Semiconductor component transfer tray

Abstract

The utility model discloses a semiconductor component transfer tray, which relates to the technical field of semiconductors and comprises a pick-and-place tray and a semiconductor wafer, the bottom of the pick-and-place tray is fixedly connected with a protective position control shell, the inner wall of the protective position control shell is rotatably connected with a one-way worm, and threads on the outer circumferential surface of the one-way worm are meshed with teeth on the outer circumferential surface of a plane worm gear. The inner wall of the plane worm gear is fixedly connected to the outer circumferential face of a two-way lead screw, the two ends of the two-way lead screw are rotationally connected to the inner wall of the protection position control shell, and the outer circumferential face of the two-way lead screw is in threaded connection with the inner wall of the L-shaped supporting sliding block. According to the invention, through the arrangement of the pick-and-place tray, the semiconductor wafer, the protection position control shell, the one-way worm, the plane worm gear, the two-way screw rod and the L-shaped supporting sliding block, the position of the position control pressing plate can be freely changed, the effect of ensuring the stability of wafers with different diameters is realized, the device can be applied to different working scenes, and the practical effect of the device is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a semiconductor component transfer tray. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Their conductivity can be altered by doping. Semiconductors doped with donor impurities primarily carry electrons in the conduction band, while those doped with acceptor impurities are primarily hole-type conductive materials.

[0003] A search revealed a wafer pick-and-place and transfer device disclosed in Chinese Patent Publication No. CN216376428U. The device includes a transfer tray and a pick-and-place pallet. The transfer tray includes a limiting groove, a rectangular groove, an anti-slip mechanism, and vent holes. The limiting groove on the transfer tray is used to limit the wafer's position, and the rectangular groove within the limiting groove is used for picking up and placing the wafer from the pallet. The transfer tray also includes an anti-slip mechanism and vent holes. The pick-and-place pallet includes a pick-and-place liner, a wafer frame, and a handle. The pick-and-place liner, wafer frame, and handle are all fixedly connected. The pick-and-place liner has a wedge-shaped boss with a beveled surface. The wafer frame and handle are threadedly connected and fixed. This invention provides a wafer pick-and-place and transfer device with good safety performance, secure positioning, convenient replacement, and long-term repeated use, preventing wafer drift during transfer and transport. It solves the problem of wafer surface damage during transfer in semi-automatic process measurement equipment.

[0004] While the above solutions can address the issue of wafer surface damage during transport in semi-automatic process measurement equipment, these patents struggle to guarantee stability for wafers of different diameters, exhibiting significant limitations and making them unsuitable for various working scenarios, thus greatly reducing their practical effectiveness. To address these issues, we provide a semiconductor component transport tray. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor component transfer tray to solve the problems raised in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor component transfer tray, including a pick-and-place tray and semiconductor wafers. A protective control housing is fixedly connected to the bottom of the pick-and-place tray. A one-way worm gear is rotatably connected to the inner wall of the protective control housing. The thread on the outer circumferential surface of the one-way worm gear meshes with the teeth on the outer circumferential surface of a planar worm wheel. The inner wall of the planar worm wheel is fixedly connected to the outer circumferential surface of a two-way lead screw. The two ends of the two-way lead screw are rotatably connected to the inner wall of the protective control housing. The outer circumferential surface of the two-way lead screw is threadedly connected to the inner wall of an L-shaped support slider. The L-shaped support slider is slidably connected to the inner wall of the protective control housing. The tight fit between the components can ensure the stability of wafers of different diameters.

[0007] Preferably, there are two L-shaped support sliders, and each of the two L-shaped support sliders has an L-shaped bracket fixedly connected to its top. The L-shaped brackets ensure the stability of the components connected to them.

[0008] Preferably, a U-shaped frame is fixedly connected to the top of the L-shaped bracket, and a control plate is rotatably connected to the U-shaped frame through a positioning post. The control plate can limit the semiconductor wafer and prevent it from falling off longitudinally.

