Cleaning tool and cleaning equipment for wafer platform
By designing a wafer platform cleaning tool, which utilizes the venting section to vacuum and remove tiny particles, the problem of dirt on the wafer fixing device was solved, achieving efficient cleaning, reducing costs, and improving equipment utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-03-17
AI Technical Summary
During wafer fabrication, particles or dirt on the back of the wafer can cause unevenness in the wafer holder, resulting in defocusing during exposure and increasing rework costs. Existing technologies cannot effectively clean the wafer holder during the process.
Design a wafer platform cleaning tool, including a handheld part, an adapter part, an air vent part, and an air tube. The air vent part is movably connected to the handheld part through the adapter part. The air vent part is used to draw vacuum and suck away tiny particles. The combination of the ceramic air vent part and the aluminum alloy handheld part enables flexible cleaning.
Effective cleaning of wafer platforms keeps them clean, reduces rework, lowers costs, and increases equipment uptime.
Smart Images
Figure CN223996837U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wafer process technology, and in particular to cleaning tools and equipment for wafer platforms. Background Technology
[0002] In the semiconductor wafer fabrication process, if abnormalities in the front-end process result in particles or contamination on the back side of the wafer, it can easily cause unevenness in the wafer holder (Chuck), deviations in wafer height, and defocusing during exposure, thus causing unnecessary rework and increasing manufacturing costs.
[0003] Although the wafer holder can be cleaned during periodic maintenance, it cannot be cleaned during operation. Therefore, manual cleaning is required after the machine operation is completed.
[0004] How to manufacture cleaning tools for wafer platforms is the technical problem that this application aims to solve. Utility Model Content
[0005] The purpose of this application is to provide a cleaning tool and cleaning equipment for a wafer platform to solve the technical problem of how to manufacture a cleaning tool for a wafer platform.
[0006] To achieve the above objectives, one or more embodiments of this application adopt the following technical solutions.
[0007] In a first aspect, embodiments of this application provide a cleaning tool for a wafer platform, including a handheld part, an adapter part, an air vent part, and an air tube;
[0008] The vent section has multiple vents, which are used for vacuuming.
[0009] The vent of the vent section is connected to one end of the vent tube, and the other end of the vent tube is used to connect to the vacuum pump.
[0010] The vent portion is movably connected to the handheld portion via the adapter portion.
[0011] This cleaning tool can use the pores to suck away tiny particles from the wafer platform, keeping the wafer platform clean.
[0012] Optionally, the adapter is a spherical rotating shaft.
[0013] The advantage of making the adapter a spherical rotating shaft is that the rotation direction is more flexible, making it easier for the air vent to rotate at an angle to enter areas with obstacles.
[0014] Optionally, the pore portion is in the shape of a sheet.
[0015] The advantage of making the pore portion into a sheet shape is that the sheet shape can enter some groove structures, especially when the wafer platform has a groove structure, the pore portion can enter the groove structure of the wafer platform and suck up the particles in the groove structure.
[0016] Optionally, the pore portion is in the shape of a circular sheet.
[0017] The advantage of making the pores into circular sheets is that the circular sheets have a regular shape, are easy to manufacture, and can enter small gaps or grooves for cleaning, providing good flexibility.
[0018] Optionally, the material of the pore portion is ceramic.
[0019] The advantages of using ceramic material for the pore section are as follows:
[0020] Ceramics are resistant to high temperatures and have high-temperature stability. The melting point of ceramics is generally higher than 1500℃ (such as silicon carbide with a melting point of 2700℃). They have a low coefficient of thermal expansion and can maintain dimensional stability in high-temperature wafer platform environments.
[0021] Ceramics have high hardness and wear resistance, are not easily worn, and can be used for a long time;
[0022] Ceramics have strong resistance to chemical media such as strong acids, strong alkalis, and salts, making them suitable for use in wafer manufacturing processes where they come into contact with etching solutions and cleaning agents. For example, alumina ceramics are stable against most acids and alkalis at room temperature, while silicon nitride ceramics remain corrosion resistant at high temperatures.
