Circuit chip laser drilling equipment

Abstract

The utility model provides circuit chip laser drilling equipment, which relates to the technical field of drilling equipment and comprises a main body mechanism, and a dust removal mechanism is fixedly mounted at the bottom of the inner wall of the main body mechanism; the dust removal mechanism comprises a support. According to the circuit chip drilling device, under the cooperation of the main body mechanism and the dust removal mechanism, the heat dissipation holes in the support can effectively reduce the temperature of a circuit chip in the drilling process, the chip is prevented from being damaged due to high temperature, and therefore the machining quality is guaranteed, an air pump is started during laser drilling, negative pressure is formed in a collecting box, and the machining efficiency is improved. Waste gas and small particles generated during drilling are efficiently captured through the feeding hole, air disturbance is effectively reduced through the close-distance dust collection mode, it is ensured that high-temperature metal steam, ionized gas and chippings generated during laser drilling are captured in time, chips are prevented from being polluted, and therefore the defective product rate is remarkably reduced.

Description

Technical Field

[0001] This utility model relates to the field of drilling equipment technology, and in particular to a laser drilling equipment for circuit chips. Background Technology

[0002] Drilling equipment is a specialized mechanical device used to create holes or achieve internal penetration on the surface of various materials. Its core definition is to form regular or customized hole structures in a localized area of ​​a material through physical cutting, impact, thermal effects or light energy conversion, so as to meet processing, shaping or functional needs.

[0003] Existing technologies, such as Chinese Patent No. CN218785294U, provide a multifunctional circuit board laser drilling device. The main body of the drilling device has a pull plate movably connected internally, with a fixing device fixedly connected to the top surface of the pull plate. A laser device and a dust extraction device are also fixedly connected internally to the main body. A control knob is fixedly connected to the front surface of the main body, and a display panel is fixedly connected to the middle of the front surface. A device door is movably connected to the left front side of the main body, and a support frame is fixedly connected to the bottom. The pull plate allows for easy removal of the circuit board from the device's interior. The dust extraction device cleans the dust inside the machine, and the fixing device ensures stable circuit board mounting.

[0004] While the aforementioned equipment achieves the effect of cleaning dust inside the machine, the dust collection device is far from the working point, and the dust is easily affected by air disturbances during diffusion, resulting in some particles not being effectively captured, reducing the dust removal efficiency. High-temperature metal vapor that is not removed in time may condense inside the equipment or on the chip surface, forming an irregularly distributed metal deposition layer, causing the aperture size to deviate from the design specifications, and may also cause short circuits between circuit layers or a decrease in signal transmission efficiency, thus posing a serious threat to the electrical performance stability and reliability of the chip. Utility Model Content

[0005] The purpose of this invention is to solve the problem that the poor dust collection effect of the above-mentioned equipment leads to a decline in processing effect and product quality, and thus proposes a circuit chip laser drilling equipment.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a circuit chip laser drilling device, comprising a main body mechanism, wherein a dust removal mechanism is fixedly installed on the bottom of the inner wall of the main body mechanism;

[0007] The dust removal mechanism includes a support frame with a set of heat dissipation holes at the top. A collection box is fixedly installed on one side of the outer wall of the support frame, and a set of feed holes is opened on one side of the outer wall of the collection box. A water tank is fixedly installed on one side of the outer wall of the collection box. A collection cabinet is movably inserted into the inner surface of the collection box. The output end of the collection box is fixedly connected to a first pipe. The output end of the first pipe is fixedly connected to an air pump, and one side of the outer wall of the air pump is fixedly connected to one side of the outer wall of the collection box. The output end of the air pump is fixedly connected to a second pipe, and the outer wall of the second pipe is fixedly inserted into the inside of the water tank. The output end of the second pipe is fixedly connected to an aeration disc. An air outlet valve is fixedly connected to the top of the water tank.

[0008] Preferably, the main body includes a shell, and two linear modules are fixedly installed on the top of the inner wall of the shell, and a second linear module is fixedly installed between the bottoms of the two linear modules.

