Wafer film thickness detection equipment

Abstract

The utility model discloses wafer film thickness detection equipment, which comprises a cabinet provided with a workbench, and the workbench is at least provided with a feeding station, a discharging station, an edge-finding calibration station, a measurement station and a turnover station. The device further comprises a first wafer placing mechanism arranged on the feeding station, a second wafer placing mechanism arranged on the discharging station, an edge searching calibration mechanism arranged on the edge searching calibration station, a measuring mechanism arranged on the measuring station, a carrying mechanism arranged on the turnover station and a controller. Each of the first wafer placement mechanism and the second wafer placement mechanism comprises a bottom support frame, a wafer box arranged on the bottom support frame and a first sensing unit for detecting whether a wafer extends to the outside of the wafer box, at least one end part of the wafer box is open, the first sensing unit is arranged on the bottom support frame and below the wafer box, and the wafer box is arranged on the bottom support frame; and the first sensing unit and the open end part of the wafer box are positioned on the same side of the bottom bracket, and the first sensing unit is positioned on the outer side of the open end part of the wafer box. The wafer film thickness detection equipment is small in structural size, and can ensure that the wafer is placed in the wafer box.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a wafer film thickness detection device. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. During wafer manufacturing, different film layers need to be formed, and the thickness of each film layer varies. The thickness of the film layers is one of the important parameters affecting the physical properties of the wafer. To accurately realize the circuit functions, the thickness of each film layer formed on the wafer surface needs to be precisely controlled to prevent the film layer from being too thick or too thin, which would cause the wafer to fail to meet requirements and affect the wafer yield.

[0003] Wafer film thickness is generally measured using film thickness testing equipment. Existing film thickness testing equipment has a complex structure for its loading and unloading mechanisms, which occupy a large space, resulting in a large overall size of the testing equipment. Furthermore, the loading and unloading mechanisms cannot guarantee that the wafers will be placed inside the wafer cassette, and when the wafers extend outside the wafer cassette, they are prone to damage and contamination. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a wafer film thickness detection device with a small structural size that can ensure that the wafer is placed in the wafer box.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A wafer film thickness inspection device, comprising:

[0007] A cabinet, wherein a workbench is provided inside the cabinet, and the workbench has at least a loading station, a unloading station, an edge-finding and calibration station, a measurement station and a turnover station;

[0008] The first wafer placement mechanism is set on the workbench and located at the loading station for loading wafers;

[0009] The second wafer placement mechanism is set on the workbench and located at the unloading station for unloading wafers;

[0010] An edge-finding calibration mechanism is set on the workbench and located at the edge-finding calibration station for edge-finding calibration of wafers.

[0011] A measuring mechanism is set on the workbench and located at the measuring station for measuring the film thickness of the wafer;

[0012] A conveying mechanism is provided on the workbench and located at the turnover station, for transferring wafers between the loading station, the unloading station, the edge-finding calibration station and the measurement station;

[0013] The controller is housed in a cabinet, and the conveying mechanism, the edge-finding calibration mechanism, and the measuring mechanism are all electrically connected to the controller.

[0014] Both the first wafer placement mechanism and the second wafer placement mechanism include a base support and a wafer cassette disposed on the base support. At least one end of the wafer cassette is open to form a channel for picking up and placing wafers. Both the first wafer placement mechanism and the second wafer placement mechanism also include a first sensing unit for detecting whether a wafer in the wafer cassette extends to the outside of the wafer cassette. The first sensing unit is disposed on the base support and below the wafer cassette. The first sensing unit and the open end of the wafer cassette are located on the same side of the base support, and the first sensing unit is located outside the open end of the wafer cassette. The first sensing unit is electrically connected to the controller.

[0015] In some embodiments, the detection device further includes a code reading and recognition mechanism, and the workbench also has a recognition station. The code reading and recognition mechanism is disposed on the workbench and at the recognition station.

[0016] In some embodiments, the loading station, the unloading station, the edge-finding calibration station, the measurement station, and the identification station are arranged circumferentially at intervals on the same circumference with the turnover station as the center.

[0017] In some embodiments, the edge-finding calibration mechanism and the code-reading identification mechanism are located on opposite sides of the conveying mechanism;

[0018] The first wafer placement mechanism and the second wafer placement mechanism are arranged adjacent to each other, both located on the same side of the transport mechanism, and both located on opposite sides of the measuring mechanism.