[0023] Ceramics are low-pollution, and their dense, smooth surfaces prevent liquid penetration and bacterial growth, meeting the ultra-high cleanliness requirements of wafer manufacturing.
[0024] Optionally, the pore portion is a circular ceramic sheet.
[0025] The beneficial effect of making the porous part into a circular ceramic sheet is that:
[0026] The circular, sheet-like shape is regular and easy to manufacture;
[0027] The sheet-like structure allows it to enter small gaps or grooves for cleaning, offering excellent flexibility.
[0028] Ceramic materials have advantages such as high temperature stability, high hardness and wear resistance, and resistance to acid and alkali corrosion.
[0029] Optionally, the handheld part is rod-shaped.
[0030] The advantage of making the handheld part into a rod shape is that the rod-shaped handle is easy to grasp and hold, and its regular shape makes it easy to manufacture and control manufacturing costs.
[0031] Optionally, the handheld part is a telescopic rod. The telescopic rod has two or more sections.
[0032] The advantage of making the handheld part into a telescopic rod is that the telescopic rod can be adjusted in length. When it is necessary to extend a long distance into the equipment, one or more sections of the telescopic rod can be pulled out. When the length is too long and hinders cleaning of a certain position, one or more sections of the telescopic rod can be retracted.
[0033] Optionally, the handheld part is made of aluminum alloy.
[0034] The advantages of using aluminum alloy for the handle are:
[0035] Aluminum alloy has a low density and is lightweight, making it easy to hold.
[0036] The aluminum alloy surface naturally oxidizes to form a dense Al₂O₃ layer, which can withstand the weak acid / weak alkali environment in the clean room;
[0037] Aluminum alloys are easy to process and their costs are controllable;
[0038] Compared to steel, aluminum alloys are non-magnetic, preventing the attraction of metal debris and thus preventing rust.
[0039] Optionally, the air tube passes through the interior of the handheld part and extends from the end of the handheld part.
[0040] The advantage of placing the air tube inside the handheld part is that it avoids the air tube occupying extra space, which helps to stabilize the position of the air tube and makes it easy to pick up and put down.
[0041] Optionally, the air tube passes through the interior of the handheld part, and the handheld part is a telescopic rod.
[0042] The advantage of using the telescopic rod as the handheld part is that it allows for more flexible adjustment of the length and the distance that the air vent can reach, while effectively accommodating the air tube.
[0043] Secondly, embodiments of this application provide a cleaning device for a wafer platform, the cleaning device for the wafer platform including a vacuum pump and the cleaning tools for the wafer platform described in the first aspect.
[0044] The beneficial effects of the wafer platform cleaning equipment described in the second aspect are consistent with the beneficial effects of the wafer platform cleaning tools described in the first aspect. Attached Figure Description
[0045] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0046] Figure 1 A schematic diagram of a cleaning tool for a wafer platform provided in an embodiment of this application, wherein the air tube 4 is exposed;
[0047] Figure 2 A schematic diagram of a cleaning tool with a trachea 4 passing through the inside of a handheld part 1, provided as an embodiment of this application;
[0048] Figure 3 A schematic diagram of a cleaning tool with a circular sheet-like vent portion 3 provided for an embodiment of this application;
[0049] Figure 4 A schematic diagram showing a handheld part 1 provided in an embodiment of this application, which may be provided with a handle 11;
[0050] Figure 5 A schematic diagram showing that a handheld part 1 can be configured as a telescopic rod according to an embodiment of this application;
[0051] Figure 6 A schematic diagram of a three-section handheld part 1 of a telescopic rod provided in an embodiment of this application;
[0052] Figure 7 This is a schematic diagram showing the dimensional proportions of various parts of a cleaning tool provided in an embodiment of this application.
[0053] Explanation of reference numerals in the attached figures:
[0054] 1 Handheld part
[0055] 2. Adapter section
[0056] 3. Porous portion
[0057] 4. Trachea
[0058] 11 handles Detailed Implementation
[0059] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described in the accompanying drawings can generally be arranged and designed in various different configurations.
[0060] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0061] In the description of this application, it should be noted that:
[0062] Relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations;
[0063] "Connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.
