LED support and LED device

Abstract

The utility model provides an LED support and an LED device, the LED support comprises a conductive substrate and an insulating frame, the insulating frame wraps the conductive substrate, the insulating frame comprises at least two functional windows, functional areas of the conductive substrate are exposed and led out by the functional windows, and different functional areas are electrically isolated, the surface of the functional area of the conductive substrate is provided with the grooves in grid distribution, so that when the LED chip is fixed, die bonding glue can permeate into the grooves, slippage at high temperature is avoided, and the fixing effect of the die bonding glue and the conductive substrate can be improved. The LED support and the LED device provided by the utility model can effectively reduce the layering slippage problem of the die bonding glue at high temperature, improve the fixing reliability of the die bonding glue and the conductive substrate, further improve the fixing reliability of the LED chip, and improve the reliability of the LED device at high temperature.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to an LED bracket and an LED device. Background Technology

[0002] LED beads are widely used in people's lives, embellishing our world. LED (light emitting diode) beads are made by fixing LED chips on a bracket with die-bonding adhesive, connecting the LED chips to the positive and negative electrodes of the bracket with solder wires, and then applying various colored fluorescent adhesives to form a complete LED bead.

[0003] The bracket is the carrier of the LED chip, bearing the conduction of the entire LED chip circuit. In order to pursue higher luminous efficacy and higher brightness of the LED chips, the size of the LED chips is also getting larger and larger. The larger the chip, the higher the heat generated. Temperature has an increasingly greater impact on the fixing effect between the bracket and the LED chip, which can easily cause the die-bonding adhesive between the LED chip and the bracket to delaminate and slip, thereby damaging the mechanical properties of the LED chip and causing problems such as dead LEDs or dim lighting. This makes the reliability of higher luminous efficacy and higher brightness LED chips insufficient. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide an LED bracket and LED device to solve the problem of insufficient reliability of the packaging structure in the application of LED beads with higher luminous efficiency and higher brightness.

[0005] This utility model provides an LED bracket, comprising: a conductive substrate and an insulating frame, wherein the insulating frame covers the conductive substrate and includes at least two functional openings to expose and lead out the functional areas of the conductive substrate through the functional openings, wherein the surface of the functional areas of the conductive substrate is provided with grid-distributed grooves.

[0006] Optionally, the inner corners of the groove are chamfered.

[0007] Optionally, the chamfer structure is a rounded corner.

[0008] Optionally, the arrangement area of ​​the groove also extends to the bonding area between the insulating frame and the conductive substrate.

[0009] Optionally, the surface of the functional area of ​​the conductive substrate is provided with a reflective coating.

[0010] Optionally, the reflective coating includes a silver coating.

[0011] This utility model also provides an LED device, including the above-mentioned LED bracket and an LED chip fixed in the functional area of ​​the conductive substrate of the LED bracket.

[0012] Optionally, the die-bonding adhesive between the LED chip and the conductive substrate is a light-transmitting adhesive.

[0013] The LED bracket provided by this utility model includes a conductive substrate and an insulating frame. The insulating frame covers the conductive substrate and includes at least two functional openings to expose and lead out functional areas of the conductive substrate, while electrically isolating different functional areas. The surface of the functional areas of the conductive substrate is provided with grid-distributed grooves, allowing die-attach adhesive to penetrate into the grooves when fixing the LED chip, preventing slippage at high temperatures and improving the bonding effect between the die-attach adhesive and the conductive substrate. The LED bracket provided by this utility model effectively reduces the problem of die-attach adhesive delamination and slippage at high temperatures, improves the bonding reliability between the die-attach adhesive and the conductive substrate, thereby improving the bonding reliability of the LED chip and the reliability of the LED device at high temperatures, facilitating the application and promotion of higher-power LED chips.

[0014] The LED device provided by this utility model includes the aforementioned LED bracket, which can effectively improve the performance reliability of the LED device at high temperatures and facilitate higher power applications of the LED device. Attached Figure Description

[0015] Figure 1 This is a top view structural diagram of the LED bracket in an embodiment of the present utility model;

[0016] Figure 2 This is a schematic cross-sectional view of the LED bracket in an embodiment of the present utility model;

[0017] Figure 3 This is a cross-sectional structural diagram of the LED bracket in another embodiment of the present invention.

[0018] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0019] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] To address the problem in existing technologies where the die-bonding adhesive between the chip and the substrate in packaging structures easily delaminates and slips at high temperatures, damaging the mechanical properties of LED chips and causing issues such as dead LEDs or dim lighting, thus compromising the reliability of higher luminous efficiency and high brightness LED chips, this invention provides an LED bracket. Grooves are formed on the functional area surface of the conductive substrate. The groove structure enhances the connection and fixation between the die-bonding adhesive and the conductive substrate, preventing delamination and slippage. This ensures the stability of the LED chip fixed to the conductive substrate by the die-bonding adhesive, guaranteeing the performance reliability of the LED device.

[0023] Specifically, please refer to Figure 1 and Figure 2 The figure shows a schematic diagram of the main structure of the LED bracket in this embodiment, including a conductive substrate 10 and an insulating frame 20. The conductive substrate 10 includes a positive electrode and a negative electrode. The insulating frame 20 covers the conductive substrate 10 to fix the positive electrode and the negative electrode of the conductive substrate 10 and to keep the positive electrode and the negative electrode insulated from each other.