[0019] In some embodiments, the measuring mechanism includes a stage for placing a wafer and a film thickness gauge fixedly mounted on the stage. The film thickness gauge is located above the stage, and the stage is slidably mounted on the stage along the X-axis and Y-axis directions so that the measurement point on the wafer is within the measurement range of the film thickness gauge.

[0020] In some embodiments, the measuring mechanism further includes a first driving component for driving the stage to slide along the X-axis direction, a second driving component for driving the stage to slide along the Y-axis direction, and a mounting base. The mounting base is fixedly disposed on the worktable, the first driving component is fixedly disposed on the mounting base, the second driving component is fixedly disposed on the movable end of the first driving component, and the stage is fixedly disposed on the movable end of the second driving component.

[0021] In some embodiments, both the first drive component and the second drive component are linear motors.

[0022] In some embodiments, the testing device further includes a purified air filter, which is disposed inside the cabinet and above the workbench;

[0023] The testing equipment also includes an antistatic unit, which is located inside the cabinet, above the workbench, and below the purified air filter.

[0024] In some embodiments, both the first wafer placement mechanism and the second wafer placement mechanism further include a second sensing unit for sensing whether the wafer cassette is placed on the base support, the base support having a support surface that supports the wafer cassette, and the second sensing unit being disposed on the support surface.

[0025] In some embodiments, the cabinet includes a frame and a sealing plate surrounding the periphery of the frame, the workbench is disposed on the frame, and the first wafer placement mechanism, the second wafer placement mechanism, the edge-finding calibration mechanism, the measuring mechanism, the handling mechanism and the controller are all located within the enclosed space formed by the sealing plate.

[0026] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: In the wafer film thickness detection equipment of this utility model, the first wafer placement mechanism and the second wafer placement mechanism have simple structures, and both are integrated on the worktable, thereby making the overall wafer film thickness detection equipment small in size and occupying a small area. Moreover, in the first wafer placement mechanism and the second wafer placement mechanism, when the wafer partially protrudes outside the wafer cassette, it can be detected by the first sensing unit. The first sensing unit will send a signal to the controller, which can then issue a warning message. In this way, the placement position of the wafer can be adjusted by the handling mechanism to ensure that the wafer is placed inside the wafer cassette, thereby reducing wafer damage and contamination. Attached Figure Description

[0027] Appendix Figure 1 This is a three-dimensional schematic diagram of the wafer film thickness detection equipment in this embodiment;

[0028] Appendix Figure 2 This is one of the three-dimensional schematic diagrams of the wafer film thickness detection equipment of this embodiment after the sealing plate has been removed;

[0029] Appendix Figure 3 This is the second three-dimensional schematic diagram of the wafer film thickness detection equipment in this embodiment after the sealing plate has been removed;

[0030] Appendix Figure 4 This is a front view schematic diagram of the wafer film thickness detection equipment in this embodiment;

[0031] Appendix Figure 5 For the appendix Figure 4 sectional view along line AA;

[0032] Appendix Figure 6 This is a perspective view of the first wafer placement mechanism or the second wafer placement mechanism in this embodiment;

[0033] Appendix Figure 7 This is a perspective view of the first wafer placement mechanism or the second wafer placement mechanism of this embodiment after removing the wafer cassette;

[0034] Appendix Figure 8 This is a three-dimensional schematic diagram of the measuring mechanism in this embodiment after removing the film thickness detector.

[0035] Wherein: 11, rack; 12, sealing plate; 13, worktable; 2a, first wafer placement mechanism; 2b, second wafer placement mechanism; 21, base support; 211, support platform; 2111, groove; 212, support column; 22, wafer box; 221, side wall; 2211, slot; 231, first positioning block; 2311, first positioning surface; 2312, second positioning surface; 232, second positioning block; 2321, third positioning surface; 2322, fourth positioning surface; 2 4. First sensing unit; 251. First connecting plate; 2511. Connecting frame; 252. Second connecting plate; 2521. Elongated hole; 26. Second sensing unit; 27. Identification unit; 3. Edge-finding calibration mechanism; 4. Measuring mechanism; 41. Stage; 42. Film thickness gauge; 43. First drive assembly; 44. Second drive assembly; 45. Bracket; 46. Mounting base; 5. Transport mechanism; 6. Code reading and identification mechanism; 7. Purified air filter; 8. Operation display terminal. Detailed Implementation

[0036] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. Many specific details are set forth in the following description to provide a full understanding of the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed below.

