Wafer platform

Abstract

The utility model provides a wafer platform, which comprises a mounting plate, a tensioning seat, a lifting driving mechanism, a supporting ring, a first lifting ring and a first pressing plate, and is characterized in that the tensioning seat is arranged on the mounting plate; the supporting ring is detachably mounted on the tensioning seat; the first lifting ring is arranged on the tensioning seat and located on the outer side of the supporting ring, the first pressing plate is connected to the top end of the first lifting ring, and the first pressing plate and the first lifting ring are used for press fitting of a first type wafer ring; the lifting driving mechanism is used for driving the first lifting ring to lift; when the supporting face of the supporting ring is of the first size, the supporting ring abuts against the first lifting ring. When the supporting surface of the supporting ring is in a second size, a mounting gap for mounting a second lifting ring is formed between the supporting ring and the first lifting ring, the top end of the second lifting ring is connected with a second pressing plate, and the second pressing plate and the second lifting ring are used for pressing a second type of wafer ring. The wafer platform provided by the utility model can support and fix various types of wafer rings with different sizes, and the universality of the wafer platform is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip packaging equipment, specifically a wafer platform. Background Technology

[0002] During the chip packaging process, the chip is carried on a carrier film, which is tensioned and fixed by a wafer ring. Before the wafer mounting process, the wafer ring needs to be fixed to the wafer platform. The wafer ring platform drives the wafer ring to move so that the chips on the carrier film can be moved sequentially to the predetermined pick-up station for easy picking by the pick-up device.

[0003] The wafer platform includes a tensioning seat, a support ring, a lifting ring, and a pressure plate. The support ring is fixedly mounted on the tensioning seat, while the lifting ring is movably mounted on the tensioning seat and located outside the support ring. The pressure plate is connected to the top of the lifting ring, forming a clamping gap between the pressure plate and the lifting ring to clamp the wafer ring. Initially, the lifting ring is in a high position, and the clamping gap is higher than that of the support ring. In this state, the wafer can be inserted into the clamping gap, causing the carrier film to cover the upper side of the support ring. Subsequently, the lifting ring is lowered to a low position, thereby tightening the carrier film through the relative movement of the pressure plate and the support ring.

[0004] The existing wafer platform uses a fixed connection between the support ring, lifting ring, and pressure plate. Therefore, it can only fix wafers of a single size. When operating on wafers of different sizes, the original support ring, lifting ring, and pressure plate must be completely removed and replaced with those of the new size. After replacement, the working position needs to be readjusted. Clearly, the existing wafer platform has poor versatility and is complex to use during model changeovers. Utility Model Content

[0005] To address the aforementioned technical problems, this application provides a wafer platform, the detailed technical solution of which is as follows:

[0006] A wafer platform includes a mounting plate, a tensioning seat, a lifting drive mechanism, a support ring, a first lifting ring, and a first pressure plate, wherein:

[0007] The tensioner seat is mounted on the mounting plate;

[0008] The support ring is detachably mounted on the tensioner seat;

[0009] The first lifting ring is movably mounted on the tensioning seat and located outside the support ring. The first pressure plate is connected to the top of the first lifting ring, and a first pressing gap is formed between the first pressure plate and the first lifting ring. The first pressing gap is used to press the first type of wafer ring.

[0010] The lifting drive mechanism is at least partially mounted on the mounting plate and is connected to the first lifting ring via a transmission. The lifting drive mechanism is used to drive the first lifting ring to lift.

[0011] When the support surface of the support ring is of the first dimension, the support ring is close to the first lifting ring;

[0012] When the support surface of the support ring is the second size, an installation gap for installing the second lifting ring is formed between the support ring and the first lifting ring. The second lifting ring is detachably connected to the first lifting ring. A second pressure plate is connected to the top of the second lifting ring. A second clamping gap is formed between the second pressure plate and the second lifting ring. The second clamping gap is used to press the second type of wafer ring.

[0013] The second dimension is smaller than the first dimension, and the outer diameter of the second type of wafer ring is smaller than the outer diameter of the first type of wafer ring.

[0014] The wafer platform provided in this application eliminates the need to replace the first lifting ring and the first pressure plate. When supporting and fixing the first type of wafer ring is required, the support ring with the first size of the support surface is installed on the tensioning seat, and the first type of wafer ring is inserted into the first clamping gap. When supporting and fixing the second type of wafer ring is required, the support ring with the second size of the support surface is installed on the tensioning seat. Then, the second lifting ring and the second pressure plate are installed, and the second type of wafer ring is inserted into the second clamping gap. The wafer platform of this application reduces the complexity of changeover operations and improves versatility.

[0015] In some embodiments, the bottom of the support ring is provided with at least one insertion hole along the circumferential direction, and the tensioning seat is provided with a pin corresponding to the insertion hole. The support ring is inserted into the tensioning seat through the insertion hole and the pin.

[0016] This facilitates the installation and removal of the support ring and ensures that the support ring does not rotate relative to the tensioner.