[0009] Preferably, a laser head is fixedly installed at the bottom of the linear module two, and two sets of racks are fixedly installed at the bottom of the inner wall of the outer shell.

[0010] Preferably, a mounting bracket is movably fitted between the outer walls of the two sets of racks, and a motor is fixedly installed on one side of the outer wall of each of the two mounting brackets.

[0011] Preferably, the output ends of both motors are fixedly mounted with rotating shafts, and the outer walls of both rotating shafts are movably inserted into the interior of the mounting bracket.

[0012] Preferably, a set of gears is fixedly sleeved on the outer wall of each of the two rotating shafts, and the outer wall of each set of gears is meshed with the inner wall of the rack. A clamping block is fixedly installed on the top of each of the two mounting brackets.

[0013] Preferably, the bottom of the inner wall of the outer casing is fixedly connected to the bottom of the bracket.

[0014] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0015] In this invention, the heat dissipation holes on the bracket can effectively reduce the temperature of the circuit chip during the drilling process by cooperating with the main body and the dust removal mechanism, thus preventing the chip from being damaged by high temperature and ensuring the processing quality. When laser drilling is performed, the air pump is started, which creates a negative pressure inside the collection box and efficiently captures the exhaust gas and small particles generated during drilling through the feed hole. This close-range dust collection method effectively reduces air disturbance and ensures that the high-temperature metal vapor, ionized gas and debris generated by laser drilling are captured in time, preventing chip contamination and thus significantly reducing the defect rate.

[0016] In this invention, the mounting bracket and clamping block can be flexibly adjusted in position under the action of the main mechanism to adapt to circuit chips of different sizes, thereby enhancing the versatility of the equipment. The precise cooperation between linear module one and linear module two enables the laser head to move quickly and accurately to the designated position, ensuring the accuracy of each hole on the circuit chip. Attached Figure Description

[0017] Figure 1 This utility model provides a front view perspective view of a circuit chip laser drilling device.

[0018] Figure 2 This utility model provides a bottom-view perspective view of the main structure of a circuit chip laser drilling device;

[0019] Figure 3 This utility model provides a top perspective view of the main structure of a circuit chip laser drilling device;

[0020] Figure 4 This utility model provides a three-dimensional schematic diagram of the main mechanism in a circuit chip laser drilling device;

[0021] Figure 5 This utility model provides a schematic diagram of the dust removal mechanism in a circuit chip laser drilling device.

[0022] Figure 6 This utility model provides a sectional perspective view of a dust removal mechanism in a laser drilling device for circuit chips.

[0023] Legend:

[0024] 1. Main body; 101. Outer shell; 102. Linear module one; 103. Linear module two; 104. Laser head; 105. Rack; 106. Mounting bracket; 107. Motor; 108. Rotating shaft; 109. Gear; 110. Clamping block;

[0025] 2. Dust removal mechanism; 201. Support frame; 202. Heat dissipation hole; 203. Collection box; 204. Feed hole; 205. Water tank; 206. Collection cabinet; 207. Pipeline 1; 208. Air pump; 209. Pipeline 2; 210. Aeration disc; 211. Air outlet valve. Detailed Implementation

[0026] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0028] Example 1, as Figures 1-6 As shown, this utility model provides a circuit chip laser drilling device, including a main body 1, and a dust removal mechanism 2 is fixedly installed on the bottom of the inner wall of the main body 1;

[0029] The dust removal mechanism 2 includes a support 201, a set of heat dissipation holes 202 on the top of the support 201, a collection box 203 fixedly installed on one side of the outer wall of the support 201, a set of feed holes 204 on one side of the outer wall of the collection box 203, a water tank 205 fixedly installed on one side of the outer wall of the collection box 203, a collection cabinet 206 movably inserted into the inner surface of the collection box 203, a pipe 207 fixedly connected to the output end of the collection box 203, an air pump 208 fixedly connected to the output end of the pipe 207, and an air pump 208 fixedly connected to the outer wall of the air pump 208 and the outer wall of the collection box 203, an air pump 209 fixedly connected to the output end of the air pump 208, and an air outlet valve 211 fixedly connected to the top of the water tank 205.

