Earphone and earphone assembly

Abstract

The utility model provides an earphone and an earphone assembly. The earphone comprises an ear muff and a connecting arm, one end of the connecting arm is connected with the ear muff, and the ear muff comprises a shell, a loudspeaker, a sensor, a support and a first antenna. A containing space is defined by the shell, the shell is provided with a sound outlet hole, and the sound outlet hole is communicated with the containing space and the exterior of the shell. The loudspeaker is located in the accommodating space, and the sound outlet surface of the loudspeaker is opposite to the sound outlet hole. The sensor is located in the containing space, at least part of the sensor is located on the side, opposite to the sound outlet hole, of the loudspeaker, and the sensor is fixedly connected with the shell. The support is located in the containing space, at least part of the support is located between the loudspeaker and the sensor, the support is fixedly connected with the shell, the first antenna is fixedly connected to the support, the first antenna and the sensor are arranged in a spaced mode in the first direction, and the first direction points to the loudspeaker from the support. The interference of the sensor of the earphone on the signal receiving and transmission of the first antenna is small. And the communication quality of the earphone is better.

Description

Technical Field

[0001] This application relates to the field of headphone device technology, and more particularly to a headphone and headphone assembly. Background Technology

[0002] Wireless headphones are gaining popularity due to their portability and stylishness, and are gradually becoming a trend. Wireless headphones typically include an antenna, which receives radio signals from Bluetooth devices (such as mobile phones and computers) and transmits them to the headphones to receive audio data. Simultaneously, signals from inside the headphones also need to be transmitted back to the Bluetooth device via the antenna to complete the communication process.

[0003] In the communication process of wireless headphones, improving antenna efficiency helps to enhance the signal reception and transmission quality, strengthen signal stability, and thus improve the user experience. Antenna efficiency refers to the ratio of the antenna's radiated power to its input power. Utility Model Content

[0004] This application provides an earphone and an earphone assembly. The earphone's antenna has high efficiency, resulting in better communication quality.

[0005] In a first aspect, embodiments of this application provide an earphone. The earphone includes an earcup and a connecting arm, one end of which is connected to the earcup. The earcup includes a housing, a speaker, a sensor, a bracket, and a first antenna. The housing encloses an accommodating space and has a sound outlet that communicates with the accommodating space and the outside of the housing. The speaker is located in the accommodating space, with its sound-emitting surface facing the sound outlet. The sensor is located in the accommodating space and is at least partially located on the side of the speaker facing away from the sound outlet. The sensor is fixedly connected to the housing. The bracket is located in the accommodating space and is at least partially located between the speaker and the sensor. The bracket is fixedly connected to the housing. The first antenna is fixedly connected to the bracket. In a first direction, the first antenna and the sensor are spaced apart, and the first direction points from the bracket to the speaker.

[0006] In this embodiment, by placing the sensor on the side of the speaker facing away from the sound outlet and fixing it to the housing, the surface of the housing facing away from the sound outlet serves as the sensor's touch surface, facilitating user touch operation. Furthermore, the larger area of ​​the touch surface allows for a wider sliding range, further enhancing user touch operation and improving the user experience.

[0007] Secondly, in this embodiment, by setting a bracket to support the first antenna and fixing the sensor to the housing, the first antenna and the sensor can be spaced apart in the first direction. That is, there is a gap between the first antenna and the sensor in the first direction, which can reduce the interference of the sensor on the signal reception and transmission of the first antenna, reduce signal loss during transmission, and improve the efficiency of the first antenna, thereby improving the communication quality of the headset. Here, the efficiency of the first antenna refers to the ratio of the radiated power to the input power of the first antenna.

[0008] In some embodiments, the projection along the first direction is a first projection of the first antenna onto a plane perpendicular to the first direction, and a second projection of the sensor onto a plane perpendicular to the first direction. At least a portion of the first projection of the first antenna is spaced apart from the second projection of the sensor.

[0009] It is understood that, in this embodiment, the projection of the first antenna onto the plane perpendicular to the first direction can be entirely spaced apart from the projection of the sensor onto the plane perpendicular to the first direction, or it can be partially spaced apart from the projection of the sensor onto the plane perpendicular to the first direction. For example, the radiating part of the first antenna and the sensor can be staggered on the plane perpendicular to the first direction, thereby reducing the interference of the sensor on the signal reception and transmission of the first antenna, reducing signal loss during transmission, thereby improving the efficiency of the first antenna, and thus improving the communication quality of the headset.

[0010] In some embodiments, the bracket includes a first side and a second side facing away from each other, the first side of the bracket facing the sensor and spaced apart from the sensor; the bracket is provided with a clearance groove, the opening of the clearance groove is located on the first side of the bracket and is positioned opposite to the sensor, a portion of the first antenna is located in the clearance groove, and a portion is arranged around the clearance groove.

[0011] In this embodiment, by providing a clearance groove on the bracket, the clearance groove can be used to avoid the sensor, which is beneficial for the sensor to be spaced apart from the bracket and the first antenna in the first direction.

[0012] In some embodiments, the earpiece also includes a first flexible circuit board, which is fixedly connected to the housing. A portion of the first flexible circuit board is located on the side of the support facing away from the speaker and is spaced apart from the support. A sensor is located on the first flexible circuit board.

[0013] In this embodiment, by setting a bracket to support the first antenna, the sensor is fixedly connected to the first flexible circuit board and then connected to the housing, so that the first antenna and the sensor are spaced apart in the first direction. That is, there is a gap between the first antenna and the sensor in the first direction, which can reduce the interference of the sensor on the signal reception and transmission of the first antenna and the second antenna, reduce the signal loss in the transmission process, and improve the efficiency of the first antenna and the second antenna, thereby improving the communication quality of the earphone.

[0014] In some embodiments, the earpiece also includes a second antenna, which is fixedly connected to the bracket and spaced apart from the first antenna; the earpiece also includes a circuit board assembly, which includes a first connection terminal, a second connection terminal and a third connection terminal, the first connection terminal and the third connection terminal being electrically connected to the first antenna, and the second connection terminal and the third connection terminal being electrically connected to the second antenna, which is a side antenna.

[0015] In this embodiment, the second antenna can optimize network connectivity through signal diffusion and scattering, reducing the impact of the human body on the signal transmission of the antenna assembly, thereby enhancing the signal reception capability of the antenna assembly and improving its efficiency. It is understood that the cooperation between the first and second antennas results in better signal reception for the speaker.

[0016] In some embodiments, the housing is further provided with a first pickup hole and a second pickup hole spaced apart, both of which are connected to the receiving space and the outside of the housing; the earphone also includes a first microphone and a second microphone, both of which are installed in the receiving space, the pickup surface of the first microphone is opposite to the first pickup hole, the pickup surface of the second microphone is opposite to the second pickup hole, the first microphone is a call microphone, and the second microphone is used to pick up noise outside the earphone; the line connecting the second pickup hole and the first pickup hole is a first connecting line, the housing includes a long axis, which is the line connecting the two farthest endpoints on the first surface of the housing, and the first connecting line is set at an angle to the long axis.

[0017] Understandably, in this embodiment, when the user wears the headphones, the line connecting the first and second microphone holes can extend towards the user's mouth, with the first microphone hole closer to the mouth than the second microphone hole. This facilitates the formation of a microphone beam array, allowing the microphone to amplify the sound signal in the direction towards the user's mouth and reduce interference from other directions. Consequently, the headphones can reduce background noise and better identify and capture the user's voice, meaning the user's voice can be better received by the first microphone. The headphones can then have better voice clarity and call performance.

[0018] In some implementations, the length of the first connection is greater than or equal to 15 mm.

[0019] This allows for a larger distance between the first and second microphone holes, which further enhances the performance of the microphone's beam array, enabling the microphone to better identify and capture the user's voice, thereby improving the headset's call performance.

[0020] In some embodiments, the first microphone is located on the side of the bracket facing away from the first antenna; projected along the first direction, the projection of the first microphone onto a plane perpendicular to the first direction is the third projection, and the projection of the first antenna onto a plane perpendicular to the first direction is the first projection, and the third projection of the first microphone and the first projection of the first antenna are spaced apart.

[0021] In this embodiment, by setting the first microphone and the first antenna facing away from each other, the first antenna can be moved away from the first microphone, thereby reducing electromagnetic interference from the first antenna to the first microphone. Furthermore, by offsetting the first microphone and the first antenna in a plane perpendicular to the first direction, during a call, when the user speaks through the first microphone, the recipient is less likely to hear static, thus ensuring better call quality.

[0022] In some embodiments, the housing includes a first surface, a second surface, and a third surface, with the first and second surfaces disposed opposite to each other in a first direction, and the third surface connected between the first and second surfaces; a first pickup hole penetrates through the third surface.

[0023] It is understood that in this embodiment, when the user wears headphones, the opening of the first pickup hole can be located on the side of the ear. Compared with the solution where the opening of the first pickup hole is located on the first surface, the opening of the first pickup hole in this embodiment is less affected by surface turbulence, which is beneficial to improving the sound pickup effect of the first microphone, that is, the first microphone can better receive the sound emitted by the user.

[0024] In some implementations, the frequency response difference between the first and second microphones is in the range of -1 dB to 1 dB. This facilitates the formation of a microphone beam array, allowing the headset to better identify and capture the user's voice, reduce background noise, and thus improve the headset's call performance.

[0025] In some implementations, the phase difference between the first and second microphones is in the range of -10dB to 10dB, or in the range of -5dB to 5dB. This facilitates the formation of a microphone beam array, allowing the headset to better identify and capture the user's voice, reduce background noise, and thus improve the headset's call performance.

[0026] In some embodiments, the circuit board of the first microphone may include a first dielectric layer, a second dielectric layer, a resistive layer, and a capacitor layer stacked together, with the resistive layer and the capacitor layer disposed between the first dielectric layer and the second dielectric layer.

[0027] It is understood that, in this embodiment, the circuit board of the first microphone may employ a buried capacitor and buried resistor process. The buried capacitor and buried resistor process typically refers to a specific process in printed circuit board manufacturing used to embed resistors and capacitors within the multilayer structure of a printed circuit board. This process allows for the integration of electronic components on the same printed circuit board, thereby reducing the board size, increasing circuit density, and reducing circuit interference and crosstalk. The use of this buried capacitor and buried resistor process on the circuit board of the first microphone in this embodiment can improve the anti-interference performance and reliability of the first microphone, thereby improving the call performance of the headset.

[0028] In some embodiments, the housing includes a first chamber and a second chamber spaced apart, with the sound outlet communicating with the first chamber. The housing also includes a first pressure relief hole and a second pressure relief hole, both communicating with the second chamber. The line connecting the first pressure relief hole and the sound outlet is a second line, and the line connecting the second pressure relief hole and the sound outlet is a third line, with the second and third lines forming an angle. Thus, when the speaker emits sound, the sound outlet, the first pressure relief hole, and the second pressure relief hole can form a dipole sound field, reducing sound leakage from the headphones.

[0029] In some embodiments, the earphone further includes a circuit board and a first electronic device disposed on the circuit board. The circuit board is fixedly connected to the housing and is at least partially located between the speaker and the bracket. The circuit board is electrically connected to the speaker, the sensor and the first antenna. Projected along the first direction, the projection of the first electronic device on a plane perpendicular to the first direction is a fourth projection, and the projection of the speaker on a plane perpendicular to the first direction is a fifth projection. The fourth projection of the first electronic device and the fifth projection of the speaker are spaced apart.

[0030] In this embodiment, by offsetting the first electronic device and the speaker on a plane perpendicular to the first direction, the interference of the first electronic device on the speaker can be reduced, thereby reducing the generation of current noise and improving the sound quality of the headphones.

[0031] In some embodiments, the first electronic device includes an inductor located on the side of the circuit board facing away from the speaker. The first electronic device also includes a power supply device, and the earpiece further includes multiple power traces for electrical connection to the power supply device and the headphone's battery. These power traces include a first power trace and a second power trace, which are at least partially overlapped in a first direction. This results in a smaller area of ​​the first and second power traces on a plane perpendicular to the first direction, reducing the mutual inductance between the first and second power traces and its interference with the speaker, thereby reducing the risk of current noise in the headphones and improving sound quality.

[0032] In some embodiments, the first electronic device further includes a first capacitor and a second capacitor, both of which are rectangular, with lengths less than 1 mm and widths less than 0.5 mm; the length extension direction of the first capacitor is set at an angle to the length extension direction of the second capacitor.

[0033] It is understandable that capacitors exhibit piezoelectric effect. When a capacitor is energized, it deforms, causing the circuit board assembly to deform as well, resulting in vibration and the generation of electrical noise. In this embodiment, by reducing the capacitor's package size, the degree of deformation of both the capacitor and the circuit board can be reduced, thereby decreasing the vibration amplitude of the circuit board. This helps to reduce the electrical noise generated by circuit board vibration, thus improving the sound quality of the headphones.

[0034] Furthermore, the vibration direction of the circuit board when it vibrates due to the deformation of the first capacitor is the first vibration direction. The vibration direction of the circuit board when it vibrates due to the deformation of the second capacitor is the second vibration direction. In this embodiment, by setting the length extension direction of the first capacitor and the length extension direction of the second capacitor to form an angle, the first vibration direction and the second vibration direction are also set to form an angle, thereby reducing the vibration amplitude of the circuit board in the same direction, which helps to reduce current noise and improve the sound quality of the headphones.

[0035] In some embodiments, the circuit board assembly further includes an electrical connector that is fixedly connected to the circuit board and located on the side of the circuit board facing the speaker, and the electrical connector is used for grounding.

[0036] In this embodiment, the anti-static capability of the headphones can be improved by providing an electrical connector for grounding.

[0037] In some embodiments, the connecting arm includes a connector and a tube body. The tube body includes a connecting end, and the connector is connected to and protrudes from the connecting end. The connector securely connects to the earpiece. It is understood that in this embodiment, the connecting arm can securely connect to the earpiece via the connector, facilitating the assembly of the connecting arm and the earpiece.

[0038] In some embodiments, the connector includes a body portion, a first protrusion, and a second protrusion. The first and second protrusions are both connected to the peripheral side surface of the body portion and are spaced apart around the body portion. The housing includes a connecting hole that connects the housing's receiving space to the outside of the housing. The housing is provided with a first limiting portion and a second limiting portion, both of which are connected to the hole wall of the connecting hole. The first and second limiting portions are spaced apart around the central axis of the connecting hole. At least a portion of the body portion is located in the connecting hole. The first protrusion abuts against the first limiting portion, and the second protrusion abuts against the second limiting portion. The first protrusion, the first limiting portion, the second protrusion, and the second limiting portion are arranged sequentially around the central axis of the connecting hole.

[0039] In this embodiment, the engagement of the first protrusion of the connector with the first limiting portion of the second sub-shell, and the engagement of the second protrusion with the second limiting portion of the second sub-shell, restricts the rotation of the connector relative to the second sub-shell around the central axis of the connector, thereby preventing the connector from detaching from the shell due to rotation. Furthermore, the mutual engagement of the first and second protrusions of the connector with the first and second limiting portions of the shell serves to prevent misalignment and provide limiting, ensuring a good fit between the connecting arm and the earpiece.

[0040] In some embodiments, the connector further includes a third protrusion that surrounds and connects to the peripheral side of the body portion, and is spaced apart from the first and second protrusions; the housing also has a first and second locking portion that are spaced apart, both of which are connected to the inner wall of the connecting hole; in the axial direction of the connecting hole, at least a portion of the first locking portion is located between the first and third protrusions and contacts the first and / or third protrusions; at least a portion of the second locking portion is located between the second and third protrusions and contacts the second and / or third protrusions.

[0041] In this embodiment, the cooperation of the second locking portion with the second protrusion and the third protrusion restricts the movement of the connector relative to the second sub-shell in a direction parallel to the central axis of the connector, thereby preventing the connector from detaching from the shell. Furthermore, the cooperation between the second and third protrusions of the connector and the first and second locking portions of the shell serves to prevent misalignment and limit movement, ensuring a better fit between the connecting arm and the earpiece.

[0042] In some embodiments, the pipe body further includes a sealing portion that protrudes from the end face of the connecting end and surrounds the body portion, and the sealing portion contacts the inner wall of the connecting hole.

