Semiconductor material ultrasonic cleaning device

Abstract

The utility model discloses an ultrasonic cleaning device for semiconductor materials, which relates to the technical field of semiconductor cleaning equipment, and adopts the scheme that the ultrasonic cleaning device for the semiconductor materials comprises a cleaning box and a cleaning tank, the cleaning tank is arranged on the cleaning box, and a first butting port is formed in the bottom of the cleaning tank; a slag discharging opening is formed in the bottom of the cleaning tank; the liquid storage tank is arranged on the cleaning box, and a second butt joint opening is formed in the bottom of the liquid storage tank; the multiple vibrators are arranged at the bottom of the cleaning tank in an array mode; the cleaning basket is installed on the cleaning box, and at least part of the cleaning basket is located in the cleaning tank; one end of the connecting pipe is connected with the first butt joint opening, the other end of the connecting pipe is connected with the second butt joint opening, and a centrifugal pump is installed on the connecting pipe; the filter screen is mounted at the first butt joint port; and the labor intensity of process operators can be reduced, the labor cost is saved, external magazines are prevented from entering the cleaning mechanism, and the risk of secondary pollution is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning equipment technology, and specifically to an ultrasonic cleaning device for semiconductor materials. Background Technology

[0002] During the production, transportation, and processing of semiconductor materials, various particulate impurities such as dust and metal particles inevitably adsorb onto them. If these particles are not removed, they may cause problems such as photolithography pattern deformation and uneven etching in subsequent processes such as photolithography and etching, leading to defects in the chip's circuit structure and affecting chip performance and yield. Cleaning semiconductor materials is crucial for semiconductor manufacturing, primarily to remove impurities and contaminants, improve surface properties, enhance manufacturing process precision, and ensure product reliability.

[0003] According to the patent authorization announcement number (CN118874947A), a silicon wafer ultrasonic cleaning machine includes a support mechanism. A loading rack is fixedly connected to one side of the center of the support mechanism, a cleaning mechanism is fixedly installed in the center of the support mechanism, and a unloading rack is fixedly connected to the other side of the center of the support mechanism. A lifting mechanism is installed on one side of the center of the cleaning mechanism, and cleaning baskets are provided on both the loading rack and the cleaning mechanism. The structure disclosed in this patent has defects in practical applications, specifically as follows: After prolonged cleaning of semiconductor materials in the cleaning mechanism, a large number of particles will remain inside the cleaning mechanism. There is no separation device installed in the cleaning mechanism to handle the residual particles, requiring a prolonged shutdown of the entire system for slag removal. The process operator needs to manually clean the residual particles inside the cleaning mechanism, which not only increases the physical exertion of the process operator but also may introduce impurities into the cleaning mechanism, creating a risk of secondary contamination. Utility Model Content

[0004] The purpose of this invention is to provide an ultrasonic cleaning device for semiconductor materials, which addresses the problems of increased labor intensity for process operators and secondary contamination within the cleaning mechanism in existing technologies. It provides a solution that reduces the labor intensity for process operators, saves labor costs, and prevents external impurities from entering the cleaning mechanism, thereby reducing the risk of secondary contamination.

[0005] This utility model is achieved through the following technical solution:

[0006] An ultrasonic cleaning device for semiconductor materials includes: a cleaning tank; a cleaning tank disposed on the cleaning tank, with a first pair of interfaces and a slag discharge port at the bottom of the cleaning tank; a liquid storage tank disposed on the cleaning tank, with a second pair of interfaces at the bottom of the liquid storage tank; multiple transducers arranged in an array at the bottom of the cleaning tank; at least one cleaning basket mounted on the cleaning tank, with at least a portion of the cleaning basket located within the cleaning tank; a connecting pipe, one end of which is connected to the first pair of interfaces and the other end of which is connected to the second pair of interfaces, with a centrifugal pump mounted on the connecting pipe; and a filter screen mounted on the first pair of interfaces.

[0007] Furthermore, in this utility model, the above also includes a first guide component and a second guide component; a storage tank is provided circumferentially along the edge of the bottom of the cleaning tank, and the storage tank is connected to the slag discharge port; the first guide component can guide the residue in the cleaning tank to the storage tank; the second guide component can guide the residue in the storage tank to the slag discharge port, and discharge the residue from the slag discharge port.

[0008] Furthermore, in this utility model, the aforementioned first guiding component includes: a drive motor, a rotating shaft, a rotating component, guide vanes, and a first mounting groove disposed within the cleaning tank; the first mounting groove is located below the cleaning tank; the drive motor is mounted on the inner wall of the first mounting groove, the output end of the drive motor is connected to the rotating shaft, the rotating shaft extends through the bottom end of the cleaning tank into the cleaning tank, the rotating shaft is connected to the rotating component within the cleaning tank, and the rotating component is circumferentially equipped with multiple guide vanes; wherein, the guide vanes can guide the residue in the cleaning tank to the storage tank.