[0030] The overall effect of Embodiment 1 is as follows: the user first places the circuit chip to be processed on top of the bracket 201. The heat dissipation hole 202 can reduce the temperature of the circuit chip during drilling, preventing damage due to overheating. When drilling begins, the air pump 208 starts, expelling air from the collection box 203 through pipe 207, creating a negative pressure inside. Subsequently, the collection box 203 sucks in the exhaust gas and particulate matter generated during drilling through a set of feed holes 204. Because the collection box 203 is close to the circuit chip, it can form an effective suction coverage area, reducing the impact of air disturbance on the dust path and removing most of the waste gas. The system absorbs gas and particulate matter, preventing metal vapor from condensing on the chip surface or the inner wall of the hole to form an irregular deposition layer, thereby improving the processing quality of the circuit chip. The particulate matter is then intercepted by the collection cabinet 206. Users only need to pull out the collection cabinet 206 to clean the contaminants, reducing the time and labor costs of cleaning work. The exhaust gas comes to the aeration plate 210 through pipe 1 207 and pipe 2 209. The aeration plate 210 can increase the contact area between the exhaust gas and the treatment liquid inside the water tank 205, so that the harmful substances inside are absorbed by the treatment liquid, improving the treatment effect and efficiency of the exhaust gas. The treated gas is discharged through the exhaust valve 211.

[0031] Example 2, as Figures 2-6As shown, the main body 1 includes a housing 101. Two linear modules 102 are fixedly installed on the top of the inner wall of the housing 101. A linear module 103 is fixedly installed between the bottoms of the two linear modules 102. A laser head 104 is fixedly installed on the bottom of the linear module 103. Two sets of racks 105 are fixedly installed on the bottom of the inner wall of the housing 101. Mounting brackets 106 are movably sleeved between the outer walls of the two sets of racks 105. One side of the outer wall of each mounting bracket 106 is fixed. Two motors 107 are fixedly installed, and two shafts 108 are fixedly installed at the output ends of the two motors 107. The outer walls of the two shafts 108 are movably inserted into the interior of the mounting bracket 106. A set of gears 109 is fixedly sleeved on the outer walls of the two shafts 108, and the outer walls of the two sets of gears 109 are meshed with the inner wall of the rack 105. Clamping blocks 110 are fixedly installed on the top of the two mounting brackets 106. The bottom of the inner wall of the outer shell 101 is fixedly connected to the bottom of the bracket 201.

[0032] The effect achieved by the entire embodiment 2 is as follows: after the circuit chip is placed on top of the bracket 201, the motor 107 starts, thereby driving the rotating shaft 108 to rotate inside the mounting bracket 106. The gear 109 on the outer wall of the rotating shaft 108 rotates accordingly, and under the action of the rack 105 meshing with it, it drives the mounting bracket 106 and the clamping block 110 at the top to move forward. The two clamping blocks 110 come together to clamp and fix the circuit chip. This device can fix circuit chips of different sizes, which not only improves the practicality of the device, but also avoids the circuit chip from being not firmly fixed and affecting the drilling effect during drilling. After the linear module one 102 is started, it can drive the laser head 104 below to move laterally. After the linear module two 103 is started, it can drive the laser head 104 to move longitudinally. The two linear modules work together, and the laser head 104 can track and position the circuit chip in a very short time, thereby greatly shortening the drilling time and improving production efficiency.