[0043] In this embodiment, by providing a sealing part in the tube body, when the connecting arm is connected to the shell, the sealing part can seal the gap between the inner wall of the tube body and the shell, thereby preventing external moisture, sweat, dust, etc. from entering the earpiece and affecting the performance of the headphones.

[0044] In some embodiments, the headphones also include a battery assembly located at the end of the connecting arm away from the earpiece, the battery assembly being used to power the earpiece; the battery assembly includes a battery, a battery circuit board, and a temperature sensor, both the battery and the temperature sensor being fixedly connected to and electrically connected to the battery circuit board, the temperature sensor being used to detect the temperature of the battery.

[0045] In this embodiment, by setting a temperature sensor to detect the battery temperature, the safety of the charging box during the charging and discharging process can be improved.

[0046] Secondly, embodiments of this application also provide an earphone assembly. The earphone assembly includes a charging case and earphones as described above, the charging case being used for storing and charging the earphones.

[0047] In some embodiments, the charging case includes a first receiving slot for receiving earphones; the charging case includes a first spring contact assembly, at least a portion of which protrudes from the first receiving slot; the earphones include a charging terminal electrically connected to a speaker, a sensor, and a first antenna; when the earphones are charging, the earphones are received in the first receiving slot, and the charging terminal contacts the first spring contact assembly.

[0048] In this embodiment, the earphones are electrically connected to the charging case via a first spring contact assembly, thereby charging the earphones. Because the spring contact has high elasticity and can withstand significant tension, it can firmly abut the charging terminal of the earphones, making the charging circuit between the charging case and the earphones less prone to disconnection, resulting in better reliability of the earphone assembly's charging performance. Secondly, the spring contact has good shielding properties, effectively shielding electromagnetic interference and improving the reliability of the earphone assembly's charging. Furthermore, the spring contact has strong corrosion resistance, making it less susceptible to corrosion and damage from sweat on the earphones, extending its lifespan and further ensuring the charging performance of the earphone assembly. Moreover, the spring contact is inexpensive. Its installation and replacement are also relatively simple.

[0049] In some implementations, the number of charging terminals of the earphones is at least two, and the charging terminals of the at least two earphones are spaced apart.

[0050] In this embodiment, when the charging case charges the earphones, the large distance between the first and second charging terminals of the earphones prevents electrical conduction between them after the earphones come into contact with water or sweat, thus avoiding electrolytic corrosion and ensuring the reliability of the first contact spring assembly. This results in better reliability of the earphone assembly's charging performance.

[0051] In some embodiments, the first receiving tank is provided with a liquid storage tank, the opening of which is located on the tank wall of the first receiving tank, and when the earphone is received in the first receiving tank, the opening of the liquid storage tank faces the earpiece of the earphone.

[0052] It is understood that in this embodiment, the liquid reservoir can be used to collect liquid on the surface of the earphone, thereby reducing the impact of the liquid on the surface of the earphone on the electrical connection between the first spring assembly and the charging terminal of the earphone, which helps to improve the reliability of the charging performance of the earphone assembly. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0054] Figure 1 This is a structural schematic diagram of an earphone assembly in one state according to an embodiment of this application;

[0055] Figure 2 yes Figure 1 The diagram shows a structural schematic of an earphone assembly in another state;

[0056] Figure 3 yes Figure 2 The diagram shown is a structural schematic of the charging box in some embodiments;

[0057] Figure 4 yes Figure 3 The diagram shown is a partial cross-sectional view of the charging box cut along point AA in some embodiments.

[0058] Figure 5 yes Figure 3 The diagram shown is a partial structural schematic of the charging box in some embodiments.

[0059] Figure 6 yes Figure 3 The diagram shown is a partial exploded view of the lower housing in some embodiments;

[0060] Figure 7 yes Figure 2 The diagram shows a partial cross-sectional structure of the headphone assembly cut along point BB.

[0061] Figure 8 yes Figure 2 The diagram shows a structural schematic of the headphones in some embodiments;

[0062] Figure 9 yes Figure 8 The diagram shown is an exploded view of part of the structure of the headphones in some embodiments.

[0063] Figure 10 yes Figure 9 The diagram shown is a partial structural exploded view of the earpiece in some embodiments.

[0064] Figure 11 yes Figure 9 The diagram shown is a partial cross-sectional view of the earpiece cut along CC in some embodiments.

[0065] Figure 12A yes Figure 10 The diagram shows a structural schematic of the bracket in some embodiments;

[0066] Figure 12B yes Figure 12A The diagram shows the structure of the bracket at another angle;

[0067] Figure 13A yes Figure 10 The diagram shows the structure of the antenna assembly and bracket in some embodiments;

[0068] Figure 13B yes Figure 9 The diagram shows a partial structural schematic of the earpiece in some embodiments;

[0069] Figure 13C yes Figure 13B A schematic diagram of a portion of the earpiece structure shown from another angle;

[0070] Figure 14A yes Figure 10 A schematic diagram of the first subshell from another angle;

[0071] Figure 14B yes Figure 14A The diagram shows a partial cross-sectional structure of the first subshell cut along DD.

[0072] Figure 15 yes Figure 9 The diagram shows a partial structural schematic of the earpiece in some embodiments;

[0073] Figure 16A yes Figure 10 The diagram shows a partial structural schematic of the circuit board assembly in some embodiments;

[0074] Figure 16B yes Figure 16AA schematic diagram of the circuit board assembly shown from another angle;

[0075] Figure 17 yes Figure 9 The diagram shows a partial structural schematic of the earpiece in some embodiments;

[0076] Figure 18 yes Figure 17 The diagram shows a partial cross-sectional view of the earpiece structure cut along EE.

[0077] Figure 19 yes Figure 9 The diagram shows a partial structural schematic of the earpiece in some embodiments;

[0078] Figure 20A yes Figure 17 The diagram shown is a partial cross-sectional view of the earpiece cut along F1-F1 in some embodiments.

[0079] Figure 20B yes Figure 17 The diagram shown is a partial cross-sectional view of the earpiece cut along F2-F2 in some embodiments.

[0080] Figure 21A yes Figure 10 A schematic diagram of the structure of the second subshell in some embodiments;

[0081] Figure 21B yes Figure 21A The diagram shows the structure of the second subshell from another angle;

[0082] Figure 21C yes Figure 21A The diagram shows the structure of the second subshell from another angle;

[0083] Figure 22 yes Figure 21B The diagram shown is a partial structural schematic of the second subshell cut along GG in some embodiments.

[0084] Figure 23 yes Figure 9 The diagram shows a partial structural schematic of the earpiece in some embodiments;

[0085] Figure 24A yes Figure 23 The diagram shows a partial cross-sectional view of the earpiece structure cut along H1-H1 in some embodiments.

[0086] Figure 24B yes Figure 23 The diagram shows a partial cross-sectional view of the earpiece structure cut along H2-H2 in some embodiments.

[0087] Figure 25A yes Figure 10 The diagram shows a structural schematic of the second flexible circuit board in some embodiments.

[0088] Figure 25B yes Figure 9 The diagram shows a partial structural schematic of the earpiece in some embodiments;

[0089] Figure 26A yes Figure 25B The diagram shows a partial cross-sectional view of the earpiece structure cut along J1-J1 in some embodiments.

[0090] Figure 26B yes Figure 25B The diagram shows a partial cross-sectional view of the earpiece structure cut along J2-J2 in some embodiments.

[0091] Figure 27 yes Figure 9 The diagram shown is a partial cross-sectional view of the earpiece cut along CC in some embodiments.

[0092] Figure 28 yes Figure 9 The diagram shows a partial structural schematic of the earpiece in some embodiments;

[0093] Figure 29 yes Figure 9 The diagram shown is a structural schematic of the connecting arm in some implementations;

[0094] Figure 30 yes Figure 29 The diagram shown is a partial exploded view of the connecting arm in some embodiments.

[0095] Figure 31 yes Figure 29 The diagram shown is a partial structural schematic of the connecting arm in some embodiments;

[0096] Figure 32A yes Figure 30 The diagram shown is a structural schematic of the connector in some embodiments;

[0097] Figure 32B yes Figure 32A The diagram shows the structure of the connector from another angle;

[0098] Figure 33 yes Figure 8 The diagram shows a partial structural schematic of the headphones in some embodiments;

[0099] Figure 34 yes Figure 8 The diagram shown is a partial cross-sectional view of the earphones cut along point KK in some embodiments. Detailed Implementation

[0100] The embodiments of this application are described below with reference to the accompanying drawings.

[0101] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Rotary connection" refers to a connection where the components can rotate relative to each other after connection. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "top," "bottom," "inner," "outer," and "side," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the referred device or component must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In the embodiments of this application, the terms "first," "second," "third," "fourth," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features specified as "first," "second," "third," "fourth," etc., can explicitly or implicitly include one or more of that feature. The term "multiple" means at least two.

[0102] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0103] References to “some embodiments” and the like in this specification mean that one or more embodiments of this application include the specific features, structures, or characteristics described in connection with that embodiment. Therefore, phrases such as “in some embodiments”, “in other embodiments”, etc., appearing in different parts of this specification do not necessarily refer to the same embodiments, but rather mean “one or more, but not all, embodiments”, unless otherwise specifically emphasized.

[0104] The terms "comprising," "including," and variations thereof, all mean "including but not limited to," unless otherwise specifically emphasized. It is understood that the specific embodiments described herein are merely illustrative of related embodiments and not intended to limit those embodiments. Furthermore, it should be noted that, for ease of description, only the parts relevant to the embodiments are shown in the accompanying drawings.

[0105] In the embodiments of this application, the terms "parallel," "perpendicular," etc., are used in relation to the current technological level, rather than being absolutely strict mathematical definitions. Slight deviations are permissible; approximations of parallelism or perpendicularity are acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0° and 10°. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80° and 100°.

[0106] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0107] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0108] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a structural schematic diagram of an earphone assembly 1000 in one state, as provided in an embodiment of this application. Figure 2 yes Figure 1 The diagram shows a structural schematic of an earphone assembly 1000 in another state.

[0109] In some embodiments, the headphone assembly 1000 may include headphones 100 and a charging case 200. The headphones 100 can be placed inside the charging case 200. The charging case 200 can be used to store and charge the headphones 100.

[0110] The earphone 100 can be a wireless earphone. Wireless earphones can communicate with terminal devices using electromagnetic waves. For example, earphone 100 can be a Bluetooth earphone. It is understood that earphone 100 can also be an infrared earphone or other wireless earphones. This application does not strictly limit the type of earphone 100. For example, the number of earphones can be two. The two earphones can be paired with the user's left and right ears respectively. At least one of the two earphones can be placed in a charging case, in which case the charging case can be used to store and charge at least one of the two earphones.

[0111] The headphone case can be in a closed state and an open state. Figure 1 The charging case and earphones are in the following states: the earphones are inside the charging case and the charging case is closed. Figure 2 The charging case and earbuds are in the following states: the earbuds are inside the charging case and the charging case is open. It's understandable that the charging case and earbuds can also be in other states, such as the earbuds not being placed in the charging case and the charging case being closed.

[0112] Understandable, Figure 1 and Figure 2The charging case 200 and earphones 100 shown are merely illustrative; their size, shape, and structure can be customized as needed. This application does not limit the specific structure of the earphones 100 and the charging case 200.

[0113] Please refer to the following: Figure 3 and Figure 4 , Figure 3 yes Figure 2 The diagram shown is a structural schematic of the charging box 200 in some embodiments. Figure 4 yes Figure 3 The diagram shows a partial cross-sectional view of the charging box 200 cut along point AA in some embodiments.

[0114] In some embodiments, the charging case 200 may include an upper shell 201, a lower shell 202, and an opening / closing mechanism 203. The upper shell 201 may be a multi-layered structure or a single-layered structure, and the lower shell 202 may be a multi-layered structure or a single-layered structure. "Multi-layered" can be understood as two or more layers.

[0115] The opening / closing mechanism 203 connects the upper housing 201 and the lower housing 202, and enables the upper housing 201 to open or close relative to the lower housing 202. For example, when the upper housing 201 is closed relative to the lower housing 202, the upper housing 201 and the lower housing 202 together can form a receiving cavity. The receiving cavity can be used to house the earphone 100.

[0116] Please refer to the following: Figure 4 and Figure 5 , Figure 5 yes Figure 3 The diagram shows a partial structural schematic of the charging box 200 in some embodiments.

[0117] In some embodiments, the opening and closing mechanism 203 may include a support frame 2031, a rotating shaft 2032, and a torsion spring 2033. The support frame 2031 is fixedly connected to the upper housing 201, and the rotating shaft 2032 is fixedly connected to the lower housing 202, with the support frame 2031 and the rotating shaft 2032 rotatably connected. The support frame 2031 can rotate relative to the rotating shaft 2032, thereby causing the upper housing 201 to rotate relative to the rotating shaft 2032, so that the upper housing 201 can open or close relative to the lower housing 202. Understandably, the rotating shaft 2032 can be fixed to the lower housing 202 by an adhesive (such as hot melt adhesive), a snap-fit, or other fixing structure, or the rotating shaft 2032 can also be welded to the lower housing 202.

[0118] It is understood that when the opening and closing mechanism 203 in this embodiment includes a support frame 2031 and a rotating shaft 2032, the rotating shaft 2032 can be fixed to the inside of the lower housing 202, and the support frame 2031 can also be disposed inside the receiving cavity formed by the upper housing 201 and the lower housing 202. When the charging box 200 is closed, the opening and closing mechanism 203 is not visible from the outside of the charging box 200, that is, the opening and closing mechanism 203 can be set as a hidden structure, which is beneficial to increasing the aesthetic appearance of the charging box 200 and can also reduce the gap between the upper housing 201 and the lower housing 202, preventing external impurities or liquids from entering the interior of the charging box 200.

[0119] In some embodiments, the lower housing 202 may be provided with a rotating hole 2020, and one end of the torsion spring 2033 may be located within the rotating hole 2020 and can rotate within the rotating hole 2020. The support frame 2031 may be provided with a mounting hole 2034, and one end of the torsion spring 2033 may be located within the mounting hole 2034 and abut against the inner wall of the mounting hole 2034. In this embodiment, the torsion spring 2033 can be used to increase the resistance during the opening and closing process of the charging case 200, enhancing the user's feel when opening or closing the charging case 200. In some other embodiments, the opening and closing mechanism 203 may not include the torsion spring 2033.

[0120] Please see Figure 6 , Figure 6 yes Figure 3 The diagram shown is a partial exploded view of the lower housing 202 in some embodiments.

[0121] In some embodiments, the lower housing 202 of the charging case 200 can be a multi-layer structure, such as a two-layer structure. The lower housing 202 may include a bracket 202A and a bottom housing 202B. The bottom housing 202B may enclose an installation space 2021, and the bracket 202A may be located in the installation space 2021 and fixedly connected to the bottom housing 202B.

[0122] For example, the holder 202A may include a first receiving groove 2022 and a second receiving groove 2023. The shapes of the first receiving groove 2022 and the second receiving groove 2023 may be the same or different, and the shapes of the first receiving groove 2022 and the second receiving groove 2023 may be specifically designed according to the shape of the earphone 100. In this embodiment, the charging case 200 can be used to store the earphone 100. For example, two earphones 100 can be placed in the first receiving groove 2022 and the second receiving groove 2023 respectively. That is, the first receiving groove 2022 and the second receiving groove 2023 can be used to accommodate two earphones 100. The holder 202A can isolate the earphone 100 from the devices in the charging case 200 and is used to support the earphone 100. The holder 202A can be a one-piece structure or a modular structure assembled from parts.

[0123] For example, the first receiving groove 2022 may include a first groove portion 2022a, a second groove portion 2022b, and a third groove portion 2022c. The second groove portion 2022b of the first receiving groove 2022 is located between the first groove portion 2022a and the third groove portion 2022c, and connects the first groove portion 2022a and the second groove portion 2022b. The first groove portion 2022a and the third groove portion 2022c of the first receiving groove 2022 are both located on the same side of the second groove portion 2022b. The second receiving groove 2023 may include a first groove portion 2023a, a second groove portion 2023b, and a third groove portion 2023c. The second groove portion 2023b of the second receiving groove 2023 is located between the first groove portion 2023a and the third groove portion 2023c, and connects the first groove portion 2023a and the second groove portion 2023b. The first groove 2023a and the third groove 2023c of the second receiving groove 2023 are both located on the same side of the second groove 2023b.

