicon wafer lane conveying device (100); A rotating member (173) is rotatably connected to each of the first shaping member (171) and the second shaping member (172), and the rotating member (173) is wrapped with a buffer member (174).

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