[0009] Preferably, one end of the positioning plate is rotatably connected to a force-bearing roller, and the other end of the positioning plate is in contact with the semiconductor wafer. The semiconductor wafer is placed in the pick-and-place tray, and the pick-and-place tray is fixedly connected to a positioning post two. The positioning post two is designed to facilitate the placement of semiconductor wafers of different diameters in the center.

[0010] Preferably, the top of the L-shaped bracket is fixedly connected to a control guide rail, and the outer wall of the control guide rail is slidably connected to a special-shaped force-applying block. The special-shaped force-applying block can lift the force-bearing roller.

[0011] Preferably, a one-way lead screw is rotatably connected to one side of the irregular force-applying block. The outer circumferential surface of the one-way lead screw is threadedly connected to the inner wall of the L-shaped bracket. The L-shaped bracket can effectively support the one-way lead screw.

[0012] Preferably, one end of the unidirectional lead screw is fixedly connected to an external throttle, and the outer circumferential surface of the external throttle is provided with anti-slip texture. The anti-slip texture makes it more convenient for the operator to turn the external throttle.

[0013] Preferably, the bottom of the protective control housing is fixedly connected with two movable track wheels. The purpose of setting the movable track wheels is to allow it to be used in conjunction with an external track.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This application, through the setting of a pallet, semiconductor wafer, protective control housing, unidirectional worm gear, planar worm wheel, bidirectional lead screw, and L-shaped support slider, can freely change the position of the control plate, thereby ensuring the stability of wafers of different diameters. It can be applied in different working scenarios, enhancing the practical effect of this application.

[0016] 2. This application, through the setting of L-shaped bracket, U-shaped frame, positioning post one, control pressure plate, force roller, irregular force application block, control guide rail, one-way lead screw, external throttle, moving track wheel, and positioning post two, can achieve the purpose of maintaining the stability of semiconductor wafers, making it convenient for operators to operate and avoiding the problem of easy damage to semiconductor wafers. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a three-dimensional structural diagram of the L-shaped bracket of this utility model;

[0019] Figure 3 This is a three-dimensional structural diagram of the internal structure of the protective control housing of this utility model;

[0020] Figure 4 This is a three-dimensional structural diagram of the tray for picking up and placing items according to this utility model.

[0021] The following are the labels in the diagram: 1. Pick-up / Place Tray; 2. Semiconductor Wafer; 3. Protective Control Housing; 4. One-Way Worm Gear; 5. Planar Worm Gear; 6. Two-Way Lead Screw; 7. L-Shaped Support Slider; 8. L-Shaped Bracket; 9. U-Shaped Frame; 10. Positioning Post 1; 11. Control Plate; 12. Force Roller; 13. Irregular Force Block; 14. Control Guide Rail; 15. One-Way Lead Screw; 16. External Thruster; 17. Moving Track Wheel; 18. Positioning Post 2. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figures 1-4 As shown, this utility model provides a technical solution for a semiconductor component transfer tray, including a pick-and-place tray 1 and a semiconductor wafer 2. The pick-and-place tray 1 mainly serves as a load-bearing device, while the semiconductor wafer 2 is a known technology and will not be described in detail. A protective control housing 3 is fixedly connected to the bottom of the pick-and-place tray 1, and two movable track wheels 17 are fixedly connected to the bottom of the protective control housing 3. The pick-and-place tray 1, the protective control housing 3, and the movable track wheels 17 maintain a linkage effect to ensure that the entire mechanism can move synchronously. The movable track wheels 17, by cooperating with a preset track, can ensure that the entire mechanism can move in a specified direction.

[0024] The inner wall of the protective control housing 3 is rotatably connected to a one-way worm gear 4. The protective control housing 3 supports the one-way worm gear 4 and applies a control effect, thereby ensuring that the one-way worm gear 4 can rotate in place. The thread on the outer circumferential surface of the one-way worm gear 4 meshes with the teeth on the outer circumferential surface of the planar worm wheel 5. The tight fit between the one-way worm gear 4 and the planar worm wheel 5 can effectively achieve the force transmission effect and has a self-locking effect, ensuring the stability of subsequent parts after movement.