[0124] For example, the second groove portion 2022b of the first receiving groove 2022 and the second groove portion 2023b of the second receiving groove 2023 at least partially overlap to form an overlapping region 2023d. The first groove portion 2022a of the first receiving groove 2022 and the first groove portion 2023a of the second receiving groove 2023 are respectively located on both sides of the overlapping region 2023d. The third groove portion 2022c of the first receiving groove 2022 and the third groove portion 2023c of the second receiving groove 2023 are respectively located on both sides of the overlapping region 2023d. For example, Figure 6 The approximate location of the overlapping region 2023d is schematically outlined using a dashed box.

[0125] In this embodiment of the application, when the two earphones 100 of the earphone assembly 1000 are respectively placed in the first receiving slot 2022 and the second receiving slot 2023, a portion of the structure of the two earphones 100 can be arranged to cross and stack in the overlapping area 2023d (see [link]). Figure 2 ).

[0126] For example, the bracket 202A also includes a first through hole 2024a, a second through hole 2024b, a third through hole 2024c, and a fourth through hole (not shown). The first through hole 2024a and the second through hole 2024b can both penetrate the wall of the first receiving groove 2022. The first through hole 2024a and the second through hole 2024b can be spaced apart and arranged opposite to each other. The third through hole 2024c and the fourth through hole can both penetrate the wall of the second receiving groove 2023. The third through hole 2024c and the fourth through hole can be spaced apart and arranged opposite to each other.

[0127] For example, the charging box 200 may also be provided with a liquid storage tank 2025. There may be two liquid storage tanks 2025. The opening of the first liquid storage tank 2025 may be located on the wall of the first receiving tank 2022. The first liquid storage tank 2025 may be located between the first through hole 2024a and the second through hole 2024b, in which case the first liquid storage tank 2025 can connect to the first portion of the first receiving tank 2022. The opening of the second liquid storage tank 2025 is located on the wall of the second receiving tank 2023. The second liquid storage tank 2025 may be located between the third through hole 2024c and the fourth through hole, in which case the second liquid storage tank 2025 can connect to the first portion of the second receiving tank 2023. In other examples, there may also be only one liquid storage tank 2025, in which case the liquid storage tank 2025 may be located in either the first receiving tank 2022 or the second receiving tank 2023. The number of liquid storage tanks 2025 may be more than two, in which case the liquid storage tanks 2025 may be located in the first receiving tank 2022 and / or the second receiving tank 2023. This application does not limit the number or location of the liquid storage tanks 2025.

[0128] In some embodiments, the charging case 200 may further include a circuit board 2026, which may be located between the bracket 202A and the bottom shell 202B, and fixedly connected to the bottom shell 202B. It is understood that the circuit board 2026 may be fixed to the inner wall of the lower shell 202 or to a structural component within the lower shell 202. This embodiment does not limit the fixed position of the circuit board 2026 in the lower shell 202. In this embodiment, the number of circuit boards 2026 may be one. The electronic components on the circuit board 2026 may be protected by applying adhesive.

[0129] In some embodiments, the circuit board 2026 is provided with a first spring assembly and a second spring assembly. The first spring assembly and the second spring assembly are spaced apart and both protrude from the top surface of the circuit board 2026. It is understood that the top surface of the circuit board 2026 is the side surface of the circuit board 2026 facing the bracket 202A.

[0130] For example, the first spring assembly 2027 may include a first spring 2027a, a second spring 2027b, and two spring supports 2027c. Both spring supports 2027c are fixedly connected to the top surface of the circuit board 2026. The first spring 2027a of the first spring assembly 2027 may be fixedly connected to one of the spring supports 2027c and electrically connected to the circuit board 2026. The second spring 2027b of the first spring assembly 2027 may be fixedly connected to the other spring support 2027c and electrically connected to the circuit board 2026. The first spring 2027a and the second spring 2027b are spaced apart and arranged opposite to each other.

[0131] For example, the second spring assembly 2028 may include a third spring 2028a, a fourth spring 2028b, and two spring supports 2028c. Both spring supports 2028c are fixedly connected to the top surface of the circuit board 2026. The third spring 2028a may be fixedly connected to one of the spring supports 2028c and electrically connected to the circuit board 2026. The fourth spring 2028b may be fixedly connected to the other spring support 2028c and electrically connected to the circuit board 2026. The third spring 2028a and the fourth spring 2028b are spaced apart and arranged opposite to each other.

[0132] In some embodiments, the charging case 200 may further include a first magnet 2029a and a second magnet 2029b. Both the first magnet 2029a and the second magnet 2029b are fixedly connected to the circuit board 2026. At least a portion of the first magnet 2029a may be located between the first spring contact 2027a and the second spring contact 2027b, and at least a portion of the second magnet 2029b may be located between the third spring contact 2028a and the fourth spring contact 2028b.

[0133] For example, the charging case 200 may further include a charging interface 2029c. The charging interface 2029c may be fixedly connected to the circuit board 2026 and electrically connected to the circuit board 2026. In this embodiment, the mounting space 2021 of the bottom shell 202B may also be used to accommodate the battery of the charging case 200. After the battery, circuit board 2026, and other components of the charging case 200 are installed in the bottom shell 202B, the bracket 202A can be fixed to the bottom shell 202B. At this time, the battery, circuit board 2026, and charging interface 2029c may be located between the bracket 202A and the bottom shell 202B.

[0134] In this embodiment, the charging case 200 can be used to charge the earphones 100. Functional components of the charging case 200, such as the battery, circuit board 2026, and charging interface 2029c, can be housed within the mounting space 2021 of the bottom shell 202B. The charging interface 2029c is electrically connected to the battery inside the bottom shell 202B, and can be used to charge the battery after being connected to an external power source. When the earphones 100 are placed inside the charging case 200, the battery in the charging case 200 can charge the earphones 100. While charging the charging case 200, the earphones 100 can also be placed inside the charging case 200, so both the charging case 200 and the earphones 100 can be charged.

[0135] In some embodiments, the charging case 200 may further include a button 2029d, which is electrically connected to the circuit board 2026. By touching the button 2029d, the user can put the earphones 100 into a re-pairing mode. At this time, the earphones 100 can re-pair and reconnect to the terminal device.

[0136] Please refer to the following: Figure 5 and Figure 6 In some embodiments, at least a portion of the first spring tab 2027a may be exposed relative to the first through hole 2024a of the bracket 202A. At least a portion of the second spring tab 2027b may be exposed relative to the second through hole 2024b of the bracket 202A. It is understood that the first spring tab 2027a may be partially or fully exposed relative to the first through hole 2024a. The second spring tab 2027b may be partially or fully exposed relative to the second through hole 2024b.

[0137] In the embodiments of this application, the first spring 2027a and the second spring 2027b of the first spring assembly 2027 can be used to electrically connect to the positive and negative terminals of an external power source, respectively. For example, the first spring 2027a can be used to electrically connect to the positive terminal of the external power source, and the second spring 2027b can be used to electrically connect to the negative terminal of the external power source; or, the first spring 2027a can also be used to electrically connect to the negative terminal of the external power source, and the second spring 2027b can also be used to electrically connect to the positive terminal of the external power source. This application does not impose strict limitations on this.

[0138] In some embodiments, at least a portion of the third spring 2028a of the second spring assembly 2028 may be exposed relative to the third through hole 2024c of the bracket 202A. At least a portion of the fourth spring 2028b of the second spring assembly 2028 may be exposed relative to the fourth through hole of the bracket 202A. It is understood that the third spring 2028a may be partially or fully exposed relative to the third through hole 2024c. The fourth spring 2028b may be partially or fully exposed relative to the fourth through hole. In embodiments of this application, the third spring 2028a and the fourth spring 2028b of the second spring assembly 2028 may be used for electrical connection to the positive and negative terminals of an external power source, respectively.

[0139] Please refer to the following: Figure 6 and Figure 7 , Figure 7 yes Figure 2 The diagram shows a partial cross-sectional view of the headphone assembly 1000 cut along point BB.

[0140] In some embodiments, the earphone 100 may include two charging terminals 101, namely a first charging terminal 101a and a second charging terminal 101b. The first charging terminal 101a and the second charging terminal 101b are arranged alternately. The structure and arrangement of the first charging terminal 101a and the second charging terminal 101b of the earphone 100 will be described in detail below, and will not be elaborated here. When the earphone 100 is housed in the first receiving slot 2022, the first charging terminal 101a and the second charging terminal 101b can abut against the first spring contact assembly 2027 of the charging case 200. For example, the first charging terminal 101a can abut against the first spring contact 2027a, and the second charging terminal 101b can abut against the second spring contact 2027b. In this way, an electrical circuit can be formed between the first spring contact 2027a, the first charging terminal 101a, the second charging terminal 101b, and the second spring contact 2027b, so that the charging case 200 can charge the earphone 100.

[0141] Similarly, when the earphone 100 is housed in the second receiving slot 2023, the first charging terminal 101a and the second charging terminal 101b can abut against the second spring contact assembly 2028 of the charging case 200. For example, the first charging terminal 101a can abut against the third spring contact 2028a, and the second charging terminal 101b can abut against the fourth spring contact. In this way, an electrical circuit can be formed between the third spring contact 2028a, the first charging terminal 101a, the second charging terminal 101b, and the fourth spring contact 2028b, so that the charging case 200 can charge the earphone 100.

[0142] In this embodiment, the charging case 200 is electrically connected to the earphone 100 via the first spring contact assembly 2027 and / or the second spring contact assembly 2028, thereby charging the earphone 100. Because the spring contact has high elasticity and can withstand significant tension, it can firmly abut against the charging terminal 101 of the earphone 100, making the charging circuit between the charging case 200 and the earphone 100 less prone to disconnection, resulting in better reliability of the earphone assembly 1000's charging performance. Secondly, because the spring contact has good shielding effect, using it for connection can effectively shield electromagnetic interference, which helps improve the reliability of the earphone assembly 1000 during charging. Furthermore, the spring contact also has strong corrosion resistance, making it less susceptible to corrosion and damage from sweat on the earphone 100, resulting in a longer service life and further ensuring the charging performance of the earphone assembly 1000. Moreover, the spring contact is low in cost. The installation and replacement of the spring contact are also relatively simple.

[0143] Furthermore, in this embodiment, the first spring 2027a and the second spring 2027b of the first spring assembly 2027 are spaced apart and arranged opposite to each other, and the third spring 2028a and the fourth spring 2028b of the second spring assembly 2028 are spaced apart and arranged opposite to each other. The first charging terminal 101a and the second charging terminal 101b of the earphone 100 are also spaced apart. This ensures that when the charging case 200 charges the earphone 100, the large distance between the first charging terminal 101a and the second charging terminal 101b of the earphone 100 prevents electrical conduction between the first charging terminal 101a and the second charging terminal 101b after the earphone 100 comes into contact with water or sweat, thus preventing electrolytic corrosion. This helps ensure the reliability of the first spring assembly 2027 and the second spring assembly 2028. Therefore, the charging performance of the earphone assembly 1000 has better reliability.

[0144] In this embodiment, when the earphones 100 are placed in the charging case 200 for charging, the two earphones 100 can be accommodated in the first receiving slot 2022 and the second receiving slot 2023, respectively. At this time, the opening of the liquid storage tank 2025 can face the earcups 10 of the earphones 100. In this way, liquid on the surface of the earphones 100, such as sweat, can flow into the liquid storage tank 2025 of the charging case 200. It is understood that the liquid storage tank 2025 can be used to collect liquid on the surface of the earphones 100, thereby reducing the impact of liquid on the surface of the earphones 100 on the electrical connection between the first spring assembly 2027 and the second spring assembly 2028 and the charging terminal 101 of the earphones 100, thereby improving the reliability of the charging performance of the earphone assembly 1000.

[0145] It is understood that in this application, the two earphones 100 of the earphone assembly 1000 can have the same or similar structures, symmetrical or partially symmetrical structures, or different structures. In this embodiment, the two earphones 100 have symmetrical structures. The following will take one earphone 100 (e.g., the earphone 100 corresponding to the user's left ear) as an example and describe the structure of the earphone 100 in detail with reference to the relevant drawings. The basic design of the component structure of the other earphone 100 (e.g., the earphone 100 corresponding to the user's right ear), the design of the connection relationship between the components, and the design of the connection relationship between the components and other structures outside the assembly can all refer to the relevant solutions of the first earphone 100. At the same time, it is permissible for the two earphones 100 to have slight differences in the detailed structure or positional arrangement of the components.

[0146] Please refer to the following: Figure 8 and Figure 9 , Figure 8 yes Figure 2 The diagram shown is a structural schematic of the earphone 100 in some embodiments. Figure 9 yes Figure 8 The diagram shown is an exploded view of part of the structure of the earphone 100 in some embodiments.

[0147] In some embodiments, the earphone 100 includes an earcup 10 and a connecting arm 20. The connecting arm 20 includes a first end 21 and a second end 22. The first end 21 of the connecting arm 20 is connected to the earcup 10. Exemplarily, the connecting arm 20 is curved. The second end 22 of the connecting arm 20 is curved toward the earcup 10. It is understood that, in the direction of extension from the first end 21 to the second end 22 of the connecting arm 20, the connecting arm 20 first moves away from the earcup 10 and then moves closer to the earcup 10. The second end 22 of the connecting arm 20 may be located on the side of the earcup away from the first end 21 of the connecting arm 20.

[0148] Please refer to the following: Figure 10 and Figure 11 , Figure 10 yes Figure 9 The diagram shown is an exploded view of part of the structure of the earpiece 10 in some embodiments. Figure 11 yes Figure 9 The earpiece 10 shown is a schematic diagram of a partial cross-sectional structure cut along CC in some embodiments.

[0149] In some embodiments, the earpiece 10 may include a housing 11, a sensor 12, an antenna assembly 13, a support 14, a circuit board assembly 15, a speaker 16, a first flexible circuit board 17, a second flexible circuit board 18, and a magnet 19. The housing 11 encloses a receiving space 110. The sensor 12, antenna assembly 13, support 14, circuit board assembly 15, speaker 16, first flexible circuit board 17, second flexible circuit board 18, and magnet 19 are all located within the receiving space 110 of the housing 11. The sensor 12 may be disposed on the first flexible circuit board 17. The antenna assembly 13 may be disposed on the support 14.

[0150] For example, the housing 11 may include a first sub-housing 111 and a second sub-housing 112. The first sub-housing 111 is fixedly connected to the second sub-housing 112. For instance, both the first sub-housing 111 and the second sub-housing 112 may be provided with snap-fit ​​protrusions and snap-fit ​​grooves, and the first sub-housing 111 and the second sub-housing 112 can be relatively fixed by the mutual cooperation of the snap-fit ​​protrusions and snap-fit ​​grooves. The first sub-housing 111 and the second sub-housing 112 together enclose the receiving space 110.

[0151] For example, the housing 11 includes a first surface 11a, a second surface 11b, and a third surface 11c. The first surface 11a and the second surface 11b are disposed facing away from each other, and both the first surface 11a and the second surface 11b face away from the receiving space 110. The third surface 11c connects the first surface 11a and the second surface 11b. It can be understood that the first surface 11a of the housing 11 may be the side surface of the first sub-shell 111 facing away from the second sub-shell 112. The second surface 11b of the housing 11 may be the side surface of the second sub-shell 112 facing away from the first sub-shell 111. A portion of the third surface 11c of the housing 11 is located in the second sub-shell 112, and another portion is located in the first sub-shell 111. In the embodiments of this application, the first surface 11a, the second surface 11b, and the third surface 11c of the housing 11 are all external surfaces of the earpiece 10.

[0152] For example, the shell 11 of the earbud 10 includes a major axis A1 and a minor axis A2. The major axis A1 of the shell 11 is the line connecting the two farthest endpoints of the shell 11 on the first surface 11a. The minor axis A2 of the shell 11 is located on the first surface 11a, passes through the center of the major axis A1, and is perpendicular to the major axis A1. For ease of description later, the extension direction of the major axis A1 of the earbud 10 is defined as the X-axis direction, the extension direction of the minor axis A2 of the earbud 10 is defined as the Y-axis direction, and the Z-axis direction is perpendicular to both the major and minor axis directions of the earbud 10. The X-axis and Y-axis are perpendicular to each other.