[0037] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0042] like Figures 1-5 As shown, the wafer film thickness detection equipment of this utility model includes a cabinet, a first wafer placement mechanism 2a, a second wafer placement mechanism 2b, an edge-finding calibration mechanism 3, a measuring mechanism 4, a handling mechanism 5, and a controller.

[0043] The cabinet includes a rack 11 and a panel 12 surrounding the rack 11. A workbench 13 is provided on the rack 11 and is located in the middle of the rack 11.

[0044] The workbench 13 is equipped with at least a loading station, a unloading station, an edge-finding and calibration station, a measurement station, and a turnover station.

[0045] The first wafer placement mechanism 2a is mounted on the worktable 13 and located at the loading station. The first wafer placement mechanism 2a is used for loading wafers. The second wafer placement mechanism 2b is mounted on the worktable 13 and located at the unloading station. The second wafer placement mechanism 2b is used for unloading wafers.

[0046] The first wafer placement mechanism 2a and the second wafer placement mechanism 2b have the same structure, both including a base support 21 and a wafer box 22 disposed on the base support 21.

[0047] The base support 21 includes a support platform 211 and support columns 212. Multiple support columns 212 are provided, with each column positioned at one of the four corners of the support platform 211. The upper surface of the support platform 211 forms the support surface for supporting the wafer cassette 22.

[0048] The wafer cassette 22 has a receiving cavity for receiving wafers. At least one end of the receiving cavity of the wafer cassette 22 is open, thereby forming a channel for picking up and placing wafers.

[0049] Specifically, such as Figure 6As shown, the wafer box 22 includes sidewalls 221 located on opposite sides. Each sidewall 221 has multiple slots 2211. The multiple slots 2211 are arranged sequentially and spaced apart in the vertical direction. The positions of the slots 2211 on the sidewalls 221 on both sides correspond to each other. The slots 2211 on the sidewalls 221 on both sides are used to place the wafers.

[0050] The first wafer placement mechanism 2a and the second wafer placement mechanism 2b both include a positioning structure. When the wafer cassette 22 is placed on the base support 21, the positioning structure limits the position of the wafer cassette 22.

[0051] like Figure 2 As shown, the positioning structure includes a first positioning block 231 and a second positioning block 232. The first positioning block 231 is respectively disposed on opposite sides of one end of the support surface, and the second positioning block 232 is respectively disposed on opposite sides of the other end of the support surface.

[0052] The first positioning block 231 has a first positioning surface 2311 and a second positioning surface 2321. The first positioning surface 2311 extends along the length direction of the side wall 221, and the second positioning surface 2321 extends along the width direction of the side wall 221. When the wafer cassette 22 is placed on the base support 21, the first positioning surface 2311 abuts against the inner surface of the side wall 221 on the corresponding side of the wafer cassette 22, and the second positioning surface 2312 abuts against one end face of the side wall 221 on the corresponding side of the wafer cassette 22.

[0053] The second positioning block 232 has a third positioning surface 2321 and a fourth positioning surface 2322. The third positioning surface 2321 extends along the length direction of the side wall 221, and the fourth positioning surface 2322 extends along the width direction of the side wall 221. When the wafer cassette 22 is placed on the base support 21, the third positioning surface 2321 abuts against the outer surface of the side wall 221 on the corresponding side of the wafer cassette 22, and the fourth positioning surface 2322 abuts against the other end face of the corresponding side of the wafer cassette 22.

[0054] like Figure 6 and Figure 7 As shown, both the first wafer placement mechanism 2a and the second wafer placement mechanism 2b further include a first sensing unit 24. The first sensing unit 24 is used to detect whether the wafer inside the wafer cassette 22 extends outside the wafer cassette 22. The first sensing unit 24 is mounted on the base support 21, and the first sensing unit 24 and the open end of the wafer cassette 22 are located on the same side of the base support 21. The first sensing unit 24 is located outside the open end of the wafer cassette 22 and below the wafer cassette 22, corresponding to the position of the middle part of the wafer cassette 22.