[0009] Furthermore, in this utility model, the second guide assembly includes a guide rod, one end of which is connected to a rotating member, and the other end of which extends into the storage tank.

[0010] Furthermore, in this utility model, a second mounting groove is provided at the end of the guide rod; an elastic element is installed in the second mounting groove, and a scraping element is connected to the elastic element, which can abut against the surface wall of the storage tank; the size of the scraping element is larger than the size of the slag discharge port.

[0011] Furthermore, in this invention, the bottom of the cleaning box is equipped with multiple casters.

[0012] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0013] By utilizing a storage tank and a cleaning tank to mutually transfer cleaning fluid, residual particles are trapped within the cleaning tank and then discharged from the slag outlet. This significantly improves the efficiency of the cleaning operation, eliminating the need for prolonged system shutdowns to clean the cleaning tank. Furthermore, it eliminates the need for operators to spend considerable time handling residual particles, saving labor costs and allowing for more efficient allocation of manpower to other critical tasks. It also eliminates the need for operators to manually remove residual particles from the cleaning tank, preventing the introduction of external impurities and reducing the risk of secondary contamination. A clean cleaning tank ensures more uniform contact of the cleaning fluid with the semiconductor material surface, guaranteeing consistent cleaning results and reducing defects such as uneven surface etching and residual stains caused by uneven cleaning. This contributes to improving the smoothness and gloss of the semiconductor material surface, meeting the stringent surface quality requirements of high-end semiconductor manufacturing. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of an ultrasonic cleaning device for semiconductor materials.

[0016] Figure 2 This is a longitudinal sectional view of the cleaning tank;

[0017] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0018] Figure 4 This is a schematic diagram of the rotating component;

[0019] Figure 5 This is a schematic diagram of the interior of the second mounting slot.

[0020] The attached diagram shows the markings and corresponding component names:

[0021] 1-Cleaning tank, 2-Cleaning basket, 3-Wheel casters, 4-Cleaning tank, 5-Storage tank, 6-Connecting pipe, 7-Centrifugal pump, 8-First pair of interfaces, 9-Second pair of interfaces, 10-Filter screen, 11-First mounting slot, 12-Drive motor, 13-Rotating component, 14-Miscellaneous waste storage tank, 15-Guide vane, 16-Slag discharge port, 17-Guide rod, 18-Second mounting slot, 19-Elastic component, 20-Scraping component, 21-Rotating shaft. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model. Example

[0023] Please refer to Figure 1 and Figure 2 In some embodiments of this application, the cleaning tank 1 is provided with a cleaning tank 4 and a storage tank 5, which are located on opposite sides of the cleaning tank 1. The cleaning tank 4 is cylindrical in shape, and multiple cleaning baskets 2 can be installed on the top of the cleaning tank 4. The cleaning baskets 2 are at least partially located inside the cleaning tank 4, thereby ensuring that the semiconductor material inside the cleaning baskets 2 can be completely immersed in the cleaning solution. Multiple vibrators are arranged in an array at the bottom of the cleaning tank 4, and multiple vibrators can also be arranged in an array on the sidewalls of the cleaning tank 4, which can enhance the uniformity of the vertical sound field. An ultrasonic generator is installed outside the cleaning tank 4, and the ultrasonic generator can provide high-frequency electrical energy to the vibrators. One end of the connecting pipe 6 is connected to the first pair of interfaces 8 of the cleaning tank 4 (the first pair of interfaces 8 are equipped with a filter screen 10), and the other end of the connecting pipe 6 is connected to the second pair of interfaces 9 of the storage tank 5. A centrifugal pump 7 is installed on the connecting pipe 6. The centrifugal pump 7 rotates in the forward direction to transport the cleaning solution in the cleaning tank 4 to the storage tank 5, and rotates in the reverse direction to transport the cleaning solution in the storage tank 5 to the cleaning tank 4.