[0025] The inner wall of the planar worm gear 5 is fixedly connected to the outer circumferential surface of the double-acting screw 6. The planar worm gear 5 and the double-acting screw 6 maintain a linkage effect. The two ends of the double-acting screw 6 are rotatably connected to the inner wall of the protective control housing 3. The protective control housing 3 also supports the double-acting screw 6 and applies a control effect to ensure that the double-acting screw 6 can rotate in place within the protective control housing 3.

[0026] The outer circumferential surface of the bidirectional lead screw 6 is threadedly connected to the inner wall of the L-shaped support slider 7. The tight fit between the bidirectional lead screw 6 and the L-shaped support slider 7 allows the rotation of the bidirectional lead screw 6 to effectively drive the L-shaped support slider 7 to translate when the L-shaped support slider 7 remains stable. There are two L-shaped support sliders 7 in total, and the tops of the two L-shaped support sliders 7 are respectively fixedly connected to L-shaped brackets 8, so that the L-shaped support sliders 7 and L-shaped brackets 8 maintain a linkage effect.

[0027] The top of the L-shaped bracket 8 is fixedly connected to a control guide rail 14, and the outer wall of the control guide rail 14 is slidably connected to a shaped force-applying block 13. The purpose of setting the control guide rail 14 is to effectively ensure the stable movement of the shaped force-applying block 13, so that it will not tilt or fall off, which is conducive to the smooth movement of subsequent components. One side of the shaped force-applying block 13 is rotatably connected to a one-way screw 15, and the shaped force-applying block 13 and the one-way screw 15 maintain the effect of translational linkage.

[0028] One end of the one-way screw 15 is fixedly connected to an external handle 16. The outer circumferential surface of the external handle 16 is provided with anti-slip texture. The purpose of setting the external handle 16 is to facilitate the operator to rotate the one-way screw 15. The outer circumferential surface of the one-way screw 15 is threadedly connected to the inner wall of the L-shaped bracket 8. The tight fit between the one-way screw 15 and the L-shaped bracket 8 means that when the one-way screw 15 rotates, the position of the one-way screw 15 will change under the action of the L-shaped bracket 8.

[0029] The top of the L-shaped bracket 8 is fixedly connected to the U-shaped frame 9. The L-shaped bracket 8 and the U-shaped frame 9 maintain a linkage effect. The U-shaped frame 9 is rotatably connected to the control plate 11 through the positioning post 10. The purpose of setting the positioning post 10 is to apply a control effect to the control plate 11, so that the control plate 11 rotates about the positioning post 10 as the axis.

[0030] One end of the positioning plate 11 is rotatably connected to the force roller 12. The positioning plate 11 and the force roller 12 maintain a translational linkage effect. The other end of the positioning plate 11 contacts the semiconductor wafer 2. The positioning plate 11 will slightly press the semiconductor wafer 2 to ensure the stability of the semiconductor wafer 2. The semiconductor wafer 2 is placed in the pick-and-place tray 1. The pick-and-place tray 1 is fixedly connected to the positioning post 2 18. The positioning post 2 18 is set so that the semiconductor wafer 2 can be placed in the center. The diameter of the semiconductor wafer 2 is not limited and can be replaced according to actual needs. However, the diameter of the circular groove opened in the middle of the semiconductor wafer 2 is consistent to facilitate subsequent placement. The L-shaped support slider 7 is slidably connected to the inner wall of the protective positioning housing 3. The protective positioning housing 3 will apply a positioning effect to the L-shaped support slider 7, so that the L-shaped support slider 7 can only move in the horizontal direction.

