Wafer feeding device

Abstract

The utility model provides a wafer feeding device, which comprises a mounting plate, a tensioning seat, a supporting ring, a lifting ring, a pressing plate, a lifting driving mechanism and an auxiliary pressing mechanism, and is characterized in that the tensioning seat is arranged on the mounting plate, and the supporting ring is arranged on the tensioning seat; the lifting ring is arranged on the tensioning seat in a lifting mode and surrounds the outer side of the supporting ring, the pressing plate is fixedly connected to the top end of the lifting ring, a pressing groove is formed between the pressing plate and the lifting ring, and the pressing plate is provided with a suspended section; the lifting driving mechanism drives the lifting ring to be switched between a first height and a second height in a lifting mode, and when the lifting ring ascends to the first height, the wafer ring is inserted into the pressing groove through the insertion opening; when the lifting ring descends to a second height, the bearing film is tensioned on the upper surface of the supporting ring; and when the lifting ring descends to a second height, the auxiliary pressing mechanism is driven by the lifting ring to downwards press the suspended section. According to the wafer feeding device provided by the invention, the suspension section can be ensured to effectively press the wafer ring located at the insertion port, and the wafer ring is prevented from inclining.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip packaging equipment, specifically a wafer feeding device. Background Technology

[0002] During the chip packaging process, the chip is carried on a carrier film, and the periphery of the carrier film is tensioned and fixed by a wafer ring. Before the wafer mounting process, the wafer ring needs to be fixed to the wafer platform, and the wafer platform drives the wafer ring to move so that the chips on the carrier film can be moved sequentially to the predetermined pick-up station for easy picking by the pick-up device.

[0003] The wafer platform includes a tensioning seat, a support ring, a lifting ring, and a pressure plate. The support ring is fixedly mounted on the tensioning seat, while the lifting ring is movably mounted on the tensioning seat and located outside the support ring. The pressure plate is connected to the top of the lifting ring, forming a clamping gap between the pressure plate and the lifting ring for clamping the wafer ring. Initially, the lifting ring is in a high position, and the clamping gap is higher than the support ring. In this state, the wafer ring can be inserted into the clamping gap, allowing the carrier film to cover the upper side of the support ring. Subsequently, the lifting ring and pressure plate are lowered to a low position, thereby tightening the carrier film through the relative movement of the pressure plate and the support ring.

[0004] To facilitate the insertion of the wafer ring into the clamping gap, a portion of the pressure plate is suspended, forming an insertion port between the suspended section of the pressure plate and the lifting ring. The problem arises when the pressure plate and support ring work together to tighten the carrier film; the reaction force of the carrier film causes the suspended section of the pressure plate to tilt upwards, resulting in a tilted wafer ring. Consequently, the suspended section of the pressure plate cannot effectively clamp the ring, affecting its fixation. Utility Model Content

[0005] To address the aforementioned technical problems, this application provides a wafer feeding device, the detailed technical solution of which is as follows:

[0006] A wafer feeding device is used to fix a wafer ring, in which a carrier film carrying a chip is tensioned. The wafer feeding device includes a mounting plate, a tensioning seat, a support ring, a lifting ring, a pressure plate, a lifting drive mechanism, and an auxiliary clamping mechanism, wherein:

[0007] The tensioner seat is mounted on the mounting plate, and the support ring is mounted on the tensioner seat.

[0008] The lifting ring is movably mounted on the tensioning seat and surrounds the outside of the support ring. The pressure plate is fixedly connected to the top of the lifting ring. A pressing groove is formed between the pressure plate and the lifting ring. The pressure plate has a suspended section, and an insertion port is formed between the suspended section and the lifting ring.

[0009] The lifting drive mechanism is at least partially mounted on the mounting plate and is connected to the lifting ring via a transmission. The lifting drive mechanism is used to drive the lifting ring to switch between a first height and a second height, wherein the first height is higher than the second height.

[0010] When the lifting ring rises to the first height, the insertion port and the clamping groove are higher than the upper end of the support ring, and the wafer ring can be inserted into the clamping groove through the insertion port, while the carrier film covers the support ring.

[0011] When the lifting ring descends to the second height, the peripheral part of the bearing membrane descends to a position below the upper surface of the support ring under the action of the pressure plate and the lifting ring, and the middle part of the bearing membrane is tensioned on the upper surface of the support ring.

[0012] The auxiliary clamping mechanism is set on the tensioning seat and located outside the suspended section. The auxiliary clamping mechanism is connected to the lifting ring. When the lifting ring descends to the second height, the auxiliary clamping mechanism is configured to press the suspended section downward under the drive of the lifting ring, so that the suspended section presses the wafer ring.

[0013] When the lifting ring rises to the first height, the auxiliary clamping mechanism is configured to release the suspended section under the action of the lifting ring.

[0014] The wafer feeding device provided in this application includes an auxiliary clamping mechanism disposed on the tensioning seat and located outside the suspended section of the pressure plate. When the lifting ring descends to the second height and the support ring tensions the peripheral part of the carrier film upward, the auxiliary clamping mechanism presses down on the suspended section of the pressure plate, thereby ensuring that the suspended section can effectively clamp the wafer ring located at the insertion port, improving the clamping effect of the pressure plate on the wafer ring, and preventing the wafer ring from tilting.

[0015] In some embodiments, the auxiliary clamping mechanism includes a rack, a connecting rod, a gear, and a clamping claw, wherein:

[0016] The rack is set vertically on the tensioner;

[0017] The connecting rod is rotatably mounted on the lifting ring, the connecting rod extends horizontally, the gear is fitted on the connecting rod and meshes with the rack, and the pressure claw is connected to the connecting rod;

[0018] When the lifting ring descends from the first height to the second height, the rack drives the connecting rod to rotate in the first clockwise direction via the gear. The connecting rod drives the pressure claw to rotate toward the suspended section, so that the pressure claw presses down to tighten the suspended section.

[0019] When the lifting ring rises from the second height toward the first height, the rack drives the connecting rod to rotate in the second clockwise direction via the gear. The connecting rod drives the pressure claw to rotate away from the suspended section, causing the pressure claw to release the suspended section. The first clockwise direction is opposite to the second clockwise direction.

