Electronic component pin machining die

Abstract

The utility model relates to the technical field of electronic component manufacturing, and discloses an electronic component pin machining mold which comprises a base, a machining table is fixedly connected to the outer wall of the top, located outside a protection box, of the base, a mold is embedded in the outer wall of the top of the machining table, and two penetrating type cutting grooves are formed in the outer wall of the top of the mold; two cutting grooves are formed in the die, a positioning groove is formed in the outer wall of the top, located between the two cutting grooves, of the die, an electronic element body matched with the positioning groove is arranged on the inner wall of the positioning groove, two pins are installed on the outer wall of the electronic element body, and the two pins are located above the two cutting grooves respectively. According to the electronic component pin cutting device, the cutting groove and the positioning groove in the die are accurately matched with the stamping block and the cutting knife on the sliding block, so that electronic component pins with set lengths can be accurately cut, the problem that the lengths of the pins are uneven is effectively avoided, and the consistency of products in the aspect of the lengths of the pins is ensured.

Description

Technical Field

[0001] This application relates to the field of electronic component manufacturing technology, and in particular to a mold for processing electronic component pins. Background Technology

[0002] In the production process of electronic components, the pins are the key parts that connect to external circuits. Their shape, dimensional accuracy, and quality have a significant impact on the overall performance of electronic components.

[0003] Currently, the pins of hardware and electronic components are processed manually, which results in inconsistent pin quality and inconsistent pin sizes, affecting their later use.

[0004] Furthermore, manual cutting is inconvenient and makes it difficult to effectively improve production efficiency, thus failing to meet the growing demand for high-quality electronic components. Utility Model Content

[0005] The purpose of this invention is to provide a mold for processing electronic component pins, so as to solve the problems of low pin processing accuracy and low production efficiency mentioned in the background art, and improve the quality and efficiency of electronic component pin processing.

[0006] The electronic component pin processing mold provided in this application adopts the following technical solution:

[0007] An electronic component pin processing mold includes a base, a protective box fixedly connected to the top outer wall of the base, and a top plate fixedly connected to the top inner wall of the protective box. A processing table is fixedly connected to the top outer wall of the base outside the protective box. A mold is embedded in the top outer wall of the processing table. Two through-cutting grooves are formed on the top outer wall of the mold. A positioning groove is formed on the top outer wall of the mold between the two cutting grooves. An electronic component body adapted to the positioning groove is provided on the inner wall of the positioning groove. Two pins are installed on the outer wall of the electronic component body, and the two pins are respectively located above the two cutting grooves.

[0008] Two guide rods are fixedly connected between the top plate and the base. A slider is slidably connected to the outer wall of the two guide rods. The protrusion of the slider extends out of the outside of the protective box, and a stamping block is fixedly connected to the bottom outer wall of the slider protrusion. Two cutting blades are installed on the bottom outer wall of the stamping block, and the two cutting blades correspond to two cutting grooves.

[0009] A cutting mechanism is installed on the outer wall of the top plate. The cutting mechanism includes a hinge seat fixedly connected to the top outer wall of the top plate. A lever is hinged to the inner wall of the hinge seat. A directional wheel is rotatably connected to the inner wall of the lever. A slide rod is slidably connected to the middle outer wall of the top of the top plate. The bottom end of the slide rod passes through the top plate and is fixedly connected to the top outer wall of the slide rod. The directional wheel abuts against the top end of the slide rod.

[0010] Preferably, the top outer wall of the base is provided with a through-type material drop groove, which is connected to two cutting grooves.

[0011] Preferably, a waste box is installed on the bottom outer wall of the base, and the waste box is located directly below the material discharge chute.

[0012] Preferably, a return spring is sleeved on the outer wall of each of the two guide rods, with the top end of the return spring fixedly connected to the bottom outer wall of the slider and the bottom end fixedly connected to the top outer wall of the base.

[0013] Preferably, a buffer block is fixedly connected to the bottom outer wall of the lever, and the buffer block is made of rubber material.

[0014] Preferably, a plurality of support blocks are fixedly connected to the bottom outer wall of the base, and the plurality of support blocks are evenly distributed at the four corner edges of the base.