[0024] Working Principle: The process operator needs to periodically remove residual particles from cleaning tank 4. After stopping the operation of cleaning tank 1, the cleaning solution in cleaning tank 4 is transferred to storage tank 5 through connecting pipe 6. The residual particles in cleaning tank 4 are intercepted by filter screen 10. When all the cleaning solution in cleaning tank 4 has been transferred to storage tank 5, the centrifugal pump 7 is stopped. The process operator can add pure water to cleaning tank 4. The residual particles in cleaning tank 4 mix with the pure water. The slag discharge port 16 is opened, and the pure water mixed with residual particles is discharged from the slag discharge port 16. The slag discharge port 16 is then sealed. Finally, the cleaning solution after cleaning in storage tank 5 is transferred to cleaning tank 4, and the semiconductor materials can continue to be cleaned. By using storage tank 5 and cleaning tank 4 to transfer cleaning solution between each other, residual particles are intercepted in cleaning tank 4, and finally discharged from slag discharge port 16. This greatly improves the efficiency of the cleaning operation and eliminates the need to stop the entire system for a long time to clean cleaning tank 4. Moreover, it eliminates the need for process operators to spend a significant amount of time handling residual particles, saving labor costs and allowing human resources to be more rationally allocated to other more demanding work processes. It also eliminates the need for process operators to manually clean residual particles inside the cleaning tank 4, avoiding the introduction of external impurities into the cleaning tank 4 and reducing the risk of secondary contamination. A clean cleaning tank 4 allows the cleaning solution to contact the semiconductor material surface more evenly, ensuring consistent cleaning results and reducing defects such as uneven surface etching and residual stains caused by uneven cleaning. This helps improve the smoothness and gloss of the semiconductor material surface, meeting the stringent surface quality requirements of high-end semiconductor manufacturing.

[0025] Please refer to Figures 2 to 4 In some embodiments of this application, a storage tank 14 is provided circumferentially along the bottom edge of the cylindrical cleaning tank 4, and the storage tank 14 is annular. A first guide member can move within the cleaning tank 4, thereby pushing the residual particles at the bottom of the cleaning tank 4 into the storage tank 14. A second guide member can move within the storage tank 14, thereby pushing the residual particles in the storage tank 14 towards the slag discharge port 16. Finally, the residual particles are discharged from the slag discharge port 16.

[0026] For example, the first guide assembly consists of a drive motor 12, a rotating shaft 21, a rotating element 13, guide vanes 15, and a first mounting groove 11. The first mounting groove 11 is located inside the cleaning tank 1 and is directly below the cleaning tank 4. The drive motor 12 is mounted on the inner wall of the first mounting groove 11. The output end of the drive motor 12 is connected to the rotating shaft 21. The rotating shaft 21 passes through the gap between the cleaning tank 4 and the first mounting groove 11 and extends into the cleaning tank 4. A mechanical seal can be used between the rotating shaft 21 and the cleaning tank 4 to form a sealing surface to prevent leakage of cleaning fluid. A rotating element 13 is mounted on the end of the rotating shaft 21, and multiple guide vanes 15 are mounted circumferentially on the rotating element 13. Working principle: The drive motor 12 is started, which drives the rotating shaft 21 to rotate. The rotating shaft 21 drives the rotating component 13 to rotate. The rotating component 13 drives multiple guide vanes 15 to rotate. The multiple guide vanes 15 make circular motion at the bottom of the cleaning tank 4, which can push the residual particles at the bottom of the cleaning tank 4 to move. Under the action of centrifugal force, the residual particles move towards the edge of the cleaning tank 4 until the residual particles fall into the storage tank 14. Finally, the second guide component pushes the residual particles in the storage tank 14 to move until the residual particles are discharged from the slag discharge port 16.

[0027] For example, the guide rod 17 can be L-shaped, with one end connected to the rotating member 13 and the other end extending into the storage tank 14. When the rotating member 13 rotates, it can drive the guide rod 17 to rotate, and the end of the guide rod 17 makes a circular motion within the storage tank 14. The guide rod 17 can push the residual particles to make a circular motion within the storage tank 14. When the residual particles move to the slag discharge port 16, they can be discharged from the slag discharge port 16, thereby quickly discharging the residual particles in the washing tank 4 and improving the slag discharge efficiency.

[0028] Please refer to Figures 2 to 5 For example, the end of the guide rod 17 has a second mounting groove 18. One end of the elastic member 19 is connected to the surface wall of the second mounting groove 18, and the other end of the elastic member 19 is connected to the scraper 20. The scraper is at least partially located in the second mounting groove 18, and the tube sheet can be slidably connected to the inner wall of the second mounting groove 18. The scraper is in constant contact with the surface of the impurity storage tank 14. Working principle: The scraper 20 can make a circular motion in the impurity storage tank 14. The scraper 20 abuts against the surface of the impurity storage tank 14, which can push finer residual particles, thereby improving the cleaning quality in the cleaning tank 4. The size of the scraper 20 is larger than the size of the slag discharge port 16, so the scraper 20 will not pass through the slag discharge port 16 when it moves to the slag discharge port 16.

[0029] Among them, the elastic element 19 can be an ethylene propylene rubber spring. ethylene propylene rubber springs have excellent weather resistance, ozone resistance, and water resistance, and exhibit good resistance to most polar and non-polar solvents, as well as acid and alkali solutions. In various types of cleaning fluids, ethylene propylene rubber springs are highly likely to operate stably for extended periods and are not easily corroded or damaged. Elastic element 19 can also be a fluororubber spring. Fluororubber springs have extremely high chemical stability and can withstand various strong acids, strong alkalis, organic solvents, and strong oxidants. They maintain good performance in most harsh cleaning fluid environments and can operate for extended periods.