[0153] In some embodiments, the first flexible circuit board 17, the support 14, the circuit board assembly 15, and the speaker 16 can be arranged sequentially along a first direction. This first direction points from the support 14 to the speaker 16. That is, the first direction points from the first surface 11a of the housing 11 to the second surface 11b of the housing 11. It is understood that the first direction can be the Z-axis direction. The first surface 11a and the second surface 11b can be arranged facing away from each other in the Z-axis direction.

[0154] In this embodiment, the sound-emitting surface of the speaker 16 may face away from the circuit board assembly 15. It is understood that the sound emitted by the speaker 16 may be transmitted toward one side of the second surface 11b of the housing 11. At least a portion of the sensor 12 disposed on the first flexible circuit board 17 may be disposed facing away from the sound-emitting surface of the speaker 16. At least a portion of the bracket 14 may be located between the sensor 12 and the speaker 16.

[0155] Please refer to the following: Figure 12A and Figure 12B , Figure 12A yes Figure 10 The diagram shown is a structural schematic diagram of the bracket 14 in some embodiments. Figure 12B yes Figure 12A The diagram shows the structure of the bracket 14 at another angle.

[0156] In some embodiments, the bracket 14 includes a first surface 141 and a second surface 142 disposed opposite to each other. For example, the first surface 141 and the second surface 142 of the bracket 14 may be disposed opposite to each other in a first direction. Exemplarily, the bracket 14 is provided with a clearance groove 143. The opening of the clearance groove 143 is located on the first surface 141 of the bracket 14. The clearance groove 143 may be located approximately at the middle position of the bracket 14.

[0157] For example, the bracket 14 further includes a first through hole 144a, a second through hole 144b, and a third through hole 144c, which are spaced apart. The first through hole 144a, the second through hole 144b, and the third through hole 144c can all penetrate the first surface 141 and the second surface 142 of the bracket 14. The first through hole 144a, the second through hole 144b, and the third through hole 144c can be located within a relief groove 143 of the bracket 14. Specifically, the first through hole 144a and the second through hole 144b can be approximately located at the center of the relief groove 143. The third through hole 144c can be approximately located at the edge of the relief groove 143.

[0158] For example, the bracket 14 may further include a first positioning hole 145a and a second positioning hole 145b spaced apart. Both the first positioning hole 145a and the second positioning hole 145b can penetrate the first surface 141 and the second surface 142 of the bracket 14. The first positioning hole 145a and the second positioning hole 145b can be located within the clearance groove 143 of the bracket 14, and are located on both sides of the first through hole 144a and the second through hole 144b.

[0159] For example, the bracket 14 may further include a first clearance hole 146 and a second clearance hole 147 spaced apart. Both the first clearance hole 146 and the second clearance hole 147 can penetrate the first surface 141 and the second surface 142 of the bracket 14. The first clearance hole 146 and the second clearance hole 147 can be located on both sides of the clearance groove 143. It is understood that the first clearance hole 146 and the second clearance hole 147 can be used to avoid interference between the bracket 14 and other structural components of the earpiece 10.

[0160] For example, the bracket 14 may also include a limiting hole 148. The limiting hole 148 may extend through the first surface 141 and the second surface 142 of the bracket 14 and be spaced apart from the clearance groove 143. A portion of the limiting hole 148 may extend along the X-axis direction and a portion may extend along the Y-axis direction.

[0161] It is understood that this application does not strictly limit the shape and size of the first through hole 144a, the second through hole 144b, the third through hole 144c, the first positioning hole 145a, the second positioning hole 145b, the first clearance hole 146, the second clearance hole 147, and the limiting hole 148.

[0162] For example, the support 14 may also be provided with multiple avoidance areas 149. It is understood that the avoidance areas 149 can be used to avoid interference between the support 14 and other structural components of the earpiece 10.

[0163] Please refer to the following: Figures 13A to 13C , Figure 13A yes Figure 10 The diagram shown is a structural schematic of the antenna assembly 13 and the bracket 14 in some embodiments. Figure 13B yes Figure 9 The diagram shown is a partial structural schematic of the earpiece 10 in some embodiments. Figure 13C yes Figure 13B A schematic diagram of a portion of the earpiece 10 shown from another angle. Exemplary, Figure 13B and Figure 13C The diagram mainly shows the assembly structure between the antenna assembly 13 and the bracket 14.

[0164] In some embodiments, the antenna assembly 13 is fixedly connected to the bracket 14. Exemplarily, the antenna assembly 13 may be fixedly connected to the first surface 141 of the bracket 14. It is understood that the bracket 14 can be used to support the antenna assembly 13. Exemplarily, the antenna assembly 13 may be formed on the first surface 141 of the bracket 14 using laser-direct structuring (LDS) technology. In other examples, the antenna assembly 13 may also be fixed to the bracket 14 by means of adhesive bonding or other methods.

[0165] In some embodiments, antenna assembly 13 may include a first antenna 131 and a second antenna 132. The first antenna 131 and the second antenna 132 may be arranged at intervals. The first antenna 131 may be a main antenna, and the second antenna 132 may be a side antenna, also known as an auxiliary antenna. The second antenna 132 can optimize network connectivity through signal diffusion and scattering, reducing the impact of human presence on signal transmission of antenna assembly 13, thereby enhancing the signal reception capability of antenna assembly 13 and improving its efficiency. It is understood that the cooperation of the first antenna 131 and the second antenna 132 results in better signal reception for the speaker. In other embodiments, antenna assembly 13 may not include the second antenna 132.

[0166] For example, the first antenna 131 may include a first portion 1311 and a second portion 1312. The first portion 1311 of the first antenna 131 is connected to the second portion 1312. The first portion 1311 may be disposed around the clearance groove 143 of the bracket 14. The second portion 1312 of the first antenna 131 may be disposed within the clearance groove 143 of the bracket 14 and extend to the wall of the first through hole 144a and the second through hole 144b.

[0167] For example, the second antenna 132 may include a first portion 1321 and a second portion 1322. The first portion 1321 of the second antenna 132 is connected to the second portion 1322. The first portion 1321 of the second antenna 132 may be disposed around the clearance slot 143 of the bracket 14. The second portion 1322 of the second antenna 132 may be disposed within the clearance slot 143 of the bracket 14 and extend to the wall of the third through hole 144c.

[0168] In some embodiments, the antenna assembly 13 may further include a first electrical connector 133, a second electrical connector 134, and a third electrical connector 135. The first electrical connector 133, the second electrical connector 134, and the third electrical connector 135 can all be fixedly connected to the second surface 142 of the bracket 14. The first electrical connector 133 may be disposed around the first through hole 144a. The first electrical connector 133 can be connected to and electrically connected to the second portion 1312 of the first antenna 131. The second electrical connector 134 may be disposed around the second through hole 144b. The second electrical connector 134 can be connected to and electrically connected to the second portion 1312 of the first antenna 131. The third electrical connector 135 may be disposed around the third through hole 144c. The third electrical connector 135 can be connected to and electrically connected to the second portion 1322 of the second antenna 132. Exemplarily, the first electrical connector 133, the second electrical connector 134, and the third electrical connector 135 can all be copper sheets.

[0169] Please refer to the following: Figure 14A and Figure 14B , Figure 14A yes Figure 10 The diagram shows the structure of the first subshell 111 from another angle. Figure 14B yes Figure 14A The diagram shows a partial cross-sectional structure of the first subshell 111 cut along DD.

[0170] In some embodiments, the first sub-shell 111 may enclose a first sub-accommodating space 1110. It is understood that the first sub-accommodating space 1110 may be the accommodating space 110 of the shell 11 (see [link to documentation]). Figure 11 Part of ).

[0171] For example, the first sub-shell 111 may include a first outer surface 1111 and a first inner surface 1112. The first outer surface 1111 surrounds the first surface (see [link to documentation]). Figure 11 The outer periphery of the surface is connected to the first surface 11a (see [reference]). Figure 11 The first outer surface 1111 faces away from the first sub-accommodating space 1110. It can be understood that the first outer surface 1111 is the third surface 11c of the housing 11 (see [reference]). Figure 11 Part of the first inner surface 1112 faces the first sub-accommodating space 1110. It is understood that a portion of the first inner surface 1112 may be disposed opposite to the first surface 11a, and another portion may be disposed opposite to the first outer surface 1111.

[0172] For example, the first subshell 111 may include a first limiting structure 1113a and a second limiting structure 1113b. Both the first limiting structure 1113a and the second limiting structure 1113b may protrude from the first inner surface 1112. Specifically, the first limiting structure 1113a may protrude from the first inner surface 1112 along the Z-axis direction. The second limiting structure 1113b may protrude from the first inner surface 1112, and the protrusion direction of the second limiting portion is set at an angle to the first direction; for example, the second limiting portion may protrude from the first inner surface 1112 along the Y-axis direction.

[0173] For example, the first sub-shell 111 may further include a first positioning post 1114a and a second positioning post 1114b spaced apart. Both the first positioning post 1114a and the second positioning post 1114b may protrude from the first inner surface 1112 and are spaced apart from the first limiting structure 1113a and the second limiting structure 1113b. For example, the first positioning post 1114a and the second positioning post 1114b may protrude from the first inner surface 1112 along the Z-axis direction.

[0174] For example, the first sub-shell 111 may further include a plurality of connecting portions 1115. The connecting portions 1115 may protrude from the first inner surface 1112. The connecting portions 1115 are spaced apart from the first limiting structure 1113a, the second limiting structure 1113b, the first positioning post 1114a, and the second positioning post 1114b. For example, the connecting portions 1115 may protrude from the first inner surface 1112 along the Z-axis direction.

[0175] In some embodiments, the first sub-shell 111 may further include a first pickup hole 1116 and a second pickup hole 1117 spaced apart. One end of the first pickup hole 1116 may be located on the first outer surface 1111 of the first sub-shell 111, i.e., on the third surface 11c of the shell 11, and the other end may connect to the first sub-accommodating space 1110. Exemplarily, the first pickup hole 1116 may be curved. The first pickup hole 1116 may include a first portion 1116a and a second portion 1116b. The first portion 1116a of the first pickup hole 1116 may extend along the Y-axis and penetrate the first outer surface 1111, and the second portion 1116b may extend along the Z-axis and connect the first portion and the first sub-accommodating space 1110. One end of the second pickup hole 1117 may be located on the first outer surface 1111 of the first sub-shell 111, i.e., on the third surface 11c of the shell 11, and the other end may connect to the first sub-accommodating space 1110. For example, the second pickup hole 1117 may be curved. The second pickup hole 1117 may include a first portion 1117a and a second portion 1117b. The first portion 1117a of the second pickup hole 1117 may extend along the Y-axis direction and penetrate through the first outer surface 1111, and the second portion 1117b may extend along the Z-axis direction and connect the first portion and the first sub-accommodating space 1110.

[0176] For example, the line connecting the first pickup hole 1116 and the second pickup hole 1117 is the first connecting line L1. The third connecting line is set at an angle to the major axis A1 of the housing 11. It can be understood that when the user wears the headphones 100, the extension direction of the first connecting line L1 can point towards the mouth, and the first pickup hole 1116 can be closer to the mouth than the second pickup hole 1117.

[0177] In some embodiments, the length of the first connecting line L1 is greater than or equal to 15 mm. For example, the length of the first connecting line L1 can be 15 mm, 18 mm, 20 mm, 22 mm, 25 mm, etc.

[0178] Please see Figure 15 , Figure 15 yes Figure 9 The earpiece 10 shown is a partial structural schematic diagram in some embodiments. Exemplary, Figure 15 The diagram mainly shows the assembly structure of the first sub-shell 111 and the bracket 14.

[0179] In some embodiments, the bracket 14 is fixedly connected to the housing 11. For example, the first surface 141 of the bracket 14 (see [reference]) Figure 13BThe bracket 14 can be fixedly connected to the first sub-shell 111. For example, the first limiting structure 1113a of the first sub-shell 111 can pass through the limiting hole 148 of the bracket 14 to limit the displacement of the bracket 14 in the X-axis and / or Y-axis directions. For example, the second limiting structure 1113b can abut against the bracket 14 to limit the displacement of the bracket 14 in the Z-axis direction. Furthermore, the cooperation between the first limiting structure 1113a, the second limiting structure 1113b, and the bracket 14 facilitates the positioning of the bracket 14 and the assembly of the bracket 14 with the first sub-shell 111.

[0180] For example, the first positioning post 1114a of the first sub-shell 111 can pass through the first positioning hole 145a of the bracket 14. The second positioning post 1114b of the first sub-shell 111 can pass through the second positioning hole 145b of the bracket 14. The first positioning post 1114a and the second positioning post 1114b can be used for positioning the bracket 14, facilitating the assembly of the bracket 14 with the first sub-shell 111.

[0181] For example, the multiple connecting portions 1115, the first pickup hole 1116, and the second pickup hole 1117 of the first sub-shell 111 can all pass through the clearance area 149 of the bracket 14. It is understood that the clearance area 149 of the bracket 14 can be used to avoid structures such as the connecting portions 1115, the first pickup hole 1116, and the second pickup hole 1117 of the first sub-shell 111.

[0182] Please refer to the following: Figure 16A and Figure 16B , Figure 16A yes Figure 10 The circuit board assembly 15 shown is a partial structural schematic diagram in some embodiments. Figure 16B yes Figure 16A The schematic diagram of the circuit board assembly 15 shown from another angle.

[0183] In some embodiments, the circuit board assembly 15 may include a first region 15A and a second region 15B, which may be arranged along the X-axis direction. For example, Figure 16A and Figure 16B The first region 15A and the second region 15B are schematically divided using dashed lines.

[0184] In some embodiments, the circuit board assembly 15 may include a first circuit board 151, a first electronic device 152, and a second electronic device 153. Both the first electronic device 152 and the second electronic device 153 are fixedly connected to and electrically connected to the first circuit board 151. The circuit board can serve as a carrier for the first electronic device 152 and the second electronic device 153. For example, a portion of the first circuit board 151 may be located in a first region 15A, and another portion may be located in a second region 15B. The first electronic device 152 may be located in the first region 15A of the circuit board assembly 15. The second electronic device 153 may be located in the second region 15B.

[0185] For example, the first circuit board 151 may include a first surface 1511 and a second surface 1512 disposed opposite to each other. For instance, the first surface 1511 and the second surface 1512 of the first circuit board 151 may be disposed opposite to each other along a first direction. Both the first surface 1511 and the second surface 1512 of the first circuit board 151 are provided with a first electronic device 152.

[0186] For example, the circuit board assembly 15 may further include a first connecting end 1541, a second connecting end 1542, and a third connecting end 1543 spaced apart. The first connecting end 1541, the second connecting end 1542, and the third connecting end 1543 may be fixedly connected to a first surface 1511 of the first circuit board 151. The first connecting end 1541, the second connecting end 1542, and the third connecting end 1543 may be located in a second region 15B of the circuit board assembly 15. In some examples, the first connecting end 1541, the second connecting end 1542, and the third connecting end 1543 may be flexible metal components such as metal springs or pogo pins.

[0187] In this embodiment, the first electronic device 152 can be an active device such as a chip, or a passive device such as a capacitor, inductor, or resistor. It is understood that the first electronic device 152 can be selected and combined in different types and quantities to give the circuit board assembly 15 a specific function. Those skilled in the art can select the type and quantity of the first electronic device 152 according to actual needs, and this application does not limit this selection.

[0188] In some embodiments, the first electronic device 152 may include a power supply device 1521. It is understood that the power supply device 1521 refers to a component that provides power, primarily used to convert alternating current (AC) energy into direct current (DC) energy usable by the headphones 100. The power supply device 1521 generally includes a transformer, rectifier, voltage regulator, etc.

[0189] In some embodiments, the first electronic device 152 may include an inductor 1522. The inductor 1522 may be disposed on the first surface 1511 of the first circuit board 151.

[0190] In some embodiments, the first electronic device 152 may include a plurality of capacitors 1523. The plurality of capacitors 1523 are spaced apart. A portion of the plurality of capacitors 1523 may be disposed on a first surface 1511 of the first circuit board 151, and a portion may be disposed on a second surface 1512 of the first circuit board 151. For example, Figure 16A and Figure 16B The capacitor 1523 is schematically outlined using a dashed box. For example, capacitor 1523 can be a ground capacitance 1523, referring to the capacitance 1523 present between the transmission and distribution line and ground.