[0017] In some embodiments, the support surface of the support ring is a first dimension, and the bottom of the support ring is provided with at least two insertion holes along the circumferential direction. The insertion holes are slots that open downwards.

[0018] By providing at least two downward-facing slots at the bottom of a support ring of the first size, it can be ensured that the support ring of the first size can be inserted and fixed onto the tensioning seat.

[0019] In some embodiments, when the support surface of the support ring is the second size, a horizontal connecting seat is provided at the bottom of the support ring, and two insertion holes are provided circumferentially at the edge of the connecting seat, one of which is a round hole and the other is a U-shaped slot hole that opens outward.

[0020] By setting a connecting seat on the base plate of the support ring with the second size, and setting a round hole and a U-shaped groove along the circumferential direction at the edge of the connecting seat, the support ring with the second size can be quickly and easily inserted and fixed onto the tensioning seat. Furthermore, the fit between the round hole and the U-shaped groove allows for angle adjustment before installing the support ring, making the installation of the support ring easier and improving its installation accuracy.

[0021] In some embodiments, the tensioning seat is further provided with a magnetic suction element for adsorbing the support ring, and the magnetic suction element is fixedly installed on the upper end of the tensioning seat through a mounting hole.

[0022] This design further enhances the connection stability between the support ring and the tensioning seat, preventing the support ring from wobbling. It also replaces the original bolt-fixed connection, facilitating the replacement of the support ring.

[0023] In some embodiments, the top end of the first lifting ring is provided with a plurality of connecting holes along the circumferential direction, and the second lifting ring can be connected to the first lifting ring through the plurality of connecting holes.

[0024] By providing several connecting holes along the circumferential direction at the top of the first lifting ring, a detachable connection between the second lifting ring and the first lifting ring is achieved, and the rotation of the second lifting ring relative to the first lifting ring can be avoided.

[0025] In some embodiments, the lifting drive mechanism includes a first drive unit, N first gears, a first synchronous belt, and a second gear, wherein: the N first gears are arranged circumferentially on a tensioning seat, each first gear is mounted on the tensioning seat via a first rotating shaft, the first synchronous belt is fitted onto the N first gears and meshes with each of the first gears; the bottom of the first lifting ring is provided with lifting screws corresponding one-to-one with the 1st to the (N-1th)th first gears, and the lower end of each lifting screw is screwed into the shaft hole of the corresponding first rotating shaft; the second gear is coaxially mounted on the tensioning seat with the Nth first gear via a second rotating shaft, and the second gear is located outside the first synchronous belt; the first drive unit is disposed on a mounting plate, and the first drive unit can dock with the second gear to drive the second gear to rotate, and when the second gear rotates, the first gears and the first synchronous belt mounted coaxially drive each first gear to rotate synchronously, and when each first gear rotates synchronously, it drives several lifting screws to rise and fall, thereby driving the first lifting ring to rise and fall.

[0026] A lifting drive mechanism with a simple structure and high driving stability is provided. It drives N-1 lifting screws arranged circumferentially at the bottom of the lifting ring synchronously via a first driving unit and a first synchronous belt, thereby driving the first lifting ring to rise and fall, improving the lifting stability of the first lifting ring and preventing the first lifting ring from tilting during the lifting process.

[0027] In some embodiments, the first drive unit includes a mounting base, a translation drive module, a rotary drive module, and a drive gear, wherein: the mounting base is disposed on the mounting plate and located on the side of the tensioning seat; the translation drive module is disposed on the mounting base; the rotary drive module is slidably connected to the mounting base and is drively connected to the translation drive module; the drive gear is connected to the movable part of the rotary drive module; the translation drive module is used to drive the drive gear to translate toward or away from the second gear, so that the drive gear meshes with or disengages from the second gear; when the drive gear meshes with the second gear, the rotary drive module drives the drive gear to rotate, thereby driving the second gear to rotate.

[0028] When the lifting and lowering of the first lifting ring is required, the translation drive module drives the rotary drive module and the drive gear to translate towards the second gear, thereby engaging the drive gear with the second gear. At this time, the rotary drive module can drive the drive gear to rotate to perform the lifting and lowering of the first lifting ring. When the position of the lifting ring needs to be adjusted, the translation drive module drives the rotary drive module and the drive gear to translate away from the second gear, thereby disengaging the drive gear from the second gear and preventing interference between the first lifting ring and the translation drive module during movement.

[0029] In some embodiments, the rotary drive module includes a drive element, a turbine, a worm gear, a photoelectric baffle, and a photoelectric sensor, wherein: the worm gear is installed on the drive end of the drive element and meshes with the turbine for transmission; the turbine gear is coaxially installed on a connector with the drive gear; the connector is slidably installed on a mounting base and connected to the drive end of the translation drive module; the photoelectric baffle is installed on the drive end of the drive element, and the periphery of the photoelectric baffle is provided with toothed grooves; the photoelectric sensor is fixedly installed on the side of the photoelectric baffle and is provided corresponding to the toothed grooves; the photoelectric sensor is configured to cooperate with the photoelectric baffle to detect the movement position of the drive element.