[0020] By configuring the auxiliary clamping mechanism, it can be driven by the lifting ring, achieving synchronized movement with it. Ultimately, when the lifting ring descends from the first height to the second height, the auxiliary clamping mechanism presses down on the suspended section; when the lifting ring rises from the second height to the first height, the auxiliary clamping mechanism releases the suspended section. In other words, the auxiliary clamping mechanism requires no additional drive components; its clamping and releasing operations are entirely triggered by the rising and falling of the lifting ring. This configuration allows the auxiliary clamping mechanism to clamp or release the suspended section simultaneously with the lifting ring's ascent and descent, thereby accelerating the work cycle and improving efficiency. Furthermore, since the auxiliary clamping mechanism does not require additional drive components, equipment costs are reduced.

[0021] In some embodiments, the gear has a tooth gap area, which lacks at least one tooth; when the lifting ring is at a first height, the tooth gap area is misaligned with the rack, and the teeth on the gear mesh with the rack; when the lifting ring is at a second height, the tooth gap area abuts against the rack, and the teeth on the gear disengage from the rack; when the lifting ring descends from the first height to a third height, the pressure claw rotates downward to press against the suspended section, the tooth gap area abuts against the rack, and the teeth on the gear disengage from the rack; when the lifting ring continues to descend to the second height, the tooth gap area slides on the rack; when the lifting ring rises from the second height to the third height, the tooth gap area slides on the rack, and the teeth on the gear mesh with the rack; when the lifting ring continues to rise to the first height, the tooth gap area is misaligned with the rack, and the pressure claw rotates upward away from the suspended section. The third height is located between the first and second heights.

[0022] When the lifting ring descends from the first height to the third height, the pressure claw rotates downwards into position and presses against the suspended section. At this point, the tooth gap area abuts against the rack, and the teeth on the gear disengage from the rack. As the lifting ring continues to descend to the second height, the tooth gap area slides on the rack, and the pressure claw does not continue to rotate downwards. Instead, it remains pressed against the suspended section with a constant pressure. Therefore, the pressure claw only rotates downwards during the stroke of the lifting ring from the first height to the third height, thus avoiding excessive downward pressure from the pressure claw, the suspended section of the pressure plate, or the wafer ring, which could cause excessive deformation.

[0023] As the lifting ring rises from the second to the third height, the tooth gap area slides on the rack, and the pressure claw holds it in place on the suspended section with a constant pressure. When the lifting ring reaches the third height, the teeth on the gear mesh with the rack. As the lifting ring continues to rise to the first height, the pressure claw rotates upward and moves away from the suspended section under the drive of the gear to release it. When the lifting ring reaches the first height, the tooth gap area is completely disengaged from the rack. It is evident that the pressure claw only rotates upward to release the suspended section during the stroke of the lifting ring from the third to the first height, avoiding excessive rotation of the pressure claw and interference with the tensioning seat assembly.

[0024] In some embodiments, the suspended section has a notch in the middle, which divides the suspended section into a first suspended section and a second suspended section; the auxiliary clamping mechanism includes a first clamping claw and a second clamping claw that are spaced apart on the connecting rod, wherein: the first clamping claw is used to clamp and release the first suspended section, and the second clamping claw is used to clamp and release the second suspended section.

[0025] By creating a notch in the middle of the suspended section, it is divided into a first suspended section and a second suspended section. On the one hand, this makes it easier to insert the wafer ring into the clamping groove between the pressure plate and the lifting ring. On the other hand, the first and second clamping claws can respectively press down on the first and second suspended sections with their free ends, so that the first and second suspended sections firmly clamp the wafer ring located at the insertion port, further improving the clamping effect of the suspended section on the wafer ring.

[0026] In some embodiments, a first pressure tongue extending outward from the first suspended section is provided on the first suspended section, and a first pressure claw is pressed and released from the first suspended section by the first pressure tongue; a second pressure tongue extending outward from the second suspended section is provided on the second suspended section, and a second pressure claw is pressed and released from the second suspended section by the second pressure tongue.

[0027] By setting the first pressure tongue, the clamping stability of the first pressure claw on the first suspended section is improved, preventing the first pressure claw from slipping. Similarly, by setting the second pressure tongue, the clamping stability of the second pressure claw on the second suspended section is improved, preventing the second pressure claw from slipping.

[0028] In some embodiments, the lifting drive mechanism includes a first drive unit, N first gears, a first synchronous belt, and a second gear, wherein:

[0029] N first gears are arranged circumferentially on the tensioning seat. Each first gear is mounted on the tensioning seat via a first rotating shaft. A first synchronous belt is fitted onto the N first gears and meshes with each of the first gears.

[0030] The bottom of the lifting ring is provided with lifting screws that correspond one-to-one with the first gear from the 1st to the (N-1th)th first gear, and the lower end of each lifting screw is screwed into the shaft hole of the corresponding first rotating shaft.

[0031] The second gear and the Nth first gear are coaxially mounted on the tensioning seat via the second rotating shaft, and the second gear is located outside the first synchronous belt;

[0032] The first drive unit is mounted on the mounting plate. The first drive unit can dock with the second gear to drive the second gear to rotate. When the second gear rotates, it drives each first gear to rotate synchronously through the first gear and the first synchronous belt mounted on the same axis. When each first gear rotates synchronously, it drives each lifting screw to rise and fall, thereby driving the lifting ring to rise and fall.

[0033] A lifting drive mechanism with a simple structure and high driving stability is provided. It drives N-1 lifting screws arranged circumferentially at the bottom of the lifting ring synchronously via a first driving unit and a first synchronous belt, thereby driving the lifting ring to rise and fall, improving the lifting stability of the lifting ring and preventing the lifting ring from tilting to one side during the lifting process.

[0034] In some embodiments, the first drive unit includes a mounting base, a translation drive module, a rotary drive module, and a drive gear, wherein: the mounting base is disposed on the mounting plate and located on the side of the tensioning seat; the translation drive module is disposed on the mounting base; the rotary drive module is slidably connected to the mounting base and is drively connected to the translation drive module; the drive gear is connected to the movable part of the rotary drive module; the translation drive module is used to drive the drive gear to translate toward or away from the second gear, so that the drive gear meshes with or disengages from the second gear; when the drive gear meshes with the second gear, the rotary drive module drives the drive gear to rotate, thereby driving the second gear to rotate.