[0191] For example, capacitor 1523 can be approximately rectangular. The length of capacitor 1523 is less than 1 mm, and the width is less than 0.5 mm. It is understood that capacitor 1523 can use a smaller package size. For example, the length of capacitor 1523 can be 0.6 mm, and the width can be 0.3 mm. That is, capacitor 1523 can use a "0201 package". In other examples, capacitor 1523 can also use other package forms smaller than the "0402 package" size.

[0192] It is understandable that capacitor 1523 exhibits a piezoelectric effect. When capacitor 1523 is energized, it deforms, causing deformation of the first circuit board 151 of the circuit board assembly 15, which in turn causes the first circuit board 151 to vibrate and generate current noise. This embodiment reduces the package size of capacitor 1523, thereby reducing the degree of deformation of both capacitor 1523 and the first circuit board 151, and consequently reducing the vibration amplitude of the first circuit board 151. This helps reduce the current noise generated by the vibration of the first circuit board 151, thus improving the sound quality of the headphones 100.

[0193] In some embodiments, the plurality of capacitors 1523 may include a first capacitor 1523a and a second capacitor 1523b. The length extension direction of the first capacitor 1523a is set at an angle to the length extension direction of the second capacitor 1523b. For example, the length extension direction of the first capacitor 1523a and the length extension direction of the second capacitor 1523b are perpendicular to each other. It is understood that, in this embodiment, the vibration direction of the first circuit board 151 when it vibrates due to the deformation of the first capacitor 1523a is the first vibration direction. The vibration direction of the first circuit board 151 when it vibrates due to the deformation of the second capacitor 1523b is the second vibration direction. By setting the length extension direction of the first capacitor 1523a and the length extension direction of the second capacitor 1523b at an angle, the first vibration direction and the second vibration direction are also set at an angle, thereby reducing the vibration amplitude of the first circuit board 151 in the same direction, which helps to reduce current noise and improve the sound quality of the headphones 100.

[0194] In some embodiments, the circuit board assembly may further include multiple power traces 155. Power traces 155 may be disposed on the first circuit board 151 for electrical connection to the headphone's battery. It is understood that the power traces 155 are used to electrically connect the power device 1521 of the circuit board assembly 15 to the battery of the headphone 100 to provide power to the earpiece 10. The power traces 155 may be power traces (BAT power traces) or SYS power traces for the headphone 100's battery. Exemplarily, the multiple power traces 155 may include a first power trace 1551 and a second power trace 1552. In the Z-axis direction, the first power trace 1551 and the second power trace 1552 are at least partially stacked. In other words, at least a portion of the first power trace 1551 and at least a portion of the second power trace 1552 may be stacked in the Z-axis direction.

[0195] In some embodiments, the circuit board assembly 15 further includes an electrical connector 156. The electrical connector 156 may be fixedly connected to a second surface 1512 of the first circuit board 151. The electrical connector 156 may be located in a second region 15B of the circuit board assembly 15. In this embodiment, the electrical connector 156 is used for grounding, thereby improving the anti-static capability of the earphone 100. Exemplarily, the material of the electrical connector 156 may be a metal, such as copper, or other conductive metal. In other embodiments, the circuit board assembly 15 may not include the electrical connector 156, and this application is not limiting in this regard.

[0196] Please continue reading. Figure 16A and Figure 16B In some embodiments, the earpiece 10 further includes a first microphone 157 and a second microphone 158. The first microphone 157 can be a call microphone used to pick up the user's voice during a call. The second microphone 158 can be a feedforward microphone used to pick up ambient noise. For example, both the first microphone 157 and the second microphone 158 are fixedly connected to the second surface 1512 of the first circuit board 151 of the circuit board assembly 15, and the first microphone 157 and the second microphone 158 are spaced apart.

[0197] For example, the first circuit board 151 of the circuit board assembly 15 may be provided with a first pickup through-hole 1591 and a second pickup through-hole 1592 spaced apart. Both the first pickup through-hole 1591 and the second pickup through-hole 1592 penetrate the first surface 1511 and the second surface 1512 of the first circuit board 151. The first pickup through-hole 1591 may be positioned opposite to the pickup surface of the first microphone 157. The second pickup through-hole 1592 may be positioned opposite to the pickup surface of the second microphone 158.

[0198] In this embodiment, the circuit board of the first microphone 157 and / or the circuit board of the second microphone 158 may employ a buried capacitor and buried resistor process. It is understood that the buried resistor and buried capacitor process typically refers to a specific process in printed circuit board (PCB) manufacturing, used to embed resistors and capacitors within the multilayer structure of the PCB. This process allows for the integration of electronic components on the same PCB, thereby reducing the PCB size, increasing circuit density, and reducing circuit interference and crosstalk. The use of a buried capacitor and buried resistor process in the circuit boards of the first microphone 157 and / or the second microphone 158 in this embodiment can improve the anti-interference performance and reliability of the first microphone 157 and the second microphone 158, thereby improving the call performance of the headset 100.

[0199] Taking the first microphone 157 as an example, the first microphone 157 may include a housing 1571, a second circuit board 1572, and a chip assembly (not shown) disposed on the second circuit board 1572. The housing 1571 is fixed to the second circuit board 1572 and forms a microphone chamber with the second circuit board 1572. The chip assembly is located inside the microphone chamber. The second circuit board 1572 is fixedly connected to the first circuit board 151 of the circuit board assembly 15 and is electrically connected to the first circuit board 151. The second circuit board 1572 may include a first dielectric layer 1573, a second dielectric layer 1574, a resistive layer 1575, and a capacitor layer 1576 stacked together. The resistive layer 1575 and the capacitor layer 1576 are disposed between the first dielectric layer 1573 and the second dielectric layer 1574. For example, Figure 16B The first dielectric layer 1573, the second dielectric layer 1574, the resistive layer 1575, and the capacitor layer 1576 of the second circuit board 1572 are schematically divided using dashed lines. It is understood that the top and bottom positions of the resistive layer and the capacitor layer can be interchanged, and this application does not strictly limit this.

[0200] In this embodiment, the structural design of the second microphone 158 can refer to the structural design of the first microphone 157, and will not be repeated here. It is understood that the structural designs of the first microphone 157 and the second microphone 158 can adopt the structural designs of microphones known in the prior art (e.g., MEMS microphones). The buried capacitor and buried resistor processes of the circuit boards of the first microphone 157 and the second microphone 158 can also adopt the buried capacitor and buried resistor processes known in the prior art. Further details regarding the first microphone 157 and the second microphone 158 will not be elaborated upon here.

[0201] Please refer to the following: Figure 17 and Figure 18 , Figure 17 yes Figure 9 The diagram shown is a partial structural schematic of the earpiece 10 in some embodiments. Figure 18 yes Figure 17 The diagram shows a partial cross-sectional view of the earpiece 10 taken along the EE. For example, Figure 17 The diagram mainly shows the assembly structure between the first sub-shell 111, the antenna assembly 13, the bracket 14, the circuit board assembly 15, and the first flexible circuit board 17.

[0202] In some embodiments, the circuit board assembly 15 is fixedly connected to the housing 11. For example, the first circuit board 151 of the circuit board assembly 15 is fixedly connected to the first sub-housing 111. In this embodiment, the circuit board assembly 15 experiences less stress, making it less prone to deformation or even breakage, thereby improving the reliability of the circuit board assembly 15 and the strength of the connection between the circuit board assembly 15 and the housing 11.

[0203] For example, the second side 1512 of the first circuit board 151 of the circuit board assembly 15 may face away from the first sub-housing 111. A portion of the connecting portion 1115 of the first sub-housing 111 may abut against the first side 1511 of the first circuit board 151, and a portion may pass through the first circuit board 151 to one side of the second side 1512 of the first circuit board 151 and be fixedly connected to the first circuit board 151.

[0204] In some embodiments, the antenna assembly 13 is located between the bracket 14 and the first sub-shell 111. The first electrical connector 133, the second electrical connector 134, and the third electrical connector 135 may be located on the side of the bracket 14 facing away from the first surface. The first surface of the first circuit board 151 of the circuit board assembly 15 faces the bracket 14. A first connection terminal 1541 on the first circuit board 151 may abut against and be electrically connected to the first electrical connector 133, thereby allowing the circuit board assembly 15 to be electrically connected to the first antenna 131 via the first connection terminal 1541. A second connection terminal 1542 may abut against and be electrically connected to the second electrical connector 134, thereby allowing the circuit board assembly 15 to be electrically connected to the first antenna 131 via the second connection terminal 1542. A third connection terminal 1543 may abut against and be electrically connected to the third electrical connector 135, thereby allowing the circuit board assembly 15 to be electrically connected to the second antenna 132 via the third connection terminal 1543.

[0205] Please refer to the following: Figures 17 to 19 , Figure 19 yes Figure 9 The earpiece 10 shown is a partial structural schematic diagram in some embodiments.

[0206] In some embodiments, the first flexible circuit board 17 is fixedly connected to the circuit board assembly 15 and the housing 11. The first surface 1511 of the first circuit board 151 of the circuit board assembly 15 may face the first flexible circuit board 17. Exemplarily, the first flexible circuit board 17 may include a first connecting portion 171, a second connecting portion 172, and a bending portion 173. The bending portion 173 of the first flexible circuit board 17 may be connected between the first connecting portion 171 and the second connecting portion 172, and is bent relative to the first connecting portion 171 and the second connecting portion 172.

[0207] The first connecting portion 171 of the first flexible circuit board 17 can be fixedly connected to the first sub-shell 111 by means of adhesive bonding or other methods. For example, the first connecting portion 171 can be located within the clearance groove 143 of the bracket 14, and on the side of the antenna assembly 13 facing away from the bracket 14. For example, in the Z-axis direction, the bracket 14 and the first connecting portion 171 of the first flexible circuit board 17 are spaced apart, that is, there is a gap between the bracket 14 and the first connecting portion 171 of the first flexible circuit board 17.

[0208] The second connecting portion 172 is fixedly connected to the circuit board assembly 15 and electrically connected to the circuit board assembly 15. For example, the second connecting portion 172 can be fixedly connected to the second surface 1512 of the first circuit board 151 of the circuit board assembly 15 and electrically connected to the first circuit board 151. For instance, the second connecting portion 172 can be fixed to the circuit board assembly 15 using fasteners such as screws or bolts.

[0209] In some embodiments, the sensor 12 is fixedly connected to and electrically connected to the first flexible circuit board 17. For example, the sensor 12 can be fixed to the first connection portion 171 of the first flexible circuit board 17 by means of welding or the like, and is located on the side of the first flexible circuit board 17 facing away from the circuit board assembly 15.

[0210] For example, sensor 12 may be located between the first sub-shell 111 and the bracket 14. For example, sensor 12 may be located on the side of the first sub-shell 111 facing away from the first surface 11a and may be attached to the first sub-shell 111 by adhesive. It is understood that sensor 12 may be positioned facing the first surface 11a of the shell 11. For example, the first surface 1511 of the first circuit board 151 of the circuit board assembly 15 may face sensor 12. For example, clearance groove 143 may face sensor 12 and be positioned opposite to sensor 12. It is understood that by providing clearance groove 143, clearance groove 143 can be used to avoid the first flexible circuit board 17 and sensor 12, thereby facilitating the spaced arrangement of sensor 12 with bracket 14 and first antenna 131 in the Z-axis direction.

[0211] In some embodiments, sensor 12 can be a capacitive sensor. For example, sensor 12 may include three detection units 121, which may be arranged sequentially at intervals along the X-axis. When a touch operation is applied to the first surface 11a, the capacitance value of the detection unit 121 changes, thereby identifying whether the user has touched the surface and the direction of the touch swipe. Subsequently, sensor 12 can transmit the identified information to circuit board assembly 15, which can adjust the volume of the headphones 100 according to the received touch signal, for example, increasing or decreasing the volume of the headphones 100. It is understood that sensor 12 may also include more or fewer detection units 121; this application does not strictly specify the number of detection units 121 in sensor 12.

[0212] In this embodiment, the sensor 12 is disposed below the first surface 11a, which serves as the touch surface of the sensor 12. When the user wears the headphones 100, the first surface 11a faces the outside of the user's ear, facilitating volume adjustment. Furthermore, the larger area of ​​the first surface 11a allows for a wider sliding range on the surface, enabling the sensor 12 to be longer (e.g., 11.5 mm or greater), further enhancing volume adjustment and improving user experience. It is understood that the length direction of the sensor 12 corresponds to the arrangement direction of its three detection units 121. The length of the sensor 12 is the distance from the first detection unit 121 to the last detection unit 121.

[0213] In some embodiments, when projecting along a first direction, the projection of the first antenna 131 onto a plane perpendicular to the first direction is the first projection, and the projection of the sensor 12 onto the plane perpendicular to the first direction is the second projection. At least a portion of the first projection of the first antenna 131 is spaced apart from the second projection of the sensor 12. It is understood that when projecting along the first direction, the projection of the first antenna 131 onto the plane perpendicular to the first direction may be entirely spaced apart from the projection of the sensor 12 onto the plane perpendicular to the first direction, or it may be partially spaced apart from the projection of the sensor 12 onto the plane perpendicular to the first direction. For example, the projection of a first portion 1311 of the first antenna 131 onto the plane perpendicular to the first direction may be spaced apart from the projection of the sensor 12 onto the plane perpendicular to the first direction.

[0214] For example, when projecting along the first direction, at least a portion of the projection of the second antenna 132 onto a plane perpendicular to the first direction may be spaced apart from the projection of the sensor 12 onto the plane perpendicular to the first direction. For instance, the projection of the first portion 1321 of the second antenna 132 onto a plane perpendicular to the first direction may be spaced apart from the projection of the sensor 12 onto the plane perpendicular to the first direction.

[0215] In this embodiment of the application, by offsetting the first portion 1311 of the first antenna 131 and the first portion 1321 of the second antenna 132 from the sensor 12 on a plane perpendicular to the first direction, the interference of the sensor 12 on the signal reception and transmission of the first antenna 131 and the second antenna 132 can be reduced, the signal loss during transmission can be reduced, thereby improving the efficiency of the first antenna 131 and the second antenna 132, which in turn helps to improve the communication quality of the headset 100.

[0216] Furthermore, in this embodiment, by setting a bracket 14 to support the antenna assembly 13, the sensor 12 is fixedly connected to the first flexible circuit board 17 and then connected to the housing 11, so that the first antenna 131 and the second antenna 132 are spaced apart from the sensor 12 in the Z-axis direction. That is, there is a gap between the first antenna 131 and the second antenna 132 and the sensor 12 in the Z-axis direction, which can reduce the interference of the sensor 12 on the signal reception and transmission of the first antenna 131 and the second antenna 132, reduce the signal loss in the transmission process, and improve the efficiency of the first antenna 131 and the second antenna 132, thereby improving the communication quality of the earphone 100.

[0217] Please see Figure 20A , Figure 20A yes Figure 17 The earpiece 10 shown is a schematic diagram of a partial cross-sectional structure cut along F1-F1 in some embodiments.

[0218] In some embodiments, the first pickup hole 1116 of the first sub-shell 111 can be connected to the first pickup through hole 1591 of the circuit board assembly 15, thereby connecting to the pickup surface of the first microphone 157. Exemplarily, the second portion 1116b of the first pickup hole 1116 can be connected to the first pickup through hole 1591 of the circuit board assembly 15. The first microphone 157 can pick up the user's voice through the first pickup hole 1116 and convert the sound signal into an electrical signal for output.

[0219] For example, when projecting along the first direction, the projection of the first microphone 157 onto a plane perpendicular to the first direction is the third projection, and the projection of the first antenna 131 onto a plane perpendicular to the first direction is the first projection. The third projection of the first microphone 157 can be spaced apart from the first projection of the first antenna 131. For example, when projecting along the first direction, the third projection of the first microphone 157 can be spaced apart from the first projection of the second antenna 132 onto a plane perpendicular to the first direction.