[0031] Working Principle: During use, the semiconductor wafer 2 is placed in the pick-and-place tray 1. The external handle 16 is manually rotated. Because the irregularly shaped force-applying block 13 is restricted by the control guide rail 14, the unidirectional screw 15, acting on the internal thread of the L-shaped bracket 8, pushes the irregularly shaped force-applying block 13 to move horizontally. At this time, the force-bearing roller 12 rotates on the inclined surface of the irregularly shaped force-applying block 13, causing the control pressure plate 11 to change its axis around the positioning post 10. This allows the control pressure plate 11 to contact and slightly press the semiconductor wafer 2, effectively preventing scratches on the surface of the semiconductor wafer 2. This ensures that the semiconductor wafer 2 can smoothly and safely complete each stage of the complex manufacturing process. When different diameters are replaced according to actual conditions... When semiconductor wafer 2 is in contact, to ensure that the positioning plate 11 is in contact with semiconductor wafer 2, the one-way worm gear 4 needs to be manually rotated again. The planar worm wheel 5 drives the two-way lead screw 6 to rotate in place within the protective positioning housing 3. At this time, because the L-shaped support slider 7 is restricted by the protective positioning housing 3, the rotation of the two-way lead screw 6 can drive the L-shaped support slider 7 to translate. Since the threads at both ends of the two-way lead screw 6 are opposite, the two L-shaped support sliders 7 move in opposite directions. During the movement of the L-shaped support slider 7, it will drive the L-shaped bracket 8 and other components to move synchronously, so that the positioning plate 11 moves synchronously. When the positioning plate 11 moves, it can contact the surface of semiconductor wafer 2, thereby ensuring the stability of semiconductor wafer 2.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor component transfer tray comprising a pick-and-place tray (1) and a semiconductor wafer (2), characterized in that: The bottom of the taking and placing tray (1) is fixedly connected with a protective control shell (3), the inner wall of the protective control shell (3) is rotatably connected with a one-way worm (4), the thread on the outer circumference of the one-way worm (4) is engaged with the tooth on the outer circumference of a plane worm wheel (5), the inner wall of the plane worm wheel (5) is fixedly connected to the outer circumference of a bidirectional screw rod (6), the two ends of the bidirectional screw rod (6) are rotatably connected to the inner wall of the protective control shell (3), the outer circumference of the bidirectional screw rod (6) is threadedly connected with the inner wall of an L-shaped supporting sliding block (7), and the L-shaped supporting sliding block (7) is slidably connected to the inner wall of the protective control shell (3).

2. The semiconductor component transfer tray of claim 1, wherein: The L-shaped supporting sliding block (7) is provided with two L-shaped supports (8) fixedly connected to the top of the two L-shaped supporting sliding blocks (7), respectively.

3. The semiconductor component transfer tray of claim 2, wherein: The top of the L-shaped support (8) is fixedly connected with a U-shaped frame (9), and the U-shaped frame (9) is rotatably connected with a control pressing plate (11) through a positioning column (10).

4. The semiconductor component transfer tray of claim 3, wherein: One end of the control pressing plate (11) is rotatably connected with a stress roller (12), the other end of the control pressing plate (11) is in contact with a semiconductor wafer (2), the semiconductor wafer (2) is placed in the taking and placing tray (1), and the taking and placing tray (1) is fixedly connected with a positioning column (18).

5. The semiconductor component transfer tray of claim 3, wherein: The top of the L-shaped support (8) is fixedly connected with a control guide rail (14), and the outer wall of the control guide rail (14) is slidably connected with a special-shaped force applying block (13).

6. The semiconductor component transfer tray of claim 5, wherein: One side of the special-shaped force applying block (13) is rotatably connected with a one-way screw rod (15), and the outer circumference of the one-way screw rod (15) is threadedly connected with the inner wall of the L-shaped support (8).

7. The semiconductor component transfer tray of claim 6, wherein: One end of the one-way screw rod (15) is fixedly connected with an external rotating handle (16), and the outer circumference of the external rotating handle (16) is provided with anti-skid lines.

8. The semiconductor component transfer tray of claim 1, wherein: The bottom of the protective control shell (3) is fixedly connected with a moving track wheel (17), and the moving track wheel (17) is provided with two moving track wheels (17).

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