Wafer placing mechanism

Abstract

The utility model discloses a wafer placing mechanism which comprises a bottom supporting frame and a wafer box arranged on the bottom supporting frame, one end portion of the wafer box is opened to form a channel for taking and placing wafers, and the wafer placing mechanism further comprises a first sensing unit used for detecting whether the wafers in the wafer box extend to the outside of the wafer box or not. The first sensing unit is arranged on the bottom supporting frame and below the wafer box, the first sensing unit and the open end of the wafer box are located on the same side of the bottom supporting frame, the first sensing unit is located on the outer side of the open end of the wafer box, and the first sensing unit is electrically connected with the controller. According to the wafer placing mechanism, when the part of the wafer in the wafer box extends out of the wafer box, the first sensing unit can detect the part of the wafer, the first sensing unit can send a signal to the controller, and the controller can send out warning information, so that the placing position of the wafer can be adjusted to ensure that the wafer is placed in the wafer box; therefore, the damage and pollution of the wafer can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and specifically to a wafer placement mechanism. Background Technology

[0002] In semiconductor fabrication, wafers need to be moved between different processes and within different areas of the same process. In each process, wafer loading and unloading require wafer placement mechanisms. Existing wafer placement mechanisms cannot guarantee that the wafer will be placed inside the wafer cassette, and wafers extending outside the cassette are prone to damage and contamination. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a wafer placement mechanism that can ensure that the wafer is placed in the wafer box.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] A wafer placement mechanism includes a base support and a wafer cassette disposed on the base support. At least one end of the wafer cassette is open to form a channel for picking up and placing wafers. The wafer placement mechanism further includes a first sensing unit for detecting whether a wafer in the wafer cassette extends outside the wafer cassette. The first sensing unit is disposed on the base support and below the wafer cassette. The first sensing unit and the open end of the wafer cassette are located on the same side of the base support, and the first sensing unit is located outside the open end of the wafer cassette. The first sensing unit is electrically connected to a controller.

[0006] In some embodiments, the front and rear of the wafer cassette are both open, and the first sensing unit is arbitrarily positioned on the base support in a front-to-back direction.

[0007] In some embodiments, the wafer placement mechanism further includes a first connecting plate and a second connecting plate, the first connecting plate being fixedly connected to the base support frame, the second connecting plate being adjustable in position along the front-rear direction and connected to the first connecting plate, and the first sensing unit being fixedly mounted on the second connecting plate.

[0008] In some embodiments, one of the first connecting plate and the second connecting plate is provided with a connecting hole, and the other is provided with an elongated hole, wherein the position of the connecting hole corresponds to the position of the elongated hole.

[0009] In some embodiments, the wafer placement mechanism further includes a second sensing unit for sensing whether the wafer cassette is placed on the base support, the base support having a support surface for supporting the wafer cassette, and the second sensing unit being disposed on the support surface.

[0010] In some embodiments, two second sensing units are provided, and the two second sensing units are respectively provided on opposite sides of the support surface.

[0011] In some embodiments, the wafer placement mechanism further includes a positioning structure for positioning the wafer cassette. The positioning structure includes a first positioning block and a second positioning block. The first positioning block is respectively disposed on the left and right sides of the front portion of the support surface, and the second positioning block is respectively disposed on the left and right sides of the rear portion of the support surface.

[0012] The first positioning block has a first positioning surface and a second positioning surface. The first positioning surface abuts against the inner side surface of the corresponding side of the wafer cassette, and the second positioning surface abuts against the front end surface of the corresponding side of the wafer cassette.

[0013] The second positioning block has a third positioning surface and a fourth positioning surface. The third positioning surface abuts against the outer side of the corresponding side of the wafer cassette, and the fourth positioning surface abuts against the rear end surface of the corresponding side of the wafer cassette.

[0014] In some embodiments, the second sensing unit is disposed on the outer side of the first positioning surface on one side and the inner side of the third positioning surface on the other side.

[0015] In some embodiments, the wafer cassette is provided with an RFID tag, and the wafer placement mechanism further includes an identification unit for identifying the RFID information. The base support has a support surface that supports the wafer cassette, and the identification unit is disposed on the support surface and corresponds to the position of the RFID tag.

[0016] In some embodiments, the base support includes a worktable and a plurality of support columns supporting the bottom of the worktable. The upper end surface of the worktable forms a support surface for supporting the wafer cassette. A groove is provided in the middle of the worktable, which is concave from the front end to the rear. The first sensing unit is disposed at the location of the groove.

[0017] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: In the wafer placement mechanism of this utility model, when the wafer partially extends outside the wafer box, it can be detected by the first sensing unit. The first sensing unit will send a signal to the controller, so that the controller can issue a warning message. In this way, the placement position of the wafer can be adjusted to ensure that the wafer is placed in the wafer box, thereby reducing wafer damage and contamination. Attached Figure Description

[0018] Appendix Figure 1This is a three-dimensional schematic diagram of the wafer placement mechanism in this embodiment;

[0019] Appendix Figure 2 This is a three-dimensional schematic diagram of the wafer placement mechanism in this embodiment after removing the wafer cassette.