[0035] When the lifting ring needs to be raised or lowered, the translation drive module drives the rotary drive module and the drive gear to translate towards the second gear, thereby engaging the drive gear with the second gear. At this time, the rotary drive module can drive the drive gear to rotate to raise or lower the lifting ring. When the position of the lifting ring needs to be adjusted, the translation drive module drives the rotary drive module and the drive gear to translate away from the second gear, thereby disengaging the drive gear from the second gear and preventing interference between the lifting ring and the translation drive module during movement.

[0036] In some embodiments, the rotary drive module includes a drive element, a turbine, a worm gear, a photoelectric baffle, and a photoelectric sensor, wherein: the worm gear is installed on the drive end of the drive element and meshes with the turbine for transmission; the turbine gear is coaxially installed on a connector with the drive gear; the connector is slidably installed on a mounting base and connected to the drive end of the translation drive module; the photoelectric baffle is installed on the drive end of the drive element, and the periphery of the photoelectric baffle is provided with toothed grooves; the photoelectric sensor is fixedly installed on the side of the photoelectric baffle and is provided corresponding to the toothed grooves; the photoelectric sensor is configured to cooperate with the photoelectric baffle to detect the movement position of the drive element.

[0037] The worm gear transmission provides a driving method with large output torque and stable drive; combined with photoelectric baffles and photoelectric sensors, the control of the lifting accuracy of the lifting ring can be further improved.

[0038] In some embodiments, the first drive unit further includes a locking pin, which is connected to a movable part of the translation drive module; when the translation drive module drives the drive gear to mesh with the second gear, the locking pin is inserted into a locking hole on the tension seat that matches the locking pin; when the translation drive module drives the drive gear to disengage from the second gear, the locking pin is withdrawn from the locking hole.

[0039] When the locking pin is removed from the locking hole, the position of the tensioning seat can be adjusted; when the drive gear meshes with the second gear, the locking pin is inserted into the locking hole on the tensioning seat that matches the locking pin, thereby ensuring that the drive gear and the second gear form a stable mesh and preventing the drive gear from disengaging or slipping from the second gear.

[0040] In some embodiments, the tensioner is rotatably mounted on the mounting plate, and the wafer feeding device further includes a rotary drive mechanism disposed on the mounting plate. The rotary drive mechanism is used to drive the tensioner to rotate in a horizontal plane, thereby driving the wafer ring to rotate in a horizontal plane. The rotary drive mechanism includes a second drive unit, a synchronous pulley, a second synchronous belt, and a geared disc, wherein: the geared disc is rotatably mounted on the mounting plate, and the tensioner is fixedly mounted above the geared disc; the second synchronous belt has meshing teeth that mesh with the outer periphery of the geared disc; the synchronous pulley is mounted on the mounting plate and is connected to the geared disc via the second synchronous belt; the second drive unit is disposed on the mounting plate and is used to drive the synchronous pulley to rotate, thereby driving the geared disc and the tensioner to rotate in a horizontal plane.

[0041] By setting up a rotary drive mechanism, the tensioner is rotated in the horizontal plane, thereby achieving angle adjustment of the wafer within the wafer ring and ensuring that the wafer picking device can smoothly pick up the wafer. The rotational drive of the tensioner is achieved through a second synchronous belt in conjunction with a toothed disc, improving the driving stability of the tensioner and thus enhancing the accuracy of wafer angle adjustment. Of course, other existing rotary drive mechanisms can also be used to drive the tensioner's rotation.

[0042] In some embodiments, the wafer feeding device further includes a translation drive mechanism, with the mounting plate horizontally disposed on a movable component of the translation drive mechanism; the translation drive mechanism is used to drive the mounting plate to translate in a horizontal plane, thereby driving the wafer ring to translate in a horizontal plane; the translation drive mechanism includes a base plate, an X-axis translation drive component, a sliding plate, and a Y-axis translation drive component, wherein: the sliding plate is slidably connected to the base plate, the X-axis translation drive component is disposed on the base plate and is driveably connected to the sliding plate, and the X-axis translation drive component is used to drive the sliding plate to slide along the X-axis; the mounting plate is slidably connected to the sliding plate, the Y-axis translation drive component is disposed on the sliding plate and is drively connected to the mounting plate, and the Y-axis translation drive component is used to drive the mounting plate to slide along the Y-axis.

[0043] By setting up a translation drive mechanism, the horizontal position of the wafer ring is adjusted, thereby adjusting the position of the wafers on it. This ensures that before each wafer pick-up, the wafer to be picked up can be adjusted to the predetermined pick-up position, allowing the wafer picking device to consistently pick up wafers from that position, improving pick-up efficiency. Furthermore, the translation drive mechanism can also switch the drive plate between the loading position and the wafer picking position, facilitating manual material changes. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the wafer feeding device in the embodiments of this application from a first perspective.

[0045] Figure 2 This is a schematic diagram of the wafer feeding device in the embodiments of this application from a second perspective;

[0046] Figure 3 This is a schematic diagram of the wafer feeding device in the embodiments of this application from a third perspective;

[0047] Figure 4 This is a schematic diagram of the wafer feeding device in the embodiments of this application after omitting the translation drive mechanism, from a first-view perspective.

[0048] Figure 5 This is a schematic diagram of the wafer feeding device in the embodiments of this application after omitting the translation drive mechanism, from a second perspective.

[0049] Figure 6 This is a schematic diagram of the components such as the tensioning seat, support ring, lifting ring, pressure plate, and auxiliary pressing mechanism in the embodiments of this application from a first-view perspective;

[0050] Figure 7 This is a schematic diagram of the components such as the tensioning seat, support ring, lifting ring, pressure plate, and auxiliary pressing mechanism in the embodiments of this application from a second perspective.

[0051] Figure 8 This is a structural schematic diagram of the components such as the tensioning seat, support ring, lifting ring, pressure plate, and auxiliary pressing mechanism in the embodiments of this application from a third perspective;

[0052] Figure 9 This is a structural schematic diagram of the components such as the tensioning seat, support ring, lifting ring, pressure plate, and auxiliary pressing mechanism in the embodiments of this application from a fourth perspective;

[0053] Figure 10 for Figure 11 A magnified view of region A in the image;

[0054] Figure 11 This is a schematic diagram of the auxiliary clamping mechanism in the embodiments of this application;

[0055] Figure 12 This is a schematic diagram of the connecting rod and gear in the embodiments of this application;

[0056] Figure 13 This is a schematic diagram of the structure of the first driving unit in an embodiment of this application from a first perspective.