[0220] It is understandable that the first microphone 157, the first antenna 131, and the second antenna 132 can be offset in the XY plane. Furthermore, since the first microphone 157 is located on the second side 1512 of the first circuit board 151, it can be positioned with its back to the first antenna 131 and the second antenna 132. This allows the first antenna 131 and the second antenna 132 to be further away from the first microphone 157, thereby reducing electromagnetic interference from the first antenna 131 and the second antenna 132 to the first microphone 157. During a call, when the user speaks using the first microphone 157, the recipient is less likely to hear static, thus ensuring better call quality.

[0221] For example, the earpiece 10 also includes a first mesh fabric 1118. The first mesh fabric 1118 may be located between the first sub-shell 111 and the circuit board assembly 15, and is fixedly connected to the first sub-shell 111 by adhesive, covering the first pickup hole 1116. The first mesh fabric 1118 can prevent external dust and impurity particles from entering the interior of the first microphone 157 and affecting the performance of the first microphone 157.

[0222] Please see Figure 20B , Figure 20B yes Figure 17 The earpiece 10 shown is a schematic diagram of a partial cross-sectional structure cut along F2-F2 in some embodiments.

[0223] In some embodiments, the second pickup hole 1117 of the first sub-shell 111 can be connected to the second pickup through hole 1592 of the circuit board assembly 15, thereby connecting to the pickup surface of the second microphone 158. For example, the second portion 1117b of the second pickup hole 1117 can be connected to the second pickup through hole 1592 of the circuit board assembly 15. The second microphone 158 can pick up external noise through the second pickup hole 1117, achieving active noise cancellation of the headphone 100.

[0224] For example, the earpiece 10 also includes a second mesh fabric 1119. The second mesh fabric 1119 may be located between the first sub-shell 111 and the circuit board assembly 15, and is fixedly connected to the first sub-shell 111 by adhesive, covering the second pickup hole 1117. The second mesh fabric 1119 can prevent external dust and impurity particles from entering the interior of the second microphone 158 and affecting the performance of the second microphone 158.

[0225] In this embodiment, the first microphone 157 picks up the user's voice through the first pickup hole 1116. The second microphone 158 picks up external noise through the second pickup hole 1117. When the user wears the headset 100, the line connecting the first pickup hole 1116 and the second pickup hole 1117 can extend towards the user's mouth, and the first pickup hole 1116 is closer to the user's mouth than the second pickup hole 1117. This facilitates the formation of a microphone beam array, allowing the microphone to enhance the sound signal in the direction towards the user's mouth and reduce interference from other directions. Consequently, the headset 100 can reduce background noise and better identify and capture the user's voice, meaning the user's voice can be better received by the first microphone 157. The headset 100 can then have better voice clarity and call performance.

[0226] In this embodiment, the length of the line connecting the first pickup hole 1116 and the second pickup hole 1117 is greater than or equal to 15mm. This results in a larger distance between the first pickup hole 1116 and the second pickup hole 1117, which further improves the microphone's beam array performance, allowing the microphone to better identify and capture the user's voice, thereby enhancing the call performance of the headset 100.

[0227] In this embodiment, the frequency response difference between the first microphone 157 and the second microphone 158 is in the range of -1dB to 1dB. The phase difference between the first microphone 157 and the second microphone 158 is in the range of -10dB to 10dB, or -5dB to 5dB. For example, the phase difference between the first microphone 157 and the second microphone 158 can be in the range of -5dB to 5dB. This facilitates the formation of a beam array by the microphones, enabling the earphone 100 to better recognize and capture the user's voice.

[0228] With the above settings, the headset 100 can achieve a significant beamforming gain, for example, up to 5dB. During calls, the headset 100 can effectively detect the user's voice and reduce background noise. Therefore, the headset 100 can provide superior call performance.

[0229] Furthermore, in this embodiment, the first microphone hole 1116 is located on the third surface 11c of the housing 11. When the user wears the earphone 100, the opening of the first microphone hole 1116 can be located on the side of the ear. Compared with the solution where the opening of the first microphone hole 1116 is located on the first surface 11a, the opening of the first microphone hole 1116 in this embodiment is less affected by surface turbulence, which is beneficial to improving the sound pickup effect of the first microphone 157, that is, the first microphone 157 can better receive the sound emitted by the user.

[0230] Please refer to the following: Figures 21A to 21C , Figure 21A yes Figure 10 The structural diagram of the second subshell 112 in some embodiments is shown below. Figure 21B yes Figure 21A The diagram shows the structure of the second subshell 112 from another angle. Figure 21C yes Figure 21A The diagram shows the structure of the second subshell 112 from another angle.

[0231] In some embodiments, the second sub-shell 112 may enclose a second sub-accommodating space 1120. It is understood that the second sub-accommodating space 1120 may be the accommodating space 110 of the shell 11 (see [link to documentation]). Figure 11 Part of the housing 11. The second surface 11b of the housing 11 is positioned away from the second sub-accommodating space 1120.

[0232] For example, the second sub-shell 112 may include a second outer surface 1121 and a second inner surface 1122. The second outer surface 1121 surrounds and connects to the outer periphery of the second surface 11b. The second inner surface 1122 faces the second sub-accommodating space 1120. A portion of the second inner surface 1122 may be disposed opposite to the second surface 11b, and another portion may be disposed opposite to the second outer surface 1121.

[0233] For example, the second sub-accommodating space 1120 may include a first mounting space 1120a and a second mounting space 1120b. The first mounting space 1120a and the second mounting space 1120b may be arranged along the X-axis direction.

[0234] For example, the second sub-shell 112 is provided with a sound outlet 1123. The sound outlet 1123 can penetrate the second surface 11b and communicate with the second sub-accommodating space 1120. For example, the sound outlet 1123 can communicate with the first mounting space 1120a. It is understood that the sound outlet 1123 can communicate with the accommodating space 110 of the shell 11 (see [link]). Figure 11 ) and the exterior of the housing 11.

[0235] For example, the second sub-shell 112 also provides a pressure relief hole 1124. The pressure relief hole 1124 penetrates the second outer surface 1121 and connects to the second sub-accommodating space 1120. For example, the pressure relief hole 1124 may connect to the first mounting space 1120a. In some examples, there may be two pressure relief holes 1124, namely a first pressure relief hole 1124a and a second pressure relief hole 1124b. The line connecting the first pressure relief hole 1124a and the sound outlet hole 1123 is a second connecting line L2. The line connecting the second pressure relief hole 1124b and the sound outlet hole 1123 is a third connecting line L3. The second connecting line L2 and the third connecting line L3 are arranged at an angle. For example, the first pressure relief hole 1124a and the second pressure relief hole 1124b may be arranged opposite to each other. In other examples, the number of pressure relief holes 1124 may also be one or more than two, which is not limited in this application.

[0236] For example, the second sub-shell 112 further includes a first through hole 1125 and a second through hole 1126. Both the first through hole 1125 and the second through hole 1126 can penetrate the second outer surface 1121 and connect to the second sub-accommodating space 1120. For example, both the first through hole 1125 and the second through hole 1126 can connect to the second mounting space 1120b. For example, the first through hole 1125 and the second through hole 1126 can be spaced apart and arranged relative to each other. For example, the line connecting the first through hole 1125 and the second through hole 1126 can be arranged relative to each other in the Y-axis direction.

[0237] For example, the second sub-shell 112 may also be provided with a first groove 1127a and a second groove 1127b. The openings of the first groove 1127a and the second groove 1127b can both be located on the second outer surface 1121. The first groove 1127a can be provided around the first through hole 1125, and the second groove 1127b can be provided around the second through hole 1126.

[0238] Please refer to the following: Figure 21C and Figure 22 , Figure 22 yes Figure 21B The second subshell 112 shown is a partial structural diagram of the section cut along GG in some embodiments.

[0239] In some embodiments, the second sub-shell 112 includes a connection hole 1128. The connection hole 1128 can penetrate the second outer surface 1121 and communicate with the second mounting space 1120b of the second receiving space 1120. It is understood that the connection hole 1128 communicates the receiving space 110 of the shell 11 and the outside of the shell 11.

[0240] In some embodiments, the second sub-shell 112 further includes a first limiting portion 113 and a second limiting portion 114 spaced apart. Both the first limiting portion 113 and the second limiting portion 114 are connected to the wall of the connecting hole 1128. For example, Figure 22 The second limiting part 114 is schematically divided by dashed lines. The first limiting part 113 and the second limiting part 114 can be arranged opposite each other. It can be understood that the first limiting part 113 and the second limiting part 114 can be arranged around the central axis of the connecting hole 1128.

[0241] For example, the first limiting portion 113 may include a first surface 113a, a second surface 113b, and a first limiting surface 113c. The first surface 113a and the second surface 113b of the first limiting portion 113 may be disposed opposite to each other along the axial direction of the connecting hole 1128. The first surface 113a of the first limiting portion 113 may face the second mounting space 1120b. The first limiting surface 113c of the first limiting portion 113 may be connected between the first surface 113a and the second surface 113b and connected to the hole wall of the connecting hole 1128.

[0242] For example, the second limiting portion 114 may include a first surface 114a, a second surface 114b, and a second limiting surface 114c. The first surface 114a and the second surface 114b of the second limiting portion 114 may be arranged facing away from each other along the axial direction of the connecting hole 1128. The first surface 114a of the second limiting portion 114 may face the second mounting space 1120b. The second limiting surface 114c may be connected between the first surface 114a and the second surface 114b and connected to the hole wall of the connecting hole 1128.

[0243] In some embodiments, the second sub-shell 112 further comprises a first locking portion 115 and a second locking portion 116 spaced apart. Both the first locking portion 115 and the second locking portion 116 are connected to and protrude from the wall of the connecting hole 1128. For example, Figure 22 The first locking portion 115 is schematically delineated using dashed lines. Along the axial direction of the connecting hole 1128, both the first locking portion 115 and the second locking portion 116 are located on the side of the first limiting portion 113 and the second limiting portion 114 away from the second mounting space 1120b. Along the circumferential direction of the connecting hole 1128, the first locking portion 115 is at least partially located between the first limiting portion 113 and the second limiting portion 114, and the second locking portion 116 is at least partially located between the first limiting portion 113 and the second limiting portion 114.

[0244] For example, the first locking portion 115 and the second locking portion 116 can be arranged opposite to each other. It is understood that the first locking portion 115 and the second locking portion 116 can be arranged around the central axis of the connecting hole 1128.

[0245] For example, the first locking portion 115 may include a first surface 115a and a second surface 115b. The first surface 115a and the second surface 115b of the first locking portion 115 may be arranged facing away from each other along the axial direction of the connecting hole 1128. The first surface 115a of the first locking portion 115 may face the second mounting space 1120b. In some examples, the first surface 115a of the first locking portion 115 may be connected to the first limiting surface 113c of the first limiting portion 113. It is understood that in other examples, the first surface 115a of the first locking portion 115 may also be spaced apart from the first limiting surface 113c of the first limiting portion 113.

[0246] For example, the second locking portion 116 may include a first surface 116a and a second surface 116b. The first surface 116a and the second surface 116b of the second locking portion 116 may be disposed facing away from each other along the axial direction of the connecting hole 1128. The first surface 116a of the second locking portion 116 may face the second mounting space 1120b. In some examples, the first surface 116a of the second locking portion 116 may be connected to the second limiting surface 114c of the second limiting portion 114. It is understood that in other examples, the second surface 116b of the second locking portion 116 may also be spaced apart from the second limiting surface 114c of the second limiting portion 114.

[0247] Please refer to the following: Figures 23 to 24B , Figure 23 yes Figure 9 The diagram shown is a partial structural schematic of the earpiece 10 in some embodiments. Figure 24A yes Figure 23 The diagram shows a partial cross-sectional view of the earpiece 10 shown in some embodiments, cut along H1-H1. Figure 24B yes Figure 23 The diagram shows a partial cross-sectional view of the earpiece 10 shown in some embodiments, cut along H2-H2. For example, Figure 23 The diagram mainly shows the assembly structure of the second sub-shell 112, the speaker 16, and the magnet 19.

[0248] In some embodiments, the speaker 16 is mounted within a second sub-receiving space 1120 of the second sub-housing 112; for example, the speaker 16 may be mounted within a first mounting space 1120a. It is understood that the speaker 16 is mounted within a receiving space 110 of the housing 11.

[0249] For example, the speaker 16 can be connected to the inner wall of the second sub-shell 112, and the speaker 16 and the second sub-shell 112 can jointly enclose the first chamber 1171 and the second chamber 1172. The first chamber 1171 and the second chamber 1172 are spaced apart. The first chamber 1171 can communicate with the sound outlet 1123 of the second sub-shell 112.

[0250] For example, the sound-emitting surface of the speaker 16 faces the first chamber 1171 and is disposed opposite to the sound outlet 1123. The sound emitted by the speaker 16 can enter the first chamber 1171 and propagate to the sound outlet 1123, and then propagate from the sound outlet 1123 to the outside of the earpiece 10.

[0251] For example, the earcup 10 may also include a sound-emitting mesh 118. The sound-emitting mesh 118 may cover the sound-emitting hole 1123 of the second sub-shell 112. The sound-emitting mesh 118 may be a porous structure, so that the sound emitted by the speaker 16 can be transmitted to the outside of the earphone 100 through the sound-emitting mesh 118. In some examples, the sound-emitting mesh 118 may be made of plastic. For example, the earcup 10 may also include a sound-emitting mesh fabric 1181, which may cover the sound-emitting mesh 118, thereby preventing dust particles from entering the interior of the earcup 10.

[0252] The second chamber 1172 can communicate with the first pressure relief hole 1124a and the second pressure relief hole 1124b. It is understood that both the first pressure relief hole 1124a and the second pressure relief hole 1124b can communicate with the outside of the second chamber 1172 and the housing 11. The first pressure relief hole 1124a and the second pressure relief hole 1124b can be used to balance the air pressure inside the second chamber 1172. In this embodiment, the line connecting the first pressure relief hole 1124a and the sound outlet 1123 (i.e., the first connection line) forms an angle with the line connecting the second pressure relief hole 1124b and the sound outlet 1123 (i.e., the second connection line). When the speaker 16 emits sound, the sound outlet 1123 can form a dipole sound field with the first pressure relief hole 1124a and the second pressure relief hole 1124b, reducing sound leakage from the headphones 100.

[0253] For example, the ear cup 10 may also include a third mesh fabric 1191 and a fourth mesh fabric 1192, which can cover the first pressure relief hole 1124a and the second pressure relief hole 1124b respectively, thereby preventing dust particles from entering the interior of the ear cup 10 from the first pressure relief hole 1124a and the second pressure relief hole 1124b.

[0254] In some embodiments, the magnet 19 is mounted within the second mounting space 1120b of the second sub-receiving space 1120 of the second sub-shell 112. Exemplarily, the magnet 19 can be fixedly connected to the second sub-shell 112 by means of adhesive bonding, welding, or other methods. Exemplarily, the magnet 19 can be located in the first through hole 1125 (see [link to documentation]). Figure 21C Between the second through hole 1126 and the second through hole 1126.

[0255] Please see Figure 25A , Figure 25A yes Figure 10 The diagram shows the structure of the second flexible circuit board 18 in some embodiments.

[0256] In some embodiments, the second flexible circuit board 18 may include a first portion 181, a second portion 182, and a third portion 183. The second portion 182 may be connected between the first portion 181 and the third portion 183. Exemplarily, the first portion 181 of the second flexible circuit board 18 may be multi-folded. Exemplarily, the second portion 182 may have a first fixing hole 1821 and a second fixing hole 1822. The first fixing hole 1821 and the second fixing hole 1822 may be spaced apart and arranged opposite to each other. Exemplarily, the third portion 183 may have a second electrical connection portion 1831. The material of the second electrical connection portion 1831 may be metal, such as copper, or other materials with good electrical conductivity.

[0257] Please refer to the following: Figures 25B to 26B , Figure 25B yes Figure 9 The diagram shown is a partial structural schematic of the earpiece 10 in some embodiments. Figure 26A yes Figure 25B The diagram shows a partial cross-sectional view of the earpiece 10 shown in some embodiments, cut along line J1-J1. Figure 26B yes Figure 25B The diagram shows a partial cross-sectional view of the earpiece 10 shown in some embodiments, cut along line J2-J2. For example, Figure 25B The diagram mainly shows the assembly structure of the second sub-shell 112, speaker 16, magnet 19 and second flexible circuit board 18.