[0020] The components are: 1. Base support frame; 11. Workbench; 111. Groove; 12. Support column; 2. Wafer box; 21. Side wall; 211. Slot; 31. First positioning block; 311. First positioning surface; 312. Second positioning surface; 32. Second positioning block; 321. Third positioning surface; 322. Fourth positioning surface; 4. First sensing unit; 51. First connecting plate; 511. Connecting frame; 52. Second connecting plate; 521. Elongated hole; 6. Second sensing unit; 7. Identification unit. Detailed Implementation

[0021] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. Many specific details are set forth in the following description to provide a full understanding of the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed below.

[0022] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] like Figure 1 and Figure 2 As shown, the wafer placement mechanism of this utility model includes a base support frame 1 and a wafer box 2 disposed on the base support frame 1.

[0028] The base support 1 includes a worktable 11 and support columns 12. The support columns 12 are supported on the bottom of the worktable 11, and multiple support columns 12 are provided. In this embodiment, four support columns 12 are provided, and the four support columns 12 are respectively located at the four corners of the worktable 11. The upper surface of the worktable 11 forms a support surface for supporting the wafer cassette 2.

[0029] The wafer cassette 2 has a receiving cavity for receiving wafers. At least one end of the receiving cavity of the wafer cassette 2 is open, thereby forming a channel for picking up and placing wafers. In this embodiment, both the front and rear of the wafer cassette 2 are open.

[0030] Specifically, such as Figure 1As shown, the wafer box 2 includes side walls 21 located on the left and right sides. Each side wall 21 is provided with multiple slots 211. The multiple slots 211 are arranged sequentially and spaced apart in the vertical direction. The positions of the slots 211 on the left and right side walls 21 are corresponding. The slots 211 on the left and right side walls 21 are used to place wafers.

[0031] The wafer placement mechanism also includes a positioning structure, which limits the position of the wafer cassette 2 after it is placed on the base support 1.

[0032] like Figure 2 As shown, the positioning structure includes a first positioning block 31 and a second positioning block 32. The first positioning block 31 is respectively disposed on the left and right sides of the front part of the support surface, and the second positioning block 32 is respectively disposed on the left and right sides of the rear part of the support surface.

[0033] The first positioning block 31 has a first positioning surface 311 and a second positioning surface 321. The first positioning surface 311 extends in the front-back direction, and the second positioning surface 321 extends in the left-right direction. When the wafer cassette 2 is placed on the base support 1, the first positioning surface 311 abuts against the inner side surface of the corresponding side wall 21 of the wafer cassette 2, and the second positioning surface 312 abuts against the front end surface of the corresponding side wall 21 of the wafer cassette 2.

[0034] The second positioning block 32 has a third positioning surface 321 and a fourth positioning surface 322. The third positioning surface 321 extends in the front-to-back direction, and the fourth positioning surface 322 extends in the left-to-right direction. When the wafer cassette 2 is placed on the base support 1, the third positioning surface 321 abuts against the outer surface of the corresponding side wall 21 of the wafer cassette 2, and the fourth positioning surface 322 abuts against the rear end surface of the corresponding side wall 21 of the wafer cassette 2.

[0035] like Figure 1 and Figure 2 As shown, the wafer placement mechanism also includes a first sensing unit 4, which is used to detect whether the wafer inside the wafer cassette 2 extends outside the wafer cassette 2. The first sensing unit 4 is disposed at the front of the base support 1 and below the wafer cassette 2, and is located on the outer side of the front of the wafer cassette 2, preferably corresponding to the position of the middle part of the wafer cassette 2.

[0036] The first sensing unit 4 is electrically connected to the controller to send the information detected by the first sensing unit 4 to the controller. When the first sensing unit 4 detects that the wafer extends outside the wafer cassette 2, the controller issues an alarm message to adjust the placement of the wafer to ensure that the wafer is placed inside the wafer cassette 2, thereby reducing wafer damage and contamination.

[0037] Preferably, the first sensing unit 4 can be positioned adjustablely on the base support 1 in the front-back direction, so that the position of the first sensing unit 4 can be adjusted according to the position of the wafer cassette 2 on the base support 1, so that the position of the first sensing unit 4 corresponds to the position of the wafer cassette 2, thereby ensuring that the first sensing unit 4 can accurately detect whether the wafer extends to the outside of the wafer cassette 2.

[0038] Specifically, the wafer placement mechanism also includes a first connecting plate 51 and a second connecting plate 52. The first connecting plate 51 is fixedly connected to the base support 1, and the second connecting plate 52 is adjustable in position along the front-back direction and connected to the first connecting plate 51. The first sensing unit 4 is fixedly disposed on the second connecting plate 52.