[0057] Figure 14 This is a schematic diagram of the structure of the first driving unit in an embodiment of this application from a second perspective;

[0058] Figure 15 This is a schematic diagram of the structure of the first driving unit in an embodiment of this application from a third perspective;

[0059] Figures 1 to 15 Includes:

[0060] Mounting plate 1;

[0061] Tension seat 2;

[0062] Support ring 3;

[0063] Lifting ring 4;

[0064] Pressure plate 5: suspended section 51, insertion port 52, first suspended section 511, second suspended section 512, first pressure tongue 513, second pressure tongue 514;

[0065] Lifting drive mechanism 6: First drive unit 61, first gear 62, first synchronous belt 63, second gear 64, mounting base 611, translation drive module 612, rotation drive module 613, drive gear 614, locking pin 615, photoelectric baffle 616, turbine 617;

[0066] Auxiliary clamping mechanism 7: rack 71, connecting rod 72, gear 73, clamping claw 74, tooth 731, tooth gap area 732, first clamping claw 741, second clamping claw 742;

[0067] Rotary drive mechanism 8: second drive unit 81, synchronous pulley 82, second synchronous belt 83, gear plate 84;

[0068] Translation drive mechanism 9: base plate 91, sliding plate 92. Detailed Implementation

[0069] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0070] In the semiconductor chip die bonding process, as described in the background section, to facilitate the installation of the pressure plate and the insertion of the wafer ring into the clamping gap, a portion of the pressure plate is suspended. The suspended section of the pressure plate and the lifting ring form an insertion port for inserting the wafer ring. The problem arising from this is that when the pressure plate and the support ring work together to tighten the carrier film, the reaction force of the carrier film causes the suspended section of the pressure plate to tilt upwards, resulting in a tilted wafer ring. This prevents the suspended section of the pressure plate from effectively clamping the ring, affecting the wafer ring's fixation effect, and this effect becomes increasingly pronounced as the wafer ring diameter increases.

[0071] To address this issue, this application provides a wafer feeding device for fixing a wafer ring, wherein a carrier film (e.g., a blue film) carrying a chip is tensioned inside the wafer ring.

[0072] like Figures 1 to 9 As shown, the wafer feeding device in this embodiment includes a mounting plate 1, a tensioning seat 2, a support ring 3, a lifting ring 4, a pressure plate 5, a lifting drive mechanism 6, and an auxiliary clamping mechanism 7, wherein:

[0073] Tensioner 2 is mounted on mounting plate 1, and support ring 3 is mounted on tensioner 2.

[0074] The lifting ring 4 is movably mounted on the tensioning seat 2 and surrounds the outside of the support ring 3. The pressure plate 5 is fixedly connected to the top of the lifting ring 4. A pressing groove is formed between the pressure plate 5 and the lifting ring 4. The pressure plate 5 has a suspended section 51. An insertion port 52 is formed between the suspended section 51 and the lifting ring 4.

[0075] The lifting drive mechanism 6 is at least partially mounted on the mounting plate 1 and is connected to the lifting ring 4 via a transmission. The lifting drive mechanism 6 is used to drive the lifting ring 4 to switch between a first height and a second height, wherein the first height is higher than the second height.

[0076] When the lifting ring 4 rises to the first height, the insertion port 52 and the clamping groove are higher than the upper end of the support ring 3, and the wafer ring can be inserted into the clamping groove through the insertion port 52, and the carrier film covers the upper surface of the support ring.

[0077] When the lifting ring 4 descends to the second height, the peripheral part of the bearing membrane is driven by the pressure plate and the lifting ring to a position lower than the upper surface of the support ring 3, and the middle part of the bearing membrane is tensioned on the upper surface of the support ring 3.

[0078] The auxiliary pressing mechanism 7 is set on the tensioning seat 2 and located outside the suspended section 51. The auxiliary pressing mechanism 7 is connected to the lifting ring 4. When the lifting ring 4 descends to the second height, the auxiliary pressing mechanism 7 is configured to press the suspended section 51 downward under the drive of the lifting ring 4, so that the suspended section 51 presses the wafer ring.

[0079] When the lifting ring 4 rises to the first height, the auxiliary clamping mechanism is configured to release the suspended section 51 under the drive of the lifting ring 4.

[0080] The optional operating process of the wafer feeding device in this embodiment is as follows:

[0081] First, the lifting ring 4 is raised to a first height, so that the insertion port 52 and the clamping groove are higher than the upper end of the support ring 3. Then, the wafer ring is inserted into the clamping groove through the insertion port 52. After the wafer ring is inserted into place, the carrier film carrying the chip covers the support ring 3.

[0082] Next, the lifting ring 4 is lowered to the second height, and the peripheral part of the carrier film is lowered to a position below the upper surface of the support ring 3 by the pressure plate 5 and the lifting ring 4, so that the middle part of the carrier film is tensioned on the upper surface of the support ring 3. At the same time, the auxiliary pressing mechanism 7 is pressed down on the suspended section 51 by the lifting ring 4, so that the suspended section 51 presses the wafer ring.

[0083] This completes the installation and fixation of the wafer ring, and the material handling device picks up and loads the wafers from the carrier film.

[0084] Once the wafer on the carrier film is removed, the control lifting ring 4 rises again to the first height. The auxiliary clamping mechanism, driven by the lifting ring 4, releases the suspended section 51. Simultaneously, the peripheral portion of the carrier film rises under the influence of the pressure plate 5 and the lifting ring 4, thus detaching from the support ring 3. At this point, the removed wafer ring can be extracted from the clamping groove through the insertion port 52, and then replaced with a new wafer ring.