[0030] The worm gear transmission provides a driving method with large output torque and stable drive; combined with photoelectric baffles and photoelectric sensors, the control of the lifting accuracy of the lifting ring can be further improved.

[0031] In some embodiments, the tensioner is rotatably mounted on the mounting plate, and the wafer platform further includes a rotary drive mechanism disposed on the mounting plate. The rotary drive mechanism is used to drive the tensioner to rotate in a horizontal plane. The rotary drive mechanism includes a second drive unit, a synchronous pulley, a second synchronous belt, and a geared disc, wherein: the geared disc is rotatably mounted on the mounting plate, and the tensioner is fixedly mounted above the geared disc; the second synchronous belt has meshing teeth that mesh with the outer periphery of the geared disc; the synchronous pulley is mounted on the mounting plate and is connected to the geared disc via the second synchronous belt; the second drive unit is disposed on the mounting plate and is used to drive the synchronous pulley to rotate, thereby driving the geared disc and the tensioner to rotate in a horizontal plane.

[0032] By setting up a rotary drive mechanism, the tensioner is rotated in the horizontal plane, thereby achieving angle adjustment of the wafer within the wafer ring and ensuring that the wafer picking device can smoothly pick up the wafer. The rotational drive of the tensioner is achieved through a second synchronous belt in conjunction with a toothed disc, improving the driving stability of the tensioner and thus enhancing the accuracy of wafer angle adjustment. Of course, other existing rotary drive mechanisms can also be used to drive the tensioner's rotation.

[0033] In some embodiments, the wafer platform further includes a translation drive mechanism, with the mounting plate horizontally disposed on a movable component of the translation drive mechanism; the translation drive mechanism is used to drive the mounting plate to translate in a horizontal plane; the translation drive mechanism includes a base plate, an X-axis translation drive component, a sliding plate, and a Y-axis translation drive component, wherein: the sliding plate is slidably connected to the base plate, the X-axis translation drive component is disposed on the base plate and is driveably connected to the sliding plate, and the X-axis translation drive component is used to drive the sliding plate to slide along the X-axis; the mounting plate is slidably connected to the sliding plate, the Y-axis translation drive component is disposed on the sliding plate and is drively connected to the mounting plate, and the Y-axis translation drive component is used to drive the mounting plate to slide along the Y-axis.

[0034] By setting up a translation drive mechanism, the horizontal position of the wafer ring is adjusted, thereby adjusting the position of the wafers on it. This ensures that before each wafer pick-up, the wafer to be picked up can be adjusted to the predetermined pick-up position, allowing the wafer picking device to consistently pick up wafers from that position, improving pick-up efficiency. Furthermore, the translation drive mechanism can also switch the drive plate between the loading position and the wafer picking position, facilitating manual material changes. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the wafer platform in the embodiments of this application from one view.

[0036] Figure 2 This is a schematic diagram of the wafer platform in an embodiment of this application from another perspective;

[0037] Figure 3 This is a schematic diagram of the first support ring, the first lifting ring, and the first pressure plate from a first perspective in an embodiment of this application.

[0038] Figure 4 This is a schematic diagram of the first support ring, the first lifting ring, and the first pressure plate from a second perspective in an embodiment of this application.

[0039] Figure 5 This is a schematic diagram of the first support ring, the first lifting ring, and the first pressure plate from a third-view perspective in an embodiment of this application.

[0040] Figure 6This is a schematic diagram of the first support ring, the first lifting ring, and the first pressure plate from a fourth perspective in an embodiment of this application.

[0041] Figure 7 This is a schematic diagram of the first support ring, the first lifting ring, and the first pressure plate from a fifth perspective in an embodiment of this application.

[0042] Figure 8 This is a schematic diagram of the structure of the first driving unit in an embodiment of this application;

[0043] Figure 9 This is a schematic diagram of the structure of the first support ring in the embodiments of this application;

[0044] Figure 10 This is a schematic diagram of the installation structure of the second support ring in an embodiment of this application;

[0045] Figure 11 This is a schematic diagram of the structure of the second support ring in an embodiment of this application;

[0046] Figure 12 This is a schematic diagram of the tensioning seat in an embodiment of this application;

[0047] Figure 13 This is a schematic diagram of the connection structure between the second lifting ring and the first lifting ring in an embodiment of this application.

[0048] Figures 1 to 13 Includes:

[0049] Mounting plate 1;

[0050] Tensioner seat 2: Pin 21, Magnetic component 22;

[0051] Lifting drive mechanism 3: First drive unit 31, first gear 32, first synchronous belt 33, second gear 34, mounting base 311, translation drive module 312, rotation drive module 313, drive gear 314, locking pin 315, photoelectric baffle 316, turbine 317;

[0052] First support ring 41, second support ring 42, connecting seat 43, slot 44, round hole 45, U-shaped slot 46;

[0053] First lifting ring 5: Connecting hole 51;

[0054] First pressure plate 6;

[0055] Second lifting ring 7;

[0056] Second pressure plate 8;

[0057] Rotary drive mechanism 9: second drive unit 91, synchronous pulley 92, second synchronous belt 93, gear plate 94;

[0058] Translation drive mechanism 10: base plate 101, sliding plate 102. Detailed Implementation

[0059] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0060] In the semiconductor chip die bonding process, as described in the background section, the positions of the support ring, lifting ring, and pressure plate of existing wafer platforms are fixed. Therefore, they can only fix wafer rings of a single size. When it is necessary to operate on wafers of different sizes, the original support ring, lifting ring, and pressure plate must be completely removed and replaced with support rings, lifting rings, and pressure plates of the new size. After replacement, the working position needs to be readjusted. It is evident that existing wafer platforms have poor versatility and are complex to operate during model changeovers.