[0030] Please refer to Figure 1 In some embodiments of this application, four casters 3 are installed at the bottom of the cleaning tank 1, and the four casters 3 are distributed in a matrix. After the casters 3 are installed, the process operator can easily push the cleaning tank 1 to move between different work areas and flexibly adjust the position of the cleaning tank 1 according to the actual cleaning needs, without having to spend a lot of manpower to move it or use other lifting equipment, thus improving the convenience of the work.

[0031] In summary, the embodiments of this utility model provide an ultrasonic cleaning device for semiconductor materials. It utilizes a storage tank 5 and a cleaning tank 4 to mutually transport cleaning fluid, trapping residual particles within the cleaning tank 4. Finally, the residual particles are discharged from the slag outlet 16, significantly improving the efficiency of the cleaning operation. It eliminates the need for prolonged system shutdowns to clean the cleaning tank 4. Furthermore, it eliminates the need for operators to spend significant time handling residual particles, saving labor costs and allowing for more efficient allocation of human resources to other more critical tasks. It also eliminates the need for operators to manually clean residual particles within the cleaning tank 4, preventing the introduction of external impurities and reducing the risk of secondary contamination. A clean cleaning tank 4 ensures more uniform contact between the cleaning fluid and the semiconductor material surface, guaranteeing consistent cleaning results and reducing defects such as uneven surface etching and residual stains caused by uneven cleaning. This contributes to improving the smoothness and gloss of the semiconductor material surface, meeting the stringent surface quality requirements of high-end semiconductor manufacturing.

[0032] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. An apparatus for ultrasonic cleaning of a semiconductor material, characterized by The utility model relates to a cleaning device for cleaning the inner wall of a cleaning tank, comprising: a cleaning tank (1); a cleaning tank (4) provided on the cleaning tank (1), the bottom of the cleaning tank (4) being provided with a first connecting port (8), and the bottom of the cleaning tank (4) being provided with a residue discharge port (16); a liquid storage tank (5) provided on the cleaning tank (1), the bottom of the liquid storage tank (5) being provided with a second connecting port (9); a plurality of vibrators arranged in an array on the bottom of the cleaning tank (4); at least one cleaning basket (2) mounted on the cleaning tank (1), the cleaning basket (2) being at least partially located in the cleaning tank (4); a connecting pipe (6) having one end connected to the first connecting port (8) and the other end connected to the second connecting port (9), and a centrifugal pump (7) mounted on the connecting pipe (6); a filter screen (10) mounted on the first connecting port (8).

2. The apparatus according to claim 1, wherein Further comprising a first guide assembly and a second guide assembly; the edge of the bottom of the cleaning tank (4) being provided with a residue storage groove (14) in the circumferential direction, the residue storage groove (14) being in communication with the residue discharge port (16); the first guide assembly being capable of guiding the residue in the cleaning tank (4) into the residue storage groove (14); the second guide assembly being capable of guiding the residue in the residue storage groove (14) to the residue discharge port (16) and discharging the residue from the residue discharge port (16).

3. The apparatus of claim 2, wherein the semiconductor material is a semiconductor wafer. the first guide assembly comprising a driving motor (12), a rotating shaft (21), a rotating member (13), guide vanes (15), and a first mounting groove (11) provided in the cleaning tank (1); the first mounting groove (11) being located below the cleaning tank (4); the driving motor (12) being mounted on the inner wall of the first mounting groove (11), the output end of the driving motor (12) being connected to the rotating shaft (21), the rotating shaft (21) extending through the bottom end of the cleaning tank (4) into the cleaning tank (4), the rotating shaft (21) being connected to the rotating member (13) in the cleaning tank (4), and the rotating member (13) being provided with a plurality of guide vanes (15) mounted in the circumferential direction; wherein the guide vanes (15) are capable of guiding the residue in the cleaning tank (4) into the residue storage groove (14).

4. The apparatus according to claim 3, wherein the second guide assembly comprising a guide rod (17), one end of the guide rod (17) being connected to the rotating member (13), and the other end of the guide rod (17) extending into the residue storage groove (14).

5. The apparatus of claim 4, wherein the semiconductor material is a semiconductor wafer. the end of the guide rod (17) being provided with a second mounting groove (18); the second mounting groove (18) being provided with an elastic member (19) mounted therein, the elastic member (19) being connected to a scraping member (20), the scraping member (20) being capable of abutting against the surface wall of the residue storage groove (14); the size of the scraping member (20) being greater than the size of the residue discharge port (16).

6. The apparatus according to any one of claims 1 to 3, wherein a plurality of universal wheels (3) mounted on the bottom of the cleaning tank (1).

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