[0024] like Figure 1 As shown, the insulating frame 20 includes at least two functional openings, so that a functional area on one side of the conductive substrate 10 is exposed through the functional opening, and the other side of the conductive substrate 10 is directly exposed. On the side where the functional openings are set, the thickness of the insulating frame 20 is greater than that of the corresponding LED chip 30, such as... Figure 2 As shown, the LED chip 30 is completely surrounded within the functional window, which is set to expand outward so that the light emitted by the LED chip 30 is reflected and diffused, thereby improving the field of view. The insulating frame 20 located between the positive and negative electrode plates of the conductive substrate 10 is generally flush with the conductive substrate 10 to facilitate wiring connection between the two functional areas and flat mounting with the external circuit board.

[0025] The conductive substrate 10 has grid-distributed grooves 11 on its functional area surface. After the die-bonding adhesive is applied, it can penetrate into the grooves 11. After curing, even if delamination occurs due to high temperature, it can still be positioned in the grooves 11, preventing slippage. After curing, the die-bonding adhesive can generally rise slightly along the outer wall of the LED chip 30, confining the LED chip 30 within it. This prevents delamination and slippage between the die-bonding adhesive and the LED chip 30. Combined with the grooves 11, this effectively prevents slippage between the LED chip 30, the die-bonding adhesive (after curing), and the conductive substrate 10 caused by high-temperature delamination, ensuring the relative stability of the LED chip 30 and the conductive substrate 10, and guaranteeing the performance reliability of the LED device at high temperatures.

[0026] For ease of production, in this embodiment, the grooves 11 are evenly distributed in a grid and cover the functional areas of the conductive substrate 10. When the conductive substrate 10 is a metal plate, it can be formed by stamping with a mold. In practice, depending on the specific arrangement of the LED chip 30 and other functional components, the grooves 11 can be set in certain areas. That is, in cases where the grooves 11 can improve the fixing effect between the die-bonding adhesive and the conductive substrate 10, this application does not particularly limit the specific distribution area of ​​the grooves 11.

[0027] To reduce the impact of the groove 11 on light emission, in this embodiment, the inner corner of the groove 11 is chamfered to improve the reflection effect and thus improve the final light emission efficiency of the LED device. Furthermore, the chamfered structure is a rounded arc, resulting in uniform reflection direction and improved light emission uniformity.

[0028] To improve the fixing effect of the insulating frame 20 on the positive and negative electrode plates of the conductive substrate 10, such as... Figure 2 As shown, the insulating frame 20 located between the positive and negative electrode plates of the conductive substrate 10 has a stepped structure and is an integral structure. The step structure can form a clamping fixation, which effectively ensures the fixation effect between the insulating frame 20 and the conductive substrate 10.

[0029] To further improve the fixing effect between the insulating frame 20 and the conductive substrate 10, in an optional embodiment, such as Figure 3 As shown, the arrangement area of ​​the groove 11 also extends to the bonding area between the insulating frame 20 and the conductive substrate 10.

[0030] The conductive substrate 10 is generally made of metal and has a certain light emission effect. In order to further improve the reflection efficiency of the groove 11, in this embodiment, a reflective coating is provided on the surface of the functional area of ​​the conductive substrate 10. The reflective coating is, for example, a silver coating or a zinc coating.

[0031] The recess 11 effectively improves the high-temperature resistance of LED devices, reduces the heat dissipation requirements, and thus reduces the thickness of the silver plating layer and lowers costs.

[0032] This utility model also provides an LED device, including the above-mentioned LED bracket and an LED chip 30 fixed in the functional area of ​​the conductive substrate 10 of the LED bracket. The LED chip 30 and the conductive substrate 10 have a high fixation effect of die bonding adhesive. When the die bonding adhesive delaminates due to high temperature, the position of the die bonding adhesive relative to the conductive substrate 10 can be stabilized by the groove 11, thereby ensuring the stable fixation effect between the LED chip 30 and the conductive substrate 10.

[0033] To improve light extraction efficiency, the die-bonding adhesive between the LED chip 30 and the conductive substrate 10 is a light-transmitting adhesive to reduce the impact of the groove 11 on light extraction efficiency. Specifically, it may be an organic silicone or epoxy resin adhesive.

[0034] The LED bracket and LED device provided by this utility model have grid-distributed grooves on the functional area surface of the conductive substrate. When fixing the LED chip, the die-bonding adhesive can penetrate into the grooves, preventing slippage at high temperatures. This improves the fixing effect between the die-bonding adhesive and the conductive substrate, and enhances the reliability of the LED device at high temperatures.

[0035] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The embodiments described above are merely illustrative of several specific implementations of this utility model, and while the descriptions are detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED holder, characterized by, The application relates to a LED support, comprising: a conductive substrate and an insulating frame, the insulating frame covering the conductive substrate, the insulating frame comprising at least two functional windows, so that functional areas of the conductive substrate are exposed and led out by the functional windows, wherein the surface of the functional areas of the conductive substrate is provided with grid-distributed grooves. The inner angle of the groove is a chamfer structure.

2. The LED support of claim 1, wherein, The chamfer structure is a rounded arc angle.

3. The LED support of claim 2, wherein, The arrangement area of the groove also extends to the bonding area of the insulating frame and the conductive substrate.

4. The LED support of claim 1, wherein, The surface of the functional areas of the conductive substrate is provided with a light-reflecting plating layer.

5. The LED support of claim 1, wherein, The light-reflecting plating layer comprises a silver plating layer.

6. The LED support of claim 5, wherein, The application further relates to a LED chip fixed on the functional areas of the conductive substrate of the LED support.

7. An LED device, characterized by The glue between the LED chip and the conductive substrate is light-transmitting glue.

8. The LED device of claim 7, wherein, ​

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