[0061] Therefore, this application provides a wafer platform. For example... Figures 1 to 2 As shown, the wafer platform in this embodiment includes a mounting plate 1, a tensioning seat 2, a lifting drive mechanism 3, a support ring, a first lifting ring 5, and a first pressure plate 6, wherein:

[0062] Tensioner 2 is mounted on mounting plate 1.

[0063] The support ring is detachably mounted on the tensioner 2.

[0064] The first lifting ring 5 is movably mounted on the tensioning seat 2 and located outside the support ring. The first pressure plate 6 is connected to the top of the first lifting ring 5, and a first pressing gap is formed between the first pressure plate 6 and the first lifting ring 5. The first pressing gap is used to press the first type of wafer ring.

[0065] The lifting drive mechanism 3 is at least partially mounted on the mounting plate 1 and is connected to the first lifting ring 5 via a transmission connection. The lifting drive mechanism 3 is used to drive the first lifting ring 5 to rise and fall.

[0066] When the support surface of the support ring installed on the tensioning seat 2 is of the first dimension, the support ring is close to the first lifting ring 5.

[0067] When the support surface of the support ring mounted on the tensioning seat 2 is of the second dimension, an installation gap is formed between the support ring and the first lifting ring 5 for mounting the second lifting ring 7. The second lifting ring 7 is detachably connected to the first lifting ring 5, and a second pressure plate 8 is connected to the top of the second lifting ring 7. A second clamping gap is formed between the second pressure plate 8 and the second lifting ring 7, and the second clamping gap is used to press the second type of wafer ring.

[0068] The second dimension is smaller than the first dimension, and the outer diameter of the second type of wafer ring is smaller than the outer diameter of the first type of wafer ring.

[0069] To distinguish between the two different sizes of support rings, the support ring with the first size of support surface will be referred to as the first support ring, and the support ring with the second size of support surface will be referred to as the second support ring.

[0070] The following combination Figures 1 to 2 The method of using the wafer platform in the embodiments of this application is described exemplarily.

[0071] When it is necessary to implement support and fixation for the first type of wafer ring (e.g., a wafer ring used to support wafers formed by dicing 12-inch wafers):

[0072] First, install the first support ring 41 onto the tensioning seat 2. The second lifting ring 7 and the second pressure plate 8 do not need to be installed. Of course, if the second lifting ring 7 is already installed on the tensioning seat 2, then the second lifting ring 7 and the second pressure plate 8 need to be removed.

[0073] The lifting drive mechanism 3 drives the first lifting ring 5 to rise to a high position, so that the first pressing gap between the first pressure plate 6 and the first lifting ring 5 is higher than the upper end of the first support ring 41.

[0074] Subsequently, the first type of wafer ring is inserted into the first clamping gap, and the carrier film inside the first type of wafer ring covers the support surface of the first support ring 41.

[0075] Next, the lifting drive mechanism 3 drives the first lifting ring 5 to a low position, so that the first pressing gap between the first pressure plate 6 and the first lifting ring 5 is lower than the upper end of the first support ring 41. In this way, the middle part of the carrier film can be tensioned on the first support ring 41.

[0076] At this point, the installation and fixation of the first type of wafer ring is complete, and the material handling device picks up and loads the wafers from the carrier film.

[0077] After the wafer on the carrier film is removed, the lifting drive mechanism 3 drives the first lifting ring 5 to rise to the high position again, and the peripheral part of the carrier film disengages from the first support ring 41. The first type of wafer ring that has been removed is then pulled out from the first clamping groove.

[0078] When it is necessary to implement support and fixation for a second type of wafer ring (e.g., a wafer ring used to support an 8-inch wafer):

[0079] The second support ring 42 is installed onto the tensioning seat 2. Of course, if the first support ring 41 is already installed on the tensioning seat 2, it needs to be removed. Furthermore, the second lifting ring 7, with the second pressure plate 8, is installed into the installation gap between the second support ring 42 and the first lifting ring 5, wherein the second lifting ring 7 is connected to the first lifting ring 5.

[0080] The lifting drive mechanism 3 drives the first lifting ring 5 to rise to a high position, and the second lifting ring 7 also rises to a high position under the drive of the first lifting ring 5. This makes the second pressing gap between the second pressure plate 8 and the second lifting ring 7 higher than the upper end of the second support ring 42.