[0258] In some embodiments, the second flexible circuit board 18 is mounted within the second sub-accommodating space 1120 of the second sub-shell 112. It is understood that the second flexible circuit board 18 is mounted within the accommodating space 110 of the shell 11. The first portion 181 of the second flexible circuit board 18 may be located in the second mounting space 1120b. In this embodiment, the first portion 181 of the second flexible circuit board 18 can be used for electrical connection with the battery of the earphone 100. Exemplarily, the first portion 181 of the second flexible circuit board 18 and the magnet 19 may be arranged along a first direction.

[0259] The second portion 182 of the second flexible circuit board 18 can be located in the second mounting space 1120b. For example, the second portion 182 can be bonded to the second sub-shell 112, and the first fixing hole 1821 of the second portion 182 can communicate with the first through hole 1125 of the second sub-shell 112, and the second fixing hole 1822 can communicate with the second through hole 1126 of the second sub-shell 112.

[0260] The third portion 183 of the second flexible circuit board 18 can be located in the first mounting space 1120a. The third portion 183 of the second flexible circuit board 18 is fixedly connected to the speaker 16 and electrically connected to the speaker 16. For example, the third portion 183 of the second flexible circuit board 18 can be located on the side of the speaker 16 facing away from the first chamber 1171, and the second connecting portion of the third portion 183 can be disposed facing away from the speaker 16.

[0261] like Figure 26B As shown, in some embodiments, the earcup 10 may further include a first charging terminal 101a and a second charging terminal 101b. Both the first charging terminal 101a and the second charging terminal 101b are fixedly connected to and electrically connected to the second portion 182 of the second flexible circuit board 18. In this embodiment, the first charging terminal 101a and the second charging terminal 101b can be used to electrically connect to an external power source of the earphone 100; for example, the first charging terminal 101a and the second charging terminal 101b can be used to electrically connect to the battery of the charging case 200. Since the second flexible circuit board 18 is also electrically connected to the battery of the earphone 100, the charging case 200 can supply power to the battery of the earphone 100 through the second flexible circuit board 18.

[0262] In some embodiments, the first charging terminal 101a may include a first abutment portion 1011a and a first extension portion 1012a. The first abutment portion 1011a may include a first contact surface 1013a. The first extension portion 1012a may be located on the side of the first abutment portion 1011a opposite to the first contact surface 1013a, and one end of the first extension portion 1012a may be connected to the first abutment portion 1011a. Exemplarily, at least a portion of the first abutment portion 1011a may be located within a first groove 1127a of the second sub-shell 112. The first contact surface 1013a of the first abutment portion 1011a may be exposed relative to the second outer surface 1121 of the second sub-shell 112. Exemplarily, the first extension portion 1012a may pass through a first through hole 1125 of the second sub-shell 112, and the end of the first extension portion 1012a away from the other end (i.e., the end away from the first abutment portion 1011a) may be fixedly connected to the second portion 182 of the second flexible circuit board 18.

[0263] In some embodiments, the second charging terminal 101b may include a second abutment portion 1011b and a second extension portion 1012b. The second abutment portion 1011b may include a second contact surface 1013b. The second extension portion 1012b may be located on the side of the second abutment portion 1011b opposite to the second contact surface 1013b, and one end of the second extension portion 1012b may be connected to the second abutment portion 1011b. Exemplarily, at least a portion of the second abutment portion 1011b may be located within the second groove 1127b of the second sub-shell 112. The second contact surface 1013b of the second abutment portion 1011b may be exposed relative to the second outer surface 1121 of the second sub-shell 112. Exemplarily, the second extension portion 1012b may pass through the second through hole 1126 of the second sub-shell 112, and the end of the second extension portion 1012b away from the other end (i.e., the end away from the second abutment portion 1011b) may be fixedly connected to the second portion 182 of the second flexible circuit board 18.

[0264] In this embodiment, when the earphone 100 is placed in the charging case 200 for charging, the magnet 19 disposed inside the ear cup 10 between the first through hole 1125 and the second through hole 1126 can interact with the first magnet 2029a of the earphone 100 case (see [link]). Figure 6 ) or the second magnet 2029b (see Figure 6 Magnetic attraction helps the earphones quickly locate itself.

[0265] It is understood that in the embodiments of this application, the first charging terminal 101a and the second charging terminal 101b of the earphone 100 are both located in the earcup 10. In some other examples, the first charging terminal 101a and the second charging terminal 101b of the earphone 100 may also be located in other positions of the earphone 100, such as the connecting arm 20. This application does not limit this.

[0266] Please refer to the following: Figure 27 and Figure 28 , Figure 27 yes Figure 9 The diagram shown is a partial cross-sectional view of the earpiece 10 cut along CC in some embodiments. Figure 28 yes Figure 9 The earpiece 10 shown is a partial structural schematic diagram in some embodiments.

[0267] In some embodiments, the circuit board assembly 15 is fixedly connected to and electrically connected to the second flexible circuit board 18. Exemplarily, the electrical connector 156 of the circuit board assembly 15 may face the speaker 16 and be fixedly connected to and electrically connected to the third portion 183 of the second flexible circuit board 18 via adhesive.

[0268] For example, a buffer 1561 may be provided between the electrical connector 156 of the circuit board assembly 15 and the second electrical connection portion 1831 of the second flexible circuit board 18. The material of the buffer 1561 may be ethylene-vinyl acetate copolymer (EVA) or other elastic materials.

[0269] In this embodiment, the buffer 1561 can absorb or buffer the stress, vibration or thermal expansion between the circuit board assembly 15 and the second flexible circuit board 18, thereby effectively alleviating the stress concentration phenomenon between the circuit board assembly 15 and the second flexible circuit board 18, reducing the occurrence of damage, and thus improving the connection reliability between the circuit board assembly 15 and the second flexible circuit board 18.

[0270] For example, the second region 15B of the circuit board assembly 15 may face the first mounting space 1120a of the second sub-shell 112, that is, the second region 15B of the circuit board assembly 15 may face the speaker 16. The first region 15A of the circuit board assembly 15 may face the second mounting space 1120b of the second sub-shell 112. For example, Figure 27 and Figure 28 The first region 15A and the second region are schematically divided using dashed lines. Projected along the first direction, the projection of the first electronic device 152 onto a plane perpendicular to the first direction is the fourth projection, and the projection of the speaker 16 onto the same plane is the fifth projection. At least a portion of the fourth projection of the first electronic device 152 is spaced apart from the fifth projection of the speaker 16. This reduces interference from the first electronic device 152 to the speaker 16 during use of the headphones 100, thereby reducing current noise and improving the sound quality of the headphones 100.

[0271] For example, when projected along the first direction, the projection of the power supply device 1521 on the circuit board assembly 15 onto a plane perpendicular to the first direction can be spaced apart from the projection of the speaker 16. It is understood that, in this embodiment, by placing the power supply device 1521 on the circuit board assembly 15 in the first region 15A of the circuit board assembly 15, the power supply device 1521 and the speaker 16 can be staggered in the XY plane. In this way, the power supply device 1521 can be moved away from the speaker 16, thereby reducing the interference of the mutual inductance of the power supply device 1521 on the speaker 16, and further reducing the risk of current noise in the headphones 100, thus improving the sound quality of the headphones 100.

[0272] For example, the inductor 1522 can be disposed on the first surface 1511 of the first circuit board 151 of the circuit board assembly 15, that is, the inductor 1522 can be located on the side of the first circuit board 151 facing away from the speaker 16. For example, projecting along the first direction, the projection of the inductor 1522 on the circuit board assembly 15 onto a plane perpendicular to the first direction can be spaced apart from the projection of the speaker 16 onto a plane perpendicular to the first direction. It is understood that, in this embodiment of the application, by disposing the inductor 1522 on the first surface 1511 of the first circuit board 15 of the circuit board assembly 15, and located in the first region 15A of the circuit board assembly 15, the inductor 1522 on the circuit board assembly 15 and the speaker 16 can be offset in the XY plane. In this way, the inductor 1522 can be moved away from the speaker 16, thereby reducing the interference of the leakage magnetic flux of the inductor 1522 on the speaker 16, thereby reducing the risk of current noise generated by the headphones 100 and improving the sound quality of the headphones 100.

[0273] In this embodiment, a power trace 155 is disposed in the first region 15A. Projected along the first direction, at least a portion of the projection of the power trace 155 onto a plane perpendicular to the first direction is spaced apart from the projection of the speaker 16 onto the same plane. This allows the power trace 155 and the speaker 16 to be staggered in the XY plane, thereby reducing interference from the power trace 155 to the speaker 16, thus reducing the risk of current noise in the headphones 100 and improving the sound quality of the headphones 100. Furthermore, at least a portion of the first power trace 1551 and at least a portion of the second power trace 1552 can be stacked in the Z-axis direction. This results in a smaller tiled area of ​​the first power trace 1551 and the second power trace 1552 in the XY plane, reducing the interference of the mutual inductance of the first power trace 1551 and the second power trace 1552 on the speaker 16, further reducing the risk of current noise in the headphones 100 and improving the sound quality of the headphones 100.

[0274] Please refer to the following: Figure 29 and Figure 30 , Figure 29 yes Figure 9 The diagram shown is a structural schematic of the connecting arm 20 in some embodiments. Figure 30 yes Figure 29 The diagram shown is a partial exploded view of the connecting arm 20 in some embodiments.

[0275] In some embodiments, the connecting arm 20 may include a connector 23, a tube 24, a support 25, a cable 26, and a battery assembly 27. The tube 24 is fitted over the support 25 and the cable 26, protecting the support 25 and the cable 26, and also providing insulation for the cable 26. The support 25 is used to align the connecting arm 20 into a predetermined shape. In some examples, the support 25 may be a deformable metal material, such as a shape memory alloy wire. In other examples, the support 25 may be a flexible metal or other material. The cable 26 is used to transmit electrical signals.

[0276] For example, the tube body 24 may be curved. The tube body 24 may include a connecting end 2411 and a free end 2412. The connector 23 may be fixedly connected to the connecting end 2411 of the tube body 24 and protrude from the connecting end 2411. For example, the tube body 24 is provided with a channel 242 and a receiving cavity 243. The channel 242 may be provided along the length extension direction of the tube body 24 and pass through the connecting end 2411. The receiving cavity 243 may be located at the free end 2412 of the tube body 24 and communicate with the channel 242. For example, the connecting end 2411 of the tube body 24 may be provided with a sealing part 244. The sealing part 244 may protrude from the end face 2413 of the connecting end 2411 of the tube body 24 and be provided around the opening of the channel 242.

[0277] In some examples, the tube 24 can be made of insulating material, such as silicone, thermoplastic polyurethane (TPU), etc. The connecting arm 20 in this embodiment is a structure where a silicone tube 24 is fitted with a shape memory metal support 25, which can meet the wearing comfort and stability requirements of different ear shapes.

[0278] Please refer to the following: Figure 30 and Figure 31 , Figure 31 yes Figure 29 The diagram shows a partial structural schematic of the connecting arm 20 in some embodiments.

[0279] In some embodiments, the battery assembly 27 may include a battery housing 271, a battery 272, a battery circuit board 273, and a temperature sensor 274. The battery housing 271 may have a receiving space 2711. The battery 272, the battery circuit board 273, and the temperature sensor 274 may be mounted in the receiving space 2711. The battery circuit board 273 is fixedly connected to and electrically connected to the battery 272.

[0280] The temperature sensor 274 can be located on the battery circuit board 273. For example, the temperature sensor 274 can be connected to the battery circuit board 273 via a four-core wire and electrically connected. The temperature is used to detect the temperature of the battery 272 to improve the safety of the charging case 200 during charging and discharging. For example, the temperature sensor 274 can be a negative temperature coefficient thermistor (NTC) sensor.

[0281] In some embodiments, the battery assembly 27 may be housed in the receiving cavity 243 of the tube 24. Exemplarily, the battery housing 271 may be fixedly connected to the tube 24.

[0282] In some embodiments, the middle portion of the cable 26 may be located within the channel 242, one end may protrude from the end face 2413 of the connection end 2411, and the other end may extend into the receiving cavity 243 and be electrically connected to the battery circuit board 273 of the battery assembly 27. In this embodiment, the cable 26 may be used to connect the battery assembly 27 and the second flexible circuit board 18 of the earpiece 10 (see [link]). Figure 26A This allows battery 272 to power earpiece 10.

[0283] For example, the connecting arm 20 may also include a cover 245. The cover 245 is fixedly connected to the tube 24 and covers the opening of the receiving cavity 243 of the tube 24 to seal the receiving cavity 243 of the tube 24. The material of the cover 245 may be the same as or different from that of the tube 24; for example, the material of the cover 245 may be silicone, plastic, etc. In some other examples, the cover 245 and the tube 24 may also be integrally formed structural components, which is not limited in this application.

[0284] Please refer to the following: Figure 32A and Figure 32B , Figure 32A yes Figure 30 The diagram shown is a structural schematic of the connector 23 in some embodiments. Figure 32B yes Figure 32A The diagram shows the structure of connector 23 from another angle.

[0285] In some embodiments, the connector 23 is provided with a through hole 231. The through hole 231 extends through the connector 23 along its length. The connector 23 may include a body portion 232, a first protrusion 234, a second protrusion 235, and a third protrusion 236. For example, the body portion 232 may include a first surface 232a and a second surface 232b disposed opposite to each other, and a peripheral surface 232c connected between the first surface 232a and the second surface 232b. The through hole 231 may extend through the first surface 232a and the second surface 232b of the body portion 232. For example, the body portion 232 may include a first portion 2321 and a second portion 2322, the second portion 2322 being connected to the first portion 2321 and located on one side of the first portion 2321. In this embodiment, the first portion 2321 may be used to connect with the tube body 24, and the second portion 2322 may be used to connect with the earpiece 10. It is understood that the shapes and sizes of the first part 2321 and the second part 2322 are not strictly defined in the embodiments of this application. For example, the connector 23 can be a structural component that is integrally formed, that is, the first part 2321, the second part 2322, the first protrusion 234, the second protrusion 235 and the third protrusion 236 can be integrally formed.

[0286] For example, the second portion 2322 may be generally cylindrical. The first protrusion 234, the second protrusion 235, and the third protrusion 236 are all connected to and protrude from the peripheral surface of the second portion 2322. The first protrusion 234, the second protrusion 235, and the third protrusion 236 may be spaced apart around the central axis 230 of the connector 23. It is understood that the central axis 230 of the connector 23 passes through the through hole 231 of the connector 23. In other words, the first protrusion 234, the second protrusion 235, and the third protrusion 236 may be arranged around the through hole 231 of the connector 23.

[0287] For example, the third protrusion 236 is spaced apart from the first protrusion 234 in a second direction, and is also spaced apart from the second protrusion 235 in a second direction. The second direction is parallel to the central axis 230 of the connector 23.

[0288] For example, the third protrusion 236 may be generally annular. The first protrusion 234 and the second protrusion 235 may both be generally arc-shaped. The first protrusion 234 and the second protrusion 235 may be spaced apart and arranged opposite to each other.

[0289] Please refer to the following: Figures 30 to 32AIn some embodiments, the first portion 2321 of the connector 23 may be located within the channel of the tube body 24, and the second portion 2322, the first protrusion 234, the second protrusion 235, and the third protrusion 236 of the connector 23 may protrude from the end face of the connecting end 2411 of the tube body 24. For example, the first portion 2321 of the connector 23 may be fixed within the channel of the tube body 24 by means of adhesive bonding or other methods.

[0290] For example, one end of the cable 26 may protrude through the through hole 231 of the connector 23 for use with the second flexible circuit board 18 of the earpiece 10 (see [link]). Figure 26A )connect.

[0291] Please refer to the following: Figures 32B to 34 , Figure 33 yes Figure 8 The diagram shown is a partial structural schematic of the earphone 100 in some embodiments. Figure 34 yes Figure 8 The diagram shows a partial cross-sectional view of the earphone 100 taken at point KK in some embodiments. For example, Figure 34 The first locking part 115, the second locking part 116, the second part 2322, the second protrusion 235 and the third protrusion 236 are schematically divided by dashed lines.