[0064] This application provides a cleaning tool for a wafer platform, such as... Figure 1 The cleaning tool includes a handheld part 1, an adapter part 2, an air vent part 3, and an air tube 4. The air vent part 3 is movably connected to the handheld part 1 via the adapter part 2.
[0065] The vent section 3 has multiple vents, which are used for vacuuming.
[0066] The vent of the vent section 3 is connected to one end of the air pipe 4, and the other end of the air pipe 4 is used to connect to the vacuum pump.
[0067] This cleaning tool can use the vent section 3 to suck away tiny particles from the wafer platform, keeping the wafer platform clean.
[0068] The adapter 2 can be a hinge, thereby enabling adjustment of the direction of the vent 3.
[0069] If a common single-axis hinge is used as the adapter 2, there are drawbacks: the vent part 3 can only rotate around one axis, the direction is limited, and the flexibility is low.
[0070] If a spherical hinge or spherical rotating shaft is used as the connecting part 2, the air vent 3 can rotate in four directions: up, down, left, and right, so that the air vent 3 can face any direction, greatly improving the flexibility of the air vent 3 and making it easier for the air vent 3 to rotate at an angle to enter places with obstacles.
[0071] Figure 1 The trachea 4 shown is exposed, but it can also pass through the inside of the handheld part 1, such as... Figure 2 The trachea 4 passes through the inside of the hand-held part 1 and extends out from the end of the hand-held part 1.
[0072] The advantages of placing the air tube 4 inside the handheld part 1 are: it avoids the air tube 4 occupying extra space, and it is conducive to the stability of the air tube 4 and makes it easy for staff to pick up and put it away.
[0073] Figure 1 The shape of the pore portion 3 shown is square, specifically it can be a square sheet.
[0074] The advantage of making the pore portion 3 into a sheet shape is that the sheet shape can enter some groove structures, especially when the wafer platform has a groove structure, the pore portion 3 can enter the groove structure of the wafer platform and suck up the particles in the groove structure.
[0075] The shape of the pore portion 3 can also be a circular plate, such as... Figure 3 .
[0076] The advantage of making the pore portion 3 into a circular sheet is that the circular sheet has a regular shape, is easy to manufacture, and can be rotated arbitrarily when combined with a spherical rotating shaft; moreover, the sheet can enter into small gaps or groove structures for cleaning, especially wafer platforms with groove structures on their surfaces, maintaining good flexibility.
[0077] Regarding the material of the pore portion 3, ceramic can be used as the material for the pore portion 3. The advantages of using ceramic as the material for the pore portion 3 are:
[0078] Ceramics are resistant to high temperatures and have high-temperature stability. The melting point of ceramics is generally higher than 1500℃ (such as silicon carbide with a melting point of 2700℃). They have a low coefficient of thermal expansion and can maintain dimensional stability in high-temperature wafer platform environments.
[0079] Ceramics have high hardness and wear resistance, are not easily worn, and can be used for a long time;
[0080] Ceramics have strong resistance to chemical media such as strong acids, strong alkalis, and salts, making them suitable for use in wafer manufacturing processes where they come into contact with etching solutions and cleaning agents. For example, alumina ceramics are stable against most acids and alkalis at room temperature, while silicon nitride ceramics remain corrosion resistant at high temperatures.
[0081] Ceramics are low-pollution, and their dense, smooth surfaces prevent liquid penetration and bacterial growth, meeting the ultra-high cleanliness requirements of wafer manufacturing.
[0082] like Figure 4 The hand-held part 1 may be provided with a handle 11, which is similar in shape to a cup handle for easy gripping.
[0083] like Figure 3The hand-held part 1 can also be rod-shaped. The advantage of using a rod shape as the shape of the hand-held part 1 is that the rod structure is simple, easy to grasp and hold, easy to manufacture, and control manufacturing costs. Moreover, since the protruding handle is omitted, the rod-shaped hand-held part occupies little space and is flexible in movement.
[0084] like Figure 5 The handheld part 1 can be configured as a telescopic rod. Figure 5 In the embodiment shown, the telescopic rod consists of two sections.