[0081] Subsequently, the second type of wafer ring is inserted into the second clamping gap, and the carrier film inside the second type of wafer ring covers the support surface of the second support ring 42.

[0082] Next, the lifting drive mechanism 3 drives the first lifting ring 5 to descend to its lowest position, and the second lifting ring 7 also descends to its lowest position under the influence of the first lifting ring 5. This causes the first pressing gap between the second pressure plate 8 and the second lifting ring 7 to be lower than the upper end of the second support ring 42. In this way, the middle part of the bearing film can be tensioned on the second support ring 42.

[0083] At this point, the installation and fixation of the second type of wafer ring is completed, and the material handling device picks up and loads the wafers on the carrier film.

[0084] After the wafer on the carrier film is removed, the lifting drive mechanism 3 drives the first lifting ring 5 to rise to the high position again. The peripheral part of the carrier film disengages from the second support ring 42. The second type of wafer ring that has been removed is then pulled out from the second clamping groove.

[0085] As can be seen, in this embodiment of the wafer platform, the first lifting ring 5 and the first pressure plate 6 do not need to be replaced. When it is necessary to support and fix the first type of wafer ring, the support ring with the first size of the support surface is installed on the tensioning seat 2, and the first type of wafer ring is inserted into the first clamping gap. When it is necessary to support and fix the second type of wafer ring, the support ring with the second size of the support surface is installed on the tensioning seat 2, and then the second lifting ring 7 and the second pressure plate 8 are installed, and the second type of wafer ring is inserted into the second clamping gap. The wafer platform in this embodiment of the application reduces the complexity of changeover operations and improves versatility.

[0086] To facilitate the installation and removal of the support ring, one optional embodiment is that the bottom of the support ring is provided with at least one insertion hole along the circumferential direction. For example... Figure 3 As shown, the tensioning seat 2 is provided with a pin 21 that matches the insertion hole, and the support ring is inserted into the tensioning seat 2 through the insertion hole and the pin 21.

[0087] like Figure 9 As shown, optionally, for the first support ring 41 with a larger first size, at least two downward-opening slots 44 can be directly provided circumferentially at its bottom as insertion holes. The first support ring 41 is inserted into the tensioning seat 2 through the slots 44 and the pin 21. Of course, the setting position of the pin 21 on the tensioning seat 2 must match the size of the first support ring 41.

[0088] Because the second support ring 42 is a smaller size, it cannot be directly inserted into the pin 21 on the tensioning seat 2 that matches the size of the first support ring 41. Figures 10 to 11 As shown, optionally, the bottom of the second support ring 42 is provided with a horizontal connecting seat 43. Two insertion holes are provided circumferentially along the edge of the connecting seat 43, one of which is a round hole 45, and the other is a U-shaped slot 46 opening outwards. This arrangement allows the second support ring 42 to be inserted into the pin 21 on the tensioning seat 2 via the round hole 45 and the U-shaped slot 46 on the connecting seat 43. Specifically, the angle of the second support ring 42 can be adjusted first so that the round hole 45 aligns with one pin 21 on the tensioning seat 2 and is inserted into that pin 21. Then, the second support ring 42 is rotated so that the U-shaped slot 46 aligns with the other pin 21 on the tensioning seat 2 and is inserted into that pin 21.

[0089] As can be seen, by setting the insertion holes on the first support ring 41 and the second support ring 42, both the first support ring 41 and the second support ring 42 can be inserted into the same ring of pins 21 on the tensioning seat 2, without the need to set pins 21 separately for the first support ring 41 and the second support ring 42.

[0090] like Figure 12 As shown, optionally, the tensioning seat 2 is also provided with a magnetic suction component 22 for adsorbing the support ring. The magnetic suction component 22 is fixedly installed on the upper end of the tensioning seat 2 through the mounting hole.

[0091] The magnetic attachment 22 can magnetically attract the support ring, thereby further enhancing the connection stability between the support ring and the tensioning seat 2 and preventing the support ring from shaking. It also replaces the original bolt-fixed connection, facilitating the replacement of the support ring. Of course, a magnetic attachment should also be installed at the bottom of the support ring, or the support ring should be made of a magnetic metal (such as stainless steel).

[0092] To achieve a detachable connection between the second lifting ring 7 and the first lifting ring 5, such as Figure 13 As shown, optionally, the top end of the first lifting ring 5 is provided with a plurality of connecting holes 51 along the circumferential direction, and the second lifting ring 7 can be detachably connected to the first lifting ring 5 through the plurality of connecting holes 51.

[0093] like Figure 1 and Figures 6 to 7 As shown, optionally, the lifting drive mechanism 3 includes a first drive unit 31, N first gears 32, a first synchronous belt 33, and a second gear 34, wherein:

[0094] N first gears 32 are arranged circumferentially on the tensioning seat 2. Each first gear 32 is mounted on the tensioning seat 2 via a first rotating shaft. The first synchronous belt 33 is fitted on the N first gears 32 and meshes with each of the first gears 32.

[0095] The bottom of the first lifting ring 5 is provided with lifting screws corresponding to the first gears 32 from the first to the (N-1)th, and the lower end of each lifting screw is screwed into the shaft hole of the corresponding first rotating shaft.