[0085] The wafer feeding device in this embodiment includes an auxiliary pressing mechanism 7 disposed on the tensioning seat 2 and located outside the suspended section 51 of the pressure plate 5. When the lifting ring 4 descends to the second height and the support ring 3 tensions the peripheral part of the bearing film upward, the auxiliary pressing mechanism 7 presses the suspended section 51 of the pressure plate 5 downward under the drive of the lifting ring 4, thereby ensuring that the suspended section 51 can be effectively pressed onto the wafer ring located at the insertion port 52, thereby improving the pressing effect of the pressure plate 5 on the wafer ring and preventing the wafer ring from tilting.

[0086] like Figures 9 to 11 As shown, optionally, the auxiliary clamping mechanism 7 includes a rack 71, a connecting rod 72, a gear 73, and a clamping claw 74, wherein:

[0087] The rack 71 is mounted vertically on the tensioner 2.

[0088] The connecting rod 72 is rotatably mounted on the lifting ring 4. The connecting rod 72 extends horizontally. The gear 73 is fitted on the connecting rod 72 and meshes with the rack 71. The pressure claw 74 is connected to the connecting rod 72.

[0089] When the lifting ring 4 descends from the first height to the second height, the rack 71 drives the connecting rod 72 to rotate in the first clockwise direction (such as clockwise direction) via the gear 73. The connecting rod 72 drives the pressure claw 74 to rotate toward the suspended section 51, so that the pressure claw 74 presses down on the suspended section 51.

[0090] When the lifting ring 4 rises from the second height toward the first height, the rack 71 drives the connecting rod 72 to rotate in the second clockwise direction (such as counterclockwise direction) via the gear 73. The connecting rod 72 drives the pressure claw 74 to rotate away from the suspended section 51, so that the pressure claw 74 releases the suspended section 51.

[0091] As can be seen, by configuring the auxiliary pressing mechanism 7, it can be driven by the lifting ring 4, achieving follow-up movement with the lifting ring 4. Ultimately, when the lifting ring 4 descends from the first height to the second height, the auxiliary pressing mechanism 7 synchronously presses down on the suspended section 51. When the lifting ring 4 rises from the second height to the first height, the auxiliary pressing mechanism 7 synchronously releases the suspended section 51.

[0092] In other words, the auxiliary clamping mechanism 7 does not require additional drive components; its clamping and releasing operations are entirely triggered by the lifting ring 4. This configuration allows the auxiliary clamping mechanism 7 to simultaneously clamp or release the suspended section 51 as the lifting ring 4 rises to its designated position, thereby accelerating the work cycle and improving efficiency. Furthermore, since the auxiliary clamping mechanism 7 does not require additional drive components, it reduces equipment costs.

[0093] Of course, the auxiliary clamping mechanism 7 can also be an existing clamping mechanism with other structures that can clamp and release the suspended section 51.

[0094] like Figure 12 As shown, optionally, gear 73 has a tooth gap area 732, which lacks at least one tooth 731. When the lifting ring 4 is at the first height, the tooth gap area 732 is misaligned with the rack 71, and the teeth 732 on gear 73 mesh with the rack 71. When the lifting ring 4 is at the second height, the tooth gap area 732 abuts against the rack 71, and the teeth 731 on gear 73 disengage from the rack 71.

[0095] When the lifting ring 4 descends from the first height to the third height, the pressure claw 74 rotates downwards to its final position and presses against the suspended section 51. At this point, the tooth gap area 732 abuts against the rack 71, and the teeth 731 on the gear 73 disengage from the rack 71. As the lifting ring 4 continues to descend to the second height, the tooth gap area 732 slides on the rack, and the pressure claw 74 does not continue to rotate downwards. Instead, it presses against the suspended section 51 with a constant pressure. Therefore, the pressure claw 74 only rotates downwards to press against the suspended section 51 during the stroke of the lifting ring 4 from the first height to the third height, thus avoiding excessive downward pressure from the pressure claw 74, the suspended section 51 of the pressure plate 5, or the wafer ring, which could cause excessive deformation.

[0096] As the lifting ring 4 rises from the second height to the third height, the tooth gap area 732 slides on the rack 71, and the pressure claw 74 presses and holds it on the suspended section 51 with a constant pressure. When the lifting ring 4 reaches the third height, the teeth 731 on the gear 73 finally mesh with the rack 71. As the lifting ring 4 continues to rise to the first height, the pressure claw 74 rotates upward under the drive of the gear 73 and moves away from the suspended section 51 to release the suspended section 51. When the lifting ring 4 reaches the first height, the tooth gap area 732 is completely disengaged from the rack 71. It can be seen that the pressure claw 74 only rotates upward to release the suspended section 51 within the stroke of the lifting ring 4 from the third height to the first height, avoiding excessive rotation of the pressure claw 74 and interference with components such as the tensioning seat 2.

[0097] The third altitude mentioned above is located between the first altitude and the second altitude; for example, the third altitude is located in the middle of the first altitude and the second altitude.

[0098] like Figure 10 As shown, optionally, the suspended section 51 has a notch in the middle, which divides the suspended section 51 into a first suspended section 511 and a second suspended section 512. The auxiliary clamping mechanism 7 includes a first clamping claw 741 and a second clamping claw 742 that are spaced apart on the connecting rod 72, i.e., the clamping claws are spaced apart by two. Wherein:

[0099] The first pressure claw 741 is used to press and release the first suspended section 511, and the second pressure claw 742 is used to press and release the second suspended section 512.

[0100] The suspended section 51 is divided into a first suspended section 511 and a second suspended section 512. On the one hand, this makes it easier to insert the wafer ring into the clamping groove between the pressure plate 5 and the lifting ring 4. On the other hand, the first clamping claw 741 and the second clamping claw 742 can respectively press down on the first suspended section 511 and the second suspended section 512 with their free ends, thereby making the first suspended section 511 and the second suspended section 512 more firmly pressed onto the wafer ring located at the insertion port, further improving the clamping effect of the suspended section 51 on the wafer ring.

[0101] To improve the clamping stability of the first clamping claw 741 on the first suspended section 511 and prevent slippage. Figure 10 As shown, optionally, the first suspended section 511 is provided with a first pressure tongue 513 extending outward from the first suspended section 511, and the first pressure claw 741 is pressed and released by the first pressure tongue 513.

[0102] Similarly, in order to improve the clamping stability of the second pressure claw 742 on the second suspended section 512 and prevent slippage, a second pressure tongue 514 is provided on the second suspended section 512, which extends outward. The second pressure claw 742 clamps and releases the second suspended section 512 through the second pressure tongue 514.