[0085] Telescopic poles can also consist of two or more sections, such as... Figure 6 , Figure 6 This demonstrates an implementation where the telescopic pole has three sections. The more sections the telescopic pole has, the greater its length adjustment range.
[0086] The retractable pole can be designed to be small in size when retracted, making it easy to fold up and fit into narrow spaces. When its length is too long and hinders cleaning in a certain area, one or more sections of the pole can be retracted. Moreover, because the retractable pole is small in size when retracted, it occupies less space, which is beneficial for storage.
[0087] The telescopic rod can be designed to extend to a larger size, making it easier to reach deep into the equipment or to allow operators to clean a larger or more distant area.
[0088] The handle 1 can be made of aluminum alloy. The advantages of choosing aluminum alloy for the handle 1 are:
[0089] Aluminum alloy has a low density and is lightweight, making it easy to hold.
[0090] The aluminum alloy surface naturally oxidizes to form a dense Al₂O₃ layer, which can withstand the weak acid / weak alkali environment in the clean room;
[0091] Aluminum alloys are easy to process and their costs are controllable;
[0092] Compared to steel, aluminum alloys are non-magnetic, preventing the attraction of metal debris and thus preventing rust.
[0093] The dimensions of each part in the diagram can be adjusted. Figure 7 This illustration shows one implementation with a dimensional scale. The telescopic rod can be designed to be 50 to 80 cm long. The air tube extends deep into the tail of the telescopic rod, which can be fitted with a base structure. This base structure supports the internal telescopic rod or air tube and facilitates handheld positioning. Sufficient length, such as 2 to 3 meters, is reserved for the air tube outside the tail of the telescopic rod to connect to a vacuum pump.
[0094] Based on the above embodiments, this application also provides a wafer platform cleaning device, the cleaning device including a vacuum pump and the above-mentioned wafer platform cleaning tool, the wafer platform cleaning tool including a handheld part, an adapter part, an air vent part and an air tube; the air vent part has multiple air vents, the air vents are used for vacuuming; the air vent part is connected to one end of the air tube, and the other end of the air tube is connected to the vacuum pump; the air vent part is movably connected to the handheld part through the adapter part.
[0095] The various optional embodiments of the wafer platform cleaning equipment are consistent with the wafer platform cleaning tools described above, and the beneficial effects of the various optional embodiments are consistent with those of the wafer platform cleaning tools described above.
[0096] In summary, this application proposes a cleaning tool and equipment for wafer platforms, which facilitates the cleaning of wafer platforms such as stepper machines, saves costs, reduces machine downtime, and improves equipment uptime.
[0097] The apparatus and system embodiments described above are merely illustrative. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement these embodiments without any creative effort.
[0098] The above are merely preferred embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A cleaning tool for a wafer stage, characterized by, The device comprises a hand-held part, an adapter part, a gas hole part and a gas pipe; The gas hole part has a plurality of gas holes for vacuum suction; The gas holes of the gas hole part are connected to one end of the gas pipe, and the other end of the gas pipe is used for connecting a vacuum pump; The gas hole part is movably connected to the hand-held part through the adapter part.
2. The wafer platform cleaning tool of claim 1, wherein, The gas hole part is in the shape of a circular sheet.
3. The wafer platform cleaning tool of claim 1, wherein, The gas hole part is a circular ceramic sheet.
4. The wafer platform cleaning tool of claim 1, wherein, The adapter part is a spherical rotating shaft.
5. The wafer platform cleaning tool of claim 1, wherein, The hand-held part is in the shape of a rod.
6. The wafer platform cleaning tool of claim 1, wherein, The hand-held part is a telescopic rod.
7. The wafer platform cleaning tool of claim 1, wherein, The hand-held part is made of aluminum alloy.
8. The wafer platform cleaning tool of claim 1, wherein, The gas pipe passes through the inside of the hand-held part and extends from the end of the hand-held part.
9. The wafer platform cleaning tool of claim 8, wherein, The hand-held part is a telescopic rod.
10. A wafer stage cleaning apparatus, comprising: The wafer platform cleaning device comprises a vacuum pump and a wafer platform cleaning tool according to any one of claims 1 to 9.