[0096] The second gear 34 and the Nth first gear 32 are coaxially mounted on the tensioning seat 2 via the second rotating shaft. The second gear 34 is located outside the first synchronous belt 33.

[0097] The first drive unit 31 is mounted on the mounting plate 1. The first drive unit 31 can be connected to the second gear 34 to drive the second gear 34 to rotate. When the second gear 34 rotates, the first gear 32 and the first synchronous belt 33, which are coaxially mounted, drive each first gear 32 to rotate synchronously. When each first gear 32 rotates synchronously, it drives a number of lifting screws to rise and fall, thereby driving the first lifting ring 5 to rise and fall.

[0098] The first driving unit 31 synchronously drives several lifting screws arranged circumferentially at the bottom of the first lifting ring 5 to rise and fall, thereby driving the first lifting ring 5 to rise and fall, improving the stability of the first lifting ring 5 and preventing the first lifting ring 5 from tilting during the rising and falling process.

[0099] Optionally, N ≥ 3. That is, the lifting drive mechanism 3 includes at least 3 first gears 32.

[0100] like Figure 8 As shown, optionally, the first drive unit 31 includes a mounting base 311, a translation drive module 312, a rotation drive module 313, and a drive gear 314, wherein: the mounting base 311 is disposed on the mounting plate 1 and located on the side of the tensioning seat 2, and the translation drive module 312 is disposed on the mounting base 311. The rotation drive module 313 is slidably connected to the mounting base 311 and is drively connected to the translation drive module 312, and the drive gear 314 is connected to the moving part of the rotation drive module 313.

[0101] The translation drive module 312 is used to drive the drive gear 314 to translate toward or away from the second gear 34, so that the drive gear 314 meshes with or disengages from the second gear 34. When the drive gear 314 meshes with the second gear 34, the rotation drive module 313 drives the drive gear 314 to rotate, thereby driving the second gear 34 to rotate.

[0102] When it is necessary to implement the lifting drive of the first lifting ring 5, the translation drive module 312 drives the rotation drive module 313 and the drive gear 314 to translate toward the second gear 34, so that the drive gear 314 meshes with the second gear 34. At this time, the rotation drive module 313 can drive the drive gear 314 to rotate to implement the lifting drive of the first lifting ring 5.

[0103] When the position of the first lifting ring 5 needs to be adjusted, the translation drive module 312 drives the rotation drive module 313 and the drive gear 314 to translate away from the second gear 34, so that the drive gear 314 and the second gear 34 mesh and separate, preventing the first lifting ring 5 from interfering with the translation drive module 312 when it moves.

[0104] The translation drive module 312 can be any existing linear drive module capable of driving the drive gear 314 to translate toward or away from the second gear 34, such as a cylinder module or a lead screw module. The rotary drive module 313 can be any existing rotary drive module capable of driving the gear 314 to rotate. For example, the rotary drive module 313 uses a worm gear reducer motor, which has the advantages of large output torque and stable drive, and can further improve the lifting accuracy of the first lifting ring 5.

[0105] Specifically, the rotary drive module 313 includes a drive component, a turbine 317, and a worm gear. The worm gear is mounted on the drive end of the drive component and meshes with the turbine 317 for transmission. The drive gear 314 is coaxially mounted with the turbine on a connecting member (not shown in the figure) via a rotating shaft. The connecting member is slidably mounted on a mounting base 311 and connected to the drive end of the translation drive module 312. The translation drive module 312 drives the turbine to reciprocate on the worm gear via the connecting member, thereby causing the drive gear 314 to move closer to or away from the second gear 34.

[0106] Optionally, a photoelectric baffle 316 is also installed on the drive end of the drive component. The photoelectric baffle 316 has a toothed groove. A photoelectric sensor is fixedly installed on the side of the photoelectric baffle 316 corresponding to the position of the toothed groove. When the rotary drive module 313 drives the drive gear 314 to rotate, it synchronously drives the photoelectric baffle to rotate. The photoelectric sensor senses the signal. By counting the sensed signal and combining it with the predefined toothed groove width, the rotation angle of the worm can be calculated, thereby detecting the movement position of the drive component and controlling the rotation angle of the drive gear 314, which can further improve the accuracy of angle adjustment.

[0107] In addition, the worm gear transmission structure is stable and low in cost. Of course, the rotary drive module 313 can also use a servo motor or a stepper motor, etc., which will not be elaborated here.

[0108] Optionally, the first drive unit 31 further includes a locking pin 315, which is connected to a movable part of the translation drive module 312. When the translation drive module 312 drives the drive gear 314 to mesh with the second gear 34, the locking pin 315 is simultaneously inserted into a locking hole on the tensioning seat 2 that matches the locking pin 315, thereby ensuring that the drive gear 314 and the second gear 34 form a stable mesh.