[0103] like Figures 4 to 5 and Figures 7 to 8 As shown, optionally, the lifting drive mechanism 6 includes a first drive unit 61, N first gears 62, a first synchronous belt 63, and a second gear 64, wherein:

[0104] N first gears 62 are arranged circumferentially on the tensioning seat 2. Each first gear 62 is mounted on the tensioning seat 2 via a first rotating shaft. The first synchronous belt 63 is fitted on the N first gears 62 and meshes with each of the first gears 62.

[0105] The bottom of the lifting ring 4 is provided with lifting screws that correspond one-to-one with the first gear 62 from the first to the (N-1)th gear, and the lower end of each lifting screw is screwed into the shaft hole of the corresponding first rotating shaft.

[0106] The second gear 64 and the Nth first gear 62 are coaxially mounted on the tensioning seat 2 via the second rotating shaft. The second gear 64 is located outside the first synchronous belt 63.

[0107] The first drive unit 61 is mounted on the mounting plate 1. The first drive unit 61 can be connected to the second gear 64 to drive the second gear 64 to rotate. When the second gear 64 rotates, the first gear 62 and the first synchronous belt 63 mounted on the same axis drive each first gear 62 to rotate synchronously. When each first gear 62 rotates synchronously, it drives each lifting screw to rise and fall, thereby driving the lifting ring 4 to rise and fall.

[0108] The first drive unit 61 synchronously drives several lifting screws arranged circumferentially at the bottom of the lifting ring 4 to rise and fall, thereby driving the lifting ring 4 to rise and fall, improving the stability of the lifting ring 4 and preventing the lifting ring 4 from tilting during the lifting process.

[0109] Optionally, N ≥ 3. That is, the lifting drive mechanism 6 includes at least 3 first gears 62.

[0110] like Figures 13 to 15 As shown, optionally, the first drive unit 61 includes a mounting base 611, a translation drive module 612, a rotation drive module 613, and a drive gear 614, wherein:

[0111] Mounting base 611 is mounted on mounting plate 1 and located on the side of tensioning seat 2. Translation drive module 612 is mounted on mounting base 611. Rotation drive module 613 is slidably connected to mounting base 611 and is drively connected to translation drive module 612. Drive gear 614 is connected to the moving part of rotation drive module 613.

[0112] The translation drive module 612 is used to drive the drive gear 614 to translate toward or away from the second gear 64, so that the drive gear 614 meshes with or disengages from the second gear 64. When the drive gear 614 meshes with the second gear 64, the rotation drive module 613 drives the drive gear 614 to rotate, thereby driving the second gear 64 to rotate.

[0113] When it is necessary to drive the lifting ring 4 to move up and down, the translation drive module 612 drives the rotation drive module 613 and the drive gear 614 to move towards the second gear 64, so that the drive gear 614 meshes with the second gear 64. At this time, the rotation drive module 613 can drive the drive gear 614 to rotate to drive the lifting ring 4 to move up and down.

[0114] When the position of the lifting ring 4 needs to be adjusted, the translation drive module 612 drives the rotation drive module 613 and the drive gear 614 to translate away from the second gear 64, so that the drive gear 614 and the second gear 64 mesh and separate, preventing the lifting ring 4 from interfering with the translation drive module 612 when it moves.

[0115] The translation drive module 612 can be any existing linear drive module capable of driving the drive gear 614 to translate toward or away from the second gear 64, such as a cylinder module, a lead screw module, etc.

[0116] The rotary drive module 613 can employ various existing drive devices capable of driving the gear 614 to rotate. For example, the rotary drive module 613 adopts a worm gear reducer drive structure. The worm gear reducer drive has the advantages of large output torque and stable drive, which can further improve the lifting accuracy of the lifting ring 4. Specifically, the rotary drive module 613 includes a drive component (such as a motor), a worm gear 617, and a worm. The worm gear is connected to the drive end of the drive component and meshes with the worm gear 617. The drive gear 614 and the worm gear 617 are coaxially mounted on a connector (not shown in the figure) via a rotating shaft. The connector is slidably mounted on the mounting base 611 and connected to the drive end of the translation drive module 612. The translation drive module 612 drives the worm gear 617 to reciprocate on the worm gear via the connector, thereby driving the drive gear 614 to move closer to or away from the second gear 64.

[0117] In addition, a photoelectric baffle 616 is installed on the drive end of the drive component. The photoelectric baffle 616 has a toothed groove. A photoelectric sensor is fixedly installed on the side of the photoelectric baffle corresponding to the position of the toothed groove. When the drive component rotates via the worm gear 617 and the worm drive gear 614, it synchronously drives the photoelectric baffle 616 to rotate. The photoelectric sensor senses the signal, counts the sensed signal, and calculates the rotation angle of the worm gear by combining it with the predefined toothed groove width. This allows for the detection of the movement position of the drive component and the control of the rotation angle of the drive gear 614, ultimately improving the accuracy of angle adjustment.

[0118] In addition, the worm gear transmission structure is stable and low in cost. Of course, the rotary drive module 613 can also use a servo motor or a stepper motor, etc., which will not be elaborated here.

[0119] Optionally, the first drive unit 61 further includes a locking pin 615, which is connected to a movable part of the translation drive module 612. When the translation drive module 612 drives the drive gear 614 to mesh with the second gear 64, the locking pin 615 is simultaneously inserted into a locking hole on the tensioning seat 2 that matches the locking pin 615, thereby ensuring a stable meshing between the drive gear 614 and the second gear 64 and preventing disengagement or slippage. When the translation drive module 612 drives the drive gear 614 to disengage from the second gear 64, the locking pin 615 is withdrawn from the locking hole, and the position of the tensioning seat 2 can be adjusted when the locking pin 615 is withdrawn from the locking hole.

[0120] like Figures 4 to 6 As shown, optionally, the tensioner 2 is rotatably mounted on the mounting plate 1. The wafer feeding device in this embodiment further includes a rotary drive mechanism 8 disposed on the mounting plate 1. The rotary drive mechanism 8 is used to drive the tensioner 2 to rotate in the horizontal plane, thereby driving the wafer ring to rotate in the horizontal plane. In this way, the angle of the wafer within the wafer ring can be flexibly adjusted, ensuring that the wafer picking device can smoothly pick up the wafer.