[0055] The first sensing unit 24 is electrically connected to the controller to send the information detected by the first sensing unit 24 to the controller. When the first sensing unit 24 detects that the wafer extends outside the wafer cassette 22, the controller issues an alarm message to adjust the placement of the wafer to ensure that the wafer is placed inside the wafer cassette 22, thereby reducing wafer damage and contamination.

[0056] Preferably, the first sensing unit 24 is positioned adjustablely on the base support 21, so that the position of the first sensing unit 24 can be adjusted according to the position of the wafer cassette 22 on the base support 21, so that the position of the first sensing unit 24 corresponds to the position of the wafer cassette 22, thereby ensuring that the first sensing unit 24 can accurately detect whether the wafer extends to the outside of the wafer cassette 22.

[0057] Specifically, the first wafer placement mechanism 2a and the second wafer placement mechanism 2b both include a first connecting plate 251 and a second connecting plate 252. The first connecting plate 251 is fixedly connected to the base support frame 21, and the second connecting plate 252 is adjustablely connected to the first connecting plate 251. The first sensing unit 24 is fixedly disposed on the second connecting plate 252.

[0058] One of the first connecting plate 251 and the second connecting plate 252 is provided with a connecting hole 2511, and the other is provided with an oblong hole 2521. The position of the connecting hole 2511 corresponds to the position of the oblong hole 2521. The connector passes through the oblong hole 2521 and the connecting hole 2511 in sequence to connect the first connecting plate 251 and the second connecting plate 252.

[0059] In this embodiment, the support platform 211 has a groove 2111 in the middle that is concave from one end to the other end, and the first sensing unit 24 is disposed at the location of the groove 2111.

[0060] like Figure 7 As shown, both the first wafer placement mechanism 2a and the second wafer placement mechanism 2b also include a second sensing unit 26. The second sensing unit 26 is used to sense whether the wafer cassette 22 is placed on the base support 21. The second sensing unit 26 is disposed on the support surface of the support platform 211.

[0061] In this embodiment, two second sensing units 26 are provided, and the two second sensing units 26 are respectively arranged on opposite sides of the support surface of the support platform 211. Preferably, one second sensing unit 26 is arranged on the outer side of the first positioning surface 2311 on one of the opposite sides, and the other second sensing unit 26 is arranged on the inner side of the third positioning surface 2321 on the other side.

[0062] The second sensing unit 26 is electrically connected to the controller to send the information detected by the second sensing unit 26 to the controller.

[0063] The wafer box 22 is equipped with RFID. For example... Figure 6 and Figure 7 As shown, both the first wafer placement mechanism 2a and the second wafer placement mechanism 2b include an identification unit 27. The identification unit 27 is used to identify the RFID information of the wafer cassette 22. The identification unit 27 is disposed on the support surface of the support platform 211 and corresponds to the position on the wafer cassette 22 where the RFID information is disposed. The identification unit 27 is electrically connected to the controller to send the information identified by the identification unit 27 to the controller.

[0064] Edge-finding calibration mechanism 3 is mounted on the workbench 13 and located at the edge-finding calibration station. Edge-finding calibration mechanism 3 is used for edge-finding calibration of wafers. Edge-finding calibration mechanism 3 can adopt a structure from the prior art.

[0065] The measuring mechanism 4 is set on the worktable 13 and located at the measuring station. The measuring mechanism 4 is used to measure the wafer film thickness.

[0066] like Figure 2 , Figure 3 and Figure 8 As shown, the measuring mechanism 4 includes a stage 41, a film thickness detector 42, a first drive assembly 43, and a second drive assembly 44.

[0067] The stage 41 is used to place the wafer. The stage 41 can be slidably set on the worktable 13 along the X-axis and Y-axis directions so that the measurement point on the wafer can be within the measurement range of the film thickness gauge 42.

[0068] The film thickness gauge 42 is fixedly mounted on the worktable 13, and is located above the stage 41. In this embodiment, a support 45 is fixedly mounted on the worktable 13, and the film thickness gauge 42 is fixedly mounted on the support 45.

[0069] The first drive assembly 43 is used to drive the stage 41 to slide along the X-axis direction, and the second drive assembly 44 is used to drive the stage 41 to slide along the Y-axis direction.