[0109] like Figures 1 to 2 and Figures 4 to 5 As shown, optionally, the tensioner 2 is rotatably mounted on the mounting plate 1. The wafer platform in this embodiment further includes a rotation drive mechanism 9 disposed on the mounting plate 1. The rotation drive mechanism 9 drives the tensioner 2 to rotate in the horizontal plane, thereby causing the wafer ring to rotate in the horizontal plane. This allows for flexible adjustment of the angle of the wafer within the wafer ring, ensuring that the wafer picking device can smoothly pick up the wafer.

[0110] Optionally, the rotary drive mechanism 9 includes a second drive unit 91, a synchronous pulley 92, a second synchronous belt 93, and a gear disc 94, wherein the gear disc 94 is rotatably mounted on the mounting plate 1, and the tensioning seat 2 is fixedly mounted above the gear disc 94. The second synchronous belt 93 has meshing teeth that mesh with the outer circumference of the gear disc 94. The synchronous pulley 92 is mounted on the mounting plate 1 and is connected to the gear disc 94 via the second synchronous belt 93. The second drive unit 91 is disposed on the mounting plate 1 and is used to drive the synchronous pulley 92 to rotate, thereby causing the gear disc 94 and the tensioning seat 2 to rotate in the horizontal plane.

[0111] The tensioner 2 is rotated by means of a second synchronous belt 93 in conjunction with a gear disk 94, which improves the driving stability of the tensioner 2 and thus improves the angle adjustment accuracy of the wafer. Of course, other existing rotary drive mechanisms can also be used to drive the tensioner 2 to rotate.

[0112] The second drive unit 91 can be any existing drive component capable of driving the synchronous pulley 92 to rotate, such as a drive motor that is connected to the synchronous pulley 92 via a synchronous belt.

[0113] like Figures 1 to 2 As shown, optionally, the wafer platform in this embodiment further includes a translation drive mechanism 10, with the mounting plate 1 horizontally disposed on the movable component of the translation drive mechanism 10. The translation drive mechanism 9 is used to drive the mounting plate 1 to translate in the horizontal plane, thereby driving the wafer ring to translate in the horizontal plane.

[0114] By setting up the translation drive mechanism 10, the horizontal position of the wafer ring is adjusted, thereby adjusting the position of the wafers on it. This ensures that before each wafer pick-up, the wafer to be picked up can be adjusted to the predetermined pick-up position, allowing the wafer picking device to pick up the wafer from that position each time, improving pick-up efficiency. Furthermore, the translation drive mechanism 9 can also switch the drive mounting plate 1 between the loading position and the wafer picking position, facilitating manual material changes.

[0115] Optionally, the translation drive mechanism 10 includes a base plate 101, an X-axis translation drive (not shown in the figure), a sliding plate 102, and a Y-axis translation drive (not shown in the figure), wherein: the sliding plate 102 is slidably connected to the base plate 101, the X-axis translation drive is disposed on the base plate 101 and is driveably connected to the sliding plate 102, and the X-axis translation drive is used to drive the sliding plate 102 to slide along the X-axis. The mounting plate 1 is slidably connected to the sliding plate 102, the Y-axis translation drive is disposed on the sliding plate 102 and is driveably connected to the mounting plate 1, and the Y-axis translation drive is used to drive the mounting plate 1 to slide along the Y-axis.

[0116] Both the X-axis and Y-axis translation drives can utilize existing translation drives, such as cylinders and lead screw motors.

[0117] The foregoing has provided a sufficiently detailed and specific description of this application. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within the protection scope of this application. The scope of protection claimed in this application is defined by the claims, and not by the above descriptions in the embodiments.

Claims

1. A wafer platform, characterized by, The wafer platform comprises a mounting plate, a tension seat, a lifting driving mechanism, a support ring, a first lifting ring and a first pressing plate, wherein: The tension seat is arranged on the mounting plate; The support ring is detachably mounted on the tension seat; The first lifting ring is arranged on the tension seat and outside the support ring in a lifting manner, the first pressing plate is connected to the top end of the first lifting ring, a first pressing gap is formed between the first pressing plate and the first lifting ring, and the first pressing gap is used for pressing a first type of wafer ring; The lifting driving mechanism is arranged at least partially on the mounting plate and in transmission connection with the first lifting ring, and the lifting driving mechanism is used for driving the first lifting ring to lift; When the support surface of the support ring is a first size, the support ring abuts against the first lifting ring; When the support surface of the support ring is a second size, an installation gap for mounting a second lifting ring is formed between the support surface of the support ring and the first lifting ring, the second lifting ring is detachably connected to the first lifting ring, a second pressing plate is connected to the top end of the second lifting ring, a second pressing gap is formed between the second pressing plate and the second lifting ring, and the second pressing gap is used for pressing a second type of wafer ring; The second size is smaller than the first size, and the outer diameter of the second type of wafer ring is smaller than that of the first type of wafer ring.

2. The wafer platform of claim 1, wherein, The bottom of the support ring is provided with at least one insertion hole in the circumferential direction, the tension seat is provided with a corresponding insertion pin, and the support ring is inserted on the tension seat through the insertion hole and the insertion pin.