[0121] Optionally, the rotary drive mechanism 8 includes a second drive unit 81, a synchronous pulley 82, a second synchronous belt 83, and a gear disc 84, wherein the gear disc 84 is rotatably mounted on the mounting plate 1, and the tensioning seat 2 is fixedly mounted above the gear disc 84. The second synchronous belt 83 has meshing teeth that mesh with the outer circumference of the gear disc 84. The synchronous pulley 82 is mounted on the mounting plate 1 and is connected to the gear disc 84 via the second synchronous belt 83. The second drive unit 81 is disposed on the mounting plate 1 and is used to drive the synchronous pulley 82 to rotate, thereby causing the gear disc 84 and the tensioning seat 2 to rotate in the horizontal plane.

[0122] The tensioner 2 is rotated by means of a second synchronous belt 83 in conjunction with a gear disk 84, which improves the driving stability of the tensioner 2 and thus improves the angle adjustment accuracy of the wafer. Of course, other existing rotary drive mechanisms can also be used to drive the tensioner 2 to rotate.

[0123] The second drive unit 81 can be any existing drive component capable of driving the synchronous pulley 82 to rotate, such as a drive motor that is connected to the synchronous pulley 82 via a synchronous belt.

[0124] like Figures 1 to 3As shown, optionally, the wafer feeding device in this embodiment further includes a translation drive mechanism 9, with the mounting plate 1 horizontally disposed on the movable part of the translation drive mechanism 9. The translation drive mechanism 9 is used to drive the mounting plate 1 to translate in the horizontal plane, thereby driving the wafer ring to translate in the horizontal plane.

[0125] By setting up the translation drive mechanism 9, the horizontal position of the wafer ring is adjusted, thereby adjusting the position of the wafers on it. This ensures that before each wafer pick-up, the wafer to be picked up can be adjusted to the predetermined pick-up position, allowing the pick-up device to consistently pick up wafers from that position, improving pick-up efficiency. Furthermore, the translation drive mechanism 9 can also switch the drive mounting plate 1 between the loading position and the wafer pick-up position, facilitating manual material changes.

[0126] like Figure 1 As shown, optionally, the translation drive mechanism 9 includes a base plate 91, an X-axis translation drive (not shown), a sliding plate 92, and a Y-axis translation drive (not shown). The sliding plate 92 is slidably connected to the base plate 91. The X-axis translation drive is mounted on the base plate 91 and is driveably connected to the sliding plate 92. The X-axis translation drive is used to drive the sliding plate 92 to slide along the X-axis. The mounting plate 1 is slidably connected to the sliding plate 92. The Y-axis translation drive is mounted on the sliding plate and is driveably connected to the mounting plate. The Y-axis translation drive is used to drive the mounting plate to slide along the Y-axis.

[0127] Both the X-axis and Y-axis translation drives can utilize existing translation drives, such as cylinders and lead screw motors.

[0128] The foregoing has provided a sufficiently detailed and specific description of this application. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within the protection scope of this application. The scope of protection claimed in this application is defined by the claims, and not by the above descriptions in the embodiments.

Claims

1. A wafer supply device characterized by comprising: The wafer supply device is used for fixing a wafer ring, the wafer ring is tensioned with a carrying film carrying chips, and the wafer supply device comprises a mounting plate, a tensioning seat, a supporting ring, a lifting ring, a pressing plate, a lifting driving mechanism and an auxiliary pressing mechanism. The tensioning seat is arranged on the mounting plate, and the supporting ring is arranged on the tensioning seat. The lifting ring is arranged on the tensioning seat in a lifting manner and surrounds the outside of the supporting ring, the pressing plate is fixedly connected to the top end of the lifting ring, a pressing groove is formed between the pressing plate and the lifting ring, the pressing plate has a suspended segment, and an insertion opening is formed between the suspended segment and the lifting ring. The lifting driving mechanism is at least partially arranged on the mounting plate and is in transmission connection with the lifting ring, and the lifting driving mechanism is used for driving the lifting ring to switch between a first height and a second height, wherein the first height is higher than the second height. When the lifting ring rises to the first height, the insertion opening and the pressing groove are higher than the upper end of the supporting ring, the wafer ring can be inserted into the pressing groove through the insertion opening, and the carrying film covers the supporting ring. When the lifting ring descends to the second height, the circumferential part of the carrying film is lowered to a position below the upper surface of the supporting ring under the driving of the pressing plate and the lifting ring, and the middle part of the carrying film is tensioned on the upper surface of the supporting ring. The auxiliary pressing mechanism is arranged on the tensioning seat and located outside the suspended segment, the auxiliary pressing mechanism is in transmission connection with the lifting ring, and when the lifting ring descends to the second height, the auxiliary pressing mechanism is configured to press the suspended segment downward under the driving of the lifting ring, so that the suspended segment presses the wafer ring. When the lifting ring rises to the first height, the auxiliary pressing mechanism is configured to release the suspended segment under the driving of the lifting ring.

2. The wafer supply device according to claim 1, wherein The auxiliary pressing mechanism comprises a rack, a connecting rod, a gear and a pressing claw. The rack is arranged on the tensioning seat in a vertical direction. The connecting rod is rotatably mounted on the lifting ring, the connecting rod extends in a horizontal direction, the gear is sleeved on the connecting rod and is in meshing connection with the rack, and the pressing claw is connected to the connecting rod. When the lifting ring descends from the first height to the second height, the rack drives the connecting rod to rotate in a first clockwise direction through the gear, the connecting rod drives the pressing claw to rotate towards the suspended segment, so that the pressing claw presses the suspended segment downward. When the lifting ring rises from the second height to the first height, the rack drives the connecting rod to rotate in a second clockwise direction through the gear, the connecting rod drives the pressing claw to rotate away from the suspended segment, so that the pressing claw releases the suspended segment, and the first clockwise direction is opposite to the second clockwise direction.