[0070] Specifically, the measuring mechanism 4 also includes a mounting base 46, which is fixedly mounted on the worktable 13. The first drive assembly 43 is fixedly mounted on the mounting base 46, the second drive assembly 44 is fixedly mounted on the movable end of the first drive assembly 43, and the stage 41 is fixedly mounted on the movable end of the second drive assembly 44.

[0071] In this embodiment, both the first drive component 43 and the second drive component 44 are linear motors. This results in a simple structure, high response speed and sensitivity, and also offers advantages such as high precision, low noise, and high reliability.

[0072] The testing equipment also includes a code reading and identification mechanism 6, and the workbench 13 has an identification station. The code reading and identification mechanism 6 is mounted on the workbench 13 and positioned at the identification station. The code reading and identification mechanism 6 is used to identify the ID information of the wafer, and the code reading and identification mechanism 6 can adopt a structure found in existing technologies.

[0073] The transport mechanism 5 is mounted on the workbench 13 and located at the turnover station. The transport mechanism 5 is used to transfer the wafer between the loading station, unloading station, edge-finding and calibration station, identification station, and measurement station. The transport mechanism 5 can adopt the structure of the prior art.

[0074] The loading station, unloading station, edge-finding calibration station, measurement station, and identification station are arranged circumferentially at intervals on the same circumference with the turnover station as the center. The edge-finding calibration mechanism 3 and the code reading and identification mechanism 6 are located on opposite sides of the transport mechanism 5. The first wafer placement mechanism 2a and the second wafer placement mechanism 2b are arranged adjacent to each other, both located on the same side of the transport mechanism 5, and both are located on opposite sides of the transport mechanism 5 along with the measurement mechanism 4. This arrangement of the components makes the testing equipment compact and small in size.

[0075] The controller is installed in the cabinet. The edge-finding calibration mechanism 3, the film thickness detector 42, the first drive component 43, the second drive component 44, the handling mechanism 5, and the code reading and identification mechanism 6 are all electrically connected to the controller.

[0076] The testing equipment also includes a purified air filter 7, which is mounted on the rack 11 and positioned above the worktable 13. The purified air filter 7 ensures that the worktable 13 is in a dust-free environment, preventing wafer surface contamination and improving wafer yield.

[0077] The testing equipment also includes an antistatic unit, which is mounted on the frame 11, above the worktable 13, and below the purified air filter 7. The antistatic unit is a plasma air bar. When measuring the film thickness of a wafer, the plasma air bar eliminates static electricity on the wafer surface, preventing interference with the film thickness gauge 42's inspection of the wafer and improving the accuracy of the inspection results.

[0078] The testing equipment also includes an operation display terminal 8, which is located outside the cabinet and electrically connected to the controller.

[0079] In this embodiment, the first wafer placement mechanism 2a, the second wafer placement mechanism 2b, the edge-finding calibration mechanism 3, the measuring mechanism 4, the handling mechanism 5, the code reading and identification mechanism 6, the controller, the purified air filter 7, and the static electricity removal unit are all located within the enclosed space formed by the sealing plate.

[0080] The working principle of this testing equipment is as follows:

[0081] (1) Loading: A wafer in the first wafer placement mechanism 2a is picked up and placed at the edge-finding calibration station by the conveying mechanism 5.

[0082] (2) Edge finding calibration: The edge finding calibration mechanism 3 performs edge finding and alignment on the wafer so that the grooves or flat slots on the wafer face the set position.

[0083] (3) Reading code: The wafer after edge calibration is transported to the identification station by the transport mechanism 5 and the wafer ID information is read by the code reading and identification mechanism 6.

[0084] (4) Measurement: The wafer after reading the code is transported to the stage 41 at the measurement station by the transport mechanism 5. The first drive component 43 and the second drive component 44 move the wafer on the stage 41 in the X-axis and Y-axis directions until it moves into the detection range of the film thickness detector 42. The film thickness of the wafer is measured by the film thickness detector 42.

[0085] (5) Unloading: The measured wafer is transported to the second wafer placement mechanism 2b by the transport mechanism 5.

[0086] This process is repeated to sequentially inspect each wafer within the first wafer placement mechanism 2a.