[0039] One of the first connecting plate 51 and the second connecting plate 52 is provided with a connecting hole 511, and the other is provided with an oblong hole 521. The position of the connecting hole 511 corresponds to the position of the oblong hole 521. The connector passes through the oblong hole 521 and the connecting hole 511 in sequence to connect the first connecting plate 51 and the second connecting plate 52.

[0040] In this embodiment, the workbench 11 has a groove 111 in the middle that is concave from the front end to the rear, and the first sensing unit 4 is located at the groove 111.

[0041] like Figure 2 As shown, the wafer placement mechanism also includes a second sensing unit 6, which is used to sense whether the wafer cassette 2 is placed on the base support 1. The second sensing unit 6 is disposed on the support surface of the worktable 11.

[0042] In this embodiment, two second sensing units 6 are provided, and the two second sensing units 6 are respectively arranged on opposite sides of the support surface of the worktable 11. Preferably, one second sensing unit 6 is arranged on the outer side of the first positioning surface 311 on one of the left and right sides, and the other second sensing unit 6 is arranged on the inner side of the third positioning surface 321 on the other side of the left and right sides.

[0043] The second sensing unit 6 is electrically connected to the controller to send the information detected by the second sensing unit 6 to the controller.

[0044] RFID is installed on wafer box 2. For example... Figure 1 and Figure 2 As shown, the wafer placement mechanism also includes an identification unit 7, which is used to identify the RFID information of the wafer cassette 2. The identification unit 7 is disposed on the support surface of the workbench 11 and corresponds to the position where the RFID information is set on the wafer cassette 2. The identification unit 7 is electrically connected to the controller to send the information identified by the identification unit 7 to the controller.

[0045] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A wafer placement mechanism, characterized by: The wafer placing mechanism comprises a bottom support frame and a wafer box arranged on the bottom support frame, at least one end of the wafer box is open to form a channel for placing a wafer, the wafer placing mechanism further comprises a first sensing unit for detecting whether the wafer in the wafer box extends to the outside of the wafer box, the first sensing unit is arranged on the bottom support frame and below the wafer box, the first sensing unit is located on the same side of the open end of the wafer box and outside the open end of the wafer box, and the first sensing unit is electrically connected with a controller.

2. The wafer placement mechanism of claim 1, wherein: The front and rear of the wafer box are open, and the first sensing unit can be adjustably arranged on the bottom support frame in the front-rear direction.

3. The wafer placement mechanism of claim 2, wherein: The wafer placing mechanism further comprises a first connecting plate and a second connecting plate, the first connecting plate is fixedly connected to the bottom support frame, and the second connecting plate is adjustably connected to the first connecting plate in the front-rear direction, and the first sensing unit is fixedly arranged on the second connecting plate.

4. The wafer placement mechanism of claim 3, wherein: One of the first connecting plate and the second connecting plate is provided with a connecting hole, and the other is provided with an oblong hole, and the position of the connecting hole corresponds to the position of the oblong hole.

5. The wafer placement mechanism of claim 1, wherein: The wafer placing mechanism further comprises a second sensing unit for sensing whether the wafer box is placed on the bottom support frame, and the bottom support frame has a support surface for supporting the wafer box, and the second sensing unit is arranged on the support surface.

6. The wafer placement mechanism of claim 5, wherein: The second sensing unit is provided with two, and the two second sensing units are respectively arranged on the opposite sides of the support surface.

7. The wafer placement mechanism of claim 5, wherein: The wafer placing mechanism further comprises a positioning structure for positioning the wafer box, the positioning structure comprises first positioning blocks and second positioning blocks, the first positioning blocks are respectively arranged on the left and right sides of the front of the support surface, and the second positioning blocks are respectively arranged on the left and right sides of the rear of the support surface. The first positioning block has a first positioning surface and a second positioning surface, the first positioning surface is respectively arranged in abutting engagement with the inner side surface of the corresponding side of the wafer box, and the second positioning surface is respectively arranged in abutting engagement with the front end surface of the corresponding side of the wafer box. The second positioning block has a third positioning surface and a fourth positioning surface, the third positioning surface is respectively arranged in abutting engagement with the outer side surface of the corresponding side of the wafer box, and the fourth positioning surface is respectively arranged in abutting engagement with the rear end surface of the corresponding side of the wafer box.

8. The wafer placement mechanism of claim 7, wherein: The second sensing unit is respectively arranged outside the first positioning surface on one side and inside the third positioning surface on the other side.

9. The wafer placement mechanism of claim 1, wherein: The wafer box is provided with an RFID, the wafer placing mechanism further comprises an identification unit for identifying the RFID information, the bottom support frame has a support surface for supporting the wafer box, and the identification unit is arranged on the support surface and corresponds to the position of the RFID.

10. The wafer placement mechanism of claim 1, wherein: The bottom support frame comprises a workbench and a plurality of support columns supported on the bottom of the workbench, the upper end surface of the workbench forms a support surface for supporting the wafer box, the middle part of the workbench is provided with a groove recessed from the front end surface to the rear, and the first sensing unit is arranged at the position of the groove.

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