3. The wafer supply device according to claim 2, wherein The gear has a tooth gap on it, and the tooth gap lacks at least one tooth. When the lifting ring is at the first height, the tooth gap is staggered with the rack, and the teeth on the gear are in meshing connection with the rack. When the lifting ring is at the second height, the tooth vacancy region is in abutment with the rack, and the teeth on the gear are disengaged from the rack; When the lifting ring is lowered from the first height to a third height, the pressing claw rotates downward to press the overhanging section, the tooth vacancy region is in abutment with the rack, and the teeth on the gear are disengaged from the rack; when the lifting ring continues to be lowered to the second height, the tooth vacancy region slides on the rack; When the lifting ring is raised from the second height to the third height, the tooth vacancy region slides on the rack, and the teeth on the gear are engaged with the rack; when the lifting ring continues to be raised to the first height, the tooth vacancy region is misaligned with the rack, and the pressing claw rotates upward away from the overhanging section; The third height is between the first height and the second height.

4. The wafer supply device according to claim 2, wherein The middle part of the overhanging section has a notch, which divides the overhanging section into a first overhanging section and a second overhanging section; The auxiliary pressing mechanism includes a first pressing claw and a second pressing claw connected to the connecting rod, wherein the first pressing claw is used to press and release the first overhanging section, and the second pressing claw is used to press and release the second overhanging section.

5. The wafer feeding device of claim 4, wherein: The first overhanging section is provided with a first pressure receiving tongue extending outward from the first overhanging section, and the first pressing claw presses and releases the first overhanging section through the first pressure receiving tongue; The second overhanging section is provided with a second pressure receiving tongue extending outward from the second overhanging section, and the second pressing claw presses and releases the second overhanging section through the second pressure receiving tongue.

6. The wafer supply device according to claim 1, wherein The lifting driving mechanism includes a first driving part, N first gears, a first synchronous belt, and a second gear, wherein: N first gears are arranged circumferentially on the tension seat, each first gear is installed on the tension seat through a first rotating shaft, and the first synchronous belt is sleeved on the N first gears and engaged with each first gear; The bottom of the lifting ring is provided with lifting leadscrews corresponding to the first to N-1 first gears, respectively, and the lower end of each lifting leadscrew is screwed into the shaft hole of the corresponding first rotating shaft; The second gear is coaxially installed on the tension seat with the Nth first gear through a second rotating shaft, and the second gear is located outside the first synchronous belt; The first driving part is arranged on the mounting plate, and the first driving part can be docked with the second gear to drive the second gear to rotate; when the second gear rotates, the first gears and the first synchronous belt coaxially installed drive each first gear to rotate synchronously, and each first gear drives each lifting leadscrew to lift to drive the lifting ring to lift when each first gear rotates synchronously.

7. The wafer supply device according to claim 6, wherein The first driving part includes a mounting seat, a translation driving module, a rotation driving module, and a driving gear, wherein: The mounting seat is arranged on the mounting plate and located at the side of the tension seat, and the translation driving module is arranged on the mounting seat; The rotation driving module is slidingly connected to the mounting seat and drivingly connected to the translation driving module, and the driving gear is connected to a movable part of the rotation driving module; The translation driving module is configured to drive the driving gear to translate towards or away from the second gear, so that the driving gear is engaged with or separated from the second gear, and when the driving gear is engaged with the second gear, the rotation driving module drives the driving gear to rotate, thereby driving the second gear to rotate.

8. The wafer supply device according to claim 7, wherein The rotation driving module comprises a driving member, a turbine, a worm, a photoelectric baffle and a photoelectric sensor, wherein: The worm is mounted on a driving end of the driving member and drivingly engaged with the turbine, the turbine is coaxially mounted with the driving gear on a connecting member, the connecting member is slidingly mounted on the mounting seat and connected to a driving end of the translation driving module; The photoelectric baffle is mounted on the driving end of the driving member, a tooth groove is formed in a periphery of the photoelectric baffle, and the photoelectric sensor is fixedly mounted on a side of the photoelectric baffle and arranged correspondingly to the tooth groove, the photoelectric sensor is configured to detect the movement position of the driving member in cooperation with the photoelectric baffle.

9. The wafer supply device according to claim 7, wherein The first driving part further comprises a locking pin connected to a movable part of the translation driving module; When the translation driving module drives the driving gear to engage with the second gear, the locking pin is inserted into a locking hole on the tensioning seat which matches the locking pin; When the translation driving module drives the driving gear to separate from the second gear, the locking pin is withdrawn from the locking hole.

10. The wafer supply device according to Claim 1, wherein The tensioning seat is rotatably mounted on the mounting plate, and the wafer feeding device further comprises a rotation driving mechanism arranged on the mounting plate, the rotation driving mechanism is configured to drive the tensioning seat to rotate in a horizontal plane, thereby driving the wafer ring to rotate in the horizontal plane; The rotation driving mechanism comprises a second driving part, a synchronous pulley, a second synchronous belt and a toothed disc, wherein: The toothed disc is rotatably mounted on the mounting plate, and the tensioning seat is fixedly mounted above the toothed disc; The second synchronous belt is provided with engagement teeth, the engagement teeth on the second synchronous belt are engaged with an outer periphery of the toothed disc, the synchronous pulley is mounted on the mounting plate and drivingly connected to the toothed disc through the second synchronous belt; The second driving part is arranged on the mounting plate, and the second driving part is configured to drive the synchronous pulley to rotate, thereby driving the toothed disc and the tensioning seat to rotate in the horizontal plane.

11. The wafer supply device according to Claim 1, wherein The wafer feeding device further comprises a translation driving mechanism, and the mounting plate is horizontally arranged on a movable part of the translation driving mechanism; The translation driving mechanism is configured to drive the mounting plate to translate in a horizontal plane, thereby driving the wafer ring to translate in the horizontal plane; The translation driving mechanism comprises a base plate, an X-axis translation driving member, a sliding plate and a Y-axis translation driving member, wherein: The sliding plate is slidingly connected to the base plate, the X-axis translation driving member is arranged on the base plate and drivingly connected to the sliding plate, and the X-axis translation driving member is configured to drive the sliding plate to slide along the X-axis; The mounting plate is slidingly connected to the sliding plate, and the Y-axis translation driving element is arranged on the sliding plate and drivingly connected to the mounting plate, and the Y-axis translation driving element is used to drive the mounting plate to slide along the Y-axis.

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