[0015] In summary, this application includes the following beneficial technical effects:

[0016] 1. By precisely cooperating with the cutting groove and positioning groove on the mold and the stamping block and cutting knife on the slider, the electronic component pins of the set length can be accurately cut, effectively avoiding the problem of inconsistent pin lengths and ensuring the consistency of the product in terms of pin length;

[0017] 2. Through the combination of the cutting mechanism and the reset spring, the slider can be driven to smoothly open and close the mold through the guide rod. With the reasonable linkage design between the components, the entire pin processing process can be carried out continuously and efficiently, reducing the time wasted due to jamming and adjustment caused by unreasonable mold structure, improving processing efficiency, and enabling the device to process more qualified electronic component pins per unit time to meet the needs of large-scale production. Attached Figure Description

[0018] Figure 1 This is an overall schematic diagram of an embodiment of the application;

[0019] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the application;

[0020] Figure 3 This is a partial cross-sectional view of an embodiment of the application;

[0021] Figure 4 for Figure 3 Enlarged schematic diagram of the structure at point A in the middle.

[0022] Explanation of reference numerals in the attached drawings: 1. Base; 2. Protective box; 3. Top plate; 4. Processing table; 5. Mold; 6. Cutting groove; 7. Positioning groove; 8. Electronic component body; 9. Pin; 10. Support block; 11. Drop chute; 12. Scrap box; 13. Guide rod; 14. Slider; 15. Stamping block; 16. Cutting knife; 17. Return spring; 18. Slide rod; 19. Hinge seat; 20. Lever; 21. Directional wheel; 22. Buffer block. Detailed Implementation

[0023] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0024] This application discloses a die for processing electronic component leads. (Refer to...) Figure 1-4 An electronic component pin processing mold includes a base 1, a protective box 2 fixedly connected to the top outer wall of the base 1, and a top plate 3 fixedly connected to the top inner wall of the protective box 2. A processing table 4 is fixedly connected to the top outer wall of the base 1 outside the protective box 2. A mold 5 is embedded in the top outer wall of the processing table 4. Two through-cut grooves 6 are opened on the top outer wall of the mold 5. A positioning groove 7 is opened on the top outer wall of the mold 5 between the two cutting grooves 6. An electronic component body 8 adapted to the positioning groove 7 is provided on the inner wall of the positioning groove 7. Two pins 9 are installed on the outer wall of the electronic component body 8. The two pins 9 are respectively located above the two cutting grooves 6.

[0025] Two guide rods 13 are fixedly connected between the top plate 3 and the base 1. A slider 14 is slidably connected to the outer wall of the two guide rods 13. The protrusion of the slider 14 extends out of the outside of the protective box 2. A stamping block 15 is fixedly connected to the bottom outer wall of the protrusion of the slider 14. Two cutting blades 16 are installed on the bottom outer wall of the stamping block 15. The two cutting blades 16 correspond to the two cutting grooves 6.

[0026] A cutting mechanism is installed on the outer wall of the top plate 3. The cutting mechanism includes a hinge seat 19 fixedly connected to the top outer wall of the top plate 3. A lever 20 is hinged to the inner wall of the hinge seat 19. A directional wheel 21 is rotatably connected to the inner wall of the lever 20. The directional wheel 21 can convert the direct friction with the slide rod 18 into rolling friction, reduce the friction force, and protect the lever 20 from damage. A slide rod 18 is slidably connected to the middle outer wall of the top of the top plate 3. The bottom end of the slide rod 18 passes through the top plate 3 and is fixedly connected to the top outer wall of the slider 14. The directional wheel 21 abuts against the top end of the slide rod 18.

[0027] The top outer wall of the base 1 is provided with a through-type material drop groove 11, which is connected to two cutting grooves 6. Waste materials falling from the two cutting grooves 6 fall to the bottom of the base 1 through the material drop groove 11.

[0028] A waste box 12 is installed on the bottom outer wall of the base 1. The waste box 12 is located directly below the discharge chute 11. When the waste falls from the discharge chute 11 to the bottom of the base 1, it will fall into the waste box 12 for collection.

[0029] Both guide rods 13 are fitted with return springs 17 on their outer walls. The top end of the return spring 17 is fixedly connected to the bottom outer wall of the slider 14, and its bottom end is fixedly connected to the top outer wall of the base 1.

[0030] A buffer block 22 is fixedly connected to the bottom outer wall of the lever 20. The buffer block 22 is made of rubber material and has a certain elasticity. It can buffer the lever 20 and prevent the lever 20 from rigidly contacting the top plate 3 when it is pressed down too much, which would cause the lever 20 to bend.

[0031] Multiple support blocks 10 are fixedly connected to the bottom outer wall of the base 1, and the multiple support blocks 10 are evenly distributed at the four corner edges of the base 1.