[0292] In some embodiments, the connector 23 of the connecting arm 20 is fixedly connected to the earpiece 10. Exemplarily, the connector 23 of the connecting arm 20 can be glued to the second sub-shell 112 of the earpiece 10, thereby fixing the connecting arm 20 to the earpiece 10. Exemplarily, the through hole 231 of the connector 23 of the connecting arm 20 communicates with the second mounting space 1120b of the second sub-shell 112. The cable 26 can pass through the through hole 231 into the second mounting space 1120b and be fixedly connected to and electrically connected to the second flexible circuit board 18.

[0293] For example, a portion of the second part 2322 of the connector 23 of the connecting arm 20 may be located within the connecting hole 1128 of the second sub-shell 112. The first protrusion 234 of the connector 23 may abut against the first limiting part 113 of the second sub-shell 112, for example, the first protrusion 234 may abut against the first limiting surface 113c of the first limiting part 113. The second protrusion 235 of the connector 23 may abut against the second limiting part 114 of the second sub-shell 112, for example, the first protrusion 234 may abut against the second limiting surface 114c of the first limiting part 113.

[0294] In this embodiment, the engagement of the first protrusion 234 of the connector 23 with the first limiting portion 113 of the second sub-shell 112 and the engagement of the second protrusion 235 with the second limiting portion 114 of the second sub-shell 112 can restrict the rotation of the connector 23 relative to the second sub-shell 112 around the central axis 230 of the connector 23. This prevents the second protrusion 235 and the third protrusion 236 from disengaging from the second locking portion 116 of the second sub-shell 112 due to the rotation of the connector 23.

[0295] For example, at least a portion of the first locking portion 115 of the second sub-shell 112 may be located between the first protrusion 234 and the third protrusion 236 of the connector 23, and contact the first protrusion 234 and / or the third protrusion 236. In this embodiment, the cooperation between the first locking portion 115 and the first protrusion 234 and the third protrusion 236 can restrict the movement of the connector 23 relative to the second sub-shell 112 in a direction parallel to the central axis 230 of the connector 23, thereby preventing the connector 23 from detaching from the second sub-shell 112.

[0296] For example, at least a portion of the second locking portion 116 of the second sub-shell 112 may be located between the second protrusion 235 and the third protrusion 236 of the connector 23, and contact the second protrusion 235 and / or the third protrusion 236. In this embodiment, the cooperation between the second locking portion 116 and the second protrusion 235 and the third protrusion 236 can restrict the movement of the connector 23 relative to the second sub-shell 112 in a direction parallel to the central axis 230 of the connector 23, thereby preventing the connector 23 from disengaging from the second sub-shell 112.

[0297] It is understood that, in this embodiment of the application, the second part 2322 of the connector 23 of the connecting arm 20 can first extend into the connecting hole 1128 of the second sub-shell 112. Then, the connector 23 can rotate around its central axis 230, so that the second locking part 116 of the second sub-shell 112 is located between the second protrusion 235 and the third protrusion 236 of the connector 23. The first protrusion 234 of the connector 23 abuts against the first limiting part 113 of the second sub-shell 112, and the second protrusion 235 abuts against the second limiting part 114 of the second sub-shell 112. Then, the connector 23 and the second sub-shell 112 are bonded together. Through the mutual cooperation of the first protrusion 234, the second protrusion 235, and the third protrusion 236 of the connector 23 with the second sub-shell 112, a foolproof and limiting effect can be achieved, allowing the connecting arm 20 and the earpiece 10 to fit together well.

[0298] For example, the end face 2413 of the connecting end 2411 of the tube 24 may face the earpiece 10. The sealing portion 244 may surround the second portion 2322 of the body portion 232. For example, Figure 34The second part 2322 is schematically divided using dashed lines. The sealing part 244 of the tube body 24 can be located inside the connecting hole 1128 of the second sub-shell 112 and contact the inner wall of the connecting hole 1128. In this embodiment, by providing the sealing part 244 in the tube body 24, when the connecting arm 20 is connected to the second sub-shell 112 of the earphone 10, the sealing part 244 can seal the gap between the tube body 24 and the inner wall of the second sub-shell 112, thereby preventing external moisture, sweat, dust, etc. from entering the earphone 10 and affecting the performance of the earphone 100.

[0299] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the connecting components in the figures are not intended to limit the actual product of this application.

[0300] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A headset (100), characterized by Earphone (10) and connecting arm (20), one end of the connecting arm (20) is connected to the earphone (10), the earphone (10) comprises a shell (11), a speaker (16), a sensor (12), a support (14) and a first antenna (131); The shell (11) encloses a containing space (110), and the shell (11) is provided with a sound hole (1123) communicating the containing space (110) and the outside of the shell (11); The speaker (16) is located in the containing space (110), and the sound emitting surface of the speaker (16) is oppositely arranged with the sound hole (1123); The sensor (12) is located in the containing space (110) and at least partially located on the side of the speaker (16) away from the sound hole (1123), and the sensor (12) is fixedly connected to the shell (11); The support (14) is located in the containing space (110) and at least partially located between the speaker (16) and the sensor (12), the support (14) is fixedly connected to the shell (11), and the first antenna (131) is fixedly connected to the support (14), in a first direction, the first antenna (131) is spaced apart from the sensor (12), and the first direction points from the support (14) to the speaker (16).

2. The earphone (100) according to claim 1, characterized in that In the first direction, the projection of the first antenna (131) on a plane perpendicular to the first direction is a first projection, the projection of the sensor (12) on a plane perpendicular to the first direction is a second projection, and at least part of the first projection of the first antenna (131) is spaced apart from the second projection of the sensor (12).

3. The earphone (100) according to claim 1, characterized in that The support (14) comprises oppositely arranged first and second faces (141) and (142), the first face (141) of the support (14) faces the sensor (12) and is spaced apart from the sensor (12); The support (14) is provided with a avoiding slot (143), the opening of the avoiding slot (143) is located on the first face (141) of the support (14) and is oppositely arranged with the sensor (12), and part of the first antenna (131) is located in the avoiding slot (143) and part of the first antenna (131) is arranged around the avoiding slot (143).

4. The earphone (100) according to any one of claims 1 to 3, characterized in that The earphone (10) further comprises a first flexible circuit board (17), the first flexible circuit board (17) is fixedly connected to the shell (11), part of the first flexible circuit board (17) is located on the side of the support (14) away from the speaker (16) and is spaced apart from the support (14), and the sensor (12) is arranged on the first flexible circuit board (17).

5. The earphone (100) according to any one of claims 1 to 3, characterized in that The earphone (10) further comprises a second antenna (132), the second antenna (132) is fixedly connected to the support (14) and is spaced apart from the first antenna (131); The ear cover (10) further comprises a circuit board assembly (15), the circuit board assembly (15) comprises a first connecting end (1541), a second connecting end (1542) and a third connecting end (1543), the first connecting end (1541) and the third connecting end (1543) are electrically connected with the first antenna (131), the second connecting end (1542) and the third connecting end (1543) are electrically connected with the second antenna (132), and the second antenna (132) is a side branch antenna.

6. The earphone (100) according to any one of claims 1 to 3, characterized in that The shell (11) is further provided with a first sound pickup hole (1116) and a second sound pickup hole (1117) arranged at intervals, and the first sound pickup hole (1116) and the second sound pickup hole (1117) are both in communication with the accommodating space (110) and the outside of the shell (11). The earphone (100) further comprises a first microphone (157) and a second microphone (158), the first microphone (157) and the second microphone (158) are both mounted in the accommodating space (110), the sound pickup surface of the first microphone (157) is arranged opposite to the first sound pickup hole (1116), the sound pickup surface of the second microphone (158) is arranged opposite to the second sound pickup hole (1117), the first microphone (157) is a call microphone, and the second microphone (158) is used for picking up noise outside the earphone (100). The connection line between the second sound pickup hole (1117) and the first sound pickup hole (1116) is a first connection line (L1), the shell (11) comprises a long axis (A1), the long axis (A1) is a connection line of two most distant end points on a first surface (11a) of the shell (11), and the first connection line (L1) is arranged at an angle with the long axis (A1).

7. The earphone (100) according to claim 6, characterized in that The length of the first connection line (L1) is greater than or equal to 15 mm.

8. The earphone (100) according to claim 6, characterized in that The first microphone (157) is located on a side of the support (14) facing away from the first antenna (131). In the first direction projection, the projection of the first microphone (157) on a plane perpendicular to the first direction is a third projection, the projection of the first antenna (131) on the plane perpendicular to the first direction is a first projection, and the third projection of the first microphone (157) is arranged at intervals with the first projection of the first antenna.

9. The earphone (100) according to claim 6, characterized in that The shell (11) comprises a first surface (11a), a second surface (11b) and a third surface (11c), the first surface (11a) and the second surface (11b) are arranged opposite in the first direction, and the third surface (11c) is connected between the first surface (11a) and the second surface (11b). The first sound pickup hole (1116) penetrates the third surface (11c).

10. The earphone (100) according to claim 6, characterized in that The frequency response difference between the first microphone (157) and the second microphone (158) is within the range of -1 dB to 1 dB. And / or, a phase difference value of the first microphone (157) and the second microphone (158) is in a range of -10dB to 10dB, or in a range of -5dB to 5dB.

11. The earphone (100) according to claim 6, characterized in that The second circuit board (1572) of the first microphone (157) can include a first dielectric layer (1573), a second dielectric layer (1574), a resistance layer (1575), and a capacitance layer (1576) arranged in layers, and the resistance layer (1575) and the capacitance layer (1576) are arranged between the first dielectric layer (1573) and the second dielectric layer (1574).

12. The earphone (100) according to any one of claims 1 to 3, characterized in that The accommodating space (110) of the shell (11) includes a first chamber (1171) and a second chamber (1172) arranged at intervals, and the sound outlet hole (1123) communicates with the first chamber (1171); The shell (11) further includes a first pressure relief hole (1124a) and a second pressure relief hole (1124b), both of which communicate with the second chamber (1172), the line connecting the first pressure relief hole (1124a) and the sound outlet hole (1123) is a second line (L2), and the line connecting the second pressure relief hole (1124b) and the sound outlet hole (1123) is a third line (L3), the second line (L2) and the third line (L3) are arranged at an included angle.

13. The earphone (100) according to any one of claims 1 to 3, characterized in that The earphone (100) further includes a first circuit board (151) and a first electronic device (152) arranged on the first circuit board (151), the first circuit board (151) is fixedly connected to the shell (11) and at least partially located between the loudspeaker (16) and the support (14), and the first circuit board (151) is electrically connected with the loudspeaker (16), the sensor (12), and the first antenna (131); In the first direction, the projection of the first electronic device (152) on a plane perpendicular to the first direction is a fourth projection, and the projection of the loudspeaker (16) on a plane perpendicular to the first direction is a fifth projection, the fourth projection of the first electronic device (152) and the fifth projection of the loudspeaker (16) are arranged at intervals.

14. The earphone (100) according to claim 13, characterized in that The first electronic device (152) includes an inductor (1522), and the inductor (1522) is located on a side of the first circuit board (151) facing away from the loudspeaker (16). The first electronic device (152) further includes a power supply device (1521), and the ear cap (10) further includes a plurality of power supply wires (155), the power supply wires (155) are used to electrically connect the power supply device (1521) and a battery of the earphone (100), and the plurality of power supply wires (155) include a first power supply wire (1551) and a second power supply wire (1552), the first power supply wire (1551) and the second power supply wire (1552) are at least partially laminated in the first direction.

15. The earphone (100) according to claim 13, characterized in that The first electronic device (152) further comprises a first capacitor (1523a) and a second capacitor (1523b), both of which are rectangular, the length of the first capacitor (1523a) and the second capacitor (1523b) is less than 1mm, and the width of the first capacitor (1523a) and the second capacitor (1523b) is less than 0.5mm; The length extension direction of the first capacitor (1523a) is arranged at an angle with the length extension direction of the second capacitor (1523b).

16. The earphone (100) according to claim 13, characterized in that The ear cover (10) further comprises an electrical connector (156) fixedly connected to the first circuit board (151) and located on the side of the first circuit board (151) facing the loudspeaker (16), and the electrical connector (156) is used for grounding.

17. The earphone (100) according to any one of claims 1 to 3, characterized in that The connecting arm (20) comprises a connector (23) and a pipe body (24), the pipe body (24) comprises a connecting end (2411), the connector (23) is connected to the connecting end (2411) and protrudes from the connecting end (2411), and the connector (23) is fixedly connected to the ear cover (10).

18. The earphone (100) according to claim 17, characterized in that The connector (23) comprises a body portion (232), a first protruding portion (234) and a second protruding portion (235), the first protruding portion (234) and the second protruding portion (235) are both connected to the circumferential side surface of the body portion (232), and the first protruding portion (234) and the second protruding portion (235) are arranged at intervals around the body portion (232); The shell (11) comprises a connecting hole (1128) communicating the accommodating space (110) of the shell (11) with the outside of the shell (11), the shell (11) is provided with a first limiting portion (113) and a second limiting portion (114), the first limiting portion (113) and the second limiting portion (114) are both connected to the hole wall of the connecting hole (1128), and the first limiting portion (113) and the second limiting portion (114) are arranged at intervals around the central axis of the connecting hole (1128); At least part of the body portion (232) is located in the connecting hole (1128), the first protruding portion (234) abuts against the first limiting portion (113), the second protruding portion (235) abuts against the second limiting portion (114), and the first protruding portion (234), the first limiting portion (113), the second protruding portion (235) and the second limiting portion (114) are arranged in sequence around the central axis of the connecting hole (1128).

19. The earphone (100) according to claim 18, characterized in that The connector (23) further comprises a third protruding portion (236) surrounding and connected to the circumferential side surface of the body portion (232), and the third protruding portion (236) is arranged at intervals with the first protruding portion (234) and the second protruding portion (235). The shell (11) is further provided with a first clamping part (115) and a second clamping part (116) which are arranged at intervals, and the first clamping part (115) and the second clamping part (116) are connected to the inner wall of the connecting hole (1128); In the axial direction of the connecting hole (1128), at least part of the first clamping part (115) is located between the first protruding part (234) and the third protruding part (236) and is in contact with the first protruding part (234) and / or the third protruding part (236); At least part of the second clamping part (116) is located between the second protruding part (235) and the third protruding part (236) and is in contact with the second protruding part (235) and / or the third protruding part (236).

20. The earphone (100) according to claim 18 or 19, characterized in that The pipe body (24) further comprises a sealing part (244) which protrudes from the end face (2413) of the connecting end (2411) and surrounds the body part (232), and the sealing part (244) is in contact with the inner wall of the connecting hole (1128).

21. The earphone (100) according to any one of claims 1 to 3, characterized in that The earphone (100) further comprises a battery assembly (27) which is arranged at one end of the connecting arm (20) away from the ear cover (10), and the battery assembly (27) is used for supplying power to the ear cover (10). The battery assembly (27) comprises a battery (272), a battery circuit board (273) and a temperature sensor (274), the battery (272) and the temperature sensor (274) are fixedly connected to the battery circuit board (273) and are electrically connected to the battery circuit board (273), and the temperature sensor (274) is used for detecting the temperature of the battery (272).

22. An earphone assembly (1000), characterized in that, The earphone (100) comprises a charging box (200) for storing and charging the earphone (100).

23. The earphone assembly (1000) according to claim 22, characterized in that, The charging box (200) comprises a first accommodating groove (2022) for accommodating the earphone (100). The charging box (200) comprises a first spring sheet assembly (2027), at least part of the first spring sheet assembly (2027) is exposed to the first accommodating groove (2022), the earphone (100) comprises a charging end (101), and the charging end (101) is electrically connected to the loudspeaker (16), the sensor (12) and the first antenna (131); When the earphone (100) is charged, the earphone (100) is accommodated in the first accommodating groove (2022), and the charging end (101) is in contact with the first spring sheet assembly (2027).

24. The earphone assembly (1000) according to claim 23, characterized in that, The number of charging ends (101) of the earphone (100) is at least two, and at least two charging ends (101) of the earphone (100) are arranged at intervals.

25. The earphone assembly (1000) according to claim 23 or 24, characterized in that, The first accommodating groove (2022) is provided with a liquid storage groove (2025), an opening of the liquid storage groove (2025) is located on a groove wall of the first accommodating groove (2022), and when the earphone (100) is accommodated in the first accommodating groove (2022), the opening of the liquid storage groove (2025) faces the ear package (10) of the earphone (100).

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