[0033] Working Principle: First, the circuit chip to be processed is securely placed on top of the bracket 201. The bracket 201 is designed with heat dissipation holes 202, which effectively reduce the temperature of the circuit chip during drilling, preventing chip damage due to high temperature. Then, the motor 107 starts, driving the rotating shaft 108 to rotate inside the mounting bracket 106. The gear 109 on the outer wall of the rotating shaft 108 rotates synchronously and, through meshing with the rack 105, pushes the mounting bracket 106 and its top clamping block 110 forward. The two clamping blocks 110 move closer to each other, firmly clamping and fixing the circuit chip. Next, linear module one 102 and linear module two 103 are started respectively. Linear module one 102 drives the laser head 104 to move laterally, while linear module two 103 is responsible for the longitudinal movement of the laser head 104. The two work together to make the circuit chip move horizontally. The laser head 104 can accurately track and locate the drilling position on the circuit chip in a very short time. When the drilling operation begins, the air pump 208 starts simultaneously. It discharges the air in the collection box 203 through the first pipe 207 to form a negative pressure environment. Then, the collection box 203 sucks in the waste gas and particulate matter generated during the drilling process through a set of feed holes 204. The particulate matter sucked into the collection box 203 is intercepted by the collection cabinet 206. Users only need to periodically remove the collection cabinet 206 to easily clean the pollutants inside. The waste gas enters the aeration plate 210 through the first pipe 207 and the second pipe 209. The design of the aeration plate 210 increases the contact area between the waste gas and the treatment liquid inside the water tank 205, so that the harmful substances in the waste gas can be effectively absorbed by the treatment liquid. Finally, the treated gas is safely discharged through the exhaust valve 211.

[0034] The wiring diagrams of linear module 102, linear module 2103, laser head 104, motor 107, and air pump 208 in this utility model are common knowledge in the field, and their working principles are known technologies. The appropriate model is selected according to actual use. Therefore, the control methods and wiring layouts of linear module 102, linear module 2103, laser head 104, motor 107, and air pump 208 will not be explained in detail.

[0035] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A circuit chip laser drilling apparatus comprising a main body mechanism (1), characterized by: The inner wall bottom of the main body mechanism (1) is fixedly installed with a dust removal mechanism (2); The dust removal mechanism (2) comprises a support (201), a plurality of heat dissipation holes (202) are formed in the top of the support (201), a collecting box (203) is fixedly installed on one side of the outer wall of the support (201), a plurality of feeding holes (204) are formed in one side of the outer wall of the collecting box (203), a water tank (205) is fixedly installed on one side of the outer wall of the collecting box (203), a collecting cabinet (206) is movably inserted into the inner surface wall of the collecting box (203), a pipeline one (207) is fixedly communicated with the output end of the collecting box (203), an air pump (208) is fixedly communicated with the output end of the pipeline one (207), and one side of the outer wall of the air pump (208) is fixedly connected with one side of the outer wall of the collecting box (203), a pipeline two (209) is fixedly communicated with the output end of the air pump (208), and the outer surface wall of the pipeline two (209) is fixedly inserted into the inside of the water tank (205), an aeration disc (210) is fixedly communicated with the output end of the pipeline two (209), and an air outlet valve (211) is fixedly communicated with the top of the water tank (205).

2. The circuit chip laser drilling apparatus according to claim 1, characterized by: The main body mechanism (1) comprises an outer shell (101), two linear modules one (102) are fixedly installed on the inner wall top of the outer shell (101), and a linear module two (103) is fixedly installed between the bottoms of the two linear modules one (102).

3. The circuit chip laser drilling apparatus according to claim 2, characterized by: The bottom of the linear module two (103) is fixedly installed with a laser head (104), and the inner wall bottom of the outer shell (101) is fixedly installed with two groups of racks (105).

4. The circuit chip laser drilling apparatus according to claim 3, characterized by: The outer surface walls between the two groups of racks (105) are movably sleeved with mounting frames (106), and the outer wall sides of the two mounting frames (106) are fixedly installed with motors (107).

5. The circuit chip laser drilling apparatus according to claim 4, characterized by: The output ends of the two motors (107) are fixedly installed with rotating shafts (108), and the outer surface walls of the two rotating shafts (108) are movably inserted into the interiors of the mounting frames (106).

6. The circuit chip laser drilling apparatus according to claim 5, characterized by: The outer surface walls of the two rotating shafts (108) are fixedly sleeved with a group of gears (109), and the outer surface walls of the two groups of gears (109) are movably connected with the inner surface walls of the racks (105), and the tops of the two mounting frames (106) are fixedly installed with clamping blocks (110).

7. The circuit chip laser drilling apparatus according to claim 6, characterized by: The inner wall bottom of the outer shell (101) is fixedly connected with the bottom of the support (201).

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