[0087] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A wafer film thickness detecting apparatus characterized by comprising: The utility model relates to a kind of wafer film thickness detection equipment, including: Cabinet, workbench is arranged in the cabinet, the workbench at least has feeding station, discharging station, edge finding calibration station, measurement station and turnover station; First wafer placement mechanism, it is arranged on the workbench and is located at the feeding station, for the feeding of wafer; Second wafer placement mechanism, it is arranged on the workbench and is located at the discharging station, for the discharging of wafer; Edge finding calibration mechanism, it is arranged on the workbench and is located at the edge finding calibration station, for the edge finding calibration of wafer; Measurement mechanism, it is arranged on the workbench and is located at the measurement station, for the film thickness of wafer is measured; Carrying mechanism, it is arranged on the workbench and is located at the turnover station, for wafer is turned over between the feeding station, the discharging station, the edge finding calibration station and the measurement station; Controller, it is arranged in cabinet, the carrying mechanism, the edge finding calibration mechanism and the measurement mechanism are electrically connected with the controller; The first wafer placement mechanism and the second wafer placement mechanism all include bottom support frame and wafer cassette arranged on the bottom support frame, at least one end of the wafer cassette is open to form the passageway of wafer taking and placing, the first wafer placement mechanism and the second wafer placement mechanism also all include first sensing unit for detecting whether the wafer in the wafer cassette extends to the outside of the wafer cassette, the first sensing unit is arranged on the bottom support frame and is arranged below the wafer cassette, the first sensing unit is located on the same side of the open end of the wafer cassette with the open end of the wafer cassette, and the first sensing unit is located outside the open end of the wafer cassette, the first sensing unit is electrically connected with the controller.

2. The wafer film thickness detecting apparatus according to claim 1, characterized by: The detection device further includes a code reading recognition mechanism, and the workbench further has an identification station.

3. The wafer film thickness detecting apparatus according to claim 2, characterized by: The feeding station, the discharging station, the edge finding calibration station, the measurement station and the identification station are arranged on the same circumference with the turnover station as the center.

4. The wafer film thickness detecting apparatus according to claim 2, characterized by: The edge finding calibration mechanism and the code reading recognition mechanism are located on opposite sides of the carrying mechanism. The first wafer placement mechanism and the second wafer placement mechanism are arranged adjacent to each other and located on the same side of the carrying mechanism, and the measurement mechanism is located on opposite sides of the carrying mechanism.

5. The wafer film thickness detecting apparatus according to claim 1, characterized by: The measurement mechanism includes a stage for placing a wafer and a film thickness detector fixedly arranged on the workbench, the film thickness detector is located above the stage, and the stage is slidably arranged on the workbench in the X-axis direction and the Y-axis direction, so that the measurement position on the wafer is located within the measurement range of the film thickness detector.

6. The wafer film thickness detecting apparatus according to claim 5, characterized by: The measuring mechanism further comprises a first driving assembly for driving the carrier to slide along the X-axis direction, a second driving assembly for driving the carrier to slide along the Y-axis direction, and a mounting base fixedly arranged on the workbench, the first driving assembly being fixedly arranged on the mounting base, and the second driving assembly being fixedly arranged on the movable end of the first driving assembly, and the carrier being fixedly arranged on the movable end of the second driving assembly.

7. The wafer film thickness detecting apparatus according to claim 6, characterized by: The first driving assembly and the second driving assembly are both linear motors.

8. The wafer film thickness detecting apparatus according to claim 1, characterized by: The detection device further comprises a purified air filter arranged in the cabinet and above the workbench. The detection device further comprises an electrostatic elimination unit arranged in the cabinet, above the workbench, and below the purified air filter.

9. The wafer film thickness detecting apparatus according to claim 1, characterized by: The first wafer placing mechanism and the second wafer placing mechanism further each comprise a second sensing unit for sensing whether the wafer cassette is placed on the bottom support frame, the bottom support frame having a support surface for supporting the wafer cassette, and the second sensing unit being arranged on the support surface.

10. The wafer film thickness detecting apparatus according to claim 1, characterized by: The cabinet comprises a rack and an enclosing plate enclosing the periphery of the rack, the workbench being arranged on the rack, and the first wafer placing mechanism, the second wafer placing mechanism, the edge-finding and aligning mechanism, the measuring mechanism, the carrying mechanism, and the controller all being located in the enclosed space enclosed by the enclosing plate.

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