[0032] The implementation principle of an electronic component pin processing mold according to an embodiment of this application is as follows: First, the electronic component to be processed is placed on the mold 5, and the electronic component body 8 is precisely positioned using the positioning groove 7. When the electronic component body 8 is embedded in the positioning groove 7, the raw material of the pin 9 of the electronic component body 8 corresponds to the corresponding position of the two cutting grooves 6. It is worth noting that one of the cutting grooves 6 can be a cutting groove, and the other cutting groove 6 can be a bending groove. With the help of two cutting blades 16, one cutting blade 16 is a cutting blade corresponding to the cutting groove, and the other cutting blade 16 can be a bending pressure block corresponding to the bending groove, so as to realize the cutting and bending operations. The combination can be flexibly made according to the actual situation.

[0033] Next, manually press lever 20. The other end of lever 20 rotates around hinge seat 19. At this time, lever 20 drives directional wheel 21 to abut against slide rod 18. The directional wheel 21 presses slide rod 18 downward. At this time, the bottom end of slide rod 18 presses down on slider 14, causing slider 14 to slide downward on the outer wall of the two guide rods 13. Slider 14 then drives stamping block 15 to move downward. During this process, two cutting blades 16 cooperate with two cutting grooves 6 to cut the raw material of pin 9 to obtain pin 9 of a set length. The cut waste falls into the discharge groove 11 through cutting groove 6 and is collected through waste box 12, completing the overall cutting operation.

[0034] Finally, after the mold is closed and the processing is completed, the lever 20 is released, and the directional wheel 21 no longer presses against the top of the slide bar 18. The slide bar 18 is no longer under force, and the slider 14 rises and resets under the elastic force of the two return springs 17. The operator can then take out the processed product and proceed to the next round of processing.

[0035] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0036] Secondly: The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0037] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

[0038] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An electronic component pin processing mold, comprising a base (1), a protective box (2) fixedly connected to the outer wall of the top of the base (1), and a top plate (3) fixedly connected to the inner wall of the top of the protective box (2), characterized in that: The top outer wall of the base (1) is fixedly connected with a processing table (4) outside the protective box (2), the top outer wall of the processing table (4) is embeddedly installed with a mold (5), the top outer wall of the mold (5) is provided with two penetrating cutting grooves (6), the top outer wall of the mold (5) between the two cutting grooves (6) is provided with a positioning groove (7), the inner wall of the positioning groove (7) is provided with an electronic element body (8) matched therewith, the outer wall of the electronic element body (8) is installed with two pins (9), and the two pins (9) are located above the two cutting grooves (6) respectively. The top plate (3) and the base (1) are fixedly connected with two guide rods (13), the outer walls of the two guide rods (13) are slidably connected with sliding blocks (14), the protruding portions of the sliding blocks (14) extend out of the outer wall of the protective box (2), the bottom outer wall of the protruding portion of the sliding block (14) is fixedly connected with a punching block (15), the bottom outer wall of the punching block (15) is installed with two cutting knives (16), and the two cutting knives (16) correspond to the two cutting grooves (6). The outer wall of the top plate (3) is installed with a cutting mechanism, the cutting mechanism comprises a hinged seat (19) fixedly connected to the top outer wall of the top plate (3), the inner wall of the hinged seat (19) is hingedly connected with a lever (20), the inner wall of the lever (20) is rotatably connected with a directional wheel (21), the top middle outer wall of the top plate (3) is slidably connected with a sliding rod (18), the bottom end of the sliding rod (18) penetrates the top plate (3) and is fixedly connected with the top outer wall of the sliding block (14), and the directional wheel (21) abuts against the top end of the sliding rod (18).

2. The electronic component pin processing mold according to claim 1, wherein: The top outer wall of the base (1) is provided with a penetrating blanking groove (11), and the blanking groove (11) is in communication with the two cutting grooves (6).

3. An electronic component lead processing mold according to claim 2, wherein: The bottom outer wall of the base (1) is installed with a waste box (12), and the waste box (12) is located directly below the blanking groove (11).

4. The electronic component lead processing mold according to claim 1, characterized by: The outer walls of the two guide rods (13) are each sleeved with a return spring (17), the top end of the return spring (17) is fixedly connected to the bottom outer wall of the sliding block (14), and the bottom end thereof is fixedly connected to the top outer wall of the base (1).

5. The electronic component lead processing mold according to claim 1, wherein: The bottom outer wall of the lever (20) is fixedly connected with a buffer block (22), and the buffer block (22) is made of rubber material.

6. The electronic component lead processing mold according to claim 1, wherein: The bottom outer wall of the base (1) is fixedly connected with a plurality of supporting blocks (10), and the plurality of supporting blocks (10) are evenly distributed at the four corner edge positions of the base (1).

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