3. The wafer platform of claim 2, wherein, When the support surface of the support ring is a first size, the bottom of the support ring is provided with at least two insertion holes in the circumferential direction, and the insertion holes are slot holes opening towards the lower side.

4. The wafer platform of claim 2, wherein, When the support surface of the support ring is a second size, the bottom of the support ring is provided with a horizontal connecting seat, and the edges of the connecting seat are provided with two insertion holes penetrating through the connecting seat in the circumferential direction, one of which is a round hole and the other is a U-shaped slot hole opening towards the outside.

5. The wafer platform of claim 1, wherein, The tension seat is further provided with a magnetic attraction member for attracting the support ring, and the magnetic attraction member is fixedly mounted on the upper end of the tension seat through a mounting hole.

6. The wafer platform of claim 1, wherein, The top end of the first lifting ring is provided with a plurality of connecting holes in the circumferential direction, and the second lifting ring can be connected to the first lifting ring through the connecting holes.

7. The wafer platform of claim 1, wherein, The lifting driving mechanism comprises a first driving part, N first gears, a first synchronous belt and a second gear, wherein: N first gears are arranged on the tension seat in the circumferential direction, each first gear is mounted on the tension seat through a first rotating shaft, the first synchronous belt is sleeved on the N first gears and meshes with each first gear; The bottom of the first lifting ring is provided with lifting lead screws corresponding to the first gears from the first gear to the N-1th gear, and the lower end of each lifting lead screw is screwed into the shaft hole of the corresponding first rotating shaft; The second gear is coaxially mounted on the tension seat through a second rotating shaft with the Nth first gear, and the second gear is located outside the first synchronous belt. The first driving part is arranged on the mounting plate and can be connected with the second gear to drive the second gear to rotate, and the first gear and the first synchronous belt coaxially arranged with the second gear drive the first gears to rotate synchronously when the second gear rotates, and the first gears drive the lifting lead screws to lift to drive the first lifting ring to lift.

8. The wafer platform of claim 7, wherein, The first driving part comprises a mounting seat, a translation driving module, a rotation driving module and a driving gear, wherein: The mounting seat is arranged on the mounting plate and located at the side of the tensioning seat, and the translation driving module is arranged on the mounting seat; The rotation driving module is slidingly connected to the mounting seat and drivingly connected to the translation driving module, and the driving gear is connected to the movable part of the rotation driving module; The translation driving module is configured to drive the driving gear to translate towards or away from the second gear to make the driving gear engage with or disengage from the second gear, and the rotation driving module drives the driving gear to rotate to drive the second gear to rotate when the driving gear engages with the second gear.

9. The wafer supply device according to claim 8, wherein The rotation driving module comprises a driving member, a turbine, a worm, a photoelectric baffle and a photoelectric sensor, wherein: The worm is arranged on the driving end of the driving member and drivingly connected to the turbine, the turbine and the driving gear are coaxially arranged on a connecting member, and the connecting member is slidingly arranged on the mounting seat and connected to the driving end of the translation driving module; The photoelectric baffle is arranged on the driving end of the driving member, the periphery of the photoelectric baffle is provided with a tooth groove, the photoelectric sensor is fixedly arranged on the side of the photoelectric baffle and arranged corresponding to the tooth groove, and the photoelectric sensor is configured to detect the movement position of the driving member in cooperation with the photoelectric baffle.

10. The wafer platform of claim 1, wherein, The tensioning seat is rotatably arranged on the mounting plate, and the wafer platform further comprises a rotation driving mechanism arranged on the mounting plate, and the rotation driving mechanism is configured to drive the tensioning seat to rotate in a horizontal plane. The rotation driving mechanism comprises a second driving part, a synchronous pulley, a second synchronous belt and a toothed disc, wherein: The toothed disc is rotatably arranged on the mounting plate, and the tensioning seat is fixedly arranged above the toothed disc; The second synchronous belt is provided with engaging teeth, the engaging teeth on the second synchronous belt engage with the outer periphery of the toothed disc, the synchronous pulley is arranged on the mounting plate and drivingly connected to the toothed disc through the second synchronous belt; The second driving part is arranged on the mounting plate, and the second driving part is configured to drive the synchronous pulley to rotate to drive the toothed disc and the tensioning seat to rotate in a horizontal plane.

11. The wafer platform of claim 1, wherein, The wafer platform further comprises a translation driving mechanism, and the mounting plate is horizontally arranged on the movable part of the translation driving mechanism; The translation driving mechanism is configured to drive the mounting plate to translate in a horizontal plane; The translation driving mechanism comprises a bottom plate, an X-axis translation driving member, a sliding plate and a Y-axis translation driving member, wherein: The sliding plate is slidingly connected to the bottom plate, and the X-axis translation driving element is arranged on the bottom plate and drivingly connected to the sliding plate, and is used for driving the sliding plate to slide along the X-axis. The mounting plate is slidingly connected to the sliding plate, and the Y-axis translation driving element is arranged on the sliding plate and drivingly connected to the mounting plate, and is used for driving the mounting plate to slide along the Y-axis.

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